Ver 1.2 2002.06
With SUPPLEMENT-1
With SUPPLEMENT-2
Photo : D-E350
US Model
D-E350/E356CK
Canadian Model
D-E350/E351/E356CK
AEP Model
D-E350/E351/E353/E351SR/E356CK
UK Model
Australian Model
D-E351/E356CK
E Model
D-E350/E351/E351SR/E353/E355/E356CK
Chinese Model
D-E355
Model Name Using Similar Mechanism NEW
CD Mechanism TypeCDM-3125ER
Optical Pick-up TypeDAX-25E
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength:λ =780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW (This output
is the value measured at a distance of 200 mm
from the objective lens surface on the optical
pick-up block with 7 mm aperture. )
Error correction
Sony Super Strategy Cross Interleave Reed
Solomon Code
Personal Audio Company
Pubulished by Sony Engineering Corporation
D-E350/E351/E351SR/E353/E355/E356CK
TABLE OF CONTENTS
• Abbreviation
AUS : AustralianCND : Canadian
FR: FrenchHK : Hong Kong
AR: ArgentinaEA : Saudi Arabia
CH: ChineseEE: East European
TW: TaiwanMX : Mexico
KR: Korean
C&SA : Central and South America
E13: AC220-230V area model
E33: AC100-240V area model
DANGER
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.
CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable of emitting
radiation exceeding the limit for Class 1.
This Compact Disc player is
classified as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on
the rear exterior.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
7. ELECTRICAL PARTS LIST................................... 18
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT .
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
À LA SÉCURITÉ!
2
D-E350/E351/E351SR/E353/E355/E356CK
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the charged
electrostatic load, etc. on clothing and the human body. During repair,
pay attention to electrostatic breakdown and also use the procedure in
the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the
disc reflective surface by the objective lens in the optical pick-up block.
Therefore, when checking the laser diode emission, observe from more
than 30cm away from the objective lens.
Before Replacing the Optical pick-up Block
Please be sure to check thoroughly the parameters as per the “Optical
pick-up Block Checking Procedure” (Part No. : 9-960-027-11) issued
separately before replacing the optical Pick-up block.
Note and specifications required to check are given below.
• FOK output : IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
• RF signal P-to-P value : 0.45 to 0.65Vp-p
Laser Diode Checking Methods
During normal operation of the equipment, emission of the laser diode
is prohibited unless the upper panel is closed while turning ON the S801
(push switch type).
The following two checking methods for the laser diode are operable.
Method :
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the S801 as shown in Fig. 1 .
3. Check the object lens for confirming normal emission of the laser
diode. If not emitting, there is a trouble in the automatic power
control circuit or the optical pick-up. During normal operation, the
laser diode is turned ON about 2.5 seconds for focus searching.
S801
LOCA TING THE CONTROLS
ESP
OPEN
SECTION 2
GENERAL
Fig.1 Method to push S801
This section is extracted from
instruction manual.
DC IN 4.5V
>B
.
i
VOL
–
HOLD
.
VOL
+
SOUND
x
MENU
DISPLAY
3
D-E350/E351/E351SR/E353/E355/E356CK
SECTION 3
DISASSEMBLY
z
The equipment can be removed using the following procedure.
Set
Cabinet (lower),
MD ASSY
Note : Follow the disassembly procedure in the numerical order given.
The CD section adjustments are done automatically in this set.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC4.5 V in DC IN jack.
(J401)
VOLUME button : Minimum
HOLD switch : OFF
Focus bias Check
Condition:
• Hold the set in horizontal state.
Connection:
oscilloscope
(AC range)
TJ503(RFI)
TJ610 (VBIAS)
[MAIN BOARD] (SIDE B)
C106
MON1
TJ603
C634
C306
C619
TAP601
TAP803
D801
TP609
IC302
(OPEN/CLO
R620
TAP805
SCOR
TJ608
TJ607
FOK
C203
S801
CLK4M
TP616
C1
R107
TP817
C2POEN
XBUSY
C802
R82
R205
TP814
TAP806
TP507
OPSTB
TJ601
AVDD
TJ602
D805
LD
TJ502
Q601
LASER
R605
L601
TJ501
AGND
PD
TP503
IC603
TJ303
TJ405
HPLOUT
AVDD
R617
C301
R613
R209
C206
R614
TP621
TJ604
MON2
RFGO
TJ610
VBIAS
R615
C610
TP603
TJ503
RFI
RF1
4V
R109
Procedure:
1. Connect the oscilloscope to the test points TJ503(RFI) and TJ610
(VBIAS) on the MAIN board.
2. Set a disc. (YEDS-18)
3. Press the >B button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10 : 1 probe in use)
TIME/DIV : 500ns
RF level
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
0.45 to 0.65 Vp-
watch-ing.
5. Stop revolving of the disc motor by pressing the x button.
6
D-E350/E351/E351SR/E353/E355/E356CK
SECTION 5
DIAGRAMS
5-1. EXPLANATION OF IC TERMINALS
IC801 (SYSTEM CONTROL) T5AW5-Z5-M0
Pin No.Pin nameI/ODescription
1GND–Ground terminal.
2XINISystem clock input.
3XOUTONot used (OPEN).
4TESTITest mode terminal (FiXed to “L”).
5VCPU–Power supply for CPU & I/O.
6FOK_IIFocus OK signal input.
7XBUSY_IIDSP’s auto sequencer status.
8XRESET_II/OMicon reset terminal.
9XSTOP_IINot used (FiXed to “L”).
10DFCT CTRLONot used (OPEN).
11SCOR_IISCOR pulse input.
12HPSW_OOHeadphone IC power switch.
13DEFECTODEFECT signal output (Not used).
14XPOWLT_OOPower IC’s serial interface latch output.
15R/XW_OODSP’s serial interface Read/Write signal output.
16MSDTIISerial interface input.
17MSDTOOSerial interface output.
18SCK_OOSerial interface clock output.
19AVCPU–Power supply for CPU and I/O.
20VREFH–Analog reference voltage for A/D converter.
21AD_SELITest mode detection input
22AD_CHGMNTICharging monitor input.
23AD_KEY2IKey input.
24AD_BATMNTIBattery voltage monitor input.
25AD_KEYISet’s key detection input.
26AD_RMKEYIRemocon’s key detection input.
27AD_DCINMNTIDC voltage monitoring input.
28XOPEN_IIOPEN switch status detection input.
29P50ONot used (OPEN).
30BEEP_OOBEEP sound
31TSBONot used (OPEN).
32VDD_EEPROM–Power supply for EEPROM (OPEN).
33P44ONot used (OPEN).
34XNONCHG_IICharging feature detection
35P42ONot used (OPEN).
36FRANCE_IIFrance version detection input.
37X4M/16M_IIDRAM size selection terminal (OPEN).
38CMPON_IIESP switch status detection input.
39XTSB/PANA-HPONot used (fixed at “L”) (OPEN).
40HOLD_IIHOLD switch status detection input.
41SEG15ONot used (OPEN).
42-55SEG1-14OLCD segment output.
56SEG0ONot used (OPEN).
57-60COM0-3OLCD common output.
61-63V1-3–LCD driver booster.
64C1–LCD driver booster.
65C0–LCD driver booster.
7
D-E350/E351/E351SR/E353/E355/E356CK
Pin No.Pin nameI/ODescription
66XWAKEUP_OOWale-up signal output.
67PGM STD0–Not used (OPEN).
68PGMSI_I–Not used (OPEN).
69PGMSCK_O–Not used (OPEN).
70P13ONot used (OPEN).
71GFS_IIGuard Frame Synchronous signal input.
72ESPLT_OOESP’s serial interface latch output.
73PGMSEL_O–Not used (OPEN).
74AMUTE_OOMute ON/OFF control output.
75VCC2ON_OONot used (OPEN).
76XRST_OOSystem reset output.
77XPOFF_OODSP’s power off output.
78OPSTBY_OOPick-up’s power supply ON/OFF control.
79OPG4[_OORF IC’s gain control.
80C2POEN_OOC2PO enable.
8
5-2. BLOCK DIAGRAMS
D-E350/E351/E351SR/E353/E355/E356CK
IC603 RAM(4M)
OPTICAL
PICK-UP
BLOCK
(DAX-25E)
OP IC
FOCUS
COIL
TRACKING
COIL
M902
SLED
MOTOR
M901
SPINDLE
MOTOR
OPGSW
OPSTB
M
M
D0-3A0-10
1,2,24,25 5,9-12,14-18
88,87,85,84
RF
RF
LD
PD
AVDD+2V
RF
13
A
A
E
F
LD
DRIVER
Q601
F+
F-
T+
T-
S+
S-
C+
C-
VBATT
A
9
B
8
E
6
F
7
LD
2
PD
3
FO3
42
44
37
39
33
35
46
48
36
40
41
26
CH3
H
RO3
BRIDGE
FO2
CH2
H
RO2
BRIDGE
FO1
CH1
H
RO1
BRIDGE
FO4
CH4
H
RO4
BRIDGE
VM12
VM2
VM3
VM34
FOCUS/TRACKING COIL DRIVE
SLED/SPINDLE MOTOR DRIVE
Caution:
Pattern face side :Parts on the pattern face
(Side B)pattern face are indicated.
Parts face side : Parts on the parts face
S811
MENU
(Side A)parts face are indicated.
• Abbreviation
AUS: Australian
CND : Canadian
FR: French
HK: Hong Kong
AR: Argentina
EA: Saudi Arabia
CH: Chinese
EE: East European
TW: Taiwan
MX: Mexico
KR: Korean
C&SA : Central and South America
E13: AC220-230V area model
E33: AC100-240V area model
5-4. SCHEMATIC DIAGRAM – MAIN SECTION (1/3) – • Refer to page 14 for Notes. • Refer to page 14 for waveforms.
• Refer to page 15 IC for Block Diagrams.
GREEN
WHITE
DCINMNT
CN502
2P
CN503
2P
CN501
15 PIN
C503
B1
RF
BT400
E353,E355
BT401
BT402
L406
L407
C-
C+
S-
S+
OPGSW
A
B
OPSTB
LD
0.1
PD
E
F
F+
T-
T+
F-
D407
UDZS5.1B
E353,E355
D408
UDZS5.1
D402
MA2YD
D405
MA2YD2300L
C502
2.2
C422
0.22
R415
220k
R416
47k
R417
R422
Q403
SWITCH
D404
0
IC404
MM1385AN
+5V REG
CTRL
IN
GND
NSE
OUT
E353,355
E350,E351,
E351SR,E356CK
*
E353,E355
R412
2.2
BATMNT
CHGMNT
C434
0.1
C431
0.01
*Q403
2SA1241-Y
2SB1237PQR
47k
MA2YD2300L
CPOL
CDUTY
FIN-
FIN+
Q404
2SD1781K
C415
6.3V
R410
1k
2SC4116GL
R413
2.2
R414
2.2
D401
UDZS5.1B
TP411
TP412
R411
100
POWER_IC
220
Q405
GATE
TP413
TEST
XC6201P242
+2.4V REG
C401
100
6.3V
C429
2.2
IC403
C-
NCNC
UMZ6.8N
FR4
PWM4
R3
F3
VMMNT
CHGMNT
BATM2
BATM1
PREGND
SAWMON
SEI
SEO
GSW
REGB
DET
INM
GND
PD
FOCUS
COIL
TRACKING
COIL
LD
SPINDLE MOTOR
M901
SLED MOTOR
M902
OPIC
VCC
DRY BATTERY
SIZE"AA"
(IEC DESIGNATION LR6)
2PCS,3V
RECHARGEABLE
BATTERY
NC-WMAAA/NH-WM2AA
OR
2.4V
J401
DC IN 4.5V
D406
IN OUT
+
C
34
FO4
RO4
VM
PGND4
FOCUS/TRACKING COIL DRIVE
SLED/SPINDLE MOTOR DRIVE
VCC2
VG
VG
LG
DCIN
CHGB
L401
220µH
C402
4.7
16V
C426
0.1
C428
0.1
F-
L405
RO3
PGND3
SWITCHING
VIN
DGND
F+
3
FO3
VM
IC401
BH6571KVT
PGND5
DSW
47µH
L402
C404
100
6.3V
T-
2
RO2
VM
REGULATOR
VCC0
USW
VCC0
Q401
2SB16790
SWITCH
L404
T+
PGND2
EI
D-E350/E351/E351SR/E353/E355/E356CK
IC405
C433
0.01
S+
S-
12
VM
STNG
C407
0.1
RO1
VCC1-OUT
C406
2200p
10k
R403
1M
R405
100k
R401
FO1
PGND1
CLOCK
WAKEUP
PREGND2
VCPUNF
VCC1-IN
LATCH
DATA
SYNC
RESET
SOFT
SLOW
VREF
PMG
VCPU
C425
10
4V
C408
R2
F2
R1
F1
TP404
TP403
100
4V
FO2
EO
XC61CN1402MR
R419
0
TIN-
TIN+
SIN-
SIN+
C412
0.047
C409
0.22
IC402
XC6201P212MR
+2V REG
IN
OUT
GND
NC
RESET
OUT
Cd
VIN
GND
NC
C413
1000p
Q402
DTC143TUA
DEFFERENTIAL
D403
MA111-TX
NC
C405
0.1
TAP402
RESET
R407
470k
POWERLT
SDTO
SCK
XWAKEUP
RESET
R406
100k
XWAKEUP
C410
1
RESET
C427
VDD
3V
B3
SYNC
VCPU 2V
2.2V
10
4V
AVDD 2V
GND
1111
D-E350/E351/E351SR/E353/E355/E356CK
5-5. SCHEMATIC DIAGRAM – MAIN SECTION (2/3) – • Refer to page 14 for Notes. • Refer to page 14 for waveforms.
SYNC
AVDD 2V
B1
B3
TINTIN+
SINSIN+
A10
XCAS
D2
D3
D0
D1
E
XW
XRAS
A9
0.1
C628
A8
A7
A6
A5
A4
A0
A1
A2
A3
R607
0
0
R612
LD
L601
µH
10
Q601
2SB16790
LD DRIVER
TP633
DOUT
R603
100k
R602
2.2
R601
470
C604
2.2
R611
0
TDON
TDOP
SDON
SDOP
DIT
DVSSIO2
A10/CAS2B
XCAS
D2
D3
DVDDIO2
D0
D1
E
XW
XRAS
A9
A8
A7
A6
A5
A4
A0
A1
A2
A3
FIN+
FDOP
AVDD1
C638
10
4V
FIN-
CDUTY
FDON
LD
PD
CPOL
CLVOP
PD
TP601
CLVON
VMON
VMON
BATMNT
GFS
CLKDRV
E
VCHK
100k
R617
E
C603
0.1
FOK
ESPLT
10k
R626
C2FX
TP628
TP630
SYNC
C2FX
YMLD
EXPLCK
EFM/YFLG
RF AM
DIGITAL SIGNAL PROCESSOR
F
A
B
AVSS1
100k
100k
100k
R615
R614
R613
C610
0.01
B
A
F
DEFECT
TP624
TP625
TP626
TZC
FOK
RFZC
ONTRK
DEFECT
IC601
BU9355KS
P,DIGITAL SERVO,
RFO
VBIAS
RFI
BTC
PKC
RFO
TP602
0.01
C612
C611
1000p
R605
0
TP623
ONDIR
RFGO
RFGO
TP621
TP622
TGU
DETI
2200p
C613
TEST2
DVDD2
ASYO
ASYI
0
R610
C614
0.1
R633
2.2k
L604
10
TEST1
MON1
(B)
MON1
TJ603
µH
TEST0
MON2
(B)
MON2
TJ604
C608
0.1
C616
47p
C617
0.22
CLK4M
DVSS2
ADPFO
XBUSY
XBUSY
CLK4M
FCO
ADPFI
SDOUT
DVDDIO1
SDIN
SRW
SCLK
DVSSIO1
XPDW
XRST
SBSY
SFSY
SBDAT
X4M
DVSS1
XOUT
DVDD1
UTE
M
AVDD2
LLINO
LLINI
LDACO
VCDACO
RDACO
RLINI
RLINO
AVSS2
PCO
R616
470
C618
0.22
TJ610
VBIAS
C609
10
4V
/8M
XIN
C626
C625
47p
0.1
D0
D1
E
XW
XRAS
A9
SDTI
0
R631
R630
R629
R636
1M
10K
10K
*R105,205
22k
10k
*R107,207
4.7k
22k
C619
220
6.3V
47
10
C103
2.2
C203
2.2
C622
L602
10p
R628
R627
C623
10p
µH
FR
EXCEPT FR
FR
EXCEPT FR
N
TP608
C624
1
TAP601
C637
0.01
C635
2200p
C102
C202
R620
C634
2200p
TP607
TP610
TP635
TP629
TP634
TP606
C621
2.2
0
0
R105
*
R205
16.9M
*
C620
0
0
X601
SDTO
SRW
SCK
POFF
XRST
SCOR
L603
Hz
C107
R107
1000p
*
C204
R207
1000p
*
1
C629
A0
A1
A2
A3
10
4V
ATTSW
LIN
RIN
GND
BEEP
M
M
PW
BIAS
BIAS_IN
BBSW
BSTOUT
C303
C304
C307
47p
BEEP
UTE
AM
HPSW
1
10
4V
C305
10
4V
MSM51V4400E-70SJ
DRAM
D0
D1
XW
XRAS
A9
A0
A1
A2
A3
VCC
IC302
TA2120FN
HP IC
HEADPHONE
P
AM
UTE_t
UTE
RSW
ADDOUT
IC603
E
ALCDET
ALCIN
IXOUT
M
PGND
LOUT
VREF
ROUT
VCC
OCLSW
RFIN
BSTNF
(4M
XCAS
XOE
VSS
)
D3
D2
A8
A7
A6
A5
A4
R301
4.7
C301
220
6.3V
XCAS
D201
UDZ5.1B
D305
UDZ5.1B
D101
UDZ5.1B
D3
D2
A8
A7
A6
A5
A4
R109
C106
C306
4.7
0.1
2.2
FB301
FB101
0
0
FB201
R209
C206
J301
0
4.7
E355,E356CK
0.1
D301
UDZ5.1B
D303
UDZ5.1B
R818
10k
R819
1k
E355
E355,E356CK
KEY
RM
3V
VDD
VCPU 2V
GND
2.2V
RF
1212
5-6. SCHEMATIC DIAGRAM – MAIN SECTION (3/3) –• Refer to page 14 for Notes. • Refer to page 14 for waveforms.
D-E350/E351/E351SR/E353/E355/E356CK
DCINMNT
VCPU 2V
LCD801
LIQUID
CRYSTAL
DISPLAY
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
COM3
COM2
COM1
COM0
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
TP820
COM3
COM2
COM1
COM0
TP811
SEG15
SEG0
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
COM3
COM2
COM1
COM0
C809
0.1
FR
R804
HOLD
XTSB/PANA-HP_I
V3
V2
C810
0.1
C812
0.1
10k
G-PRO
PON_I
CM
V1
C811
0.22
_I
/16M
X4M
HOLD_I
C1
TP809
(P42)
FRANCE_I
AKEUP_O
C0
XW
AKEUP
XW
E353,E355
R803
10k
TP803
(P44)
XNONCHG_I
<VDD_EEPROM>
IC801
T5AW5-Z5-M0
SYSTEM CONTROL
MICON
_SCK
PGM_SDTO
<PGMSI_I>
PGM
PGM_SDTI
PGM_SCK
PGM_SDTO
BEEP
TP807
TSB
BEEP_O
M4)
GFS_I
(P13/PW
TP812
GFS
TP806
(P50)
ESPLT_O
ESPLT
OPEN
_SEL
PGM
NT
P/XOPEN
W
P/AD_RMKEY
W
P/AD_DCINM
W
UTE_O
VCC2ON_O
AM
<PGMSEL_O>
TP815
VCC2_ON
AMUTE
BATMNT
NT
AD_KEY_2
P/AD_KEY_1
AD_BATM
W
C2POEN_O
XRST_O
POFF_O
XOPSTBY_O
POFF
XRST
NT
R801
CHGM
100k
C806
*
NT
AD_SEL
AD_CHGM
AVCPU
SCK_O
MSDTO_O
(SENS)MSDTI_I
R/XW_O
XPOWLT_O
DEFECT_I
HPSW_O
SCOR_I
(DFCT_CTRL_O)
XSTOP
XRESET_I
XBUSY_I
FOK_I
VCPU
TEST
XOUT
XIN_I
GND
OPG4_O
R820
C2PO
OPSTB
OPGSW
VREFH
10k
C804
0.01
*C806
0
0.0047
R817
100k
C801
1
C807
0.01
E351,351SR,E353
E355,E356CK
TAP801
TEST
OPEN:NORMAL MODE
(
SHORT:TEST MODE
R824
C802
0.22
TAP803
R823
100k
0
R806
100k
C818
4700p
D801
MA2ZD1400
SCK
SDTO
SDTI
SRW
POWERLT
DEFECT
HPSW
SCOR
RESET2
XBUSY
TEST
CLK4M
RESET
P23
FOK
B1
GND
RMKEY
Q808
0.01
(
C814
0.1
R809
10k
C805
0.01
R810
10k
S805
R811
2.2k
S811
MENU
R813
2.2k
OPEN
C813
4700p
HOLD
G-PRO
S806
R812
4.7k
D804
UDZS5.1B
R816
220k
TAP802
S808
SOUND
R814
4.7k
OPEN
S807
D805
UMZ6.8N
S809
VOL+
R815
10k
S801
(DOOR OPEN)
OFF
ON
OFF
ON
S810
VOL-
S803
ESP
S802
HOLD
PGM_SEL
PGM_SCK
PGM_SDTI
PGM_SDTO
RESET2
VDD
TEST
CLK4M2
CN901
CHECK
1313
D-E350/E351/E351SR/E353/E355/E356CK
p
p
p
p
r
Wavef orms
Note:
1
IC601
ek X OUT
2 p-
16.9 MHz
VOLT/DIV: 1 V AC
TIME/DIV : 50 nsec
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise specifed.
•f: internal component.
Note:Note:
The components identi-Les composants identifiés
fied by mark 0 or dottedpar une marque 0 sont criline with mark 0 are cri-tiques pour la sécurité.
tical for safety.Ne les remplacer que par
Replace only with partune piéce portant le numéro
number specified.spécifié.
2
• A : B+ Line.
• Power voltage is dc 3 V and fed with regulated dc power supply
from battery terminal.
• Voltages are dc with respect to ground under no-signal conditions.
no mark : PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler
ances.
• Circled numbers refer to waveforms.
• Signal path.
E: CD PLAY
IC801
2 XIN-I
3
2.6 p-
4.24 MHz
VOLT/DIV: 1 V AC
TIME/DIV : 200 nsec
6.2 Vp-p
IC401
4 LG
PLAY MODE
4
5.6 µsec
IC401
9 USW
5
IC601qh
RFGO
5.6 µsec
VOLT/DIV: 2 V AC
TIME/DIV : 2 µsec
VOLT/DIV : 1 V AC
TIME/DIV : 2 µsec
0.45-0.65 Vp-
VOLT/DIV: 0.1 V AC
TIME/DIV : 0.5 msec
3 Vp-
• Abbreviation
AUS: AustralianCND: Canadian
FR: FrenchHK: Hong Kong
AR: ArgentinaEA: Saudi Arabia
CH: ChineseEE: East European
TW: TaiwanMX: Mexico
KR: Korean
C&SA : Central and South America
E13: AC220-230V area model
E33: AC100-240V area model
1414
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