•For ADJUSTMENTS (SECTION 6), refer to SERVICE MANUAL, ADJ (9-876-854-51).
•For INSTRUCTION MANUAL, refer to SERVICE MANUAL, LEVEL 1 (9-876-854-41).
• Reference No. search on printed wiring boards is available.
• Note in Lens Frame Installation
• Exchange Method of Barrier Assy
On the CH-146, SY-123 boards
This service manual procides the information that is premised the
circuit board replacement service and not intended repair inside the
CH-146, SY-123 boards.
Therefore, schematic diagram, printed wiring board and electrical
parts list of the CH-146, SY-123 boards are not shown.
The following pages are not shown.
Schematic diagrams.................. Pages 4-9 to 4-28
Printed wiring boards ................ Pages 4-39 to 4-42
Waveforms ................................ Pages 4-45 and 4-46
Mounted parts location.............. Page 4-48 and 49
Electrical parts list ..................... Pages 5-7 to 5-11
FRAME SCHEMATIC DIAGRAM
FRAME SCHEMATIC DIAGRAM
SCHEMATIC DIAGRAMS
SCHEMATIC DIAGRAMS
REPAIR PARTS LIST
REPAIR PARTS LIST
DIGITAL STILL CAMERA
DSC-P200
The above-described information is shown in service manual Level 3.
Nominal voltage DC 3.6 V
Capacity4.4 Wh (1 220 mAh)
Design and specifications are subject to change
without notice.
DC 4.2 V
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— 2 —
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
CAUTION
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY .
1.Check the area of your repair for unsoldered or poorly-soldered
2.Check the interboard wiring to ensure that no wires are
3.Look for unauthorized replacement parts, particularly
4.Look for parts which, through functioning, sho w obvious signs
5.Check the B+ voltage to see it is at the values specified.
6.Flexible Circuit Board Repairing
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SAFETY-RELATED COMPONENT WARNING!!
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
connections. Check the entire board surface for solder splashes
and bridges.
"pinched" or contact high-wattage resistors.
transistors, that were installed during a previous repair . Point
them out to the customer and recommend their replacement.
of deterioration. Point them out to the customer and
recommend their replacement.
•Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky , less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
— 3 —
TABLE OF CONTENTS
SectionTitlePage
1.SERVICE NOTE
1-1. Note for Repair ································································1-1
1-2. Discharging of the FP-163 Flexible Board’s Charging
Capacitor (C601) ····························································· 1-1
1-3. Note in Lens Frame Installation ······································ 1-2
1-4. Description on Self-diagnosis Display ····························1-2
2.DISASSEMBLY
2-1. Disassembly·····································································2-1
2-2. SY-123 Board Service Position ······································· 2-5
2-3. Exchange Method of Barrier Assy ·································· 2-7
2-3-1.Peel Off Old Ornamental Ring A ····································2-7
2-3-2.Remove Old Barrier Assy ················································2-8
2-3-3.Install New Barrier Assy ·················································2-8
2-3-4.Adhere the Ornamental Ring A······································· 2-9
2-4. Circuit Boards Location ················································2-10
3.BLOCK DIAGRAMS
3-1. Overall Block Diagram (1/2)···········································3-1
3-2. Overall Block Diagram (2/2)···········································3-3
3-3. Power Block Diagram (1/2)·············································3-5
3-4. Power Block Diagram (2/2)·············································3-7
FP-163 FLEXIBLE ·······················································4-44
4-5. Mounted Parts Location ················································4-47
5.REPAIR PARTS LIST
5-1. Exploded Vie ws ·······························································5-2
5-1-1.Overall Assembly ····························································5-2
5-1-2.Lens Block Assembly······················································5-3
5-1-3.Main Block Assembly ·····················································5-4
5-1-4.BT Block Assembly·························································5-5
5-2. Electrical Parts List ·························································5-6
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— 4 —
1-1. NOTE FOR REPAIR
When installing a connector, don’t press down at wire of connector.
It is possible that a wire is snapped.
1. SERVICE NOTE
Make sure that the flat cable and flexible board are not cracked of
bent at the terminal.
Do not insert the cable insufficiently nor crookedly.
Cut and remove the part of gilt
which comes off at the point.
(Be careful or some
pieces of gilt may be left inside)
When remove a connector, don’t pull at wire of connector.
It is possible that a wire is snapped.
1-2. DISCHARGING OF THE FP-163
FLEXIBLE BOARD’S CHARGING
CAPACITOR (C601)
The charging capacitor (C601) of the FP-163 flexible board is
charged up to the maximum 300 V potential.
There is a danger of electric shock by this high voltage when the
capacitor is handled by hand. The electric shock is caused by the
charged voltage which is kept without discharging when the main
power of the unit is simply turned off. Therefore, the remaining
voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of a
resistor of 1 kΩ /1 W (1-215-869-11).
Wrap insulating tape fully around the leads of the resistor to prevent
electrical shock.
1 kΩ/1 W
Wrap insulating tape.
Discharging the Capacitor
Short-circuit between the positive and the negative terminals of
charged capacitor with the short jig about 10 seconds.
R:1 kΩ/1 W
(Part code:
1-215-869-11)
CN757
FP-163
flexible board
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1-1
1-3. NOTE IN LENS FRAME INSTALLATION
When tightening a screw, have both sides of the lens block assembly so as not for the load to depend.
Lens frame
Lens block assembly
P2 tapping screw
1-4. DESCRIPTION ON SELF-DIAGNOSIS DISPLAY
Self-diagnosis display
• C: ss: ss
You can reverse the camera
malfunction yourself. (However,
contact your Sony dealer or local
authorized Sony service facility
when you cannot recover from the
camera malfunction.)
• E: ss: ss
Contact your Sony dealer or local
authorized Sony service facility.
Display Code
C:32:ss
C:13:ss
E:61:ss
E:91:ss
Countermeasure
Turn the power off and on again.
Format the “Memory stick”.
Insert a new “Memory Stick”.
Checking of lens drive circuit.
Checking of flash unit or replacement
of flash unit.
Trouble with hardware.
Unformatted memory stick is inserted.
Memory stick is broken.
When failed in the focus and zoom
initialization.
Abnormality when flash is being
charged.
Cause
Caution Display During Error
SYSTEM ERROR
FORMAT ERROR
MEMORY STICK ERROR
—
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1-2E
2. DISASSEMBLY
The following flow chart shows the disassembly procedure.
2-1. DISASSEMBLY
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two
points with the short jig about 10
seconds.
CN757
R:1 kΩ/1 W
(Part code:
1-215-869-11)
4
FP-163
flexible board
6
2
4
3
4
1
2
7
3
4
4
5
5
to Page 2-3
1
2
3
2
1
3
1 Ornamental ring (A)
2 Tapping screw
x2
3 Barrier assy
Note: When you exchange rings, be sure
to follow the procedure carried on
"2-3. Exchange Method of Barrier
Assy" (2-7 page).
1 Screw (M1.4)
2 Claw
x6
x1
3 Side cabinet assembly
4 Screw (M1.4)
5 Cabinet plate
x8
x1
6 Cabinet front block
7 Cabinet (rear) block assembly
Torque driver
Soldering iron
Weight about 60g
Adhesive (Super X) (Note)
Note: Use adhesive (Super X) or an equivalent article.
Don’t use what becomes white after drying like a quick-drying glue.
1
2
3
2-3-1. PEEL OFF OLD ORNAMENTAL RING A
The Ornamental Ring A has adhered to the Barrier Assy strongly and accordingly, use a soldering iron to weaken the adhesive force.
Heat four circled portions with the soldering iron.
Heating temperature is about 300ºC.
Beware of a burn since the entire Ornamental Ring becomes hot.
* As the adhesive force of Ornamental Ring A is considerably large, the forced peeling will damage the group-1 frame.
Insert the tip of tweezers, etc. into a notch of the group-1 frame and prize the ring.
* Take extreme care so as not to damage the coated surface of the group-1 frame.
In case of difficult peeling, heat the ring again with the soldering iron.
If this re-heating failed, it may be advisable that the ring be peeled while heating the portions 1 → 2 → 3 → 4 in the under figure one
by one sequentially.
1 Remove two screws.
* Discard the removed screws.
2 Remove the Barrier Assy.
* Discard the removed Barrier Assy.
1
2
1
* After removing the Barrier Assy, if the “G1 Dust-Proof Ring” was removed, it must be returned to the home position.
In returning the ring, adjust the location of a projection to the lens direction.
This is an important part to prevent the dust and light from coming in.
* After removing the Barrier Assy, take extreme care not to drop dust or foreign substances in the lens barrel.
2-3-3. INSTALL NEW BARRIER ASSY
1 Install new Barrier Assy by paying attention to the projection of the Barrier Assy in relation to the position shown in the under figure.
2 Tighten two screws.
* Tightening torque = 0.5 kgf (4.9 N)
* Discard the removed Ornamental Ring A.
4
2
Tip
1
3
Projection
1
2
2
DSC-P200
2-72-8
2-3-4. ADHERE THE ORNAMENTAL RING A
Apply an adhesive to four recesses on the top surface of the Barrier Assy.
* Do not apply too much adhesive. (Make quantity of adhesives into the quantity in which a groove hides.)
Meeting a “notch” of the Ornamental Ring A with a “projection” of the group-1 frame, push the Ornamental Ring A into the group-1 frame.
* The projection of the spring for preventing static electricity must be tilted.
Put the 60g weight on the Ornamental Ring A so that the Ornamental Ring A does not float up until the adhesive hardens.
Note: Be careful not to give a shock.
* After the weight was put, no gap must be present in full circumference between Ornamental Ring A and group-1 frame.
A gap, if present, causes the crackle sound NG.
* The weight must push in the Ornamental Ring A only.
If the weight is put on the mold part of the Barrier Assy, the Ornamental Ring A will float up.
Do not put the weight on a black mold part.
Notch
Adhesive
Adhesive
Adhesive
Projection
Adhesive
Completion after 30 minutes.
Not gap in full circumference.
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2-9
2-4. CIRCUIT BOARDS LOCATION
Control switch block
SY-123
(including CP101
(CH-146 board)
and IC301
(KFW board))
FP-162 flexible
Control SW block
(SW51740)
FP-163 flexible
CD-517 flexible
CH-146
(included in SY-123)
FP-161 flexible
(included in Memory stick connector)
Board NameFunction
CD-517 flexibleCCD IMAGER
CH-146CCD SIGNAL PROCESS
(included in SY-123)
FP-161 flexibleMEMORY STICK CONNECTOR
(included in Memory
stick connector)
FP-162 flexibleDC IN, MULTI CONNECTOR
FP-163 flexibleFLASH
SY-123CAMERA MODULE, CAMERA DSP, LENS DRIVE,
(including CP-101 SH DSP, FRONT CONTROL,