Sony HBD-E370 User Manual

HBD-E370/E470/

E570/E870/T57

SERVICE MANUAL

Ver. 1.0 2010.02

Photo: HBD-E370

• HBD-E370 is the amplifi er, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-E370.

• HBD-E470 is the amplifi er, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-E470.

• HBD-E570 is the amplifi er, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-E570.

• HBD-E870 is the amplifi er, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-E870.

• HBD-T57 is the amplifi er, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-T57.

US Model

HBD-E370/E570/T57

Canadian Model

HBD-E370/E470/E870

AEP Model

UK Model

HBD-E370/E870

Model Name Using Similar Mechanism BDP-S370

Mechanism Type BPX-5

Optical Pick-up Block Name KEM-460AAA

Amplifier Section

U.S. models:
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(FTC)
Front L + Front R: With 3 ohms loads, both

Other models:
POWER OUTPUT (rated)
Front L/Front R: 108 W + 108 W (at 3 ohms,

HBD-E370:
POWER OUTPUT (reference)
Front L/Front R/Center/Surround L/Surround R:

Subwoofer: 140 W (at 3 ohms, 80 Hz)
HBD-E870/HBD-E570/HBD-E470/HBD-T57:
POWER OUTPUT (reference)
Front L/Front R/Center/Surround L/Surround R:

channels driven, from 180

- 20,000 Hz; rated 60 watts

per channel minimum
RMS power, with no more
than 1% total ha rmonic
distortion from 250 mil li
watts to rated output.

1 kHz, 1% THD)

142 W (per channel at 3
ohms, 1 kHz)

167 W (per channel at 3
ohms, 1 kHz)

SPECIFICATIONS

Subwoofer: 165 W (at 3 ohms, 80 Hz)
Inputs (Analog)
AUDIO (AUDIO IN) Sensitivity: 450/250 mV
Inputs (Digital)
SAT/CABLE (COAXIAL), TV (OPTICAL)

Video Section

Outputs VIDEO: 1 Vp-p 75 ohms

BD/DVD/Super Audio CD/CD System

Signal format system NTSC (US and

USB Section

(USB) port: Type A (For connecting

Maximum current: 500 mA

LAN Section

LAN (100) terminal 100BASE-TX Terminal

Supported formats: LPCM
2CH (up to 48 kHz), Dolby
Digital, DTS

COMPONENT:
Y: 1 Vp-p 75 ohms

PB/CB, PR/CR: 0.7 Vp-p
75 ohms

HDMI OUT: Type A (19
pin)

Canadian models)
PAL/NTSC (AEP and
UK models)

USB memory, memo ry
card reader, d igital still

camera, and digital video
camera)

Tuner Section

System PLL quartz-locked digital

FM tuner section
Tuning range
North American models: 87.5 MHz - 108.0 MHz

Other models: 87.5 MHz - 108.0 MHz

Antenna (aerial) F M wire ante
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency 10.7 MHz

General

Power requirements
North American model:
Other models:

Power consumption On: 170 W

Dimensions (approx.) 430 mm × 85 mm × 335

Mass (approx.) 4.8 kg (10 lb 10 oz)

Design and specifications are subject to change
without notice.

synthesizer

(100 kHz step)

(50 kHz step)

120 V AC, 60 Hz
220 - 240 V AC,
50/60 Hz

Standby: 0.3 W (at the
Power Saving mode)

mm (17 in × 3
13
projecting parts

nna (aerial)

3

1

/8 in ×

/4 in) (w/h/d) incl.

9-889-770-01

2010B05-1

2010.02

©

BLU-RAY DISC/DVD RECEIVER

Sony Corporation

Audio&Video Business Group
Published by Sony Techno Create Corporation

HBD-E370/E470/E570/E870/T57

• This product incorporates copyright protection technology that is protected by
U.S. patents and other intellectual property rights.

Use of this copyright protection technology must be authorized by Macrovision,

and is intended for home and other limited viewing uses only unless otherwise
authorized by Macrovision.

Reverse engineering or disassembly is prohibited.

• This system incorporates with Dolby* Digital and Dolby Pro Logic (II) adaptive
matrix surround decoder and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Labora-

tories.
** Manufactured under license under U.S. Patent #’s:
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535;

7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide

patents issued & pending. DTS is a registered trademark and the DTS logos,

Symbol, DTS-HD and DTS-HD Master Audio are trademarks of DTS, Inc.
© 1996-2008 DTS, Inc. All Rights Reserved.

• This system incorporates High-Defi nition Multimedia Interface (HDMI™) tech-
nology.

HDMI, the HDMI logo and High-Defi nition Multimedia Interface are trademarks

or registered trademarks of HDMI Licensing LLC.

• Java and all Java-based trademarks and logos are trademarks or registered trade­marks of Sun Microsystems, Inc.

• “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.

• “Blu-ray Disc” is a trademark.

• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,” “DVD
VIDEO,” and “CD” logos are trademarks.

• “BRAVIA” is a trademark of Sony Corporation.

• “AVCHD” and the “AVCHD” logo are trademarks of Matsushita Electric Indus­trial Co., Ltd. and Sony Corporation.

• “S-AIR” and its logo are trademarks of Sony Corporation.

•

, “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony

Computer Entertainment Inc.

• “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.

®

, DivX Certifi ed® and associated logos are registered trademarks of DivX,

• DivX
Inc. and are used under license. (Except for U.S. models.)

• Music and video recognition technology and related data are provided by Grace­note®.

Gracenote is the industry standard in music recognition technology and related

content delivery. For more information, please visit www.gracenote.com.

CD, DVD, Blu-ray Disc, and music and video-related data from Gracenote, Inc.,

copyright © 2000-present Gracenote.

Gracenote Software, copyright © 2000-present Gracenote. One or more patents

owned by Gracenote apply to this product and service. See the Gracenote website
for a nonexhaustive list of applicable Gracenote patents. Gracenote, CDDB,
MusicID, MediaVOCS, the Gracenote logo and logotype, and the “Powered by
Gracenote” logo are either registered trademarks or trademarks of Gracenote in
the United States and/or other countries.

This appliance is classified as a
CLASS 1 LASER product. This
marking is located on the rear
exterior.

NOTES ON CHIP COMPONENT REPLACEMENT

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.

FLEXIBLE CIRCUIT BOARD REPAIRING

• Keep the temperature of soldering iron around 270 °C during
repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.

SAFETY CHECK-OUT

After correcting the original service problem, perform the follow­ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.

2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)

To Exposed Metal
Parts on Set

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC­TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON­NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.

2

AC

1.5 kΩ0.15 μF

voltmeter
(0.75 V)

Earth Ground

Fig. A. Using an AC voltmeter to check AC leakage.

TABLE OF CONTENTS

HBD-E370/E470/E570/E870/T57

1. SERVICING NOTES ............................................. 4

2. DISASSEMBLY

2-1. Disassembly Flow ........................................................... 11

2-2. Case (EZ) ........................................................................ 11

2-3. MB-134 Board ................................................................ 12

2-4. Bracket (MB) Block ........................................................ 13

2-5. Fuse (F901), POWER Board .......................................... 13

2-6. Front Panel Block ........................................................... 14

2-7. CONNECT Board ........................................................... 14

2-8. BD Drive (BPX-5) .......................................................... 15

2-9. Back Panel Block ............................................................ 15

2-10. MAIN Board ................................................................... 16

2-11. AUDIO Board ................................................................. 16

2-12. Optical Device (KEM-460AAA), Wire (Flat Type) ....... 17

3. TEST MODE ............................................................ 18

4. ELECTRICAL CHECK ......................................... 27

5. DIAGRAMS

5-1. Block Diagram - SERVO Section - ................................ 28

5-2. Block Diagram - MEMORY Section - ............................ 29

5-3. Block Diagram - TUNER, S-AIR Section - .................... 30

5-4. Block Diagram - AUDIO Section - ................................. 31

5-5. Block Diagram - REGULATOR Section - ...................... 32

5-6. Block Diagram

- PANEL, POWER SUPPLY Section - ........................... 33

5-7. Schematic Diagram - MB-134 Board (1/13) - ................ 35

5-8. Schematic Diagram - MB-134 Board (2/13) - ................ 36

5-9. Schematic Diagram - MB-134 Board (3/13) - ................ 37

5-10. Schematic Diagram - MB-134 Board (4/13) - ................ 38

5-11. Schematic Diagram - MB-134 Board (5/13) - ................ 39

5-12. Schematic Diagram - MB-134 Board (6/13) - ................ 40

5-13. Schematic Diagram - MB-134 Board (7/13) - ................ 41

5-14. Schematic Diagram - MB-134 Board (8/13) - ................ 42

5-15. Schematic Diagram - MB-134 Board (9/13) - ................ 43

5-16. Schematic Diagram - MB-134 Board (10/13) - .............. 44

5-17. Schematic Diagram - MB-134 Board (11/13) - .............. 45

5-18. Schematic Diagram - MB-134 Board (12/13) - .............. 46

5-19. Schematic Diagram - MB-134 Board (13/13) - .............. 47

5-20. Printed Wiring Board

- MB-134 Board (Component Side) - ............................. 48

5-21. Printed Wiring Board

- MB-134 Board (Conductor Side) - ............................... 49

5-22. Printed Wiring Board - AUDIO Board - ......................... 50

5-23. Schematic Diagram - AUDIO Board - ............................ 51

5-24. Printed Wiring Board

- MAIN Board (Component Side) - ................................ 52

5-25. Printed Wiring Board

- MAIN Board (Conductor Side) - .................................. 53

5-26. Schematic Diagram - MAIN Board (1/5) - ..................... 54

5-27. Schematic Diagram - MAIN Board (2/5) - ..................... 55

5-28. Schematic Diagram - MAIN Board (3/5) - ..................... 56

5-29. Schematic Diagram - MAIN Board (4/5) - ..................... 57

5-30. Schematic Diagram - MAIN Board (5/5) - ..................... 58

5-31. Printed Wiring Board - CONNECT Board - ................... 59

5-32. Schematic Diagram - CONNECT Board - ...................... 59

5-33. Printed Wiring Board - REG Board - .............................. 60

5-34. Schematic Diagram - REG Board - ................................ 61

5-35. Printed Wiring Board - FL Board - ................................. 62

5-36. Schematic Diagram - FL Board - .................................... 63

5-37. Printed Wiring Board - POWER Board - ........................ 64

5-38. Schematic Diagram - POWER Board - .......................... 65

5-39. Printed Wiring Boards - KEY Section - .......................... 66

5-40. Schematic Diagram - KEY Section - .............................. 66

6. EXPLODED VIEWS

6-1. Case, Front Panel Section ............................................... 91

6-2. MB-134 Board Section ................................................... 92

6-3. Back Panel Section ......................................................... 93

6-4. MAIN Board Section ...................................................... 94

6-5. BD Drive Section (BPX-5) ............................................. 95

7. ELECTRICAL PARTS LIST .............................. 96

3

HBD-E370/E470/E570/E870/T57

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro­static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 °C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to fl ow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

RELEASING THE DISC TRAY LOCK

The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.

Releasing Procedure:

1. Press the [

] button to turn on the system.

?/1

2. Press the [FUNCTION] button to select “BD/DVD”.

3. Press the [

] and [Z] buttons simultaneously and hold down

x

unit “DEMO OFF” displayed on the fluorescent indicator tube
(around 5 seconds).

Note: When “DEMO ON” is displayed, the disc tray lock is not released

by turning power on/off with the [

?/1

] button.

ABOUT THE LENS CLEANING

Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.

NOTE THE IC101, IC104, IC105, IC204, IC205, IC307,
IC311, IC501 AND IC502 ON THE MB-134 BOARD
REPLACING

IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and
IC502 on the MB-134 board cannot exchange with single. When
these parts are damaged, exchange the entire mounted board.

TEST DISC

Part No. Description Layer

J-6090-199-A BLX-104 Single Layer

J-6090-200-A BLX-204 Dual Layer

J-2501-307-A CD (HLX-A1)

J-2501-305-A HLX-513 Single Layer (NTSC)

J-2501-306-A HLX-514 Dual Layer (NTSC)

J-6090-077-A HLX-506 Single Layer (PAL)

J-6090-078-A HLX-507 Dual Layer (PAL)

Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-

989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.

Operation and Display:

1. BLX-104
Procedure:

1. Select 23.976Hz/1080p.

2. Play “4.Motion picture”.

3. Check whether player can play back or not.

4. Check each outputs.
Video:
Composite/S Video/component/HDMI.
Audio:
Speaker out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)

can use instead of 1080/24p.

However this is temporary correspondence.

2. BLX-204
Procedure:

1. Select 1080i (59.94Hz or 50Hz).

2. Play “4.Motion picture”.

3. Check whether player can play back or not (Check the picture
and sound output).

3. CD (HLX-A1)

Procedure:

Check whether player can play back or not (Check the sound out­put).

4. HLX-513/514 (NTSC), HLX-506/507 (PAL)

Procedure:

1. After displayed Main Menu, select “1.Video Signal”.

2. Play “1.Color bar 100%” (Check the picture and sound out­put).

3. Return to Menu.

4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
picture and sound output).

4

HBD-E370/E470/E570/E870/T57

CAPACITOR ELECTRICAL DISCHARGE PROCESSING

When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistors referring to the fi gure below.

• MAIN board (C3115, C3125, C3215, C3315, C3415, C3425)
Both ends of CN3001.

– MAIN Board (Conductor Side) –

4

1

CN3001

C3115

C3425

C3415

800 :/2 W

C3215

C3315

C3125

• POWER board (C903, C932, C933)
Both ends of respective capacitors.

– POWER Board (Conductor Side) –

800 :/2 W

C903

C933

800 :/2 W

C932

800 :/2 W

1. Preparation
1-1. ESD Countermeasure

It is necessary to confi rm the state of static electricity in the work
space before the repair is started.
The static electricity resistance of the BD laser is weaker than that
of the DVD/CD laser.
Do work space and worker’s ESD countermeasures to prevent de­struction by ESD.

1-2. Jig

• Digital camera (Recommend with macro mode)

• USB memory

• PC

• Barcode decoder (Refer to “1-3. Barcode decoder
(BDBUDEC)”)

1-3. Barcode decoder (BDBUDEC)

Part No. : J-6090-212-A
Jig name : BDBUDec.exe
Release : 2009.02.19
Version : 1.0.0.0
Software contents :

• BDBUDec.exe : Barcode decoder software

• SavePath.ini : Decoded fi le destination setting fi le (Ini-

tial destination is “C:\BuData.txt”)

• TasmanBars.dll : Decode dll

• Uninst.exe : Uninstall the “BDBUDec.exe” from PC

Install procedure:

1. Unzip the barcode decoder fi les to any PC folder.

2. Check the taken barcode photo click & drop onto “BDBUDec.
exe”.

When the barcode decoder is used for the fi rst time, the pass-

word is necessary. It is unnecessary since the second times.

NOTE OF REPLACING THE OPTICAL DEVICE (KEM­460AAA) OR MB-134 BOARD

Optical device (KEM-460AAA) for BD requires precise read out
functions and secure contents protection system for more than past
DVD/CD.
Therefore, in the case repaired as follows, the writing work of the
OP data is necessary.

• When the optical device (KEM-460AAA) is replaced (The
MB-134 board doesn’t replace).

• When both the optical device (KEM-460AAA) and MB-134
board are replaced.

• When the MB-134 board is replaced (The optical device
(KEM-460AAA) doesn’t replace) (In this case, do the work of
“3. Optical device (KEM-460AAA) replacement” other than
the replacement of new optical device).

Note: The servo adjustment is done while writing the OP data. The manual

adjustment is unnecessary.
LD ON TIME history doesn’t carry over.
Do not touch any optical block parts, turn table and during replac-

ing. BD laser diode is very sensitive.

Note 1: The password will be supplied to only service headquarters, and

service center name/q’ty/all of software registered information
should be maintained by service headquarters.

Note 2: Do not change the decoded fi le name “BuData.txt”.

3. When “.NET frame work requirements” is displayed, down­load following applications from Microsoft download site.

• Microsoft .NET Framework Version 2.0 Redistributable Pack­age (x86)

http://www.microsoft.com/downloads/details.aspx?displaylan

g=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5

• Microsoft .NET Framework 2.0 Service Pack 1 (x86)

http://www.microsoft.com/downloads/details.aspx?displaylan

g=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5

5

HBD-E370/E470/E570/E870/T57

2. Pass-fail judgment of the optical device (KEM-460AAA)

Perform pass-fail judgment to judge whether the repair of the optical device (KEM-460AAA) is necessary.

2-1. Flow of drive section check

Confirm whether

BD (BLX-104) can be

reproduced

YES

Confirm whether

DVD (HLX-513)/

CD (HLX-A1) can be

reproduced

Note: Refer to “2-12. OPTICAL DEVICE (KEM-460AAA), WIRE (FLAT TYPE)” (page 17) about how to remove the FFC HOLDER (REAR).

NO

NO

Confirm whether the

drive voltage is the

following values

CN301 pin 2 : 12 V

CN301 pin 6 : 5 V

YES

Confirm OP FFC cable

(Part No. 1-837-494-11)

and SPDL FFC cable

(Part No. 1-837-495-11),

and replace it when it

has been damaged

Then, confirm whether

this set operates

normally

YES

OK

NO

NO NO

Confirm PS301 to

PS304 on the MB-134

board, and replace it

when it has been

damaged

Confirm whether the

optical device IOP

is normal in the

service mode

(Refer to “2-2. Flow

of optical device

IOP check”)

Repalece the
optical device

(KEM-460AAA)

(Refer to “3. Optical

device (KEM-460AAA)

replacement”)

2-2. Flow of optical device IOP check

Turn the power on,

and change function

to “BD/DVD”

Press the buttons on

the remote commander

in order of [RETURN],

[0], [2], [1] [SUBTITLE],

and enter the service

mode

Confirm whether

value is the

specification value

Specification value:

BD : 6 mA

DVD/CD: 9 mA

YES

OK

NO

Repalece the
optical device

(Refer to “3. Optical

device (KEM-460AA)

replacement”)

Press the buttons on

the remote commander

in order of [8], [7], [3],

[ENTER], and the

dIOP value is displayed

6

3. Optical device (KEM-460AAA) replacement
Flow of replacement:

Note: The photo in fl ow is an image.

Barcode label on
new optical device
(KEM-460AAA)
bottom side

Take photo (JPEG)
by digital camera

Change photo into
the text data with
the barcode decoder

HBD-E370/E470/E570/E870/T57

Save the text data
to USB memory
(memory capacity
need not be 8GB)

Connect USB memory
with rear USB connector
on this set, and read the
text data by the service mode

Procedure:

1. Remove the INSULATOR (4 pieces) and broken optical de­vice (KEM-460AAA) from LOADING ASSY.

2. Take photo of the barcode on new optical device (KEM­460AAA) bottom side by digital camera.

3. Assemble the INSULATOR (4 pieces) to new optical device
(KEM-460AAA), fi x (Torq0ue value: 2 kgf) it to LOADING
ASSY with screw, and assemble this set.

4. Drag & drop the taken photo by step 2 to “BDBUDec.exe”,
and make the text data (File name: BuData.txt).

5. Save the text data to USB memory.

6. Connect USB memory with rear USB connector on this set,
and turn the power on.

7. Press the [FUNCTION] button to select “BD/DVD”.

8. Press the buttons on the remote commander in order of
[RETURN], [0], [2], [1], [SUBTITLE], and enter the service
mode.

9. Press the buttons on the remote commander in order of [8], [1],
[ENTER], and execute “[1] Drive OP data Write”.

10. Turn the power off after writing the OP data.

11. Turn the power on, and enter the service mode again.

12. Press the buttons on the remote commander in order of [8], [7],
[3], [ENTER], and the dIOP value is displayed.

13. Confi rm value is the following specifi cation value, and turn the
power off.

Specifi cation value:

BD : 6 mA
DVD/CD : 9 mA

14. Turn the power on, confi rm playback performance of the BD
(BLX-104)/DVD (HLX-513)/CD (HLX-A1).

15. Completely assemble this set, and complete the repair.

Rear USB connector

7

HBD-E370/E470/E570/E870/T57

NOTE THE BD DRIVE (BPX-5) PARTS REPLACING

The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.

• CHUCK HOLDER ASSY

• LOADING ASSY

• HOLDER, FFC (REAR)

These parts are produced by two venders, it is not compatible.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.

HOLDER FFC (REAR) need not be exchanged at the same time.

Note: The laser caution label is not pasted to LOADING FOR SERVICE

(Part No. A-1750-926-A). Please peel off an original laser caution
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.

LASER CAUTION LABEL

LOADING FOR SERVICE

CHUCK HOLDER ASSY

NOTE OF REPLACING THE THE IC3100, IC3200 AND
IC3400 ON THE MAIN BOARD AND THE COMPLETE
MAIN BOARD

When IC3100, IC3200 and IC3400 on the MAIN board and the
complete MAIN board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501­221-A ) between parts and heat sink.
Spread the compound referring to the fi gure below.

– MAIN Board (Component Side) –

IC3200IC3100

IC3400

LOADING ASSY

MODEL IDENTIFICATION
– Rear Chassis –

Model Part No.

E370: AEP and UK models

E370: US model

E370: Canadian model

E470: Canadian model

E570: US model

E870: Canadian model

E870: AEP and UK models

T57: US model (for Costco)

IC3100 IC3200 IC3400

HOLDER, FFC (REAR)

Part No.

4-161-684-1[]

4-161-685-1[]

4-161-685-2[]

4-161-686-1[]

4-161-684-3[]

4-161-684-5[]

4-161-686-5[]

4-161-686-0[]

8

HBD-E370/E470/E570/E870/T57

NOTE OF REPLACING THE D913, D931, IC901 AND IC921 ON THE POWER BOARD AND THE COMPLETE
POWER BOARD

When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.

IC901

D913

– POWER Board
(Component Side) –

HS901

D931

IC901

HS931

D931

D913

HS921

IC921

IC921

9

HBD-E370/E470/E570/E870/T57

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF

Note 1: After the case is removed, this mark is done.
Note 2: Please prepare the thin wire (clip etc.).

1 Remove the case.
(Illustration of disassembly is omitted.)

2

clip etc.

PROCESSING OF HARNESS (USB)

tray

3

– Top view –

10

DISASSEMBLY

• This set can be disassembled in the order shown below.

2-1. DISASSEMBLY FLOW

SET

2-2. CASE (EZ)
(Page 11)

HBD-E370/E470/E570/E870/T57

SECTION 2

2-3. MB-134 BOARD
(Page 12)

2-4. BRACKET (MB) BLOCK
(Page 13)

2-5. FUSE (F901),
POWER BOARD
(Page 13)

Note: Follow the disassembly procedure in the numerical order given.

2-6. FRONT PANEL BLOCK
(Page 14)

2-8. BD DRIVE (BPX-5)
(Page 15)

2-12. OPTICAL DEVICE
(KEM-460AAA),
WIRE (FLAT TYPE)
(Page 17)

2-9. BACK PANEL BLOCK
(Page 15)

2-10. MAIN BOARD
(Page 16)

2-7. CONNECT BOARD
(Page 14)

2-11. AUDIO BOARD
(Page 16)

2-2. CASE (EZ)

2 five screws
(BV/RING)

– Bottom view –

1 four screws
(BV3)

5 seven hooks

6 case (EZ)

3

3

4

11

HBD-E370/E470/E570/E870/T57

2-3. MB-134 BOARD

9 screw (BV3)

6 wire (flat type) (45 core)

(CN1401)

7 wire (flat type) (9 core)
(CN2460)

8 wire (flat type) (5 core)
(CN2470)

2 two connectors
(CN601, CN602)

q; clamp

9 four screws (BV3)

qd MB-134 board

4 wire (flat type) (18 core)

(CN902)

5 wire (flat type) (16 core)
(CN901)

qa screw (B3 u 5)

qs two screws (BV3)

1 connector (CN303)

3 wire (flat type) (27 core)

(CN1505)

12

2-4. BRACKET (MB) BLOCK

HBD-E370/E470/E570/E870/T57

8 three screws (BV3)

5 connector (CN400)

1 power cord connector

(CN901)

7 screw
(BV3)

3 power-supply cord (US, Canadian)
power cord (AEP, UK)

8 two screws (BV3)

9 bracket (MB) block

2 cord bush (2104)

6 screw (P3 u 6)

4 connector (CN403)

2-5. FUSE (F901), POWER BOARD

0 POWER board

4 bracket R (MB foot)

6 connector

(CN17)

9 fuse label (T. H)

(AEP, UK)

7 eight screws
(BV3)

1 glass fuse (DIA. 5) (8A/125V)
(F901) (US, Canadian)
fuse (H. B. C.) (T5AH/250V)
(F901) (AEP, UK)

2 screw (BV3)

5 connector

(CN904)

3

8 Remove the POWER board

from PC board holder.

13

HBD-E370/E470/E570/E870/T57

2-6. FRONT PANEL BLOCK

Note: Please prepare the thin wire (clip etc.).

5 three screws
(BV3)

6 three ground plates (front)

7 three screws

(BV3)

q; connector
(CN700)

9

8 three claws

1

clip etc.

2-7. CONNECT BOARD

5 CONNECT board

2 wire (flat type) (15 core)

(CN300)

four claws

8 three claws

3 four screws

(BV3)

4

2

3 claw

1 connector (CN301)

qa front panel block

8 two claws

7 three screws

(BV3)

3 three claws

4 loading panel assy

(10EZ)

14

2-8. BD DRIVE (BPX-5)

HBD-E370/E470/E570/E870/T57

5 three screws (BV3)

qs sound sheet

qd BD drive (BPX-5)

qa

0 four screws (BV3)

7 screw (BV3)

9 bracket

(S-AIR foot)

8

6 bracket (S-AIR UME)

1 screw (BV3)

3 bracket L (MB foot)

2

4 screw (BV3)

2-9. BACK PANEL BLOCK

2 three screws (BV3)

4 wire (flat type) (9 core)

(CN10) (US, Canadian)
wire (flat type) (11 core)
(CN11) (AEP, UK)

3 bracket (S-AIR UME)

5 fan connector

(CN3000)

7 screw (BV3)

1 screw (BV3)

7 two screws (BV3)

6 two screws (BV3)

7 screw (BV3)

7 screw (BV3)

8 back panel block

15

HBD-E370/E470/E570/E870/T57

2-10. MAIN BOARD

9 wire (flat type) (18 core)
(CN701)

7 wire (flat type) (15 core) (CN504) (US, Canadian)
wire (flat type) (17 core) (CN502) (AEP, UK)

qd six screws
(BV3)

5 wire (flat type) (27 core)
(CN505)

6 wire (flat type) (15 core)
(CN508)

1 screw
(BV3)

8 wire (flat type) (15 core)
(CN702)

q; wire (flat type) (16 core)
(CN703)

4 connector

2

(CN904)

3 bracket R
(MB foot)

qa four screws
(BV3)

qs heat sink
(S-master DDV)

qd two screws
(BV3)

qf MAIN board

2-11. AUDIO BOARD

6 three screws (BV3)

3 bracket L (MB foot)

1 screw (BV3)

7 AUDIO board

2

4 connector

(CN17)

5 wire (flat type) (15 core) (CN13) (US, Canadian)
wire (flat type) (17 core) (CN15) (AEP, UK)

16

2-12. OPTICAL DEVICE (KEM-460AAA), WIRE (FLAT TYPE)

Note: Please prepare the thin wire (clip etc.).

4 chuck holder assy (D)

1 two screws

(BVTP 2.6)

2 two claws

7 two float screws (S)

qa insulator

5 Insert the thin

wire (clip etc.).

8

0

3 two claws

qa insulator

qs optical device

(KEM-460AAA)

qa insulator

9

qd non-halogene tape

qf wire (flat type) (5 core)

HBD-E370/E470/E570/E870/T57

qh ffc holder (rear)

qk wire (flat type)

(45 core)

qg

qj wire (flat type)

(9 core)

qa insulator

6

,QVWDOODWLRQRIZLUHIODWW\SHFRUHDQGZLUHIODWW\SHFRUH

Note: This illustration sees the loading assy (D) from bottom side.

3 wire (flat type) (9 core)

4 Through the hole.

terminal face

Under the guide.

loading assy (D)

1 wire (flat type) (45 core)

Fold.

2 Through the hole.

terminal face

boss

loading assy (D)

– Bottom view –

7 two claws

5 ffc holder (rear)

7 three claws

6

Under the guide.
(Fold area)

boss

17

HBD-E370/E470/E570/E870/T57

SECTION 3

TEST MODE

COLD RESET

The cold reset clears data except BD/DVD data stored in the RAM
to initial conditions. Execute this mode when returning the set to
the customers.

Procedure:

1. Press the [

2. Press the [x] and [VOLUME –] buttons simultaneously and

hold down (around 5 seconds).

3. The message “COLD RESET” appears on fl uorescent indica-
tor tube, then becomes standby states.

DEMO MODE

This mode let you lock the disc tray. When this mode is activated,
the disc will not eject when the [
“LOCKED” will be displayed on the fluorescent indicator tube.

Procedure:

1. Press the [

2. Press the [FUNCTION] button to select the “BD/DVD”.

3. Press the [
until “DEMO ON” or “DEMO OFF” displayed on the fluores­cent indicator tube (around 5 seconds).

S-AIR ID SETTING CHANGE
Procedure:

1. Press the [

2. Press the [FUNCTION] and [VOLUME +] buttons simultane­ously and hold down (around 5 seconds).

3. S-AIR ID setting is changed (A → B → C → A...).

] button to turn the power on.

?/1

] button is pressed. The message

Z

] button to turn the power on.

?/1

] and [Z] buttons simultaneously and hold down

x

] button to turn the power on.

?/1

AMP TEST
Procedure:

1. Press the [

2. Press button in order of the [RETURN] → [0] → [1] → [1]
→ [SUBTITLE] on the remote commander (Make the interval
when each button is pressed within two seconds).

3. The message “MEASURE” appears on the fluorescent indica­tor tube and enter the AMP test mode.

4. Press the [BLUE] button on the remote commander, the state
of D.C.A.C. microphone is displayed on the fl uorescent indica-
tor tube.

*** @@ $$$

*** : Either of “IN”/“NON” is displayed by the state of

@@ : Either of “OK”/“NG” is displayed by the state of

$$$ : Microphone input audio data A/D value (0 – 255).

5. Press the [MUTING] button on the remote commander, “VOL
N” (The change in the volume is usual)/“VOL MSM” (The
change in the volume is a switch of MIN/1/20/MAX) can be
switched.

6. Press the [SUBTITLE] button on the remote commander, the
message “VACS ON” or “VACS OFF” appears on the fl uores-
cent indicator tube and thus the VACS on/off are changed.

7. To release from this mode, press the [

] button to turn the power on.

?/1

detection of the microphone.

digital audio data input.

?/1

] button.

PANEL TEST
Procedure:

1. Press the [

2. Press button in order of the [RETURN] → [0] → [0] → [1]
→ [SUBTITLE] on the remote commander (Make the interval
when each button is pressed within two seconds).

3. All segments in fl uorescent indicator tube are lighted up. And
half segments in fl uorescent indicator tube are lighted up, oth-
ers half segments in fl uorescent indicator tube are lighted up,
then LEDs and all segments in fl uorescent indicator tube are
lighted up. This operation is repeated.

4. When all segments in fl uorescent indicator tube are lighted up
in the state of step 3, press the [VOLUME +] button on the
remote commander and model information is displayed on the
fl uorescent indicator tube.

Each time the [VOLUME +] button on the remote commander

is pressed, the display changes from destination information,
STR version, SYS version, UI version, BDLIB version, ST
version, TA version, DSP version, TM version, CEC version,
SAIR version, PF version in this order, and returns to the mod­el information display.

Each time the [VOLUME –] button on the remote commander

is pressed, the version and date are switched.

5. In the state of step 3, press the [FUNCTION] button on the
remote commander and “K 0” is displayed on the fluorescent
indicator tube.

“K 0” value increases whenever a button on the set is pressed.

However, once a button has been pressed, it is no longed taken
into account.

All buttons on the set are pressed, “OK” and “K 7” are alter-

nately displayed on the fluorescent indicator tube.

6. To release from this mode, press the [

] button to turn the power on.

?/1

?/1

] button.

BD SERVICE MODE

Note: The operation in this mode must use a remote commander.

Setting method of the BD service mode:

1. Press the [

2. Press button in order of the [RETURN] → [0] → [2] → [1] →

[SUBTITLE] on the remote commander. (Make the interval
when each button is pressed within two seconds)

3. Enter the BD service mode.

1. Main Functions

• ErrorLog display
Display the error log. Displayed contents can also be saved in

an USB memory device.

• Diag
Performs unit test of devices installed on the board.

• Factory Initialize
Restores the set to its factory settings.

• Network
Checks the wired network connection.

• Version Up (version update)
Not used.

• System Information
Displays the system information of the set.
Displays information such as the software version, drive infor-

mation, etc.

• EMC Test Mode
Not used.

• Drive
Write drive OP data and check drive.

] button to turn the power on.

?/1

18

2. Menu Tree

HBD-E370/E470/E570/E870/T57

Service Mode Menu

Service Mode Menu

[1] Diag

[1] Diag

[2] Log

[2] Log

[3] Factory Initialize

[3] Factory Initialize

[4] Network

[4] Network

[5] Version Up

[5] Version Up

[6] System Information

[6] System Information

[7] EMC Test Mode
[8] Drive

Diag

'LDJ7HVW

Log
Displays Error Log

Factory Initialize
5Hstores set to factory settings

Network
1Htwork diagnosis for wired

Device Test

86%'$&,)FRQWHVW

Video Test

Video output test

$udio Test
$udio output test

$udio Input Test
$XGLR,QSXW7HVW

:LUHOHVV/$17HVW
Not used

Error Log

Displays error log

Start Initialize

,QLWLDOL]HGHIDXOWVHWWLQJIRU%'SOD\HU

Start Initialize for TV

1RWXVHG

Ifconfig

View network status

Version Up
Not used

System Information

Displays system information

EMC Test Mode
Not used

Drive

Write drive OP data and check drive

Ping

&RQILUPQHWZRUNFRQQHFWLRQ

19

HBD-E370/E470/E570/E870/T57

3. Service Mode Menu (Top Menu)

This is the top menu of service mode.
Each function is accessed from this screen.

Operation:

[1] Moves to Diag screen
[2] Moves to Log screen
[3] Moves to Factory Initialize screen
[4] Moves to Network screen
[5] Moves to Version Up (DISC version update) screen (Not

used)
[6] Moves to System Information screen
[7] Moves to EMC test mode screen (Not used)
[8] Moves to Drive screen
[M]/[m] Moves the cursor
[3] Moves to the screen of the item selected with the cursor

* Cursor is not displayed when the menu is fi rst displayed.

Service Mode Menu

[1] Diag

[1] Diag

[2] Log
[3] Factory Initialize
[4] Network
[5] Version Up
[6] System Information
[7] EMC Test Mode
[8] Drive

• Device Test: List of devices
USB Host (*1)

*1) USB media check (front and rear). Only one time.
* For details concerning device test, see the Diag reference.

 Diag

Category:

(Screen 1)

(Screen 2)

Device Test

 Diag

Category: Device Test

HELP: [RIGHT] [UP] [ENT] [RET]

USB Host

Device:

Rear USB Media check ... OK
Front USB Media check ... OK

Checking...

5. Diag (Video/Audio Test)

This screen performs video and audio tests.

HELP : [DOWN] [ENT] [(NUM)]

HELP (currently available keys, etc.) is displayed

4. Diag (Device Test)

This screen is used to test devices mounted on the board.

Screen 1: Selects the test category
Operation:

[<]/[,] Selects the category
[m]/[3] Moves to the selected category

Screen 2: Device test

Selects the device to test after selecting Device Test in screen 1.

Operation:

[<]/[,] Selects the device to test
[3] Executes the test
[M] Returns to selection of test category
Selects the cursor during IFCon and D terminal tests
[m] Selects the cursor during IFCon and D terminal tests

• List of test categories
Device Test
Video Test
Audio Test
Audio Input Test
Wireless LAN Test (not used)

Screen 1: When video test category is selected
Operation:

[3] Shows/hides the color bar
[M]/[RETURN] Returns to the selection of test category

Screen 2: When audio test category is selected
Operation:

[3] Plays back/stops the tone sound
[M]/[RETURN] Returns to the selection of test category

• Video test:
Outputs a color bar (composite & component & HDMI).

• Audio test:
TONE sound output (speaker (8 ch) & HDMI (2 ch)).

 Diag

Category: Video Test

[ENT] Show Color Bar

 Diag

Category: Audio Test

(Screen 1)

HELP: [UP][ENT][RET]

[ENT] Generate TONE Sound

20

(Screen 2)

HELP: [UP] [ENT] [RET]

HBD-E370/E470/E570/E870/T57

6. Diag (Audio Input Test)

This screen performs audio input test.

Screen 1: Selects the test category
Operation:

[<]/[,] Selects the category
[m]/[3] Moves to the selected category

Screen 2: Select Audio Input Test
Operation:

[M]/[m] Select test
[3] Start/stop input sound
[RETURN] Returns to the selection of test category

• Digital Input
Input : SPDIF (optical, 48 kHz, 2 ch only).
Sound output : Speaker (2 ch).

• Analog Input
Input : Line In (2 ch).
Sound output : Speaker (2 ch).

 Diag

Category: Audio Input Test

 Diag

Category: Audio Input Test

Device: Digital Input

Analog Input
[ENT] Start Input Sound

8. Log: Error Log (Output of each Log)

This screen displays the contents of each log.

Note: Do not refer to the displayed date.

Screen 1: Selects log
Operation:

[1]/[

3] Moves to the Error Log output screen

[RETURN] Returns to the top menu of the service mode

Screen 2: Displays the Error Log
Operation:

[<] Returns to the previous page
[,] Moves to the next page
[RETURN] Returns to the screen (screen 1) that selects the log

type

[RED] Writes the log contents to an USB memory device

• Viewing the log display
Error Log:
001 08/01/01 00: 53: 19: [ErrCode: 080400000000]
[Number (starting from old log) ] [date] [time] [error code]

About copying log to USB memory device:
Press the [RED] button in each log display screen with the USB
memory device inserted into the set

Note: Please do not press the [RED] button immediately after USB mem-

ory is inserted.

Please do not pull out USB memory immediately after the [RED]

button was pressed.

Error Log:
When “getErrLogFile.trm fi le” exists in the USB memory de-

vice, errlog.log fi le is output.

(Screen 1)

HELP: [UP][ENT][RET]

(Screen 2)

HELP: [UP] [ENT] [RET]

7. Diag (Wireless LAN Test)

This screen performs wireless LAN test.

Note: Not used for the servicing.

(Screen 1)

(Screen 2)

 Select Log

[1] Error Log

 Error Log

001 08/01/01 00: 53: 19: [ErrCode: 080400000000]
002 08/01/01 00: 53: 45: [ErrCode: 080400252100]
003 08/01/01 00: 54: 00: [ErrCode: 080400005555]

HELP : [DOWN][ENT][(NUM)]

:
:

21

HBD-E370/E470/E570/E870/T57

9. Factory Initialize (Factory Settings)

Return all of the player setting to their factory defaults.

Operation:
Screen 1

Press the [1] button in this screen when restoring the set to its fac­tory settings.
All saved titles will also be deleted.
[1] Start Factory Initialize
[2] Start Factory Initialize for TV (Not used)
[M]/[m] Moves the cursor
[3] Activate the selected cursor
[RETURN] Returns to the top menu of the service mode

Screen 2

It is a screen of the end of initialization.
[RETURN] Returns to the top menu of the service mode

To complete factory initialize, process COLD RESET subsequent­ly.
Please disconnect AC power cord, and connect AC again. Then
press the [

] button to turn the power on, and press the [x] and

?/1

[VOLUME –] buttons simultaneously and hold down (around 5
seconds) to execute COLD RESET.

Remove the AC power cord and insert the AC power cord again.
* Operations in other service menus can also be performed.

Factory Initialize



[1] Start Initialize
[2] Start Initialize for TV

10. Network (Network Test Diagnosis Screen: Ifconfi g)

Network menu for the wired ethernet.

Screen 1: Ifconfi g Test
Operation:

[3] Activate Ifconfi g (Display network setting)
[,] Select ping test
[RETURN] Returns to the top menu of the service mode

Screen 2: Ping Test
Operation:

[<] Select Ifconfi g test
[RETURN] Returns to the top menu of the service mode
(The details of a Ping test are “11. Network (Network Test Diagno­sis Screen: Ping)”)

Screen 3: Ifconfi g Test Active

Display Ifconfi g command results.

Operation:

[3] Ifconfi g retry
[,] Select ping test
[RETURN] Returns to the top menu of the service mode

 Network

Test: Ifconfig Ping

 Network

Test: Ifconfig Ping

Ping To:

[START]

(Screen 1)

(Screen 2)

[RET] Return to Top Menu

Factory Initialize



Reboot to complete.

[RET] Return to Top Menu

HELP: [RET]

(Screen 1)

(Screen 2)

 Network

HELP : [DOWN][ENT][(NUM)]

(Screen 3)

Test: Ifconfig Ping

IP 192. 168. 11. 2 MAC 00-16-01-85-21-A3

HELP : [DOWN][ENT][(NUM)]

HELP : [ENT]: Re/Exe [RIGHT]

22

HBD-E370/E470/E570/E870/T57

11. Network (Network Test Diagnosis Screen: Ping)

Ping test for the wired ethernet.

Screen 1: Ping Test
Operation:

[<] Select Ifconfi g test
[m] Ping execution preparation
[RETURN] Returns to the top menu of the service mode

Screen 2: The IP address of the Ping point is set up
(IP address input mode)

When “Ping to :>” is reversed, the [3] button is pressed and IP is
inputted.

Operation:

[3] Finish to input
[RETURN] Finish to input
[<] Finish to input and Select Ifconfi g Test
[0] to [9] Input Character sting ‘0-9’
[TIME] Input Character sting ‘.’
[CLEAR] Backspace

Screen 3: Ping Test Active

When [START] is reversed, the [

3] button is pressed and execute

ping .

Operation:

3] Activate ping test

[
[M] The IP address of the ping point is set up
[RETURN] Returns to the top menu of the service mode



Network

Ifconfig

(Screen 1)

(Screen 2)

Test:

(Screen 3)

Ping To :



Network

Test: Ifconfig

Ping

[START]

Ping to :> 192. 168. 200. 13



Test: Ifconfig

PING 192. 168. 200. 13 OK!

HELP: [ENT] : Start [UP] [LEFT]

Ping

[ENT] : Release
[RET] : Release

Network

Ping

Ping to : 192. 168. 200. 13

[START]

12. System Information (System Information Display)

This screen displays system information.

Screen 2: Drive Information Menu
Operation:

[<] Basic Information displayed (go to screen 1)
[RETURN] Returns to the top menu of the service mode

When delta IOP is measured, it becomes impossible to use the Ver­sion Up function.

Contents List:

Model
Destination
Sequence Number
MAC
IP
IFCON IFCON Version
Bootloader Bootloader Version
Host Main Host Main Version
Host Sub Host Sub Version
Middleware Middleware Version
ADSP ADSP Version
IF Model
IF Dest

Drive Firm Revision
CD DIOP Delta IOP
DVD DIOP Delta IOP
BD DIOP Delta IOP
CD LD TIME LD Time
DVD LD TIME LD Time
BD LD TIME LD Time

(Screen 1)

 System Information

Model :
Destination :
Sequence Number :
MAC :
IP :
IF-con Block0 Version : Block1 Version :
Bootloader Version :
Host Main Version :
Host Sub Version :
Middleware Version :
ADSP Version :

IF_MODEL :
IF_DEST :

HELP: [RET] [RIGHT]

(Screen 2)

 System Information

Drive Firm Revision :
CD DIOP :
DVD DIOP :
BD DIOP :
CD LD TIME :
DVD LD TIME :
BD LD TIME :

Screen 1: Basic Information
Operation:

[

] Drive information (delta IOP of a drive is measured)

,

displayed (go to screen 2)

[RETURN] Returns to the top menu of the service mode

HELP: [RET] [LEFT]

23

HBD-E370/E470/E570/E870/T57

13. Drive

This menu is used to operate the drive using drive-related diagnos­tic and tools.

Screen 1: Selecting items under *Service Menu

(Screen 1)

Service Menu



[1] Diag
[2] Log
[3] Factory Initialize
[4] Network
[5] Version Up
[6] System Information
[7] EMC Test Mode
[8] Drive

Screen 2: Selecting items under *Drive

(Screen 2)



Drive
[1]Drive OP data Write
[2]Servo Parameter Check Menu
[3]Servo Signal Check Menu
[4]S - Curve Check Menu
[5]Readability Check Menu
[6]OP Position Check Menu
[7]OP Check Menu
[8]Load Eject Aging
[9]Spindle Control Check Menu
[10]FA Test Mode

Screen 3: *Drive OP data Write
Purpose: Write OP data into fl ash IC

[

]/[m] Move the cursor up and down

M

3] Start the selected cursor item

[
[RETURN] Returns to the top menu of the service mode

(Screen 3)

Drive OP data Write



Insert USB StorageDevice ...
Remove DISC and Close tray.
[1]Disc: Eject

[ENT] Start

Screen 4: *Servo Parameter Check Menu (Not Used)

(Screen 4)



Servo Parameter Check Menu
[1] Disc: Eject
[2] Show Parameters

Operation:

[M]/[m] Move the cursor up and down
[3] Open the selected cursor item
[RETURN] Returns to the top menu of the service mode

• Test item list
[1] Drive OP data Write
[2] Servo Parameter Check Menu
[3] Servo Signal Check Menu
[4] S-Curve Check Menu
[5] Readability Check Menu
[6] OP Position Check Menu
[7] OP Check Menu
[8] Load Eject Aging
[9] Spindle Control Check Menu
[10] FA Test Mode

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

Screen 5: *Servo Signal Check Menu (Not Used)

(Screen 5)



Servo Signal Check Menu
[1] Disc: Eject
[2] Servo Signal Monitor out: OFF
[3] RTADJ: OFF
[4] FocusBias: 0000
[5] SA -Act.move: FWD 00 step

[6] Pl Level: 0000
[7] RF Level: 0000
[8] TRV Level: 0000
[9] Current FB: 0000 SA: 0000

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

24

HBD-E370/E470/E570/E870/T57

Screen 6: *S-Curve Check Menu (Not Used)

(Screen 6)



S - Curve Check Menu
[1] Disc: Eject

[2] Media Type: BD - ROM SL
[3] Layer: L0
[4] SLD move to Home
[5] SLD move: FWD 00 step

[6] FCS Search start

Not used for the servicing.
Press the [RETURN] button if having entered this mode

Screen 7: *Readability Check Menu (Not Used)

(Screen 7)



Readability Check Menu
[1] Disc: Eject

[2] Address: 00000000
[3] Length: 0000

[4] Execute
Jitter P: 0000
Jitter PR: 0000
Jitter DC: 0000
SER: 0000 0000

Screen 9: *OP Check Menu
Purpose: Verify OP related such as delta IOP and LD time

[

]/[m] Move the cursor up and down

M

3] Start the selected cursor item

[
[RETURN] Returns to the top menu of the service mode

(Screen 9)



OP Check Menu
Remove DISC and Close tray
[1] Disc Eject
[2] OP Serial: xxxxxxxxxxxxxx
[3] dIOP
BD: x[xx]
DVD: x[xx]
CD: x[xx]
TEMP: xx.x deg
[4] LD ON Time
BD: xxxxh xxm
DVD: xxxxh xxm
CD: xxxxh xxm

Screen 10: *Load Eject Aging (Not Used)

(Screen 10)



Load Eject Aging
[1] Disc: Eject
[2] Repeat set: 00000
[3] Mecha type: Tray mecha
[4] Aging type: Normal

[5] Start

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

Screen 8: *OP Position Check Menu (Not Used)

(Screen 8)



OP Position Check Menu
[1] Disc: Eject

[2] OP Position Check

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

Screen 11: *Spindle Control Check Menu (Not Used)

(Screen 11)



Spindle Control Check Menu
[1] Disc : Eject

[2] rpm: 0000 rpm

[3] Spindle: OFF

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

25

HBD-E370/E470/E570/E870/T57

Screen 12: *FA Mode Test (Not Used)

(Screen 12)



FA Mode Test
[1] Enter Repeat FA mode
Repeat number: 0000

[2] Save FE log to USB

Not used for the servicing.
Press the [RETURN] button if having entered this mode.

CONFIRMATION ITEM

1. Playback Operation Confi rmation
1-1. Test Disc

Part No. Description Layer

J-6090-199-A BLX-104 Single Layer

J-6090-200-A BLX-204 Dual Layer

J-2501-307-A CD (HLX-A1)

J-2501-305-A HLX-513 Single Layer (NTSC)

J-2501-306-A HLX-514 Dual Layer (NTSC)

J-6090-077-A HLX-506 Single Layer (PAL)

J-6090-078-A HLX-507 Dual Layer (PAL)

Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-

989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.

Operation and Display:

1. BLX-104
Procedure:

1. Select 23.976Hz/1080p.

2. Play “4.Motion picture”.

3. Check whether player can play back or not.

4. Check each outputs.
Video:
Composite/S Video/component/HDMI.
Audio:
Speaker out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)

can use instead of 1080/24p.
However this is temporary correspondence.
* When the output of HDMI is 1080p, the signal of Composite/S

Video/Component are not output.
It is necessary to lower the output of HDMI to 1080i or less.

3. CD (HLX-A1)
Procedure:

Check whether player can play back or not.
(Check the sound output)

4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:

1. After displayed Main Menu, select “1.Video Signal”.

2. Play “1.Color bar 100%”.
(Check the picture and sound output)

3. Return to Menu.

4. Play “Demonstration 4:3” or “Demonstration 16:9”.
(Check the picture and sound output)

1-2. Playback operation confi rmation

Confi rm operation in each signal/output mode of test disc (BLX-
104/204) according to the content of the repair.

Note: “AV Sync.” doesn’t operate.

2. Networking Confi rmation

Confi rm it according to the following procedure when you confi rm
the connection of the network.

Note: Do not execute “Network Connection Diagnostics” of “Network

Settings” of the home menu with only the router connected.

Procedure:

1. Connect the router with the set with LAN cable.

2. Turn on the power of the set and the router.

3. Press the [HOME] button on the remote commander, and the
home menu is displayed.

4. Select “Setup” → “Network Settings” → “Internet Settings”,
and press the [3] button on the remote commander.

5. Select “View Networks Status” and press the [3] button on the
remote commander.

6. Confi rm IP address are displayed in “IP Address”, “Subnet
Mask” and “Default Gateway”.

Physical Connection: XXXX

Internet Access: XXXX

IP Address Setting: XXXX

IP Address: XXX.XXX.XXX.XXX

Subnet Mask: XXX.XXX.XXX.XXX

Default Gateway: XXX.XXX.XXX.XXX

DNS Settings: XXXX

Primary DNS: XXX.XXX.XXX.XXX

Secondary DNS: XXX.XXX.XXX.XXX

MAC Address: XXX.XXX.XXX.XXX

2. BLX-204
Procedure:

1. Select 1080i (59.94Hz or 50Hz).

2. Play “4.Motion picture”.

3. Check whether player can play back or not.
(Check the picture and sound output)

26

HBD-E370/E470/E570/E870/T57

HBD-E370/E470/E570/E870/T57

2727

SECTION 4

ELECTRICAL CHECK

FM TUNER LEVEL CHECK

Procedure:

1. Turn on the set.

2. Input the following signal from Signal Generator to FM antenna
input directly.

Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz
Deviation : 75 kHz
Modulation : 1 kHz
ANT input : 35 dBu (EMF)

Note: Use 75 ohm coaxial cable to connect signal generator and the set.

You cannot use video cable for checking.

Use signal generator whose output impedance is 75 ohm.

3. Set to FM tuner function and tune A, B and C signals.

4. Confi rm “TUNED” is lit on the display for A, B and C signals.

When the selected station signal is received in good condition,
“TUNED” is displayed.

signal

generator

set

HBD-E370/E470/E570/E870/T57

HBD-E370/E470/E570/E870/T57

2828

SECTION 5

DIAGRAMS

5-1. BLOCK DIAGRAM - SERVO Section -

X1201
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(Page 31)

(Page 30)

HBD-E370/E470/E570/E870/T57

HBD-E370/E470/E570/E870/T57

2929

5-2. BLOCK DIAGRAM - MEMORY Section -

SD-RAM

IC104

A_RWEB

A_RA0 - A_RA13

A_RDQ0 - A_RDQ15

A_RCSB

BC29
AV2 4

K3
L8

/WE

A_RBA0

BB28

L2

BA0

A_RBA1

AU27

L3

BA1

A_RBA2

AT2 8

L1

BA2

/CS

A_RCASB
A_RRASB

AU23
BB24

L7
K7

/CAS
/RAS

A_RCKE

BA29

K2

CKE

A_RCLK0

BC21

J8

CK

A_RCLK0B

BA21

K8

/CK

A_RDQM1
A_RDQS1

AV1 8
BC17

B3
B7

UDM

UDQS

A_RDQS1B
A_RDQM0

BA17
AT1 8

A8
F3

/UDQS

LDM

A_RODT

AW23

K9

ODT

A_RDQS0

AY1 6

F7

LDQS

A_RDQS0B

BB16

E8

/LDQS

A0 - A12, NC

DQ0 - DQ15

SD-RAM

IC105

A_RDQ16 - A_RDQ31

K3
L8

/WE

L2

BA0

L3

BA1

L1

BA2

/CS

L7
K7

/CAS
/RAS

K2

CKE

A_RCLK1

BA39

J8

CK

A_RCLK1B

BC39

K8

/CK

A_RDQM3
A_RDQS3

AU35
BC35

B3
B7

UDM

UDQS

A_RDQS3B
A_RDQM2

BA35
AV3 4

A8
F3

/UDQS

LDM

K9

ODT

A_RDQS2

BA33

F7

LDQS

A_RDQS2B

BC33

B_RWEB

B_RA0 - B_RA13

B_RDQ0 - B_RDQ15

B_RCSB

AC43
AD42

B_RBA0

AD40

B_RBA1

AD36

B_RBA2

AC39

B_RCASB
B_RRASB

AH40
AJ41

B_RCKE

AC41

B_RCLK0

AL43

B_RCLK0B

AL41

B_RDQM1
B_RDQS1

AM36
AR43

B_RDQS1B
B_RDQM0

AR41
AP38

B_RODT

AG41

B_RDQS0

AT4 0

B_RDQS0B

AT4 2

B_RDQ16 - B_RDQ31

B_RCLK1

N41

B_RCLK1B

N43

B_RDQM3
B_RDQS3

V36
U43

B_RDQS3B
B_RDQM2

U41
V38

B_RDQS2

W41

B_RDQS2B

W43

E8

/LDQS

A0 - A12, NC

DQ0 - DQ15

SD-RAM

IC204

K3

L8

/WE

L2

BA0

L3

BA1

L1

BA2

/CS

L7

K7

/CAS
/RAS

K2

CKE

J8

CK

K8

/CK

B3
B7

UDM

UDQS

A8
F3

/UDQS

LDM

K9

ODT

F7

LDQS

E8

/LDQS

A0 - A12, NC

DQ0 - DQ15

SD-RAM

IC205

K3

L8

/WE

L2

BA0

L3

BA1

L1

BA2

/CS

L7

K7

/CAS
/RAS

K2

CKE

J8

CK

K8

/CK

B3
B7

UDM

UDQS

A8
F3

/UDQS

LDM

K9

ODT

F7

LDQS

E8

/LDQS

A0 - A12, NC

DQ0 - DQ15

NAND FLASH

IC501

BD DECODER

IC101 (2/2)

NFD0 - NFD7

B_RA0 - B_RA13

A_RA0 - A_RA13

A_RA0 ­A_RA13

B_RA0 - B_RA13

NFWEN

G43

18

XWE

NFREN

M36

8

XRE

NFCEN
NFRBN

M38
P38

9
7

XCE

RY/XBY

NFALE
NFCLE

L37
K38

17
16

ALE

CLE

EEPROM

IC1101

SDA

AV1 4

13

I2C_SDA

SCL

AT1 2

12

I2C_SCL

4

RESET

FESFDO

A1

FESFDI

C3

FESFCK
FESFCS

D4
B2

FE_SFDO

E1

FE_SFDI

F2
FE_SFCLK
FE_SFCS#

C1

K6

FE_SRXP

AR1

FE_SRXN

AR3

FE_STXP
FE_STXN

AN1
AP2

STXP_1

BC3

FE_XTAL25MI

AJ3

VCLK25MI

AJ9

FE_RSTI

M6

MRESET_

C35

STXN_1

BA3

SRXP_1
SRXN_1

BC1

BB2

SERIAL FLASH

IC502

SFDO
SFDI

F42
H40

5
2

D
Q

SFCK
SFCS

G41
J39

6
1

C
S

19

XWP

IO1 - IO8

X802

25MHz

XTAL25MO

XTAL25MI

BA9

BB8

X401

27MHz

NS_XTALO

NS_XTALI

C25

A25

VIND5

F14

USB_VBUS_PCONT1

GPIO3

B18

USB_VBUS_PCONT2

LCDRD

G33

VDATA

B34

VCLK

A35

GPIO2

C19

GPIO1

A17

GPIO0

C17

IF_SDI

IF_SDO

OPWRSB

F34

FE_EJECT#

AH4

OPWRSB

FE_EJECT

IF_SCK
XIF_CS

IF_START_BIT

SYSCON_REQ

GPIO6

AV1 2

UPG_STATUS

TEMP

RESET_

SYSCON_RST
CPU_PRERST

E35

CORE_RESETB

AP4

TH1501

D

C

7

HOLD

(Page 32)

(Page 30)

HBD-E370/E470/E570/E870/T57

HBD-E370/E470/E570/E870/T57

3030

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(Page 29)

(Page 28)

(Page 31)

(Page 31)