POWER OUTPUT AND
TOTAL HARMONIC
DISTORTION:With 4 ohm loads, both
channels driven, from
200 −20,000 Hz; rated
65 watts per channel
minimum RMS power,
with no more than 0.7 %
total harmonic distortion
from 250 milli watts to
rated output.
Amplifier section
BC150
Stereo mode (rated)65W + 65W (4 ohms at 1
kHz, DIN)
Surround mode (reference)
North American models: Front: 108 W + 108 W
(with SS-TS10)
Center*: 108 W
(with SS-TS10)
Surround*: 108 W + 108 W
(with SS-TS10)
Subwoofer*: 110 W
(with SS-WS10)
Other models:Front: 85 W + 85 W
(with SS-TS10)
Center*: 85 W
(with SS-TS10)
Surround*: 85 W + 85 W
(with SS-TS10)
Subwoofer*: 85 W
(with SS-WS10)
BC250
Stereo mode (rated)65 W + 65 W (4 ohms at 1
kHz, DIN)
Surround mode (reference) Front: 113 W + 113 W
(with SS-TS11)
Center*: 113 W
(with SS-CT11)
Surround*: 113 W + 113 W
(with SS-TS10)
Subwoofer*: 115 W
(with SS-WS10)
*Depending on the sound field settings and the source,
there may be no sound output.
SERVICE MANUAL
Ver. 1.5 2004. 11
HCD-BC150/BC250 are the amplifier, DVD/
CD and tuner section in DA V-BC150/BC250.
This system incorporates with Dolby* Digital and Dolby
Pro Logic (II) adaptive matrix surround decoder and the
DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories.
"Dolby", "Pro Logic" and the double-D symbol are
trademarks of Dolby Laboratories.
** Manufactured under license from Digital Theater
Systems, Inc. "DTS" and "DTS Digital Surround" are
trademarks of Digital Theater Systems, Inc.
Photo: HCD-BC150
Model Name Using Similar Mechanism NEWNEW
Mechanism T ypeCDM81A-DVB U27 CDM81C-D VBU100
Optical Pick-up Name
3-8. Base Unit Section (DVBU27) ......................................... 66
4.ELECTRICAL PARTS LIST .................................. 67
•Abbreviation
AUS: Australian model.
CND: Canadian model.
E41: 230 V AC Area in E model.
EA: Saudi Arabia model.
KR: Korea model.
MX: Mexican model.
TW: Taiwan model.
2
HCD-BC150/BC250
r
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follow the manuf acturers’ instructions to use these
instruments.
2. A battery-operated A C milliammeter . The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate lo w-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V A C range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
AC
0.15 µF
1.5 k
Ω
Earth Ground
voltmete
(0.75 V)
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
3
HCD-BC150/BC250
Index to Parts and Controls
For more info rm ation, refer to th e pages indicated in parentheses.
Front Panel
SECTION 1
GENERAL
This section is extracted
from instruction manual.
DISC1DISC2DISC3DISC4DISC5
STANDBY
A "/1 (power) (28)
B Disc tray (28)
C DISC 1-5 A (eject) indicators (28, 62)
D H (play) (28, 62)
E X (pause) (30)
F x (stop) (30)
G ./>, PRESET -/+
(30, 60, 62)
Rear Panel
VOLUMEPRESET
FUNCTION
PHONES
H FUNCTION (28, 57, 60)
I VOLUME +/- (28)
J PHONES jack (28)
K Front panel display (75)
L STANDBY indicator (28)
M (remote sensor) (13)
FRONT R
CENTER FRONT L
SURR RSURR LWOOFER
SPEAKER
A SPEAKER jacks (14)
B VIDEO/SAT AUDIO IN jacks (20, 58)
C COMPONENT VIDEO OUT jacks (20)
D MONITOR OUT (VIDEO / S VIDEO) jacks
(20)
AUDIO IN
Y
PB/CBPR/C
R
VIDEO/SAT
L
R
COMPONENT VIDEO OUT
E AM terminal (19)
F FM 75Ω COAXIAL jack (19)
(
S
DVD ONLY
VIDEO
VIDEO
MONITOR OUT
)
COAXIAL
75
AM
FM
4
HCD-BC150/BC250
Remote
123
45
7
10
A SONY TV DIRECT (56)
B PROGRESSIVE (22, 55)
C DISC SKIP (28, 30)
D MUTING (30)
E REPEAT/FM MODE (37, 60)
F SLEEP (61)
G TUNER/BAND (59, 60)
H TUNER MENU (59, 60)
I TV (55)
J AUDIO (46)
K ANGLE (51)
6
9
8
0
L SUBTITLE (51)
M ./>, PRESET -/+ (30, 32, 60)
N H PLAY (28, 30, 31, 32, 36, 37, 38)
O X PAUSE (30)
P TOP MENU (32)
Q C/X/x/c/ENTER (25, 32, 34, 35, 36, 37,
39, 46, 52, 58, 59, 60, 62, 63)
R DISPLAY (34, 35, 37, 39, 44, 45, 46,
52, 63)
S TV CH +/- (55, 56)
T TV VOL +/- (55)
U TV [/1 (on/standby) (55)
V "/1 (standby) (28, 59, 60)
W DSGX (50)
X AUTO FORMAT DIRECT (48, 49)
Y MODE (48, 49)
wh NIGHT MODE (50)
wj FUNCTION (22, 28, 55, 57, 58, 59, 60)
wk Number buttons (32, 39, 52, 55, 56)
wl ENTER (55)
e; m/M// SLOW, TUNING -/ + (38,
59, 60)
ea x STOP (30, 31, 32)
es AMP MENU (25, 58, 62)
ed MENU (32)
ef VOLUME +/- (30, 60)
eg O RETURN (32, 34, 35, 39, 52, 63)
eh TV/VIDEO (55, 56)
ej DISPLAY (43, 60)
ek TIME/TEXT (41, 44)
el CLEAR (39)
5
HCD-BC150/BC250
MEMO
6
SECTION 2
DIAGRAMS
HCD-BC150/BC250
Ver 1.3
2-1. PRINTED WIRING BOARD — RF SECTION —
12345678910111213
A
B
RF BOARD
E
E
C
• See page 36 for Circuit Boards Location.
(SIDE A)
OPTICAL PICK-UP
BLOCK
(DBU-1)
RF BOARD
(SIDE B)
D
E
F
A
DMB07 BOARD
CN501
(Page 11)
IC003
1
R047
C052
R033
453
R046
R091
R034
C050
1-684-822-
12
(12)
6449
1
IC001
16
1732
48
33
12
1-684-822-
(12)
• Semiconductor
Location
Ref. No.
D001C-11
D002B-11
Location
HCD-BC150/BC250
IC001D-11
IC003D-4
Q001C-3
Q002B-3
77
HCD-BC150/BC250
Ver 1.3
2-2. SCHEMATIC DIAGRAM — RF SECTION —
• See page 37 for Waveforms. • See page 39 for IC Block diagrams.
(DBU-1)
CN001
C027C028
0.10.1
IC001
C030
C029
0.01
0.033
C039
C026
C025
R023
820
C024
JL005
24P
JL007
C009
0.1
100
R001
R041
1k
R035
0
R019R020
00
R025
100
R022
C019
220
5600p
C017
2200p
C016
0.01
R024
0
C015
C014
2200p
R014
R013
R012
R011
R018
R017
R016
R015
22p
22p
22p
22p
5600p
C023
C020
C022
C021
C018
2200p
2200p
C042
180p
0
0
0
0
0
0
0
0
JL004
C008
0.1
R021
0
0.1
0.1
SP3723CAF0PM
C041
0.1
C040
0.1
R026
C031
12k
1000p
0.5%
0.01
C032
0.047
JL006
JL003
1.9
R031
JL002
JL001
680p
0.033
C036
0.47
R034
C037
C038
R091
560k
0.5%
470
C051
0.47
C006
C013
22
0.1
R027
R028
R029
10V
0
0
0
C033 C012
0.1 0.1
C035
0.1
C005
22
10V
CN002
29P
(Page 14)
100
C049
0.1
C034
0.1
HCD-BC150/BC250
CN003
IC003
IC003
TL343IDBVR
C001
IOP2
Q001Q002
2SB1132-T100-QR2SB1132-T100-QR
9P
1SS355TE
-17
R004R003
L001
C002D001
10
16V
R005R009
3333
47k47k
C010
1000p
R006
100
470
6.3V
1SS355TE
-17
IOP1
L002
C004D002
10
16V
C003
R010R008R007
100
4703333
6.3V
R047
33k
R033
C050
100k
C011
1000p
0.0033
R046
10k
AMP
C052
0.1
88
2-3. PRINTED WIRING BOARD — CD MECHANISM SECTION —
HCD-BC150/BC250
Ver 1.3
• See page 36 for Circuit Boards Location.
1
2
MOTOR BOARD
A
34567
S761
(SUB TRAY OUT)
• Semiconductor
Location
Ref. No.
D701D-4
D711D-4
CN761
6
B
C
S781
ROTARY ENCODER
(ST U/D)
4
D
3
G
2
1
E
1
M761
(LD/ST MOTOR)
TRANSLATION BOARD
1
2
3
4
G
JW713
Q751
E
R752
R755
1
2
CN703
R751
R754
R753
C702
JW708
JW706
JW712
JW707
JW709
JW710
JW711
JW714
JW705
JW718
JW720
1
2
G
3
4
CN707
JW719
M762
(BU U/D MOTOR)
C762
1
R712
R711
JW703
JW704
JW717
9
20
21
D711
IC711
CN701
JW701
1
3
3
CN702
1
IC701
1
9
C701
1-861-240-
6
CN705
CN706
1
R702
D701
R701
JW702
JW716
JW715
2
1
1-861-245-
C761
11
(11)
11
(11)
SENSOR BOARD
IC751
3
1
CN751
SW(1) BOARD
CN721
1
SW(2) BOARD
CN731
1
1-861-242-
2
ENCODER BOARD
CN771
5
1
1-861-244-
3
1-861-241-
(11)
11
(11)
S721
(MAIN TRAY IN/OUT)
11
(11)
S731
(SUB TRAY N)
11
S771
ROTARY ENCODER
(MD)
IC701D-4
IC711E-3
IC751B-5
Q751D-2
Location
HCD-BC150/BC250
B
(Page 22)
MAIN
BOARD
CN513
1-861-243-
11
(11)
F
99
HCD-BC150/BC250
Ver 1.3
2-4. SCHEMATIC DIAGRAM — CD MECHANISM SECTION —
M761
RF500TB
M762
RF500TB
CN761
6P
• See page 40 for IC Block diagrams.
CN706
6P
C761
0.01
C762
0.01
R702
100
IC701
BA6956AN
R701
680
C701
47
16V
CN702
3P
CN721
3P
S721
(MAIN TRAY
IN/OUT)
CN701
21PIN
S761
(SUB TRAY OUT)
S731
(SUB TRAY IN)
IC751
RPR-359F
CN751
3P
CN731
2P
CN703
2P
CN705
3P
MTZJ-T-77-4.7B
R712
100
D711
MTZJ-T-77-4.3A
D701
IC711
BA6956AN
R711
680
R751
91
R754
12k
R753
10k
Q751
2SC2785-HFE
SWITCH
C702
10
16V
ST-E1
ST-E2
ST-E3
ST-E4
ST-E4
ST-E3
ST-E2
ST-E1
CN707
5P
ROTARY ENCODER
CN771
5P
CN513
(Page 24)
S781
ROTARY
ENCODER
S771
(MD)
HCD-BC150/BC250
R752
10k
R755
10k
1010
2-5. PRINTED WIRING BOARD — DMB07 SECTION (SIDE A) —