Sony DSCP-200 Service manual

DSC-P200
SERVICE MANUAL
Ver 1.2 2005.05
Revision History
Revision History
How to use
How to use
Acrobat Reader
Acrobat Reader
Photo: Silver
Link
Link
SPECIFICATIONS
SPECIFICATIONS
BLOCK DIAGRAMS
BLOCK DIAGRAMS
LEVEL 2
US Model
Canadian Model
AEP Model
UK Model
E Model
Hong Kong Model
Australian Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Tourist Model
Japanese Model
SERVICE NOTE
SERVICE NOTE
DISASSEMBLY
DISASSEMBLY
•For ADJUSTMENTS (SECTION 6), refer to SERVICE MANUAL, ADJ (9-876-854-51).
•For INSTRUCTION MANUAL, refer to SERVICE MANUAL, LEVEL 1 (9-876-854-41).
• Reference No. search on printed wiring boards is available.
• Note in Lens Frame Installation
• Exchange Method of Barrier Assy
On the CH-146, SY-123 boards
This service manual procides the information that is premised the circuit board replacement service and not intended repair inside the CH-146, SY-123 boards. Therefore, schematic diagram, printed wiring board and electrical parts list of the CH-146, SY-123 boards are not shown. The following pages are not shown.
Schematic diagrams.................. Pages 4-9 to 4-28
Printed wiring boards ................ Pages 4-39 to 4-42
Waveforms ................................ Pages 4-45 and 4-46
Mounted parts location.............. Page 4-48 and 49
Electrical parts list ..................... Pages 5-7 to 5-11
FRAME SCHEMATIC DIAGRAM
FRAME SCHEMATIC DIAGRAM
SCHEMATIC DIAGRAMS
SCHEMATIC DIAGRAMS
REPAIR PARTS LIST
REPAIR PARTS LIST
DIGITAL STILL CAMERA
DSC-P200
The above-described information is shown in service manual Level 3.
Sony EMCS Co.
2005E0500-1
© 2005.5
Published by DI Technical Support Section9-876-854-31

SPECIFICATIONS

Camera
[System]
Image device 9.11 mm (1/1.8 type) color
Total pixel number of camera
Effectiv e pix el number of camera
Lens Carl Zeiss Vario-Tessar
Exposure control Automatic exposure, Manual
White balance Automatic, Daylight, Cloudy,
File format (DCF compliant)
Recording media “Memory Stick” FlashRecommended distance (ISO
[Input and Output connectors]
Multi connector USB communication
[LCD screen]
LCD panel 5.1 cm (2.0 type) TFT drive Total number of dots
CCD, Primary color filter
Approx. 7 410 000 pixels
Approx. 7 201 000 pixels
3× zoom lens f = 7.9 - 23.7 mm (38 - 114 mm when converted to a 35 mm still camera) F2.8 - 5.2
exposure, Scene Selection (9 modes)
Fluorescent, Incandescent, Flash, One push
Still images: Exif Ver. 2.2 JPEG compliant, DPOF compatible Movies: MPEG1 compliant (Monaural)
set to Auto): 0.2 m to 3.5 m (7 7/8 inches to 11 feet 5 3/4 inches) (W)/0.3 m to 2.5 m (11 7/8 inches to 8 feet 2 3/8 inches) (T)
Hi-Speed USB (USB 2.0 compliant)
134 000 (560×240) dots
[Power, general]
Battery pack used
Power requirements
Power consumption (during shooting with the LCD screen on)
Operating temperature
Storage temperature
Dimensions 104.5×51.5×27.9 mm
Mass Approx. 180 g (6.3 oz)
Microphone Electret condenser microphone Speaker Dynamic speaker Exif Print Compatible PRINT Image Matching II
PictBridge Compatible
NP-FR1
3.6 V
1.2 W
0°C to +40°C (+32°F to +104°F)
–20°C to +60°C (–4°F to +140°F)
(4 1/8×2 1/8×1 1/8 inches) (W/H/D, excluding maximum protrusions)
(including NP-FR1 battery pack, “Memory Stick”, and wrist strap)
Compatible
AC-LS5/LS5B AC Adaptor
Input rating 100 V to 240 V AC, 50/60 Hz,
Output rating 4.2 V DC*
Operating temperature
Storage temperature
Dimensions Approx. 48×29×81 mm
Mass Approx. 130 g (5 oz) excluding
11 W
* See the label on the AC Adaptor for other specifications.
0°C to +40°C (+32°F to +104°F)
–20°C to +60°C (–4°F to +140°F)
(1 15/16×1 3/16×3 1/4 inches) (W/H/D, excluding projecting parts)
power cord (mains lead)
NP-FR1 battery pack
Battery used Lithium-ion battery Maximum voltage
Nominal voltage DC 3.6 V Capacity 4.4 Wh (1 220 mAh)
Design and specifications are subject to change without notice.
DC 4.2 V
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— 2 —
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type.
CAUTION
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY .
1. Check the area of your repair for unsoldered or poorly-soldered
2. Check the interboard wiring to ensure that no wires are
3. Look for unauthorized replacement parts, particularly
4. Look for parts which, through functioning, sho w obvious signs
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
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SAFETY-RELATED COMPONENT WARNING!!
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety checks before releasing the set to the customer.
connections. Check the entire board surface for solder splashes and bridges.
"pinched" or contact high-wattage resistors.
transistors, that were installed during a previous repair . Point them out to the customer and recommend their replacement.
of deterioration. Point them out to the customer and recommend their replacement.
•Keep the temperature of the soldering iron around 270˚C during repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky , less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
— 3 —

TABLE OF CONTENTS

Section Title Page
1. SERVICE NOTE
1-1. Note for Repair ································································1-1 1-2. Discharging of the FP-163 Flexible Board’s Charging
Capacitor (C601) ····························································· 1-1 1-3. Note in Lens Frame Installation ······································ 1-2 1-4. Description on Self-diagnosis Display ····························1-2
2. DISASSEMBLY
2-1. Disassembly·····································································2-1 2-2. SY-123 Board Service Position ······································· 2-5 2-3. Exchange Method of Barrier Assy ·································· 2-7 2-3-1.Peel Off Old Ornamental Ring A ····································2-7 2-3-2.Remove Old Barrier Assy ················································2-8 2-3-3.Install New Barrier Assy ·················································2-8 2-3-4.Adhere the Ornamental Ring A······································· 2-9 2-4. Circuit Boards Location ················································2-10
3. BLOCK DIAGRAMS
3-1. Overall Block Diagram (1/2)···········································3-1 3-2. Overall Block Diagram (2/2)···········································3-3 3-3. Power Block Diagram (1/2)·············································3-5 3-4. Power Block Diagram (2/2)·············································3-7
4. PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS
4-1. Frame Schematic Diagram ·············································· 4-1 4-2. Schematic Diagrams························································ 4-5
CD-517 FLEXIBLE (CCD IMAGER)····························4-7
FP-162 FLEXIBLE
(DC IN, MULTI CONNECTOR) ··································4-29
FP-163 FLEXIBLE (FLASH) ·······································4-30
MEMORY STICK CONNECTOR
(FP-161 FLEXIBLE)·····················································4-30
CONTROL SWITCH BLOCK (SW51740), (RL)········ 4-31 4-3. Printed Wiring Boards ···················································4-35
CD-517 FLEXIBLE ······················································4-37
FP-162 FLEXIBLE ·······················································4-43
FP-163 FLEXIBLE ·······················································4-44 4-5. Mounted Parts Location ················································4-47
5. REPAIR PARTS LIST
5-1. Exploded Vie ws ·······························································5-2 5-1-1.Overall Assembly ····························································5-2 5-1-2.Lens Block Assembly······················································5-3 5-1-3.Main Block Assembly ·····················································5-4 5-1-4.BT Block Assembly·························································5-5 5-2. Electrical Parts List ·························································5-6
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— 4 —
1-1. NOTE FOR REPAIR
When installing a connector, don’t press down at wire of connector. It is possible that a wire is snapped.
1. SERVICE NOTE
Make sure that the flat cable and flexible board are not cracked of bent at the terminal. Do not insert the cable insufficiently nor crookedly.
Cut and remove the part of gilt which comes off at the point. (Be careful or some pieces of gilt may be left inside)
When remove a connector, don’t pull at wire of connector. It is possible that a wire is snapped.
1-2. DISCHARGING OF THE FP-163
FLEXIBLE BOARD’S CHARGING CAPACITOR (C601)
The charging capacitor (C601) of the FP-163 flexible board is charged up to the maximum 300 V potential. There is a danger of electric shock by this high voltage when the capacitor is handled by hand. The electric shock is caused by the charged voltage which is kept without discharging when the main power of the unit is simply turned off. Therefore, the remaining voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of a resistor of 1 k /1 W (1-215-869-11). Wrap insulating tape fully around the leads of the resistor to prevent electrical shock.
1 k/1 W
Wrap insulating tape.
Discharging the Capacitor
Short-circuit between the positive and the negative terminals of charged capacitor with the short jig about 10 seconds.
R:1 k/1 W (Part code: 1-215-869-11)
CN757
FP-163 flexible board
DSC-P200
1-1
1-3. NOTE IN LENS FRAME INSTALLATION
When tightening a screw, have both sides of the lens block assembly so as not for the load to depend.
Lens frame
Lens block assembly
P2 tapping screw
1-4. DESCRIPTION ON SELF-DIAGNOSIS DISPLAY
Self-diagnosis display
• C: ss: ss You can reverse the camera malfunction yourself. (However, contact your Sony dealer or local authorized Sony service facility when you cannot recover from the camera malfunction.)
• E: ss: ss Contact your Sony dealer or local authorized Sony service facility.
Display Code
C:32:ss
C:13:ss
E:61:ss
E:91:ss
Countermeasure
Turn the power off and on again. Format the “Memory stick”. Insert a new “Memory Stick”.
Checking of lens drive circuit.
Checking of flash unit or replacement of flash unit.
Trouble with hardware. Unformatted memory stick is inserted. Memory stick is broken.
When failed in the focus and zoom initialization.
Abnormality when flash is being charged.
Cause
Caution Display During Error
SYSTEM ERROR FORMAT ERROR MEMORY STICK ERROR
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1-2E
2. DISASSEMBLY
The following flow chart shows the disassembly procedure.
2-1. DISASSEMBLY
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two points with the short jig about 10 seconds.
CN757
R:1 k/1 W (Part code: 1-215-869-11)
4
FP-163 flexible board
6
2
4
3
4
1
2
7
3
4
4
5
5
to Page 2-3
1
2
3
2
1
3
1 Ornamental ring (A) 2 Tapping screw
x2
3 Barrier assy
Note: When you exchange rings, be sure
to follow the procedure carried on "2-3. Exchange Method of Barrier Assy" (2-7 page).
1 Screw (M1.4) 2 Claw
x6
x1
3 Side cabinet assembly
4 Screw (M1.4) 5 Cabinet plate
x8 x1
6 Cabinet front block 7 Cabinet (rear) block assembly
1 Connector 2 Connector 3 Claw
x2
x2
: CN101, CN202
x1
: CN758
4 Flexible board x1: CN754
5 Lens block
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2-1 2-2
4
2
from Page 2-2
3
1
1 Connector x1: CN707 2 Connector x1: CN003 3 Claw
4 Control switch block
x2
3
2
8
4
1
3
5
7
6
1 Flexible board x1: CN704 2 P2 tapping screw 3 Claw 4 P2 tapping screw (M1.7) 5 Claw 6 Connector x2: CN751, 756
7 Control SW block (SW51740) 8 SY-123 board
x1 x1
x1
x1
1
4
2
3
1 P2 tapping screw 2 Multi fixed plate
3 FP-162 flexible board 4 Memory stick connector
x1
x1
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1
1
2
1 Claw
2 D901, LCD901
x3
2-3 2-4
2-2. SY-123 BOARD SERVICE POSITION
Control switch block
FP-163 flexible board
AC power
4
1
4
3
2
4
4
6
4
1
5
7
2
3
5
2
2
3
A/V multi cable
adaptor
FP-162 flexible board
AC IN
SY-123 board
Control SW block (SW51740)
Lens block
8
3
4
5
4
1
6
7
Color monitor
Memory stick connector (including FP-161 flexible board)
D901, LCD901
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1
1
2
3
3
1
4
3
2
1
2
2-5 2-6
2-3. EXCHANGE METHOD OF BARRIER ASSY
2-3-2. REMOVE OLD BARRIER ASSY
Service parts
Part Number Part Name Quantity 1 3-091-427-01 Ring (A), Ornamental 1 2 X-3954-476-1 Barrier Assy 1 3 3-086-156-31 Tapping screw (P2) 2
Tools used
Torque driver Soldering iron Weight about 60g Adhesive (Super X) (Note) Note: Use adhesive (Super X) or an equivalent article.
Don’t use what becomes white after drying like a quick-drying glue.
1
2
3
2-3-1. PEEL OFF OLD ORNAMENTAL RING A
The Ornamental Ring A has adhered to the Barrier Assy strongly and accordingly, use a soldering iron to weaken the adhesive force. Heat four circled portions with the soldering iron. Heating temperature is about 300ºC. Beware of a burn since the entire Ornamental Ring becomes hot. * As the adhesive force of Ornamental Ring A is considerably large, the forced peeling will damage the group-1 frame.
Insert the tip of tweezers, etc. into a notch of the group-1 frame and prize the ring. * Take extreme care so as not to damage the coated surface of the group-1 frame. In case of difficult peeling, heat the ring again with the soldering iron. If this re-heating failed, it may be advisable that the ring be peeled while heating the portions 1 2 3 4 in the under figure one by one sequentially.
1 Remove two screws. * Discard the removed screws.
2 Remove the Barrier Assy. * Discard the removed Barrier Assy.
1
2
1
* After removing the Barrier Assy, if the “G1 Dust-Proof Ring” was removed, it must be returned to the home position.
In returning the ring, adjust the location of a projection to the lens direction. This is an important part to prevent the dust and light from coming in.
* After removing the Barrier Assy, take extreme care not to drop dust or foreign substances in the lens barrel.
2-3-3. INSTALL NEW BARRIER ASSY
1 Install new Barrier Assy by paying attention to the projection of the Barrier Assy in relation to the position shown in the under figure.
2 Tighten two screws.
* Tightening torque = 0.5 kgf (4.9 N)
* Discard the removed Ornamental Ring A.
4
2
Tip
1
3
Projection
1
2
2
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2-7 2-8
2-3-4. ADHERE THE ORNAMENTAL RING A
Apply an adhesive to four recesses on the top surface of the Barrier Assy. * Do not apply too much adhesive. (Make quantity of adhesives into the quantity in which a groove hides.)
Meeting a “notch” of the Ornamental Ring A with a “projection” of the group-1 frame, push the Ornamental Ring A into the group-1 frame. * The projection of the spring for preventing static electricity must be tilted.
Put the 60g weight on the Ornamental Ring A so that the Ornamental Ring A does not float up until the adhesive hardens. Note: Be careful not to give a shock. * After the weight was put, no gap must be present in full circumference between Ornamental Ring A and group-1 frame.
A gap, if present, causes the crackle sound NG.
* The weight must push in the Ornamental Ring A only.
If the weight is put on the mold part of the Barrier Assy, the Ornamental Ring A will float up.
Do not put the weight on a black mold part.
Notch
Adhesive
Adhesive
Adhesive
Projection
Adhesive
Completion after 30 minutes.
Not gap in full circumference.
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2-9
2-4. CIRCUIT BOARDS LOCATION
Control switch block
SY-123 (including CP101 (CH-146 board) and IC301 (KFW board))
FP-162 flexible
Control SW block (SW51740)
FP-163 flexible
CD-517 flexible
CH-146 (included in SY-123)
FP-161 flexible (included in Memory stick connector)
Board Name Function
CD-517 flexible CCD IMAGER CH-146 CCD SIGNAL PROCESS (included in SY-123) FP-161 flexible MEMORY STICK CONNECTOR (included in Memory stick connector) FP-162 flexible DC IN, MULTI CONNECTOR FP-163 flexible FLASH SY-123 CAMERA MODULE, CAMERA DSP, LENS DRIVE, (including CP-101 SH DSP, FRONT CONTROL,
LCD DRIVE,
AUDIO, (CH-146 board) and DC/DC CONVERTER, CONNECTOR
IC301 (KWF board))
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2-10E
3. BLOCK DIAGRAMS
Link
Link
POWER BLOCK DIAGRAM (1/2)OVERALL BLOCK DIAGRAM (1/2)
POWER BLOCK DIAGRAM (1/2)OVERALL BLOCK DIAGRAM (1/2)
OVERALL BLOCK DIAGRAM (2/2) POWER BLOCK DIAGRAM (2/2)
OVERALL BLOCK DIAGRAM (2/2) POWER BLOCK DIAGRAM (2/2)
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3. BLOCK DIAGRAMS
3-1. OVERALL BLOCK DIAGRAM (1/2)
LENS BLOCK
LENS
SHUTTER
MOTOR
M
ZOOM
MOTOR
M
ZOOMFGZOOM
SENSOR
FOCUS
MOTOR
FOCUS
SENSOR
LENS TEMP
SENSOR
A : VIDEO SIGNAL
A : AUDIO SIGNAL
A : VIDEO/AUDIO SIGNAL
FLASH
UNIT
C601
CHARGING
CAPACITOR
M
IRIS
(METER)
+
M
05
IRIS
MOTOR
CD-517 FLEXIBLE BOARD (1/2)
IC101
CCD
IMAGER
FP-163 FLEXIBLE BOARD
XE_H
TRIG 300V
XE_L
CL501
CL502
Q103
17
BUFFER
19
Q102
23 25 24
28 29
4 8
ı
15
1 6 7
3 5
26
27
F MOTOR A, A, B, B
Z DC MOTOR (+), (–)
SHUTTER MOTOR (+), (–)
Z BOX1 PI SENS OUT, Z BOX2 PI SENS OUT
CN757
1
XE_H ı 3
TRIG 300V
11 12
6
XE_L ı
8
( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
Q101
RG, H1B, H2B
H1A, H2A
V2, V4, V5A, V5B,
V6, V7, V8, V9, V10
V1, V3A, V3B
VST VHLD VSUB
VSUB CONT
IRIS M±, S±
F PI SENS OUT Z PI SENS OUT
THERMISTOR (+)
D601
Q601
SY-123 BOARD (1/2)
CN101 (1/2)
CCD OUT
16
PWR SAVE
13
4
10
7
9 6
34 30
ı
23
36 32 33
35 31 21
Q108
22
Q105
CN201
23
FOCUS A, A, B, B
ı
26
9
ZOOM DC ±
ı
12
17
IRIS M±, S±
ı
20
13
SHUTTER±
ı
16
33 29
4 7
30
T601
5 4
1
2
3
Q205
CH-146 BOARD
86
6
133
37
33
5
42
2
51
4
37
1
48
3
9
12
113 109
ı
112 115
14
7 125
20
119 118
15
121
ı
18
10
7
20
11
17
10
138 1119 19
21
135
36
ST UNREG
5
2
6
134 136
2 4
6 9 12 15
18 21 24 27 30 32
49
66
101 120
IC101
CCD SIGNAL
PROCESSOR,
TIMING
GENERATOR
3
126
A6
FOCUS
B5
MOTOR
A4
DRIVER
B4
ZOOM
C1
MOTOR
D2
DRIVER
G5
IRIS
H6
MOTOR
G4
DRIVER
H4
SHUTTER
E7
MOTOR
D7
DRIVER
IC601
TRANS DRIVE,
FLASH CONTROL,
FLASH CHARGE
DETECT
(9/9)
105
132 124
123 129
99
84
22
35
45 46 48
38 39
40
42
47
LENS DRIVE
B7 B8 C7 C8
B3 A2
B1
G3 H2 G2 G1
F8 F7
H8
8 7
4
CP101
CAMERA MODULE
(1/9)
ı
XFE CS, XTG CS
ı
IC201
(3/9)
STRB CHRG
XSTRB FULL
STRB ON
CA AD00 – CA AD13
CAM F
CAM SO, XCAM SCK, XCAM RST
VSUB CONT IC 301
HR EN2, HR DIR2A, HR DIR2B
HR EN0, HR DIR0A
XZM DC BR
IRIS M IN IRIS M EN IRIS S IN IRIS S EN
MSHUT DIR MSHUT EN MSHUT REF
XFC RST SENS
XZM RST SENS1
ZM DC FG A, B
CA HD CAM F
MCKTG
TG CKI
CAM SO, XCAM SCK, XCAM RST
STRB ON
D602
Y11 AB11 Y10 AA11 AB10
Y9 AB9 AA10 AA9 Y8
AB8 AA8
AA7
AB7
Y7 AB6 AC8
IC301
CAMERA DSP,
SDRAM
(KWF BOARD)
(2/9)
AC4
AC22
N3 K3 M4
K4 J3
T4 U2 T3 T2
U3 AA19
U20 V21 V23 U22
V22 W20 Y20
V20
Y23 W21 Y22
W22
F4 F3
G4 J2 Y4
G3 H4 W4
AB20
AA22 AA21 AB22
Y21
J21 L22 L20 L23 K21
M21 M23 M20 M22
L21
N22 N20 P20 P21
N21
R21 P22 T21 R23
P23
R22 T20 T23 U21
R20
CAM SO, XCAM SCK, XCAM RST
F1 D1 E1
C6 D7
G1
AC12 AC15
P4
D8 AA12
J23 J22
P1
PANEL R PANEL G PANEL B
HDO
PANEL V
XSYS RST
XPANEL TG CS
BL LEV
SYS SI, SYS SO, XSYS SCK
VIDEO AMP ON
XPANEL TG CS
SYS SI, SYS SO, XSYS SCK
XSYS RST
SYS V
MC XCS IC 301REG
MC XCS IC 301SDRAM
MC D0 – D15
MC A1 – A25
MC CKIO
X101
27MHz
STRB CHRG XSTRB FULL
D11 E11 F11
A2 B1
C1
A5 B4 A4
B5 G10
CAM F XFE CS XTG CS LENS TEMPLENS TEMP
XZM DC BR
MSHUT REF
VER EXTAL
IC801
LCD DRIVE
(6/9)
E1 F1 G2
H2 H1 J2
J1 K1 K3
H11
L3
L10
K11
VIDEO AMP
1
D21
AD16
A11 B11 C11
MC CAM,
D14 K2 AA8
A17 C18
L21 L23 M24 K23
J21 J22 F24
H22
H21 M23 K22
K21
L24 F23 E23
G21 V22 V21 V23 R22 W22
W21 T22 R23 N21
U22
P21 P23 R21 M22
P22
P24 U21 U23 N22
T21
N23 T24 M21 T23
U24
A7 H1 AC12 AA9 AC16 A2
A12 B12 C23
AA19 G2 A6
AD19 AC15
L6 L7 L8
J11
IC302
(2/9)
IC502
SH DSP,
FLASH
(4/9)
RGT, HCK1, HCK2, HST, PCG, XSTBY,
DWN, EN, VST,
VCK, REF, VP
24
SYS SO, XSYS SCK
XAU LINE MUTE
AA18 D22
MELODY ENV
AB7 AD14
J1
K1
USB PHY D±
L1 M1
PRELAMP AF CONT
F1
SELF TIMER LED
H23
AE LOCK LED
AD20
XACCESS LED
C22
MC MSDIO,
MC MSBS, MC MSCLK
B16 B15 D16
XAE LOCK ON
AB5 AB13
B13
FR SI, FR SO, XFR SCK
D13 C13
AD11 D11
CN754
VR VG VB
COM, CS
BL H
BL L
BL LEV
V OUTYO
AU AIN
AU AOUT
AU SEN
MELODY
XMS IN
XSHTR ON
FR INT
XCS MC
PANEL UNIT
21 20 22
1 2
3
ı
6
11
ı
14 17
ı
19 23
26 25
BL L BL H
3
1
Q752
LED
DRIVE
MEMORY STICK CONNECTOR
CN751
(FP-161 FLEXIBLE)
9
11
DIO, BS, SCLK
4
76
2
XSYS RST
SYS V
LCD901
COLOR
LCD
MONITOR
D901
BACKLIGHT
OVERALL (2/2) (PAGE 3-4)
OVERALL (2/2) (PAGE 3-3)
D753
(MS ACCESS)
CN001
INT
OVERALL (2/2) (PAGE 3-3)
4 2 8
MEMORY
STICK
DSC-P200
3-1 3-2
3-2. OVERALL BLOCK DIAGRAM (2/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
SY-123 BOARD (2/2)
OVERALL (1/2)
(PAGE 3-2)
CD-517 FLEXIBLE BOARD (2/2)
D104
SELF TIMER/
AF ILLUMINATOR
D103
(AE/AF LOCK)
D101
(FLASH/CHG)
CONTROL SWITCH BLOCK (RL)
S001
(SHUTTER)
D001
(POWER)
S002
POWER
(ZOOM)
05
MICROPHONE
XCHARGE/XSTRB LED
CONTROL SWITCH BLOCK (SW51740)
CN003
1 2
3
5
WT
BT001
LITHIUM
BATTERY
1
MIC901
PRELAMP AF ON
XAE LOCK LED
XAE LOCK ON
XSHTR ON
XPWR LED
XPWR ON
MODE
DIAL
FUNCTION
KEY
V OUT
USBPHY D± USBPHY D±
AU AIN
AU AOUT
SYS SO, XSYS SCK
XAU LINE MUTE AU SEN
MELODY ENV
MELODY
AE LOCK LED AE LOCK LED
PRELAMP AF CONT SELF TIMER LED
CN707
MIC IN
2
CN101
Q701
(2/2)
CN756
VL 3V
LED
DRIVE
Q503
LED
DRIVE
38
43
44
6 5
4
2
8
11
18 19
12
15
MODULATOR
AE LOCK LED
Q504
BEEP
H6 H7
H2 H3
IC901
G4
AUDIO AMP
(7/9)
H4
C1
A7
OVERALL (1/2)
(PAGE 3-2)
XCHARGE/XSTRB LED
XPWR LED
XPWR ON
MODE DIAL 0, 1
KEY AD 0, 1
KEY AD 2
F1
A2 A4
USB JACK IN
XAV JACK IN
XMS IN
FR SI, FR SO, XFR SCK
2
FR INT XCS MC XSYS RST SYS V
XSHTR ON XAE LOCK ON
V OUT
AU OUT
XAV JACK IN
USB JACK IN
32.768kHz
SP ±
Q408
Q401
CN704
CN758
X401
PLL
LOOP
FILTER
(1/2)
CN101
(MULTI CONNECTOR)
C8
A3
B6
D1 D2 E1
D9 E2 B3 B9
J5
J4
J2 J3
B1 B2
B8
J8 J9
J6 H6
G6
V OUT
A OUT L
XAV JACK IN
D±
USB VBUS
IC401
FRONT
CONTROL
(5/9)
SPEAKER
34 31 22 26
28
24
1 2
SP901
F9 F7 E9
A8
J7 H7
A7
G1 G2
D7
E8
C1 D3
H1
A9 H2 J1
20 16 26 10
12
6
CHG STAT 0 – 2
Q407
BATTERY
CHARGE
DETECTOR
S401
RESET
XRSTX
SYS DD ON
DDCON SO, DDCON SCK
XCS DDCON
BATT IN
FAST CHARGE
INIT CHARGE
PANEL 8.5V
BACK UP VCC
EVER 3.0V
A 3.1V D 1.2V D 2.8V A 2.8V
CAM 15.5V
CAM –7.5V/–8.0V
CAM 3.3V
M 5V
ST 5V
CAM –0.5V
VL 3V
FP-162 FLEXIBLE BOARD
21
ACV UNREG
23 25
BATT XEXT
19
KEY ADA, ADB
15
9
XLANC POWER ON
7
2
CHG STAT 0 – 2
17 24
BATT/XEXT
BATT SIG
B7
C7
D7
L8 K8
K7
A7 E3 D2
A10
D8
IC002
DC/DC
CONTROL,
RESET
(8/9)
E4
G1 G2 B1
ACV UNREG
BL H
BL L
BL LEV
CN704
(2/2)
CHG STAT 0 – 2
Q402
IC402
(5/9)
OVERALL (1/2)
3
(PAGE 3-2)
17
XLANC POWER ON
23 20 36
BUFFER
DC JACK/MULTI DOUBLE
INSERTION DETECT
ACV UNREG
ST UNREG
BATT UNREG
19 18
KEY ADA, ADB
ACV W SENS
CHG SW
ACV UNREG
2 – 9
1
21
BATT XEXT D
ACV UNREG1
BATT XEXT M
Q008,
009
A : VIDEO SIGNAL
A : AUDIO SIGNAL
4537–44
BATT SIG
BATT UNREG
BATT /XEXT D
BATT UNREG
BATT SIG
+
S
J101
DC IN
BT901
BATTERY
TERMINAL
A : VIDEO/AUDIO SIGNAL
DSC-P200
3-3 3-4
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