• All of the units included in the HT-NT3 (SA-NT3/SAWNT3) are required to confi rming operation of SA-NT3.
Check in advance that you have all of the units.
COMPONENT MODEL NAME
HT-NT3
Bar Speaker (Active Speaker System)SA-NT3
Subwoofer (Active Subwoofer)SA-WNT3
SPECIFICATIONS
Amplifi er section
US model only:
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(FTC)
Front L + Front R:
With 4 ohms loads, both channels driven, from
300 Hz – 20,000 Hz; rated 50 watts per channel
minimum RMS power, with no more than 1% total
harmonic distortion from 250 milliwatts to rated
output.
POWER OUTPUT (reference)
Front L/Front R:
133 W (per channel at 4 ohms, 1 kHz)
Except US model:
POWER OUTPUT (rated)
Front L + Front R:
60 W + 60 W (at 4 ohms, 1 kHz, 1% THD)
POWER OUTPUT (reference)
Front L/Front R:
133 W (per channel at 4 ohms, 1 kHz)
Inputs
HDMI IN 1*/2/3
TV (DIGITAL IN)
ANALOG IN
Output
HDMI OUT* (ARC)
* HDMI IN 1 and HDMI OUT jacks support HDCP 2.2
protocol. HDCP 2.2 is newly enhanced copyright
protection technology that is used to protect content
such as 4K movies.
HDMI section
Connector
Type A (19pin)
USB section
(USB) port:
Type A (For connecting USB memory, memory
card reader, and digital still camera)
LAN section
LAN (100) terminal
100BASE-TX Terminal
Wireless LAN section
Standards Compliance
IEEE 802.11 a/b/g/n
Frequency band
2.4 GHz, 5 GHz
BLUETOOTH section
Communication system
BLUETOOTH Specifi cation version 3.0
Output
BLUETOOTH Specifi cation Power Class 1
Maximum communication range
Line of sight approx. 30 m (98.4 ft)
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Frequency band
2.4 GHz
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible BLUETOOTH profi les
A2DP 1.2 (Advanced Audio Distribution Profi le)
AVRCP 1.5 (Audio Video Remote Control Profi le)
Supported Codecs
SBC4), AAC, LDAC
Transmission range (A2DP)
20 Hz – 20,000 Hz (Sampling frequency 44.1 kHz,
48 kHz, 88.2 kHz, 96 kHz)
1) The actual range will vary depending on factors such
as obstacles between devices, magnetic fi elds around
a microwave oven, static electricity, cordless phone,
reception sensitivity, antenna’s performance, operating
system, software application, etc.
2) BLUETOOTH standard profi les indicate the purpose
of BLUETOOTH communication between devices.
3) Codec: Audio signal compression and conversion
format
4) Subband Codec
Front L/Front R speaker section
Speaker system
2-way speaker system, Acoustic suspension
Speaker
Woofer: 65 mm (2 5/8 in) cone type, magnetic fl uid speaker ×2
Tweeter: 18 mm (23/32 in) dome type ×2
General
Power requirements
LA9 model only:
110 V – 240 V AC, 50/60 Hz
US, CND, TW models only:
120 V AC, 60 Hz
EA model only:
127 V – 240 V AC, 50/60 Hz
Except LA9, US, CND, TW, EA models:
220 V – 240 V AC, 50/60 Hz
Power consumption
On: 55 W
Standby:
0.3 W
5.5 W (EXCEPT US, CND, LA9)
Dimensions (w/h/d) (approx.)
1,070 mm × 86 mm × 65 mm.
(42 1/4 in × 3 1/2 in × 2 5/8 in) incl.
projecting parts
Mass (approx.)
3.1 kg (6 lb 14oz)
Wireless transmitter section
Communication system
Wireless Sound Specifi cation version 3.0
Frequency band
US, CND, AEP, UK, AUS, EA, E3 models only: 5.2 GHz, 5.8 GHz
SP, TW, LA9 models only: 5.8 GHz
RU model only: 5.2 GHz
* 5.2 GHz or 5.8 GHz may not be available in some countries/regions.
Modulation method
DSSS
a
aa aa
aa aa
aa aa
aa aa
aa aa
aa aa
aa aa
aa aa
aa aa
–––
a
–––
a
–––
a
Supplied accessories
Remote control (1)
R03 (size AAA) batteries (2)
High Speed HDMI cable (1) (EXCEPT AEP, UK)
Optical digital cable (1) (AEP, UK)
Stands (2)
AC plug adaptor (2) (LA9)
Design and specifi cations are subject to change without notice.
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
RU : Russian model
SP : Singapore model
TW : Taiwan model
3D
Side-by-Side
(Half)
aa
aa
Over-Under
(Top-and-Bottom)
Copyrights and Trademarks
• This system incorporates Dolby* Digital and the DTS** Digital Surround System.
• This system incorporates High-Defi nition Multimedia Interface (HDMI™)
technology.
The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the HDMI
Logo are trademarks or registered trademarks of HDMI Licensing LLC in the
United States and other countries.
• “BRAVIA” is a trademark of Sony Corporation.
• “PlayStation” is a registered trademark of Sony Computer Entertainment Inc.
®
• Wi-Fi
, Wi-Fi Protected Access®, Wi-Fi Alliance® and Wi-Fi CERTIFIED
®
Miracast
• Wi-Fi CERTIFIED™, WPA™, WPA2™, Wi-Fi Protected Setup™ and Miracast™
are trademarks of Wi-Fi Alliance
• The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the
United States and in other countries.
• Android™ is a trademark of Google Inc.
are registered trademarks of Wi-Fi Alliance®.
®
.
• Google Play™ is a trademark of Google Inc.
• Google Cast™ is a trademark of Google Inc.
• Google Cast™ Ready and the Google Cast Ready badge are trademarks of Google
Inc.
• “Xperia” is a trademark of Sony Mobile Communications AB.
• The BLUETOOTH
®
word mark and logos are registered trademarks owned by
Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is under
license. Other trademarks and trade names are those of their respective owners.
• LDAC™ and LDAC logo are trademarks of Sony Corporation.
• “DSEE HX” is a trademark of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS
and Thomson.
• Windows Media is either a registered trademark or trademark of Microsoft
Corporation in the United States and/or other countries.
This product is protected by certain intellectual property rights of Microsoft
Corporation. Use or distribution of such technology outside of this product is
prohibited without a license from Microsoft or an authorized Microsoft subsidiary.
®
• Opera
Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera
Software ASA. All rights reserved.
• “ClearAudio+” is a trademark of Sony Corporation.
• “x.v.Colour” and “x.v.Colour” logo are trademarks of Sony Corporation.
• Apple, the Apple logo, iPhone, iPod, iPod touch, and Retina are trademarks of
Apple Inc., registered in the U.S. and other countries. App Store is a service mark of
Apple Inc.
“Made for iPod,” and “Made for iPhone” mean that an electronic accessory has been
designed to connect specifi cally to iPod or iPhone, respectively, and has been
certifi ed by the developer to meet Apple performance standards. Apple is not
responsible for the operation of this device or its compliance with safety and
regulatory standards. Please note that the use of this accessory with iPod or iPhone
may affect wireless performance.
Compatible iPod/iPhone models
The compatible iPod/iPhone models are as follows. Update your iPod/iPhone with
the latest software before using with the system.
BLUETOOTH technology works with:
– iPhone
iPhone 6 Plus/iPhone 6/iPhone 5s/iPhone 5c/iPhone 5/iPhone 4s/iPhone 4/
iPhone 3GS
– iPod touch
iPod touch (5th generation)/iPod touch (4th generation)
• All other trademarks are trademarks of their respective owners.
• Other system and product names are generally trademarks or registered trademarks
of the manufacturers. ™ and ® marks are not indicated in this document.
Notice on GNU GPL/LGPL applied software and other Open Source
Softwares
This product contains software that is subject to the GNU General Public License
(“GPL”) or GNU Lesser General Public License (“LGPL”). These establish that
customers have the right to acquire, modify, and redistribute the source code of said
software in accordance with the terms of the GPL or the LGPL.
For details of the GPL, LGPL and other software licenses, please refer to [Software
License Information] in [System Settings] of the [Setup] menu on the product.
The source code for the software used in this product is subject to the GPL and LGPL,
and is available on the Web. To download, please access the following:
URL:
http://oss.sony.net/Products/Linux
Please note that Sony cannot answer or respond to any inquiries regarding the content
of this source code.
2
Page 3
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
HT-NT3
To Exposed Metal
Parts on Set
AC
1.5 kΩ0.15 μF
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
7. ELECTRICAL PARTS LIST .............................. 83
Accessories are given in the last of the electrical parts list.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
4
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Page 5
SECTION 1
SERVICING NOTES
HT-NT3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OPERATION
All of the units included in the HT-NT3 (SA-NT3/SA-WNT3) are
required to confi rming operation of SA-NT3. Check in advance
that you have all of the units.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
NOTE OF REPLACING THE IC101, IC102, IC103,
IC301, IC302, IC303, IC410, IC3004 AND IC5010 ON
THE MB-1407 BOARD
IC101, IC102, IC103, IC301, IC302, IC303, IC410, IC3004 and
IC5010 on the MB-1407 board cannot replace with single. When
these parts are damaged, replace the complete mounted board.
NOTE OF REPLACING THE IC6001 ON THE AMP
BOARD AND THE COMPLETE AMP BOARD
When IC6001 on the AMP board and the complete AMP board are
replaced, it is necessary to spread the compound between the AMP
board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) referring to the fi gure below.
– AMP Board (Component Side) –
thermal compound (G747)
IC6001
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, connect the resistors to both ends of respective capacitor (C201 and
C207) to discharge the capacitor (C201 and C207).
When SWITCHING REGULATOR (3L405W) board or AMP
board is replaced or the following object parts are replaced, it is
necessary to fi x parts to the boards by using a specifi ed bond with-
out fail.
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
RU : Russian model
SP : Singapore model
TW : Taiwan model
OLED CHUKEI board
panel, front (left)
MOUNTED PWB (left)
AMP board
REGULATOR, SWITCHING (3L405W)
panel, front (right)
RF MODULATOR
(WS001)
IR TXR board
MB-1407 board
AUDIO IO board
WS CHUKEI board
RC-S730 (WW)
MOUNTED PWB (right)
7
Page 8
HT-NT3
NOTE OF REPLACING THE CARD WLAN/BT COMBO
When the CARD WLAN/BT COMBO is exchanged, the MAC
address has been changed.
Please print and cut out the following explanations, and return it
with the unit that complete the repair.
MAC address of this receiver has been changed by
this repair.
The customer who use the MAC address fi ltering
function of connected access point equipment please
set it again.
MAC address is possible to confi rm on the System
Information screen of this unit.
Please refer to “Settings and Adjustments”
“System Settings”
---
> “System Information” on the
---
>
Instruction Manual for details.
Please check the basic operation for wired LAN, Wireless
LAN and USB after the repair completed.
NOTE OF DELETING THE PRODUCT REGISTRATION
ON SEN (INTERNET MUSIC SERVICES)
It is needed to delete the product registration on SEN (Internet
Music Services) by checking the “Device ID” which have 12 digits
hexadecimal number. The procedure of checking “Device ID” can
be followed as below:
1. Press [HOME] button of the remote commander, the message
“HOME” appears.
2. Select “Setup” and press [
3.
Select “System Settings” and press [ ]
4. Select “System Information” and press
] button.
button
[ ]
.
button.
5. Device ID will shown on the display.
Device ID: XXXX XXXX XXXX (12 digits hexadecimal
number).
If it is needed to delete the customer’s registration, please contact
the Service Headquarter with Device ID information.
NOTE OF REPLACING THE COMPLETE MB-1407
BOARD OR CARD WLAN/BT COMBO
When the complete MB-1407 board or CARD WLAN/BT COMBO are replaced, please execute the below service mode.
Procedure:
[Home menu → Setup → Resetting → Reset to Factory Default
Settings → All Settings]
Next, go to service menu and execute “[1] Bluetooth Enable” and
“[3] Write Bluetooth device address to Registry”.
Finally check one touch NFC listening function at normal power
on.
Note: The operation in this mode must use a remote commander
and TV monitor.
1. Connect this unit with TV monitor.
2. Press the [
3.
Press button in order of the [x] → [DISPLAY] → [X] → [M]
] button to turn the power on.
?/1
on
the remote commander.
(Make the interval when each button is pressed within two
seconds)
4. Enter the SVC service mode. The OSD menu on TV monitor
can be operated by remote commander.
5. Press [m] and Enter Diag.
6. Press [,] and Enter Bluetooth Device Test (Screen 1).
7. Enter [1] Bluetooth Enable, wait until the display show
“ Status : Bluetooth Enable Successful ” (Screen 2).
8. Enter [3] Write Bluetooth device address to Registry, wait until
the display show “Bluetooth Device Address” and “Status :
Write Successfull” (Screen 3).
9. Press the [RETURN] button on the remote commander to
select “Wireless LAN Test”. (Screen 4)
10. Press the [ ] button on the remote commander to select
“[5] Write P2P address to Registry”.
11. Press the [ ] button on the remote commander, wait until the
display show “Status: Write Successful!” (Screen 5).
12. Press the [m] button on the remote commander to select
“[6] P2P Registry Check”.
13. Press the [ ] button on the remote commander to check the
P2P devise address is the same as shown in Screen 5.
(Displayed chracters/values in the following fi gure are ex-
ample)
14. Press the [BACK] button on the remote commander and
select Factory Initialize. (go to Screen 7)
15. The set will turn off automatically.
(Screen 1)
Diag
Category: Bluetooth Device Test
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test
Status : Bluetooth Enable Successful!
(Screen 2)
HELP: [UP][DOWN][ENT][RET]
8
Page 9
(Screen 3)
(Screen 4)
(Screen 5)
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test
Bluetooth device address : 00:01:36:23:FD:CF
Status : Write Successful!
HELP: [UP][DOWN][ENT][RET]
Diag
Category: Wireless LAN Test
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Start Display RSSI Value
[4] Start Ping Test
[5] Write P2P address to Registry
[6] P2P Registry Check
HT-NT3
(Screen 6)
(Screen 7)
P2P device address : xx:xx:xx:xx:xx:xx
Status : Write Successful!
Status : Write Fail!
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Start Display RSSI Value
[4] Start Ping Test
[5] Write P2P address to Registry
[6] P2P Registry Check
P2P device address : xx:xx:xx:xx:xx:xx
HELP: [UP][DOWN][ENT][RET]
* Service Mode Menu
[1] Diag
[2] Log
[3] Factory Initialize
[4] Network --> Not Support In This Model
[5] Version Up
[6] System InformaƟon
[7] EMC Test Mode
[8] Drive --> Not Support In This Model
[9] HDD mode
[10] RF Test Mode
HELP: [DOWN][ENT]
9
Page 10
HT-NT3
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SET
2-2. FRONT PANEL (LEFT, RIGHT, CENTER) SECTION-1
(Page 11)
2-3. FRONT PANEL (LEFT, RIGHT, CENTER) SECTION-2
(Page 12)
2-4. CARD WLAN/BT COMBO
(Page 13)
2-5. KEY BOARD, IR TXL BOARD, IR TXR BOARD, WS CHUKEI BOARD, RC-S730 (WW)
(Page 14)
6 one screw (+BVTP 3 x 8)
1 terminal (narrow side)
4 two screws (+BVTP 3 x 8)
3 terminal
(narrow side)
:LUHVHWWLQJ
loudspeaker (6.5 cm)-080-12 (R-CH)
(wide side)
1 terminal (wide side)
7 holder, wire
(narrow side)
top side
:LUHVHWWLQJ
MOUNTED PWB
(left)
(narrow side)
top side
(wide side)
:LUHVHWWLQJ
top side
(narrow side)
3 terminal
(wide side)
5 MOUNTED PWB (right)
MOUNTED PWB
(right)
–%RWWRPYLHZ–
(wide side)
15
Page 16
HT-NT3
2-7. POWER CORD, MB-1407 BOARD SECTION
8 cord, power
7 Draw out the cord, power from the hole.
5 two claws
6 bushing (FBS001), cord
3 CN1 (2P)
2 Remove the cord, power
from stopper, wiring
:ire VeWWiQJ
REGULATOR, SWITCHING (3L405W)
top side
stopper, wiring
4 Remove the bushing (FBS001), cord
in the direction of the arrow.
1 Remove the MB-1407 board
section in the direction of the arrow.
9 MB-1407 board section
– Rear view –
16
Page 17
2-8. SWITCHING REGULATOR (3L405W), AUDIO IO BOARD
2 four screws (+BVTP 3 x 8)
4 stopper, wiring
:LUHVHWWLQJ
AUDIO IO board
acoustic tape
HT-NT3
top side
cushion, saranet
5 REGULATOR,
SWITCHING
(3L405W)
3 stopper, wiring
:LUHVHWWLQJ
stopper, wiring
AMP board
1 CN101
(9P)
top side
7 cushion, saranet
8 wire (flat type)
(9 core) (CN705)
6 acoustic tape
9 two screws (+BVTP 3 x 8)
qa AUDIO IO board
0 one screw (+BVTP 3 x 8)
REGULATOR, SWITCHING
(3L405W)
17
Page 18
HT-NT3
2-9. AMP BOARD
:LUHVHWWLQJ
AMP board
stopper, wiring
7 CN6007 (4P)
8 wire (flat type) (24 core) (CN6004)
2 wire holder PWB
1 one screw (+BVTP 3 x 8)
top side
9 four screws (+BVTP 3 x 8)
3 two screws (+BVTP 3 x 10)
4 heat sink, AMP
0 stopper, wiring
IC6001
spread the compound referring to “NOTE
OF REPLACING THE IC6001 ON THE
AMP BOARD AND THE COMPLETE
AMP BOARD” on page 5.
qs AMP board
qa stopper, wiring
Note: When you install the heat sink, AMP
:LUHVHWWLQJ
top side
AMP board
5 CN6001 (5P)
6 CN6002 (4P)
stopper, wiring
18
Page 19
2-10. MB-1407 BOARD
5 six screws (+BVTP 3 x 8)
(AEP, UK, RU, AUS)
HT-NT3
Ver. 1.1
3 two screws (+BVTP 3 x 8)
4 heat sink, MB
2 sheet, copper
(AEP, UK, RU, AUS)
1 cushion tw-side
(AEP, UK, RU, AUS)
A
6 shield, MB
A
9 MB-1407 board
8 two screws (+B 3 x 5)
7 three screws (+B 3 x 5)
• Abbreviation
AUS :
RU : Russian model
Australian model
19
Page 20
HT-NT3
SECTION 3
TEST MODE
COLD RESET
The cold reset clears certain data in this system without initialize
Personal Information and some operation data.
Execute this mode when returning the unit to the customers.
Procedure:
1. Press the [
2. Press the [
] button on the main unit to turn the power on.
?/1
] button and [VOL -] button on the main unit
?/1
simultaneously for fi ve seconds.
3. The message “WAIT” appears and then “RESET” appears on
the fl uorescent indicator tube, then becomes standby states.
PANEL TEST
Procedure:
1. Press the [
] button on the main unit to turn the power on.
?/1
2. Press button in order of the [x] → [DISPLAY] → [m] → [M]
on the remote commander.
(Make the interval when each button is pressed within two sec-
onds).
3. All segments in fl uorescent indicator tube are lighted up and
then is dimmed after a second.
4. In the state of step 3, press the [INPUT +] button on the remote
commander and “K 0” is displayed on the fl uorescent indicator
tube.
5. In the state of step 4, press the [VOL +] button on the remote
commander and “SZ_A” is displayed on the fl uorescent indi-
cator tube.
6. In the state of step 5, press the [VOL -] button on the remote
commander and all segments in fl uorescent indicator tube are
lighted up and then is dimmed after a second.
7. In the state of step 6, press the [x] button on the remote commander and “1 24” is displayed on the fl uorescent indicator
tube.
Releasing method:
To release from this mode, press the [
or press the [
] button on the remote commander.
?/1
] button on the main unit
?/1
AMP TEST
7. In the state of step 6, press [VOICE] button on the remote commander to adjust the volume gain.
It can be adjusted between -3.0 to +3.0 (increase everytime 0.1
step).
Eg: When gain +1.0 dB by pressing the [VOICE] button, the
message “G +1.0” will appear on the fluorescent indicator
tube.
8. In the state of step 7, press [NIGHT] button on the remote
commander to adjust the volume gain.
It can be adjusted between +3.0 to -3.0 (decrease everytime 0.1
step).
Eg: When gain -1.0 dB by pressing the [NIGHT] button, the
message “G -1.0” will appear on the fluorescent indicator tube.
WIRELESS SOUND TEST MODE
It can display the μ-com version of Subwoofer (SA-WNT3).
Note : More than one item may be displayed on the fl uorescent indicator
tube, but it is not used for the servicing other than “VER”.
Preparation:
• Prepare the remote commander attached to this unit.
Remote commander:
RM-AH110U (US and Canadian models)
RM-AH110E (Except US and Canadian models)
• Connect the Bar Speaker (SA-NT3) and the Subwoofer (SA-WNT3)
by wireless.
Procedure:
1. Press button in order of the [x] → [DISPLAY] → [CLEAR
AUDIO+] → [
] on the remote commander.
M
2. The message “FACTR” is displayed on the fl uorescent indica-
tor tube and enter the wireless sound test mode.
3. Press the [
]/[m] buttons on the remote commander, select the
M
“VER”, and press the [ ] button on the remote commander.
4. The μ-com version of Subwoofer (SA-WNT3) is displayed on
the fl uorescent indicator tube. For example, 0.12A.
5. When [M]/[m] buttons on the remote commander is pressed
while the μ-com version of Subwoofer (SA-WNT3) is displayed on the fl uorescent indicator tube, year, month and day
of the creation is displayed on the fl uorescent indicator tube.
For example, 41027.
Procedure:
1. Touch the [
] touch key on the main unit to turn the power
?/1
on.
2. Press button in order of the [x] → [DISPLAY] → [VOL -] →
[M] on the remote commander.
The messsage “MSURE” is displayed on the fl uorescent indi-
cator tube.
3. In the state of step 2, press [DIMMER] button on the remote
commander.
The message will appear in order of the “FULL” → “THRU”
→ “F2S” → “F2SB” → “F2CW” on the fl uorescent indicator
tube.
4. In the state of step 3, press [m] button on the remote commander.
The message will appear in order of the “A.OFF” → “A.ON”
on the fl uorescent indicator tube.
5. In the state of step 4, press [%] button on the remote commander.
The message will appear in order of the “V .N” → “V.MSM” on
the fl uorescent indicator tube.
6. In the state of step 5, press [CLEARAUDIO+] button on the
remote commander.
The message will appear in order of the “VAON” → “VAOFF”
on the fl uorescent indicator tube.
When [M]/[m] buttons on the remote commander is pressed
again, the display returns to the μ-com version of Subwoofer
(SA-WNT3) display.
Releasing method:
Press the [
] button to release the test mode menu.
?/1
20
Page 21
HT-NT3
WIRELESS SOUND COLD RESET
It can initialize various backup information of Subwoofer (SAWNT3).
Preparation:
Connect the Bar Speaker (SA-NT3) and the Subwoofer (SAWNT3)
Procedure:
1. Press button in order of the [x] → [DISPLAY] → [BACK] →
[M] on the remote commander.
2. The power indicator LED on the Subwoofer (SA-WNT3) turns
as below.
For secure link : orange (light up) -> red (fl ashing) ->
orange (light up)
For normal link : green (light up) -> red (fl ashing) ->
orange (light up)
Power indicator LED
3. Pull out the power cord on the Subwoofer (SA-WNT3) from
an outlet and insert the power cord again.
FACTORY INITIALIZE
Return all of the unit setting to their factory defaults.
Note 1: Disconnect the following connections when you use this mode.
• USB
Note 2: The operation in this mode must use a remote commander and TV
monitor.
4. Select “Initialize Personal Information”, and press the [ ]
button on the remote commander.
Reset to Factory Default Settings
Initialize Personal Information
Delete personal data when disposing
5. Select “OK”, and press the [ ] button on the remote commander.
Initialize Personal Information
Deleting Personal Information.
Do you want to proceed?
If you destroy or transfer or resell this
unit, please delete all Personal Information
for security reasons.
Please take appropriate measures such as
logging out after using a network service.
OKCancel
6. The message “Close” appears, and press the [ ] button on the
remote commander.
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press the [HOME] button on the remote commander, and the
home menu is displayed.
3. Select “Setup” → “Resetting”, and press the [ ] button on the
remote commander.
Input Skip Setting
Easy Setup
Easy Network Settings
Resetting
Initialize Personal Information
Initialization complete.
Close
21
Page 22
HT-NT3
7. Select “Reset to Factory Default Settings”, and press the [ ]
button on the remote commander.
Reset to Factory Default Settings
Restore each setting to the factory
default setting.
Initialize Personal Information
8. Select “All Settings”, and press the [ ] button on the remote
commander.
Reset to Factory Default Settings
Audio Settings
Bluetooth Settings
System Settings
Input Skip Setting
Network Settings
All Settings
1. Main Functions
• Diag
Performs unit test of devices installed on the board.
• Log
Error log is displayed. Displayed contents can also be saved in
an USB memory device.
• Factory Initialize
Restores the unit to its factory settings.
• Network
Not used.
• Version Up
Not used.
• System Information
Displays the system information of the unit.
Displays information such as the software version, drive infor-
mation, etc.
• EMC Test Mode
Not used.
• Drive
Not used.
• HDD Mode
Not used.
• RF Test Mode
Not used.
9. Select “Start”, and press the [ ] button on the remote commander.
All Settings
Restore all settings to the factory default
settings. The system will turn off after
reset.
Start
Cancel
10. Initialization ends when the message “HELLO” on the fl uores-
cent indicator tube disappears.
SVC SERVICE MODE
Note: The operation in this mode must use a remote commander and TV
monitor.
Setting method of the SVC service mode:
1. Connect this unit with the TV monitor.
2. Press the [
3. Press button in order of the [
] button on the main unit to turn the power on.
?/1
] → [DISPLAY] → [X] → [M]
x
on the remote commander.
(Make the interval when each button is pressed within two sec-
onds).
4. The message “SVC” displayed on the fl uorescent indicator
tube. The OSD menu on TV monitor can be operated by the
remote commander.
22
Page 23
2. Menu Tree
HT-NT3
Service 0ode 0enu
Service0ode 0enu
[1] DiaJ
[1] DiaJ
[] LoJ
[] LoJ
[3] Factory Initialize
[3] Factory Initialize
[4] Network
[4] Network
[5] Version Up
[5] Version Up
[6] System Information
[6] System Information
[7] E0& Test 0ode
[8] Drive
[] +DD 0ode
[10] 5F Test 0ode
DiaJ
DiaJ Test
Device Test
US%D$&IFcon0I&0FII3&
E[ternal +D0ITranscoder test
Video Test
Not used
$udio Test
Not used
$udio Input Test
Not used
:ireless L$N Test
33 test only
0ic Test
Not used
+D0I Input Test
Not used
Transcorder Test
Not used
%luetootK Device Test
LoJ
Displays Error LoJ
Factory Initialize
Initialize default settinJ
Network
Not used
Version Up
Not used
System Information
Displays system information
E0& Test 0ode
Not used
Error LoJ
Displays error loJ
+DD LoJ
Not used
Start Initialize
Initialize default settinJ for tKe unit
Drive
Not Used
+DD 0ode
Not Used
5F Test 0ode
Not used
23
Page 24
HT-NT3
3. Service Mode Menu (Top Menu)
This is the top menu of service mode.
Each function is accessed from this screen.
Operation:
[1] Moves to Diag screen
[2] Moves to Log screen
[3] Moves to Factory Initialize screen
[4] Moves to Network screen
[5] Moves to Version Up (USB version update) screen
(Not used)
[6] Moves to System Information screen
[7] Moves to EMC test mode screen (Not used)
[8] Moves to Drive screen (Not used)
[9] Moves to HDD mode screen (Not used)
[10] Moves to RF Test Mode (Not used)
[M]/[m] Moves the cursor
[ ] Moves to the screen of the item selected with the cursor
* Cursor is not displayed when the menu is fi rst displayed.
* Service Mode Menu
[1] Diag
[2] Log
[3] Factory Initialize
[4] Network --> Not Support In This Model
[5] Version Up
[6] System InformaƟon
[7] EMC Test Mode
[8] Drive --> Not Support In This Model
[9] HDD mode
[10] RF Test Mode
Diag
Category:
(Screen 1)
(Screen 2)
Device Test
Diag
Category: Device Test
HELP: [RIGHT] [UP] [ENT] [RET]
USB Host
Device:
Front USB Media check ... OK
Checking...
• Device Test: List of devices
USB Host : USB media check (front). Only one time.
5. Diag (Wireless LAN Test)
This screen performs wireless LAN/Miracast test.
Screen 1: Selects Wireless LAN Test Category
Operation:
[<]/[,] Selects the category
] Activate the selected category
[m]/[
[RETURN] Returns to service top menu
HELP: [DOWN][ENT]
4. Diag (Device Test)
This screen is used to test devices mounted on the board.
Screen 1: Selects the test category
Operation:
[<]/[,] Selects the category
[m]/[ ] Moves to the selected category
[RETURN] Returns to the service top menu
Screen 2: Device test
Selects the device to test after selecting Device Test in screen 1.
Operation:
[<]/[,] Selects the device to test
[ ] Executes the test
[M] Returns to selection of test category
[RETURN] Returns to selection of test category
• List of test categories
Device Test
Video Test (Not used)
Audio Test (Not used)
Audio Input Test (Not used)
Wireless LAN Test
Mic Test (Not used)
HDMI Input Test (Not used)
Transcorder Test (Not used)
Bluetooth Device Test
Screen 2: Selects Wireless LAN Test
Operation:
[1] Show Wireless LAN module Information (Not used)
[2] Connect to Access Point (Not used)
[3] Start display RSSI value (Not used)
[4] Start Ping Test (Not used)
[5] Write P2P Address to Registry
[6] P2P Registry Check
[M]/[m] Selects Test
] Activate and Start Test
[
[RETURN] Returns to test category selection
Screen 2: Store P2P device address to Registry
Display will show : P2P device address : “xx:xx:xx:xx:xx:xx”
• Viewing the Status display, if
Successful : “Write Successful!”
Fail: “Write Fail!”
Screen 3: P2P Registry Check
Show P2P device address “xx:xx:xx:xx:xx:xx”
24
Page 25
HT-NT3
(Screen 1)
Diag
Category: Wireless LAN Test
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Start Display RSSI Value
[4] Start Ping Test
[5] Write P2P address to Registry
[6] P2P Registry Check
P2P device address : xx:xx:xx:xx:xx:xx
Status : Write Successful!
(Screen 2)
(Screen 3)
Status : Write Fail!
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Start Display RSSI Value
[4] Start Ping Test
[5] Write P2P address to Registry
[6] P2P Registry Check
P2P device address : xx:xx:xx:xx:xx:xx
HELP: [UP][DOWN][ENT][RET]
6. Diag (MIC Input Test)
This screen performs MIC input test.
Note: Not used for the servicing.
7. Diag (HDMI Input Test)
This screen performs HDMI input test.
Note: Not used for the servicing.
8. Diag (Transcoder Test)
Note: Not used for the servicing.
9. Diag (Bluetooth Device Test)
This screen performs Bluetooth Device Test.
Screen 1: Select Bluetooth Device Test Category
Operation:
[<]/[,] Selects the category
] Activate the selected category
[
[RETURN] Returns to the service top menu
Screen 2: Select Bluetooth Device Test
Operation:
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry.
[4] Bluetooth Inquiry Test
[M]/[m] Selects Device
[ ] Activate and Start Test
[RETURN] Returns to test category selection
Screen 3 : Select [2] Bluetooth Disable
• Viewing the Status display, if
Successful: “Bluetooth Disable Successful!”
Fail: “Bluetooth Disable Fail!”
Screen 4 : Select [3] Write Bluetooth device address to
Registry
Display will show : Bluetooth device address : “xx:xx:xx:xx:xx:xx”
• Viewing the Status display, if
Successful: “Write Successful!”
Fail: “Write Fail!”
(Screen 1)
Diag
Category: Bluetooth Device Test
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Status : Bluetooth Enable Successful!
Status : Bluetooth Enable Fail!
(Screen 2)
HELP: [UP][DOWN][ENT][RET]
(Screen 3)
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Status : Bluetooth Disable Successful!
Status : Bluetooth Disable Fail!
HELP: [UP][DOWN][ENT][RET]
(Screen 4)
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Bluetooth device address : 00:01:36:23:FD:CF
Status : Write Successful!
Status : Write Fail!
HELP: [UP][DOWN][ENT][RET]
Screen 2: Select [1] Bluetooth Enable
• Viewing the Status display, if
Successful: “Bluetooth Enable Successful!”
Fail: “Bluetooth Enable Fail!”
25
Page 26
HT-NT3
10. Log: Error Log (Output of each Log)
This screen displays the contents of each log.
Note: Do not refer to the displayed date.
Screen 1: Selects log
Operation:
[1]/[ ] Moves to the Error Log output screen
[RETURN] Returns to the top menu of the service mode
Screen 2: Displays the Error Log
Operation:
[
] Returns to the previous page
<
[,] Moves to the next page
[RETURN] Returns to the screen (Screen 1) that selects the log
type
[RED] Writes the log contents to an USB memory device
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
• : Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
• MB-1407 board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
Q
B
E
CEB
These are omitted.
Q
B
CE
• Lead layouts
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
These are omitted.
These are omitted.
surface
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• Components for right channel have same values as for
left channel. Reference numbers are coded from
• f : Internal component.
• C : Panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO (ANALOG)
J : AUDIO (DIGITAL)
E : VIDEO
d : LAN
G : WIRELESS LAN / BLUETOOTH
L : USB
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
* Replacement of IC102 and IC103 on the MB1306 board used
in this unit requires a special tool.
• Circuit Boards Location
KEY board
CARD WLAN/BT COMBO
MOUNTED PWB (left)
REGULATOR, SWITCHING (3L405W)
IR TXL board
OLED CHUKEI board
MB-1407 board
AMP board
AUDIO IO board
MOUNTED PWB (right)
IR TXR board
RF MODULATOR
(WS001)
RC-S730 (WW)
WS CHUKEI boar
HT-NT3
CSP (Chip Size Package) Lead layout of conventional IC
* Replacement of IC102 and IC103 on the MB1306 board used
in this unit requires a special tool.
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
RU : Russian model
SP : Singapore model
TW : Taiwan model
Note 1: When the complete AMP board is replaced, re-
fer to “NOTE OF REPLACING THE IC6001 ON
THE AMP BOARD AND THE COMPLETE AMP
BOARD” on page 5.
Note 2: When the C6078 and C6079 on the AMP board
are replaced, spread the bond referring to
“BOND FIXATION OF ELECTRIC PARTS” on
page 5.
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
RU : Russian model
SP : Singapore model
TW : Taiwan model
Note 1: When the complete AMP board is replaced, re-
fer to “NOTE OF REPLACING THE IC6001 ON
THE AMP BOARD AND THE COMPLETE AMP
BOARD” on page 5.
Note 2: When the C6078 and C6079 on the AMP board
are replaced, spread the bond referring to
“BOND FIXATION OF ELECTRIC PARTS” on
page 5.
3131
Page 32
HT-NT3
Ver. 1.1
5-4. PRINTED WIRING BOARD - MB-1407 Board (suffi x 12 (EXCEPT AEP, UK, RU, AUS)) - • See page 31 for Circuit Boards Location. • : Uses unleaded solder.
Note: IC3004 on the MB-1407 board cannot exchange with single. When this part on
the MB-1407 board is damaged, exchange the entire mounted board.
3939
Page 40
HT-NT3
Ver. 1.1
5-12. SCHEMATIC DIAGRAM - MB-1407 Board (7/12) - • See page 53 for Waveforms. • See page 54 for IC Block Diagrams.• See page 58 for IC Pin Function Descriptions.
A2DQU5I/OData Input/output: Bi-directional data bus.
A3DQU7I/OData Input/output: Bi-directional data bus.
A4NO_USE-Not used
A5NO_USE-Not used
A6NO_USE-Not used
A7DQU4I/OData Input/output: Bi-directional data bus.
A8VDDQ-DQ Power Supply: 1.5V +/-0.075V
A9VSS-Ground
B1VSSQ-DQ Ground
B2VDD-Power Supply: 1.5V +/-0.075
B3VSS-Ground
B4NO_USE-Not used
B5NO_USE-Not used
B6NO_USE-Not used
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corre-
B7
B8DQU6I/OData Input/output: Bi-directional data bus.
B9VSSQ-DQ Ground
C1VDDQ-DQ Power Supply: 1.5V +/-0.075V
C2DQU3I/OData Input/output: Bi-directional data bus.
C3DQU1I/OData Input/output: Bi-directional data bus.
C4NO_USE-Not used
C5NO_USE-Not used
C6NO_USE-Not used
C7DQSUI/O
C8DQU2I/OData Input/output: Bi-directional data bus.
C9VDDQ-DQ Power Supply: 1.5V +/-0.075V
D1VSSQ-DQ Ground
D2VDDQ-DQ Power Supply: 1.5V +/-0.075V
D3DMUI
D4NO_USE-Not used
D5NO_USE-Not used
D6NO_USE-Not used
D7DQU0I/OData Input/output: Bi-directional data bus.
D8VSSQ-DQ Ground
D9VDD-Power Supply: 1.5V +/-0.075
E1VSS-Ground
E2VSSQ-DQ Ground
E3DQL0I/OData Input/output: Bi-directional data bus.
E4NO_USE-Not used
E5NO_USE-Not used
E6NO_USE-Not used
E7DMLI
E8VSSQ-DQ Ground
E9VDDQ-DQ Power Supply: 1.5V +/-0.075V
DQSUI/O
sponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling to
the system during reads and writes. DDR3 SDRAM supports differential data strobe only and
does not support single-ended.
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling to
the system during reads and writes. DDR3 SDRAM supports differential data strobe only and
does not support single-ended.
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH coincident with that input data during a Write access. DM is sampled on both
edges of DQS. For x8 device, the function of DM or TDQS/ TDQS is enabled by Mode Register
A11 setting in MR1.
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH coincident with that input data during a Write access. DM is sampled on both
edges of DQS. For x8 device, the function of DM or TDQS/ TDQS is enabled by Mode Register
A11 setting in MR1.
HT-NT3
67
Page 68
HT-NT3
Pin No.Pin NameI/ODescription
F1VDDQ-DQ Power Supply: 1.5V +/-0.075V
F2DQL2I/OData Input/output: Bi-directional data bus.
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corre-
F3DQSLI/O
F4NO_USE-Not used
F5NO_USE-Not used
F6NO_USE-Not used
F7DQL1I/OData Input/output: Bi-directional data bus.
F8DQL3I/OData Input/output: Bi-directional data bus.
F9VSSQ-DQ Ground
G1VSSQ-DQ Ground
G2DQL6I/OData Input/output: Bi-directional data bus.
G3
G4NO_USE-Not used
G5NO_USE-Not used
G6NO_USE-Not used
G7VDD-Power Supply: 1.5V +/-0.075
G8VSS-Ground
G9VSSQ-DQ Ground
H1VREFDQ-Reference voltage for DQ
H2VDDQ-DQ Power Supply: 1.5V +/-0.075V
H3DQL4I/OData Input/output: Bi-directional data bus.
H4NO_USE-Not used
H5NO_USE-Not used
H6NO_USE-Not used
H7DQL7I/OData Input/output: Bi-directional data bus.
H8DQL5I/OData Input/output: Bi-directional data bus.
H9VDDQ-DQ Power Supply: 1.5V +/-0.075V
J1NC-No Connect: No internal electrical connection is present.
J2VSS-Ground
J3
J4NO_USE-Not used
J5NO_USE-Not used
J6NO_USE-Not used
J7CKI
J8VSS-Ground
J9NC-No Connect: No internal electrical connection is present.
K1ODTI
K2VDD-Power Supply: 1.5V +/-0.075
K3
K4NO_USE-Not used
K5NO_USE-Not used
K6NO_USE-Not used
K7
K8VDD-Power Supply: 1.5V +/-0.075
DQSLI/O
RASICommand Input: RAS (along with CS) defi ne the command being entered.
CASICommand Input: CAS (along with CS) defi ne the command being entered.
CKI
sponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling to
the system during reads and writes. DDR3 SDRAM supports differential data strobe only and
does not support single-ended.
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling to
the system during reads and writes. DDR3 SDRAM supports differential data strobe only and
does not support single-ended.
Clock: CK is differential clock input. All address and control input signals are sampled on the
crossing of the positive edge of CK. Output (read) data is referenced to the crossing of CK.
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the
DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS,
NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x8 confi gura-
tions. The ODT pin will be ignored if the Mode Register (MR1) is programmed to disable ODT.
Clock: CK is differential clock input. All address and control input signals are sampled on the
crossing of the negative edge of CK. Output (read) data is referenced to the crossing of CK.
68
Page 69
Pin No.Pin NameI/ODescription
Clock Enable: CKE HIGH activates, and CKE LOW deactivates, internal clock signal and device input buffers and output drivers. Talking CKE LOW provides Precharge Power-Down and
Self Refresh operation (all banks idle), or Active Power-Down (Row Active in any bank). CKE
K9CKEI
L1NC-No Connect: No internal electrical connection is present.
L2
L3
L4NO_USE-Not used
L5NO_USE-Not used
L6NO_USE-Not used
L7A10I
L8ZQ-Reference Pin for ZQ calibration
L9NC-No Connect: No internal electrical connection is present.
M1VSS-Ground
M2BA0I
M3BA2I
M4NO_USE-Not used
M5NO_USE-Not used
M6NO_USE-Not used
M7NC-No Connect: No internal electrical connection is present.
M8VREFCA-Reference voltage for CA
M9VSS-Ground
N1VDD-Power Supply: 1.5V +/-0.075
N2A3I
N3A0I
N4NO_USE-Not used
N5NO_USE-Not used
N6NO_USE-Not used
N7A12I
N8BA1I
N9VDD-Power Supply: 1.5V +/-0.075
P1VSS-Ground
P2A5I
P3A2I
P4NO_USE-Not used
CSI
WEICommand Input: WE (along with CS) defi ne the command being entered.
is asynchronous for self refresh exit. After V
initialization sequence, it must be maintained during all operations (including Self-Refresh).
CKE must be maintained high throughout read and write accesses. Input buffers, excluding
CK, CK, ODT and CKE are disabled during power-down. Input buffers, excluding CKE, are
disabled during Self-Refresh.
Chip Select: All commands are masked when CS is registered HIGH. CS provides for external
Rank selection on system with multiple Ranks. CS is considered part of the command code.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Autoprecharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be performed to the accessed bank after the Read/Write operation. (HIGH:
Autoprecharge; LOW: No Autoprecharge)
A10 is sampled during a Precharge command to determine the Percharge applies to one bank
(A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected
by bank adresses.
Bank Address Inputs: BA0 defi ne to which bank an Active, Read, Write or Precharge com-
mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
Bank Address Inputs: BA2 defi ne to which bank an Active, Read, Write or Precharge com-
mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands. Burst
Chop: A12 is sampled during Read and Write commands to determine if burst chop (on- thefl y) will be performed. (HIGH: no burst chop, LOW: burst chopped).
Bank Address Inputs: BA1 defi ne to which bank an Active, Read, Write or Precharge com-
mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
REFCA has become stable during the power on and
HT-NT3
69
Page 70
HT-NT3
Pin No.Pin NameI/ODescription
P5NO_USE-Not used
P6NO_USE-Not used
P7A1I
P8A4I
P9VSS-Ground
R1VDD-Power Supply: 1.5V +/-0.075
R2A7I
R3A9I
R4NO_USE-Not used
R5NO_USE-Not used
R6NO_USE-Not used
R7A11I
R8A6I
R9VDD-Power Supply: 1.5V +/-0.075
T1VSS-Ground
T2
T3A13I
T4NO_USE-Not used
T5NO_USE-Not used
T6NO_USE-Not used
T7NC-No Connect: No internal electrical connection is present.
T8A8I
T9VSS-Ground
RESETI
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when
RESET is HIGH. RESET must be HIGH during normal operation. RESET is CMOS rail to rail
signal with DC high and low at 80% and 20% of VDD, example, 1.20V for DC high and 0.30V
for DC low.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
1 to 6D14 to D19IVideo data input terminal Not used
7DEIData enable signal input terminal Not used
8VSYNCIVertical sync signal input terminal Not used
9HSYNCIHorizontal sync signal input terminal Not used
10R0XC–ITMDS clock (negative) signal input from the HDMI IN 9 (VIDEO 2) connector
11R0XC+ITMDS clock (positive) signal input from the HDMI IN 9 (VIDEO 2) connector
12R0X0–ITMDS data (negative) input from the HDMI IN 9 (VIDEO 2) connector
13R0X0+ITMDS data (positive) input from the HDMI IN 9 (VIDEO 2) connector
14R0X1–ITMDS data (negative) input from the HDMI IN 9 (VIDEO 2) connector
15R0X1+ITMDS data (positive) input from the HDMI IN 9 (VIDEO 2) connector
16R0X2–ITMDS data (negative) input from the HDMI IN 9 (VIDEO 2) connector
17R0X2+ITMDS data (positive) input from the HDMI IN 9 (VIDEO 2) connector
18AVDD12-Power supply terminal (+1.2V)
19AVDD33-Power supply terminal (+3.3V)
20R1XC–ITMDS clock (negative) signal input from the HDMI input selector
21R1XC+ITMDS clock (positive) signal input from the HDMI input selector
22R1X0–ITMDS data (negative) input from the HDMI input selector
23R1X0+ITMDS data (positive) input from the HDMI input selector
24R1X1–ITMDS data (negative) input from the HDMI input selector
25R1X1+ITMDS data (positive) input from the HDMI input selector
26R1X2–ITMDS data (negative) input from the HDMI input selector
27R1X2+ITMDS data (positive) input from the HDMI input selector
28R2XC–ITMDS clock (negative) signal input from the HDMI input selector
29R2XC+ITMDS clock (positive) signal input from the HDMI input selector
30R2X0–ITMDS data (negative) input from the HDMI input selector
31R2X0+ITMDS data (positive) input from the HDMI input selector
32R2X1–ITMDS data (negative) input from the HDMI input selector
33R2X1+ITMDS data (positive) input from the HDMI input selector
34R2X2–ITMDS data (negative) input from the HDMI input selector
35R2X2+ITMDS data (positive) input from the HDMI input selector
36AVDD12-Power supply terminal (+1.2V)
37CVCC12-Power supply terminal (+1.2V)
38AVDD33-Power supply terminal (+3.3V)
39R3XC–I
40R3XC+I
41R3X0–I
42R3X0+I
43R3X1–I
44R3X1+I
45R3X2–I
46R3X2+I
47R4XC–I
48R4XC+I
49R4X0–I
50R4X0+ITMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
51R4X1–I
52R4X1+ITMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
53R4X2–I
TMDS clock (negative) signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SACD/CD) connector
TMDS clock (positive) signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/
CD) connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
TMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
TMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
TMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
TMDS clock (negative) signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD)
connector
TMDS clock (positive) signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD)
connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
74
Page 75
HT-NT3
Pin No.Pin NameI/ODescription
54R4X2+ITMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
55AVDD12-Power supply terminal (+1.2V)
56AVDD33-Power supply terminal (+3.3V)
57R5XC–I
58R5XC+I
59R5X0–I
60R5X0+I
61R5X1–I
62R5X1+I
63R5X2–I
64R5X2+I
65CVCC12-Power supply terminal (+1.2V)
66CSCLII2C serial data transfer clock signal input from the video system controller
67CSDAI/O
68INTOInterrupt signal output to the video system controller
69RESETIReset signal input from the video system controller "L": reset
70TPWR_CI2CAI/ONot used
71CEC_A1I/ONot used
72CEC_A0WAKEUPI/ONot used
73DSDA6I/OI2C serial data bus terminal Not used
74DSCL6II2C serial data transfer clock signal input terminal Not used
75LPSVCC33-Not used
76DSDA0I/OI2C serial data bus with the HDMI IN 9 (VIDEO 2) connector
77DSCL0II2C serial data transfer clock signal input from the HDMI IN 9 (VIDEO 2) connector
78CBUS_HPD0OHot plug detection signal output to the HDMI IN 9 (VIDEO 2) connector
79R0PWR5VIPower supply voltage (+5V) input from the HDMI IN 9 (VIDEO 2) connector
80DSDA1I/OI2C serial data bus with the HDMI input selector
81DSCL1II2C serial data transfer clock signal input from the HDMI input selector
82CBUS_HPD1OHot plug detection signal output to the HDMI input selector
83R1PWR5VIPower supply voltage (+5V) input terminal
84DSDA2I/OI2C serial data bus with the HDMI input selector
85DSCL2II2C serial data transfer clock signal input from the HDMI input selector
86CBUS_HPD2OHot plug detection signal output to the HDMI input selector
87R2PWR5VIPower supply voltage (+5V) input terminal
88DSDA3I/OI2C serial data bus with the HDMI ASSIGNABLE (INPUT ONLY) IN 3 connector
89DSCL3I
90CBUS_HPD3O
91R3PWR5VI
92DSDA4I/OI2C serial data bus with the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
93DSCL4I
94CBUS_HPD4O
95R4PWR5VI
96RSVDL-Not used
97DSDA5I/OI2C serial data bus with the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1) connector
98DSCL5I
99CBUS_HPD5O
TMDS clock (negative) signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO
1) connector
TMDS clock (positive) signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO
1) connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1)
connector
TMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1) connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1)
connector
TMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1) connector
TMDS data (negative) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1)
connector
TMDS data (positive) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1) connector
Two-way I2C serial data bus with the video system controller, video processor and HDMI input
selector
I2C serial data transfer clock signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3
(SA-CD/CD) connector
Hot plug detection signal output to the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/CD)
connector
Power supply voltage (+5V) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 3 (SA-CD/
CD) connector
I2C serial data transfer clock signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2
(BD) connector
Hot plug detection signal output to the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD) connector
Power supply voltage (+5V) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 2 (BD)
connector
I2C serial data transfer clock signal input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1
(VIDEO 1) connector
Hot plug detection signal output to the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO 1)
connector
75
Page 76
HT-NT3
Pin No.Pin NameI/ODescription
100R5PWR5VI
101SBVCC5V-Power supply terminal (+5V)
102VCC33OUTOPower supply (+3.3V) output terminal
103MHL0_CD0/GPIO0I/ONot used
104MHL1_CD1/GPIO1I/ONot used
105TX_HPD0OHot plug detection signal input from the video processor
106TXDSDA0I/OI2C serial data bus terminal Not used
107TXDSCL0OI2C serial data transfer clock signal output terminal Not used
108TX_HPD1IHot plug detection signal input from the HDMI ZONE 2 OUT connector
109TXDSDA1I/OI2C serial data bus with the HDMI ZONE 2 OUT connector
110TXDSCL1OI2C serial data transfer clock signal output to the HDMI ZONE 2 OUT connector
111APLL12-Power supply terminal (+1.2V)
112XTALVCC33-Power supply terminal (+3.3V)
113XTALOUTOSystem clock (27 MHz) output terminal
114XTALINISystem clock input terminal Not used
115XTALGND-Ground terminal
116CVCC12-Power supply terminal (+1.2V)
117SS/GPIO2I/ONot used
118SCLK/GPIO3I/ONot used
119SD0/GPIO4I/ONot used
120SD1/GPIO5I/ONot used
121WS0_OUT/DR0O
122SCK0/DDCKO
123IOVCC33-Power supply terminal (+3.3V)
124SD0_0/DL0O
125MCLKOMaster clock signal output to the video processor
126SD0_1/DR1/GPIO6O
127SD0_2/DL1/GPIO7O
128SD0_3/DR2/GPIO8O
129MUTEOUT/GPIO9O
130SPDIF0_OUT/DL2O
131WS0_IN/GPIO11I/ONot used
132SCK0_IN/GPIO10I/ONot used
133SD0_IN/SPDIF0_ININot used
134SCK1_IN/SCK1_OUTI/ONot used
135WS1_IN/WS1_OUTI/ONot used
136
137ARC0IAudio return signal input from the HDMI OUT A ARC connector
138ARC1IAudio return signal input terminal Not used
139CVCC12-Power supply terminal (+1.2V)
140TPVDD12-Power supply terminal (+1.2V)
141TDVDD12-Power supply terminal (+1.2V)
142T1XC–OTMDS clock (negative) output to the HDMI ZONE 2 OUT connector
143T1XC+OTMDS clock (positive) output to the HDMI ZONE 2 OUT connector
144T1X0–OTMDS data (negative) output to the HDMI ZONE 2 OUT connector
145T1X0+OTMDS data (positive) output to the HDMI ZONE 2 OUT connector
146T1X1–OTMDS data (negative) output to the HDMI ZONE 2 OUT connector
147T1X1+OTMDS data (positive) output to the HDMI ZONE 2 OUT connector
148T1X2–OTMDS data (negative) output to the HDMI ZONE 2 OUT connector
149T1X2+OTMDS data (positive) output to the HDMI ZONE 2 OUT connector
150TPVDD12-Power supply terminal (+1.2V)
SD1_IN/SD1_OUT/
SPDIF1_IN/SPDIF1_
OUT
Power supply voltage (+5V) input from the HDMI ASSIGNABLE (INPUT ONLY) IN 1 (VIDEO
1) connector
L/R sampling clock signal output to the DSP1
DSD audio data output to the video processor
Bit clock signal output to the video processor and DSP1
DSD audio clock signal output to the video processor
Digital audio signal output to the DSP1
DSD audio data output to the video processor
Digital audio signal output to the DSP1
DSD audio data output to the video processor
Digital audio signal output to the DSP1
DSD audio data output to the video processor
Digital audio signal output to the DSP1
DSD audio data output to the video processor
HDMI error signal output to the main system controller "H": error
Audio muting control signal output terminal
S/PDIF audio signal output to the digital audio interface receiver and DSP1
DSD audio data output to the video processor
OS/PDIF audio signal output to the digital audio interface receiver
76
Page 77
Pin No.Pin NameI/ODescription
151TDVDD12-Power supply terminal (+1.2V)
152T0XC–OTMDS clock (negative) output to the video processor
153T0XC+OTMDS clock (positive) output to the video processor
154T0X0–OTMDS data (negative) output to the video processor
155T0X0+OTMDS data (positive) output to the video processor
156T0X1–OTMDS data (negative) output to the video processor
157T0X1+OTMDS data (positive) output to the video processor
158T0X2–OTMDS data (negative) output to the video processor
159T0X2+OTMDS data (positive) output to the video processor
160CVCC12-Power supply terminal (+1.2V)
161 to
171
172IDCKIInput data clock signal input terminal Not used
173IOVCC33-Power supply terminal (+3.3V)
174 to
176
D0 to D10IVideo data input terminal Not used
D11 to D13IVideo data input terminal Not used
HT-NT3
77
Page 78
HT-NT3
Ver. 1.1
Note:
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service. Some delay should be anticipated
when ordering these items.
• The mechanical parts with no reference
number in the exploded views are not supplied.
6-1. OVERALL SECTION
• Bottom view
SECTION 6
EXPLODED VIEWS
• Color Indication of Appearance Parts Example:
KNOB, BALANCE (WHITE) . . . (RED)
↑ ↑
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
RU : Russian model
SP : Singapore model
TW : Taiwan model
Parts Color Cabinet’s Color
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro spécifi é.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
Les composants identifi és par la marque 9 contiennent des informations confi den-
tielles.
Suivre scrupuleusement les instructions
chaque fois qu’un composant est remplacé
et / ou réparé.
1
not supplied
1
1
front panel section
#1
1
#1
not supplied
2
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 4-433-307-21 (+) P TAPPING SCREW 3.5
2 X-2590-646-1 FRAME, GRILLE ASSY
#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 IT-3
1
not supplied
78
Page 79
6-2. FRONT PANEL SECTION
HT-NT3
Ver. 1.1
51
not supplied
not supplied
57
52
not supplied
not supplied
62
60
not supplied
not supplied
not supplied
61
60
not supplied
not supplied
55
not supplied
(OLED CHUKEI board)
not supplied
not
supplied
56
not supplied
54
60
not supplied
53
not supplied
not supplied
not
supplied
60
not supplied
57
62
not supplied
58
59
not supplied
not supplied
not supplied
60
not supplied
(AEP, UK, RU, AUS)
cabinet section 1
(AEP, UK, RU, AUS)
Note: If wire (fl at type) is replaced, install it after bending
it in the same form as that before replacement.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
51 4-547-408-01 PANEL, FRONT (LEFT)
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F: nonfl ammable
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
RU : Russian model
SP : Singapore model
TW : Taiwan model
When indicating parts by reference number, please include the board name.
HT-NT3
Ver. 1.1
AMP
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro spécifi é.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
Les composants identifi és par la marque 9 contiennent des informations confi den-
tielles.
Suivre scrupuleusement les instructions
chaque fois qu’un composant est remplacé
et / ou réparé.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
A-2060-205-A AMP BOARD, COMPLETE
< RESISTOR >
R6001 1-208-922-11 METAL CHIP 30K 0.5% 1/16W
R6002 1-218-937-11 METAL CHIP 47 5% 1/16W
R6003 1-218-937-11 METAL CHIP 47 5% 1/16W
R6004 1-218-937-11 METAL CHIP 47 5% 1/16W
R6005 1-218-937-11 METAL CHIP 47 5% 1/16W
R6011 1-216-001-00 METAL CHIP 10 5% 1/10W
R6012 1-216-001-00 METAL CHIP 10 5% 1/10W
R6013 1-216-001-00 METAL CHIP 10 5% 1/10W
R6014 1-216-001-00 METAL CHIP 10 5% 1/10W
R6025 1-218-967-11 METAL CHIP 15K 5% 1/16W
R6026 1-250-525-11 METAL CHIP 18K 1% 1/16W
R6027 1-250-487-11 METAL CHIP 470 1% 1/16W
R6028 1-250-487-11 METAL CHIP 470 1% 1/16W
R6035 1-218-937-11 METAL CHIP 47 5% 1/16W
R6036 1-218-937-11 METAL CHIP 47 5% 1/16W
R6037 1-218-937-11 METAL CHIP 47 5% 1/16W
R6039 1-218-937-11 METAL CHIP 47 5% 1/16W
R6043 1-218-965-11 METAL CHIP 10K 5% 1/16W
R6044 1-218-965-11 METAL CHIP 10K 5% 1/16W
R6045 1-218-937-11 METAL CHIP 47 5% 1/16W
R6049 1-218-977-11 METAL CHIP 100K 5% 1/16W
R6050 1-218-977-11 METAL CHIP 100K 5% 1/16W
R6056 1-218-965-11 METAL CHIP 10K 5% 1/16W
R6059 1-218-971-81 METAL CHIP 33K 5% 1/16W
R6060 1-218-971-81 METAL CHIP 33K 5% 1/16W
R6065 1-216-845-11 METAL CHIP 100K 5% 1/10W
R6066 1-216-839-11 METAL CHIP 33K 5% 1/10W
R6067 1-208-920-81 METAL CHIP 24K 0.5% 1/16W
84
R6072 1-208-927-11 METAL CHIP 47K 0.5% 1/16W
R6076 1-208-695-11 METAL CHIP 3.3K 0.5% 1/16W
R6084 1-218-965-11 METAL CHIP 10K 5% 1/16W
R6085 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R6089 1-216-789-11 METAL CHIP 2.2 5% 1/10W
R6090 1-216-789-11 METAL CHIP 2.2 5% 1/10W
R6091 1-216-295-91 SHORT CHIP 0
R6092 1-216-295-91 SHORT CHIP 0
R6093 1-216-295-91 SHORT CHIP 0
R6094 1-216-295-91 SHORT CHIP 0
R6095 1-216-295-91 SHORT CHIP 0
R6096 1-216-295-91 SHORT CHIP 0
R6097 1-216-295-91 SHORT CHIP 0
R6098 1-216-295-91 SHORT CHIP 0
R6099 1-216-845-11 METAL CHIP 100K 5% 1/10W
R6100 1-216-839-11 METAL CHIP 33K 5% 1/10W
R6101 1-218-967-11 METAL CHIP 15K 5% 1/16W
R6102 1-208-695-11 METAL CHIP 3.3K 0.5% 1/16W
R6103 1-208-927-11 METAL CHIP 47K 0.5% 1/16W
R6106 1-216-793-11 METAL CHIP 4.7 5% 1/10W
R6107 1-216-793-11 METAL CHIP 4.7 5% 1/10W
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
FB5008 1-400-580-21 FERRITE, EMI (SMD)
FB5010 1-481-348-21 EMI FERRITE (SMD) (1608) < IC >
IC101 (Not supplied) IC CXD90028GB-B
@ IC102 (Not supplied) IC K4B2G1646Q-BCMA
@ IC103 (Not supplied) IC K4B2G1646Q-BCMA
IC301 (Not supplied) IC TPS542941PWPR
IC302 (Not supplied) IC TPS542941PWPR
IC303 (Not supplied) IC TPS542941PWPR
IC410 (Not supplied) IC MFI337S3959
IC502 6-720-030-01 IC TPS2065CDBVR
IC503 6-720-030-01 IC TPS2065CDBVR
IC701 6-719-070-01 IC MM3411A50URE
IC703 6-710-554-01 IC PCM1808PWR
IC704 8-759-831-52 IC TC7WH125FK
IC2001 6-721-743-01 IC TC58NVG2S0HTAI0
IC3002 6-709-888-01 IC TC7WHU04FK
IC3003 6-706-483-01 IC TC7SH02FU
IC3004 (Not supplied) IC MB9BF128SPMC-GE1
IC3005 6-713-333-01 IC PST8429UL
IC3506 6-718-773-01 IC SII9575CTUC
IC5000 6-719-062-01 IC W25X20CLSNIG
IC5001 6-721-481-01 IC SII9679CNUC
IC5009 6-719-062-01 IC W25X20CLSNIG
IC5010 (Not supplied) IC SII9678CNUC
IC5014 6-718-999-01 IC MM1839A50NRE
R1503 1-218-933-11 METAL CHIP 22 5% 1/16W
R1504 1-218-933-11 METAL CHIP 22 5% 1/16W
R1505 1-218-933-11 METAL CHIP 22 5% 1/16W
R1506 1-218-933-11 METAL CHIP 22 5% 1/16W
R1507 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R1508 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R1509 1-218-965-11 METAL CHIP 10K 5% 1/16W
R1510 1-218-965-11 METAL CHIP 10K 5% 1/16W
R1511 1-218-965-11 METAL CHIP 10K 5% 1/16W
R1513 1-218-965-11 METAL CHIP 10K 5% 1/16W
R1519 1-218-933-11 METAL CHIP 22 5% 1/16W
R1520 1-218-990-81 SHORT CHIP 0
R1530 1-218-990-81 SHORT CHIP 0
R1531 1-218-990-81 SHORT CHIP 0
R1533 1-218-990-81 SHORT CHIP 0
R1539 1-218-990-81 SHORT CHIP 0
R1540 1-218-990-81 SHORT CHIP 0
R1541 1-218-990-81 SHORT CHIP 0
R1542 1-218-990-81 SHORT CHIP 0
R1551 1-216-864-11 SHORT CHIP 0
R1552 1-216-864-11 SHORT CHIP 0
R1553 1-216-864-11 SHORT CHIP 0
R1554 1-218-990-81 SHORT CHIP 0
R1555 1-218-990-81 SHORT CHIP 0
R1560 1-218-990-81 SHORT CHIP 0
R1561 1-218-990-81 SHORT CHIP 0
R1566 1-218-990-81 SHORT CHIP 0
R1567 1-218-990-81 SHORT CHIP 0
board is replaced, spread the bond referring to “BOND
FIXATION OF ELECTRIC PARTS” on page 5.
94
Note 2: If wire (fl at type) is replaced, install it after bending
it in the same form as that before replacement.
Page 95
MEMO
HT-NT3
95
Page 96
HT-NT3
REVISION HISTORY
Ver.DateDescription of Revision
1.02015.03New
1.12015.05Addition of Latin-American, Singapore, Russian and Taiwan models.
Change P/N of Ref. No. 201 in page 82 and 94.
How to search for a contact point of signal lines or the like in DIAGRAMS SECTION
If a contact point of a BLOCK DIAGRAM, PRINTED WIRING BOARD or SCHEMATIC DIAGRAM is shown in a different page, use
the PDF fi le search function to fi nd one.
e.g.) If a contact point is shown as
Procedure:
1. Press the [F] key while pressing the [Ctrl] key.
2. Input “>001Z” in the search box and press the [Enter] key.
3. The relevant part (page), where the contact point is shown, appears.
Note: If you still see the original page, press the [Enter] key again.
, follow the procedure below.
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