Sony HCDCL-5-MD Service manual

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Page 1

HCD-CL5MD

SERVICE MANUAL

Ver 1.0 2001. 02

HCD-CL5MD is the tuner, deck, CD, MD and amplifier section in CHC-CL5MD.

Model Name Using Similar Mechanism NEW

SECTION

TAPE DECK

SECTION

CD Mechanism Type CDM63B Base Unit Type BU-30BD61 Optical Pick-up Type A-MAX.3 Model Name Using Similar Mechanism HCD-ZX50MD MD Mechanism Type MDM-7B Optical Pick-up Type KMS-260B/K1NP Model Name Using Similar Mechanism NEW T ape Transport Mechanism T ype TCM-230ASR41CL

AEP Model

UK Model

E Model

Australian Model

Amplifier section

AEP model: DIN power output (Rated):40 + 40 watts

Continuous RMS power output (Reference):

Music power output (Reference):

Other models: DIN power output (Rated):40 + 40 watts

Continuous RMS power output (Reference):

Inputs VIDEO (AUDIO) IN (phono jacks):

(6 ohms at 1 kHz, DIN) 50 + 50 watts

(6 ohms at 1 kHz, 10% THD)

95 + 95 watts (6 ohms at 1 kHz, 10% THD)

(6 ohms at 1 kHz, DIN) 50 + 50 watts

(6 ohms at 1 kHz, 10% THD)

voltage 250 mV, impedance 47 kilohms

SPECIFICATIONS

CD DIGITAL IN (Supported sampling frequencies: 32 kHz, 44.1 kHz and 48 kHz) Outputs PHONES (stereo minijack):

SPEAKER: accepts impedance of 6 to

CD player section

System Compact disc and digital Laser Semiconductor laser

Laser output Max. 44.6 µW*

Frequency response 20 Hz – 20 kHz (±0.5 dB)

MICRO HiFi COMPONENT SYSTEM

accepts headphones of 8 ohms or more.

16 ohms.

audio system (λ=780 nm)

Emission duration: continuous

* This output is the value

measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture.

— Continued on next page —

9-929-583-11

Sony Corporation

Audio Entertainment Group General Engineering Dept.

Page 2

HCD-CL5MD

MD deck section

System MiniDisc digital audio Laser Semiconductor laser

Sampling frequency 44.1 kHz Frequency response 20 Hz – 20 kHz (±0.5 dB)

Tape deck section

Recording system 4-track 2-channel stereo Frequency response 40 – 13,000 Hz (±3 dB),

Tuner section

FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range 87.5 – 108.0 MHz

Aerial FM lead aerial Aerial terminals 75 ohms unbalanced Intermediate frequency 10.7 MHz AM tuner section

Tuning range AEP model: 531 – 1,602 kHz

Other models: 531 – 1,602 kHz

Aerial AM loop aerial Intermediate frequency 450 kHz

system (λ=780 nm)

Emission duration: continuous

using Sony TYPE I cassettes

(50 kHz step)

(with the interval set at 9 kHz)

(with the interval set at 9 kHz) 530 – 1,710 kHz (with the interval set at 10 kHz)

External aerial terminals

General

Power requirements AEP model: 230 V AC, 50/60 Hz Australian and New Zealand models:

Other models: 120 V, 220 V, 230 – 240

Power consumption AEP model: 100 watts

Other models: 100 watts Dimensions (w/h/d) incl. projecting parts and controls Amplifier/Tuner/Tape/MD/CD section:

Speaker: Approx. 210 × 285 × 260 Mass

Amplifier/Tuner/Tape/MD/CD section:

Design and specifications are subject to change without notice.

230 – 240 V AC, 50/60 Hz

V AC, 50/60 Hz Adjustable with voltage selector

0.5 watts (at the Power Saving Mode)

Approx. 215 × 285 × 421 mm

Approx. 8.6kg

Page 3

HCD-CL5MD

SELF-DIAGNOSIS FUNCTION

The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codes w hich show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self- Diagnosis Function (Error History Display Mode)”.

Self-diagnosis display

This system has a Self-diagnosis display function to let you know if there is a system malfunction. The display shows a code made up of three letters and a message alternately to show you the problem. To solve the problem refer to the following list. If any problem persists, consult your nearest Sony dealer.

C11/Protected

The MD is protected against erasure. cRemove the MD and slide the tab to close the

slot (Refer to Operating Instruction on page 17).

C12/Cannot Copy

You tried to record a CD or MD with a format that the system does not support, such as a CD-ROM.

cRemove the disc and turn off the system once,

then turn it on again.

C13/REC Error

Recording could not be performed properly. cMove the system to a stable place, and start

recording over from the beginning.

The MD is dirty or scratched, or the MD does not meet the standards.

cReplace the MD and start recording over from

the beginning.

C13/Read Error

The MD deck cannot read the disc information properly.

cRemove the MD once, then insert it again.

C14/Toc Error

The MD deck cannot read the disc information properly.

cReplace the MD. cErase all the recorded contents of the MD using

the All Erase function (Refer to Operating Instruction on page 27).

C41/Cannot Copy

The sound source is a copy of a commercially available music software, or you tried to record a CD-R (Recordable CD).

cThe Serial Copy Management System prevents

making a digital copy (Refer to Operating Instruction on page 48). You cannot record a CD-R.

E0001/MEMORY NG

There is an error in the internal data that the system needs in order to operate.

cConsult your nearest Sony dealer.

E0101/LASER NG

There is a problem with the optical pickup. cThe optical pickup may have failed. Consult your

nearest Sony dealer.

Procedure for using the Self-Diagnosis Function (Error History Display Mode). Note: Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required

procedure. Be careful not to enter other modes by mistake. If other modes are entered accidentally, press the MENU/NO button to exit the mode.

1. Connect the mains lead to the mains while pressing the DIMMER , FUNCTION , and x buttons together, then release the DIMMER, FUNCTION , and x buttons simultaneously. While the test mode is set. “[Check]” will be displayed.

2. Move ./> left and right to display “[Service]” and press the ENTER/YES button.

3. Move ./> left and right to display “Err Display”.

4. Press the ENTER/YES button to enter the error history mode. “op rec tm” will be displayed.

5. Select the item to be displayed or executed using ./> .

6. Press the REC MODE button to display the selected item.

7. Press the REC MODE button another time to return to step 4.

8. Pressing the MENU/NO button displays “Err Display” and exits the error history display mode.

9. To exit the test mode, press the REPEAT button. This sets the standby state and ends the test mode.

Page 4

HCD-CL5MD

ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS

Selecting the Test Mode

Display

op rec tm

op play tm

spdl rp tm

retry err

total err

err history

retry adrs

History

Displays the total recording time. When the total recording time is more than 1 minute, displays the hour and minute When less than 1 minute, displays “Under 1 min” The display time is the time the laser is set to high power, which is about 1/4 of the actual recording time.

Displays the total playback time. When the total playback time is more than 1 minute, displays the hour and minute When less than 1 minute, displays “Under 1 min”

Displays the total rotating time of the spindle motor. When the total rotating time is more than 1 minute, displays the hour and minute When less than 1 minute, displays “Under 1 min”

Displays the total number of retry errors during recording and playback Displays “r xx p yy”. xx is the number of errors during recording. yy is the number of errors during playback. This is displayed in hexadecimal from 00 to FF.

Displays the total number of errors Displays “total xx”. This is displayed in hexadecimal from 00 to FF.

Displays the past ten errors. Displays “0x ErrCd@@”. X is the history number. T he younger the number , the more recent is the history (00 is the latest). @@ is the error code. Select the error history number using ./> .

Displays the past five retry addresses. Displays “xx ADRS yyyy”, xx is the history number, yyyy is the cluster with the retry error. Select the error history number using ./> .

er refresh

op change

spdl change

Mode for erasing the error and retry address histories Procedure

1. Press the REC MODE button when displayed as “er refresh”.

2. Press the ENTER/YES button when the display changes to “er refresh?”. When “complete!” is displayed, it means erasure has completed. Be sure to check the following after executing this mode. *Data has been erased. *Perform recording and playback, and check that the mechanism is normal.

Mode for erasing the total time of op rec tm, op play tm. These histories are based on the time of replacement of the optical pick-up. If the optical pick-up has been replaced, perform this procedure and erase the history. Procedure

1. Press the REC MODE button when displayed as “op change”.

2. Press the ENTER/YES button when the display changes to “op change?”. When “Complete!” is displayed, it means erasure has completed.

Mode for erasing the total spdl rp tm time These histories are based on the time of replacement of the spindle motor. If the spindle motor has been replaced, perform this procedure and erase the history. Procedure

1. Press the REC MODE button when displayed as “spdl change”

2. Press the ENTER/YES button when the display changes to “spdl change?” When “Complete!” is displayed, it means erasure has completed.

Page 5

Table of Error Codes

HCD-CL5MD

Error Code

10 12 20 21 22 23 24 30 31 40 41 42 43 50 51

Description

Could not load Loading switches combined incorrectly Timed out without reading the top of PTOC Could read top of PTOC, but detected error Timed out without accessing UTOC Timed out without reading UTOC Error in UTOC Could not start playback Error in sector Retry cause generated during normal recording Retried in DRAM overflow Retry occurred during TOC writing Retry aborted during S.F editing Other than access processing, and could not read address. Focus NG occurred and overran.

Page 6

HCD-CL5MD

1. SERVICING NOTES ······················································· 7

2. GENERAL ·········································································· 9

3. DISASSEMBLY

3-1. Top Panel, Side Panel ·················································· 11 3-2. Cassette Mechanism ···················································· 12 3-3. Front Panel ·································································· 12 3-4. Panel Board ································································· 13 3-5. MD Mechanism ··························································· 13 3-6. Over Light Head (HR901), BD (MD) Board ·············· 14 3-7. Holder Assy ································································· 14 3-8. Loading Motor Assy (M103)······································· 15 3-9. Sled Motor Assy (M102) ·············································15 3-10.MD Optical Pick-Up (KMS-260B/K1NP) ·················· 16 3-11.Spindle Motor Assy ····················································· 16 3-12.Back Panel, Main Board··············································17 3-13.Amp Board, Power Transformer ································· 17 3-14.CD Mechanism ···························································· 18 3-15.Relay Board ································································· 18 3-16.CD Base Unit (BU-30BD61) ······································ 19 3-17.CD Optical Pick-Up (A-MAX.3) ································ 19 3-18.BD (CD) Board ··························································· 20 3-19.Driver Board ································································ 20 3-20.Fitting Base (Stabilizer) Assy, Tray Assy ···················· 21 3-21.Tray Sensor Board ······················································· 21 3-22.Slider (Loading), Gear (Slider) ··································· 22 3-23.Stocker Assy ································································ 22 3-24.Disc Sensor Board ······················································· 23 3-25.IN OUT SW Board ······················································ 23 3-26.Motor Assy (M721), Motor Board ······························ 24

4. TEST MODE ···································································· 25

5. MECHANICAL ADJUSTMENTS ····························· 30

6. ELECTRICAL ADJUSTMENTS ······························· 30

7. DIAGRAMS

7-1. Circuit Boards Location ·············································· 45

7-2. Block Diagram

CD Section ·································································· 47 MD Section ································································· 48 Syscon Section ···························································· 49

Main Section ······························································· 50 7-3. Printed Wiring Board Main Section ··························· 51 7-4. Schematic Diagram Main Section (1/2) ····················· 52 7-5. Schematic Diagram Main Section (2/2) ····················· 53 7-6. Schematic Diagram CD Section ································· 54 7-7. Printed Wiring Board CD Section ······························ 55 7-8. Schematic Diagram Driver Section ···························· 56 7-9. Printed Wiring Board Driver Section ························· 57 7-10.Schematic Diagram MD Section (1/2) ······················· 58 7-11.Schematic Diagram MD Section (2/2) ······················· 59 7-12.Printed Wiring Board MD Section ····························· 60 7-13.Printed Wiring Board Digital Section ························ 61 7-14.Schematic Diagram Digital Section (1/2) ·················· 62 7-15.Schematic Diagram Digital Section (2/2) ·················· 63 7-16.Schematic Diagram TC Section ································· 64 7-17.Printed Wiring Board TC Section······························· 65 7-18.Schematic Diagram AMP Section······························66 7-19.Printed Wiring Board AMP Section ··························· 67 7-20.Schematic Diagram Panel Section ····························· 68 7-21.Printed Wiring Board Panel Section··························· 69 7-22.Schematic Diagram Trans Section ····························· 70 7-23.Printed Wiring Board Trans Section ··························· 71 7-24.Schematic Diagram Power Section ···························· 72 7-25.Printed Wiring Board Power Section ························· 73 7-26.IC Pin Functions ·························································· 75 7-27.IC Block Diagrams ······················································ 85

8. EXPLODED VIEWS

8-1. Side Panel, Back Panel Section ··································· 89 8-2. Front Panel Section ····················································· 90 8-3. Chassis Section ···························································· 91 8-4. MD Mechanism Deck Section-1 ································· 92 8-5. MD Mechanism Deck Section-2 ································· 93 8-6. CD Mechanism Deck Section-1 ·································· 94 8-7. CD Mechanism Deck Section-2 ·································· 95 8-8. Base Unit Section ························································ 96

9. ELECTRICAL PARTS LIST ······································· 97

Page 7

SECTION 1

SERVICING NOTES

HCD-CL5MD

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

FOR CD

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

FOR MD

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

MODEL IDENTIFICATION – Back Panel –

Model

AEP, UK models Australian model

Other models

Power Voltage Indicator

Pow er V oltage

Incdication

AC: 230 V 50/60 Hz 100 W

AC: 230 – 240V 50/60 Hz 100 W

AC: 120 V, 220 V, 230 – 240V

50/60 Hz 100 W

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

To inspect the printed circuit boards, use the following jigs.

• Extension jig to inspect the DIGITAL board Jig for extension between DIGITAL board CN1001 and MAIN

board CN701 Part code number: J-2501-019-A 1 pc 25 pins with 1.25 mm

• Extension jig to inspect the BD (CD) board (RELAY board) Jig for extension between RELAY board CN2 and MAIN board

CN201 Part code number: J-2501-019-A 1 pc 25 pins with 1.25 mm

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY .

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

Page 8

HCD-CL5MD

JIG FOR CHECKING BD (MD) BOARD WAVEFORM

The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of ter minals and the checking items to be performed are shown as follows.

GND : Ground I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser) IOP : For measuring IOP (Check the deterioration of the optical pick-up laser) TE : TRK error signal (Traverse adjustment) VC : Reference level for checking the signal RF : RF signal (Check jitter) FE : Focus error signal

I+3V

GND

IOP

I+3V

IOP

GND

FE VC RF

CN105

I+3V Iop GND TE FE VC RF

for

MDM-7B

Page 9

SECTION 2

GENERAL

HCD-CL5MD

This section is extracted from instruction manual.

wh wg

wd ws wa

12345

qgqhqk

9 0 qa

qs qd

wh wg

wf wd

ws wa

ql qk

1234

5 6 7

8 9 0 qa qs

qf qg

BASS/TREBLE wf (40) CD 1 – 3 qj (11) CD 1 – 3 Z qj (9) CD disc tray qk (9) CD NX qs (9) DIMMER 5 (7) DISPLAY wg (8, 12, 16) Display window 3 ENTER/START ws (17, 38) ENTER/YES 7 (8, 11, 15, 20,

25, 34, 42) FUNCTION qh (9, 14, 17, 25, 37) GROOVE w; (40) MD insertion slot wd (14) MD REC ws (19) MD NX qf (14) MENU/NO 6 (24) MUSIC MENU wf (41)

BUTTON DESCRIPTIONS

?/1 1 ./> 4 Z 9 x 0 m/M wf

+/– wf

PHONES jack qd PLAY MODE/DIRECTION wa

(9, 14, 17, 37) REC MODE ws (20) Remote sensor wh REPEAT ql (10, 14) STEREO/MONO ql (35) SYNCHRO MODE ws (17) Tape deck lid 2 ( 37) TAPE REC PAUSE/START ws

(39) TAPE nN qg (37) TUNER/BAND qa (34) VOLUME 8

CHECK 8 (11, 15) CLEAR qs (11, 15) CLOCK/TIMER SELECT 2

(42)

CLOCK/TIMER SET 3

(8, 42) DBFB wh (40) DIMMER wd (7) DISC SKIP 9 (10) DISPLAY qk (8, 12, 16) ENTER/YES qa (8, 11, 15, 20,

25, 34, 42) FUNCTION qg (9, 14, 17, 25, 37) GROOVE qh (40) MENU/NO wa (24) MUSIC MENU 6 (41)

BUTTON DESCRIPTIONS

@/1 4 N q; x q; X q; M qd > qf . ql m w;

NAME EDIT/CHARACTER ws

(12, 25, 36) REPEAT 7 (10, 14) SCROLL wg (13, 26) SLEEP 1 (41) SURROUND 5 (40) TUNER/BAND wf (34) VOL +/– qj

Page 10

HCD-CL5MD

Setting the time

Turn on the system.

Press CLOCK/TIMER SET on the remote.

Proceed to step 5 when you set the clock for the first time.

Turn ./> (or press . or > on the remote) to select “CLOCK SET?”.

Press ENTER/YES.

Turn ./> (or press . or > on the remote) to set the hour.

Press ENTER/YES or M.

The minute indication flashes.

Turn ./> (or press . or > on the remote) to set the minute.

Press ENTER/YES.

The clock starts working.

If you made a mistake

Press m or M repeatedly until the incorrect item flashes, then set it again.

To change the preset time

Start over from step 1.

Saving the power in standby mode

Press DISPLAY repeatedly when the system is off. Each time you press the button, the system switches cyclically as follows:

Demonstration t Clock display t Power Saving Mode

To cancel the Power Saving Mode

Press DISPLAY once to show the demonstration, twice to show the clock displa

Tip

?/1 indicator lights up even in the Power Saving Mode.

Page 11

SECTION 3

DISASSEMBLY

• The equipment can be removed using the following procedure.

Set Top panel, Side panel

HCD-CL5MD

Cassette mechanism Front panel

Panel board

MD mechanism Over light head (HR901),

BD (MD) board Holder assy Loading motor assy (M103)

Sled motor assy (M102) MD optical pick-up

(KMS-260B/K1NP) Spindle motor assy

Back panel, Main board

Amp board, Power transformer

Note : Follow the disassembly procedure in the numerical order given.

3-1. TOP PANEL, SIDE PANEL

Note: Attach it so that it pressed down

the Main board.

Screw

(

Side panel (L) (Remove in the direction of the arrow)

Four screws

(

CASE 3 TP2)

Two screws

(

HEXAGON

SOCKET TAPPING

+BVTT 3 × 8

)

Connector (CN305)

CD mechanism Relay board

CD base unit (BU-30BD61) CD optical pick-up

(A-MAX.3) BD (CD) board

D.C. Fan

Connector (CN904)

Driver board Fitting base (stabilizer) assy,

Tray assy Tray sensor board

Slider (loading), Gear (slider) Stocker assy

Disc sensor board IN OUT SW board Motor assy (M721), Motor board

Top panel (Remove in the direction of the arrow)

Flact cable (9 core)

(CN304)

Screw

(

+BVTT 3 × 8

Two screws

(

+BVTP 3 × 8

Two screws

(

+BVTT 3 × 8

4 Heat sink,

Screw

(

+BVTT 3 × 8

)

cover

)

Side panel (R) (Remove in the direction of the arrow)

Four screws

(

CASE 3 TP2)

Page 12

HCD-CL5MD

)

3-2. CASSETTE MECHANISM

Two screws

+BVTP 3 × 8

(

TC board

)

Two screws

Flat cable (9 core)

Cassette mechanism dec

Bracket

(Cassette mechanism)

Screw

(

3-3. FRONT PANEL

Connector

+BVTP 2.6 × 8

)

Three s

(

+BVTP 2.6 × 8

Front panel

(

Two screws

(

+BVTP 2.6 × 8

crews

)

Screw

+BVTP 3 × 8

(

)

Screw

+BVTP 3 × 8

Screw

+BVTP 2.6 × 8

(

F/R belt

Main belt

Motor

)

Two screws

(

HEXAGON

SOCKET TAPPING

Screw

(

+BVTP 3 × 8

)

Flact cable (25 core)

(CN701)

Connector

(CN701)

Screw

(

+BVTP 3 × 8

Page 13

HCD-CL5MD

3-4. PANEL BOARD

Nut

Panel board

Two screws

(+BVTP

2.6 × 8

Six screws

(

+BVTP 2.6 × 8

)

Ring SW board

Shield (MD)

)

Four screws

(

+BVTP 2.6 × 8

)

Eight screws

(

+BVTP 2.6 × 8

Two screws

(

+BVTP 3 × 8

Two screws

(

+BVTP 2.6 × 8

MD mechanism

)

Knob (vol)

3-5. MD MECHANISM

Two screws

(

+BVTTWH M3

MD mechanism

(MDM-7B)

Two screws

(

Two insulators

)

+BVTP 3 × 8

)

Flat cable (17 core)

(CN103)

Digital board

Flat cable (27 core)

(CN102)

Two screws

(

+BVTTWH M3

Two insulators

)

Page 14

HCD-CL5MD

3-6. OVER LIGHT HEAD (HR901), BD (MD) BOARD

Over light head (HR901)

4 Remove the solder (four portions).

Screw (

P 1.7 × 6)

4 Remove the solder (five portions).

3-7. HOLDER ASSY

Screw (

5 Holder assy

2 × 6)

BD (MD) board

Flexible board (CN101)

2 Claw

Connector (CN104)

1 Tension spring (holder)

Page 15

3-8. LOADING MOTOR ASSY (M103)

)

Two s

crews (+

PWH1.7 × 3.5)

Loading motor assy (M103)

Belt

(loading

HCD-CL5MD

)

3-9. SLED MOTOR ASSY (M102)

1 T wo s

crews (

CZN2 × 6)

4 Slider (EJ)

2 Guide (L)

7 Slider

8 Lever (CHG)

6 Claw

9 T wo s

5 Lever (head)

crews (+

PWH1.7 × 3.5)

q; Sled motor assy (M102

Page 16

HCD-CL5MD

)

3-10. MD OPTICAL PICK-UP (KMS-260B/K1NP)

Flexible PWB

SL base

Screw (+

P1.7 × 6)

MD Optical pick-up (KMS-260B/K1NP)

Main shaft

Two s

crews (

+KPT2 × 6)

Screw (

CZN2 × 6

Screw (

M1.7, T APPING)

3-11. SPINDLE MOTOR ASSY

3 Gear

(SD)

Base (BU-A)

2 Spindle motor assy (M101)

1 Three s

crews (

M1.7, T APPING

Page 17

3-12. BACK PANEL, MAIN BOARD

)

Flat cable (15 core) (CN502)

Main board

Tuner

Back panel

Blacket (Heat sink)

Two screws

+BVTP 3 × 8

(

Two screws

(

+BVTP 3 × 8

Thirteen screws

(

+BVTP 3 × 8

HCD-CL5MD

)

3-13. AMP BOARD, POWER TRANSFORMER

Four screws

(+BVTT 4

Power

transformer

Connector

(CN902)

Three screws

(

Connector

(CN901)

+BVTP 3 × 8

Connector (CN701)

Two screws

+BVTP 3 × 16

(

)

(+BVTP 3

Two screws

Amp board

Main board

Two connector (CN101, CN251

Two screws

(

+BVTP 3 × 8

Heat sink

)

Cord bushing

Sub power board

Page 18

HCD-CL5MD

3-14. CD MECHANISM

CD mechanism deck

(CDM63B)

Two screws

(

+BVTP 3 × 8)

3 Chassis assy

Four screws

(

+BVTP 3 × 8

)

3-15. RELAY BOARD

Three screws

(

+BVTP 3 × 8

Note: When installing the CD mechanism, the four bosses

must be aligned with the specified positions.

)

3 RELAY board

1 Flat cable (21 core)

(CN792)

2 Two

Screws

(

+BTTP M2.6

)

Page 19

3-16. CD BASE UNIT (BU-30BD61)

)

qa CD base unit

(BU-30BD61)

HCD-CL5MD

q; Insulator

9 Cone coil spring

8 Floating screw (DIA.12)

q; Two Insulators

4 Two coil springs (Insulators)

3 Two stoppers

2 Two screws (BVTP2.6 × 8)

3-17. CD OPTICAL PICK-UP (A-MAX.3)

3 MD Optical pick-up (A-MAX.3)

q; Insulator

7 Coil spring (Insulator)

6 Washer

5 Floating screw (PTPWH M2.6

1 Flat cable (22 core)

(CN101)

1 Flat cable (16 core)

2 Sled shaft

Page 20

HCD-CL5MD

3-18. BD (CD) BOARD

3 BD (CD) board

4 Gear (LA)

5 Gear (LB)

1 Flat cable (16 core) (CN102)

2 Remove the solder

(four portions).

3-19. DRIVER BOARD

3 DRIVER board

1 Connector (CN703)

1 Connector (CN704)

1 Connector (CN702)

2 Screw (BTTP M2.6)

1 Connector (CN705)

Page 21

3-20. FITTING BASE (STABILIZER) ASSY, TRAY ASSY

2 Two screws (+BTTP M2.6)

4 Two screws (+BTTP M2.6)

5 TRAY SENSOR board

1 Rotate the cam,

and lift up the stocker at the full.

Stocker

6 HOLDER (SENSOR)

Cam

HCD-CL5MD

5 Tray assy

1 Two screws (+BTTP M2.6)

4 Fitting base (STABILIZER) assy

1 Two screws (+BTTP M2.6)

3-21. TRAY SENSOR BOARD

3 Three bosses

Page 22

HCD-CL5MD

3-22. SLIDER (LOADING), GEAR (SLIDER)

3 Two screws (+BTTP M2.6)

6 Slider (LOADING)

4 Bracket (retainer)

5 Floating screw

2 Bracket (retainer)

1 Two screws (+BTTP M2.6)

8 Two gears (SLIDER)

7 Two floating screws

3-23. STOCKER ASSY

3 Stocker assy

1 Screw (+BTTP M2.6)

2 Slide the slider (BU.L),

slider (BU.R) in the direction of

arrow A at the full.

1 Screw (+BTTP M2.6)

Page 23

3-24. DISC SENSOR BOARD

2 CD base unit assy

4 DISC SENSOR board

HCD-CL5MD

3 Two screws (+BTTP M2.6)

3-25. IN OUT SW BOARD

2 Two screws (+BTTP M2.6)

3 IN OUT SW board

1 Connector (CN704)

Page 24

HCD-CL5MD

3-26. MOTOR ASSY (M721), MOTOR BOARD

1 Belt

2 Connector (CN702)

7 Motor assy (M721)

4 Two screws (+BTTP M2.6)

Motor board bottom view

3 Remove two solders.

5 Motor board

Page 25

SECTION 4

TEST MODE

HCD-CL5MD

[CD Ship Mode]

• This mode moves the optical pick-up to the position durable to vibration. Use this mode when returning the set to the customer after repair.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Press CD 1 button and FUNCTION button simultaneously.

3. After the “STANDBY” display blinks six times, a message

“LOCK” is displayed on the fluorescent indicator tube, and the CD ship mode is set.

[GC Test Mode]

• This mode is used to check the software version, FL tube, LED, keyboard and VACS.

Procedure:

1. Press three buttons x , DISPLAY , and CD 2 simultaneously.

2. LEDs and fluorescent indicator tube are all turned on.

3. When you want to enter the software version display mode,

press CD 1 . The model number and destination are displayed.

4. Each time CD 1 is pressed, the display changes starting from

MC version, GC version, CD version, CDD version, CDM version, BD version, ST version, TA version, TM version, TC version and MD version in this order , and returns to the model number and destination display.

5. Press CD 2 button, and the key check mode is activated.

6. In the key check mode, the fluorescent indicator tube displays

“K 0 J 0 V 0”. Each time a button is pressed, “K 0” value increases. However, once a button is pressed, it is no longer taken into account. “V 0” value increases like 1, 2, 3 ... if rotating V OLUME knob in “+” direction, or it decreases like 0, 9, 8 ... if rotating in “–” direction.

7. Also when CD 3 is pressed after lighting of all LEDs and FL

tubes, value of VACS appears.

8. T o e xit from this mode, press three b uttons in the same manner

as step 1, or disconnect the power cord.

[MC Test Mode]

• This mode is used to check operations of the respective sections

of Amplifier, Tuner, CD and Tape.

Procedure:

1. Press the ?/1 button to turn on the set.

2. Press the three buttons of x , DISPLAY and CD 3

simultaneously.

3. The “VOLUME” segment flashes.

4. Every pressing of BASS/TREBLE f changes the displays in

the order of

“GEQ MIN”t“GEQ FLAT”t“GEQ MAX”

9. When x button is pressed to stop recording, the Tape (Deck) B is selected and tape is rewound using the m button, tape is rewound, tape is stops at around the record-starting position and playback of the recorded portion of the tape is started. If P A USE is inserted even once during recording, tape is re wound to the position around the P AUSE position and is played back.

10. The cold reset is enforced at the same time.

[CD Service Mode]

• This mode can run the CD sled motor freely. Use this mode, for

instance, when cleaning the optical pick-up.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD”.

3. Press three buttons x , FUNCTION , and CD 2 simultaneously.

4. The CD service mode is selected.

5. With the CD in stop status, turn the shuttle knob clockwise to

move the optical pick-up to outside track, or turn the shuttle knob counter-clockwise to inside track.

6. To exit from this mode, perform as follows:

1) Move the optical pick-up to the most inside track.

2) Press three buttons in the same manner as step 2.

Note: • Always move the optical pick-up to most inside track when exit-

ing from this mode. Otherwise, a disc will not be unloaded.

• Do not run the sled motor excessively, otherwise the gear can be chipped.

[CD Ship (Memory Clear) Mode]

• Set the CD ship mode and set the default setup when shipped from the factory at the next AC power on.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Select the function “CD ”.

3. Press three buttons x , FUNCTION and CD 1 simultaneously.

4. After the “STANDBY” display blinks six times, a message

“LOCK” is displayed on the fluorescent indicator tube, and the CD ship mode is set.

[CD/MD/TAPE Repeat 5 Times Limit Release Mode]

• 5 times limit of repeating CD/MD/TAPE is released.

Procedure:

1. Press ?/1 button to turn the set ON.

2. Press three buttons x , FUNCTION and CD 1Z .

3. 5 times limit of repeating CD/MD/TAPE is released.

4. Cold reset is performed at power off.

5. When the VOLUME control knob is turned clockwise even slightly, the sound volume increases to its maximum and a message “V OLUME MAX” appears for two seconds, then the display returns to the original display.

6. When the V OLUME control knob is turned counter -clockwise even slightly, the sound volume decreases to its minimum and a message “VOLUME MIN” appears for two seconds, then the display returns to the original display.

7. In the test mode, the default-preset channel is called even when the TUNER is selected and an attempt is made to call the preset channel that has been stored in memory, by oper ating the Shuttle knob. (It means that the memory is cleared.)

8. When a tape is inserted in Deck B and recording is started, the input source function selects VIDEO automatically.

Page 26

HCD-CL5MD

4-1. PRECAUTIONS FOR USE OF TEST MODE

• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the Z b utton is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop rotating. Therefore, it will be ejected while rotating. Be sure to press the MENU/NO button, and press the Z button after the disc stops rotating.

4-1-1. Recording laser emission mode and operating buttons

• Continuous recording mode (CREC 1MODE) (C35)

• Laser power check mode (LDPWR CHECK) (C13)

• Laser power adjustment mode (LDPWR ADJUS) (C04)

• Iop check (Iop Compare) (C27)

• Iop value nonvolatile writing (Iop NV Save) (C06)

• Traverse (MO) check (EF MO CHECK) (C14)

• Traverse (MO) adjustment (EF MO ADJUS) (C07)

• When pressing the MD REC button.

4-2. SETTING THE TEST MODE

The following are two methods of entering the test mode. Procedure: Connect the mains lead to the mains while pressing the DIMMER , FUNCTION , and x buttons together, then r elease the

DIMMER , FUNCTION , and x buttons simultaneously. When the test mode is set, “[Check]” will be displayed. Move ./> to switch between the following three groups;

··· y Check y Service y Develop y ···.

NOTE: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally. If the [Develop] group is set accidentally, press the MENU/NO button, immediately to exit the [Develop] group.

4-3. EXITING THE TEST MODE

Press the REPEAT button. The disc is ejected when loaded, and “Initialize” display blinks, and the STANDBY state is set.

4-4. BASIC OPERATIONS OF THE TEST MODE

Operate using the ./> , ENTER/YES button, REC MODE button, MENU/NO button.

Function name

MENU/NO button ENTER/YES button ./> (Left or Right) REC MODE button

Cancel or move to top hierarchy Set Select Set submenu

Function

Page 27

HCD-CL5MD

4-5. SELECTING THE TEST MODE

There are 26 types of test modes as shown below. The groups can be switched by moving ./> . After selecting the group to be used, press the ENTER/YES button. After setting a certain group, move the multi-stick to switche between these modes. Refer to “Group” in the table for details selected. All adjustments and checks during servicing can be performed in the test mode in the Service group.

NOTE: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally. If the [Develop] group is set accidentally, press the MENU/NO button, immediately to exit the [Develop] group.

Display

AUTO CHECK Err Display TEMP ADJUS LDPWR ADJUS Iop Write Iop NV Save EF MO ADJUS EF CD ADJUS FBIAS ADJUS AG Set (MO) AG Set (CD) TEMP CHECK LDPWR CHECK EF MO CHECK EF CD CHECK FBIAS CHECK ScurveCHECK VERIFYMODE DETRK CHECK 0920 CHECK Iop Read Iop Compare ADJ CLEAR INFORMATION CPLAY1MODE CREC 1MODE

No.

Automatic self-diagnosis

C01

Error history display, clear

C02

Temperature compensation offset adjustment

C03

Laser power adjustment

C04

Iop data writing

C05

Writes current Iop value in read nonvolatile memory using microprocessor

C06

Traverse (MO) adjustment

C07

Traverse (CD) adjustment

C08

Focus bias adjustment

C09

Focus, tracking gain adjustment (MO)

C10

Focus, tracking gain adjustment (CD)

C11

Temperature compensation offset check

C12

Laser power check

C13

Traverse (MO) check

C14

Traverse (CD) check

C15

Focus bias check

C16

S-curve check

C17

Nonvolatile memory check

C18

Detrack check

C19

Most circumference check

C25

Iop data display

C26

Comparison with initial Iop value written in nonvolatile memory

C27

Initialization of nonvolatile memory for adjustment values

C28

Display of microprocessor version, etc.

C31

Continuous playback mode

C34

Continuous recording mode

C35

Details

Mark

Group

Check Service

• For details of each adjustment mode, refer to “6. Electrical Adjustments”. For details of “Err Display”, refer to “Self-Diagnosis Function” on page 3.

• If a different mode has been selected by mistake, press the MENU/NO button, to exit that mode.

• Modes with (X) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set acciden-

tally, press the MENU/NO button, to exit the mode immediately.

Page 28

HCD-CL5MD

4-5-1. Operating the Continuous Playback Mode

1. Entering the continuous playback mode

1 Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.) 2 Move ./> and display “CPLAY1MODE”(C34). 3 Press the ENTER/YES button to change the display to “CPLAY1MID”. 4 When access completes, the display changes to “C = AD = ”.

Note : The numbers “ ” displayed show you error rates and ADER.

2. Changing the parts to be played back 1 Press the ENTER/YES button during continuous playback to change the display as below.

“CPLAY1MID” t “CPLAY1OUT” t “CPLAY1IN”

When pressed another time, the parts to be played back can be moved.

2 When access completes, the display changes to “C = AD = ”.

Note : The numbers “ ” displayed show you error rates and ADER.

3. Ending the continuous playback mode

1 Press the MENU/NO button. The display will change to “CPLAY1MODE”(C34). 2 To remove the disc, press the Z button.

Note : The playback start addresses for IN, MID, and OUT are as follows.

IN 40h cluster MID 300h cluster OUT 700h cluster

4-5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check.)

1. Entering the continuous recording mode

1 Set a recordable disc in the unit. 2 Move ./> and display “CREC 1MODE” (C35). 3 Press the ENTER/YES button to change the display to “CREC 1MID”. 4 When access completes, the display changes to “CREC1 ( )” and REC lights up.

Note : The numbers “ ” displayed shows you the recording position addresses.

2. Changing the parts to be recorded 1 When the ENTER/YES button is pressed during continuous recording, the display changes as below.

“CREC 1MID” t “CREC 1OUT” t “CREC 1IN”

When pressed another time, the parts to be recorded can be changed. REC goes off.

2 When access completes, the display changes to “CREC 1(

)” and REC lights up.

Note : The numbers “ ” displayed shows you the recording position addresses.

3. Ending the continuous recording mode

1 Press the MENU/NO button. The display changes to “CREC 1MODE” (C35 ) and REC goes off. 2 To remove the disc, press the Z button.

Note 1 : The recording start addresses for IN, MID, and OUT are as follows.

IN 40h cluster MID 300h cluster OUT 700h cluster

Note 2 :Press the MENU/NO button can be used to stop recording anytime. Note 3 :Do not perform continuous recording for long periods of time above 5 minutes. Note 4 :During continuous recording, be careful not to apply vibration.

4-6. FUNCTIONS OF OTHER BUTTONS

PLAY

MD 7

J (FF) j (FR)

PLAY MODE EJECT REPEAT

Function

Contents

Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns ON/OFF. Stops continuous playback and continuous recording. The sled moves to the outer circumference only when this is pressed. The sled moves to the inner circumference only when this is pressed. Switches the spindle servo mode (CLV S y CLV A). Ejects the disc. Exits the test mode. (When No disc)

Page 29

HCD-CL5MD

4-7. MEANINGS OF OTHER DISPLAYS

Display

LP2 LP4 (LED) SYNC LEVEL-SYNC OVER TOC REPEAT X1 MONO

Servo ON Tracking servo OFF Recording mode ON CLV low speed mode ABCD adjustment completed Tracking offset cancel ON Tracking auto gain OK Focus auto gain OK CLV S CLV LOCK

When Lit When Off

4-8. AUTOMATIC SELF-DIAGNOSIS FUNCTION

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform AUTO CHECK after the laser power check and Iop check.

Contents

Servo OFF Tracking servo ON Recording mode OFF CLV normal mode

Tracking offset cancel OFF

CL V A CLV UNLOCK

Procedure

1. Press the ENTER/YES button. If “LDPWR” is displayed, it means that the laser power check has not been performed. In this case, perform the laser power check and Iop compare, and then repeat from step 1.

2. If a disc is in the mechanical deck, it will be ejected forcibly. “DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.

3. If a disk is loaded at step 2, the check will start automatically.

4. When “XX CHECK” is displayed, the item corresponding to XX will be performed. When “06 CHECK” completes, the disc loaded at step 2 will be ejected. “DISC IN” will be displayed. Load the check disc (MD) TD YS-1.

5. When the disc is loaded in step 4, the check will automatically be resumed from “07 CHECK”.

6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHECK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.

When “CHECK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, thread motor, etc. When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.

4-9. INFORMATION

Display the software version.

Procedure

1. If displayed as “INFORMATION”, press the ENTER/YES button.

2. The software version will be displayed.

3. Press the MENU/NO button is lit to end this mode.

4-10. WHEN MEMORY NG IS DISPLAYED

If the nonvolatile memory data is abnormal, “E001”/”MEMORY NG” will be displayed so that the MD deck does not continue operations. In this case, set the test mode promptly and perform the following procedure.

Procedure

1. Set the test mode. (Refer to 4-2.)

2. Normally a message for selecting the test mode will be displayed. However if the non v olatile memory is abnormal, the following will be displayed. “INIT EEP?”

3. Press the x button and Z button together.

4. Move ./> and select MDM-7B.

5. Press the REC MODE button. If the nonvolatile memory is successfully overwritten, the normal test mode will be set and a message to select the test mode will be displayed.

Page 30

HCD-CL5MD

SECTION 5

MECHANICAL ADJUSTMENTS

SECTION 6

ELECTRICAL ADJUSTMENTS

Precaution

1. Clean the following parts with a denatured alcohol-moistened swab:

record/playback heads pinch rollers erase head rubber belts capstan idlers

2. Demagnetize the record/playback head with a head demagnetizer.

3. Do not use a magnetized screwdriver for the adjustments.

4. After the adjustments, apply suitable locking compound to the parts adjusted.

5. The adjustments should be performed with the rated power supply voltage unless otherwise noted.

Torque Measurement

Mode

FWD

FWD back tension

REV

REV back tension

FF/REW

FWD tension

REV tension

Torque meter

CQ-102C

CQ-102RC

CQ-201B

CQ-403A

CQ-403R

Meter reading

3.04 – 6.96 N • m (31 to 71 g • cm)

(0.43 – 0.98 oz • inch)

0.20 – 0.58 N • m

(2 to 6 g • cm)

(0.02 – 0.08 oz • inch)

3.04 – 6.96 N • m (31 to 71 g • cm)

(0.43 – 0.98 oz • inch)

0.20 – 0.58 N • m

(2 to 6 g • cm)

(0.02 – 0.08 oz • inch)

6.97 – 14.02 N • m (71 to 143 g • cm)

(0.98 – 1.99 oz • inch)

0.98 N • m or more

(100 g or more)

(3.53 oz or more)

0.98 N • m or more

(100 g or more)

(3.53 oz or more)

DECK SECTION 0 dB=0.775V

1. Demagnetize the record/playback head with a head demagnetizer.

2. Do not use a magnetized screwdriver for the adjustments.

3. After the adjustments, apply suitable locking compound to the parts adjusted.

4. The adjustments should be performed with the rated power supply voltage unless otherwise noted.

5. The adjustments should be performed in the order given in this service manual. (As a general rule, playback circuit adjustment should be completed before performing recording circuit adjustment.)

6. The adjustments should be performed for both L-CH and R-CH.

7. Switches and controls should be set as follows unless otherwise specified.

Signal

P-4-A100

WS-48B

10 kHz, –10 dB

3 kHz, 0 dB

Record/Playback Head Azimuth Adjustment

Procedure:

1. Mode : Playback

test tape P-4-A100 (10kHz, –10dB)

set

main board CN301 Pin 1 (L-ch) Pin 3 (R-ch)

Used forTape

Azimuth Adjustment

Tape Speed Adjustment

level meter

+ –

2. Turn the adjustment screw and check output peaks. If the peaks do not match for L-CH and R-CH, turn the adjustment screw so that outputs match within 1 dB of peak.

L-CH peak

screw position

R-CH peak

output level

within 1 dB

L-CH peak

R-CH peak

within 1dB

screw position

Page 31

HCD-CL5MD

RV354

RV304

RV304(Lch),RV354(Rch) Record Bias

3. Mode: Playback

test tape P-4-A100 (10kHz, –10dB)

set

in phase 45°

main board CN301 Pin 1 (L-ch)

Pin 2 (GND)

Pin 3 (R-ch)

Waveform of oscilloscope

90°

good

135°

oscilloscope

180°

wrong

4. After the adjustments, apply suitable locking compound to the parts adjusted.

Adjustment Location: Record/Playback/Erase Head

Tape Speed Check

Record Bias Adjustment

Procedure:

INTRODUCTION

When set to the test mode performed in Tape Speed Adjustment, when the tape is re wound after recording, the “REC memory

mode” which rewinds only the recorded portion and playback is set. This “REC memory mode” is convenient for performing this ad- justment. During recording, the input signal FUNCTION will automatically switch to VIDEO. (After recording, press the m button without stopping will return to the position where recording was started.)

1. Press FUNCTION button to select VIDEO. (This step is not necessary if the above test mode has already been set.)

2. Insert a tape into deck, press the TAPE REC PAUSE/START button, and then press the Y button to start recording.

3. Mode: Record

VIDEO (AUDIO) IN

1) 315 Hz

2) 10 kHz

AF OSC

attenuator

600 Ω

} 50 mV (–23.8 dB)

blank tap CS-123

set

Note: Set the test mode using the following method and begin tape

speed adjustment.

Procedure:

With the power turned ON, press the x button, ENTER/YES button, and DISC 3 button simultaneously. (The “VOLUME” on the fluorescent display tube will blink while in the test mode.) To exit the test mode, press the "/1 button.

1. Insert the WS-48B into deck.

2. Press the Y button of deck.

3. Check the reading of frequency counter becomes 3000 ± 15 Hz.

Sample Value of Wow and flutter

W.RMS (JIS) less than 0.3% (test tape: WS-48B)

4. Mode: Playback

recorded position

set

main board CN301 Pin 3 (R-ch) Pin 1 (L-ch)

level meter

5. Confirm playback the signal recorded in step 2 become adjustment level as follows. If these levels do not adjustment lev el, adjust the R V304 (L-CH) and RV354 (R-CH) on the TC board to repeat steps 3 and 4.

Adjustment level: The playback output of 10 kHz lev el differ ence

against 315 Hz reference should be 0 ± 0.5 dB.

Adjustment Location:

[TC BOARD]

Page 32

HCD-CL5MD

TP(RFAC) TP(DVC)

BD board

oscilloscope

Record Level Adjustment

Procedure:

INTRODUCTION

When set to the test mode performed in Tape Speed Adjustment, when the tape is rewound after recording, the “REC memory

mode” which rewinds only the recorded portion and playback is set. This “REC memory mode” is convenient for performing this adjustment. During recording, the input signal FUNCTION will automatically switch to VIDEO. (After recording, press the m button without stopping will return to the position where recording was started.)

1. Press FUNCTION button to select VIDEO. (This step is not necessary if the above test mode has already been set.)

2. Insert a tape into deck, press the TAPE REC PAUSE/START button, and then press the Y button to start recording.

3. Mode: Record

VIDEO (AUDIO) IN (J101) 315Hz 50 mV (–23.8 dB)

AF OSC

600 Ω

attenuator

set

blank tap CS-123

CD SECTION

Note :

1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.

2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10MΩ impedance.

4. Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.

S-Curve Check

Oscilloscope

BD (CD) board

TP(FEO) TP(DVC)

Procedure :

1. Connect oscilloscope to TP (FEO).

2. Connect between TP (FEI) and TP (VC) by lead wire.

3. Turn Power switch on.

4. Load a disc (YEDS-18) and actuate the focus search. (In consequence of open and close the disc tray, actuate the focus search)

5. Confirm that the oscilloscope waveform (S-curve) is symmetrical between A and B. And confirm peak to peak level within 4 ±1 Vp-p.

4. Mode: Playback

recorded position

set

main board CN301 Pin 3 (R-ch) Pin 1 (L-ch)

level meter

5. Confirm playback the signal recorded in step 2 become adjustment level as follows. If these levels do not adjustment lev el, adjust the R V301 (L-CH) and R V351 (R-CH) on the MAIN board to repeat steps 3 and 4.

Adjustment level:

CN301 playback level: 47.2 to 53.0 mV (–24.3 to –23.3 dB)

Adjustment Location:

[MAIN BOARD]

IC301

CN301

Record Level (R ch)

RV351

RV301

Record Level (L ch)

S-curve waveform

symmetry

within 4 ±1Vp-p

7. After check, remove the lead wire connected in step 2.

Note : • Try to measure several times to make sure than the ratio

of A : B or B : A is more than 10 : 7.

• Take sweep time as long as possible and light up the brightness to obtain best waveform.

RF Level Check

Procedure :

1. Connect oscilloscope to TP (RFAC).

2. Turned Power switch on.

3. Load a disc (YEDS-18) and playback.

4. Confirm that oscilloscope waveform is clear and check RF signal level is correct or not.

5. Measure the RFDC in the same way.

Page 33

HCD-CL5MD

IC103

IC101

TP (RFDC)

TP (CE)

TP (RFAC)

TP (XPCK)

)

Note: Clear RF signal waveform means that the shape “◊” can be

clearly distinguished at the center of the waveform.

RF signal waveform

VOLT/DIV : 200mV TIME/DIV : 500ns

level : 1.1 ± 0.3Vp-p

E-F Balance (1 Track jump) Check

oscilloscope

BD (CD) board

TP (TEO) TP (DVC)

+ –

Procedure:

1. Connect oscilloscope to TP (TEO) and TP (DVC) board.

2. Turned Power switch on.

3. Load a disc (YEDS-18) and playback the number five track.

4. Press the u button. (Becomes the 1track jump mode.)

5. Confirm that the level B and A (DC v oltage) on the oscilloscope waveform.

Adjustment Location :

[ BD (CD) BOARD ] — SIDE B —

1 track jump waveform

level=1.3 ±0.6Vp-p

Specification level: x 100=less than ±22%

A B

Symmetry

6. After check, remove the lead wire connected in step 1.

RF PLL Free-run Frequency

Procedure :

1. Connect frequency counter to test point (XPCK) with lead wire.

BD (CD) board

TP (XPCK)

2. Turned Power switch on.

frequency counte

–

3. Put the disc (YEDS-18) in to play the number five track.

Confirm that reading on frequency counter is 4.3218MHz.

Center of waveform

A (DC voltage

Page 34

HCD-CL5MD

MD SECTION 6-1. PARTS REPLACEMENT AND ADJUSTMENT

If malfunctions caused by Optical pick-up such as sound skipping are suspected, follow the following check.

Check before replacement

Start

6-6-2.

Laser Power Check

(See page 37)

6-6-3.

Iop Compare (See page 37)

6-6-4.

Auto Check

(See page 38)

Other faults are suspected. Check the threading mechanism, etc.

Replace Optical pick-up or MDM-7B

Page 35

Adjustment flow

HCD-CL5MD

Start

Replace IC195

Replace OP or IC195

Replace IC101, IC195, or D101

Replace OP, IC190, or IC195

YES

• Abbreviation OP: Optical pick-up

After turning off and then on the power, initialize the EEPROM For details, refer to 4-11. WHEN MEMORY NG IS DISPLAYED (See page 29)

6-7. INITIAL SETTING OF ADJUSTMENT VALUE

(See page 40)

6-9. TEMPERATURE COMPENSATION OFFSET

ADJUSTMENT (See page 40)

6-10. LASER POWER ADJUSTMENT (See page 40)

Replace OP, IC102, IC190,

or IC195

Replace OP, IC101, IC151,

or IC195

Replace OP

Replace the spindle motor

6-6-4. Auto Check (See page 38)

YES

6-11. Iop NV SAVE (See page 41)

6-12. TRAVERSE ADJUSTMENT (See page 41) 6-13. FOCUS BIAS ADJUSTMENT (See page 42) 6-16. AUTO GAIN CONTROL OUTPUT LEVEL

ADJUSTMENT (See page 43)

OP change in Err Display mode Iop write

Spindle change in Err Display mode

End adjustments

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HCD-CL5MD

6-2. PRECA UTIONS FOR CHECKING LASER DIODE

EMISSION

T o check the emission of the laser diode dur ing adjustments, ne ver view directly from the top as this may lose your eye-sight.

6-3. PRECAUTIONS FOR USE OF OPTICAL PICK-

UP (KMS-260B)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder fi rst. Before connecting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

flexible board

laser tap

Optical pick-up flexible board

6-4. PRECAUTIONS FOR ADJUSTMENTS

1) When replacing the following parts, perform the adjustments and checks with

2) Set the test mode when performing adjustments. After completing the adjustments, exit the test mode. Perform the adjustments and checks in “group S” of the test mode.

3) Perform the adjustments to be needed in the order shown.

4) Use the following tools and measuring devices.

• Check Disc (MD) TDYS-1

(Parts No. 4-963-646-01)

• Test Disk (MDW-74/GA-1) (Parts No. 4-229-747-01)

• Laser power meter LPM-8001 (Parts No. J-2501-046-A)

MD Laser power meter 8010S (Parts No. J-2501-145-A)

• Oscilloscope (Measure after perfor ming CAL of prove.)

• Digital voltmeter

• Thermometer

• Jig for checking BD (MD) board waveform

(Parts No. : J-2501-196-A)

6-7. Initial setting of adjustment values 6-8. Recording and displaying the Iop information 6-9. Temperature compensation offset adjustment 6-10. Laser power adjustment 6-11. Iop NV Save 6-12. Traverse adjustment 6-13. Focus bias adjustment 6-16. Auto gain control output level adjustment 6-6-4. Auto Check

in the order shown in the following table.

Adjustment

Optical

Pick-up

5) When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscilloscope. (VC and ground will become short-circuited.)

6) Using the above jig enables the waveform to be checked without the need to solder. (Refer to Servicing Note on page 8.)

7) As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Parts to be replaced

IC101 IC102 IC151 IC190 IC195 D101

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HCD-CL5MD

6-5. USING THE CONTINUOUSL Y RECORDED DISC

* This disc is used in focus bias adjustment and error rate check.

The following describes how to create a continuous recording disc.

1. Insert a disc (blank disc) commercially available.

2. Move ./> and display “CREC 1MODE”(C35).

3. Press the ENTER/YES button again to display “CREC 1MID”. Display “CREC (0300)” and start to recording.

4. Complete recording within 5 minutes.

5. Press the MENU/NO button and stop recording.

6. Press the Z button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note :

• Be careful not to apply vibration during continuous recording.

6-6. CHECKS PRIOR TO REPAIRS

These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations.

6-6-1. Temperature Compensation Offset Check

When performing adjustments, set the internal temperature and room temperature to 22 to 28ºC. Checks cannot be performed properly if performed after some time from power ON due to the rise in the temperature of the IC and diode, etc. So, perform the checks again after waiting some time.

Checking Procedure:

1. Move ./> to display “TEMP CHECK”(C12).

2. Press the ENTER/YES button.

3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]” is displayed, it means that the results are bad. (@@ indicates the current value set, and ## indicates the value written in the non-volatile memory.)

Checking Procedure:

1. Set the laser power meter on the objective lens of the optical pick-up. (If cannot set properly, press the m or M button and move the optical pick-up.) Connect the digital volt meter to CN105 pin 1 (I+3V) and CN105 pin 2 (IOP).

2. Then, move ./> and display “LDPWR CHECK” (C13).

3. Press the ENTER/YES button once and display “LD 0.9 mW $

”. Check that the reading of the laser power meter become

0.84 to 0.92 mW.

4. Press the ENTER/YES button once more and display “ LD 7.0 mW $ ”. Check that the reading the laser power meter and digital volt meter satisfy the specified value.

Specified Value :

Laser power meter reading : 7.0 ± 0.2 mW Digital voltmeter reading : Optical pick-up displayed value ± 10%

(Optical pick-up label)

KMS

260B 20101 H0576

Iop = 57.6 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)

(For details of the method for checking this value, refer to “6-8. Recording and Displaying Iop Information”.)

5. Press the MENU/NO button and display “LDPWR CHECK” (C13) and stop the laser emission. (The MENU/NO button, it is effective at all times to stop the laser emission.)

Note 1: After step 4, each time the ENTER/YES button is pressed,

the display will be switched between “LD 0.7 mW $ ”, “LD 6.2 mW $ ”, and “LD Wp $ ”. Nothing needs to be performed here.

6-6-2. Laser Power Check

Before checking, check the Iop value of the optical pick-up. (Refer to 6-8. Recording and Displaying Iop Information.)

Connection :

Laser power meter

Optical pick-up objective lens

Digital volt mete

BD (MD) board

CN105 pin 1 (I+3V)

CN105 pin 2 (IOP)

6-6-3. Iop Compare

The current Iop value at laser power 7 mW output and reference Iop value (set at shipment) written in the nonvolatile memory are compared, and the rate of increase/decrease will be displayed in percentage.

Note: Perform this function with the optical pick-up set at room

temperature.

Procedure

1. Move ./> to display “Iop Compare”(C27).

2. Press the ENTER/YES button and start measurements.

3. When measurements complete, the display changes to “±xx%yy”. xx is the percentage of increase/decrease, and OK or NG is displayed at yy to indicate whether the percentage of increase/ decrease is within the allowable range.

4. Press the MENU/NO button to end.

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HCD-CL5MD

6-6-4. Auto Check

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform Auto Check after the laser power check and Iop compare.

Procedure

2. If a disc is in the mechanical deck, it will be ejected forcibly. “DISC IN” will be displayed in this case. Load a test disc (MDW 74/GA-1) which can be recorded.

3. If a disk is loaded at step 2, the check will start automatically.

5. When the disc is loaded, the check will automatically be resumed from “07 CHECK”.

6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHECK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.

When “CHECK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, sled motor, etc. When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.

6-6-5. Other Checks

All the following checks are performed by the Auto Check mode. They therefore need not be performed in normal operation.

6-6-6. T raverse Check 6-6-7. Focus Bias Check 6-6-8. C PLAY Check 6-6-9. Self-Recording/Playback Check

6. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not move ./> . (Read power traverse checking)

(Traverse Waveform)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

7. Press the ENTER/YES button and display “EFB = MO-W”.

8. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. (Write power traverse checking)

(Traverse Waveform)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

9. Press the ENTER/YES button display “EFB = MO-P”.

Then, the optical pick-up moves to the pit area automatically and servo is imposed.

10. Observe the waveform of the oscilloscope, and check that the

specified value is satisfied. Do not move ./> .

6-6-6. T raverse Check

Connection :

Oscilloscope

BD (MD) board CN105 pin 4 (TE) CN105 pin 6 (VC)

V : 0.5 V/div H : 10 ms/div Input : DC mod

Checking Procedure:

1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) of the BD (MD) board.

2. Load a test disc (MDW-74/GA-1). (Refer to Note 1.)

3. Press the M button, and move the optical pick-up outside the pit.

4. Move ./> and display “EF MO CHECK”(C14).

5. Press the ENTER/YES button and display “EFB =

MO-R”. (Laser power READ power/Focus ser vo ON/tracking servo OFF/ spindle (S) servo ON)

(Traverse Waveform)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

11. Press the ENTER/YES button display “EF MO CHECK” (C14). The disc stops rotating automatically.

12. Press the Z button and remove the disc.

13. Load the check disc (MD) TDYS-1.

14. Move ./> and display “EF CD CHECK” (C15).

15. Press the ENTER/YES button and display “EFB =

CD”.

Servo is imposed automatically.

Page 39

HCD-CL5MD

16. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not move ./> .

(Traverse Wa vef orm)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

17. Press the ENTER/YES button and display “EF CD CHECK” (C15).

18. Press the Z button and remove the check disc (MD) TD YS-1.

Note 1 : MO reading data will be erased during if a recorded disc is

used in this adjustment.

Note 2 : If the traverse waveform is not clear, connect the oscillo-

scope as shown in the following figure so that it can be seen more clearly.

Oscilloscop

6-6-8. C PLAY Check

MO Error Rate Check

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “6-5. Using the Continuously Recorded Disc”.)

2. Move ./> and display “CPLAY1MODE”(C34).

3. Press the ENTER/YES button and display “CPLAY1MID”.

4. The display changes to “C1 = AD = ”.

5. If the C1 error rate is below 20, check that ADER is 00.

6. Press the MENU/NO button, stop playback, press the Z button, and test disc.

CD Error Rate Check

Checking Procedure :

1. Load a check disc (MD) TDYS-1.

2. Move ./> and display “CPLAY1MODE”(C34).

3. Press the ENTER/YES button twice and display “CPLAY1 MID”.

4. The display changes to “C1 = AD = ”.

5. Check that the C1 error rate is below 20.

6. Press the MENU/NO button, stop playback, press the Z button, and the test disc.

6-6-9. Self-Recording/playback Check

Prepare a continuous recording disc using the unit to be repaired and check the error rate.

BD (MD) board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

330 kΩ

10pF

6-6-7. Focus Bias Check

Change the focus bias and check the focus tolerance amount.

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “6-5. Using the Continuously Recorded Disc”.)

2. Move ./> and display “CPLAY1MODE”(C34).

3. Press the ENTER/YES button and display “CPLAY1MID”.

4. Press the MENU/NO button, when “C = AD = ” is displayed.

5. Move ./> and display “FBIAS CHECK”(C16).

6. Press the ENTER/YES button and display “ / c = ”. The first four digits indicate the C1 error rate, the two digits after [/] indicate ADER, and the 2 digits after [c =] indicate the focus bias value. Check that the C1 error is below 20 and ADER is below 2.

7. Press the ENTER/YES button and display “ / b = ”. Check that the C1 error is below 100 and ADER is below 2.

8. Press the ENTER/YES button and display “ / a = ”. Check that the C1 error is below 100 and ADER is below 2.

9. Press the MENU/NO button, next press the Z button, and remove the test disc.

Checking Procedure :

1. Insert a recordable test disc (MDW-74/GA-1) into the unit.

2. Move ./> to display “CREC 1MODE”(C35).

3. Press the ENTER/YES button to display the “CREC 1MID”.

4. When recording starts, “ REC ” is displayed, this becomes

“CREC (@@@@)” (@@@@ is the address), and recording starts.

5. About 1 minute later, press the MENU/NO button to stop continuous recording.

6. Move ./> to display “CPLAY1MODE”(C34).

7. Press the ENTER/YES button to display “CPLAY1MID”.

8. “C1 =

AD = ” will be displayed.

9. Check that the C1 error becomes below 20 and the AD error below 2.

10. Press the MENU/NO button to stop playback, and press the Z

button and remove the disc.

Page 40

HCD-CL5MD

6-7. INITIAL SETTING OF ADJUSTMENT VALUE

Note:

Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “6-4. Precautions on Adjustments” and execute the initial setting before the adjustment as required.

Setting Procedure :

1. Move ./> to display “ADJ CLEAR” (C28).

2. Press the ENTER/YES button. “Complete!” will be displayed momentarily and initial setting will be executed, after which “ADJ CLEAR” (C28) will be displayed.

6-8. RECORDING AND DISPLAYING THE Iop

INFORMATION

The Iop data can be recorded in the non-volatile memory. The Iop value on the label of the optical pick-up and the Iop value after the adjustment will be recorded. Recording these data eliminates the need to read the label on the optical pick-up.

Recording Procedure :

1. Move ./> to display “Iop Write” (C05), and press the ENTER/YES button.

2. The display becomes Ref=@@@.@ (@ is an arbitrary number) and the numbers which can be changed will blink.

3. Input the Iop value written on the optical pick-up. To select the number : Move ./> . To select the digit : Press the REC MODE button

4. When the ENTER/YES button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

5. As the adjustment results are recorded for the 6 value. Leave it as it is and press the ENTER/YES button.

6. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write” (C05).

Display Procedure :

1. Move ./> to display “Iop Read”(C26).

2. Press the ENTER/YES button.

2. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ indicates the Iop value labeled on the pick-up. ##.# indicates the Iop value after adjustment

3. To end, pr ess the MENU/NO b utton or press the REC MODE button and display “Iop Read” (C26).

6-9. TEMPERATURE COMPENSATION OFFSET

ADJUTMENT

Save the temperature data at that time in the non-volatile memory as 25 ˚C reference data.

Note :

1. Usually, do not perform this adjustment.

2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C. Perform it immediately after the po wer is turned on when the internal temperature of the unit is the same as the ambient temperature of 22 ˚C to 28 ˚C.

3. When D101 has been replaced, perform this adjustment after the temperature of this part has become the ambient temperature.

Adjusting Procedure :

1. Move ./> and display “TEMP ADJUS” (C03).

2. Press the ENTER/YES button and select the “TEMP ADJUS” (C03) mode.

3. “TEMP = [OK]” and the current temperature data will be displayed.

4. To save the data, press the ENTER/YES button. When not saving the data, press the MENU/NO button.

5. When the ENTER/YES button is pressed, “TEMP = SAVE” will be displayed and turned back to “TEMP ADJUS” (C03) display then. Pressing the MENU/NO button displays “TEMP ADJUS” (C03) immediately.

Specified Value :

The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 0F”, “10 - 1F” and “20 - 2F”.

6-10. LASER POWER ADJUSTMENT

Check the Iop value of the optical pick-up before adjustments. (Refer to 6-8. Recording and Displaying Iop Information.)

Connection :

Laser power meter

Optical pick-up objective lens

Digital volt mete

BD (MD) board

CN105 pin 1 (I+3V)

CN105 pin 2 (IOP)

Adjusting Procedure :

1. Set the laser power meter on the objective lens of the optical pick-up. (When it cannot be set properly,press the m or M button and move the optical pick-up.) Connect the digital volt meter to CN105 pin 1 (I+3V) and CN105 pin 2 (IOP).

2. Move ./> and display “LDPWR ADJUS” (C04). (Laser power : For adjustment)

3. Press the ENTER/YES button once and display “LD 0.9 mW $

”.

4. Move ./> so that the reading of the laser power meter becomes 0.85 to 0.91 mW . Press the ENTER/YES b utton after setting the range knob of the laser power meter, and save the adjustment results. (“LD SAVE $ ” will be displayed for a moment.)

5. Then “LD 7.0 mW $ ” will be displayed.

6. Move ./> so that the reading of the laser power meter becomes 6.9 to 7.1 mW, press the ENTER/YES button and save it.

Note : Do not perform the emission with 7.0 mW more than 15

seconds continuously.

Page 41

HCD-CL5MD

7. Then, move ./> and display “LDPWR CHECK” (C13).

8. Press the ENTER/YES button once and display “LD 0.9 mW $ ”. Check that the reading of the laser power meter become

0.85 to 0.91 mW.

9. Press the ENTER/YES button once more and display “LD 7.0

mW $ ”. Check that the reading the laser power meter and digital volt meter satisfy the specified value. Note down the digital voltmeter reading value.

Specified Value :

Laser power meter reading : 7.0 ± 0.2 mW Digital voltmeter reading : Optical pick-up displayed value ± 10%

(Optical pick-up label)

KMS

260B 20101 H0576

Iop = 57.6 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)

(For details of the method for checking this value, refer to “6-8. Recording and Displaying the IOP Information”.)

10. Press the MENU/NO button and display “LDPWR CHECK” (C13) and stop the laser emission. (The MENU/NO button is effective at all times to stop the laser emission.)

11. Move ./> to display “Iop Write”(C05).

12. Press the ENTER/YES button. When the display becomes Ref=@@@.@ (@ is an arbitrary number), press the ENTER/ YES button to display “Measu=@@@.@” (@ is an arbitrary number).

13. The numbers which can be changed will blink. Input the Iop value noted down at step 9. To select the number : Move ./> . To select the digit : Press the REC MODE button.

14. When the ENTER/YES button is pressed, “Complete!” will be displayed momentarily. The value will be recorded in the nonvolatile memory and the display will become “Iop Write” (C05).

Note 1: After step 4, each time the ENTER/YES button is pressed,

the display will be switched between “LD 0.7 mW $ ”, “LD 6.2 mW $ ”, and “LD Wp $ ”. Nothing needs to be performed here.

6-11. Iop NV SAVE

Write the reference values in the nonvolatile memory to perform “Iop compare”. As this involves rewriting the reference values, do not perform this procedure except when adjusting the laser power during replacement of the Optical pick-up and when replacing the IC102. Otherwise the Optical pick-up check may deteriorate.

Note: Perform this function with the optical pick-up set at room

temperature.

Procedure

1. Move ./> to display “Iop NV Save” (C06).

2. Press the ENTER/YES button and display “Iop [stop]”.

3. After the display changes to “Iop =xxsave?”, press the ENTER/

YES button.

4. After “Complete!” is displayed momentarily , the display changes

to “Iop 7.0 mW”.

5. After the display changes to “Iop=yysave?”, press the ENTER/

YES button.

6. When “Complete!” is displayed, it means that Iop NV saving

has been completed.

6-12. TRA VERSE ADJUSTMENT

Connection :

BD (MD) board CN105 pin 4 (TE) CN105 pin 6 (VC)

Adjusting Procedure :

1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) of the BD board.

2. Load a test disc (MDW-74/GA-1). (Refer to Note 1.)

3. Press the M button and move the optical pick-up outside the pit.

4. Move ./> and display “EF MO ADJUS” (C14).

5. Press the ENTER/YES button and display “EFB = (Laser power READ power/Focus serv o ON/tracking servo OFF/ spindle (S) servo ON)

6. Move ./> so that the waveform of the oscilloscope becomes the specified value. (When ./> is moved, the of “EFB= ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Read power traverse adjustment)

(Traverse Wa vef orm)

Specification A = B

7. Press the ENTER/YES button and save the result of adjustment to the non-volatile memory (“EFB = SAVE” will be displayed for a moment. Then “EFB = MO-W” will be displayed).

8. Move ./> so that the waveform of the oscilloscope becomes the specified value. (When ./> is moved, the of “EFB- MO-W” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Write power traverse adjustment)

(Traverse Wa vef orm)

Specification A = B

9. Press the ENTER/YES button, and save the adjustment results in the non-volatile memory . (“EFB = for a moment.)

10. “EFB = MO-P”. will be displayed.

The optical pick-up moves to the pit area automatically and servo is imposed.

Oscilloscope

V : 0.5 V/div H : 10 ms/div Input : DC mod

MO-R”.

SA VE” will be displayed

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HCD-CL5MD

11. Move ./> until the wavef orm of the oscilloscope moves closer to the specified value. In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

(Traverse Wa vef orm)

Specification A = B

12. Press the ENTER/YES button, and save the adjustment results in the non-volatile memory. (“EFB = SAVE” will be displayed for a moment.) Next “EF MO ADJUS” (C07) is displayed. The disc stops rotating automatically.

13. Press the Z button and remove the disc.

14. Load the check disc (MD) TDYS-1.

15. Move ./> and display “EF CD ADJUS” (C08).

16. Press the ENTER/YES button and display “EFB = CD”. Servo is imposed automatically.

17. Move ./> so that the waveform of the oscilloscope moves closer to the specified value. In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

(Traverse Wa vef orm)

6-13. FOCUS BIAS ADJUSTMENT

Adjusting Procedure :

1. Load a test disk (MDW-74/GA-1).

2. Move ./> and display “CPLAY1MODE”(C34).

3. Press the ENTER/YES button and display “CPLAY1MID”.

4. Press the MENU/NO button when “C1 = AD = ” is displayed.

5. Move ./> and display “FBIAS ADJUS”(C09).

6. Press the ENTER/YES button and display “ / a = ”. The first four digits indicate the C1 error rate, the two digits after [/] indicate ADER, and the 2 digits after [a =] indicate the focus bias value.

7. Move ./> in the right direction and find the focus bias value at which the C1 error rate becomes 220 (Refer to Note 2).

8. Press the ENTER/YES button and display “ / b = ”.

9. Move ./> in the left direction and find the focus bias value at which the C1 error rate becomes 220.

10. Press the ENTER/YES button and display “ / c = ”.

11. Check that the C1 error rate is below 20 and ADER is 00. Then

press the ENTER/YES button.

12. If the “( ” in “ - - ( ” is above 20, press the ENTER/

YES button. If below 20, press the MENU/NO button and repeat the adjustment from step 2.

13. Press the Z button and remove the test disc.

Note 1 : The relation between the C1 error and focus bias is as

shown in the following figure. Find points a and b in the following figure using the above adjustment. The focal point position C is automatically calculated from points a and b.

Note 2 : As the C1 error rate changes, perform the adjustment us-

ing the average vale.

Specification A = B

18. Press the ENTER/YES button, display “EFB =

SAVE” for a moment and save the adjustment results in the non-volatile memory. Next “EF CD ADJUS” (C08) will be displayed.

19. Press the Z button and remove the check disc (MD) TD YS-1.

Note 1 : MO reading data will be erased during if a recorded disc is

used in this adjustment.

Note 2 : If the traverse waveform is not clear, connect the oscillo-

scope as shown in the following figure so that it can be seen more clearly.

Oscilloscop

BD (MD) board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

330 kΩ

10pF

220

C1 error

c a Focus bias value

(F. BIAS)

Page 43

HCD-CL5MD

6-14. ERROR RATE CHECK

6-14-1. CD Error Rate Check

Checking Procedure :

1. Load a check disc (MD) TDYS-1.

2. Move ./> and display “CPLAY1MODE” (C34).

3. Press the ENTER/YES button and display “CPLAY1 MID”.

4. The display changes to “C1 = AD = ”.

5. Check that the C1 error rate is below 20.

6. Press the MENU/NO button, stop playback, press the Z button, and remove the test disc.

6-14-2. MO Error Rate Check

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “6-5. Using the Continuously Recorded Disc”.)

2. Move ./> and display “CPLAY1MODE” (C34).

3. Press the ENTER/YES button and display “CPLAY1MID”.

4. The display changes to “C1 = AD = ”.

5. If the C1 error rate is below 20, check that ADER is 00.

6. Press the MENU/NO button, stop playback, press the Z button, and remove the test disc.

6-15. FOCUS BIAS CHECK

Change the focus bias and check the focus tolerance amount.

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “6-5. Using the Continuously Recorded Disc”.)

2. Move ./> and display “CPLAY1 MODE”(C34).

3. Press the ENTER/YES button and display “CPLAY1 MID”.

4. Press the MENU/NO button when “C1 = AD = ” is displayed.

5. Move ./> and display “FBIAS CHECK”(C16).

7. Press the ENTER/YES button and display “ / b = ”. Check that the C1 error is below 100 and ADER is below 2.

8. Press the ENTER/YES button and display “ / a = ”. Check that the C1 error is below 100 and ADER is below 2

9. Press the MENU/NO button, next press the Z button and remove the continuously recorded disc.

6-16. AUTO GAIN CONTROL OUTPUT LEVEL

ADJUSTMENT

Be sure to perform this adjustment when the Optical pick-up is replaced. If the adjustment results becomes “Adjust NG!”, the Optical pick- up may be faulty or the servo system circuits may be abnormal.

6-16-1. CD Auto Gain Control Output Level Adjustment

Adjusting Procedure :

1. Insert the check disc (MD) TDYS-1.

2. Move ./> to display “AG Set (CD)” (C11).

3. When the ENTER/YES button is pressed, the adjustment will be performed automatically. “Complete!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (CD)” (C11).

4. Press the Z button and remove the disc.

6-16-2. MO Auto Gain Control Output Level Adjustment

Adjusting Procedure :

1. Insert the reference disc (MDW-74/GA-1) for recording.

2. Move ./> to display “AG Set (MO)” (C10).

4. Press the Z button and remove the disc.

Note 1 : If the C1 error and ADER are above other than the speci-

fied value at points a (step 8. in the above) or b (step 7. in the above), the focus bias adjustment may not have been carried out properly. Adjust perform the beginning again.

Page 44

HCD-CL5MD

6-17. ADJUSTING POINTS AND CONNECTING POINTS

[BD (MD) BOARD] (SIDE A)

CN101

D101

[BD (MD) BOARD] (SIDE B)

IC151

IC190

IC195

23 1 27 1

CN103 CN102

IC101

IC102

CN105

* NOTE

NOTE:It is useful to use the jig. for checking the waveform. (Refer

to Servicing Note on page 8.)

Page 45

7-1. CIRCUIT BOARDS LOCATION

TC board

BACK LIGHT board

HCD-CL5MD

SECTION 7

DIAGRAMS

VOL SEL board

THERMAL board

TRANS board

MAIN board

AMP board

RING SW board

PANEL board

IN OUT SW board

TRAY SENSOR board

DIGITAL board

BD (MD) board

DISK SENSOR board

SUB POWER boar

MOTOR board

DRIVER board

BD (CD) board

RELAY board

Page 46

HCD-CL5MD

These are omitted.

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.)

For schematic diagrams.

Note:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and specified.

•

• 2 : nonflammable resistor.

• 1 : fusible resistor.

• C : panel designation.

Note: The components identified by mark 0 or dotted line

• A : B+ Line.

• B : B– Line.

• H : adjustment for repair.

• Voltages and waveforms are dc with respect to ground

• V oltages are taken with a VOM (Input impedance 10 MΩ).

• Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

• Signal path.

• Abbreviation

: internal component.

with mark 0 are critical for safety. Replace only with part number specified.

under no-signal (detuned) conditions. Voltage variations may be noted due to normal produc-

tion tolerances. Voltage variations may be noted due to normal produc-

tion tolerances.

F : FM E : PB a : REC J : CD (Analog) c : CD (Digital) I : DIGITAL IN (Optical) p : MD (PB) l : MD (REC)

AUS : Australian model HK : Hong Kong model

W or less unless otherwise

• Indication of transistor

These are omitted.

For printed wiring boards.

Note:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

•

• : Pattern from the side which enables seeing.

Caution: Pattern face side: P arts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated.

: Through hole.

Page 47

7-2. BLOCK DIAGRAMS

CD SECTION

HCD-CL5MD

• Signal Path

: CD (DIGITAL)

:DIGITAL IN (OPTICAL)

OPTICAL PICK-UP

BLOCK

(A-MAX.3)

VCC

PD1

PD2

I5-10

I1-6

GND

F+

F-

+5V

Q101

DRIVE

IC103

RF AMP

VFC

MOTOR/COIL DRIVE

VO1(-)

VO1(+)

RFAC

RFDC

RFDCI

IC102

RFC

FEI

IN1+

IN1-

16FE

18TE

+5V

Q102

IC101

DIGITAL SERVO

DIGITAL SIGNAL PROC.

D OUT

RFAC

RFDC

26 SSTP

FFDR

FRDR

XTSL

DATA

CLOK

XLAT

SQSO

SENS

SCLK

SCOR

IC551

DIGITAL

(OPTICAL)

CTRL1(1-2)

DATA

CLK

XLT

SQSO

SENS

SCLK

SCOR

IC401(1/3)

MASTER CONTROL

XTSL

CD-DATA

CD-CLK

XLT

SQ-DATA-IN

SENS

SQ-CLK

SCOR

OPT SEL

IC503

SELECTOR

DIN

SECTION

T+

VO2(-)

T-

M102

SLED

MOTOR

M101

SPINDLE

MOTOR

VO2(+)

VO3(+)

VO3(-)

VO4(+)

VO4(-)

IN2+

IN2-

IN3+

IN3-

IN4R

24 MDP

STBY

TFDR

TRDR

SFDR

SRDR

XTAI

XTAO

XRST

X201

33.8MHz

LDON

XRST

PWM1

PWM2

PWM3

LDON

XRST

BU PWM 1

BU PWM 2

BU PWM 3

+3.3V

Q103,D101

+3.3V

REG.

+5V

4747

Page 48

HCD-CL5MD

MD SECTION

OPTICAL PICK-UP (KMS-260B/K1NP)

I J

LASER DIODE

2-AXIS DEVICE

(TRACKING)

HF MODULE

OVER WRITE HEAD

C B

DETECTOR

LDPD

FCS+

(FOCUS)

FCS– TRK+ TRK–

MOD

HR901

VC VC

C D

ILCC

FOCUS/TRACKING COIL DRIVER,

SPINDLE/SLED MOTOR DRIVER

M101

(SPINDLE)

M102

(SLED)

LD+3V

AUTOMATIC

POWER CONTROL

Q121, 122

LASER ON

SWITCH

Q101

IC141

21 23

12 10

OUT4F

OUT4R

OUT2F

OUT2R

OUT1F OUT1R

OUT3F OUT3R

D101 TEMP

SENSOR

PSB

4 5 6 7

IN4R

IN4F

IN2F

IN2R

IN1F

IN1R

IN3F

IN3R

TEMPR

TEMPI

A B C D

APC

AMP

19 18

14 15

48 47

MORFO

RF AMP

I-V

LD/PD

AMP

SPFD

SPRD

OVER WRITE HEAD DRIVE

IC181, Q181, 182

MORFI

RFO

46 40

B.P.F.

TEMP

WBL

B.P.F.

AMP

ABCD

AMP

SERIAL/PARALLEL

CONVERTER,

APCREF

83 13 67 65 66 75 74 63 64

APCREF

SFDR

SRDR

FFDR

FRDR

TFDR

TRDR

SCTX

ADFM

FOCUS

ERROR AMP

TRACKING

ERROR AMP

COMMAND

DECODER

SWDT

SCLK

XLAT

181716

XRST

PWM GENERATOR

WRPWR

AUTOMATIC

POWER

CONTROL

DIGITAL SERVO

SIGNAL

PROCESS

SIGNAL PROCESSOR

DIGITAL SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

SHOCK PROOF MEMORY CONTROLLER,

ATRAC ENCODER/DECODER

IC151 (1/2)

RF AMP,

FOCUS/TRACKING ERROR AMP

DIGITAL SERVO

IC151 (2/2)

AGCI

WBL

PEAK &

BOTTOM

ADIN

3029

V-I

CONVERTER

IC101

RF AGC

& EQ

WBL

AUX1

ABCD

A/D CONVERTER

FROM CPU INTERFACE

AUTO

SEQUENCER

AUX

PEAK

BOTM

ADFG

ABCD

F0CNT

ANALOG MUX

PEAK

XLRF CKRF DTRF

BOTM

FILTER

MD BACKUP

80 81 82

XLAT

SCLK

SWDT

100

(3.3V)

EFMO

FILI

PCO

CLTV

FILO

ASYO

ASYI

COMPA-

RFI

RATOR

ADFG

DEMODULATOR/

DECODER

F0CNT

RESET

HF MODULE

SWITCH

Q131 – 134

PLL

ADIP

IC502

SPINDLE

SERVO

SPFD

94 93

LD+3.3V

15 68

SHOCK PROOF

EFM/ACIRC

SUBCODE

PROCESSOR

SPRD

DQSY

12 11 14 9 8 5 6 7 1 2 3 4

RESET

LDON

DIG-RST

WRPWR

MOD

MOTOR DRIVE

IC1004

MEMORY CONTROLLER

ENCODER/DECODER

SQSY

XINT

27 32 48 40 42 50 58 56 2638

SQSY

DQSY

12 13

OUT1

2 10

XINT

LD-IN

6 5

RIN

SENS

LD-OUT

VCC

FIN

VREF

OUT2

INTERFACE

ATRAC

ENCODER/DECODER

CPU

SRDT

SWDT

SRDT

SWDT

M103

(LOADING)

-A

IC102

WAVEFORM

SHAPPER

SAMPLING

RATE

CONVERTER

DIGITAL

AUDIO

INTERFACE

GENERATOR

SCLK

XLAT

SCLK

MASTER CONTROLLER

REFERENCE

VOLTAGE SWITCH

Q1001,1002

(LIMIT IN SW)

(OUT SW)

(PLAY SW)

(REC SW)

IC151 (1/2)

CLOCK

INTERNAL BUS

MONITOR CONTROL

MNT0

MNT1

MNT1 (SHCK)

IC1001

IOP

ADDT

DADTI

XBCKI

LRCKI

DIN0

DIN1

DOUT

DADT

XBCK

LRCK

FS256

MNT2

MNT3

MNT2 (XBUSY)

M+7V

S101

S103

S104

S105

S102

DADTI

XBCKI

LRCKI

DIN

DOUT

P.DOWN

11 30

68 133

LD-LOW LIMIT-IN

OUT-SW

PLAY-SW

REC-SW

REFLECT

PROTECT

OP-LEVEL

OSCI

OSCO

D0 – D3

A00 – A07

A09

XOE

XWE XRAS XCAS

XOUT

ADPWN

EEP-WP

SDA(EEP)

MUTE

SLICERSEL

DARST

DALOCK

I2CCLK

I2CDAT

SPDIF-CUT

IC190

+3.3V

3 1

REG.

X171

90MHz

49, 48, 50, 51

34 – 31, 36 – 39, 45

43 47 46 44

XIN

118

60 66

SCL

116

36 37

123

I2C-CLK I2C-DATA

+5VLD+3.3 V

2, 3, 24, 25

DQ1 – DQ4

A0 – A7, A9

9 – 12, 15 – 18, 21

OE WE

RAS

CAS

X1001 10MHz

IC195

EEPROM

WP SCL

SDA

Q1004

D-RAM

IC152

DOUT

DIN

15 16 33 37 29

SPDIFO

MUTE

SLICER-SEL

RESET LOCK

+3.3V

XBCKI

SPDIFI

12SBCKOUT

IC1006

CONVERTER

Q2001,2002

DATAI

13 1211

DATA0

PW ON

LRCKI

12SLRCKOUT

D/A

• Signal Path

: MD (PLAY)

: MD (REC)

: CD (DIGITAL)

: CD (ANALOG)

IC1005

A/D

CONVERTER

XBCKI

LRCKI

BCK

VINL

VINR

SYSCLK

CLKOUT

VOUTL

VOUTR

VDDPLL

R-CH

I2C-DATA,I2C-CLK

P.DOWN

REC-L

CDMD-L

DIN

SECTION

MAIN

SECTION

MAIN

SECTION

PANEL

SECTION

4848

Page 49

SYSCON SECTION

CN551

PC LINK

SECTION

+5V

DATA

I2C-DATA,I2C-CLK

HCD-CL5MD

IC401(2/3)

MASTER CONTROL

PC POWER

IIC-CLK

IIC-DATA

IC552

I2C BUS BUFFER

CLK

Q551

Q552

I2C-CLK

I2C-DATA

XC-IN

XC-OUT

X-IN

X-OUT

X401

32.768kHz

X402 16MHz

S791

RING

S701

S707

DISPLAY

VOLUME

IC702

REMOTE SENSOR

S706

ROTARY

ENCODER

S702-705 S741-746

FUNCTION

KEY

SIRCS

POWER KEY

DISPLAY KEY

VOL A

VOL B

KEY0

LCD DATA

LCD SCK

LCD STB

STB LED

LCD

+5V

DATA

SCK

STB

Q701

LED

DRIVER

+5V

VREF

DATA

SCK

STB

D701

(POWER)

TC-MECHA

PLAY SW

SENSOR OUT

BTRGM+

+5V

R REC

F REC

PACK

M 9V

(TC-LID-SW)

Q396-397

MOTOR

CONTROL

Q391-392

TRIGGER

MOTOR

CONTROL

S501

B HALF/REC

CAPM-CNT1

B PLAY

B-SHUT

B TRG

TC LID

SUB TRAY 1

HEIGHT SENSOR

SUB TRAY 2

HEIGHT SENSOR

SUB TRAY 3

HEIGHT SENSOR

S742

(OUT)

S732-738

FUNCTION

KEY

S725-731 S747-750

FUNCTION

KEY

IC731

IC732

IC733

KEY1

KEY2

T-SENS1

T-SENS2

T-SENS3

OPEN

BACK LIGHT

LED 1

LED 2

LED 3

LED 4

Q702

DRIVER

Q746

LED

DRIVER

Q745

LED

DRIVER

Q744

LED

DRIVER

LED

D741 D743 D745 D722 D724

CD1 CD2 CD3

D771-776

(BACK LIGHT)

+5v

Q741-743

•REC

TAPE

•REC

(DISC IN DETECT)

S741

(IN)

IC751

IC701

LOADING MOTOR DRIVER

Q701

LOAD-OUT

DISC-SENS

LOAD-IN

RIN

FIN

OUT1

OUT2

M721

(LOADING)

4949

Page 50

HCD-CL5MD

MAIN SECTION

REC/PB HEAD

ERASE HEAD

R-CH

IC302

ERASE BIAS

REC/PB

VIDEO

(AUDIO)

IC304

J101

TUNER UNIT

ST-CLK

ST-D OUT

ST-D IN

ST-CE

TUNED

STEREO

ST MUTING

RDS-DATA

RDS-INT

RV304

REC

BIAS

T301

REC BIAS

ST-L ST-R

R-CH

A IN(L)

48 46

B IN(L)

EQ OUT(L)

Q302,303

BIAS

OSC

+10V

PB-A/B

+12V

Q301

D+5V

EQ IN(L)

SOUND PROCESSOR

VIDEO

CDMD

IC501

RESET

RV301

REC LEVEL

IC201

CLK

22 21 20

IC301

DOLBY NR

REC

OUT

INBB

NFBB

FBB

DATA

LATCH

PAS

REC OUT(L)

DOL

DOLBY TYPE B

BIAS SW

CDMD-L

SECTION

REC-L

IC801

POWER AMP

–

MUTING SWITCH

Q271

SWITCH

Q834

SWITCH

CD +5V

D513

Q801

OVERLOAD

DET.

Q835

DRIVER

E +5V

THP842

Q841,842 THERMAL

DET.

Q831-833 PROTECT

SWITCH

Q106,109

B+

SWITCH

D +5V

MDH +5V

MD 3.3V

MD A3.3V

MD BACKUP

Q881,882

RELAY

DRIVER

Q836-837 PROTECT

DC AMP

POWER AMP

D108

+10V

Q104 REG.

A +9V

M +7V

Q911

RELAY

DRIVER

+5.7V

IC401 (3/3)

STK-POWER

DBFB ON/OFF

HEAD PHONE

CD-POWER

STBY-RELAY

Q971-973

FAN CONT

PROTECT

DETECT

Q203

MUTING

Q201

SWITCH

LM ON/ OFF

BIAS ON/OFF

RM ON/OFF

ALC ON/OFF

Q183

SWITCH

MS OUT

PB OUT(L)

R LIN(L)

R-CH

Q181,182

SWITCH

Q501

RESET

SWITCH

R-CH

FEEDBACK

MASTER CONTROL

FRONT-RELAY

LINE MUTING

DA-MUTING

100

AC CUT

RESET

AMP-LAT

AMP-DATA

AMP-CLK

ST-CLK

ST-D IN

ST-D OUT

ST-CE

TUNED

STEREO

ST-MUTING RDS-DATA

RDS-INT

AMS-IN

TC-MUTING

R/PB/PASS

BIAS

REC MUTING

ALC

TC-RELAY

RY801

-B

IC105 +5.7V

3 1

REG.

IC108

+5V

3 1

REG.

IC110

+4V

3 1

REG.

IC101 +10V

3 1

REG.

IC102

+9V

3 1

REG.

IC103

+7V

3 1

REG.

IC911

+5.7V

3 1

REG.

Q931-933

R-CH

D961

D962

D921

R-CH

FAN

DRIVER

D901

D953-956

D957-960

D912-914

TM801

(FAN)

T901

POWER

TRANSFORMER

T911

SUB

TRANSFORMER

SPEAKER

J701

PHONES

• R-CH is omitted due to same as L-CH.

• Signal Path

: FM

: CD

: PB

: REC

: MD(PLAY)

: MD(REC)

RY911

AC IN

D922

MDM POWER

P.DOWN

SECTION

TO IC501

D511

D512

5050

Page 51

HCD-CL5MD

IC504

EP902

7-3. PRINTED WIRING BOARD MAIN SECTION

(Page 73)

IC501

IC401

• See page 45 for Circuit Boards Location.

(Page 65)

IC301

There are a few cases that the part printed on this diagram isn’t mounted in this model.

IC201

• Semiconductor Location

Ref. No. Location

D103 G-4 D106 F-6 D107 F-8 D108 F-8 D182 F-11 D202 C-10 D203 C-11 D204 H-5 D205 H-3 D206 G-6 D501 D-1 D502 B-1 D504 B-2 D505 B-2 D506 B-1 D507 B-1 D508 B-2 D509 B-2 D511 B-1 D512 B-1 D513 B-3 D514 B-1

(Page 69)

IC502

IC504

IC503

IC110

IC108

IC105

IC103 IC102 IC101

(Page 67)

IC552

IC551

IC101 G-10 IC102 G-10 IC103 G-9 IC105 F-8 IC108 E-6 IC110 G-6 IC201 C-10 IC301 D-6 IC401 D-3 IC501 C-1 IC502 G-3 IC503 H-4 IC551 F-13 IC552 G-12

Q104 G-10 Q106 F-7 Q109 F-9 Q181 F-11 Q182 F-11 Q183 F-11 Q201 D-9 Q203 C-9 Q251 B-9 Q253 C-9 Q271 D-9 Q391 B-7 Q392 B-7 Q396 B-8 Q397 B-8 Q501 D-1 Q551 F-11 Q552 G-12

(Page 69)

(Page 61)

EP902

(Page 57)

(Page 67)

5151

Page 52

HCD-CL5MD

7-4. SCHEMATIC DIAGRAM MAIN SECTION (1/2)

• See page 85 for IC Block Diagrams.

IC B/D

RV301

REC LEVEL

IC B/D

5252

Page 53

HCD-CL5MD

7-5. SCHEMATIC DIAGRAM MAIN SECTION (2/2)

• See page 74 for Wavefoms.

• See page 83 for IC Pin Function Description.

• See page 85 for IC Block Diagrams.

IC B/D

5353

Page 54

HCD-CL5MD

7-6. SCHEMATIC DIAGRAM CD SECTION

• See page 74 for Wavefoms.

• See page 75 for IC Pin Function Description.

(A-MAX. 3)

5454

Page 55

HCD-CL5MD

7-7. PRINTED WIRING BOARD CD SECTION

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

IC102

IC104

IC103

IC101

(Page 69)

(A-MAX.3)

• Semiconductor

Location

Ref. No. Location

D101 D-2

IC101 C-2 IC102 A-3 IC103 C-1

Q101 C-1 Q102 B-1 Q103 D-3

5555

Page 56

HCD-CL5MD

7-8. SCHEMATIC DIAGRAM DRIVER SECTION

• See page 86 for IC Block Diagrams.

IC B/D

5656

Page 57

HCD-CL5MD

7-9. PRINTED WIRING BOARD DRIVER SECTION

IC731

IC732

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

IC733

IC751

IC701

MAIN

BOARD

(Page 51)

5757

Page 58

HCD-CL5MD

7-10. SCHEMATIC DIAGRAM MD SECTION (1/2)

• See page 74 for Wavefoms.

• See page 77 for IC Pin Function Description.

• See page 86, 87 for IC Block Diagrams.

IC B/D

5858

Page 59

HCD-CL5MD

7-11. SCHEMATIC DIAGRAM MD SECTION (2/2)

• See page 74 for Wavefoms.

• See page 78 for IC Pin Function Description.

• See page 87 for IC Block Diagrams.

IC B/D

5959

Page 60

HCD-CL5MD

7-12. PRINTED WIRING BOARD MD SECTION

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

IC153

IC152

IC181

IC151

TO DIGITAL BOARD

(Page 61)

IC195

IC190

IC141

TO DIGITAL BOARD

(Page 61)

• Semiconductor

Location

Ref. No. Location

D101 D-3

Q101 C-3 Q131 B-3 Q132 C-3 Q133 B-3 Q134 B-3

K1NP

IC102

• Semiconductor

Location

Ref. No. Location

D181 A-1 D183 A-1

IC101 D-1 IC102 C-1 IC141 B-3 IC151 B-2 IC152 B-1

IC200

IC101

Ref. No. Location

IC181 A-2 IC190 A-3 IC195 A-3

Q121 C-1 Q122 C-1 Q181 A-1 Q182 A-1

6060

Page 61

HCD-CL5MD

IC1102

IC1004

(Page 60) (Page 60)

(Page 51)

7-13. PRINTED WIRING BOARD DIGITAL SECTION

IC1006

IC1005

IC1008

• See page 45 for Circuit Boards Location.

IC1002

There are a few cases that the part printed on this diagram isn’t mounted in this model.

• Semiconductor

Location

Ref. No. Location

IC1001 C-4 IC1005 B-2 IC1006 B-2

Q1004 C-3 Q2001 B-3 Q2002 B-3

IC1001

IC1101

• Semiconductor

Location

Ref. No. Location

IC1004 E-1

Q1001 D-1 Q1002 D-1

6161

Page 62

HCD-CL5MD

7-14. SCHEMATIC DIAGRAM DIGITAL SECTION (1/2)

• See page 88 for IC Block Diagrams.

53 59

R1077

R1024

100

IC B/D

6262

Page 63

HCD-CL5MD

7-15. SCHEMATIC DIAGRAM DIGITAL SECTION (2/2)

IC B/D

• See page 74 for Wavefoms.

• See page 81 for IC Pin Function Description.

• See page 88 for IC Block Diagrams.

6363

Page 64

HCD-CL5MD

7-16. SCHEMATIC DIAGRAM TC SECTION

• See page 88 for IC Block Diagrams.

IC B/D

6464

Page 65

HCD-CL5MD

7-17. PRINTED WIRING BOARD TC SECTION

• See page 45 for Circuit Boards Location.

IC302

There are a few cases that the part printed on this diagram isn’t mounted in this model.

(Page 51)

• Semiconductor Location

Ref. No. Location

IC302 A-3 IC304 B-1

Q301 A-4 Q302 C-3 Q303 B-4 Q304 B-2 Q305 B-2

IC304

6565

Page 66

HCD-CL5MD

7-18. SCHEMATIC DIAGRAM AMP SECTION

6666

Page 67

HCD-CL5MD

7-19. PRINTED WIRING BOARD AMP SECTION

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

(Page 51) (Page 71)

(Page 51)

• Semiconductor Location

Ref. No. Location

D801 E-6 D831 B-7 D851 F-6 D881 H-5 D891 F-6 D953 B-2 D954 B-2 D955 B-2 D956 B-2 D957 B-2 D958 A-2 D959 B-2 D960 B-2 D961 B-3 D962 B-3 D971 D-7 D991 H-6

(Page 71)

IC801 F-8

Q801 E-6 Q831 D-5 Q832 C-5 Q833 C-5 Q834 C-5 Q835 D-5 Q836 E-5 Q837 E-5 Q841 B-7 Q842 B-7 Q851 F-6 Q881 G-5 Q882 F-5 Q971 D-7 Q972 C-7 Q973 C-7

IC801

6767

Page 68

HCD-CL5MD

7-20. SCHEMATIC DIAGRAM PANEL SECTION

6868

Page 69

HCD-CL5MD

7-21. PRINTED WIRING BOARD PANEL SECTION

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

IC702

• Semiconductor Location

Ref. No. Location

D701 B-8 D702 E-4 D703 E-4 D722 G-6 D724 G-6 D741 H-7 D743 H-6 D745 H-5 D746 E-8 D771 B-5 D772 C-5 D773 B-5 D774 C-5 D775 B-5 D776 B-4

IC702 C-8

(Page 51)

(Page 55)

Q701 B-7 Q702 B-2 Q741 F-8 Q742 F-6 Q743 F-8 Q744 E-7 Q745 F-7 Q746 F-7

(Page 51)

6969

Page 70

HCD-CL5MD

7-22. SCHEMATIC DIAGRAM TRANS SECTION

AMP

TO SUB POWER BOARD AND VOL SEL BOARD (Page 72)

7070

Page 71

HCD-CL5MD

7-23. PRINTED WIRING BOARD TRANS SECTION

(Page 67)

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

• Semiconductor Location

Ref. No. Location

D901 D-1 D934 F-3

Q931 F-3 Q932 F-3 Q933 F-2

(Page 67)

TO SUB POWER BOARD AND VOL SEL BOARD (Page 73)

7171

Page 72

HCD-CL5MD

7-24. SCHEMATIC DIAGRAM POWER SECTION

7272

Page 73

HCD-CL5MD

7-25. PRINTED WIRING BOARD POWER SECTION

• See page 45 for Circuit Boards Location.

There are a few cases that the part printed on this diagram isn’t mounted in this model.

• Semiconductor Location

Ref. No. Location

D911 C-4 D912 A-4 D913 A-4 D914 A-4 D915 A-4 D921 A-5 D922 B-5

IC911 B-4

Q911 C-5

IC911

(Page 71)

(Page 51)

VOLTAGE

7373

Page 74

HCD-CL5MD

1 IC1001 w;

XOUT

3.5Vp-p

10.0MHz

• WA VEFORMS

IC101 eh (RF)

IC101 ef (FE)

(Play mode)

IC101 wh (TE)

(Play mode)

IC151 o; (FS4)

1.3Vp-p

0.2Vp-p

1.6Vp-p

– BD (CD) SECTION –

IC101 t;

RFAC

1.3Vp-p

IC101 ra

IC101 el

IC101 wg

MDP

0.5Vp-p

– MAIN SECTION –

IC401 qa

32.768kHz

IC401 qd

16MHz

– MD DIGITAL SECTION –– BD (MD) SECTION –

3.0Vp-p

4.2Vp-p

176.4kHz

3.5Vp-p

7.5µsec

IC101 us

XTAO

2.2Vp-p

5Vp-p

33.8MHz

7474

Page 75

7-26. IC PIN FUNCTIONS

• IC101 DIGITAL SIGNAL PROCESSOR (CXD3068Q) (BD (CD) Board)

Pin No.

1 DVDD0 — Digital power supply 2 XRST I System reset 3 MUTE I Muting selection pin 4 DATA I Serial data input, supplied from CPU 5 XLAT I Latch input, supplied from CPU 6 CLOK I Serial data transfer clock input, supplied from CPU 7 SENS O SENS output 8 SCLK I SENS serial data read-out clock

9 ATSK I/O Input pin for anti-shock (Ground) 10 WFCK O WFCK (Write Frame Clock) output (Not used) 11 XUGF O XUGF output (Not used) 12 XPCK O XPCK output (Not used) 13 GFS O GFS output (Not used) 14 C2P0 O C2PO output 15 SCOR O Sub-code sync output 16 CM4 O 4.2336MHz output (Not used) 17 WDCK O 48-bit slot D/A interface word clock (Not used) 18 DVSS — Digital ground 19 COUT O Numbers of track counted signal output (Not used) 20 MIRR O Mirror signal output (Not used) 21 DFCT O Defect signal output (Not used) 22 FOK O Focus OK output (Not used) 23 PWM1 I (Not used) 24 LOCK I/O GFS in sampled by 460Hz (Not used) 25 MDP O Output to control spindle motor servo 26 SSTP I Input signal to detect disc inner most trak 27 FST0 O 2/3 divider output (Not used) 28 DVDD1 — Digital power supply 29 SFDR O 30 SRDR O 31 TFDR O 32 TRDR O 33 FFDR O 34 FRDR O 35 DVSS1 — Digital ground 36 TEST I 37 TES1 I 38 VC I Center voltage input 39 FE I FOCUS error signal input 40 SE I Sled error signal input

I/O

Sled drive output

Tracking drive output

Focus drive output

TEST pin connected normally ground

HCD-CL5MD

FunctionPin Name

Page 76

HCD-CL5MD

Pin No. Function

41 TE I Tracking error signal input 42 CE I Center servo analog input 43 RFDC I RF signal input 44 ADI0 O Test pin (Not used) 45 AVSS0 — Analog ground 46 IGEN I Power supply pin operational amplifiers 47 AVDD — Analog power supply 48 ASYO O EFM full swing output 49 ASYI I Asymmetry comparate voltage input 50 RFAC I EFM signal input 51 AVSS1 — Analog ground 52 CLTV I Control voltage input for master VCO 53 FILO O Filter output for master PLL 54 FILI I Filter input for master PLL 55 PCO O Charge-pump output for master PLL 56 AVDD1 — Analog power supply 57 BIAS I Asymmetry circuit constant current input 58 VCTL I Control voltage input for variable pitch PLL 59 V16M I/O 16.9344MHz output (Not used) 60 VPCO O Charge-pump output for variable pitch PLL (Not used) 61 DVDD2 — Digital power supply 62 ASYE I Asymmetry circuit ON/OFF (Connected to +5V.) 63 MD2 I Digital-out ON/OFF control (Connected to +5V.) 64 DOUT O Digital-out output 65 LRCK O 48-bit slot D/A interface, LR clock output 66 PCMD O 48-bit slot D/A interface, Serial deta output 67 BCLK O 48-bit slot D/A interface, bit clock output 68 EMPH O Playback disc output in emphasis mode (Not used) 69 XTSL I X’tal selection input pin 70 DVSS2 — Digital ground 71 XTAI I X’tal oscillator circuit input 72 XTAO O X’tal oscillator circuit output (Not used) 73 SOUT O 74 SOCK O (Not used) 75 XOCT O 76 SQSO O Sub-Q serial output 77 SQCK I Clock input for SQSO read-out 78 SCSY I Sub-code input 79 SBSO O Sub-P through Sub-W serial output (Not used) 80 EXCR I Clock input for SBSO read-out

Pin Name I/O

Page 77

• IC101 CXA2523AR RF Amplifier (BD (MD) BOARD) Pin No.

1 2 3

4 to 9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

Pin Name I/O

I J VC A to F PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLAT XSTBY F0CNT VREF EQADJ 3TADJ Vcc WBLADJ TE CSLED SE ADFM ADIN ADAGC ADFG

AUX

FE ABCD BOTM PEAK RF RFAGC AGCI COMPO COMPP ADDC OPO OPN RFO MORFI MORFO

I-V converted RF signal I input

I-V converted RF signal J input

Middle point voltage (+1.5V) generation output

Signal input from the optical pick-up detector

Light amount monitor input

Laser APC output

Reference voltage input for setting laser power

—

Ground

Temperature sensor connection

Reference voltage output for the temperature sensor

Serial data input from the CXD2662R

Serial clock input from the CXD2662R

Latch signal input from the CXD2662R “L”: Latch

Stand by signal input “L”: Stand by

Center frequency control voltage input of BPF22, BPF3T, EQ from the CXD2662R

Reference voltage output (Not used)

I/O

Center frequency setting pin for the internal circuit EQ

I/O

Center frequency setting pin for the internal circuit BPF3T

—

+3V power supply

I/O

Center frequency setting pin for the internal circuit BPF22

Tracking error signal output to the CXD2662R

—

External capacitor connection pin for the sled error signal LPF

Sled error signal output to the CXD2662R

FM signal output of ADIP

ADIP signal comparator input ADFM is connected with AC coupling

—

External capacitor connection pin for AGC of ADIP

ADIP duplex signal output to the CXD2662R I

3 signal/temperature signal output to the CXD2662R

(Switching with a serial command)

Focus error signal output to the CXD2662R

Light amount signal output to the CXD2662R

RF/ABCD bottom hold signal output to the CXD2662R

RF/ABCD peak hold signal output to the CXD2662R

RF equalizer output to the CXD2662R

—

External capacitor connection pin for the RF AGC circuit

Input to the RF AGC circuit The RF amplifier output is input with AC coupling

User comparator output (Not used)

User comparator input (Fixed at “L”)

I/O

External capacitor pin for cutting the low band of the ADIP amplifier

User operation amplifier output (Not used)

User operation amplifier inversion input (Fixed at “L”)

RF amplifier output

Groove RF signal is input with AC coupling

Groove RF signal output

HCD-CL5MD

Function

• Abbreviation APC: Auto Power Control AGC: Auto Gain Control

Page 78

HCD-CL5MD

• IC151 CXD2662R Digital Signal Processor, Digital Servo Signal Processor (BD (MD) BOARD) FunctionPin No.

2 3 4 5 6 7 8 9

13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

31 to 34

36 to 40

41 42 43 44 45 46 47

Pin Name I/O

MNT0 (FOK)

MNT1 (SHCK) MNT2 (XBUSY) MNT3 (SLOC) SWDT SCLK XLAT SRDT SENS XRST

SQSY

DQSY

RECP XINT TX OSCI OSCO XTSL DIN0 DIN1 DOUT DADTI LRCKI XBCKI ADDT DADT LRCK XBCK FS256 DVDD A03 to A00 A10 A04 to A08 A11 DVSS XOE XCAS A09 XRAS XWE

FOK signal output to the system control (monitor output)

“H” is output when focus is on Track jump detection signal output to the system control (monitor output)

Monitor 2 output to the system control (monitor output)

Monitor 3 output to the system control (monitor output)

Writing data signal input from the system control

Serial clock signal input from the system control

I (S)

Serial latch signal input from the system control

I (S)

Reading data signal output to the system control

O (3)

Internal status (SENSE) output to the system control

O (3)

Reset signal input from the system control “L”: Reset

I (S)

Subcode Q sync (SCOR) output to the system control

“L” is output every 13.3 msec. Almost all, “H” is output Digital In U-bit CD format or MD format subcode Q sync (SCOR) output to the system

control Laser power switching input from the system control “H”: Recording, “L”: Playback

Interrupt status output to the system control

Recording data output enable input from the system control

System clock input (512Fs=22.5792 MHz)

System clock output (512Fs=22.5792 MHz) (Not used)

System clock frequency setting “L”: 45.1584 MHz, “H”: 22.5792 MHz (Fixed at “H”)

Digital audio input (Optical input)

Digital audio output (Optical output)

Serial data input

LR clock input “H” : Lch, “L” : R ch

Serial data clock input

Data input from the A/D converter

Data output to the D/A converter

LR clock output for the A/D and D/A converter (44.1 kHz)

Bit clock output to the A/D and D/A converter (2.8224 MHz)

11.2896 MHz clock output (Not used)

+3V power supply (Digital)

—

DRAM address output

DRAM address output (Not used)

DRAM address output

DRAM address output (Not used)

Ground (Digital)

—

Output enable output for DRAM

CAS signal output for DRAM

Address output for DRAM

RAS signal output for DRAM

Write enable signal output for DRAM

* I (S) stands for Schmidt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O

Page 79

HCD-CL5MD

Pin No.

48 49

50, 51

52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85

Pin Name I/O

D1 D0 D2, D3 MVCI ASYO ASYI AVDD BIAS RFI AVSS PCO FILI FILO CLTV PEAK BOTM ABCD FE AUX1 VC ADIO AVDD ADRT ADRB AVSS SE TE DCHG APC ADFG F0CNT XLRF CKRF DTRF APCREF TEST0 TRDR

I/O I/O I/O

I (S)

I (A)

—

I (A) I (A)

—

O (3)

I (A)

O (A)

I (A) I (A) I (A) I (A) I (A) I (A) I (A)

O (A)

—

I (A) I (A)

—

I (A) I (A) I (A) I (A)

I (S)

O O O O O O O

Function

Data input/output for DRAM

Clock input from an external VCO (Fixed at “L”) Playback EFM duplex signal output Playback EFM comparator slice level input +3V power supply (Analog) Playback EFM comparator bias current input Playback EFM RF signal input Ground (Analog) Phase comparison output for the recording/playback EFM master PLL Filter input for the recording/playback EFM master PLL Filter output for the recording/playback EFM master PLL Internal VCO control voltage input for the recording/playback EFM master PLL Light amount signal peak hold input from the CXA2523AR Light amount signal bottom hold input from the CXA2523AR Light amount signal input from the CXA2523AR Focus error signal input from the CXA2523AR Auxiliary A/D input Middle point voltage (+1.5V) input from the CXA2523AR Monitor output of the A/D converter input signal (Not used) +3V power supply (Analog) A/D converter operational range upper limit voltage input (Fixed at “H”) A/D converter operational range lower limit voltage input (Fixed at “L”) Ground (Analog) Sled error signal input from the CXA2523AR Tracking error signal input from the CXA2523AR Connected to +3V power supply Error signal input for the laser digital APC (Fixed at “L”) ADIP duplex FM signal input from the CXA2523AR (22.05 ± 1 kHz) Filter f

0 control output to the CXA2523AR

Control latch output to the CXA2523AR Control clock output to the CXA2523AR Control data output to the CXA2523AR Reference PWM output for the laser APC PWM output for the laser digital APC (Not used) Tracking servo drive PWM output (–)

• Abbreviation EFM: Eight to Fourteen Modulation PLL : Phase Locked Loop VCO: Voltage Controlled Oscillator

Page 80

HCD-CL5MD

Pin No.

86 87 88 89 90 91 92 93 94 95

96 to 98

100

• Abbreviation EFM: Eight to Fourteen Modulation

Pin Name I/O

TFDR DVDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1 to TEST3 DVSS EFMO

Tracking servo drive PWM output (+)

+3V power supply (Digital)

—

Focus servo drive PWM output (+)

Focus servo drive PWM output (–)

176.4 kHz clock signal output (X’tal) (Not used)

Sled servo drive PWM output (–)

Sled servo drive PWM output (+)

Spindle servo drive PWM output (–)

Spindle servo drive PWM output (+)

I (S)

Test input (Fixed at “L”)

Ground (Digital)

—

EFM output when recording

Function

Page 81

• IC1001 M30805MG-205GP SYSTEM CONTROL (DIGITAL BOARD)

HCD-CL5MD

Pin No.

1 — Not used. 2 — Not used. 3 LVLI — Not used. 4 LVLO — Not used. 5 (TXD3) — Not used. 6 (RXD3) — Not used. 7 (CLK3) — Not used. 8 MUTE O Line out muting output. L: Mute

9 DARST O Reset signal output to the D/A converter. L: Active 10 SLICERSEL O IEC958 input select signal output to the D/A converter. L: CD H: MD 11 LD-LOW O Loading motor voltage control output L: High voltage H: Low voltage 12 LDIN I Loading motor control input. H: IN 13 LDOUT O Loading motor control output. H: OUT 14 MOD O Laser modulation switching signal output. L: OFF H: ON 15 BYTE I Data bus changed input. (Connected to ground.) 16 CNVSS — Ground. 17 X-CIN O Sub clock input. (32.768kHz) (Not used.) 18 X-COUT O Sub clock output. (32.768kHz) (Not used.) 19 RESET I System rest input. L : ON 20 XOUT O Main clock output. (10MHz) 21 VSS0 — Ground. 22 XIN I Main clock input. (10MHz) 23 VCC0 — Power supply. (+3.3V) 24 NMI I Fixed at H. (Pull-up) 25 DQSY I Digital in sync input. (Record system) 26 P.DOWN I Power down detection input. L: Power down 27 SQSY I ADIP (MO) sync or subcode Q (PIT) sync input from CXD2662R.(Playback system) 28 NC — Not used. 29 LDON O Laser ON/OFF control output. H: Laser ON 30 LIMIT-IN I Detection input from the limit switch. L: Sled limit-In H: Sled limit-Out 31 C2-PWM-B — Not used. 32 XINIT I Interrupt status input from CXD2662R. 33 — Not used. 34 XELT I XELT input from DSP IC. 35 WR PWR O Write power ON/OFF output. L: OFF H: ON 36 IIC CLK I/O IIC serial clock input/output. 37 IIC DATA I/O IIC serial data input/output. 38 SWDT O Writing data signal output to the serial bus. 39 VCC1 — Power supply. (+3.3V) 40 SRDT I Reading data signal input from the serial bus. 41 VSS1 — Ground. 42 SCLK O Clock signal output to the serial bus. 43 REC-SW I Detection signal input from the recording position detection switch. L: REC 44 CLIP DTO O CLIP serial data output. 45 CLIPDTI I CLIP serial data input. (Not used.) 46 CLIP CLK O CLIP serial clock output. (Not used.) 47 DIG-RST O Digital rest signal output to the CXD2662R and motor driver. L: Reset 48 SENS I Internal status (SENSE) input from the CXD2662R. 49 PLAY-SW I Detection signal input from the playback position detection switch. L: PLAY 50 XLAT O Latch signal output to DSP IC. 51 OUT-SW I Detection signal input from the loading out detection switch. 52 — Not used.

I/O

FunctionPin Name

Page 82

HCD-CL5MD

FunctionPin NamePin No. I/O

53 — Not used. 54 — Not used. 55 O Not used. 56 MNT2 (XBUSY) I In the state of executive command from the CXD2662R 57 VSS2 — Ground. 58 MNT1 (SHCK) I Track jump signal input from the CXD2662R 59 VCC2 — Power supply. (+3.3V) 60 EEP-WP O EEP-ROM write protect signal output. L: write possibility 61 SDA (EEP) I/O Data signal input/output pin with the EEP-ROM. 62 BCLK/ALE/CLKO — Not used. 63 RD/DW O Read signal output. 64 BHE/CASH — Not used. 65 WR/CASL O Write signal output. 66 SCL O Clock signal output to the EEP-ROM. 67 REFLECT I Disk reflection rate detection input from the reflect detection switch. H: Disk with low reflection rate 68 PRO TECT I Recording-protection claw detection input from the protection detection switch. H: Protect 69 CS0 O Chip select signal output to the Flash ROM. 70 CS1 O Not used. 71 O Not used. 72 A20 O Address bus signal output to Flash ROM. 73 A19 O Address bus signal output to Flash ROM. 74 VCC3 — Power supply. (+3.3V) 75 A18 O Address bus signal output to Flash ROM.

76 VSS3 — Ground 77 to 85 A17 to A9 O Address bus signal output to Flash ROM. 86 to 89 SEL 3 to 0 O Not used.

90 WP O Write protect signal to the Flash ROM.

91 VCC4 — Power supply. (+3.3V)

92 A8 O Address bus signal output to Flash ROM.

93 VSS4 — Ground.

94 to 100 A7 to A1 O Address bus signal output to Flash ROM.

101 LB — Not used.

102 to 113 D15 to D4 I/O Data bus signal input/output to the Flash ROM.

114 CLIP-SEL O Not used. 115 IIC BUSY O IIC cable connect check. L: Active 116 DALOCK O LOCK signal input from D/A converter. 117 LINE-MUTE O Not used. 118 ADP DOWN O Reset signal output to the A/D converter.

119 to 122 D3 to D0 I/O Data bus signal input/output to the Flash ROM.

123 SPDIF-CUT — Jog dial pulse input from the rotary encoder. 124 OPT SEL O Optical select signal output.

125 to 129 — Not used.

130 VSS5 — Ground. 131 O Not used. 132 VCC5 — Power supply. (+3.3V) 133 OP-LEVEL I Optical Pick-up voltage (current) detect signal input.

134 to 139 — Not used.

140 AVSS — Ground. (Analog) 141 — Not used. 142 VREF — Power supply. (+3.3V) 143 AVCC — Power supply. (+3.3V) 144 NC I Not used.

Page 83

• IC401 M30622MGA-A33FP MASTER CONTROL (MAIN BOARD)

HCD-CL5MD

Pin No.

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

Pin Name

LED 2 LED 3 LED 4

SIRCS

LCD DATA

LCD STB LCD SCK

N.C. N.C.

XC-IN

XC-OUT

RESET X-OUT

VSS X-IN VCC

NMI

RDS-INT

SCOR

RDS-DATA

ST-MUTING

ST-CE

ST-DOUT

BU PWM 3

ST-DIN

BU PWM 2

ST-CLK

BU PWM 1

IIC-CLK

IIC-DATA

N.C.

SQ-DATA-IN

SQ-CLK

XTSL

CD-DATA

SENS

CD-CLK

CD-POWER

STB LED/CLK

DBFB ON/OFF

LDON

XLT

XRST

LOAD-IN

LOAD-OUT

OPEN

CLOSE T-SENS1 T-SENS2 T-SENS3

I/O

LED control signal output

Remote control receiver data signal input

LCD DATA signal output

LCD STB signal output

LCD SCK signal output

–

Connected to ground

–

Connected to ground

Sub clock input

Sub clock output

System reset input

Main system clock output

–

Ground

Main system clock input

–

Power supply (+5V)

–

Not used (connected to Vcc)

RDS interrupt signal input

CD Q-data signal input

RDS data signal input

Tuner muting signal output

Tuner chip enable output

Tuner data signal output

BU PWM 3 signal output

Tuner data signal input

BU PWM 2 signal output

Tuner clock signal output

BU PWM 1 signal output

IIC SCL output

IIC SDA output

–

Not used

CD SQ data input

CD SQ clock output

XTSL signsl output for IC101

CD data signal output

BD condition signal input

CD clock signal output

CD power control signal output (H=ON,L=OFF)

Standby LED ON/OFF signal output/Test point (clock check)

DBFB control signal output (L=ON,H=OFF)

LDON signsl output for IC103

CD LAT signal output

CD reset signal output

Loading motor control signal output

Tray open detect signal input

Tray close detect signal input

CD table detect signal input

Description

Page 84

HCD-CL5MD

Pin No.

51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99

100

Pin Name

FAN CNT

DISC-SENS

B TRG

AMS-IN

CAPM-CNT1

OPT SEL

B PLAY

TC-MUTING

R/PB/PAS

TC LID

REC-MUTING

VCC

SOFT-TEST

VSS

BIAS

MD/VIDEO

DA-MUTING

ALC

TC-RELAY

HEAD PHONE DETECT

LINE-MUTING

STK-POWER

DISPLA YKEY

POWER KEY

PC_POWER

MDM POWER

BACK LIGHT

VOL B VOL A

STBY-RELAY

AMP-DATA

AMP-LA T

AMP-CLK

FRONT-RELAY

N.C.

PRO TECT

STEREO

TUNED

LED 1

B-SHUT

B HALF/REC

MODEL -IN

SPEC-IN

KEY2 KEY1

AVSS KEY0 VREF AVCC

AC-CUT

I/O

Fan control signal output

Detection input signal from DISC SENSOR BOARD

B deck trigger control signal output

AMS signal input (L=ON,H=OFF)

Capstan motor REV/FWD/STOP control signal output

Optical select signal output

B deck play detect signal input

Tape deck line muting signal output (H=ON,L=OFF)

REC/PB/PAS select signal input (L=REC,Z=PB,H=PAS)

TC lid detect signal input

REC MUTING ON/OFF signal output (L=ON,H=OFF)

–

Power supply (+5V)

Test point (soft check out)

–

Ground

BIAS ON/OFF signal output (H=ON,L=OFF)

Not used

DA muting control signal output

ALC ON/OFF signal output (L=ON,H=OFF)

Tape deck relay ON/OFF signal output (H=ON,L=OFF)

HEAD PHONE detect signal input

LINE muting ON/OFF signal output (H=ON,L=OFF)

Power amplifier ON/OFF signal output (H=ON,L=OFF)

Display key detect signal input

Power key detect signal input

PC power detect signal from PC LINK

MD P-DOWN control signal output

Back light LED control signal output

Volume signal input from rotary encoder

Standby relay ON/OFF signal output

DATA signal output for sound processor

LAT signal output for sound processor

CLK signal output for sound processor

Front speaker relay ON/OFF signal output (H=ON,L=OFF)

–

Not used

Speaker protect ON/OFF signal input (L=ON,H=OFF)

STEREO detect signal input (L=ON,H=OFF)

TUNED detect signal input (L=ON,H=OFF)

LED control signal output

B deck reel pulse signal input

B deck half detect signal input

MODEL input

Version select input

Key input signal from function key

–

Analog ground

Key input signal from function key

Analog reference voltage

–

Analog power supply

AC_CUT ON/OFF check (L=ON,H=OFF)

Description

Page 85

7-27. IC BLOCK DIAGRAMS

– MAIN BOARD –

IC502 M62016L

COM

INTERRUPT SIGNAL

GENERATING BLOCK

–

COM

–

2 3

GND INT RESET CD VCC

IC201 M62428AFP600C

RESET SIGNAL

GENERATING BLOCK

HCD-CL5MD

IC552 P82B715TD.118

VCC

SDA

SCL

BUFFER

GND

LDA

LCL

VREFI

SUR R

SUR C

IN1A

IN1B

IN1C

IN1D

REC OUT1

INBAS1

NFBAS1

FBAS1

FTRE1

TONE OUT1

VOL IN1

FBB1

NFBB1

INBB1

OUT1

DGND

LATCH

DATA

AVDD

REF AMP

–

MIX

AMP2

–

SURROUND SW

–

BASS AMP1

20 21

BASS BOOST SW

–

AMP1

BUFF

AMP1

MIX

AMP1

–

TONE AMP1

–

FIN

AMP1

CPU

INTERFACE

TONE

AMP2

FIN

AMP2

AGND

AAB

–

BUFF

AMP2

BASS

AMP2

BASS BOOST SW

VREF

AMP2

AGND

VREFO

MIC

–

AMP

–

MIC IN

IN2A

IN2B

IN2C

IN2D

REC OUT2

INBAS2

NFBAS2

FBAS2

FTRE2

TONE OUT2

VOL IN2

FBB2

NFBB2

INBB2

OUT2

AVDD

DVDD

CLK

Page 86

HCD-CL5MD

– DRIVER BOARD –

IC701 BA6956AN

TSD

CONTROL LOGIC

1 2 3 4 5 6 7 8 9

OUT2

RNF

OUT1

VREF

– BD (MD) BOARD –

IC101 CXA2523AR

VCC

FIN

GND

RIN

MORFO47MORFI46RFO45OPN

–

RFA1

–

CVB

3VC

IVR

GSW

–

RFA2

– –

–

1 2

GRVA

EBAL

HLPT

OFST

GRV

–

FBAL

OPO43ADDC42COMPP41COMPO40AGCI39RF AGC38RF37PEAK

USROP

EE'

–1

–2

–1

– – – –

+ +

– –

+ +

ESW

FF'

–

BPF3T

BPF22

WBL

RFA3

PTGR

PBSW

ABCDA

FEA

ATA

EFB TESW

RF AGC EQ

USRC

PEAK

BOTTOM

WBL

ADIP

PTGR

PEAK3T

P-P

AGC

WBL

3T WBL

PBH

DET

–1

–2

–1

–2

DET

TEMP

AUX

BPFC

SEA

TEA

VI CONV

BOTM

ABCD

AUX

32 ADFG

31 ADAGC

30 ADIN

29 ADFM

28 SE

27 CSLED

26 TE

25 WBLADJ

AUXSW

TEMPR

COMMAND

SCRI - PARA

DECODE

SWDT

SCLK

BGR

VREF

XLAT

XSTBY

F0CNT

VREF

EQADJ

3TADJ

VCC

10PD

11APC

12APCREF

–

GND

TEMPI

Page 87

IC141 BH6511FS-E2

HCD-CL5MD

CAPA–

CAPA+

IN2R

IN2F

VM2

OUT2F

PGND2

OUT2R

VM12

OUT1R

PGND1

OUT1F

VM1

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

IN4F

AMP

VM4

INTERFACE

CHARGE

PUMP.

OSC

INTERFACE

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

GND

IN4R

OUT4F

AMP

PGND4

OUT4R

VM34

AMP

OUT3R

PGND3

AMP

AMPAMPAMP

OUT3F

INTERFACE

PREDRIVEPREDRIVE

INTERFACE

VM3

IC151 CXD2662R

EFMO

DVSS

TEST3

TEST2

TEST1

TEST0

SPFD

MNT0

MNT1

MNT2

MNT3

SWDT

SCLK

XLAT

SRDT

SENS

XRST

SQSY

DQSY

RECP

XINT

OSCI

OSCO

XTSL

DIN0

DIN1

DOUT

100

99 98 97 96 95 94 93

MONITOR CONTROL

CPU I/F

SUBCODE

PROCESSOR

GENERATOR

CLOCK

EACH BLOCK

SPRD

SPINDLE

SERVO

ADIP

DEMODULATOR/

DECODER

EACH BLOCK

DIGITAL

AUDIO

SFDR91SRDR90FS489FRDR88FFDR87DVDD86TFDR85TRDR84LDDR83APCREF82DTRF81CKRF80XLRF79F0CNT78ADFG77APC76DCHG

PWM

GENERATOR

SHOCK RESISTANT

MEMORY CONTROLLER

SAMPLING

I/F

RATE

CONVERTER

SERVO

DSP

APC

A/D

CONVERTER

IN1F

IN3F

AUTO

IN1R

PSB

IN3R

SEQUENCER

ANALOG

DECODER

ENCODER/

EFM/ACIRC

COMP

PSB

MUX

PLL

AVSS

ADRB

ADRT

AVDD

ADIO

AUX1

ABCD

BOTM

PEAK

CLTV

FILO

FILI

PCO

AVSS

RFI

BIAS

AVDD

ASYI

ASYO

DATAI

LRCKI

XBCKI

ADDT

LRCK

XBCK

DADT

FS256

DVDD

ATRAC/ATRAC3

ENCODER/DECODER

ADDRESS/DATA BUS A00 - A11, D0 - D3

A1140A0839A0738A0637A0536A0435A1034A0033A0132A0231A03

DVSS

XOE

XCAS

A09

XRAS

DRAM

XWE

MVCI

50D249D048D147

Page 88

HCD-CL5MD

– DIGITAL BOARD –

IC1004 LB1641

IC1005 UDA1360TS

T.S.D O.C.P

MOTOR

DRIVE

FWD/REV/STOP

CONTROL LOGIC

2 3

GND

DRIVE

MOTOR

NOISE

FILTER

5 6 7 8 9

FWD.IN

REV.IN

CLAMP

VCC 1

VCC 2

IC1006 UDA1350AH

RTCB

VDDD

RESET

VDDD(C)

VSSD

VSSD(C)

L3DATA

L3CLOCK

DATAI

BCKI

WSI

L3MODE

PREEMONCNCNCTEST2

44 43 42 41 40 39 38 37 36 35 34

1 2 3 4 5 6 7 8 9

DATA

INPUT

INTERFACE

DATA

OUTPUT

INTERFACE

WSO

DATAO

MOTOR

DRIVE

NOISE

FILTER

DRIVE

MOTOR

SELSTATIC

AUDIO FEATURE PROCESSOR

INTERPOLATOR

NOISE SHAPER

DAC

VINL

VREF

VINR

VREF(N) VREF(P)

SFOR

PWON

SYSCLK

DAC

4 5

6 7 8

TIMING CIRCUIT

DC-CANCELLATION

CLOCK

CONTROL

TEST1

CLOCK

AND

FILTER

33 32 31

28 27 26 25 24 23

BCKO VDDA(PLL) VSSA(PLL)

PREEM1

CLKOUT

NC VDDA VSSA VSSA(DAC) VREF

ADC

(Σ∆)

ADC

(Σ∆)

DIGITAL

INTERFACE

DECIMATION

FILTER

VDDA

VSSA

FSEL

DATAO

BCK

VSSD VDDD

– TC BOARD –

IC302 uPC1330HA

SW R1 GND SW P1

CONT

INVERTER

COMPARATER

VCC

GND

IEC 958

DECODER

7 8 9

SW P2 GND

12 13 14 15 16 17 18 19 20 21 22

MUTE

SELCHAN

SW R2

SPDIF0

SPDIF1

VOUTL

SELCLK

DDA(DAC)

SELSPDIF

LOCK

VOUTR

Page 89

SECTION 8

EXPLODED VIEWS

HCD-CL5MD

NOTE:

• -XX, -X mean standardized parts, so they may have some differences from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

• Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.

8-1. SIDE PANEL, BACK PANEL SECTION

not supplied

• Abbreviation AUS : Australian model HK : Hong Kong model

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

not supplied

FRONT PANEL

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

1 4-232-226-01 SCREW, HEXAGON SOCKET TAPPING 2 3-363-099-11 SCREW (CASE 3 TP2) 3 4-231-649-01 PANEL (L), SIDE 4 A-4476-076-A TC BOARD, COMPLETE 5 1-769-910-11 WIRE (FLAT TYPE) (9 CORE)

10 4-231-677-41 PANEL, BACK (AEP,UK) 10 4-231-677-51 PANEL, BACK (AUS) 10 4-231-677-61 PANEL, BACK (HK) 11 1-763-072-11 FAN, DC 12 A-2100-929-A TAPE MECHANISM UNIT (TCM-230ASR41CL)

not supplied

6 1-693-529-11 TUNER 7 1-769-944-11 WIRE (FLAT TYPE) (11 CORE) (AUS,HK) 7 1-773-008-11 WIRE (FLAT TYPE) (15 CORE) (AEP,UK) 8 1-680-270-11 THERMAL BOARD 9 X-4953-318-1 PANEL ASSY, TOP

13 4-231-650-01 PANEL (R), SIDE 14 A-4475-470-A MAIN BOARD, COMPLETE (AEP,UK) 14 A-4475-488-A MAIN BOARD, COMPLETE (AUS,HK) 15 4-951-620-01 SCREW (2.6X8), +BVTP 18 1-680-258-11 VOL SEL BOARD (HK)

Page 90

HCD-CL5MD

8-2. FRONT PANEL SECTION

not supplied

MD MECHANISM

not supplied

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

51 4-231-633-01 LID (CD) 52 4-231-670-01 SPRING (CD) 53 4-231-646-01 KNOB, VOLUME 54 X-4953-323-1 PANEL ASSY, FRONT (AEP,UK) 54 X-4953-350-1 PANEL ASSY, FRONT (AUS,HK)

55 4-933-134-41 SCREW (+PTPWH 2.6X5) 56 1-679-982-11 RING SW BOARD 57 4-228-335-01 LID (MD) 58 4-231-113-01 SCREW (1.7X3), BTN 59 4-228-323-01 SPRING (MD)

60 1-804-260-11 DISPLAY PANEL, LIQUID CRYSTAL

61 4-231-637-01 SHEET, DIFFUSION 62 4-231-636-01 HOLDER, LCD 63 1-679-981-11 BACK LIGHT BOARD 64 1-775-152-11 WIRE (FLAT TYPE) (17 CORE) 65 1-775-237-11 WIRE (FLAT TYPE) (27 CORE)

66 A-4476-086-A DIGITAL BOARD, COMPLETE 67 1-773-207-11 WIRE (FLAT TYPE) (25 CORE) 68 4-228-643-11 SCREW (+BVTTWH M3), STEP 69 4-228-689-01 INSULATOR\ 70 A-4475-468-A PANEL BOARD, COMPLETE

71 4-951-620-01 SCREW (2.6X8), +BVTP

Page 91

8-3. CHASSIS SECTION

HCD-CL5MD

T901

CD MECHANISM

103

107

not supplied

110

108

109

not supplied

112

111

101

not supplied

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

101 1-773-214-11 WIRE (FLAT TYPE) (25 CORE) 103 1-680-256-11 TRANS BOARD 107 A-4475-465-A AMP BOARD, COMPLETE (AEP,UK) 107 A-4475-485-A AMP BOARD, COMPLETE (AUS,HK) 108 1-680-257-11 SUB POWER BOARD

0 109 1-575-651-11 CORD, POWER (AEP,HK) 0 109 1-783-203-11 CORD, POWER (AUS)

0 109 1-790-226-11 CORD, POWER (UK)

* 110 3-703-244-00 BUSHING (2104), CORD

111 4-965-822-01 FOOT

0 112 1-770-019-11 ADAPTOR, CONVERSION PLUG 3P (HK) 0 T901 1-435-833-11 TRANSFORMER, POWER (AEP,UK)

0 T901 1-435-834-11 TRANSFORMER, POWER (AUS,HK)

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 92

HCD-CL5MD

8-4. MD MECHANISM DECK SECTION-1

319

302

311

310

308

312

309

not supplied

306

304

317

314

303

313

not supplied

315

316

318

307

320

302

301

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks * 301 4-996-267-01 BASE (BU-D)

302 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 303 4-227-007-01 GEAR (SB) 304 4-227-025-01 BELT (LOADING) 306 4-227-002-01 GEAR, PULLEY

307 4-226-999-01 LEVER (HEAD) 308 X-4952-665-1 SPRING (SHT) ASSY, LEAF 309 A-4672-990-A LOCK (HOLDER) 310 4-229-533-01 SPRING (STOPPER), TORSION 311 4-227-012-01 SPRING (HOLDER), TENSION

312 4-227-190-02 PLATE (HOLDER) ASSY, RETAINER 313 4-227-013-01 SPRING (EJ), TENSION 314 4-226-995-01 SLIDER (EJ) 315 4-226-996-01 LIMITTER (EJ) 316 4-226-997-04 SLIDER

317 4-226-998-01 LEVER (CHG) 318 4-227-006-01 GEAR (SA) 319 A-4735-075-A HOLDER ASSY 320 4-226-994-01 GUIDE (L)

Page 93

8-5. MD MECHANISM DECK SECTION-2

359

358

HCD-CL5MD

HR901

360

365

371

357

S102

not supplied

355

352

354

366

362

370

M101

356

359

361

364

370

M102

368

371

367

not supplied

352

363

M103

351

352

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

351 A-4725-473-A BD(MD)BOARD, COMPLETE 352 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 354 4-226-993-01 RACK 355 4-227-014-01 SPRING (RACK), COMPRESSION 356 4-226-992-01 BASE, SL

357 1-678-514-11 PWB, FLEXIBLE

0 358 A-4672-541-A MD OPTICAL PICK-UP(KMS-260B/K1NP)

359 4-988-560-01 SCREW (+P 1.7X6) 360 4-996-265-01 SHAFT, MAIN 361 4-226-989-01 CHASSIS

362 3-372-761-01 SCREW (M1.7), TAPPING 363 4-226-990-01 BASE (BU-A)

364 4-227-023-01 SPRING (SPINDLE), TORSION 365 4-227-004-01 GEAR (LC) 366 4-227-005-01 GEAR (LD) 367 4-227-008-01 GEAR (SC) 368 4-227-009-01 GEAR (SD)

370 4-232-270-01 SCREW (1.7X3.5), +PWH 371 3-372-761-01 SCREW (M1.7), TAPPING HR901 1-500-670-11 HEAD, OVER LIGHT S102 1-771-957-11 SWITCH, PUSH (2 KEY) M101 A-4672-898-A MOTOR ASSY, SPINDLE

M102 A-4735-076-A MOTOR ASSY, SLED M103 A-4735-074-A MOTOR ASSY, LOADING

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 94

HCD-CL5MD

8-6. CD MECHANISM DECK SECTION-1

501

not supplied

501

506 520

521

501

507

506

509

510

not supplied

512

501

518

508

501

509

504

502

not supplied

501

514

501

not supplied

501

not supplied

502

not supplied

515

not supplied

511

516

517

501

513

501

522

501

not supplied

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

501 4-218-253-01 SCREW (M2.6), +BTTP 502 4-228-995-01 SPRING (L), TORSION 504 4-228-972-01 TRAY (MAIN) 506 4-985-672-01 SCREW (+PTPWH M2.6), FLOATING 507 4-228-414-01 BRACKET (YOKE)

508 4-228-980-01 SPRING (STOCKER), LEAF 509 4-228-981-01 STOPPER (TRAY) 510 4-228-963-01 SLIDER (STOCKER.L) 511 4-228-964-01 SLIDER (STOCKER.R) 512 4-228-970-01 TRAY (SUB)

513 4-229-001-01 HOLDER (SENSOR) 514 4-228-978-01 COVER (TRAY.R) 515 4-228-975-01 COVER (TRAY.L) 516 4-228-970-11 TRAY (SUB) 517 4-228-970-21 TRAY (SUB)

518 4-234-423-01 SPRING (STOCKER L), LEAF 520 4-231-971-01 PULLEY (30B), CHUCKING 521 X-4953-307-1 PULLEY (A) ASSY, CHUCKING 522 1-678-457-11 TRAY SENSOR BOARD

501

Page 95

8-7. CD MECHANISM DECK SECTION-2

556

561

not supplied

BASE UNIT

not supplied

561

560

579

580

551

560

562

551

556

558

559

557

576

556

581

577

552

555

578

554

551

553

551

552

551

571

551

M721

556

582

556

551

556

572

573

569

556

584

583

568

553

575

553

564

551

567

585

565

578

586

HCD-CL5MD

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

551 4-985-672-01 SCREW (+PTPWH M2.6), FLOATING 552 4-229-002-02 GEAR (SLIDER) 553 4-218-254-21 SCREW (M2.6), +PTPWH 554 4-228-971-01 CAM 555 4-228-974-02 RACK (CENTER)

556 4-218-253-61 SCREW (M2.6), +BTTP 557 4-228-969-02 SPRING (TABLE), LEAF 558 4-228-977-01 SLIDER (BU.L) 559 4-951-620-01 SCREW (2.6X8), +BVTP 560 4-227-045-11 SPRING (INSULATOR), COIL

561 4-231-451-01 INSULATOR (BU-30) 562 4-231-151-01 STOPPER (BU) 564 4-228-985-01 GEAR (PULLEY) 565 4-228-997-02 GEAR (CAM) 567 4-228-968-01 BELT

568 4-228-998-01 GEAR (DETECTION) 569 4-228-976-01 SLIDER (BU.R)

571 X-4952-971-2 MOTOR ASSY 572 4-228-999-02 LEVER (MAIN.L) 573 4-229-000-02 LEVER (MAIN.R) 575 4-229-003-01 PULLEY 576 4-228-988-01 CHASSIS

577 1-757-574-11 WIRE (FLAT TYPE) (22 CORE) 578 4-218-253-71 SCREW (M2.6), +BTTP 579 4-227-899-01 SCREW (DIA. 12), FROATING 580 A-4412-659-A CDM HIGH SPEED ASSY 581 1-680-269-11 RELAY BOARD

582 1-678-461-11 MOTOR BOARD 583 1-678-460-11 DRIVER BOARD 584 1-678-462-11 IN OUT SW BOARD 585 1-678-463-11 DISK SENSOR BOARD 586 4-231-517-03 HOLDER (BU30)

M721 1-541-632-12 MOTOR, DC

Page 96

HCD-CL5MD

8-8. BASE UNIT SECTION

601

606

not supplied

604

602

606

not supplied

605

603

607

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

0 601 A-4735-059-A CD OPTICAL PICK-UP (A-MAX.3)

602 1-782-817-11 WIRE (FLAT TYPE) (16 CORE) 603 A-4725-528-A BD(CD)BOARD, COMPLETE 604 4-233-831-01 GEAR (LA)

605 4-233-832-01 GEAR (LB) 606 7-627-853-28 SCREW, PRECISION +P 2X3 TYPE3 607 3-531-576-11 RIVET

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 97

HCD-CL5MD

SECTION 9

ELECTRICAL PARTS LIST

NOTE:

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX, -X mean standardized parts, so they may have some difference from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• CAPACITORS: uF: µF

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

A-4475-465-A AMP BOARD, COMPLETE (AEP,UK)

****************************

A-4475-485-A AMP BOARD, COMPLETE (AUS,HK)

****************************

< CAPACITOR >

C801 1-126-964-11 ELECT 10uF 20.00% 50V C802 1-162-286-31 CERAMIC 220PF 10% 50V C803 1-162-282-31 CERAMIC 100PF 10% 50V C804 1-126-965-11 ELECT 22uF 20.00% 50V C805 1-136-161-00 FILM 0.047uF 5.00% 50V

C806 1-136-161-00 FILM 0.047uF 5.00% 50V C807 1-136-153-00 FILM 0.01uF 5% 50V

C808 1-136-153-00 FILM 0.01uF 5% 50V

C809 1-162-306-11 CERAMIC 0.01uF 30.00% 16V

C810 1-162-306-11 CERAMIC 0.01uF 30.00% 16V

C811 1-107-713-11 ELECT 4.7uF 20.00% 50V C832 1-104-665-11 ELECT 100uF 20.00% 10V C833 1-126-961-11 ELECT 2.2uF 20.00% 50V C834 1-104-665-11 ELECT 100uF 20.00% 10V C851 1-126-964-11 ELECT 10uF 20.00% 50V

C852 1-162-286-31 CERAMIC 220PF 10% 50V C853 1-162-282-31 CERAMIC 100PF 10% 50V C854 1-126-965-11 ELECT 22uF 20.00% 50V C855 1-136-161-00 FILM 0.047uF 5.00% 50V C856 1-136-161-00 FILM 0.047uF 5.00% 50V

C857 1-136-153-00 FILM 0.01uF 5% 50V

C858 1-136-153-00 FILM 0.01uF 5% 50V

C859 1-162-306-11 CERAMIC 0.01uF 30.00% 16V

C861 1-107-713-11 ELECT 4.7uF 20.00% 50V C891 1-126-959-11 ELECT 0.47uF 20.00% 50V

• RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable

• COILS uH: µH

• SEMICONDUCTORS In each case, u: µ, for example: uA...: µA... , uPA... , µPA... , uPB... , µPB... , uPC... , µPC... , uPD..., µPD...

C954 1-136-165-00 FILM 0.1uF 5.00% 50V C957 1-136-153-00 FILM 0.01uF 5% 50V C958 1-136-153-00 FILM 0.01uF 5% 50V C971 1-126-965-11 ELECT 22uF 20.00% 50V C972 1-126-965-11 ELECT 22uF 20.00% 50V

C973 1-104-665-11 ELECT 100uF 20.00% 10V C974 1-126-967-11 ELECT 47uF 20.00% 50V C975 1-162-306-11 CERAMIC 0.01uF 30.00% 16V

C991 1-126-963-11 ELECT 4.7uF 20.00% 50V

(AEP,UK)

CN801 1-778-982-21 CONNECTOR, BOARD TO BOARD 13P CN952 1-778-982-21 CONNECTOR, BOARD TO BOARD 13P

D801 8-719-911-19 DIODE 1SS133T-72 D831 8-719-911-19 DIODE 1SS133T-72 D851 8-719-911-19 DIODE 1SS133T-72 D881 8-719-911-19 DIODE 1SS133T-72 D891 8-719-911-19 DIODE 1SS133T-72

D953 8-719-024-99 DIODE 11ES2-NTA2B D954 8-719-024-99 DIODE 11ES2-NTA2B D955 8-719-024-99 DIODE 11ES2-NTA2B D956 8-719-024-99 DIODE 11ES2-NTA2B D957 8-719-024-99 DIODE 11ES2-NTA2B

D958 8-719-024-99 DIODE 11ES2-NTA2B D959 8-719-024-99 DIODE 11ES2-NTA2B D960 8-719-024-99 DIODE 11ES2-NTA2B D961 8-719-911-19 DIODE 1SS133T-72 D962 8-719-911-19 DIODE 1SS133T-72

D971 8-719-911-19 DIODE 1SS133T-72 D991 8-719-911-19 DIODE 1SS133T-72

* EP951 1-537-738-21 TERMINAL, EARTH

• Abbreviation AUS : Australian model HK : Hong Kong model

When indicating parts by reference number, please include the board name.

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

< CONNECTOR >

< DIODE >

< EARTH >

AMP

(AEP,UK)

C951 1-137-844-11 ELECT 2200uF 20% 42V

(AEP,UK)

C951 1-135-832-11 ELECT 2200uF 20% 50V

(AUS,HK)

C952 1-137-844-11 ELECT 2200uF 20% 42V

(AEP,UK)

C952 1-135-832-11 ELECT 2200uF 20% 50V

(AUS,HK)

C953 1-136-165-00 FILM 0.1uF 5.00% 50V

< IC >

IC801 8-749-016-93 IC STK402-070S

< COIL >

L801 1-420-872-00 COIL, AIR-CORE (AEP,UK) L851 1-420-872-00 COIL, AIR-CORE (AEP,UK)

Page 98

HCD-CL5MD

AMP BACK LIGHT

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< TRANSISTOR >

Q801 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q831 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q832 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q833 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q834 8-729-119-78 TRANSISTOR 2SC2785TP-HFE

Q835 8-729-119-76 TRANSISTOR 2SA1175TP-HFE Q836 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q837 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q841 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q842 8-729-119-78 TRANSISTOR 2SC2785TP-HFE

Q851 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q881 8-729-119-76 TRANSISTOR 2SA1175TP-HFE Q882 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q971 8-729-119-78 TRANSISTOR 2SC2785TP-HFE Q972 8-729-140-82 TRANSISTOR 2SA988TP-PAFAEA

Q973 8-729-119-78 TRANSISTOR 2SC2785TP-HFE

< RESISTOR >

R863 1-249-437-11 CARBON 47K 5% 1/4W R864 1-249-437-11 CARBON 47K 5% 1/4W R865 1-249-433-11 CARBON 22K 5% 1/4W R866 1-215-889-00 METAL OXIDE 330 5% 2W

0R881 1-215-890-11 METAL OXIDE 470 5% 2W

R882 1-249-429-11 CARBON 10K 5% 1/4W R883 1-249-429-11 CARBON 10K 5% 1/4W R884 1-249-429-11 CARBON 10K 5% 1/4W R885 1-249-441-11 CARBON 100K 5% 1/4W R891 1-249-429-11 CARBON 10K 5% 1/4W

R892 1-249-441-11 CARBON 100K 5% 1/4W R893 1-247-903-00 CARBON 1M 5% 1/4W R898 1-249-441-11 CARBON 100K 5% 1/4W R899 1-249-429-11 CARBON 10K 5% 1/4W R951 1-249-425-11 CARBON 4.7K 5% 1/4W F

R952 1-249-425-11 CARBON 4.7K 5% 1/4W F

0R971 1-212-881-11 FUSIBLE 100 5% 1/4W 0R972 1-212-881-11 FUSIBLE 100 5% 1/4W

R973 1-249-435-11 CARBON 33K 5% 1/4W R974 1-249-433-11 CARBON 22K 5% 1/4W

R801 1-249-417-11 CARBON 1K 5% 1/4W F R802 1-249-437-11 CARBON 47K 5% 1/4W R803 1-249-419-11 CARBON 1.5K 5% 1/4W F R804 1-249-437-11 CARBON 47K 5% 1/4W

0R805 1-233-352-11 ENCAPSULATED COMPONENT

R806 1-260-076-11 CARBON 10 5% 1/2W R807 1-260-076-11 CARBON 10 5% 1/2W

(AEP,UK)

R808 1-260-076-11 CARBON 10 5% 1/2W

(AEP,UK) R810 1-249-417-11 CARBON 1K 5% 1/4W F R811 1-249-431-11 CARBON 15K 5% 1/4W

R812 1-249-441-11 CARBON 100K 5% 1/4W R813 1-249-437-11 CARBON 47K 5% 1/4W R814 1-249-438-11 CARBON 56K 5% 1/4W R815 1-249-433-11 CARBON 22K 5% 1/4W R816 1-215-889-00 METAL OXIDE 330 5% 2W

R833 1-249-425-11 CARBON 4.7K 5% 1/4W F R834 1-249-435-11 CARBON 33K 5% 1/4W R835 1-249-433-11 CARBON 22K 5% 1/4W R836 1-249-429-11 CARBON 10K 5% 1/4W R837 1-249-429-11 CARBON 10K 5% 1/4W

R839 1-249-441-11 CARBON 100K 5% 1/4W R841 1-249-441-11 CARBON 100K 5% 1/4W R842 1-249-441-11 CARBON 100K 5% 1/4W R843 1-249-441-11 CARBON 100K 5% 1/4W R851 1-249-417-11 CARBON 1K 5% 1/4W F

R975 1-249-437-11 CARBON 47K 5% 1/4W R976 1-249-441-11 CARBON 100K 5% 1/4W R977 1-249-421-11 CARBON 2.2K 5% 1/4W F R978 1-249-433-11 CARBON 22K 5% 1/4W R979 1-249-421-11 CARBON 2.2K 5% 1/4W F

R980 1-249-429-11 CARBON 10K 5% 1/4W R981 1-249-429-11 CARBON 10K 5% 1/4W

0R982 1-202-972-61 FUSIBLE 1 5% 1/4W

< RELAY >

RY801 1-515-920-11 RELAY (24V)

< TERMINAL >

TM801 1-694-677-11 TERMINAL BOARD (4P) (SPEAKER)

************************************************************

1-679-981-11 BACK LIGHT BOARD

****************

< CAPACITOR >

C709 1-126-935-11 ELECT 470uF 20.00% 10V

< CONNECTOR >

CN771 1-506-481-11 PIN, CONNECTOR 2P

< DIODE >

R852 1-249-437-11 CARBON 47K 5% 1/4W R853 1-249-419-11 CARBON 1.5K 5% 1/4W F R854 1-249-437-11 CARBON 47K 5% 1/4W

0R855 1-233-352-11 ENCAPSULATED COMPONENT

R856 1-260-076-11 CARBON 10 5% 1/2W

R857 1-260-076-11 CARBON 10 5% 1/2W

(AEP,UK) R858 1-260-076-11 CARBON 10 5% 1/2W

(AEP,UK) R860 1-249-417-11 CARBON 1K 5% 1/4W F R861 1-249-431-11 CARBON 15K 5% 1/4W R862 1-249-441-11 CARBON 100K 5% 1/4W

D771 8-719-075-50 DIODE SELS6B14C-TP6 (BACK LIGHT) D772 8-719-075-50 DIODE SELS6B14C-TP6 (BACK LIGHT) D773 8-719-075-50 DIODE SELS6B14C-TP6 (BACK LIGHT) D774 8-719-075-50 DIODE SELS6B14C-TP6 (BACK LIGHT) D775 8-719-075-50 DIODE SELS6B14C-TP6 (BACK LIGHT)

D776 8-719-075-50 DIODE SELS6B14C-TP6 (BACK LIGHT)

< RESISTOR >

R771 1-249-409-11 CARBON 220 5% 1/4W F R772 1-249-409-11 CARBON 220 5% 1/4W F R773 1-249-409-11 CARBON 220 5% 1/4W F

************************************************************

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 99

HCD-CL5MD

BD (CD)

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

A-4725-528-A BD(CD) BOARD, COMPLETE

**********************

< CAPACITOR >

C101 1-163-133-00 CERAMIC CHIP 470PF 5% 50V C102 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C103 1-163-133-00 CERAMIC CHIP 470PF 5% 50V C104 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V C107 1-162-921-11 CERAMIC CHIP 33PF 5% 50V

C108 1-163-038-11 CERAMIC CHIP 0.1uF 25V C109 1-163-038-11 CERAMIC CHIP 0.1uF 25V C110 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C111 1-126-607-11 ELECT CHIP 47uF 20% 4V C112 1-126-607-11 ELECT CHIP 47uF 20% 4V

C113 1-126-209-11 ELECT CHIP 100uF 20.00% 4V C114 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C115 1-126-205-11 ELECT CHIP 47uF 20% 6.3V C117 1-163-038-11 CERAMIC CHIP 0.1uF 25V C118 1-115-156-11 CERAMIC CHIP 1uF 10V

C119 1-115-156-11 CERAMIC CHIP 1uF 10V C120 1-126-607-11 ELECT CHIP 47uF 20% 4V C151 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V C153 1-163-038-11 CERAMIC CHIP 0.1uF 25V C164 1-163-038-11 CERAMIC CHIP 0.1uF 25V

C165 1-124-779-00 ELECT CHIP 10uF 20% 16V C166 1-163-038-11 CERAMIC CHIP 0.1uF 25V C182 1-128-995-11 ELECT CHIP 100uF 20% 10V C201 1-126-246-11 ELECT CHIP 220uF 20% 4V C202 1-163-038-11 CERAMIC CHIP 0.1uF 25V

C203 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V C204 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V C205 1-163-038-11 CERAMIC CHIP 0.1uF 25V C209 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C211 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V

C212 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V C213 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V C215 1-107-823-11 CERAMIC CHIP 0.47uF 10.00% 16V C216 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C221 1-163-038-11 CERAMIC CHIP 0.1uF 25V

C222 1-163-038-11 CERAMIC CHIP 0.1uF 25V C224 1-163-038-11 CERAMIC CHIP 0.1uF 25V C227 1-163-038-11 CERAMIC CHIP 0.1uF 25V C228 1-115-156-11 CERAMIC CHIP 1uF 10V C229 1-163-038-11 CERAMIC CHIP 0.1uF 25V

C231 1-128-995-11 ELECT CHIP 100uF 20% 10V C234 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C235 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C236 1-107-823-11 CERAMIC CHIP 0.47uF 10.00% 16V C237 1-162-919-11 CERAMIC CHIP 22PF 50V

C240 1-163-038-11 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

CN101 1-784-873-21 CONNECTOR,FFC(LIF(NON-ZIF))22P CN102 1-794-424-11 CONNECTOR, FCC/FPC 16P

FB101 1-500-445-11 FERRITE 0uH

IC101 8-752-408-73 IC CXD3068Q IC102 8-759-713-70 IC AN41020A IC103 8-752-089-74 IC CXA2581N-T4

Q101 8-729-010-08 TRANSISTOR MSB710-RT1 Q102 8-729-424-08 TRANSISTOR UN2111-TX Q103 8-729-920-85 TRANSISTOR 2SD1664-T100-QR

R102 1-216-077-00 RES-CHIP 15K 5% 1/10W R103 1-216-097-11 RES-CHIP 100K 5% 1/10W R104 1-216-077-00 RES-CHIP 15K 5% 1/10W R105 1-216-049-11 RES-CHIP 1K 5% 1/10W R109 1-216-099-00 METAL CHIP 120K 5% 1/10W

R111 1-216-099-00 METAL CHIP 120K 5% 1/10W R113 1-216-059-00 METAL CHIP 2.7K 5% 1/10W R114 1-218-745-11 RES-CHIP 160K 5% 1/16W R115 1-216-085-00 METAL CHIP 33K 5% 1/10W R116 1-216-085-00 METAL CHIP 33K 5% 1/10W

R118 1-216-295-11 SHORT 0 R120 1-216-099-00 METAL CHIP 120K 5% 1/10W R122 1-216-097-11 RES-CHIP 100K 5% 1/10W R123 1-216-001-00 METAL CHIP 10 5% 1/10W R124 1-216-001-00 METAL CHIP 10 5% 1/10W

R125 1-216-085-00 METAL CHIP 33K 5% 1/10W R126 1-216-085-00 METAL CHIP 33K 5% 1/10W R151 1-216-097-11 RES-CHIP 100K 5% 1/10W R152 1-216-065-00 RES-CHIP 4.7K 5% 1/10W R163 1-216-295-11 SHORT 0

R164 1-216-295-11 SHORT 0 R167 1-216-295-11 SHORT 0 R168 1-216-295-11 SHORT 0 R176 1-216-295-11 SHORT 0 R179 1-216-295-11 SHORT 0

R201 1-216-085-00 METAL CHIP 33K 5% 1/10W R202 1-216-073-00 METAL CHIP 10K 5% 1/10W R203 1-216-097-11 RES-CHIP 100K 5% 1/10W R204 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R205 1-216-049-11 RES-CHIP 1K 5% 1/10W

R206 1-216-065-00 RES-CHIP 4.7K 5% 1/10W R207 1-216-121-11 RES-CHIP 1M 5% 1/10W R212 1-216-033-00 METAL CHIP 220 5% 1/10W R213 1-216-295-11 SHORT 0 R214 1-216-295-11 SHORT 0

R215 1-216-295-11 SHORT 0 R216 1-216-033-00 METAL CHIP 220 5% 1/10W R217 1-216-065-00 RES-CHIP 4.7K 5% 1/10W R218 1-216-049-11 RES-CHIP 1K 5% 1/10W R219 1-216-049-11 RES-CHIP 1K 5% 1/10W

< FERRITE BEAD >

< IC >

< TRANSISTOR >

< RESISTOR >

< DIODE >

D101 8-719-422-12 DIODE UDZ-TE-17-3.9B

R220 1-216-295-11 SHORT 0 R221 1-216-033-00 METAL CHIP 220 5% 1/10W R226 1-216-025-11 RES-CHIP 100 5% 1/10W R227 1-216-097-11 RES-CHIP 100K 5% 1/10W R228 1-216-113-00 METAL CHIP 470K 5% 1/10W

Page 100

HCD-CL5MD

BD (CD) BD (MD)

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

R229 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R230 1-216-295-11 SHORT 0 R240 1-216-295-11 SHORT 0

< NETWORK >

C158 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C159 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C160 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C161 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C162 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

RN201 1-233-576-11 RES, CHIP NETWORK 100 RN202 1-233-576-11 RES, CHIP NETWORK 100

< VARIABLE RESISTOR >

RV101 1-223-997-21 RES, CARBON ADJ VAR 47K

< VIBRATOR >

X201 1-767-518-11 VIBRATOR, CRYSTAL 33.8MHz

************************************************************

A-4725-473-A BD(MD)BOARD, COMPLETE

**********************

< CAPACITOR >

C101 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V C102 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V C103 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C104 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C105 1-115-416-11 CERAMIC CHIP 0.001uF 5.00% 25V

C106 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C107 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C108 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C109 1-164-677-11 CERAMIC CHIP 0.033uF 10.00% 16V C110 1-163-038-11 CERAMIC CHIP 0.1uF 25V

C111 1-117-720-11 CERAMIC CHIP 4.7uF 10V C112 1-110-563-11 CERAMIC CHIP 0.068uF 10.00% 16V C113 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C114 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V C115 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V

C116 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C117 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C118 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C119 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C120 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C121 1-164-156-11 CERAMIC CHIP 0.1uF 25V C125 1-117-720-11 CERAMIC CHIP 4.7uF 10V C128 1-164-156-11 CERAMIC CHIP 0.1uF 25V C131 1-117-720-11 CERAMIC CHIP 4.7uF 10V C132 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C133 1-164-156-11 CERAMIC CHIP 0.1uF 25V C141 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C142 1-164-156-11 CERAMIC CHIP 0.1uF 25V C143 1-164-156-11 CERAMIC CHIP 0.1uF 25V C144 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C145 1-164-156-11 CERAMIC CHIP 0.1uF 25V C146 1-117-720-11 CERAMIC CHIP 4.7uF 10V C147 1-117-720-11 CERAMIC CHIP 4.7uF 10V C151 1-117-370-11 CERAMIC CHIP 10uF 10V C152 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C153 1-164-156-11 CERAMIC CHIP 0.1uF 25V C154 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C155 1-164-156-11 CERAMIC CHIP 0.1uF 25V C156 1-164-156-11 CERAMIC CHIP 0.1uF 25V C157 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C163 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V C164 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C165 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C166 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V C167 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V

C169 1-164-156-11 CERAMIC CHIP 0.1uF 25V C173 1-164-156-11 CERAMIC CHIP 0.1uF 25V C174 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C180 1-117-370-11 CERAMIC CHIP 10uF 10V C181 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C182 1-163-038-11 CERAMIC CHIP 0.1uF 25V C183 1-164-156-11 CERAMIC CHIP 0.1uF 25V C184 1-117-970-11 ELECT CHIP 22uF 20.00% 10V C185 1-131-872-11 CERAMIC CHIP 1000PF 10% 630V C191 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C192 1-164-156-11 CERAMIC CHIP 0.1uF 25V C193 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C194 1-164-156-11 CERAMIC CHIP 0.1uF 25V C195 1-164-156-11 CERAMIC CHIP 0.1uF 25V C196 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C1401 1-117-720-11 CERAMIC CHIP 4.7uF 10V

< CONNECTOR >

CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P CN102 1-784-835-21 CONNECTOR,FFC(LIF(NON-ZIF))27P CN103 1-784-869-21 CONNECTOR,FFC(LIF(NON-ZIF))17P

* CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P

CN105 1-784-859-21 CONNECTOR, FFC(LIF(NON-ZIF))7P

< DIODE >

D101 8-719-988-61 DIODE 1SS355TE-17 D181 8-719-080-81 DIODE FS1J6 D183 8-719-080-81 DIODE FS1J6

< IC >

IC101 8-752-080-95 IC CXA2523AR IC102 8-759-473-51 IC TLV2361CDBV IC141 8-759-430-25 IC BH6511FS-E2 IC151 8-752-404-64 IC CXD2662R IC152 8-759-599-51 IC MSM51V17400D-50TS-K

IC181 8-759-481-17 IC MC74ACT08DTR2 IC190 8-759-677-64 IC L88M35T IC195 8-759-640-41 IC BR24C08F-E2

< COIL >

L101 1-500-245-11 FERRITE 0uH L102 1-500-245-11 FERRITE 0uH L103 1-500-245-11 FERRITE 0uH L105 1-414-235-11 FERRITE 0uH L106 1-500-245-11 FERRITE 0uH

L121 1-500-245-11 FERRITE 0uH L122 1-500-245-11 FERRITE 0uH L131 1-500-245-11 FERRITE 0uH L141 1-412-029-11 INDUCTOR CHIP 10uH L142 1-412-032-11 INDUCTOR CHIP 100uH

100

Sony HCDCL-5-MD Service manual

Specifications and Main Features

Frequently Asked Questions

User Manual

TABLE OF CONTENTS

SERVICING NOTES

GENERAL

DISASSEMBLY

Front panel

Panel board

MD mechanism

5 Holder assy

Loading motor assy (M103)

MD Optical pick-up (KMS-260B/K1NP)

3 RELAY board

3 BD (CD) board

3 DRIVER board

5 TRAY SENSOR board

3 Stocker assy

4 DISC SENSOR board

3 IN OUT SW board

TEST MODE

MECHANICAL ADJUSTMENTS

ELECTRICAL ADJUSTMENTS

DIAGRAMS

EXPLODED VIEWS

ELECTRICAL PARTS LIST

AMP BACK LIGHT

BD (CD)

BD (CD) BD (MD)