Sony DSJ-303 Service manual
D-SJ303
SERVICE MANUAL
Ver. 1.1 2005. 03
SPECIFICATIONS
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength : λ = 780 nm
Emission duration : Continuous
Laser output : Less than 44.6 mW
(This output is the value measured at a distance of 200 mm from
the objective lens surface on the optical pick-up block with 7
mm aperture.)
D-A conversion
1-bit quartz time-axis control
Frequency response
40 - 20 000Hz dB (measured by JEITA CP-307)
Output (at 4.5 V input level)
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW at 16 Ω
Power requirements
For the area code of the model you purchased, check the upper
left side of the bar code on the package.
• Sony NH-WM2AA rechargeable batteries: 2.4 V DC
• Two LR6 (size AA) batteries: 3 V DC
• AC power adaptor (DC IN 4.5 V jack): 120 V, 60 Hz
US Model
Canadian Model
Model Name Using Similar Mechanism D-SJ301
CD Mechanism Type CDM-3125ER
Optical Pick-up Type DAX-25E
Battery life* (approx. hours)
(When you use the CD player on a flat and stable surface.)
Playing time varies depending on how the CD player is used.
When using G-PROTECTION function
12
NH-WM2AA 30 32
(charged for about 5 hours**)
Two Sony alkaline 47 50
batteries LR6(SG)
(produced in Japan)
* Measured value by the standard of JEITA (Japan Electronics and
Information Technology Industries Association).
** Charging time varies depending on how the rechargeable battery is
used.
Operating temperature
5°C - 35°C (41°F - 95°F)
Dimensions (w/h/d) (excluding projecting parts and controls)
Approx. 133.9 x 38.1 x 147.5 mm
(5 3⁄8 x 1 1⁄2 x 5 7⁄8 in.)
Mass (excluding accessories)
Approx. 360 g (12.7 oz.)
Design and specifications are subject to change without notice.
9-879-364-02
2005C02-1
© 2005.03
Accessories
Supplied accessories
Headphones (1)
Hand strap (1)
PORTABLE CD PLAYER
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
D-SJ303
Ver. 1.1
TABLE OF CONTENTS
DANGER
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Specifications ............................................................................ 1
1. SERVICING NOTE ................................................... 3
2. GENERAL ................................................................... 3
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 4
3-2. “Lid Upper”, Cabinet (Front) .......................................... 4
3-3. MD Assy, Main Board ..................................................... 4
3-4. “Motor Assy , Turn Table (Spindle) (M901)” ................. 5
3-5. “Motor Assy (Sled) (M902)”,
Optical Pick-Up (DAX-25E) ........................................... 5
4. ELECTRICAL ADJUSTMENT ............................. 6
5. DIAGRAMS
5-1. IC Pin Function Description ............................................ 7
5-2. Block Diagrams ............................................................... 11
5-3. Printed Wiring Boards – Main Section (1/2) –................ 12
5-4. Printed Wiring Boards – Main Section (2/2) –................ 13
5-5. Schematic Diagram – Main Board (1/3) – ...................... 14
5-6. Schematic Diagram – Main Board (2/3) – ...................... 15
5-7. Schematic Diagram – Main Board (3/3) – ...................... 16
6. EXPLODED VIEWS
6-1. Upper Lid Section ........................................................... 18
6-2. Cabinet Section................................................................ 19
6-3. Optical Pick-Up Section (CDM-3125ER) ....................... 20
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PA RTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
7. ELECTRICAL PARTS LIST .................................. 21
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
2
SECTION 1
SERVICING NOTE
D-SJ303
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the “Optical
Pick-Up Block Checking Procedures” (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
• FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
• RF signal P-to-P value: 0.45 to 0.65 Vp-p
SECTION 2
GENERAL
Laser Diode Checking Methods
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper panel is closed while turning
ON the S801 (push switch type).
The following two checking methods for the laser diode are operable.
Method :
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the S801 as shown in Fig. 1 .
3. Check the object lens for confirming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up. During normal
operation, the laser diode is turned ON about 2.5 seconds for
focus searching.
S801
Fig.1 Method to push S801
This section is extracted
from instruction manual.LOCATING THE CONTROLS
CD player (front)
1 HOLD switch
2 3-way control key
3 VOL (volume)
control
4 DC IN 4.5 V
(external power
input) jack
5 Display
3-way control key
N/>: Play/AMS/search
6 PLAY MODE button
7 REPEAT/ENTER button
8 SOUND button
9 i (headphones)
jack
q; Buckle
CD player (inside)
Pushtoward
N/> OR
..
Pressx /CHG.
.: AMS/search
x/CHG: stop/charge
qa G-PROTECTION
switch
qs Battery
compartment
3
D-SJ303
SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
SET
3-2. “LID, UPPER”, CABINET
(FRONT) (Page 4)
Note: Follow the disassembly procedure in the numerical order given.
3-2. “LID, UPPER”, CABINET (FRONT)
4
five screws (B2)
3-3. MD ASSY, MAIN BOARD
(Page 4)
3-4. “MOTOR ASSY, TURN TABLE
(SPINDLE) (M901)’’
(Page 5)
3-5. “MOTOR ASSY (SLED) (M902)’’,
OPTICAL PICK-UP (DAX-25E)
(Page 5)
cabinet (front)
1
open the buckle sub assy
3-3. MD ASSY, MAIN BOARD
5
3
CN502 (white)
2
screw
3
cabinet (lower) sub assy
1
6
flexible cable (24P)
MD assy
2
CN503 (black)
lid, upper
2
screw
• Note ON DURING ASSEMBLY
Align RV301 and Lever (VOL) (B).
4
level (vol) (B)
RV301
4
main board
5
cabinet (lower) sub assy
3-4. “MOTOR ASSY, TURN TABLE (SPINDLE) (M901)”
2
motor assy, turn table
(spindle) (M901)
1
three screws (B1.7)
chassis
D-SJ303
3-5. “MOTOR ASSY (SLED) (M902)”, OPTICAL PICK-UP (DAX-25E)
screw (B 1.7)
1
cover, gear
gear (B)
motor assy (sled) (M902)
3
6
screw feed assy
2
5
chassis
4
screw
(P 1.4x3.5)
retainer, shaft
optical pick-up
(DAX-25E)
5
D-SJ303
)
C632
L606
3
4
4
91
120
SECTION 4
ELECTRICAL ADJUSTMENTS
The CD section adjustments are done automatically in this set.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement :DC4.5 V in DC IN jack.
(J401)
VOLUME button : Minimum
HOLD switch : OFF
Focus bias Check
Condition:
• Hold the set in horizontal state.
Connection:
oscilloscope
(AC range)
TP630(RF)
[MAIN BOARD] (SIDE B)
D
R6
R4R
IC601
31
R641
607
613
C608
X601
C613
R625
C627
60
R616
90
61
R602
R6
C601
R601
C602
C619
C618
R623
R622
R621
R619
C615
R618
11
2
R620
TAP403
C617
C630
C616
R624
C620
R627
R632
C631
C629
R633
R631
TP630(RF)
R637
R635
Procedure:
1. Connect the oscilloscope to the test point TP630(RF) on the
MAIN board.
2. Set a disc. (YEDS-18)
3. Press the >B button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10 : 1 probe in use
TIME/DIV : 500ns
RF level
0.4 to 0.65 Vp-p
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
watch-ing.
5. Stop revolving of the disc motor by pressing the x button.
6
SECTION 5
DIAGRAMS
5-1. IC PIN FUNCTION DESCRIPTION
• IC601 CXD3029R (SYSTEM CONTROL)
Pin No. Pin name I/O Description
1 XRAM O DRAM low address strobe signal outut
2XWE O DRAM data input enable signal output
3 to 6 D0 to 3 I/O DRAM data bus 0 to 3
7 DCLK O Not used (OPEN)
8 DCKE O Not used (OPEN)
9 XCAS O DRAM column address storobe signal output
10 WFCK O Not used (OPEN)
11 to 13 A7 to 9 O DRAM address 7 to 9
14 DVss – Ground terminal for DRAM interface
15 to 17 A4 to 6 O DRAM addres 4 to 6
18 XRDE I/O Not used (OPEN)
19 VDD0 – Power supply for digital
20 CLOCK I Serial data transfer clock input
21 SDTO I Serial data input
22 SENS O SENS output
23 XLAT I Latch input
24 XSOE I CPU serial data output enable signal input
25 SYSM I Mute input “H” : MUTE
26 WDCK O Word clock output
27 SCOR O SCOR output
28 XRST I Reset terminal
29 PWMI I Spindle moter external control input
30 XQOK I/O Not used (OPEN)
31 XWRE I/O Not used (Fixed at “L”)
32 R4M O System clock output
33 Vss0 – Digital ground terminal
34 SQCK I Not used (Fixed at “H”)
35 SCLK I Not used (Fixed at “H”)
36 SQSO O Not used (OPEN)
37 XEMP O Not used (OPEN)
38 XWIH O Not used (OPEN)
39 SBSO O Not used (OPEN)
40 EXCK I Not used (Fixed at “L”)
41 XTSL I Not used (Fixed at “L”)
42 HVss – Ground terminal for headphones
43 HPL O Not used (OPEN)
44 HPR O Not used (OPEN)
45 HVDD – Power supply terminal for headphones
46 XVDD – Power supply terminal for master clock
47 XTAI I Master clock input (169MHz)
48 XTAO O Master clock output (169MHz)
49 XVss – Ground terminal for master clock
50 AVDD1 – Power supply terminal for DAC block
51 AOUT1 O Audio out (L-CH)
52 VREFL O VREF terminal (L-CH)
53 AVss1 – Ground terminal DAC block
54 AVss2 – Ground terminal DAC block
D-SJ303
7
D-SJ303
Pin No Pin name I/O Description
55 VREFR O VREF terminal(R-CH)
56 AOUT2 O Audio out (R-CH)
57 AVDD2 – Power supply terminal for DAC block
58 TEST1 I Not used (Fixed at “L”)
59 TEST I Not used (Fixed at “L”)
60 Vss1 – Not used (Fixed at “L”)
61 LRMU O OR output of L-CH/R-CH detection flag (AND output) and system flag
62 DOUT O Not used (OPEN)
63 ATSK I/O Not used (OPEN)
64 DFCT I/O Not used (OPEN)
65 FOK I/O Focus OK signal I/O teminal
66 MIRR I/O Not used (OPEN)
67 COUT I/O Not used (OPEN)
68 C2PO O Not used (OPEN)
69 GFS O Not used (OPEN)
70 XUGF O Not used (OPEN)
71 XPCK O Not used (OPEN)
72 VDD1 – Power supply terminal for digital
73 PCO O Charge pump output for master PLL
74 FILI I Filter input for master PLL
75 FILO O Filter output for master PLL
76 CLTV I VC01 contorol voltage input
77 VCTL I VC02 contorol voltage input for wide range EFM PLL
78 VPCO O Charge pump output for wide range EFM PLL
79 AVDD 3 – Ground terminal for analog (servo block)
80 ASYO O EMF fullswing output
81 ASYI I Asymmetric comparate voltage input
82 BIAS I Asymmetric circuit current constrant input
83 AVDD3 – Power supply terminal for analog (servo block)
84 RFAC I EFM signal input
85 AVDD0 – Power supply terminal for analog (servo block)
86 IGEN I Current constant input for OP amplifier
87 AVss0 – Ground terminal for analog (servo block)
88 RFDC I RF signal input
89 CE I E signal input
90 TE I F signal input
91 SE I B signal input
92 FE I A signal input
93 VC I Center voltage input
94 Vss2 – Digital ground terminal
95 FRDR O Focus drive output
96 FFDR O Focus drive output
97 TRDR O Traking drive output
98 TFDR O Traking drive output
99 SRDR O Sled drive output
100 SFDR O Sled drive output
101 SSTP I Most inside disc detection signal input (Fixed at “L”)
102 MDS O Spindle drive output
103 MDP O Servo contorol output for spindle moter
104 C176 O 17644kHz output
8
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