Sony CDX-747-X Service manual

Page 1
CDX-747X
SERVICE MANUAL
Ver 1.2 2001.06
US Model
E Model
Model Name Using Similar Mechanism NEW CD Drive Mechanism Type MG-251B-137 Optical Pick-up Name KSS-720A
System Compact disc digital audio system Laser diode properties Material: GaAlAs
*
This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block.
Frequency response 10 – 20,000 Hz Wow and flutter Below the measurable limit Signal-to-noise ratio
Outputs BUS control output (8 pins)
Current drain 800 mA (during CD playback)
Operating temperature –10°C to +55°C (14°F to 131°F) Dimensions Approx. 262 × 90 × 185 mm
Mass Approx. 2.1 kg (4 lb. 10 oz.) Power requirement 12 V DC car battery
Supplied accessories Disc magazine (1)
Design and specifications are subject to change without notice.
Wavelength: 780 nm Emission Duration: Continuous Laser out-put Power: Less than
44.6 µW*
102 dB
Analog audio output (RCA pin)
800 mA (during loading or ejecting a disc)
3
(10
/8 × 3 5/8 × 7 3/8 in.)
(w/h/d) not incl. projecting parts and controls
(negative ground)
Parts for installation and connections (1 set)
9-870-245-13 Sony Corporation
2001F0500-1 e Vehicle Company C 2001.6 Shinagawa Tec Service Manual Production Group
COMPACT DISC CHANGER
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CDX-747X

TABLE OF CONTENTS

1. SERVICING NOTES ................................................ 3
2. GENERAL
Installation....................................................................... 4
Connections ..................................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 5
3-2. Case (Upper T), Front Panel Assy.................................. 6
3-3. Mechanism Deck (MG-251B-137)................................. 6
3-4. JACK Board .................................................................... 7
3-5. MAIN Board, Slide Variable Resister
(Elevator Height Sensor) (RV202) ................................. 7
3-6. ELJ Motor Assy (Elevator) (M104)................................ 8
3-7. Escutcheon (T) ................................................................ 8
3-8. Chassis (U.S) Sub Assy .................................................. 9
3-9. Chassis Assy.................................................................... 9
3-10. RF Board ......................................................................... 10
3-11. Sled Motor Assy (251) (M101),
Optical Pick-up (KSS-720A) .......................................... 10
3-12. LSW Board, Spindle Motor (S) Sub Assy (M102) ........ 11
3-13. ELJ Motor Assy (Chucking) (M103) ............................. 11
4. ASSEMBLY
4-1. Assembly Flow................................................................ 12
4-2. Optical Pick-up Complete Assy...................................... 12
4-3. Gear (Lomini)/(Load Cam) Assy.................................... 13
4-4. Operation Check ............................................................. 13
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur­ing repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra­diation exposure.
5. MECHANICAL ADJUSTMENT .......................... 14
6. ELECTRICAL CHECK .......................................... 15
7. DIAGRAMS
7-1. Block Diagram – SERVO Section – .............................. 17
7-2. Block Diagram
– BUS CONTROL/POWER SUPPLY Section –........... 18
7-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
7-4. Printed Wiring Boards – RF/LSW Boards – ................. 20
7-5. Schematic Diagram – RF/LSW Boards –...................... 21
7-6. Printed Wiring Boards
– MAIN Board (Component Side) – .............................. 22
7-7. Printed Wiring Boards
– MAIN (Conductor Side)/SWITCH Boards –.............. 23
7-8. Schematic Diagram – MAIN Board (1/3) – .................. 24
7-9. Schematic Diagram – MAIN Board (2/3) – .................. 25
7-10. Schematic Diagram
– MAIN (3/3)/SWITCH Boards – .................................. 26
7-11. Printed Wiring Boards – JACK Board – ........................ 27
7-12. Schematic Diagram – JACK Board – ............................. 27
7-13. IC Pin Function Description ........................................... 32
8. EXPLODED VIEWS
8-1. Case Section .................................................................... 35
8-2. Mechanism Deck Section-1 (MG-251B-137) ................ 36
8-3. Mechanism Deck Section-2 (MG-251B-137) ................ 37
8-4. Mechanism Deck Section-3 (MG-251B-137) ................ 38
8-5. Mechanism Deck Section-4 (MG-251B-137) ................ 39
9. ELECTRICAL PARTS LIST ............................... 40
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB­LISHED BY SONY.
2
Page 3
SECTION 1
Lever (ML.S)
Magazine assy
A
L

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK­UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro­static breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body . During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis­sion, observe from more than 30 cm away from the objecti ve lens.
US model:
If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick-up block.
OPTICA PICK-UP BLOCK
NOTE FOR REPLACING IC201
IC201 on MAIN board for this set has been changed in the mid­way of manufacturing. In a set that the former type of IC201 is mounted, SUB board is connected to MAIN board (conductor side). No service parts are supplied for the former type of IC201 and SUB board. When the former type of IC201 is replaced, remove SUB board and replace the former type of IC201 with the new type.
CHECKING QUALITY OF SUB BOARD
If the set works normally after SUB board is removed from MAIN board, SUB board has a trouble. IN this case, remove SUB board and replace IC201 now in use with the new type of IC201.
Former Type
MAIN
BOARD
IC201
MB90473PFV-G-108-
BNDE1
SUB
BOARD
– MAIN BOARD (Component Side) –
New Type
MB90473PFV-G-110-
BNDE1
IC201
SECTION 2

GENERAL

Inserting a disc Insertion d’un disque Inserción de discos
With the arrow side facing up Avec la partie fléchée tournée vers
1
le haut Con el lado de la flecha hacia arriba
Labeled surface up Etiquette vers le haut Con la superficie de la etiqueta hacia arriba
c
Tab Onglet Lengüeta
Use the supplied disc magazine or the disc magazine XA-250.The disc magazine XA-10B can not be used with this unit.If you use any other magazine,it may cause a malfunction.
Utilisez le magasin à disques fourni ou un magasin à disques XA-250. Vous ne pouvez pas utiliser de magasin à disques XA-10B avec cet appareil. L'utilisation d'un autre type de magasin à disques risque de provoquer un dysfonctionnement.
Disc magazine Chargeur de disques Cargador de discos
If the disc magazine does not lock properly
Take out the magazine, and after pressing the Z (EJECT) button, re-insert it.
Si vous ne pouvez pas fermer le chargeur de disques
Sortez le chargeur et, après avoir appuyé sur la touche Z (EJECT), réinsérez-le.
Si el cargador de discos no se cierra correctamente
Extraiga el cargador, pulse el botón Z (EJECT) y vuelva a insertarlo.
Notes on the disc magazine
• Do not leave the disc magazine in locations with high temperatures and high humidity such as on a car dashboard or in the rear window where the disc magazine will be subjected to direct sunlight.
• Do not place more than one disc at a time onto one tray, otherwise the changer and the discs may be damaged.
• Do not drop the disc magazine or subject it to a violent shock.
When the tray comes out
Normally, the trays will not come out of the magazine. However, if they are pulled out of the magazine, it is easy to re-insert them.
Lorsque le plateau sort
En principe, les plateaux ne sortent pas du chargeur. Toutefois, s’ils sortent du chargeur, il est facile de les réinsérer.
Emplee el cargador de discos suministrado o el XA-250. El cargador de discos XA-10B no puede utilizarse con esta unidad. Si emplea otro tipo de cargador, puede producir fallos de funcionamiento.
Si la bandeja se sale
Normalmente, las bandejas no se salen del cargador. No obstante, si esto ocurre, pueden volver a insertarse con facilidad.
10 discs, one in each tray 10 disques, un par plateau 10 discos, uno en cada bandeja
To remove Retrait Extracción
Remarques sur le chargeur de disques
• Ne pas laisser le chargeur de disques dans un endroit très chaud ou très humide comme sur le tableau de bord ou sur la plage arrière de la voiture où il serait en plein soleil.
• Ne pas insérer plus d’un disque à la fois sur le plateau, sinon le changeur et les disques risquent d’être endommagés.
• Ne pas laisser tomber le chargeur de disques ni le cogner.
Notes
• To listen to an 8 cm (3 in.) CD, use the separately sold Sony CD adapter CSA-8. Be sure to always use the specified adapter, as failing to do so may cause a malfunction of the unit. If you use any other adapter, the unit may not operate properly. When using the Sony CD adapter, make sure the three catches on the adapter are firmly latched onto the 8 cm CD.
• Do not insert the Sony CD adapter CSA-8 in the magazine without a disc, malfunction may result.
Remarques
• Pour écouter un disque de 8 cm (3 po.), utilisez l’adaptateur Sony CSA-8, vendu séparément, à l’exclusion de tout autre, pour éviter tout probléme de fonctionnement. Si vous utilisez un autre adaptateur, l’appareil risque de ne pas fonctionner correctement. Quand vous utilisez l’adaptateur CD Sony, vérifiez que les trois griffes soient bien en prise sur le CD de 8 cm.
• Ne pas insérer d’adaptateur CD Sony CSA-8 dans le chargeur sans disque, car cela pourrait provoquer un dysfonctionnement.
Notas
• Para escuchar un disco compacto de 8 cm, utilice el adaptador de discos compactos Sony CSA-8, que podrá adquirir por separado. Asegúrese de utilizar siempre el adaptador especificado, ya que si utiliza otro tipo de adaptador es posible que la unidad no funcione correctamente. Al utilizar el adaptador de discos compactos Sony, asegúrese de que los tres enganches del adaptador están firmemente ajustados al disco compacto de 8 cm.
• No inserte el adaptador de discos compactos Sony CSA-8 en el cargador sin discos, ya que pueden producirse fallos de funcionamiento.
43
Use the unit with the door closed completely
Otherwise, foreign matter may enter the unit and contaminate the lenses inside the changer.
Utilisez cet appareil avec la fenêtre complètement fermée
Sinon, des corps étrangers pourraient pénétrer dans
Z (EJECT)
l’appareil et encrasser les lentilles dans le lecteur.
Emplee la unidad con la puerta completamente cerrada
De lo contrario podrían introducirse objetos extraños y contaminar las lentes del interior del cambiador.
Notas sobre el cargador de discos
• No lo deje en lugares muy húmedos o con temperaturas altas, como en el salpicadero del automóvil o en la ventanilla trasera, expuesto a la luz solar directa.
• No inserte más de un disco en una bandeja de una vez, ya que en caso contrario el cambiador y los discos pueden dañarse.
• No lo deje caer ni lo exponga a golpes violentos.
With the cut-away portion of the tray facing you, insert the right corner of the tray in the slot, then push in the left corner until it clicks.
Note
Do not insert the tray upside down or in the wrong direction.
Avec la portion découpée du plateau vous faisant face, insérer le coin droit du plateau dans la fente, puis enfoncer le coin gauche jusqu’au déclic.
Remarque
Ne pas insérer le plateau à l’envers ou dans le mauvais sens.
CDX-747X
Ver 1.1 2001.05
This section is extracted from instruction manual.
Push to unlock the door Poussez pour déverrouiller la porte
2
Empuje para desbloquear la puerta
Slide open Coulissez pour ouvrir Deslice para abrir
Note
To prevent injury, do not insert your hand in the CD changer.
Remarque
Pour éviter toute blessure, ne pas introduire la main dans le changeur de CD.
Nota
Para evitar lesiones, no inserte la mano en el cambiador de CD.
Note
When a disc magazine is inserted into the CD changer or the reset button of the connected car audio is pressed, the unit will automatically be activated and read the information on the CDs. When the information on all the CDs in the disc magazine has been read, the unit will automatically stop operation.
Remarque
Quand un chargeur de disques est inséré dans le changeur de CD ou si la touche de réinitialisation de l’autoradio raccordé est enclenchée, l’appareil se met automatiquement en marche et reproduit les CD. Lorsque tous les CD du chargeur ont été reproduits, l’appareil s’arrête automatiqement.
Nota
Cuando inserta un cargador de discos en el cambiador de discos compactos, o si está pulsado el botón de reposición del equipo de audio para automóvil conectado, la unidad se activará automáticamente y leerá la información de los discos compactos. Una vez leída la información de todos los discos compactos del cargador de discos, la unidad detendrá automáticamente la operación.
Con la parte de corte de la bandeja hacia afuera, inserte la esquina derecha de dicha bandeja en la ranura y, a continuación, ejerza presión en la esquina izquierda hasta oír un chasquido.
Nota
No inserte la bandeja al revés o en la dirección incorrecta.
x
SEMI-FIXED RESISTOR
DISC MAGAZINE GETTING OUT PROCEDURE ON THE POWER SUPPLY IS OFF
Remove the CASE (LOWER T) beforehand
1) Press the lever (ML.S) assy in the direction of arrow A.
2) Removal the magazine assy.
Note: Take out the magazine only when the tray is completely within the
magazine. If the disk or tray is sticking out, turn on the power and eject the magazine.
– MAIN BOARD (Conductor Side) –
SUB BOARD
Notes on handling discs
A dirty or defective disc may cause sound drop-outs during playback. To enjoy optimum sound, handle the disc as follows.
Handle the disc by its edge, and to keep the disc clean,
do not touch the unlabeled surface. (fig.
Do not stick paper or tape on the disc. (fig.
Keep your discs in their cases or disc magazines when
not in use. Do not expose discs to direct sunlight or heat sources such as hot air-ducts. Do not leave discs in a car parked in direct sunlight where there can be a considerable rise in the temperature inside the car. (fig.
Before playing, clean the discs with an optional cleaning cloth. Wipe each disc in the direction of the
D
arrows. (fig.
Do not use solvents such as benzine, thinner, commercially available cleaners or antistatic spray intended for analog discs.
Discs with special shapes (heart-shaped discs,
octagonal discs etc.) cannot be played on this unit. Attempting to do so may damage the unit. Do not use such discs.
Notes on discs
If you use the discs explained below, the sticky residue can cause the disc to stop spinning and may cause malfunction or ruin your discs. Do not use second-hand or rental CDs that have a sticky residue on the surface (for example from peeled-off stickers or from ink, or glue leaking from under the stickers).
There are paste residue. Ink is sticky. (fig. Do not use rental CDs with old labels that are beginning to peel off.
Stickers that are beginning to peel away, leaving a
sticky residue. (fig.
Do not use your discs with labels or stickers attached.
Labels are attached. (fig.
Notes on CD-R discs
You can play CD-Rs (recordable CDs) designed for audio use on this unit (fig.
Some CD-Rs (depending on the equipment used for its recording or the condition of the disc) may not play on this unit.
You cannot play a CD-R that is not finalized*.
* A process necessary for a recorded CD-R disc to be played
on the audio CD player.
)
F
)
G
A
)
B
)
C
)
E
)
)
H
).
Remarques sur la manipulation des disques
Un disque sale ou défectueux peut provoquer des pertes de son à la lecture. Manipuler le disque comme suit pour obtenir un son optimal.
Manipuler le disque par son arête et le maintenir dans un
état propre, ne pas le toucher sur la surface non imprimée. (fig.
Ne pas coller de papier ou de bande adhésive sur le disque. (fig.
Conservez vos disques dans leurs boîtiers ou des pochettes de rangement lorsqu’ils ne sont pas utilisés. Ne pas laisser les disques en plein soleil ou près d’une source de chaleur comme des conduits d’air chaud. Ne pas laisser les disques dans une voiture garée en plein soleil car la température de l’habitacle risque d’augmenter considérablement. (fig.
Avant la lecture, essuyer les disques avec un chiffon de nettoyage en option. Essuyer chaque disque dans le sens des flèches. (fig.
Ne pas utiliser de solvants tels que de la benzine, du diluant, des produits de nettoyage vendus dans le commerce ou de vaporisateurs anti-statiques destinés aux disques analogiques.
Il n’est pas possible d’utiliser les disques de formes
spéciales (en forme de cœur ou octogonaux, etc.) avec cet appareil. Vous risquez d’endommager l’appareil. N’essayez jamais de lire ces disques.
Remarques sur les disques
Si vous utilisez les disques décrits ci-dessous, le résidu adhésif risque de provoquer l’arrêt de la rotation du disque et d’entraîner un dysfonctionnement ou d’endommager vos disques. N’utilisez pas de CD de seconde main ou de location qui présentent des résidus adhésifs à la surface (par exemple d’étiquettes décollées ou d’encre, de colle dépassant de l’étiquette).
Résidus de colle. L’encre colle. (fig. N’utilisez pas de CD de location avec d’anciennes étiquettes qui commencent à se décoller.
Les étiquettes qui commencent à se décoller laissent des
résidus adhésifs. (fig.
N’utilisez pas vos disques avec des étiquettes ou des autocollants apposés dessus.
Les étiquettes sont fixées. (fig.
Remarques sur les disques CD-R
Vous pouvez écouter avec cet appareil des CD-R (CD enregistrables) conçus pour une utilisation audio. (fig.
Certains CD-R (en fonction des conditions de l’équipement d’enregistrement ou du disque) risquent de ne pas être lus avec cet appareil.
Vous ne pouvez pas lire de disques CD-R non finalisés*.
* Un processus nécessaire à la lecture des disques CD-R
enregistrés sur le lecteur de CD audio.
A
)
B
)
C
)
D
)
E
)
F
)
G
)
Notas sobre el manejo de discos
Es posible que se produzca ausencia de sonido durante la reproducción, si el disco está sucio o es defectuoso. Para disfrutar de una calidad de sonido óptima, utilice el disco de la siguiente forma.
Maneje el disco por los bordes. Para mantenerlo
limpio, no toque la superficie sin etiqueta (fig.
No adhiera papeles ni cinta sobre el disco (fig.
Guarde los discos en sus cajas o en los cargadores de
discos cuando no los utilice. No exponga los discos a la luz solar directa ni a fuentes térmicas, como conductos de aire caliente. No deje los discos en un automóvil aparcado bajo la luz solar directa donde pueda producirse un considerable aumento de temperatura en el interior de dicho automóvil (fig.
Antes de la reproducción, limpie los discos con un paño
de limpieza opcional en la dirección de las flechas (fig.
D
No utilice disolventes como bencina, diluyentes, productos de limpieza disponibles en tiendas del ramo ni aerosoles antiestáticos destinados a discos analógicos.
Los discos con formas especiales (forma de corazón,
octagonales, etc.) no pueden reproducirse en esta unidad. Si lo intenta, puede dañar la unidad. No utilice tales discos.
Notas sobre los discos
Si emplea los discos descritos a continuación, el residuo adherente puede causar que el disco deje de girar y producir fallos de funcionamiento o dañar los discos. No utilice discos compactos de segunda mano o de alquiler que tengan residuos adherentes en la superficie (por ejemplo, de adhesivos despegados o tinta, o de restos de pegamento de los adhesivos).
• Residuos adherentes. Tinta adherente (fig.
No utilice discos compactos de alquiler con etiquetas viejas que estén comenzando a despegarse.
• Adhesivos que empiezan a despegarse, dejando un residuo adherente (fig.
No emplee discos con etiquetas o adhesivos fijados.
• Etiquetas adheridas (fig.
Notas sobre discos CD-R
Puede reproducir discos CD-R (discos compactos grabables) diseñados para uso de audio en esta unidad (fig. H).
H
)
Determinados discos CD-R (dependiendo del equipo utilizado para su grabación o la condición del disco) pueden no reproducirse en esta unidad.
No es posible reproducir discos CD-R no finalizados*.
* Proceso necesario para reproducir en el reproductor de CD
de audio los discos CD-R grabados.
C
).
A GBC DEF
This way Oui Así
Not this way Non Así no
Not this way Non Así no
This way Oui Así
A
).
B
).
).
E
).
F
).
G
).
Look for this mark to distinguish CD-Rs for audio use.
H
Ce symbole permet de distinguer les CD-R conçus pour une utilisation audio. Busque esta marca para distinguir los discos CD-R para uso de audio.
This mark denotes that a disc is not for audio use. Ce symbole indique qu’un disque n’est pas conçu pour une utilisation audio. Esta marca indica que el disco no es para uso de audio.
33
Page 4
CDX-747X
Precautions
Choose the mounting location carefully, observing the following: — The unit is not subject to temperatures exceeding 55°C (131°F) (such as in a
car parked in direct sunlight). — The unit is not subject to direct sunlight. — The unit is not near heat sources (such as heaters). — The unit is not exposed to rain or moisture. — The unit is not exposed to excessive dust or dirt. — The unit is not subject to excessive vibration. — The fuel tank should not be damaged by the tapping screws. — There should be no wire harnesses or pipes under the place where you are
going to install the unit. — The spare tire, tools or other equipment in or under the trunk should not be
interfered with or damaged by the screws or the unit itself.
Be sure to use only the supplied mounting hardware for a safe and secure
installation.
Use only the supplied screws.
Make holes of ø 3.5 mm (
other side of the mounting surface.
How to install the unit
The brackets 1 provide two positions for mounting, high and low. Use the appropriate screw holes according to your preference.
5
/32 in.) only after making sure there is nothing on the
Horizontal installation
1
InstallationInstallation Instalación
Précautions
Choisir l’emplacement de montage en tenant compte des observations
suivantes: — Appareil non soumis à des températures dépassant 55°C (131°F) (comme
dans une voiture parquée au soleil). — Appareil non soumis au rayonnement solaire direct. — Appareil à l’écart de sources de chaleur (comme des radiateurs). — Appareil non exposé à la pluie ou à l’humidité. — Appareil non exposé à des poussières ou à des souillures en excès. — Appareil non exposé à des vibrations excessives. — Vérifier que le réservoir d’essence ne risque pas d’être endommagé par les vis
taraudeuses. — Il ne doit pas y avoir de faisceau de fils ou de tuyaux à l’emplacement du
montage. — Vérifier que l’appareil ou les vis ne risquent pas d’endommager ou de gêner
la roue de secours, les outils, ou autre objet dans le coffre.
Pour garantir la sécurité de l’installation, utiliser uniquement le matériel de
montage fourni.
Utilisez uniquement les vis fournies.
Ne percez les trous de 3,5 mm (
rien de l'autre côté de la surface de montage.
Installation de lappareil
Les supports 1 offrent deux positions de montage, haut et bas. Utilisez les trous de vissage appropriés en fonction de vos préférences.
5
/32 po.)ø qu'après vous être assuré qu'il n'y avait
Installation horizontale
Align with the marked position.
HORIZONTAL
Aligner sur le repère. Alinee en la posición marcada.
Precauciones
Elija cuidadosamente el lugar de montaje y tenga en cuenta lo siguiente: — La unidad no queda sometida a temperaturas superiores a los 55°C (como en
un automóvil aparcado a la luz solar directa). — La unidad no queda sometida a la luz solar directa. — La unidad no queda cercana a fuentes térmicas (como aparatos de
calefacción). — La unidad no queda expuesta a la lluvia o a la humedad. — La unidad no queda expuesta a polvo o suciedad excesivos. — La unidad no queda sometida a vibraciones excesivas. — El depósito de combustible no deberá dañarse con los tornillos
autorroscantes. — No deberá haber mazos de conductores ni tubos debajo del lugar donde vaya
a instalar la unidad. — La rueda de repuesto, las herramientas, u otros equipos situados dentro o
debajo del portaequipajes no deberán verse interferidos ni dañados por los
tornillos ni por la propia unidad.
Para realizar una instalación segura, emplee solamente la ferretería de montaje
suministrada.
Utilice sólo los tornillos suministrados.
Antes de hacer los orificios de ø 3,5 mm, compruebe que no haya nada en el otro
lado de la superficie de montaje.
Instalación de la unidad
Los soportes 1 proporcionan dos posiciones de montaje, alta y baja. Utilice los orificios para tornillo apropiados según sus preferencias.
Instalación horizontal
2
Unit: mm (in.) Unité: mm (po.) Unidad: mm
Connections/Connexions/ Conexiones
For details, refer to the Installation/Connections manual of the car audio. Pour plus de détails, consulter le manuel dinstallation/connexions de lautoradio. Con respecto a los detalles, consulte el manual de instalación/conexiones del sistema de audio del
automóvil.
Connection diagram/Schéma de connexion/Diagrama de conexión
Sony BUS compatible car audio Autoradio compatible BUS Sony Sistema de audio del automóvil
compatible con BUS Sony
BUS AUDIO IN BUS CONTROL IN
3
2
1
5
ø 3.5 (
/32)
3
2
1
45
CDX-747X
Vertical installation Installation verticale
1
Align with the marked position.
VERTICAL
Aligner sur le repère. Alinee en la posición marcada.
Suspended installation
When the unit is to be installed under the rear tray etc. in the trunk compartment, make sure the following provisions are made.
Choose the mounting location carefully so that the unit can be installed
horizontally.
Make sure the unit does not hinder the movement of the torsion bar spring etc.
of the trunk lid.
1
Unit: mm (in.) Unité: mm (po.) Unidad: mm
ø 3.5 (5/32)
1
2
Inclined installation
After installing the unit, align the dials with one of the marks so that the arrows are as vertical as possible.
Installation suspendue
Si l’appareil doit être installé sous la plage arrière dans le coffre, par exemple, observer les précautions suivantes.
Bien choisir l’emplacement pour pouvoir installer l’appareil à l’horizontale.
Vérifier que l’appareil ne gêne pas les mouvements du ressort de fermeture du
coffre, entre autres.
Align with the marked position.
HORIZONTAL
Aligner sur le repère. Alinee en la posición marcada.
2
1
Installation inclinée
Après avoir installé l’appareil, alignez les disques sur un repère de façon à ce que les flèches soient dans la position la plus verticale possible.
Instalación vertical
2
Unit: mm (in.) Unité: mm (po.) Unidad: mm
3
2
1
Instalación suspendida
Si va a instalar la unidad debajo de la bandeja trasera, etc., del maletero, tenga en cuenta lo siguiente:
Elija el lugar de montaje cuidadosamente de forma que sea posible instalar la
unidad horizontalmente.
Asegúrese de que la unidad no dificulta el movimiento del muelle de la barra de
torsión, etc., de la tapa del maletero.
2
3
Instalación inclinada
Una vez instalada la unidad, alinee los diales de forma que una de las marcas de las flechas se encuentre en la posición más vertical posible.
ø 3.5 (5/32)
Note
For connecting two or more changers, the XA-C30 source selector (optional) is necessary.
Remarque
Pour raccorder deux ou plusieurs changeurs, le sélecteur de source XA-C30 (en option)
3
est nécessaire.
Nota
Si desea conectar dos o más cambiadores, es preciso utilizar un selector de fuente XA­C30 (opcional).
2
1
3
Note
Be sure to align the left and right dials with the same mark.
L A T
N
O Z I R
O
V
H
E R
T I C
V E
R T IC
L
A L
A T N O Z
I R O H
Remarque
Veillez á aligner les disques gauche et droite sur le même repère.
AL
Nota
Asegúrese de alinear los diales izquierdo y derecho con la misma marca.
L A
T N O Z I
R O
VE
H
R T
I C A L
44
Page 5
This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

Note 1: The process described in can be performed in any order. Note 2: Without completing the process described in , the next process can not be performed.
SET
3-2. CASE (UPPER T), FRONT PANEL ASSY
(Page 6)
3-3. MECHANISM DECK (MG-251B-137)
(Page 6)
CDX-747X
SECTION 3

DISASSEMBLY

3-4. JACK BOARD
(Page 7)
3-5. MAIN BOARD,
SLIDE VARIABLE RESISTOR (ELEVATOR HEIGHT SENSOR) (RV202) (Page 7)
3-6. ELJ MOTOR ASSY (ELEVATOR) (M104)
(Page 8)
3-9. CHASSIS ASSY
(Page 9)
3-10. RF BOARD
(Page 10)
3-11. SLED MOTOR ASSY (251) (M101),
OPTICAL PICK-UP (KSS-720A) (Page 10)
3-12. LSW BOARD,
SPINDLE MOTOR (S) SUB ASSY (M102) (Page 11)
3-13. ELJ MOTOR ASSY (CHUCKING) (M103)
(Page 11)
3-7. ESCUTCHEON (T)
(Page 8)
3-8. CHASSIS (U.S) SUB ASSY
(Page 9)
5
Page 6
CDX-747X
)
)
)
Note: Follow the disassembly procedure in the numerical order given.

3-2. CASE (UPPER T), FRONT PANEL ASSY

3
screw
1
screw (PTT2.6
4
lever (FLT. 838)
×
6)
(PTT2.6
×
6)
3
screw (PTT2.6 × 6)
5
case (upper T)
4
lever (FLT. 838)
3
screw (PTT2.6 × 6
2
front panel assy
3-3. MECHANISM DECK (MG-251B-137)
2
tension coil spring (FL)
1
two dampers (T)
filament tape
1
screw (PTT2.6 × 6)
4

mechanism deck (MG-251B-137)

2
tension coil spring (FL
3
jack flexible board (CNJ901)
1
two dampers (T
6
Page 7
3-4. JACK BOARD
2
Remove two solders of the elevator motor leads (M104).
2
Remove two solders of the switch board leads.
2
Remove three solders of the slide variable resistor (RV202).
4
heat sink (T)
3
screw (PTT2 × 4)
6
main board
5
two screws (FP)
1
main flexible board (CNJ101)
5
screw (FP)
7
screw (PTT2
×
4)
8
slide variable resistor (elevator height sensor) (RV202)
Remove the jack board of the arrow.
1
ground point screw (PTT2.6
×
6)
2

jack board

CDX-747X

3-5. MAIN BOARD , SLIDE V ARIABLE RESIST OR (ELEV A T OR HEIGHT SENSOR) (RV202)

7
Page 8
CDX-747X
)
3-6. ELJ MOTOR ASSY (ELEVATOR) (M104)
1
2
bracket (EVM.S)
screw (PTT2
×
4)
4

ELJ motor assy (elevator) (M104)

3
spacer (MO

3-7. ESCUTCHEON (T)

2
Remove the claw in the direction of arrow
4
Remove the ditch in the direction of arrow
5
Remove the escutcheon (T) in the direction of arrow
A
B
two claws
3
.
.
C
.
3
claw
B
A
4
C
ditch
1
screw (T)
8
Page 9
3-8. CHASSIS (U.S) SUB ASSY
1
three screws (PTT2 × 4)
5

chassis (U.S) sub assy

3
A
2
Remove the edge in the direction of arrow A.
CDX-747X
1
two screws (PTT2 × 4)
3-9. CHASSIS ASSY
5
1
screw (PTT2 × 4)
spring (stopper.lower)
4
spring (SUT)
6

chassis assy

4
1
Turn the gear (EVD.S) fully in the direction of arrow A.
3
2
A
3
9
Page 10
CDX-747X
3-10. RF BOARD
3
two screws (PS2
×
4)
4

RF board

3
two screws
×
4)
(PS2
2
Remove four solders of the LSW board leads and spindle motor leads (M102).
2
Remove two solders of the sled motor leads (M101).
1
OP flexible board (CN102)
3-11. SLED MOTOR ASSY (251) (M101), OPTICAL PICK-UP (KSS-720A)
1
two precision screws (P2
×
4
Turn shaft (feed) assy in the direction of the arrow, then remove it.
3)
2
sled motor assy (251) (M101)
OP flexible board
adhesive sheet
10
3
optical pick-up (KSS-720A)
optical pick-up
Note: After connecting OP flexible board,
fix it with adhesive sheet to optical pick-up.
Page 11
3-12. LSW BOARD, SPINDLE MOTOR (S) SUB ASSY (M102)
)
w
8
two precision screws (P1.7
×
2.2)
7
1
precision screw (P2
×
2.5)
5
bracket (CP)
CDX-747X
spring (chucking)
3
6
retainer (disc
4
precision scre (P2 × 2.2)
2
LSW board
3-13. ELJ MOTOR ASSY (CHUCKING) (M103)
2
two screws (PTT2 × 4)
3
retainer (CHM)
9
Remove the spindle motor (S) sub assy (M102) in the direction of the arrow.
1
Remove two solders of the chucking motor leads (M103).
4

ELJ motor assy (chucking) (M103)

11
Page 12
CDX-747X
)
This set can be assembled in the order shown below.

4-1. ASSEMBLY FLOW

SECTION 4

ASSEMBLY

4-2. OPTICAL PICK-UP COMPLETE ASSY
4-3. GEAR (LOMINI)/(LOAD CAM) ASSY
(Page 12)
(Page 13)
4-4. OPERATION CHECK
(Page 13)
Note: Follow the assembly procedure in the numerical order given.

4-2. OPTICAL PICK-UP COMPLETE ASSY

1
Move the lever (LOCK 3A) in the direction of arrow A, and return it a little in the direction of arrow
chuck plate
from the position where the chuck plate is moved down to the lower limit.
B
A
B
stop ring 2.0 (E type
3
4
tension spring (DH)
12
shaft (A)
2
optical pick-up complete assy Note: Insert the shaft (A) first.
Page 13

4-3. GEAR (LOMINI)/(LOAD CAM) ASSY

CDX-747X
gear (LOAD 2)
marking Fig. A
3
Attach the gear (LOAD CAM) assy with its facing inside.
gear (LOMINI)
slit
chuck plate
2
Attach the gear (LOMINI) at the position shown in Fig. A.
shaft (rotary prevention C)
1
B
4
stop ring 1.5 (E type)
Move the lever (LOCK 3A) fully in the direction of arrow to move the chuck plate up.
B

4-4. OPERATION CHECK

1
Confirm that the slider moves in the direction of arrow C to move down the chuck plate if the gear (LOAD CAM) is rotated in the direction of arrow
A
or the chuck plate moves up and the slider moves in the direction of
arrow D if the gear is rotated in the direction of arrow B.
chuck plate
slider
D
C
A
gear (LOAD CAM) assy
B
13
Page 14
CDX-747X

MECHANICAL ADJUSTMENT

• Elevator Height (Address) Adjustment
SECTION 5
Note: This adjustments is necessary when the system controller (IC201),
variable resistor (RV201), slider (R), slider (L), or chassis (ELV) was replaced for any repair.
Connection:
power supply
(DC 14.4 V)
master unit
+
GND
BUS cable
compact disc changer
CONTROL connector (CN901)
Adjustment Method:
1. Connect this set to the master unit (e.g. MDX-C7970/C7970R), load a disc magazine, and place the set vertically as shown below.
2. Connect the regulated power supply to the master unit, and turn the power on.
3. Press the DISC button on the master unit and select DISC 5.
4. At this time, if the elevator shaft does not position between comb teeth A and B at addresses 5 and 6 as shown below, adjust the following.
5. Press repeatedly the DISC + and – buttons on the master unit so that the elevator shafts moves from address 6 to address 5, or from 5 to 6. At this time, adjust RV201 on the main board so that the elevator shaft positions smoothly between comb teeth A and B.
6. Further, place the set horizontally and make same adjustment as mentioned above.
7. After adjustment at addresses 5 to 6 is finished, check all op­erations from addresses 1 to 10 with the set placed vertically and horizontally respectively to confirm that the ele vator shaft positions in a range between comb teeth A to B.
comb tooth at address 6
comb tooth at address 5
comb tooth at address 6
elevator shaft
A B
OK NG
A
elevator shaft
B
comb tooth at address 5
14
RV201
Page 15
SECTION 6

ELECTRICAL CHECK

CDX-747X
Note:
1. This check is performed with the set placed horizontally.
2. Power supply voltage: DC14.4 V (more than 3 A).
3. Be sure to use the disc “YEDS-18” parts code: 3-702-101-01, but only when indicated.
Connection:
power supply
(DC 14.4 V)
master unit
+
GND
BUS cable
Focus Bias Check
Connection:
RF Board (Component Side)
oscilloscope
(AC range)
+ –
TP (RFAC)
TP (VC)
IC101
compact disc changer
CONTROL connector (CN901)
Procedure:
1. Connect the oscilloscope to TP (RFAC) and TP (VC) on the RF board.
2. Put the set into play mode by loading the disc (YEDS-18).
3. Confirm that oscilloscope waveform is clear and check RF sig­nal level is correct or not.
Note:
Clear RF signal waveform means that the shape can be clearly distin­guished at the center of the waveform.
RF signal waveform
VOLT/DIV: 200 mV TIME/DIV: 500 ns (10 : 1 probe in use)
level: 1.4 ± 0.3 Vp-p
When observing the eye pattern, set the oscilloscope to AC range and raise the vertical sensitivity so that it may be easily seen.
15
Page 16
CDX-747X
Tracking Offset Check
Connection:
RF Board (Component Side)
oscilloscope
(DC range)
+
TP (VC)
IC101
TP (TE)
Procedure:
1. Connect the oscilloscope to TP (TE) and TP (VC) on the RF board.
2. Put the set into play mode by loading the disc (YEDS-18).
. >
3. Press the
[ AMS ] button on the master unit, and check
the traverse waveform*.
4. Confirm that the oscilloscope waveform is symmetrical on the top and bottom in relation to 0 V dc, and check this level.
* Traverse waveform: This is the tracking error wave form appears
when crossing the track.
Traverse waveform
A
0 V
B
VOLT/DIV: 500 mV TIME/DIV: 2 ms Center: 0 V
16
A=B
traverse waveform (100 track jump waveform)
Page 17
7-1. BLOCK DIAGRAM – SERVO Section –
CDX-747X
SECTION 7

DIAGRAMS

DETECTOR
A
B
C
D
E
F
LASER DIODE
OPTICAL
PICK-UP BLOCK
(KSS-720A)
(TRACKING)
(FOCUS)
I-V AMP
PD LD
2-AXIS DEVICE
A
6
B
7
C
8
D
9
E
10
F
11
AUTOMATIC
CONTROL
M101
(SLED)
M102
(SPINDLE)
M103
(CHUHCKING)
RF AMP,
FOCUS/TRACKING ERROR AMP
POWER
Q101
IC101
RFAC
SUMMING
AMP
RFDC
SUMMING
AMP
FOCUS ERROR
AMP
TRACKING
ERROR
AMP
LD
1
TRACKING/FOCUS COIL DRIVE,
SLED/SPINDLE/CHUCKING
VO3 +
8
VO3 –
9
VO4 +
6
VO4 –
7
VO2 +
10
MM
MM
MM
VO2 –
11
VO1 +
12
VO1 –
13
VL0 +
5
VL0 –
4
SUM
RW/ROM
APC AMP
MOTOR DRIVE
AC
RW/ROM
IC201
MOTOR
COIL
DRIVE
DRIVE
COIL
DRIVE
MOTOR
DRIVE
MOTOR
DRIVE
MOTOR
DRIVE
4 3
DC OFST
SW
PD
VIN3 + VIN3 –
VIN4 + VIN4 –
VIN2 + VIN2 –
VIN1-B
FWD
RFDCO
12
2
REV
EQ IN
FE
TE
25 24
31 32
22 21
18
1 2
RFAC
VCA
RF
28
30
FE
16
TE
18
RF EQ
AMP
RF AMP OFFSET
CONTROL SWITCH
Q102
TFDR
48
TRDR
49
FFDR
50
FRDR
51
SFDR
46
SRDR
47
MDP
43
RFAC
15
D-RAM
IC102
RF
RFDC
ANALOG SW
A/D CONVERTER
SERVO DSP
PWM GENERATOR
DIGITAL
CLV
71
73 74
DQ1 – DQ4
A0 – A10
RAS CAS
WE
OE
FE
TE
FE
TE
OP AMP
23
22
RFAC
ASYMMETRY
CORRECTOR
ASYI ASYO
2, 3,
24, 25
21, 8
9 – 12, 15 – 19,
5
4
61606258
SE
MIRR DECT
FOK
FILTER
66 69 68 67
FILI
PCO
FILO
CLTV
DIGITAL
PLL
D0 – D3
118, 117
116, 115,
A0 – A10
3 – 1, 111
109 – 106, 7 – 5,
XRAS
113
XCAS
119
XWE
114
XOE
120
ON : When completion of the disc
ON : When completion of the disc chucking operation
chucking operation
ON : When completion of the disc
ON : When completion of the disc save operation
save operation
VIBRATION
MEMORY
CONTROLLER
&
COMPRESSION
EXPANDER
XRDE XWRE XQOK
ON : When the optical pick-up
ON : When the optical pick-up is inner position
is inner position
DIGITAL SIGNAL PROCESSOR,
DIGITAL SERVO PROCESSOR,
D-RAM CONTROLLER
IC101
EFM
DEMODULATOR
INTERNAL BUS
SUBCODE
PROCESSOR
SW3
(LIMIT)
SW1
(CHUCKING END DETECT)
SW2
(SAVE END DETECT)
D/A
INTERFACE
32k RAM
ERROR
CORRECTOR
CPU
INTERFACE
SERVO AUTO SEQUENSOR
SERVO
INTERFACE
SSTP
45
WDCK
GFS
DATA CLOK XLAT
SENS
SQSO SQCK SCOR
XRDE
XWRE
XQOK
SCLK
FOK
XRST
1578
1581
1523 1525 1524
1526
1514 1515 1517
159 158 1512
27
35
21
DIGITAL
OUT
SELECTOR
CLOCK
GENERATOR
DOUT
PCMD
BCK
LRCK
XTAI
XTAO
1585
15
88
1588 15
90 15
86
1593
1594
DATA
2
BCK
3
LRCK
1
CD-ROM/RW
SELECT SWITCH
Q202
SERIAL
INPUT
INTERFACE
INTERFACE
MODE
CONTROL
DM1
8 TIME OVER
SAMPLING
DIGITAL FILTER
WITH
FUNCTION
CONTROLLER
RST
2227
66
99
53
42
61 59 60
44
56 58 52
64 65 63
43
41
62
5 6
98
97
96
MULTI LEVEL
MODULATOR
BPZ
CONTROL
DIGITAL FILTER, D/A CONVERTER
IC501
EMPH
RW SEL
GRSCOR
GFS
CDDAT CDCLK CDLAT
SENS
SQSO SQCK SCOR
XRDE XWRE XQOK
SYSTEM CONTROLLER
IC201 (1/2)
SCLK
FOK
XRST
LOADF LOADR
LIM SW
LOAD SW
SAVE SW
D/A
CONVERTER
CLKO
67MUTEMUTE
LOW-PASS
FILTER
CRYSTAL
OSCILLATOR
XTI
XTO
3 64
X501
16.9344MHz
VOUTL
VOUTR
SCK
MUTING CONTROL
SWITCH
Q402
• SIGNAL PATH
: CD PLAY
1516
1513
LOW-PASS
LOW-PASS
FILTER
FILTER
IC401
IC401
MUTING
Q410, 420
LINE AMP
IC402
CN901 (1/2)
AUDIO OUT
L
R
1717
Page 18
CDX-747X

7-2. BLOCK DIAGRAM – BUS CONTROL/POWER SUPPLY Section –

SYSTEM CONTROLLER
ON : When magazine is set
SW201
MAGAZINE
DETECT
51
MAGLK SW
IC201 (2/2)
MCK
37
RV201
ELEVATOR HEIGHT
(ADDRESS)
M104
(ELEVATOR)
ELEVATOR
MOTOR DRIVE
IC301
OUT1
9
M
OUT2
7
MOTOR
DRIVE
IN1 IN2
EEPROM
IC203
SDA SCL
ELVF
3 4
5 6
4 3
ELVR
EEDAT
32 28
EECLK
EHS
AVRH
ELVON
BUCHK
EJECT SW
CDON
RESET
36
34
24
46
50
23
75
RV202
ELEVATOR HEIGHT
SENSOR
BATTERY
CHECK
Q301
SW801
Z
RESET SIGNAL
GENERATOR
IC303
D306
SERVO +3.3V
BUS INTERFACE
(FOR SONY BUS)
IC302
B. UP +3.3V
DRIVER +8V
D307
+3.3V
REGULATOR
IC306
DAC/SERVO +5V
14
VCC
+8V
REGULATOR
IC304
+5V
REGULATOR
IC305
+3.3V
REGULATOR
Q303, 304
PS901
CN901 (2/2)
CONTROL
7
B. UP
X180X0
81
X201 4MHz
UNI SI
UNI SO
UNI CK
BUSON
SO
16
17
18
45
10 6
SI
9
SCK
11 4
BUSON OUT
1 12
BUSON OUT
13 2
RESET
8 7
RESET
SWITCH
DATA
CLK
LOF
BUSON IN
RST
5
DATA
4
CLK
6
BUSON
2
RST
1818
Page 19
CDX-747X
d

7-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
f
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the par ts face side seen from (Component Side) the parts face are indicated.
: internal component.
Note on Schematic Diagram:
All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
All resistors are in Ω and 1/ specified.
f
C : panel designation.
Note: The components identified by mark 0 or dotted line
A : B+ Line.
H : adjustment for repair.
Pow er voltage is dc 14.4V and fed with regulated dc pow er
Voltages and waveforms are dc with respect to ground
V oltages are taken with a VOM (Input impedance 10 MΩ).
Waveforms are taken with a oscilloscope.
Circled numbers refer to waveforms.
Signal path.
: internal component.
with mark 0 are critical for safety. Replace only with part number specified.
supply from CD changer controller. under no-signal conditions.
no mark : CD PLAY
Voltage variations may be noted due to normal produc­tion tolerances.
Voltage variations may be noted due to normal produc­tion tolerances.
J : CD PLAY
: Impossible to measure
4
Circuit Boards Location
W or less unless otherwise
JACK board
MAIN board
SWITCH board
RF boar
LSW board
1919
Page 20
CDX-747X
7-4. PRINTED WIRING BOARDS – RF/LSW Boards –• See page 19 for Circuit Boards Location.
Semiconductor Location
Ref. No. Location
IC101 H-6 IC201 J-5
Q101 F-7 Q102 H-7
1
2 3 4 5 6 7 8 9 10 11 12 13
A
SW2
B
SW1
CHUKING
END DETECT
SAVE END
DETECT
C
TP106
TP105
TP103
TP104
WHT
YEL
RED
BLK
D
M101
M
(SLED)
E
M103
M
(CHUKING)
F
G
OPTICAL PICK-UP
BLOCK
(KSS-720A)
OP FLEXIBLE
BOARD
CN102
R103
H
C107
TP
TP
(VC)
(RFAC)
R223
R222
R104
R220
R218
C202
IC201
R219
C106
R106
C209
R215
SW3
MAIN FLEXIBLE
1-679-422-
BOARD
11
(11)
CNJ101
R214
R212
R210
R208
R206
R204
R201
R213
R211
R209
R207
R205
R203
R202
C208
C207
C206
C205
C204
C203
C217
I
A
MAIN BOARD
(Page 22)
J
LSW BOARD
BLU
K
(LIMIT)
YEL
R102
IC101
TP
(TE)
R107
C109
R108
R216
R109
C103
C111
R110
Q101
C101
R117
C102
R119
R105
R122
R113
TP107
TP108
TP102
TP101
R101
Q102
R121
C108
R120
R112
1-679-421-
C104
C122
YEL
BLU
BLK
RED
(11)
C121
M102
M
(SPINDLE)
11
C105
C201
1-679-421-
11
(11)
2020
Page 21
7-5. SCHEMATIC DIAGRAM – RF/LSW Boards –• See page 28 for for Waveforms. See page 28 for IC Block Diagrams.
CDX-747X
(Page 24)
The components identified by mark 0 or dotted line with mark 0 are critical for safety.
2121
Replace only with part number specified.
Page 22
CDX-747X
Ver 1.1 2001.05
• Semiconductor Location
Ref. No. Location
D302 D-3 D303 E-3 D306 F-6 D307 F-5 D310 G-4 D313 E-3 D314 D-3
IC101 C-9 IC102 D-7 IC201 F-9 IC203 H-10 IC301 H-4 IC302 D-3 IC303 G-3 IC306 A-9 IC401 D-6 IC402 D-5 IC501 B-7
Q202 G-11 Q301 F-6 Q303 F-4 Q304 G-4 Q402 E-4 Q410 D-4 Q420 E-4
7-6. PRINTED WIRING BOARDS – MAIN Board (Component Side) – • See page 19 for Circuit Boards Location.
1
2 3 4 5 6 7 8 9 10 11 12
A
C307
R303
C162
C502
IC501
C506
C504
C501
R501
C112
C113
C161
IC102
C203
R205
R206
R208
B
R401
D307
R407
R408
Q301
C406
R406
C404
D306
C403
R405
C405
R403
IC401
R402
R404
R302
C
C304
C317
D314
D302
C305
D
C318
IC302
C306
D313
R301
D303
Q410
Q420
R416
R415
C412
C411
IC402
R414
R413
E
Q402
F
G
Q303
D310
C308
R305
R311
R306
R310
C312
Q304
C309
IC303
R411
R409
C408
R410
R412
R304
IC301
C302
H
C314
C301
C303
SW201
MAGAZINE
DETECT
R204
C110
C109
C111
R106
R207
C205
R107
R105
IC101
C104
C108
C107
C114
IC201
C106
R104
R103
C105
R102
C202
C201
C115
R108
R201
R109
C102
C101
IC306
C122
C123
C121
R101
C103
R202
C204
R250
IC203
R122
R123
R125
R211
R203
A
RF BOARD
CNJ101
(Page
20)
R222
R221
R209
C206
Q202
R210
MAIN FLEXIBLE BOARD
JACK FLEXIBLE BOARD
Y
B
I
JACK BOARD
CNJ901
SUB BOARD
(Page 23) (Page 23)
X
SUB BOARD
(Page 27)
J
K
11
1-679-417-
(11)
2222
Page 23
7-7. PRINTED WIRING BOARDS – MAIN (Conductor Side)/SWITCH Boards – • See page 19 for Circuit Boards Location.
1
2 3 4 5 6 7 8 9 10 11
A
BP201
X501
X201
C505
BP302
(CHASSIS)
C503
C508
BP301
BLK
RED
C407
C410
C409
C311
YEL
BLU
C509
M
M104
(EVEVATOR)
B
(CHASSIS)
C319
C
D
RV201
E
F
G
H
(CHASSIS)
I
BP121
BP122
CDX-747X
Ver 1.1 2001.05
• Semiconductor Location
Ref. No. Location
IC304 H-11 IC305 F-11
C316
IC305
C313
C310
C315
IC304
1-679-417-
11
(11)
J
SWITCH BOARD
YEL
BLU
RV202
EVEVATOR
HEIGHT
K
SENSOR
SW801
Z
SUB BOARD
TP6
TP5
TP4
TP3
TP2
TP1
(Page 22)
MAIN BOARD
X
(COMPONENT SIDE)
MAIN BOARD
(COMPONENT SIDE)
Y
(Page 22)
(NOT SUPPLIED: See page 3)
(CHASSIS)
2323
Page 24
CDX-747X
7-8. SCHEMATIC DIAGRAM – MAIN Board (1/3) –• See page 28 for Waveforms. See page 28 for IC Block Diagrams.
(Page 21)
(Page 25)
(Page 26)
2424
Page 25
7-9. SCHEMATIC DIAGRAM – MAIN Board (2/3) – • See page 28 for Waveform. See page 28 for IC Block Diagram.
(Page 24)
SUB
BOARD
TP6
(Page 26)
CDX-747X
Ver 1.1 2001.05
(Page 26)
2525
Page 26
CDX-747X
Ver 1.1 2001.05
7-10. SCHEMATIC DIAGRAM – MAIN (3/3)/SWITCH Boards – • See page 28 for Waveforms. See page 28 for IC Block Diagrams.
(Page 24)
(Page 25)
(Page 27)
(Page 25)
SUB BOARD
(NOT SUPPLIED: See page 3)
2626
Page 27
7-11. PRINTED WIRING BOARDS – JACK Board –• See page 19 for Circuit Boards Location. 7-12. SCHEMATIC DIAGRAM – JACK Board –
C902
C901
PS901
D901
D902
C904
CNJ901
CDX-747X
1-679-418-
CN901
FB902
FB903
FB901
11
(11)
B
MAIN BOARD
CN301
(Page 22)
JACK FLEXIBLE
BOARD
(Page 26)
AUDIO OUT
CONTROL
(FOR SONY BUS)
5 4
6
7
8
2 13
L
R
4
5
7
1
2
3
8
6
2727
Page 28
CDX-747X

Waveforms RF Board

1 IC101 qh (FE) (CD play mode)
Approx. 100 mVp-p
2 IC101 qk (TE) (CD play mode) 2
Approx. 250 mVp-p
3 IC101 qg (RFAC) (CD play mode)
MAIN Board
1 IC101 rd (MDP) (CD play mode) 5 IC201 ia (X1) (CD play mode)
3
3.8
µ
s
IC101 ih (LRCK), IC501 1 (LRCK) (CD play mode)
22.7 µs
IC101 o; (BCK), IC501 3 (BCK) (CD play mode)
2 Vp-p
4.5 Vp-p
250 ns
6 IC501 6 (XTO) (CD play mode)
59.1 ns
3.9 Vp-p
6.2 Vp-p

IC Block DiagramsRF Board

IC101 CXA2581N-T4
APC AMP
A B C
D
VC
+
SUMMING
BCD
A
RFAC
AMP
EQ IN
AC SUM
GND
DVC
VC
1
LD
2
PD
3
4
5
6
A
7
B
8
C
9
D
VOFST
RW/ROM
30
DC OFST
29
A
B
C
D
B C
A
D
DVC
RW/ROM
EQ ON/OFF
RW/ROM
RW/ROM
RW/ROM
+
VOFST
+
+
DVC VCC
EQ
RFAC
VCA
VCC
+
DVC
VC
RFDCI
28
RFDCO
VC
27
VC
26
RFC
25
VFC
24
BST
23
RFG
22
VCC
21
CEI
20
CE
19
TE BAL
1.4 ± 0.3 Vp-p
472 ns
4
IC101 od (XTAI), IC501 4 (CLKO) (CD play mode)
59.1 ns
4.7 Vp-p
5.4 Vp-p
SW
DVCC
DVC
RFAC
10
E
11
F
12
13
DVC
14
15
GM
GM
APC-OFF
(Hi-Z)
RW/ROM
(H/L)
+
VC
RW/ROM
RW/ROM
B
D
A
C
VOFST
+
RW/ROM
+
DVC
VC
18
TE
17
FEI
16
FE
2828
Page 29
IC201 LA6576L-TE-L
FWD
1
INPUT
2
REV
3
VCC2
4
VLO–
5
VLO+
6
VO4+
7
VO4–
8
VO3+
9
VO3–
10
VO2+
VO2–
11
12
VO1+
VO1–
13
VCC1
14
15
VIN1
OUTPUT
CONTROL
LEVEL
SHIFT
LEVEL SHIFT
+
LEVEL SHIFT
LEVEL SHIFT
+
THERMAL SHUT DOWN
+
5VREG
+
+
+
CH2-4 MUTE
CH1
MUTE
VIN1/VREF
SWITCH
+
+
+
+
S-GND
36
35
MUTE2
34
MUTE1
33
VIN4
32
VIN4–
31
VIN4+
30
VREF-IN
29
VIN1 (VREF)-SW
28
VREF-OUT (CH1)
27
REG-OUT
REG-IN
26
25
VIN3+
VIN3–
24
VIN3
23
22
VIN2+
21
VIN2–
VIN2
20
VIN1+B
19
CDX-747X
16
VIN1–A
VIN1+A
VIN1–B
AMP-A
+
17
18
AMP-B
+
–MAIN Board –
IC102 MSM51V17400D-10TK-FS
COLUMN
ROW
TIMING
GENERATOR
INTERNAL ADDRESS COUNTER
ROW
DECODERS
REFRESH CONTROL
CLOCK
WORD
DRIVERS
COLUMN
DECODERS
SENSE
AMPLIFIERS
MEMORY
CELLS
TIMING
GENERATOR
I/O
SELECTOR
INPUT
BUFFERS
DATA BUS
WRITE CLOCK
GENERATOR
OUTPUT
BUFFERS
1 26
VCC
DQ1
2 3
DQ2
4
WE
5
RAS
NC
6 7
NC
8
A10
9
A0
10
A1
11
A2
12
A3
ADDRESS BUFFERS
VSS
25
DQ4 DQ3
24
23
CAS
22
OE
A9
21 20
NC A8
19
A7
18 17
A6 A5
16
A4
15
VSS
13
14
VSS
29
Page 30
CDX-747X
IC101 CXD3027R
XOE
XCASD2D3D0D1
120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91
D2D3D0
XOE
XCAS
XWE
XRAS
A11
A10
DVDDA0A1A2A3
A11
A10
DVDD
A0A1A2
D1
XWE
XRAS
A3
AVDD2
AVDD2
LOUT2
AIN2
LOUT2
AIN2
AOUT2
AVSS2
AOUT2
AVSS2
AVSS1
AVSS1
AOUT1
AOUT1
AIN1
AIN1
LOUT1
LOUT1
AVDD1
AVDD1
XVSS
XVSS
XTAO
XTAO
XTAI
XTAI
XVDD
XVDD
BCKI
BCKI
DVSS
XWRE
XRDE
XEMP
XWIH XQOK
AMUTE
SDTI XQCK SCSY SCOR
VSS0
SBSO
EXCK
XRST
SYSM
SDTO
XLAT CLOK SENS
SCLK XSOE
ATSK
R4M
VPCO
WFCK
DEMODULATOR
CONVERTER
GFS
MDS
XUGF
EFM
SUB CODE
PROCESSOR
SERVO
AUTO
SEQUENCER
A/D
ERROR
CORRECTOR
32K
RAM
PROCESSOR
C2PO
D/A
INTERFACE
SIGNAL
BLOCK
SERVO
INTERFACE
MIRR
DFCT
FOK
SERVO DSP
FOCUS SERVO
TRACKING
SERVO
SLED SERVO
WDCK
VIBRATION
MEMORY
CONTROLLER
COMPRESSION
EXPANDER
DAC
MEMORY CONTROLLER,
BUS BOOST BLOCK
LPF
LPF
PWM GENERATOR
FOCUS PWM GENERATOR
TRACKING PWM
GENERATOR
SLED PWM
GENERATOR
BCK
DIGITAL
OUT
XOE
XCAS
XWE XRAS XQOK XWIH XEMP XRDE XWRE
D0 – D4
A0 – A11
SYSM
AMUTE
HPL
HPM
HPR
PCMDI
LRCKI
BCKI
AOUT1
AIN1
LOUT1
LOUT2
AIN2
AOUT2
ATSK SCLK SSTP
COUT
FOK
DFCT
MIRR
FRDR
FFDR TRDR TFDR SRDR SFDR
PCMD
LRCK
DOUT
BCK
PCMDI
PCMD LRCKI
LRCK
DOUT
VDD2
WFCK
C2PO
GFS XPCK XUGF
WDCK
VSS2 XTSL
AVDD3
ASYO
ASYI BIAS RFAC
AVSS3
CLTV
PCO
FILI
FILO VCTL
VPCO
VC
A B
90
BCK
89
PCMDI
88
PCMD
87
LRCKI
86
LRCK
85
DOUT
84
VDD2
83
WFCK
82
C2PO
81
GFS
80
XPCK
79
XUGF
78
WDCK
77
VSS2
76
XTSL
75
AVDD3
74
ASYO
73
ASYI
72
BIAS
71
RFAC
70
AVSS3
69
CLTV
68
PCO
67
FILI
66
FILO
65
VCTL
64
VPCO
63
VC
62
A
61
B
SELECTOR
+
XTAI
XTSL
VCTL
XTAO
CLOCK
GENERATOR
RFAC BIAS
ASYMMETRY
ASYI
CORRECTOR
ASYO
FILO
FILI
DIGITAL
PCO CLTV XPCK
A9
1
A9
A8
2
A8
A7
3
A7
DVSS
4
A6
5
A6
A5
6
A5
A4
7
A4
XWRE
8
XRDE
9
XEMP
10
XWIH
11
XQOK
12
AMUTE
13
SDTI
14 15
SCSY
16
SCOR
17
VSS0
18
SBSO
19
EXCK
20 21
SYSM
22
SDTO
23
XLAT
24
CLOK
25
SENS
26
SCLK
27
XSOE
28
ATSK
29
R4M
30
PWMI
LOCK MDP
SDTI SCSY SCOR SBSO EXCK SDTO XLAT CLOK SENS XSOE
R4M
IGEN
RFDC
VC
D GND
SERVO BLOCK
E F B A
PLL
DIGITAL
CLV
CPU
INTERFACE
OP AMP
ANALOG SWITCH
30
D VDD
FOK
DFCT
MIRR
VDD0
COUT
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
VDD0
COUT
MIRR
DFCT
FOK
PWMI
PWMI
LOCK
LOCK
HPR
HPR
HPM
HPM
HPL
HPL
VDD1
VDD1
C176
MDP
MDP
MDS
MDS
SSTP
SSTP
SFDR
SFDR
SRDR
SRDR
TFDR
TFDR
TRDR
TRDR
FFDR
FFDR
FRDR
FRDR
VSS1
VSS1
TEST
AVDD0
TES1
A VDD
IGEN
AVDD0
IGEN
A GND
AVSS0
AVSS0
RFDC
RFDC
E
E
F
F
Page 31
CDX-747X
1 2 3
26 25
28 27
23 22
21
24
7 8
9
10
20 19
4
5
6
LOW-PASS
FILTER
MODE
CONTROL
INTERFACE
SERIAL
INPUT
INTERFACE
CRYSTAL
OSCILLATOR
POWER
SUPPLY
MULTI LEVEL
∆∑
MODULATOR
8 TIME OVER
SAMPLING
DIGITAL FILTER
WITH
FUNCTION CONTROLLER
SCK
OPEN
LOW-PASS
FILTER
D/A
CONVERTER
BPZ
CONTROL
D/A
CONVERTER
11 12 13
14 15
18 17 16
LRCK DATA
BCK
DGND
VDD
VCC2R
AGND2R
CLKO
XTI
XTO
EXTR
NC
VOUTR
AGND1
DM0 MUTE
IIS DM1
IW0 RST
ZERO
IW1
VCC2L AGND2L
VCC1
EXTL NC VOUTL
IC203 BR24C16FJ-E2
START
STOP
LOGIC
LOAD
DEVICE
ADDRESS
COMPARATOR
1
GND
A0
2
A1 A2
3
4
D
R/W
DATA WORD
ADDR/COUNTER
IN
D
OUT
COMP
SERIAL
CONTROL
LOGIC
LOAD INC
Y DEC
EN
H.V. PUMP/TIMING
DATA RECOVERY
X DEC
SERIAL MUX
E
D
2
PROM
/ACK
OUT
LOGIC
IC301 LB1930M-TLM
NC
891014 13 12 11
RESET
SWITCH
10
9 8 7
6
RESET
BUS RESET
OUT1 NC OUT2
P-GND
VCC
1
BUFFER
NC
2
IN1
3
4
IN2
VCC
8
7
TST
SDL
6
SDA
5
S-GND
IC302 BA8272FV-E2
5
VCC
2 3
1
BUS ON OUT
BUFFER
BUS ON
BUS ON IN
CONTROL
CIRCUIT
LINK OFF
CLK OUT
5 6 7
4
GND
VREF
BUS CLK
DATA OUT
BUS DATA
MOTOR
DRIVE
CIRCUIT
DATA IN
IC304 MJM2395AF08 IC305 MJM2395AF05
CONTROL
2
VOUT
3
GND
1
VIN
4
CONT
IC501 PCM1728E/2K
31
Page 32
CDX-747X
7-13. IC PIN FUNCTION DESCRIPTION
MAIN BOARD IC201 MB90473PFV-G-108-BNDE1 (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Description
1, 2
RAMA5, RAMA6
3 ELVR O
O Address signal output to the S-RAM Not used (open)
Motor drive signal (elevator down direction) output to the elevator motor drive (IC301) L active *1
4 ELVF O
5 LOADF O
6 LOADR O
7, 8
12 to15
30, 31 NC O Not used (open)
RAMA7, RAMA12
9 VSS Ground terminal 10 RAMA14 O Address signal output to the S-RAM Not used (open) 11 RAMWE O Write enable output to the S-RAM Not used (open)
RAMA13, RAMA8,
RAMA9, RAMA11
16 UNI SI I Serial data input from the SONY bus interface (IC302) 17 UNI SO O Serial data output to the SONY bus interface (IC302) 18 UNI CK I Serial data transfer clock signal input from the SONY bus interface (IC302) 19 LEDDAT O Not used (open) 20 LEDCLK O Not used (open) 21 VCC Power supply terminal (+3.3V) 22 LEDLAT O Not used (open) 23 CDON O D/A converter and servo section power supply on/off control signal output H: power on 24 ELVON O Mechanism deck section power supply on/off control signal output H: power on 25 RX I Input terminal at the flash memory data write mode Not used (open) 26 TX O Output terminal at the flash memory data write mode Not used (open) 27 NC O Not used (open) 28 EECLK O Serial data transfer clock signal output to the EEPROM (IC203) 29 FL BOOT I Flash memory data write control signal input terminal L active Not used (fixed at H)
32 EEDAT I/O Two-way data bus with the EEPROM (IC203) 33 AVCC Power supply terminal (+3.3V) (for A/D converter) 34 AVRH I Reference voltage (+3.3V) input terminal (for A/D converter) 35 AVSS Ground terminal (for A/D converter)
36 EHS I
Motor drive signal (elevator up direction) output to the elevator motor drive (IC301) L active *1
Motor drive signal (load chucking direction) output to the chucking motor drive (IC201) L active *2
Motor drive signal (save direction) output to the chucking motor drive (IC201) L active *2
O Address signal output to the S-RAM Not used (open)
O Address signal output to the S-RAM Not used (open)
Elevator height position detection signal input from the RV202 (elevator height sensor) (A/D input)
37 MCK I
38, 39 KEY0, KEY1 I Not used (open)
40 VSS Ground terminal 41 FOK I Focus OK signal input from the CXD3027R (IC101) L: NG, H: OK 42 GFS I Guard frame sync signal input from the CXD3027R (IC101) L: NG, H: OK 43 SCLK O Serial data reading clock signal output to the CXD3027R (IC101) 44 SENS I Internal status signal (sense signal) input from the CXD3027R (IC101) 45 BUSON I Bus on/off control signal input from the SONY bus interface (IC302) H: bus on 46 BUCHK I
Input of detection signal for the fine adjustment (elevator height (address) adjustment; RV201) of elevator height position (A/D input)
Battery detection signal input L: battery on
32
Page 33
CDX-747X
Pin No. Pin Name I/O Description
47, 48 MD0, MD1 I Setting terminal for the CPU operational mode (fixed at H in this set)
49 MD2 I Setting terminal for the CPU operational mode (fixed at L in this set) 50 EJECT SW I Eject switch (SW801) input terminal L active 51 MAGLK SW I Magazine detect switch (SW201) input terminal L: magazine is set 52 SCOR I Subcode sync (S0+S1) detection signal input from the CXD3027R (IC101)
53 GRSCOR I
54 NC O Not used (open)
55 HS O
56 SQSO I Subcode Q data input from the CXD3027R (IC101) 57 NC O Not used (open) 58 SQCK O Subcode Q data reading clock signal output to the CXD3027R (IC101) 59 CDCLK O Serial data transfer clock signal output to the CXD3027R (IC101) 60 CDLAT O Serial data latch pulse signal output to the CXD3027R (IC101) 61 CDDAT O Serial data output to the CXD3027R (IC101) 62 XRST O System reset signal output to the CXD3027R (IC101) and D/A converter (IC501) L: reset 63 XQOK O Subcode Q OK pulse signal output to the CXD3027R (IC101) L active 64 XRDE O D-RAM read enable signal output to the CXD3027R (IC101) L active 65 XWRE O D-RAM write enable signal output to the CXD3027R (IC101) L active 66 EMPH O Emphasis control signal output to the D/A converter (IC501) H: emphasis on 67 MUTE O Audio line muting on/off control signal output H: muting on 68 RAMA10 O Address signal output to the S-RAM Not used (open) 69 RAMCS O Chip select enable output to the S-RAM Not used (open)
70 to 74
RAMIO7 to
RAMIO3
Subcode sync (S0+S1) detection signal input from the D-RAM controller section on the CXD3027R (IC101)
Normal/high speed playback control signal output terminal L: high speed playback Not used (open)
I/O Two-way data bus with the S-RAM Not used (open)
System reset signal input from the SONY bus interface (IC302) and reset signal generator (IC303)
75 RESET I
76 RAMIO2 I/O Two-way data bus with the S-RAM Not used (open) 77 X1A O Sub system clock output terminal Not used (open) 78 X0A I Sub system clock input terminal Not used (fixed at L) 79 VSS Ground terminal 80 X0 I Main system clock input terminal (4 MHz) 81 X1 O Main system clock output terminal (4 MHz) 82 VCC Power supply terminal (+3.3V)
83, 84
85 to 88
RAMIO1, RAMIO0
RAMA0 to RAMA3
89 SINGLE I
90 DOUTSEL I Analog/digital select switch input terminal Not used (open) 91 CFSEL I Custom file on/off setting terminal L: custom file on (fixed at L)
92 TEXTSEL I
93 ESPSEL I ESP on/off setting terminal L: ESP on (fixed at L) 94 TEST I Test mode setting terminal L: test mode Not used (open)
95 MAG SW I Magazine in/out detect switch input terminal Not used (open)
L: reset For several hundreds msec. after the power supply rises, L is input, then it changes to H
I/O Two-way data bus with the S-RAM Not used (open)
O Address signal output to the S-RAM Not used (open)
Setting terminal for the single disc/multiple discs mode L: single disc mode, H: multiple discs mode (fixed at H)
CD text mode setting terminal L: CD text on, H: does not display track name (fixed at L)
33
Page 34
CDX-747X
e
e
Pin No. Pin Name I/O Description
96 SAVE SW I
97 LOAD SW I
98 LIM SW I
99 RW SEL O CD-ROM/RW selection signal output L: CD-ROM, H: CD-RW
100 RAMA4 O Address signal output to the S-RAM Not used (open)
*1 elevator motor (M104) control
Mod
Terminal
ELVF (pin 4) H”“L”“H”“L ELVR (pin 3) H”“H”“L”“L
*2 chucking motor (M103) control
Mod
Terminal
LOADF (pin 5) H”“L”“H”“L LOADR (pin 6) H”“H”“L”“L
Save end detect switch (SW2) input terminal L: When completion of the disc save operation
Chucking end detect switch (SW1) input terminal L: When completion of the disc chucking operation
Sled limit in detect switch (SW3) input terminal L: When the optical pick-up is inner position
STOP
STOP
ELEVATORUPELEVATOR
DOWN
LOAD
CHUCKING
SAVE BRAKE
BRAKE
34
Page 35
SECTION 8
7

EXPLODED VIEWS

CDX-747X
NOTE:
-XX and -X mean standardized parts, so they may have some difference from the original one.
Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED)
↑↑
Parts Color Cabinet's Color
8-1. CASE SECTION
13
#2
12
6
Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
The mechanical parts with no reference num­ber in the exploded views are not supplied.
Hardware (# mark) list and accessories and packing materials are given in the last of the electrical parts list.
19
#2
B
18
#3
A
16
#2
10
14
17
#3
#3
RV202
15
7
8
#2
20
(including fA)
#2
19
MG-251B-13
18
9
The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.
B
5
not supplied
1
A
3
not supplied
Ref. No. Part No. Description Remark
1 3-047-852-01 DAMPER (T)
* 3 3-024-065-01 CUSHION (EJECT-T)
4 X-3375-357-1 ARM (FLT) ASSY
* 5 1-679-418-11 JACK BOARD
6 3-376-464-11 SCREW (+PTT 2.6X6), GROUND POINT
* 7 A-3283-130-A MAIN BOARD, COMPLETE
8 1-676-340-11 JACK FLEXIBLE BOARD 9 1-676-339-11 MAIN FLEXIBLE BOARD
* 10 1-679-419-11 SWITCH BOARD
12 X-3379-720-1 DOOR (L) ASSY
13 3-229-226-11 PANEL, FRONT
22
4
not supplied
not supplied
23
1
fA
(included in 20)
Ref. No. Part No. Description Remark
14 3-022-007-01 BUTTON (EJT) (Z) 15 3-041-218-21 ESCUTCHEON (T)
* 16 3-022-012-01 HEAT SINK (T)
17 3-042-244-11 SCREW (T) 18 3-038-166-01 SPRING (FL), TENSION COIL
19 3-022-010-31 LEVER (FLT. 838)
* 20 3-047-609-01 CASE (UPPER. LOWER)
22 3-935-636-11 SCREW (FP) 23 X-3375-360-1 ARM (FRT) ASSY RV202 1-227-137-11 RES, VAR, SLIDE 10K
not supplied
(ELEVATOR HEIGHT SENSOR)
35
Page 36
CDX-747X
8-2. MECHANISM DECK SECTION-1
(MG-251B-137)
#3
101
#3
#3
102
103
Ref. No. Part No. Description Remark
101 X-3378-091-1 CHASSIS (U. S) SUB ASSY 102 3-024-161-01 SPRING (SUT)
36
Ref. No. Part No. Description Remark
103 3-011-997-01 SPRING (STOPPER. LOWER)
Page 37
8-3. MECHANISM DECK SECTION-2
(MG-251B-137)
CDX-747X
#3
152
151
M104
154
153
Ref. No. Part No. Description Remark
151 3-024-170-01 SPRING (SB), TENSION
* 152 3-040-790-01 BRACKET (EVM. S)
153 X-3378-092-1 CHASSIS (D. S) SUB ASSY
Ref. No. Part No. Description Remark * 154 3-014-685-01 SPACER (MO)
M104 A-3301-123-A ELJ MOTOR ASSY (ELEVATOR)
37
Page 38
CDX-747X
8-4. MECHANISM DECK SECTION-3
(MG-251B-137)
211
#8
213
212
#4
202
M103
201
204
205
206
209
208
#8
210
207
#3
214
#6
#6
#3
#6
Ref. No. Part No. Description Remark
* 201 3-024-150-01 RETAINER (CHM) * 202 X-3378-080-1 BRACKET (CHM. D) ASSY
204 3-321-813-01 WASHER, COTTER POLYETHYLENE 205 3-017-139-01 GEAR (WORM LOAD A) 206 3-022-839-01 ARM (NSW)
207 3-573-936-00 STOPPER, REEL 208 X-3375-220-1 GEAR (LOAD CAM) ASSY
38
Ref. No. Part No. Description Remark
209 3-010-252-11 ROLLER (CRE) 210 3-010-268-01 SPRING (DH), TENSION
* 211 A-3290-194-C MAIN ASSY, CHASSIS (EVY)
212 3-010-254-11 SHAFT (ROTARY PREVENTION C) 213 3-010-253-01 GEAR (LOMINI)
* 214 A-3326-947-A RF BOARD, COMPLETE
M103 A-3301-123-A ELJ MOTOR ASSY (CHUCKING)
Page 39
8-5. MECHANISM DECK SECTION-4
(MG-251B-137)
CDX-747X
258
256
#7
254
#9
257
252
M101
#11
not supplied
255
#5
#10
259
M102
not supplied
251
253
#11
not supplied
Ref. No. Part No. Description Remark
251 1-676-341-11 OP FLEXIBLE BOARD 252 3-025-743-01 SPRING (FEED), LEAF 253 X-3378-101-1 HOLDER (SLED. S) ASSY 254 3-931-832-01 GEAR (SL MIDWAY)
0255 8-820-103-03 OPTICAL PICK-UP KSS-720A/K1RP
256 A-3291-669-A SHAFT (FEED) ASSY
The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.
Ref. No. Part No. Description Remark
257 3-010-263-01 DETENT (SHAFT THRUST)
* 258 1-679-422-11 LSW BOARD
259 A-3301-954-A BASE (OPT. S) (J) ASSY M101 A-3315-151-A SLED MOTOR ASSY (251) M102 A-3301-998-A SPINDLE MOTOR (S) SUB ASSY
39
Page 40
CDX-747X
JACK LSW MAIN
SECTION 9

ELECTRICAL PARTS LIST

NOTE:
Due to standardization, replacements in the parts list may be different from the parts speci­fied in the diagrams or the components used on the set.
-XX and -X mean standardized parts, so they may have some difference from the original one.
RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 1-679-418-11 JACK BOARD
***********
< CAPACITOR >
C901 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C902 1-164-156-11 CERAMIC CHIP 0.1uF 25V C904 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
< CONNECTOR >
CN901 1-779-077-61 PLUG, CONNECTOR (CONTROL, AUDIO OUT) CNJ901 1-778-775-21 CONNECTOR, FPC 13P
< DIODE >
D901 8-719-978-33 DIODE DTZ-TT11-6.8B D902 8-719-978-33 DIODE DTZ-TT11-6.8B
< FERRITE BEAD >
FB901 1-500-445-21 FERRITE 0uH FB902 1-500-445-21 FERRITE 0uH FB903 1-500-445-21 FERRITE 0uH
< IC LINK >
PS901 1-576-398-21 LINK, IC (CCP2E63)
**************************************************************
Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when order­ing these items.
SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. .
CAPACITORS uF: µF
COILS uH: µH
C106 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V C107 1-162-960-11 CERAMIC CHIP 220PF 10% 50V C108 1-164-156-11 CERAMIC CHIP 0.1uF 25V C109 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C110 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C111 1-164-156-11 CERAMIC CHIP 0.1uF 25V C112 1-164-156-11 CERAMIC CHIP 0.1uF 25V C113 1-164-156-11 CERAMIC CHIP 0.1uF 25V C114 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C115 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C121 1-162-960-11 CERAMIC CHIP 220PF 10% 50V C122 1-162-960-11 CERAMIC CHIP 220PF 10% 50V C123 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C161 1-164-156-11 CERAMIC CHIP 0.1uF 25V C162 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C201 1-164-156-11 CERAMIC CHIP 0.1uF 25V C202 1-164-156-11 CERAMIC CHIP 0.1uF 25V C203 1-164-156-11 CERAMIC CHIP 0.1uF 25V C204 1-164-156-11 CERAMIC CHIP 0.1uF 25V C205 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C206 1-164-156-11 CERAMIC CHIP 0.1uF 25V C301 1-164-156-11 CERAMIC CHIP 0.1uF 25V C302 1-164-156-11 CERAMIC CHIP 0.1uF 25V C303 1-164-156-11 CERAMIC CHIP 0.1uF 25V C304 1-164-156-11 CERAMIC CHIP 0.1uF 25V
The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.
When indicating parts by reference number, please include the board.
* 1-679-422-11 LSW BOARD
**********
< SWITCH >
SW3 1-529-565-41 SWITCH, PUSH (1KEY) (LIMIT)
**************************************************************
* A-3283-130-A MAIN BOARD, COMPLETE
*********************
1-676-339-12 MAIN FLEXIBLE BOARD 1-676-340-12 JACK FLEXIBLE BOARD
< CAPACITOR >
C101 1-164-156-11 CERAMIC CHIP 0.1uF 25V C102 1-164-156-11 CERAMIC CHIP 0.1uF 25V C103 1-164-156-11 CERAMIC CHIP 0.1uF 25V C104 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V C105 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V
40
C305 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C306 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C307 1-165-112-11 CERAMIC CHIP 0.33uF 20% 10V C308 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C309 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C310 1-115-466-00 ELECT 1000uF 20% 16V C311 1-126-382-11 ELECT 100uF 20% 16V C312 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C313 1-126-382-11 ELECT 100uF 20% 16V C314 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C315 1-115-466-00 ELECT 1000uF 20% 16V C316 1-126-157-11 ELECT 10uF 20% 16V C317 1-164-156-11 CERAMIC CHIP 0.1uF 25V C318 1-164-156-11 CERAMIC CHIP 0.1uF 25V C319 1-127-491-00 ELECT (SOLID) 22uF 20% 10V
C403 1-164-730-11 CERAMIC CHIP 0.0012uF 10% 50V C404 1-164-730-11 CERAMIC CHIP 0.0012uF 10% 50V C405 1-164-217-11 CERAMIC CHIP 150PF 5% 50V C406 1-164-217-11 CERAMIC CHIP 150PF 5% 50V
Page 41
CDX-747X
Ver 1.1 2001.05
MAIN
Ref. No. Part No. Description Remark
C407 1-126-382-11 ELECT 100uF 20% 16V
C408 1-164-156-11 CERAMIC CHIP 0.1uF 25V C409 1-115-650-11 ELECT 47uF 20% 16V C410 1-115-650-11 ELECT 47uF 20% 16V C411 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C412 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C501 1-164-156-11 CERAMIC CHIP 0.1uF 25V C502 1-164-156-11 CERAMIC CHIP 0.1uF 25V C503 1-115-651-11 ELECT 100uF 20% 16V C504 1-164-156-11 CERAMIC CHIP 0.1uF 25V C505 1-115-651-11 ELECT 100uF 20% 16V
C506 1-164-156-11 CERAMIC CHIP 0.1uF 25V C508 1-115-650-11 ELECT 47uF 20% 16V C509 1-115-650-11 ELECT 47uF 20% 16V
< DIODE >
D302 8-719-017-94 DIODE MA8180 D303 8-719-017-94 DIODE MA8180 D306 8-719-069-56 DIODE UDZS-TE17-6.2B D307 8-719-988-61 DIODE 1SS355TE-17 D310 8-719-422-62 DIODE MA8062-L-TX
D313 8-719-071-34 DIODE RB521S-30-TE61 D314 8-719-071-34 DIODE RB521S-30-TE61
< IC >
IC101 8-752-398-18 IC CXD3027R IC102 8-759-538-44 IC MSM51V17400D-10TK-FS IC201 6-800-233-02 IC MB90473PFV-G-110-BNDE1 IC203 8-759-660-38 IC BR24C16FJ-E2 IC301 8-759-527-33 IC LB1930M-TLM
IC302 8-759-697-48 IC BA8272FV-E2 IC303 8-759-827-97 IC XC61CN2502PR IC304 8-759-833-13 IC NJM2395AF08 IC305 8-759-833-12 IC NJM2395AF05 IC306 8-759-444-93 IC RH5RL33AA-T1
IC401 8-759-662-11 IC TLV2362IPWR IC402 8-759-662-11 IC TLV2362IPWR IC501 8-759-648-44 IC PCM1728E/2K
< TRANSISTOR >
Q202 8-729-901-00 TRANSISTOR DTC124EK Q301 8-729-230-49 TRANSISTOR 2SC2712-YG Q303 8-729-820-46 TRANSISTOR 2SB1202FAS Q304 8-729-230-49 TRANSISTOR 2SC2712-YG Q402 8-729-027-23 TRANSISTOR DTA114EKA-T146
Ref. No. Part No. Description Remark
R109 1-216-857-11 METAL CHIP 1M 5% 1/16W R122 1-216-839-11 METAL CHIP 33K 5% 1/16W
R123 1-216-845-11 METAL CHIP 100K 5% 1/16W R125 1-216-839-11 METAL CHIP 33K 5% 1/16W R201 1-216-845-11 METAL CHIP 100K 5% 1/16W R202 1-216-845-11 METAL CHIP 100K 5% 1/16W R203 1-216-833-11 METAL CHIP 10K 5% 1/16W
R204 1-216-853-11 METAL CHIP 470K 5% 1/16W R205 1-216-864-11 METAL CHIP 0 5% 1/16W R206 1-216-864-11 METAL CHIP 0 5% 1/16W R207 1-216-821-11 METAL CHIP 1K 5% 1/16W R208 1-216-864-11 METAL CHIP 0 5% 1/16W
R209 1-216-833-11 METAL CHIP 10K 5% 1/16W R210 1-216-864-11 METAL CHIP 0 5% 1/16W R211 1-216-864-11 METAL CHIP 0 5% 1/16W R221 1-216-833-11 METAL CHIP 10K 5% 1/16W R222 1-216-833-11 METAL CHIP 10K 5% 1/16W
R250 1-216-845-11 METAL CHIP 100K 5% 1/16W R301 1-216-841-11 METAL CHIP 47K 5% 1/16W R302 1-216-845-11 METAL CHIP 100K 5% 1/16W R303 1-216-846-11 METAL CHIP 120K 5% 1/16W R304 1-216-847-11 METAL CHIP 150K 5% 1/16W
R305 1-216-845-11 METAL CHIP 100K 5% 1/16W R306 1-216-841-11 METAL CHIP 47K 5% 1/16W R310 1-216-841-11 METAL CHIP 47K 5% 1/16W R311 1-216-845-11 METAL CHIP 100K 5% 1/16W R401 1-216-833-11 METAL CHIP 10K 5% 1/16W
R402 1-216-833-11 METAL CHIP 10K 5% 1/16W R403 1-216-833-11 METAL CHIP 10K 5% 1/16W R404 1-216-833-11 METAL CHIP 10K 5% 1/16W R405 1-216-833-11 METAL CHIP 10K 5% 1/16W R406 1-216-833-11 METAL CHIP 10K 5% 1/16W
R407 1-218-871-11 RES-CHIP 10K 2% 1/16W R408 1-218-871-11 RES-CHIP 10K 2% 1/16W R409 1-218-645-11 RES-CHIP 11K 2% 1/16W R410 1-218-645-11 RES-CHIP 11K 2% 1/16W R411 1-216-853-11 METAL CHIP 470K 5% 1/16W
R412 1-216-853-11 METAL CHIP 470K 5% 1/16W R413 1-216-809-11 METAL CHIP 100 5% 1/16W R414 1-216-809-11 METAL CHIP 100 5% 1/16W R415 1-216-845-11 METAL CHIP 100K 5% 1/16W R416 1-216-845-11 METAL CHIP 100K 5% 1/16W
R501 1-216-821-11 METAL CHIP 1K 5% 1/16W
< VARIABLE RESISTOR >
Q410 8-729-015-39 TRANSISTOR DTC323TK Q420 8-729-015-39 TRANSISTOR DTC323TK
< RESISTOR >
R101 1-216-839-11 METAL CHIP 33K 5% 1/16W R102 1-216-833-11 METAL CHIP 10K 5% 1/16W R103 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R104 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R105 1-216-857-11 METAL CHIP 1M 5% 1/16W
R106 1-216-853-11 METAL CHIP 470K 5% 1/16W R107 1-216-833-11 METAL CHIP 10K 5% 1/16W R108 1-216-853-11 METAL CHIP 470K 5% 1/16W
RV201 1-223-834-11 RES, ADJ, CARBON 47K
< SWITCH >
SW201 1-529-565-41 SWITCH, PUSH (1KEY) (MAGAZINE DETECT)
< VIBRATOR >
X201 1-781-282-11 VIBRATOR, CERAMIC (4MHz) X501 1-760-307-11 VIBRATOR, CERAMIC (16.9344MHz)
**************************************************************
41
Page 42
CDX-747X
RF SWITCH
Ref. No. Part No. Description Remark
* A-3326-947-A RF BOARD, COMPLETE
******************
< CAPACITOR >
C101 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C102 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C103 1-164-156-11 CERAMIC CHIP 0.1uF 25V C104 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C105 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C106 1-164-156-11 CERAMIC CHIP 0.1uF 25V C107 1-164-156-11 CERAMIC CHIP 0.1uF 25V C108 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C109 1-164-156-11 CERAMIC CHIP 0.1uF 25V C111 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C121 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C122 1-164-156-11 CERAMIC CHIP 0.1uF 25V C201 1-117-681-11 ELECT CHIP 100uF 20% 16V C202 1-164-156-11 CERAMIC CHIP 0.1uF 25V C203 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
C204 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C205 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C206 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C207 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C208 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C209 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C217 1-164-156-11 CERAMIC CHIP 0.1uF 25V
< CONNECTOR >
CN102 1-778-303-21 CONNECTOR, FPC (ZIF) 16P CNJ101 1-778-777-21 CONNECTOR, FPC 26P
< IC >
IC101 8-752-089-74 IC CXA2581N-T4 IC201 8-759-832-99 IC LA6576L-TE-L
< TRANSISTOR >
Ref. No. Part No. Description Remark
R201 1-216-826-11 METAL CHIP 2.7K 5% 1/16W R202 1-216-833-11 METAL CHIP 10K 5% 1/16W R203 1-216-833-11 METAL CHIP 10K 5% 1/16W
R204 1-216-839-11 METAL CHIP 33K 5% 1/16W R205 1-216-833-11 METAL CHIP 10K 5% 1/16W R206 1-216-839-11 METAL CHIP 33K 5% 1/16W R207 1-216-833-11 METAL CHIP 10K 5% 1/16W R208 1-216-839-11 METAL CHIP 33K 5% 1/16W
R209 1-216-833-11 METAL CHIP 10K 5% 1/16W R210 1-216-839-11 METAL CHIP 33K 5% 1/16W R211 1-216-833-11 METAL CHIP 10K 5% 1/16W R212 1-216-839-11 METAL CHIP 33K 5% 1/16W R213 1-216-833-11 METAL CHIP 10K 5% 1/16W
R214 1-216-839-11 METAL CHIP 33K 5% 1/16W R215 1-216-841-11 METAL CHIP 47K 5% 1/16W R216 1-216-842-11 METAL CHIP 56K 5% 1/16W R218 1-216-841-11 METAL CHIP 47K 5% 1/16W R219 1-216-843-11 METAL CHIP 68K 5% 1/16W
R220 1-216-834-11 METAL CHIP 12K 5% 1/16W R222 1-216-821-11 METAL CHIP 1K 5% 1/16W R223 1-216-819-11 METAL CHIP 680 5% 1/16W
< SWITCH >
SW1 1-529-566-41 SWITCH, PUSH (1KEY)
(CHUKING END DETECT)
SW2 1-529-566-41 SWITCH, PUSH (1KEY) (SAVE END DETECT)
**************************************************************
* 1-679-419-11 SWITCH BOARD
*************
< SWITCH >
SW801 1-692-431-21 SWITCH, TACTILE (Z)
***********************************************************
MISCELLANEOUS
**************
Q101 8-729-141-48 TRANSISTOR 2SB624-BV345 Q102 8-729-901-00 TRANSISTOR DTC124EK
< RESISTOR >
R101 1-216-801-11 METAL CHIP 22 5% 1/16W R102 1-216-837-11 METAL CHIP 22K 5% 1/16W R103 1-216-837-11 METAL CHIP 22K 5% 1/16W R104 1-216-845-11 METAL CHIP 100K 5% 1/16W R105 1-216-801-11 METAL CHIP 22 5% 1/16W
R106 1-216-864-11 METAL CHIP 0 5% 1/16W R107 1-216-845-11 METAL CHIP 100K 5% 1/16W R108 1-216-833-11 METAL CHIP 10K 5% 1/16W R109 1-216-836-11 METAL CHIP 18K 5% 1/16W R110 1-216-836-11 METAL CHIP 18K 5% 1/16W
R112 1-216-845-11 METAL CHIP 100K 5% 1/16W R113 1-218-859-11 METAL CHIP 3.3K 0.5% 1/16W R117 1-216-833-11 METAL CHIP 10K 5% 1/16W R119 1-216-864-11 METAL CHIP 0 5% 1/16W R120 1-218-879-11 METAL CHIP 22K 0.5% 1/16W
R121 1-218-847-11 METAL CHIP 1K 0.5% 1/16W R122 1-218-847-11 METAL CHIP 1K 0.5% 1/16W
42
251 1-676-341-11 OP FLEXIBLE BOARD
0 255 8-820-103-03 OPTICAL PICK-UP KSS-720A/K1RP
M101 A-3315-151-A SLED MOTOR ASSY (251) M102 A-3301-998-A SPINDLE MOTOR (S) SUB ASSY M103 A-3301-123-A ELJ MOTOR ASSY (CHUCKING)
M104 A-3301-123-A ELJ MOTOR ASSY (ELEVATOR) RV202 1-227-137-11 RES, VAR, SLIDE 10K
************************************************************
**************
HARDWARE LIST
**************
#2 7-685-792-09 SCREW +PTT 2.6X6 (S) #3 7-685-781-09 SCREW +PTT 2X4 (S) #4 7-624-104-04 STOP RING 2.0, TYPE-E #5 7-627-554-07 SCREW, PRECISION +P 2X2.2 #6 7-628-253-00 SCREW +PS 2X4
#7 7-627-553-27 SCREW, PRECISION +P 2X2.5 #8 7-624-102-04 STOP RING 1.5, TYPE-E #9 7-627-850-28 SCREW, PRECISION +P 1.4X3 #10 7-627-000-00 SCREW, PRECISION +P 1.7X2.2 TYPE 3
The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.
(ELEVATOR HEIGHT SENSOR)
Page 43
CDX-747X
Ref. No. Part No. Description Remark
#11 7-627-553-37 PRECISION SCREW +P 2X3 TYPE 3
************************************************************
ACCESSORIES & PACKING MATERIALS
*******************************
3-225-284-11 MANUAL, INSRTUCTION (ENGLISH, FRENCH,
SPANISH, TRADITIONAL CHINESE)
A-3301-944-A MAGAZINE (250T) ASSY
***********************************************************
PARTS FOR INSTALLATION AND CONNECTIONS
**************************************
501 3-040-583-21 BRACKET (T)
* 502 X-3369-824-1 SCREW ASSY
503 1-590-874-11 CORD, CONNECTION (RCA PIN CORD 5.5m) 504 1-590-519-21 CORD (WITH CONNECTOR) (BUS CABLE 5.5m)
501 502
BRACKET
× 2
+PSW4 × 10
× 4
TAPPING SCREW
SCREW ASSY
(DIA.5 × 20) × 4
Ref. No. Part No. Description Remark
503 504
RCA PIN CORD 5.5 m
× 1
BUS CABLE 5.5 m
× 1
43
Page 44
CDX-747X
MEMO
44
Page 45
SERVICE MANUAL
Ver 1.2 2001.06

SUPPLEMENT-1

File this supplement with the service manual.
Subject: Change of RF/LSW boards
CDX-747X
US Model
E Model
(ECN-CSA04819)
In this set, RF/LSW boards have been changed in the midway of pro­duction. Printed wiring boards and schematic diagrams of new type, and changed parts list are described in this supplement-1. Refer to original service manual for other information.
• NEW/FORMER TYPE DISCRIMINATION
RF BOARD (Component Side)
Former type : 1-679-421-11 New type : 1-679-421-12
LSW BOARD (Component Side)
Former type : 1-679-422-11 New type : 1-679-422-12
Page 46

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

CDX-747X
Note on Printed Wiring Board:
Y : parts extracted from the conductor side.
: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)
Caution: Pattern face side: Parts on the pattern f ace side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the par ts face side seen from (Component Side) the parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in and 1/ specified.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety. Replace only with part number specified.
A : B+ Line.
H : adjustment for repair.
• Power v oltage is dc 14.4V and fed with regulated dc power supply from CD changer controller.
• Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : CD PLAY
• V oltages are taken with a V OM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc­tion tolerances.
• Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal produc­tion tolerances.
• Circled numbers refer to waveforms.
• Signal path. J : CD PLAY
: Impossible to measure
4
W or less unless otherwise
Page 47
CDX-747X

PRINTED WIRING BOARDS – RF/LSW Boards –

Semiconductor Location
Ref. No. Location
IC101 H-6 IC201 J-5
Q101 F-7 Q102 H-7
1
2 3 4 5 6 7 8 9 10 11 12 13
A
SW2
B
SW1
CHUKING
END DETECT
SAVE END
DETECT
C
TP106
TP105
TP103
TP104
WHT
YEL
RED
BLK
D
M101
M
(SLED)
E
M103
M
(CHUKING)
F
G
OPTICAL PICK-UP
BLOCK
(KSS-720A)
OP FLEXIBLE
BOARD
CN102
R103
H
C107
TP
TP
(VC)
(RFAC)
R223
R222
R104
R220
R218
C202
IC201
R219
C106
R106
C209
R215
SW3
MAIN FLEXIBLE
1-679-422-
BOARD
12
(12)
CNJ101
R214
R212
R210
R208
R206
R204
R201
R213
R211
R209
R207
R205
R203
R202
C208
C207
C206
C205
C204
C203
C217
I
A
MAIN BOARD
J
LSW BOARD
BLU
K
(LIMIT)
YEL
R102
IC101
TP
(TE)
R107
C109
R108
R216
R109
C103
C111
R110
Q101
C101
R117
C102
R119
R105
R122
R113
TP107
TP108
TP102
TP101
R101
Q102
R121
C108
R120
R112
1-679-421-
C104
C122
YEL
BLU
BLK
RED
(12)
C121
M102
M
(SPINDLE)
12
C105
C201
1-679-421-
12
(12)
22
Page 48

SCHEMATIC DIAGRAM – RF/LSW Boards –

CDX-747X
The components identified by mark 0 or dotted line with mark 0 are critical for safety.
33
Replace only with part number specified.
Page 49
CDX-747X
LSW RF

ELECTRICAL PARTS LIST

NOTE:
• Due to standardization, replacements in the parts list may be different from the parts speci­fied in the diagrams or the components used on the set.
• -XX and -X mean standardized parts, so they may have some difference from the original one.
• RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 1-679-422-12 LSW BOARD
**********
< SWITCH >
SW3 1-529-565-41 SWITCH, PUSH (1KEY) (LIMIT)
**************************************************************
* A-3326-947-A RF BOARD, COMPLETE
******************
< CAPACITOR >
C101 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C102 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C103 1-164-156-11 CERAMIC CHIP 0.1uF 25V C104 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C105 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C106 1-164-156-11 CERAMIC CHIP 0.1uF 25V C107 1-164-156-11 CERAMIC CHIP 0.1uF 25V C108 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C109 1-164-156-11 CERAMIC CHIP 0.1uF 25V C111 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C121 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C122 1-164-156-11 CERAMIC CHIP 0.1uF 25V C201 1-117-681-11 ELECT CHIP 100uF 20% 16V C202 1-164-156-11 CERAMIC CHIP 0.1uF 25V C203 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
C204 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C205 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C206 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C207 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C208 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C209 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C217 1-164-156-11 CERAMIC CHIP 0.1uF 25V
< CONNECTOR >
CN102 1-778-303-21 CONNECTOR, FPC (ZIF) 16P CNJ101 1-778-777-21 CONNECTOR, FPC 26P
• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when order­ing these items.
• SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. .
R101 1-216-801-11 METAL CHIP 22 5% 1/16W R102 1-216-837-11 METAL CHIP 22K 5% 1/16W R103 1-216-837-11 METAL CHIP 22K 5% 1/16W R104 1-216-845-11 METAL CHIP 100K 5% 1/16W R105 1-216-801-11 METAL CHIP 22 5% 1/16W
R106 1-216-864-11 METAL CHIP 0 5% 1/16W R107 1-216-845-11 METAL CHIP 100K 5% 1/16W R108 1-216-833-11 METAL CHIP 10K 5% 1/16W R109 1-216-836-11 METAL CHIP 18K 5% 1/16W R110 1-216-836-11 METAL CHIP 18K 5% 1/16W
R112 1-216-845-11 METAL CHIP 100K 5% 1/16W R113 1-218-859-11 METAL CHIP 3.3K 0.5% 1/16W R117 1-216-833-11 METAL CHIP 10K 5% 1/16W R119 1-216-864-11 METAL CHIP 0 5% 1/16W R120 1-218-879-11 METAL CHIP 22K 0.5% 1/16W
R121 1-218-847-11 METAL CHIP 1K 0.5% 1/16W R122 1-218-847-11 METAL CHIP 1K 0.5% 1/16W R201 1-216-826-11 METAL CHIP 2.7K 5% 1/16W R202 1-216-833-11 METAL CHIP 10K 5% 1/16W R203 1-216-833-11 METAL CHIP 10K 5% 1/16W
R204 1-216-839-11 METAL CHIP 33K 5% 1/16W R205 1-216-833-11 METAL CHIP 10K 5% 1/16W R206 1-216-839-11 METAL CHIP 33K 5% 1/16W R207 1-216-833-11 METAL CHIP 10K 5% 1/16W R208 1-216-839-11 METAL CHIP 33K 5% 1/16W
R209 1-216-833-11 METAL CHIP 10K 5% 1/16W R210 1-216-839-11 METAL CHIP 33K 5% 1/16W R211 1-216-833-11 METAL CHIP 10K 5% 1/16W R212 1-216-839-11 METAL CHIP 33K 5% 1/16W R213 1-216-833-11 METAL CHIP 10K 5% 1/16W
R214 1-216-839-11 METAL CHIP 33K 5% 1/16W R215 1-216-841-11 METAL CHIP 47K 5% 1/16W R216 1-216-842-11 METAL CHIP 56K 5% 1/16W R218 1-216-841-11 METAL CHIP 47K 5% 1/16W R219 1-216-843-11 METAL CHIP 68K 5% 1/16W
• CAPACITORS
uF: µF
• COILS
uH: µH
When indicating parts by reference number, please include the board.
< RESISTOR >
< IC >
IC101 8-752-089-74 IC CXA2581N-T4 IC201 8-759-832-99 IC LA6576L-TE-L
< TRANSISTOR >
Q101 8-729-141-48 TRANSISTOR 2SB624-BV345 Q102 8-729-901-00 TRANSISTOR DTC124EK
R220 1-216-834-11 METAL CHIP 12K 5% 1/16W R222 1-216-821-11 METAL CHIP 1K 5% 1/16W R223 1-216-819-11 METAL CHIP 680 5% 1/16W
< SWITCH >
SW1 1-529-566-31 SWITCH, PUSH (1KEY)
(CHUKING END DETECT)
SW2 1-529-566-31 SWITCH, PUSH (1KEY) (SAVE END DETECT)
Page 50
CDX-747X

REVISION HISTORY

Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page.
Ver. Date Description of Revision
1.2 2001.06 Change of RF/LSW BOARDS (ECN-CSA04819)
1.1 2001.05 Addition of SUB BOARD (ECN-CSB02847)
1.0 2001.02 New
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