Sony DNS-505 Service manual

D-NS505

SERVICE MANUAL

Ver 1.0 2004.04

Manufactured under license from Dolby
Laboratories Licensing Corporation.

SPECIFICATIONS

System

Compact disc digital audio system

Laser diode properties

Material: GaAlAs
Wavelength: λ = 770 - 800 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW

(This output is the value measured at a distance
of 200 mm from the objective lens surface on the
optical pick-up block with 7 mm aperture.)

D-A conversion

1-bit quartz time-axis control

Frequency response

20 - 20 000 Hz

Output (at 4.5 V input level)

Headphones (stereo minijack)

Approx. 5 mW + Approx. 5 mW at 16 Ω

+1–2

dB (measured by JEITA)

Power requirements

• LR6 (size AA) batteries: 1.5 V DC 2

• AC power adaptor (DC IN 4.5 V jack)

Operating temperature

5°C - 35°C (41°F - 95°F)

Dimensions (w/h/d) (excluding projecting parts
and controls)

Approx. 136 30.5 136 mm (53⁄8 11⁄4 53⁄8 in.)

Mass (excluding accessories)

Approx. 250 g (8.9 oz.)

Supplied accessories

•

AC power adaptor (US, Canadian models)

•

Headphones

•

CD-ROM (SonicStage)

•

Operating Instructions

•

SonicStage Installation/Operating Guide

Design and specifi cations are subject to change
without notice.

US Model

Canadian Model

E Model

Australian Model

Model Name Using Similar Mechanism D-NE10

CD Mechanism Type CDM-3325ERV2

Optical Pick-up Name DAX-25EV

x

x

x

x

x

x

9-877-797-01

2004D1679-1
© 2004.04

PORTABLE CD PLAYER

Sony Corporation

Personal Audio Company
Published by Sony Engineering Corporation

D-NS505

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Flexible Circuit Board Repairing

•Keep the temperature of soldering iron around 270˚C
during repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

Notes on chip component replacement

•Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

On AC power adaptor

•Use only the AC power adaptor supplied or

recommended in “Accessories (supplied/
optional).” Do not use any other AC power
adaptor. It may cause a malfunction.

Polarity of the plug

TABLE OF CONTENTS

1. SERVICING NOTE .............................................. 3

2. GENERAL ................................................................... 5

3. DISASSEMBLY

3-1. Upper (Lid) Section ......................................................... 6

3-2. Cabinet (middle) Section ................................................. 7

3-3. MAIN Pwb Assy ............................................................. 7

3-4. MAIN Board, CD Mechanism Deck

(CDM-3325ERV2) ......................................................... 8

3-5. Turn Table Motor Assy (M901), Sled Motor Assy(M902),

Optical Pick-up (DAX-25EV) ......................................... 8

4. ELECTRICAL CHECKING .................................... 9

5. DIAGRAMS

5-1. Block Diagram – MAIN Section (1/2) – ......................... 11

5-2. Block Diagram – MAIN Section (2/2) – ......................... 12

5-3. Block Diagram POWER Section ..................................... 13

5-4. Printed Wiring Boards – MAIN Board (Side A) – .......... 14

5-5. Printed Wiring Boards – MAIN Board (Side B) – .......... 15

5-6. Schematic Diagrams – MAIN Board (1/4) – ................... 16

5-7. Schematic Diagrams – MAIN Board (2/4) – ................... 17

5-8. Schematic Diagrams – MAIN Board (3/4) – ................... 18

5-9. Schematic Diagrams – MAIN Board (4/4) – ................... 19

5-10. IC Pin Function Descriptions .......................................... 22

6. EXPLODED VIEWS

6-1. Cabinet Upper .................................................................. 27

6-2. Cabinet Lower ................................................................. 28

6-3. Strap Front ....................................................................... 29

6-4. MAIN Pwb Assy ............................................................. 30

6-5. CD Mechanism Deck Section (CDM-3325ERV2).......... 31

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

7. ELECTRICAL PARTS LIST .................................. 32

2

SECTION 1

IC601 FOK output ygpin

130

9061

31

60

100

91

MAIN BOARD (SIDE A)

SERVICING NOTE

D-NS505

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission, ob­serve from more than 30 cm away from the objective lens.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

BEFORE REPLACING THE OPTICAL PICK-UP BLOCK

Please be sure to check thoroughly the parameters as par the “Opti­cal Pick-Up Block Checking Procedures” (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.

• FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.

• RF signal P-to-P value: 0.45 to 0.65 Vp-p

ATTENTION AU COMPOSANT AYANT RAPPORT

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

À LA SÉCURITÉ!

LASER DIODE AND FOCUS SEARCH OPERATION
CHECK

During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S820.
The following checking method for the laser diode is operable.

• Method:

Emission of the laser diode is visually checked.

1. Remove the upper lid.

2. W ith a disc not set, turn on the S820 with a scre wdriver having

a thin tip as shown in Fig.1.

3. Press the

u

button.

4. Observing the objective lens, check that the laser diode emits

light.
When the laser diode does not emit light, automatic power con­trol circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.

Fig. 1 Method to push the S820

3

D-NS505

M
v

SERVICE MODE

The following confirmation can be performed when the Service
Mode is set.

1. How to set the Service Mode.

To set the Service Mode, the following method is available.

1) Confirm the set is not powered on.

2) Confirm the following settings.

OPEN/CLOSE detect switch (S820) ............. OFF

Solder Land (SL825) ..................................... OPEN

[HOLD] switch (S810) .................................... OFF

3) Short the solder land SL824 (TEST) on the MAIN board.

4) Turn on the main power.

MAIN BOARD(SIDE A)

S820

SL825
(OPEN)

2. Operation when the Service Mode is set.

When the Service Mode becomes active, following messages are
displayed onthe remote control LCD.

icrocomputer

ersion display

1) Turn off the power.

2) Open the solder land SL824 (TEST) on the MAIN board.

Note : The solder should be removed clean.

VS010B:

MAIN BOARD(SIDE B)

SL824(TEST)

TP746
(RF)

S810

TP701(AG)

4

SECTION 2

9

0

k

r

GENERAL

Guide to parts and Controls

2134

D-NS505

This section is extracted
from instruction manual.

56 78

Display

1

DISPLAY/MENU button

2

(group) button

3
4
5

VOL (volume) +*/– buttons

6

.

Display

H

(group) button

h

>

, lever

qd qf

qa qs

7
8
9
0
qa
qs

* This button has a tactile dot.

(play/pause)*/ENTER button

u

(stop) button

x

Hand strap
HOLD switch

(headphones) jack

i

DC IN 4.5 V (external power input) jac

qg

Play mode indicator

qd

Character information display

qf

Disc indicator

qg

Play list indicator

qh

Note

You can invert the characters on the display.

qh qj qk ql w;

Group indicator

qj

Timer indicator

qk
ql

Battery indicator
SOUND indicato

w;

5

D-NS505

Note: Disassemble the unit in the order as shown below.

SECTION 3

DISASSEMBLY

SET

UPPER (LID) SECTION

CABINET (MIDDLE) SECTION

MAIN PWB ASSY

MAIN BOARD,
CD MECHANISM DECK
(CDM-3325ERV2)

TURN TABLE MOTOR ASSY (M901),
SLED MOTOR ASSY (M902),
OPTICAL PICK-UP (DAX-25EV)

Note: Follow the disassembly procedure in the numerical order given.

3-1. UPPER (LID) SECTION

1

four screws

2

upper lid sub assy

6

s

3-2. CABINET (MIDDLE) SECTION

2

cabinet middle

1

ten screw

D-NS505

3-3. MAIN PWB ASSY

Precaution:PWB can not be lifted up
>5cm from back cabinet.

NG

Prohibit:Can not press FPC during
assembly PWB to back cabinet.

6

main pwb assy

5

jog

actuator

4

screw

2

1

hinge support

3

open spring

hinge sliding

7

D-NS505

)

3-4. MAIN BOARD,CD MECHANISM DECK(CDM-3325ERV2)

4

CD mechanism deck

(CDM-3325ERV2)

3

flexible board

(CN601)

5

com cover

sheet

1

connector (2P

(CN401)

2

connector (4P)

(CN402)

main board

3-5. TURN TABLE MOTOR ASSY(M901),SLED MOTOR ASSY(M902),OPTICAL PICK-UP(DAX-25EV)

1

three screws

×

4)

3

sled motor assy

2

gear cover

4

optical pick-up

(DAX-25EV RP ASSY)

5

three screws

(B 1.7

×

(B 1.7

4)

6

turn table motor assy

chassis

8

SECTION 4

RF level

0.45 to 0.65 Vp-p

e

ELECTRICAL CHECKING

D-NS505

The CD section adjustments are done automatically in this set.
In case of operation check, confirm that RF level.

Precautions for Check

1. Perform check in the order given.

2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.

3. Power supply voltage requirement : DC4.5 V in terminals

(J401)
VOLUME button : Minimum
HOLD switch : OFF

Checking Location:

MAIN BOARD(SIDE B)

SL824(TEST)

TP701(AG)

TP746
(RF)

S810

RF Level Check

Condition:

• Hold the set in horizontal state.

Connection:

Oscilloscop

(AC range)

MAIN board

2 k

TP746 (RF)
TP701 (AGND)

Procedure:

1. Connect the oscilloscope to the test points TP746 (RF) and
TP701 (AGND) on the MAIN board.

2. Set a disc. (YEDS-18)

3. Press the u button.

4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.

Ω

+
–

RF Signal reference Waveform (Eye Pattern)

VOLT/DIV : 100 mV (With the 10:1 probe in use)
TIME/DIV : 500 ns

To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
watching.

5. Stop revolving of the disc motor by pressing the x button.

9

D-NS505

SECTION 5

DIAGRAMS

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• :Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)

Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF 50
WV or less are not indicated except for electrolytics and
tantalums.

• All resistors are in Ω and 1/

•%: indicates tolerance.

• C : panel designation.

Note:

The components identified by
mark 0 or dotted line with
mark 0 are critical for safety .
Replace only with part
number specified.

• A : B+ Line.

•Total current is measured with CD installed.

•Power voltage is dc 4.5 V and fed with regulated dc power supply
from DC IN jack.

•Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : CD PLAY

* : Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.

•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.

• Circled numbers refer to waveforms.

• Signal path.
J : CD PLAY

W or less unless otherwise specified.

4

Note:

Les composants identifiés par une
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.

• Waveforms

1

IC601 if RFAC

100mV/DIV, 400ns/DIV

540 mVp-p

2

IC601 rk XTAO

1V/DIV, 20ns/DIV

3.2 Vp-p

59ns

3

IC801 wk XIN

1V/DIV, 40ns/DIV

3.4 Vp-p

118ns

4

IC403 efSYNC

1V/DIV, 2us/DIV

5.7us

2.0 Vp-p

10

D-NS505

(

(

5-1. BLOCK DIAGRAM – MAIN SECTION (1/2) –

IC601

RF AMP,

DIGITAL SIGNAL PROCESSOR,

DIGITAL SERVO PROCESSOR,

DETECTOR

A
B

RF

E
F

VCC

OPTICAL PICK-UP BLOCK

DAX-25E

LASER DIODE

PD

A

Page 13)

B

LD

PD

Page 13)

(FOCUS)

2-AXIS
DEVICE

(TRACKING)

M902

SPINDLE

MOTOR

V

U

W

A

B

RF

E

F

VCC3

OPGSW
OPSTB

LD

M901

M

SLED

MOTOR

U1

79

V1

78

W1

77

COM

80

U

2

V

4

W

6

+

+

+

MOTOR
DRIVER

52
50

44
42

42
40

IC403 (1/3)

FOCUS/TRACKING COIL DRIVER

SLED MOTOR DRIVER

FO1
RO1

FO3

CONTROLLER,

RO3

H BRIDGE DRIVER

FO2
RO2

IC403 (2/3)

SPINDLE MOTOR DRIVER

CONTROL
CIRCUIT

FI1

RI1

FI3

RI3

FI2

RI2

APWM

XBRK

56
55

60
59

58
57

73
70

FG

74

100

104
103
102

A

92

B

91

RFDC

88

RFAC

84

E

89

F

90

SFDR
SRDR

99

FFDR

96

FRDR

95

TFDR

98

TRDR

97

C176
MDP
MDS

SCOR

27

FG_I

10

SCOR_I

HG_XSTB_O

HG_GUP_O

12

13

D-RAM CONTROLLER

WFCK

MDS

XTAO

XTAI

RFAC

XSOE
SENS
R4M
XLAT
CLOK
SCOR
SDTO

RFDC

SFDR

SRDR

FFDR
FRDR
TFDR

TRDR

SIGNAL

PROCESSOR

BLOCK

MDP

E

F
B
A

SDTO

SENS

858887838486

MSDTO0_O

IC801 (1/3)

SYSTEM CONTROLLER

MEMORY

CONTROLLER,

BASS BOOST

BLOCK

SERVO
BLOCK

R8M

CLOK

MSCK_O

MSDTI0_I

XSOE

XLAT

32 65

2422

232021

28

XIN

XSOE_O

XLAT0_O

28

XRST

4

XRST_O

DIGITAL

OUT

FOK

GFS

LPF

GFS

69

53

GFS_I

AOUT1
AOUT2

PCMD_O

FOK

52

FOKI

AT3_MP3_V_O

WAKEUP_K_O

SDOUT_O

SDCLK_O
SDXLAT_O
EEP_CS_O

DOUT

62

D0-D3

4, 3, 6, 5

A0-A10

116 — 113, 17 — 15, 13 — 11, 117

XRAS

1

XWE

2

XCAS

9

XTAI

47

XTAO

48
51
56

108
106

LRCK_O

110

BCK_O

109

PCMD_I

107

LRCK_I

111

BCK_I

XRDE

18

X701

22MHz

60
66

REQ_I

11

SDIN_I

20
19
18
17
67

D0 — D3A0 — A10

2, 3, 24, 25

9 — 12, 15 — 19, 21, 8

5

XRAS

4

XWE

23

XCAS

X601

16.9344MHz

4

PCMD

1

LRCK

2

BCK

15

PI0

14

PI2

13

PI3

12

PF4

29

EXTAL

30

XTAL

33

IC603

D-RAM

IC701

MP3 DECODER

PF0

NRST

PF3

34

37

AOUTL,
AOUTR

PC1

40

D

(Page 12)

PC0

PC2

41

38

PC3

42

4
3
2
1

IC803

EEPROM

DO
DI
XSK
XCS

¥ SIGNAL PATH

: CD PLAY

SYNC

MSCK

MSDTO

E

F

G

(Page 13)

(Page 13)
(Page 13)

1111