Sony CXD2719Q Datasheet

Single-Chip Dolby Pro Logic Surround Decoder

Description

The CXD2719Q is a CMOS LSI developed for Dolby Pro Logic Surround. A SRAM for short delay and AD/DA converters are built in, and all functions necessary for Dolby Pro Logic Surround such as an adaptive matrix, a passive decoder including BNR, auto input balance, a noise sequencer and center channel mode control are contained on a single chip.

Features

• Dolby Pro Logic Surround decoding with a single

chip

• 2-channel 1-bit AD converter, decimation filter and

prefilter operational amplifier

• 4-channel 1-bit DA converter, oversampling filter

and post filter

• Analog switch for DSP bypass

• Analog electronic attenuator (+1.5 to –29.5dB) for

center/surround channel trim

• 24K-bit SRAM for short delay

• No separation or other variance for digital

processing

• External parts reduced by incorporating analog

circuits

Functions

• Adaptive matrix

• Center channel mode control

(Normal/Phantom/Wide)

• Dolby 3 Stereo

• Auto input balance control (ON/OFF)

• Noise sequencer

• Variable delay time (0 to 34.8ms)

• 7 kHz low-pass filter (12dB/Oct)

• Modified Dolby B-type NR

• Simple SFC function

• SFC mode

• DSP bypass mode (L, R-channel through) Structure

Silicon gate CMOS

Applications

Equipment having Dolby Pro Logic Surround function such as AV amplifiers, receivers and compact music systems

Absolute Maximum Ratings (Ta = 25°C, VSS = 0V)

• Supply voltage VDD VSS – 0.5 to +7.0 V

• Input voltage VI VSS – 0.5 to VDD + 0.5 V

• Output voltage VO VSS – 0.5 to VDD + 0.5 V

• Operating temperature

Topr –20 to +70 °C

• Storage temperature Tstg –55 to +150 °C

Recommended Operating Conditions

• Supply voltage VDD

Analog system 4.75 to 5.25 (5.0 typ.) V Digital system 4.50 to 5.25 (5.0 typ.) V

• Operating temperature Ta –20 to +70 °C

Input/Output Capacitance

• Input capacitance CIN 9 (max.) pF

• Output capacitance COUT 11 (max.) pF

• Input/output capacitance

CI/O 11 (max.) pF

∗

Measurement conditions: VDD = VI = 0V, F = 1MHz

Maximum Current Consumption

(Ta = 25°C, VDD = 5.25V)

• Digital/analog block total: 166.7mA

Dolby level

• During analog input: 200 to 300mVrms

• During digital input: –20dBFS

Analog characteristics

Pro Logic ON: Dolby level = 300mVrms

Prefilter gain = –3.52dB

• S/N: L, Rch = 80dB, C, Sch = 72dB

• THD + N: L, Rch = 0.015%, C, Sch = 0.03%

∗

All values for typ.

– 1 –

E98944-PS

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

CXD2719Q

80 pin QFP (Plastic)

This device is available only to parties obtaining the license from Dolby Laboratories Licensing Corporation. "Dolby", the double-D symbol and "Pro Logic" are trademarks of Dolby Laboratories Licensing Corporation.

– 2 –

CXD2719Q

Block Diagram

XSOUT

XCOUT

ROUT

LOUT

LO2

RIN

LO1

LIN

DAC1

DAC2

DAC3

DAC4

Trim Vol

ADC2

ADC1

Analog SW

DSP

24K bit DELAY RAM

CLOCK GENERATOR

/TIMING CIRCUIT

MICROCOMPUTER I/F

SERIAL DATA I/F

XTLI

XTLO

BFOT

XMST

BCK

REDY

XLAT

SCK

RVDT

LRCK

(Phase Inverted Output)

Pin Configuration

T.P

TST0

TST1

TST2

TST3

TST4

XRST

BFOT

CSL1

CSL2

AVS3

AVD3

LOUT

AVD1

T.P

BCK

T.P

XS24

RVDT

T.P

REDY

SCK

AVS4

AVD4

ROUT

AVD2

AVS1

LO1

LIN

AVD5

AVS5

XCOUT

AVDX

XTLO

XTLI

AVSX

XSOUT

AVS6

AVD6

RIN

LO2

AVS2

XLAT

LRCK

XMST

6364

66 67 68

69 70

71 72 73 74 75 76

77 78

79 80

T.P

SS7

DD2

T.P

– 3 –

CXD2719Q

Pin Description Notations in parentheses indicate the fixed pin connection status.

1 to 3

5 to 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

T.P VSS0 T.P TST0 VDD0 VSS1 TST1 TST2 TST3 TST4 XRST BFOT CSL1 CSL2 VSS2 AVS3 AVD3 LOUT AVD1 AVS1 LO1 LIN AVD5 AVS5 XCOUT AVDX XTLO XTLI AVSX XSOUT AVS6 AVD6

—

I — —

I — — —

O — —

I — —

—

I —

O — —

Test monitor. Normally outputs Low. (OPEN) Digital GND. (VSS) Test monitor. Normally outputs Low. (OPEN) Test. Normally fixed Low. (VSS) Digital power supply. (VDD) Digital GND. (VSS) Test. Normally fixed Low. (VSS) Test. Normally fixed Low. (VSS) Test. Normally fixed Low. (VSS) Test. Normally fixed Low. (VSS) System reset input. Reset when Low. Clock, frequency-division output. [384/768/256/512fs] Test. Normally fixed High. (VDD) Test. Normally fixed Low. (VSS) Digital GND. (VSS) L-ch DA converter GND. (AVSS) L-ch DA converter power supply. (AVDD) L-ch DA converter output. L-ch AD converter power supply. (AVDD) L-ch AD converter GND. (AVSS) L-ch AD converter LPF operational amplifier inverted output. L-ch AD converter analog input. C-ch DA converter power supply. (AVDD) C-ch DA converter GND. (AVSS) C-ch DA converter output. Analog power supply for master clock. (AVDD) Crystal oscillator circuit output. Crystal oscillator circuit input. Analog GND for master clock. (AVSS) S-ch DA converter output. S-ch DA converter GND. (AVSS) S-ch DA converter power supply. (AVDD)

Pin No. Symbol I/O Description

(OPEN): Open, (VDD): +5V digital power supply, (AVDD): +5V analog power supply, (VSS): Digital GND, (AVSS): Analog GND

– 4 –

CXD2719Q

Notations in parentheses indicate the fixed pin connection status.

(OPEN): Open, (VDD): +5V digital power supply, (AVDD): +5V analog power supply, (VSS): Digital GND, (AVSS): Analog GND

∗

There are three digital and seven analog power supplies, but the power-on sequence is not specified.

Pin No.

38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60

61 to 63

65 to 72

73 74

75 to 80

Symbol

RIN LO2 AVS2 AVD2 ROUT AVD4 AVS4 VSS3 SCK REDY T.P XLAT RVDT XS24 VDD1 VSS4 T.P SI T.P BCK LRCK VSS5 XMST T.P VSS6 T.P VDD2 VSS7 T.P

I/O

O — —

O — — —

I O O

— —

I/O I/O

—

I O

—

— —

Description

R-ch AD converter analog input. R-ch AD converter LPF operational amplifier inverted output. R-ch AD converter GND. (AVSS) R-ch AD converter power supply. (AVDD) R-ch DA converter output. R-ch DA converter power supply. (AVDD) R-ch DA converter GND. (AVSS) Digital GND. (VSS) Shift clock input for microcomputer interface. Transfer enabling signal output for microcomputer interface. Transfer prohibited when Low. Test monitor. Normally outputs Hi-Z. (OPEN) Latch input for microcomputer interface. Data input for microcomputer interface. Serial data 24-/32-bit slot selection. 24-bit slot when Low. (valid for slave mode) Digital power supply. (VDD) Digital GND. (VSS) Test monitor. Normally outputs Low. (OPEN) 1-sampling 2-channel serial data input. Test input. Normally inputs Low. (VSS) Serial bit transfer clock for serial I/O data SI and SO. Sampling frequency clock for serial I/O data SI and SO. Digital GND. (VSS) BCK, LRCK master/slave mode switching input. Master mode when Low. Test monitor. Normally outputs Low. (OPEN) Digital GND. (VSS) Test monitor. Normally outputs Low. (OPEN) Digital power supply. (VDD) Digital GND. (VSS) Test monitor. Normally outputs Low. (OPEN)

– 5 –

CXD2719Q

DC Characteristics

(AVD1 to 6 = AVDX = VDD0 to 2 = 5V ± 5%, AVS1 to 6 = AVSX = VSS0 to 7 = 0V, Ta = –20 to +70°C)

Item

Symbol

Conditions Min. Max. Unit Applicable pinsTyp.

V V V V V V V V V V

V µA µA µA

Ω

∗1, ∗2, ∗7 ∗1, ∗2, ∗7 ∗5 ∗5 ∗3, ∗6 ∗3, ∗6 ∗4 ∗8, ∗9 ∗8, ∗9, ∗10 ∗11 ∗11 ∗1, ∗5, ∗7 ∗2, ∗3, ∗6 ∗9, ∗10

Resistance between ∗7and

∗11

High level Low level High level Low level High level Low level

High level Low level High level Low level

Input voltage (1)

Input voltage (2)

Input voltage (3)

Input voltage (4) Output voltage

(1) Output voltage

(2) Input leak current (1)

Input leak current (2) Output leak current Feedback resistance

VIH VIL VIH VIL VIH VIL VIN VOH VOL VOH VOL II II IOZ RFB

CMOS input

Schmitt input

TTL input

Analog input IOH = –2.0mA IOL = 4.0mA IOH = –12.0mA IOL = 12.0mA VIH = VDD, VSS VIH = VDD, VSS VIH = VDD, VSS

0.7VDD

0.8VDD

2.2

VSS

VDD – 0.8

VDD/2

–10 –40 –40

250k 1M

0.3VDD

0.2VDD

0.8

VDD

0.4

VDD/2

10 40 40

2.5M

∗1

CSL2, CSL1, TST0 to TST4, XMST

∗2

XLAT, RVDT, XS24, SCK

∗3

∗4

LIN, RIN

∗5

XRST

∗6

During input to bidirectional pins BCK, LRCK

∗7

XTLI

∗8

During output from bidirectional pins BCK, LRCK

∗9

BFOT

∗10

REDY

∗11

XTLO

– 6 –

CXD2719Q

AC Characteristics

(AVD1 to 6 = AVDX = VDD0 to 2 = 5V ± 5%, AVS1 to 6 = AVDX = VSS0 to 7 = 0V, Ta = –20 to +70°C)

Input Timing from Power-on to Input Pin

•••••

VDD

XTLI

XRST

Input pins

0.7V

0.3VDD

1/fs or more

Determined by the crystal and other external circuit conditions

Stable (clock applied correctly)

0.8V

0.2VDD

0.95VDD

First input

BCK

LRCK

tHLR tSLR

0.7V

0.3VDD

0.7VDD

0.3VDD

tSSI tHSI

0.7V

0.3VDD

BCK

LRCK

tDLR

Serial Audio Interface Timing [Slave mode]

[Master mode]

Item SI setup time SI hold time LRCK setup time LRCK hold time LRCK delay time

Symbol

tSSI

tHSI tSLR tHLR tDLR

Conditions Slave mode Slave mode Slave mode Slave mode Master mode, CL = 120pF

Min.

20 40 20 40

Max.

Unit

ns ns ns ns ns

– 7 –

CXD2719Q

Microcomputer Interface Timing

Transfer timing for address section, transfer mode section and data section LSB

Transfer timing from data section MSB to address section and transfer mode section

Notes) 1. t is the cycle of 2/3 the clock frequency applied to the XTLI pin. (512fs)

2. The REDY pin is the value for CL = 60pF.

Item RVDT data setup time relative to SCK rise RVDT data hold time from SCK rise SCK Low level width SCK High level width XLAT Low level width XLAT High level width SCK rise preceding time relative to XLAT rise SCK rise wait time relative to XLAT rise Delay time to REDY fall relative to SCK rise REDY fall preceding time relative to SCK rise REDY rise preceding time relative to XLAT rise REDY rise preceding time relative to SCK fall XLAT fall wait time relative to SCK rise XLAT fall delay time relative to REDY fall SCK rise wait time for next transfer

Symbol

tDS tDH

tSWL

tSWH

tLWL

tLWH

tSLP

tLSD tSBD tBSP

tRLP

tRSDP

tSLD tLDR

tSS

Min.

20 1t + 20 1t + 20 1t + 20 1t + 20 1t + 20

20 3t + 20

20 2t + 40

Max.

4t + 50

Unit

ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns

RVDT

SCK

tSWL

tSWH tDS tDH

Address LSB Mode MSB

0.3VDD

0.7VDD

0.3VDD

0.7VDD

tSLP tLSD

tLWL

0.3VDD

0.7VDD

XLAT

REDY

Data LSB Data MSB

RVDT

SCK

XLAT

REDY

Mode MSB

0.3V

0.7VDD

Address LSBData MSB

tSS

tLDR

tSBD

tSLD

tBSP

0.3V

0.7VDD

tRLP

0.3V

0.7VDD

– 8 –

CXD2719Q

Analog Characteristics

(AVD0 to 6 = VDD0 to 2 = AVDX = 5.0V, AVS0 to 6 = VSS0 to 7 = AVSX = 0.0V, fs = 44.1kHz, Ta = 25°C)

When Pro Logic mode is on, the input signal level while measuring the center (C) and surround (S) channels should be –3dB smaller than the input level while measuring the left (L) and right (R) channels. Note that the C channel is input in-phase to the L channel, and the S channel is input at reversed phase to the R channel. The input level is the same for all measurement items when Pro Logic mode is off.

1. ADC + DAC Connection Total Characteristics

n addition to the ADC and DAC, the total characteristics include the prefilter with built-in operational amplifier, built-in post filter, and trim volume. Use the analog I/O circuits in the Application Circuit for the measurement circuit.

1-1. When Pro Logic mode is on

Unless otherwise specified, the measurement conditions are as given below.

• VIN (L, R) = 300mVrms, VIN (C, S) = 212mVrms (= 0dB)

• fIN = 1kHz

∗1

When VIN = 200mVrms (= –3.52dB), the S/N ratio is 3.52dB smaller than the values noted in the table above.

∗2

VIN (L, R) = 2.0Vrms, VIN (C, S) = 1.414Vrms

∗3

VIN (L, R) = 300mVrms, VIN (C, S) = 212mVrms

∗4

VIN (L, R) = 200mVrms, VIN (C, S) = 141mVrms

∗5

When the L and R channel gain deviation is 0.1dB or less for the ADC front-end prefilter output.

∗6

Includes the amplification (L/Rch...5.27dB

, C/Sch...13.72dB) of the external amplifier.

∗7

The trim volume is set to 0dB.

L, R C, S L, R

S L, R C, S L, R C, S L, R C, S L, R

L, R C, S

(all) (all)

L, R

C, S

∗7

70 65

25 25

250

80 72 60 56 64

0.04

0.007

0.015

0.03

0.02

0.04

0.12

0.18

0.04

16.5 60 40

280

±0.2

36 91

3.9

–13.2

1.00

310

Vrms

S/N ratio

∗1

THD + N

Head room

Matrix rejection

Output level Level difference between channels

Current consumption

Power supply rejection ratio

∗6

CCIR/ARM filter

10Hz to 500kHz

10Hz to 20kHz VIN = 16.5dB

∗2

10Hz to 20kHz VIN = 0dB

∗3

10Hz to 20kHz VIN = –3.52dB

∗4

10Hz to 500kHz

10Hz to 20kHz, THD + N = 1%

∗5

Analog system (including oscillator circuit) Digital system

1mVrms

, 100Hz sine wave

Channels Min. Typ. Max. UnitItem Measurement conditions

– 9 –

CXD2719Q

1-2. When Pro Logic mode is off

Unless otherwise specified, the measurement conditions are as given below.

• VIN (L, R, C, S) = 2.0Vrms (= 0dB)

• fIN = 1kHz

L, R

C, S

(all)

L, R

C, S

L, R

C, S

(all) (all) 1.7

97 90

0.03

0.004

0.01 93 83

1.33

1.85

1.00

2.0

Vrms Vrms

S/N ratio

THD + N

∗11

Dynamic range

∗12

ADC maximum input level

∗13

Output level

∗14

EIAJ (with "A" weighting filter)

EIAJ (0dB)

EIAJ (–3dB)

EIAJ (–60dB)

(Full-scale output)

∗11

See Graphs 1a and 1b.

∗12

THD + N during –60 dB input

∗13

The analog input level at which the ADC outputs full scale varies according to supply voltage AVDn. When supply voltage AVDn contains deviation, calculate the maximum input level from (Formula 1) below and adjust the level with the ADC front-end prefilter, etc., so that the waveform is not clipped at the minimum voltage.

ADC maximum input level [Vrms] = 1.33 [Vrms] × (Formula 1)

∗14

Like the ADC, the DAC conversion gain also varies according to supply voltage AVDn. However, the DAC has the reverse characteristics of the ADC, so the total gain between the ADC and DAC is constant.

Minimum supply voltage [V]

5.0 [V]

–60 –50 –40 –30 –20 –10 0

0.001

0.01

0.1

Graph 1a. L, R Channel Characteristics

Analog input level [dB]

THD + N [%]

0dB = 2Vrms fin = 1kHz

–60 –50 –40 –30 –20 –10 0

0.001

0.01

0.1

Graph 1b. C, S Channel Characteristics

Analog input level [dB]

THD + N [%]

0dB = 2Vrms fin = 1kHz

Channels Min. Typ. Max. UnitItem Measurement conditions

– 10 –

CXD2719Q

2. DAC Characteristics

In addition to the DAC, these characteristics include the built-in post filter and trim volume. Use the digital input and analog output circuits in the Application Circuit for the measurement circuit.

2-1. When Pro Logic mode is on

Unless otherwise specified, the measurement conditions are as given below.

• Digital data = –20dBFS

• fIN = 3kHz

Channels

L, R C, S L, R

C S

L, R

C S

L, R

C S

L, R-in

C-in

S-in (all)

Min. Typ.

77 68 60 52 65

0.05

0.08

0.06

0.15

0.3

0.08 –20 200

62 87 79

±0.2

Max. Unit

dBFS

mVrms

Item

S/N ratio

THD + N

Dolby level Output level

∗31

Matrix rejection

Level difference between channels

Measurement conditions

CCIR/ARM filter Data = –20dBFS

10Hz to 500kHz Data = –20dBFS

10Hz to 20kHz Data = –20dBFS

10Hz to 500kHz Data = –20dBFS

Data = –20dBFS

fIN = 3kHz

∗31

The output level depends on supply voltage AVDn as shown in (Formula 2) below.

Output level [mVrms] = 285 [mVrms] × (Formula 2)

Supply voltage AVDn [V]

5.0 [V]

– 11 –

CXD2719Q

2-2. When Pro Logic mode is off

Unless otherwise specified, the measurement conditions are as given below.

• Digital data = Full scale (0dBFS)

• fIN = 1kHz

Channels

L, R

C, S

L, R

C, S

L, R

C, S

L, R

C, S

(all)

Min. Typ.

100

0.03

0.007

0.01 87 83

2.0

Max. Unit

Vrms

Item

S/N ratio

THD + N

∗41

Dynamic range

∗42

Output level

∗43

Measurement conditions

EIAJ (with "A" weighting filter)

EIAJ (0dB)

EIAJ (–3dB)

EIAJ (–60dB)

∗41

See Graphs 2a and 2b.

∗42

THD + N during –60dB input

∗43

The output level depends on supply voltage AVDn as shown in (Formula 3) below.

Output level [Vrms] = 1.9 [Vrms] × (Formula 3)

Supply voltage AVDn [V]

5.0 [V]

–60 –50 –40 –30 –20 –10 0

0.001

0.01

0.1

Graph 2b. C, S Channel Characteristics

Digital input level [dB]

THD + N [%]

0dB = Full scale fin = 1kHz

–60 –50 –40 –30 –20 –10 0

0.001

0.01

0.1

Graph 2a. L, R Channel Characteristics

THD + N [%]

Digital input level [dB]

0dB = Full scale fin = 1kHz

– 12 –

CXD2719Q

3. Bypass Mode Characteristics (L, R channels only)

These are the characteristics without passing through the DSP, and including the prefilter with built-in operational amplifier and the built-in post filter. Use the analog I/O circuits in the Application Circuit for the measurement circuit. Unless otherwise specified, the measurement conditions are as given below.

• fIN = 1kHz

• VIN (L, R) = 2.0Vrms (= 0dB)

Min. Typ.

100

0.008

0.005 95

2.5

2.0

±0.2

105

7.5

Max. Unit

dB Vrms Vrms

Item

S/N ratio

THD + N

Dynamic range

∗51

Maximum input level Output level Level difference between channels Channel separation

Power supply rejection ratio

∗52

Measurement conditions

CCIR/ARM filter 10Hz to 20kHz, "A" weighting filter 10Hz to 500kHz

10Hz to 500kHz 10Hz to 20kHz 10Hz to 20kHz, VIN = –60dB THD + N = 0.05%

1mVrms, 100Hz sine wave

Min.

Typ.

104

Max.20Unit

kΩ

kHz

Item

Prefilter

Post filter

Measurement conditions Feedback resistance value Maximum amplification rate

(100kHz or less) Load resistance value Cut-off frequency (= fc)

Min. Typ.

1.5

–29.5

1.0

Max. Unit

dB dB dB

Item Maximum gain Minimum gain Variable step

Symbol TRIMmax TRIMmin TRIMstep

∗51

THD + N during –60dB input

∗52

Includes the amplification (5.27dB) of the external amplifier.

4. Filter Characteristics

5. Trim Volume Characteristics

– 13 –

CXD2719Q

Description of Functions

1. Master/Slave Modes

[Relevant pins] XMST, LRCK, BCK

When using the CXD2719Q alone without digital input, set the CXD2719Q to master mode. When using digital input, the CXD2719Q may be set to either master mode or slave mode. The clock applied to LRCK and BCK in slave mode must be synchronized to either the crystal oscillator clock of the XTLI and XTLO pins or the external clock input from the XTLI pin.

Table 1-1. LRCK, BCK Mode Setting

XMST

Mode

Slave mode

Master mode

LRCK, BCK I/O

Input

Output

SQC05

0 0 1 1

SQC04

0 1 0 1

BFOT

384fs 256fs 512fs 768fs

2. Master Clock System

[Relevant pins] XTLI, XTLO, BFOT

768fs (fs = 32 to 44.1kHz) is assumed for the master clock system, and the connection is as shown below. BFOT outputs the clock obtained by frequency dividing the master clock. The frequency division ratio can be changed by the setup register (SQC04, SQC05). (See "6. Setup Register".)

(1) Master

(2) Slave

Frequency divider

Setup Register

512fs

XTLI

XTLO

768fs

BFOT 256fs/384fs/512fs/768fs

512fs

XTLI

XTLO

768fs

OPEN

Frequency divider

Fig. 2-1.

Note) Oscillation circuits may differ according to peripheral circuit and

substrate. Consult with crystal oscillator manufacturers about the selecting oscillation circuits.

– 14 –

CXD2719Q

3. Reset Circuit

[Relevant pins] XRST, XTLI, XTLO

This LSI must be reset after the power is turned on. Reset is done by setting the XRST pin Low for 1/fs or more after the supply voltage satisfies the recommended operating condition, and the crystal oscillator clock of the XTLI and XTLO pins or the external clock input from the XTLI pin is correctly applied. (See "AC Characteristics".)

4. Serial Audio Interface (SIF)

[Relevant pins] SI, BCK, LRCK, XS24, XMST

Serial data is used for the external communication of the digital audio data. The CXD2719Q has only one input system, and 2 channels of data are input each sampling cycle. Either the 32-bit clock mode or the 24-bit clock mode can be selected. In master mode, the mode is fixed to the 32-bit clock mode.

(1) Pin Configuration (The pins shown in the table below are assigned to the SIF.)

Serial input; taken with synchronized to BCK. BCK I/O; either 32-bit clock mode (64fs) or 24-bit clock mode (48fs). BCK output supports

32-bit clock mode only. LRCK I/O (1fs). SIO slot number (24/32) selection input. Low: 24-bit slot; High: 32-bit slot.

Valid only in slave mode. Set High in master mode. Do not switch between High and Low during DSP operation.

BCK, LRCK master mode/slave mode switching input. Low: master mode; High: slave mode.

Symbol

SI BCK LRCK

XS24

XMST

I/O

Function

I I/O I/O

"0": normal, "1": IIS "0": Lch "H", "1": Lch "L"

"0": edge ↓, "1" : edge ↑

Setup register SQC15 SQC14

SQC13

Function

Contents LRCK format LRCK polarity selection BCK polarity selection relative to LRCK edge

Valid only in slave mode. Fix to "0" in master mode.

Table 4-1. Pin Configuration

Table 4-2. LRCK/BCK Mode Setting

(2) Operation Modes

The LRCK/BCK mode can be selected by the setup register settings as follows. (See "6. Setup Register".)

LRCK/BCK Mode Setting

– 15 –

CXD2719Q

Table 4-3. Setup Register Settings

(3) SIF Format

The serial audio interface has only one input system, and except for the slot number, the following formats can be set by setting the setup register. The serial audio interface can also support IIS format to enable connection to Philips and other company's devices. The timing charts for each data format are given on the following page.

SQC12

0 0 1 1

SQC11

0 1 0 1

Data arrangement/Frontward or rearward truncation/Data word length

MSB first/Frontward truncation/24 bits

MSB first/Rearward truncation/16 bits MSB first/Rearward truncation/18 bits MSB first/Rearward truncation/20 bits

∗

All formats support either the 24- or 32-bit slot in slave mode.

– 16 –

CXD2719Q

23 22 21 20 19 18 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 0017 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 0017 16

15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 0017 1619 18 19 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 0017 1618

LRCK

BCK

23 22 21 20 19 18 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

• MSB first 24 bits frontward truncation (SQC12, 11 = 0, 0)

• MSB first 16 bits rearward truncation (SQC12, 11 = 0, 1)

• MSB first 18 bits rearward truncation (SQC12, 11 = 1, 0)

• MSB first 20 bits rearward truncation (SQC12, 11 = 1, 1)

Lch

Rch

LSB MSBIavalid LSB Iavalid

MSBIavalid LSB MSBIavalid LSB

LSB MSBIavalid LSB

MSB

Iavalid

MSBMSB

23 22 21 20 19 18 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 23 22 21 20 19 18 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

19 18 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 19 18 17 16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00

LRCK

BCK

LSB MSB LSB

MSB LSB MSBIavalid LSB

LSB MSBIavalid LSB

MSB

Iavalid

Lch

Rch

MSB

• MSB first 24 bits (SQC12, 11 = 0, 0)

• MSB first 16 bits rearward truncation (SQC12, 11 = 0, 1)

• MSB first 18 bits rearward truncation (SQC12, 11 = 1, 0)

• MSB first 20 bits rearward truncation (SQC12, 11 = 1, 1)

Digital Audio Data Input Timing (with polarities: SQC15 = 0, SQC14 = 0, SQC13 = 0)

32-bit slot

24-bit slot

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CXD2719Q

5. Microcomputer Interface

[Relevant pins] RVDT, SCK, XLAT, REDY

The CXD2719Q performs the serial audio interface format setting and the coefficient settings such as volume and filter by serial data from the microcomputer.

(1) Pin Configuration

The four external pins indicated in the table below are assigned to the microcomputer interface.

Serial data input from microcomputer. Shift clock for serial data. Input data from RVDT is taken according to the SCK rise. Interprets the 8 bits of RVDT before this signal rises as transfer mode data, and the

bits before that as address data. Transfer prohibited while at Low level. Transfer enabled at High. This pin is an open

drain, and must be pulled up externally.

Symbol RVDT SCK

XLAT

REDY

I/O

Function I I

Table 5-1. Microcomputer Interface External Pins

(2) Description of Communication Formats

The internal data transfer timing from the microcomputer interface to the coefficient RAM and setup register is called the SV cycle, and is generated once per 1 LRCK. The SV cycle is generated immediately preceding the signal processing program, so it has absolutely no effect on signal processing, and there is no risk of the sound being cut.

Address section + Mode section + Data section

act as one package of data to transfer data from the microcomputer to the CXD2719Q.

[Write]∗For coefficient RAM

A0 A7 M0 M7 D0 D15

Address section (8 bits) Mode section (8 bits)

RVDT

SCK

XLAT

REDY

Data section (16 bits)

Fig. 5-1. Example of Communication

– 18 –

CXD2719Q

(3) Data Structure

The data structure is classified into three types, as shown in the table below. All data communication is done with LSB first.

Coefficient RAM and setup register are both 16 bits

Symbol A0 to A7 M0 to M7 D0 to D15/SQ00 to SQ15

Bit length

Remarks 8 8

Contents

Address section

Transfer mode section

Data section

Table 5-2. Data Structure

(3)-1. Transfer Mode Section

The transfer mode section is 8 bits and has the following functions.

Normally fixed to "0" SU1 SU0

0 0 Field A 0 1 Field B 1 0 Field C 1 1 Field D

VS1 VS0

0 0 Setup register 1 0 Coefficient RAM

Normally fixed to "0"

Bit

M5 M4

M3 M2 M1 M0

Symbol

Function

SU1

SU0 VS1

VS0

Reserve

Setup Reg. type

Data type

Reserve

Table 5-3. Transfer Mode Section

(3)-2. Address Section

The coefficient RAM has a 256-word structure, so the address section is 8 bits. The setup register has a 4word structure and the field (address) is specified by the mode section, so the address section data may be optional.

(3)-3. Data Section

The coefficient RAM and setup register both have a 16-bit structure, so 16 SCK are required.

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