Sony DSJ-301 Service manual
D-SJ301
SERVICE MANUAL
Ver 1.2 2004. 04
SPECIFICATIONS
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength : λ = 780 nm
Emission duration : Continuous
Laser output : Less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the objective lens surface on
the optical pick-up block with 7 mm aperture.)
D-A conversion
1-bit quartz time-axis control
Frequency response
40 - 20 000 Hz
Output (at 4.5 V input level)
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW at 16 Ω
Power requirements
For the area code of the model you purchased,
check the upper left side of the bar code on the
package.
• Sony NH-WM2AA rechargeable batteries:
2.4 V DC
• Two LR6 (size AA) batteries: 3 V DC
• AC power adaptor (DC IN 4.5 V jack):
US, CND model:120 V, 60 Hz
AEP, FR, E model: 220 - 230 V, 50/60 Hz
UK model: 230-240V, 50Hz
AUS model: 240 V, 50 Hz
+
0
dB (measured by JEITA CP-307)
-4.5
Battery life* (approx. hours)
(When you use the CD player on a flat and stable surface.)
Playing time varies depending on how the CD player is
used.
When using G-PROTECTION function
NH-WM2AA 30 32
(charged for
about 5 hours**)
Two Sony alkaline 47 50
batteries LR6(SG)
(produced in Japan)
* Measured value by the standard of JEITA (Japan
Electronics and Information Technology
Industries Association).
** Charging time varies depending on how the
rechargeable battery is used.
Operating temperature
5°C - 35°C (41°F - 95°F)
Dimensions (w/h/d) (excluding projecting
parts and controls)
Approx. 133.9 × 38.1 × 147.5 mm
(5 3 ⁄ 8 × 1 1⁄
Mass (excluding accessories)
Approx. 305 g (10.8 oz.)
Design and specifications are subject to change
without notice.
× 5
2
7
⁄ 8 in.)
Model Name Using Similar Mechanism D-E350
CD Mechanism Type CDM-3125ER
Optical Pick-up Type DAX-25E
1 2
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Accessories
Supplied accessories
For the area code of the location in which you
purchased the CD player, check the upper left
side of the bar code on the package.
AC power adaptor (1)
Headphones (1)
Hand strap (1)
• Abbreviation
CND : Canadian
AUS : Australian
FR : French
9-873-647-03
2004D02-1
© 2004.04
PORTABLE CD PLAYER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
D-SJ301
TABLE OF CONTENTS
DANGER
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.
CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable of emitting
radiation exceeding the limit for Class 1.
This Compact Disc player is
classified as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on
the rear exterior.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
Specifications ............................................................................ 1
1. SERVICING NOTES................................................... 3
2. GENERAL
Locating the Controls......................................................... 3
3. DISASSEMBLY
3-1. “Lid, Upper”, Cabinet (Front) .................................... 4
3-2. MD ASSY, Main Board ............................................. 4
3-3. “Motor ASSY, Turn Table (Spindle) (M901)”............ 5
3-4. “Motor ASSY (Sled) (M902)”,
Optical Pick-up (DAX-25E) ...................................... 5
4. ELECTRICAL ADJUSTMENS ............................... 6
5. DIAGRAMS
5-1. Explanation of IC Terminals....................................... 7
5-2. Block Diagram...........................................................11
5-3. Printed Wiring Boards –MAIN SECTION (1/2)–.... 12
5-4. Printed Wiring Boards –MAIN SECTION (2/2)–.... 13
5-5. Schematic Diagram –MAIN SECTION (1/3)– ....... 14
5-6. Schematic Diagram –MAIN SECTION (2/3)– ....... 15
5-7. Schematic Diagram –MAIN SECTION (3/3)– ....... 16
5-8. IC Block Diagram..................................................... 17
6. EXPLODED VIEWS
6-1. Upper Lid Section..................................................... 18
6-2. Cabinet Section......................................................... 19
6-3. Optical pick-up Section (CDM-3125ER) ................. 20
7. ELECTRICAL PARTS LIST................................... 21
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT .
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
À LA SÉCURITÉ!
2
SECTION 1
SERVICING NOTES
D-SJ301
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the charged
electrostatic load, etc. on clothing and the human body. During repair,
pay attention to electrostatic breakdown and also use the procedure in
the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the
disc reflective surface by the objective lens in the optical pick-up block.
Therefore, when checking the laser diode emission, observe from more
than 30cm away from the objective lens.
Before Replacing the Optical pick-up Block
Please be sure to check thoroughly the parameters as per the “Optical
pick-up Block Checking Procedure” (Part No. : 9-960-027-11) issued
separately before replacing the optical Pick-up block.
Note and specifications required to check are given below.
• FOK output : IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
• RF signal P-to-P value : 0.4 to 0.65Vp-p
Laser Diode Checking Methods
During normal operation of the equipment, emission of the laser diode
is prohibited unless the upper panel is closed while turning ON the S801
(push switch type).
The following two checking methods for the laser diode are operable.
Method :
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the S801 as shown in Fig. 1 .
3. Check the object lens for confirming normal emission of the laser
diode. If not emitting, there is a trouble in the automatic power
control circuit or the optical pick-up. During normal operation, the
laser diode is turned ON about 2.5 seconds for focus searching.
S801
LOCA TING THE CONTROLS
CD player (front)
1 HOLD switch
2 3-way control key
3 VOL (volume)
control
4 DC IN 4.5 V
(external power
input) jack
Fig.1 Method to push S801
SECTION 2
GENERAL
6 PLAYMODE button
7 REPEAT/ENTER button
8 SOUND button
9 i (headphones)
jack
This section is extracted from
instruction manual.
5 Display
3-way control key
Pushtoward
N/> OR
..
Pressx /CHG.
N/>: Play/AMS/search
.: AMS/search
x/CHG: stop/charge
q; Buckle
CD player (inside)
qa G-PROTECTION
switch
qs Battery
compartment
3
D-SJ301
DISASSEMBLY
z
The equipment can be removed using the following procedure.
SECTION 3
MD ASSY “Moter ASSY, turn table (spindle) (M901)”
“Moter ASSY (Sled) (M902)”, Optical pick-up (DAX-25E),
Set
“Lid, Upper”,
Cabinet (front)
Main board
Note : Follow the disassembly procedure in the numerical order given.
3-1. “LID, UPPER”, CABINET (FRONT)
3 Five screws (B2)
1 Screws
4
Cabinet (front)
Lid, upper
2
3-2. MD ASSY, MAIN BOARD
Cabinet (lower) sub ASSY
3 CN502 (white)
RV301
4
1
1 Screws
5 Flexible cable (24P)
MD ASSY
2 CN503 (black)
Main board
• Note ON DURING ASSEMBLY
Align RV301 and Lever (VOL) (B).
4
LEVER (VOL) (B)
5
Cabinet (lower) sub ASSY
3-3. “MO TOR ASSY, TURN T ABLE
e
(SPINDLE) (M901)”
D-SJ301
1 Three screws
(B1.7x5)
Motor ASSY, Turn tabl
(Spindle) (M901)
2
3-4. “MO TOR ASSY (SLED) (M902)”,
OPTICAL PICK-UP (DAX-25E)
Screw ASSY, Feed
Cover, Gear
5
Chassis
2
1 Screw (B 1.7x5)
Gear B
Motor ASSY (Sled) (M902)
3
4 Screw
(P 1.4x3.5)
Bracket (Shaft)
Optical pick-up
6
Chassis
(DAX-25E)
5
D-SJ301
p
C632
L606
3
4
4R4
91
120
SECTION 4
ELECTRICAL ADJUSTMENTS
The CD section adjustments are done automatically in this set.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC4.5 V in DC IN jack.
(J401)
VOLUME button : Minimum
HOLD switch : OFF
Focus bias Check
Condition:
• Hold the set in horizontal state.
Connection:
oscilloscope
(AC range)
TP630(RF)
[MAIN BOARD] (SIDE B)
D
R6
R
IC601
R641
607
613
31
C608
X601
R625
C627
C613
60
R616
90
61
R602
R6
C601
R601
C602
C619
C618
R623
R622
R621
R619
C615
R618
11
2
R620
TAP403
C617
C630
C616
R624
C620
R627
R632
C631
C629
R633
R631
TP630(RF)
R637
R635
Procedure:
1. Connect the oscilloscope to the test point TP630(RF) on the
MAIN board.
2. Set a disc. (YEDS-18)
3. Press the >B button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10 : 1 probe in use)
TIME/DIV : 500ns
RF level
0.4 to 0.65 Vp-
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
watch-ing.
5. Stop revolving of the disc motor by pressing the x button.
6
SECTION 5
DIAGRAMS
5-1. EXPLANATION OF IC TERMINALS
IC601 CXD3029R (SYSTEM CONTROL)
Pin No. Pin name I/O Description
1 XRAM O DRAM low address strobe signal outut.
2 XWE O DRAM data input enable signal output.
3 to 6 D0 to 3 I/O DRAM data bus 0-3.
7 DCLK O Not used (OPEN).
8 DCKE O Not used (OPEN).
9 XCAS O DRAM column address storobe signal output.
10 WFCK O Not used (OPEN).
11 to 13 A7 to 9 O DRAM address 7 – 9.
14 DVss – Ground terminal for DRAM interface.
15 to 17 A4 to 6 O DRAM addres 4 – 6.
18 XRDE I/O Not used (OPEN).
19 VDD0–Power supply for digital.
20 CLOCK I Serial data transfer clock input.
21 SDTO I Serial data input.
22 SENS O SENS output.
23 XLAT I Latch input.
24 XSOE I CPU serial data output enable signal input.
25 SYSM I Mute input. “H” : MUTE
26 WDCK O Word clock output.
27 SCOR O SCOR output.
28 XRST I Reset terminal.
29 PWMI I Spindle moter external control input.
30 XQOK I/O Not used (OPEN).
31 XWRE I/O Not used (Fixed at “L”).
32 R4M O System clock output.
33 Vss0 – Digital ground terminal.
34 SQCK I Not used (Fixed at “H”).
35 SCLK I Not used (Fixed at “H”).
36 SQSO O Not used (OPEN).
37 XEMP O Not used (OPEN).
38 XWIH O Not used (OPEN).
39 SBSO O Not used (OPEN).
40 EXCK I Not used (Fixed at “L”).
41 XTSL I Not used (Fixed at “L”).
42 HVss – Ground terminal for headphones.
43 HPL O Not used (OPEN).
44 HPR O Not used (OPEN).
45 HVDD – Power supply terminal for headphones.
46 XVDD – Power supply terminal for master clock.
47 XTAI I Master clock input (16.9MHz).
48 XTAO O Master clock output (16.9MHz).
49 XVss – Ground terminal for master clock.
50 AVDD1–Power supply terminal for DAC block.
51 AOUT1 O Audio out (L-CH).
52 VREFL O VREF terminal (L-CH).
53 AVss1 – Ground terminal DAC block.
54 AVss2 – Ground terminal DAC block.
D-SJ301
7
D-SJ301
Pin No. Pin name I/O Description
55 VREFR O VREF terminal(R-CH).
56 AOUT2 O Audio out (R-CH).
57 AVDD2–Power supply terminal for DAC block.
58 TEST1 I Not used (Fixed at “L”).
59 TEST I Not used (Fixed at “L”)..
60 Vss1 – Not used (Fixed at “L”).
61 LRMU O OR output of L-CH/R-CH detection flag (AND output) and system flag.
62 DOUT O Not used (OPEN)
63 ATSK I/O Not used (OPEN).
64 DFCT I/O Not used (OPEN).
65 FOK I/O Focus OK signal I/O teminal.
66 MIRR I/O Not used (OPEN).
67 COUT I/O Not used (OPEN).
68 C2PO O Not used (OPEN).
69 GFS O Not used (OPEN).
70 XUGF O Not used (OPEN).
71 XPCK O Not used (OPEN).
72 VDD1–Power supply terminal for digital.
73 PCO O Charge pump output for master PLL.
74 FILI I Filter input for master PLL.
75 FILO O Filter output for master PLL.
76 CLTV I VC01 contorol voltage input.
77 VCTL I VC02 contorol voltage input for wide range EFM PLL.
78 VPCO O Charge pump output for wide range EFM PLL.
79 AVDD 3–Ground terminal for analog (servo block).
80 ASYO O EMF fullswing output.
81 ASYI I Asymmetric comparate voltage input.
82 BIAS I Asymmetric circuit current constrant input.
83 AVDD3–Power supply terminal for analog (servo block).
84 RFAC I EFM signal input.
85 AVDD0–Power supply terminal for analog (servo block).
86 IGEN I Current constant input for OP amplifier.
87 AVss0 – Ground terminal for analog (servo block).
88 RFDC I RF signal input.
89 CE I E signal input.
90 TE I F signal input.
91 SE I B signal input.
92 FE I A signal input.
93 VC I Center voltage input.
94 Vss2 – Digital ground terminal.
95 FRDR O Focus drive output.
96 FFDR O Focus drive output.
97 TRDR O Traking drive output.
98 TFDR O Traking drive output.
99 SRDR O Sled drive output.
100 SFDR O Sled drive output.
101 SSTP I Most inside disc detection signal input (Fixed at “L”).
102 MDS O Spindle drive output.
103 MDP O Servo contorol output for spindle moter.
104 C176 O 176.44kHz output.
8
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