—1—
E97841-TE
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Timing Generator for Progressive Scan CCD Image Sensor
48 pin TQFP (Plastic)
CXD2434ATQ
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage VDD VSS –0.5 to +7.0 V
• Input voltage VI VSS –0.5 to VDD +0.5 V
• Output voltage VO VSS –0.5 to VDD +0.5 V
• Operating temperature
Topr –20 to +75 °C
• Storage temperature
Tstg –55 to +150 °C
Recommended Operating Conditions
• Supply voltage VDD 4.75 to 5.25 V
• Operating temperature
Topr –20 to +75 °C
Description
The CXD2434ATQ is an IC developed to generate
the timing pulses required by the Progressive Scan
CCD image sensors as well as signal processing
circuits. The CXD2434ATQ adds EFS operation
when using the high-speed electronic shutter and
other changes to the CXD2434TQ specifications.
Features
• External trigger function
• Electronic shutter function
• Supports non-interlaced operation
• 30 frames/s
• Built-in driver for the horizontal (H) clock
• Base oscillation 1560 fH (24.5454 MHz)
Applications
Progressive Scan CCD cameras
Structure
Silicon gate CMOS IC
Applicable CCD Image Sensors
ICX084AK, ICX084AL
TG
PULSE GENERATOR
10
13
14
21
18
22
23
17
16
19
38
39
40
REGISTER
PS
STRB
DCLK
DATA
SMD1
SMD2
XSUB
TEST1
TEST2
RESET
RG
H1
H2
XSHP
XSHD
XRS
XV1
XV2
XV3
XSG
CLD
CL
CKO
BUSY
WEN
ID
PBLK
XCPOB
XCPDM
VD
HD
STDBY
WM
SMDE
FSE
DECODE
COUNTER
GATE
41
48
28
11
9
8
7
5
4
3
252629424647313233343536
1 2
43 44 45
6
12 15 20 24 27 30 37
OSCO
OSCI
TRIG
ESG
EFS
V
SS
V
DD
V
SS
V
DD
V
SS
V
SS
V
DD
V
SS
1/2
1 2 3 4 5 6 7 8 9
10 11 12
13
14
15
16
17
18
19
20
21
22
23
24
35 34 33 32 31 30 29 28 27 252636
46
45
44
43
42
41
40
39
38
37
47
48
CXD2434ATQ
V
SS
CL
CLD
CKO
RESET
STDBY
TRIG
ESG
EFS
HD
VD
TEST2
V
SS
XRS
XSHD
XSHP
V
DD
XSG
XV1
XV2
XV3
V
SS
H2
H1
BUSY
WEN
ID
PBLK
XCPOB
SCPDM
V
DD
WM
TEST1
V
SS
SMDE
FSE
OSCO
OSCI
PS
STRB
DCLK
V
SS
DATA
SMD1
SMD2
RG
XSUB
V
DD
Block Diagram
Pin Configuration (Top View)
—3—
CXD2434ATQ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
O
I
I
I
I
—
I
I
I
O
O
—
O
O
—
O
O
O
O
—
O
O
O
—
I
I
—
I
I
—
O
O
O
O
O
O
—
O
O
OSCO
OSCI
PS
STRB
DCLK
VSS
DATA
SMD1
SMD2
RG
XSUB
VDD
H1
H2
VSS
XV3
XV2
XV1
XSG
VDD
XSHP
XSHD
XRS
VSS
FSE
SMDE
VSS
TEST1
WM
VDD
XCPDM
XCPOB
PBLK
ID
WEN
BUSY
VSS
CL
CLD
Inverter output for oscillation.
Inverter input for oscillation.
Switching for electronic shutter speed input method. (With pull-up resistor)
Low: Serial input, High: Parallel input
Shutter speed setting. (With pull-up resistor)
Shutter speed setting. (With pull-up resistor)
GND
Shutter speed setting. (With pull-up resistor)
Shutter mode setting. (With pull-up resistor)
Shutter mode setting. (With pull-up resistor)
Reset gate pulse output.
CCD discharge pulse output.
Power supply.
Clock output for horizontal CCD drive.
Clock output for horizontal CCD drive.
GND
Clock output for vertical CCD drive.
Clock output for vertical CCD drive.
Clock output for vertical CCD drive.
Sensor charge readout pulse output.
Power supply.
Sample-and-hold pulse output.
Sample-and-hold pulse output.
Sample-and-hold pulse output.
GND
Switching for external trigger discharge operation. (With pull-up resistor)
Low: No high-speed discharge, High: High-speed discharge
Switching for readout timing. (With pull-up resistor)
Low: ESG input valid, High: ESG input invalid
GND
Test. (With pull-down resistor)
WEN mode setting. (With pull-down resistor)
Low: Effective line, High: XSG synchronization
Power supply.
Clamp pulse output.
Clamp pulse output.
Blanking cleaning pulse output.
Line identification output.
Write enable output.
Trigger mode flag output.
GND
780 fH clock output.
AD conversion pulse output.
Pin Description
Pin No. Symbol I/O Description
—4—
CXD2434ATQ
Pin No. Symbol I/O Description
40
41
42
43
44
45
46
47
48
CKO
RESET
STDBY
TRIG
ESG
EFS
HD
VD
TEST2
O
I
I
I
I
I
I
I
I
1560 fH clock output.
RESET. (With pull-up resistor) Low : Reset, High : Normal
Standby. (With pull-up resistor)
Low: Internal clock supply stopped, High: Normal
External trigger input. (With pull-up resistor)
External readout input. (With pull-up resistor)
Vertical CCD discharge input. (With pull-up resistor)
Horizontal sync signal input.
Vertical sync signal input.
Test. (With pull-up resistor)
Electrical Characteristics
1. DC Characteristics VDD=4.75 V to 5.25 V Topr= –20 to +75 °C
Item
Supply voltage
Input voltage 1
(Input pins other than those listed below)
Input voltage 2
(Pin 2)
Output voltage 1
(Output pins other than those listed below)
Output voltage 2
(Pins 21, 22, 23, 38, 39 and 40)
Output voltage 3
(Pin 10)
Output voltage 4
(Pins 13 and 14)
Output voltage 5
(Pin 1)
Feedback resistor
Pull-up resistor
Pull-down resistor
Current consumption
Symbol
VDD
VIH1
VIL1
VIH2
VIL2
VOH1
VOL1
VOH2
VOL2
VOH3
VOL3
VOH4
VOL4
VOH5
VOL5
RFB
RPU
RPD
IDD
Conditions
IOH=–2.5 mA
IOL=4.5 mA
IOH=–5.0 mA
IOL=9.0 mA
IOH=–7.5 mA
IOL=13.5 mA
IOH=–14.0 mA
IOL=24.0 mA
VIN=VSS or VDD
VIL=0 V
VIH=VDD
VDD=5 V
Min.
4.75
0.7 VDD
0.7 VDD
VDD–0.4
VDD–0.4
VDD–0.4
VDD–0.4
VDD/2
Typ.
5.0
1 M
50 k
50 k
40
Max.
5.25
0.3 VDD
0.3 VDD
0.4
0.4
0.4
0.4
VDD/2
100 k
100 k
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Ω
Ω
Ω
mA
—5—
CXD2434ATQ
2. AC Characteristics
1) Waveform characteristics of H1, H2 and RG
tRH1 tWH1 tFH1
0.9VDD
0.1VDD
0.9VDD
0.1VDD
tFH2 tWH2 tRH2
tRRG tWRG tFRG
H1
H2
RG
0.9V
DD
0.1VDD
VDD=5.0 V, Topr=25 °C, load capacitance of H1 and H2=100 pF, load capacitance of RG=10 pF
Symbol
tRH1
tFH1
tWH1
tRH2
tFH2
tWH2
tRRG
tFRG
tWRG
Definition
H1 rise time
H1 fall time
H1 high level time
H2 rise time
H2 fall time
H2 low level time
RG rise time
RG fall time
RG high level time
Min.
25
25
10
Typ.
6
5
35
6
5
35
2
2
15
Max.
15
15
15
15
5
5
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
—6—
CXD2434ATQ
2) Phase characteristics of H1, H2, RG, XSHP, XSHD, XRS, CL, CLD and CKO
tH1
0.5VDD 0.5VDD 0.5VDD
tPD3 tPD1
0.5VDD 0.5VDD
tPD2
0.5VDD 0.5VDD
tPD4 tPD5
tW1
0.5VDD 0.5VDD
tW2 tPD6
0.5VDD 0.5VDD
0.5VDD
tPD7
0.5VDD
tPD8 tPD9
0.5VDD 0.5VDD
tW3tPD10
tW4
0.5VDD 0.5VDD
tW5
tW5
0.5VDD 0.5VDD
0.5VDD
0.5VDD
tPD11 tPD11
H1
H2
RG
XSHP
XSHD
XRS
CLD
CL
CLO
VDD=5.0 V, Topr=25 °C, load capacitance of CL and CKO=30 pF, load capacitance of CLD, XSHP, XSHD, XRS and RG=10 pF
Symbol
tH1
tPD1
tPD2
tPD3
tPD4
tPD5
tPD6
tPD7
tPD8
tPD9
tPD10
tPD11
tW1
tW2
tW3
tW4
tW5
Definition
H1 cycle
H2 rising delay, activated by the falling edge of H1
H2 falling delay, activated by the rising edge of H1
H1 rising delay, activated by the rising edge of RG
XSHP falling delay, activated by the falling edge of RG
H1 falling delay, activated by the rising edge of XSHP
H1 rising delay, activated by the rising edge of XSHD
CLD falling delay, activated by the falling edge of XSHD
CLD falling delay, activated by the rising edge of XRS
XRS falling delay, activated by the falling edge of CLD
CL falling delay, activated by the rising edge of H1
H1 rising (falling) delay, activated by the rising edge of CKO
XSHP pulse width
XSHD pulse width
CLD pulse width
CL pulse width
CKO pulse width
Min.
–5
–5
–5
–2
–7
–5
–5
17
0
–5
–5
13
15
17
38
17
Typ.
82
0
0
0
4
2
2
2
22
8
0
2
18
20
22
41
20
Max.
5
5
5
10
7
7
7
27
15
5
7
23
25
27
45
24
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
—7—
CXD2434ATQ
3) Phase conditions of HD, VD, TRIG, EFS and ESG
0.5VDD
tSETUP
tHOLD
0.5VDD 0.5VDD
CL
HD, VD, TRIG
EFS, ESG
VDD=5.0 V, Topr=25 °C, load capacitance of CL=30 pF
Symbol
tSETUP
tHOLD
Definition
HD, VD, TRIG, EFS and ESG setup time, activated by CL
HD, VD, TRIG, EFS and ESG hold time, activated by CL
Min.
20
5
Typ. Max. Unit
ns
ns
4) Phase characteristics of XV1, XV2, XV3, XSG, PBLK, XCPDM, XCPOB, BUSY, WEN and ID
0.5VDD 0.5VDD
tPDCL1
0.5VDD
tPDCL2
0.5VDD
tPDCL3
0.5VDD
CL
XV1, XV2, XV3
BUSY, WEN, ID
XSG, PBLK,
XCPDM, XCPOB
VDD=5.0 V, Topr=25 °C, load capacitance of CL=30 pF,
load capacitance of XV1, XV2, XV3, XSG, PBLK, XCPDM, XCPOB, BUSY, WEN and ID=10 pF
Symbol
tPDCL1
tPDCL2
tPDCL3
Definition
XV1, XV2 and XV3 delay, activated by the falling edge of CL
BUSY, WEN and ID delay, activated by the rising edge of CL
XSG, PBLK, XCPDM and XCPOB delay, activated by the
rising edge of CL
Min.
30
40
40
Typ. Max.
65
60
55
Unit
ns
ns
ns
—8—
CXD2434ATQ
Description of Functions
1. Progressive Scan CCD drive pulse generation
• Combining this IC with a crystal oscillator generates a fundamental frequency of 24.5454 MHz.
• CCD drive pulse generation is synchronized with the HD and VD inputs.
Set fCL to 780 fHD and fHD to 525 fVD.
• The various operations are performed by the TRIG, EFS and ESG inputs. (See the following items.)
<Detection timing for VD, TRIG, EFS and ESG>
35
T1
1
CL
HD
H1
Detection timing for VD,
TRIG, EFS and ESG
After HD input is detected, the status of VD, TRIG, ESG and EFS is detected during T1.
Do not change the status of VD, TRIG, ESG and EFS during T1.
When input is from a non-synchronized system, the low level period for each pulse should be set to 63.5 µs
or longer to prevent misoperation.
2. Reset
The internal register values are undetermined immediately after power-on, so perform one of the following
reset operations.
1. Reset by the RESET pin
Reset is performed by setting the RESET pin low for a period of 80 ns or more. Reset can also be
performed by setting the RESET pin low during power-on and then switching the RESET pin from low to
high when VDD rises to 4.75 V or higher. Note that when reset is performed by the RESET pin, the
electronic shutter settings made by serial input are also reset.
2. Reset by turning off the electronic shutter
Reset is performed by setting the shutter mode to electronic shutter off and inputting VD. Note that in
this case the TRIG, ESG and EFS pins should all be set high.