•For ADJUSTMENTS (SECTION 6), refer to SERVICE MANUAL, ADJ (9-876-856-51).
•For INSTRUCTION MANUAL, refer to SERVICE MANUAL, LEVEL 1 (9-876-856-41).
• This service manual contains information for Japanese model as well.
• Reference No. search on printed wiring boards is available.
•Table for Differences of Function of Each Model
• Note in Lens Frame Installation
•Method for Copying or Erasing the Data in Internal Memory.
• Exchange Method of Barrier Assy
On the CH-168 and SY-001 boards
This service manual procides the information that is premised the
circuit board replacement service and not intended repair inside the
CH-168 and SY-001 boards.
Therefore, schematic diagram, printed wiring board and electrical
parts list of the CH-168 and SY-001 boards are not shown.
The following pages are not shown.
Schematic diagrams.................. Pages 4-11 to 4-30
Printed wiring boards ................ Pages 4-39 to 4-42
Waveforms ................................ Pages 4-45 and 4-46
Mounted parts location.............. Pages 4-48
Electrical parts list ..................... Pages 5-7 and 5-9 to 5-12
FRAME SCHEMATIC DIAGRAM
FRAME SCHEMATIC DIAGRAM
SCHEMATIC DIAGRAMS
SCHEMATIC DIAGRAMS
REPAIR PARTS LIST
REPAIR PARTS LIST
DIGITAL STILL CAMERA
The above-described information is shown in service manual Level 3.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY .
•Abbreviation
AR : Argentine model
AUS: Australian model
BR : Brazilian model
CH : Chinese model
CND: Canadian model
HK : Hong Kong model
J: Japanese model
JE : Tourist model
KR : Korea model
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
1.Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4.Look for parts which, through functioning, sho w obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5.Check the B+ voltage to see it is at the values specified.
6.FLEXIBLE Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
DSC-W5/W7/W15/W17
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
— 3 —
TABLE OF CONTENTS
SectionTitlePageSectionTitlePage
1.SERVICE NOTE
1-1. Note for Repair ································································1-1
1-2. Discharging of The SY-001 Board’s Charging Capacitor
(C901)··············································································1-1
1-3. Note in Lens Frame Installation ······································1-2
1-4. Description on Self-diagnosis Display ····························1-2
1-5. Method for Copying or Erasing the Data in Internal
Memory ··········································································· 1-3
1-6. Process After Fixing Flash Error·····································1-4
2.DISASSEMBLY
2-1. Disassembly·····································································2-1
2-2. SY-001 Board Service Position ·······································2-3
2-3. Exchange Method of Barrier Assy ··································2-5
2-3-1.Peel Off Old Ornamental Ring A ····································2-5
2-3-2.Remove Old Barrier Assy················································ 2-6
2-3-3.Install New Barrier Assy ·················································2-6
2-3-4.Adhere the Ornamental Ring A·······································2-7
2-4. Circuit Boards Location ··················································2-8
4-5. Mounted Parts Location ················································4-47
5.REPAIR PARTS LIST
5-1. Exploded Vie ws ·······························································5-2
5-1-1.Overall Assembly ···························································5-2
5-1-2.Cabinet (Front) Block······················································5-3
5-1-3.Main Block Assembly ·····················································5-4
5-1-4.Lens Block Assembly······················································5-5
5-2. Electrical Parts List ·························································5-6
DSC-W5/W7/W15/W17
— 4 —
1-1. NOTE FOR REPAIR
When installing a connector, don’t press down at wire of connector.
It is possible that a wire is snapped.
1. SERVICE NOTE
Make sure that the flat cable and flexible board are not cracked of
bent at the terminal.
Do not insert the cable insufficiently nor crookedly.
Cut and remove the part of gilt
which comes off at the point.
(Be careful or some
pieces of gilt may be left inside)
When remove a connector, don’t pull at wire of connector.
It is possible that a wire is snapped.
1-2. DISCHARGING OF THE SY-001
BOARD’S CHARGING CAPACITOR
(C901)
The charging capacitor (C901) of SY-001 board is charged up to
the maximum 300 V potential.
There is a danger of electric shock by this high voltage when the
capacitor is handled by hand. The electric shock is caused by the
charged voltage which is kept without discharging when the main
power of the unit is simply turned off. Therefore, the remaining
voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of a
resistor of 1 kΩ /1 W (1-215-869-11).
Wrap insulating tape fully around the leads of the resistor to prevent
electrical shock.
1 kΩ/1 W
Wrap insulating tape.
Discharging the Capacitor
Short-circuit between the positive and the negative terminals of
charged capacitor with the short jig about 10 seconds.
R:1 kΩ/1 W
(Part code:
1-215-869-11)
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1-1
1-3. NOTE IN LENS FRAME INSTALLATION
When tightening a screw, have both sides of the lens block assembly so as not for the load to depend.
P2 tapping screw
Lens block assembly
Lens frame
assembly
1-4. DESCRIPTION ON SELF-DIAGNOSIS DISPLAY
Self-diagnosis display
• C: ss: ss
You can reverse the camera
malfunction yourself. (However,
contact your Sony dealer or local
authorized Sony service facility
when you cannot recover from the
camera malfunction.)
• E: ss: ss
Contact your Sony dealer or local
authorized Sony service facility.
Display Code
C:32:ss
C:13:ss
E:61:ss
E:91:ss
E:92:ssNote: After repair, be sure to perfom “1-6. PROCESS AFTER FIXING FLASH ERROR”.
Turn the power off and on again.
Format the “Memory Stick” or internal
memory.
Insert a new “Memory Stick”.“Memory Stick” is broken.
Turn the power off and on again.Trouble with internal memory.INTERNAL MEMORY ERROR
Checking of lens drive circuit.
Checking of flash unit or replacement
of flash unit. (Note)
Insert batteries correctly.
Countermeasure
Trouble with hardware.
“Memory Stick” or internal memory is
unformatted.
When failed in the focus and zoom
initialization.
Abnormality when flash is being
charged.
Batteries are not inserted correctly.
Cause
Caution Display During Error
SYSTEM ERROR
FORMAT ERROR
MEMORY STICK ERROR
—
DSC-W5/W7/W15/W17
1-2
1-5. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
p
The data can be copied/erased by the operations on the Setup screen. (When erasing the data, execute formatting the internal memory.)
Note: 1 When replacing the SY-001 board, erase the data in internal memory of the board before replacement.
Note: 2 When replacing the SY-001 board or the IC381 on the SY-001 board, execute formatting and initialize the internal memory after
replacement.
Method for Copying the Data in Internal Memory
Copy
Copies all images in the internal memory to a “Memory Stick”.
OK
Cancel
1 Insert a “Memory Stick” having 32 MB or larger capacity.
2 Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be copied Ready?” appears.
3 Select [OK] with v, then z.
Copying starts.
Copying
102_COPY
• Use fully charged Nickel-Metal Hydride batteries or the AC Adaptor (not supplied). If you attempt to
copy image files using batteries with little remaining charge, the batteries may run out, causing copying to
fail or possibly corrupting the data.
• You cannot copy individual images.
• The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick” after copying, then execute the [Format] command in
Internal Memory Tool).
• You cannot select a folder copied on a “Memory Stick”.
• A(Print order) mark added to an image is deleted when you copy data.
See the following procedure.
Cancels the copying.
Method for Formatting the Internal Memory
Format
Formats the internal memory.
• Note that formatting irrevocably erases all data in the internal memory, including even protected images.
OK
Cancel
1 Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be erased Ready?” appears.
2 Select [OK] with v, then press z.
The format is com
lete.
See the following procedure.
Cancels the formatting.
DSC-W5/W7/W15/W17
1-3
1-6. PROCESS AFTER FIXING FLASH ERROR
When “FLASH error” (Self-diagnosis Code E : 91 : ** ) occurs, to prevent any abnormal situation caused by high voltage, setting of the
flash is changed automatically to disabling charge and flash setting.
After fixing, this setting needs to be deactivated. Flash error code can be initialized by the operations on the Setup screen.
Method for Initializing the Flash Error Code
Initialize
Initializes the setting to the default setting.
OK
Cancel
1 Select [OK] with v on the control button, then press z.
The message “Initialize all settings Ready?” appears.
2 Select [OK] with v, then press z.
The settings are reset to the default setting.
• Make sure that the power is not disconnected during resetting.
See the following procedure.
Cancels the resetting.
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1-4E
2. DISASSEMBLY
The following flow chart shows the disassembly procedure.
2-1. DISASSEMBLY
R:1 kΩ/1 W
(Part code:
1-215-869-11)
qs
9
1
3
9
4
1
1
2
1 P2 torasuta screw (M1.7)
2 Claw
x1
x4
3 Cabinet (rear) block assembly
4 Screw (M1.7)
x2
5 SW-001 board
6 Flexible board x2: CN451, 452
qa
0
6
8
7
5
7 Claw
x1
8 BT side cabinet (C)
9 Claw
x3
0 SP sheet
qa Connector: CN601
qs D901, LCD901
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two
points with the short jig about 10
seconds.
3
2
1
1 Screw (M1.7)
2 LCD frame
3 Terminal guard
4 Fuse label
5 Remove the control switch block.
x2
5
0
7
6
9
8
4
6 Connector: CN753
7 Control switch block
8 Connector x2:
CN801, 802
9 Remove the cabinet (front) block.
0 Cabinet (front) block
DSC-W5/W7/W15/W17
1
2
2
1 Ornamental ring A
2 Tapping screw
x2
3 Barrier assy
3
Note: When you exchange rings, be sure
to follow the procedure carried on
4
"2-3. Exchange Method of Barrier
Assy" (2-5 page).
2-12-2
1
3
1 Connector: CN001
2 Battery holder
x2
3 Connector
: CN201, 401
4 Lens block
2-2. SY-001 BOARD SERVICE POSITION
Connection cord (DK-2AA)
(1-830-351-11)
qs
9
1
3
1
9
4
1
2
qa
SW-001
0
6
5
8
7
FFC-051
Batery holder
AC power
adaptor
Control switch block
AC IN
SY-001 board
0
7
5
6
9
8
A/V cable (Note)
D901, LCD901
3
2
(Note)
1
DSC-W5/W7/W15/W17
Lens block
4
Color monitor
Note: If the A/V cable is connected to the AV OUT (MONO) jack
of SY-001 board, the image can not appear on the LCD
screen.
If you want to confirm the circuit of LCD drive or LCD,
disconnect the A/V cable.
Torque driver
Soldering iron
Weight about 60g
Adhesive (Super X) (Note)
Note: Use adhesive (Super X) or an equivalent article.
Don’t use what becomes white after drying like a quick-drying glue.
1
2
3
2-3-1. PEEL OFF OLD ORNAMENTAL RING A
The Ornamental Ring A has adhered to the Barrier Assy strongly and accordingly, use a soldering iron to weaken the adhesive force.
Heat four circled portions with the soldering iron.
Heating temperature is about 300ºC.
Beware of a burn since the entire Ornamental Ring becomes hot.
* As the adhesive force of Ornamental Ring A is considerably large, the forced peeling will damage the group-1 frame.
Insert the tip of tweezers, etc. into a notch of the group-1 frame and prize the ring.
* Take extreme care so as not to damage the coated surface of the group-1 frame.
In case of difficult peeling, heat the ring again with the soldering iron.
If this re-heating failed, it may be advisable that the ring be peeled while heating the portions 1 → 2 → 3 → 4 in the under figure one
by one sequentially.
1 Remove two screws.
* Discard the removed screws.
2 Remove the Barrier Assy.
* Discard the removed Barrier Assy.
1
2
1
* After removing the Barrier Assy, if the “G1 Dust-Proof Ring” was removed, it must be returned to the home position.
In returning the ring, adjust the location of a projection to the lens direction.
This is an important part to prevent the dust and light from coming in.
* After removing the Barrier Assy, take extreme care not to drop dust or foreign substances in the lens barrel.
2-3-3. INSTALL NEW BARRIER ASSY
1 Install new Barrier Assy by paying attention to the projection of the Barrier Assy in relation to the position shown in the under figure.
2 Tighten two screws.
* Tightening torque = 0.5 kgf (4.9 N)
* Discard the removed Ornamental Ring A.
4
2
Tip
1
3
Projection
1
2
2
DSC-W5/W7/W15/W17
2-52-6
2-3-4. ADHERE THE ORNAMENTAL RING A
Apply an adhesive to four recesses on the top surface of the Barrier Assy.
* Do not apply too much adhesive. (Make quantity of adhesives into the quantity in which a groove hides.)
Meeting a “notch” of the Ornamental Ring A with a “projection” of the group-1 frame, push the Ornamental Ring A into the group-1 frame.
* The projection of the spring for preventing static electricity must be tilted.
Put the 60g weight on the Ornamental Ring A so that the Ornamental Ring A does not float up until the adhesive hardens.
Note: Be careful not to give a shock.
* After the weight was put, no gap must be present in full circumference between Ornamental Ring A and group-1 frame.
A gap, if present, causes the crackle sound NG.
* The weight must push in the Ornamental Ring A only.
If the weight is put on the mold part of the Barrier Assy, the Ornamental Ring A will float up.