SONY CDP XE270 Service Manual

CDP-XE270/XE370

SERVICE MANUAL

Ver. 1.4 2006.07

Photo: CDP-XE370

Model Name Using Similar Mechanism NEW

CD Mechanism Type CDM66-5BD27

Base Unit Name BU-5BD27

Optical Pick-up Name PXR-104X or KSS-213C

US Model

AEP Model

UK Model

E Model

Australian Model

CDP-XE270/XE370

Canadian Model

CDP-XE270

SPECIFICATIONS

Compact disc player

Laser Semiconductor laser (λ =

Frequency response 2 Hz to 20 kHz ± 0.5 dB Dynamic range More than 93 dB Harmonic distortion 0.0045%

Outputs

Jack type

ANALOG OUT

DIGITAL OUT (OPTICAL)

Phono jacks

Optical output connector

780 nm) Emission duration: continuous

Maximum output level

2 V (at 50 kilohms)

–18 dBm

Load impedance

Over 10 kilohms

Wave length: 660 nm

General

Power requirements

Where purchased

US, Canadian models AEP, UK models Australian model Singapore model

Power consumption 11 W Dimensions (approx.) 430 x 95 x 290 mm (w/h/d) incl. projecting parts Mass (approx.)

Supplied accessories

Audio cord (2 phono plugs – 2 phono plugs) (1) Remote commander (remote) (1) (CDP-XE370 only) R6 (size AA) batteries (2) (CDP-XE370 only)

Design and specifications are subject to change without notice.

Power requirements

120 V AC, 60 Hz 230 V AC, 50/60 Hz 240 V AC, 50/60 Hz 220 V– 230 V AC, 50/60 Hz

CDP-XE370: 3.2 kg CDP-XE270: 3.2 kg

9-929-591-15 Sony Corporation

2006G05-1 Home Audio Division

COMPACT DISC PLAYER

CDP-XE270/XE370

Ver 1.1 2001.07

1. SERVICING NOTES ............................................... 4

2. GENERAL ................................................................... 5

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 6

3-2. Case ................................................................................. 6

3-3. CD Mechanism Deck (CDM66-5BD27)........................ 7

3-4. MAIN Board ................................................................... 7

3-5. Base Unit (BU-5BD27)................................................... 8

4. TEST MODE.............................................................. 9

5. ELECTRICAL CHECKS ....................................... 11

6. DIAGRAMS

6-1. Note for Printed Wiring Boards

and Schematic Diagrams ................................................ 13

6-2. Printed Wiring Board – BD Board – ............................. 14

6-3. Schematic Diagram – BD Board – ................................ 15

6-4. Printed Wiring Boards

– LOADING/MAIN/POWER SW Boards –.................. 16

6-5. Schematic Diagram

– LOADING/MAIN/POWER SW Boards –.................. 17

6-6. Printed Wiring Boards – DISPLAY/KEY Boards –...... 18

6-7. Schematic Diagram – DISPLAY/KEY Boards – .......... 19

6-8. IC Pin Function Description ........................................... 22

7. EXPLODED VIEWS

7-1. Case Section .................................................................... 26

7-2. Front Panel Section ......................................................... 27

7-3. CD Mechanism Deck Section (CDM66-5BD27)........... 28

7-4. Base Unit Section (BU-5BD27) ..................................... 29

8. ELECTRICAL PARTS LIST ............................... 30

CDP-XE270/XE370

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester , such as the Simpson 229 or RCA

WT -540A. Follo w the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245

digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a

VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate lowvoltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V A C range are suitable. (See Fig. A)

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

The following caution label is located inside the unit.

To Exposed Metal Parts on Set

1.5 k

0.15 µF

Fig. A. Using an AC voltmeter to check AC leakage.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIA GRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Ω

Earth Ground

AC voltmete (0.75 V)

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

CDP-XE270/XE370

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objecti ve lens.

LASER DIODE AND FOCUS SEARCH OPERATION CHECK

Carry out the “S curve check” in “CD section adjustment” and check that the S curve waveforms is output three times.

• MODEL IDENTIFICATION

– Rear Panel –

PART No.

MODEL PART No.

CDP-XE270: AEP model 4-232-151-0 CDP-XE270: UK model 4-232-151-1 CDP-XE270: US and Canadian models 4-232-151-2[] CDP-XE270: Australian model 4-232-151-3 CDP-XE270: Singapore model 4-232-151-6 CDP-XE370: AEP model 4-232-692-0 CDP-XE370: UK model 4-232-692-1 CDP-XE370: US model 4-232-692-2 CDP-XE370: Australian model 4-232-692-3 CDP-XE370: Singapore model 4-232-692-6

[]

LOCATION OF CONTROLS

ANALOG OUT LEVEL +/– qk (7, 9) CHECK qg (12) CLEAR qf (12) CONTINUE 2 (9, 14) DISPLAY ON/OFF qs (11) FADER qd (13) Number buttons 4 (9, 12) PROGRAM qa (9) REPEAT 6 (9) SHUFFLE 1 (9) TIME 3 (10)

BUTTON DESCRIPTIONS

>10 5 (9, 12)

N qh (9, 11, 12, 14) X 8 (9, 14) x qj (9, 14) . AMS > 9 (9, 12, 14) m/M 0 (9, 13)

SECTION 2

GENERAL

CDP-XE270/XE370

This section is extracted from instruction manual.

– FRONT PANEL –

CLEAR qg (12) Disc compartment 6 (8) Display qj (10) PLAY MODE 2 (9, 12, 14) POWER 1 (8) Remote sensor qh (7)

(CDP-XE370 only) REPEAT 3 (9, 11) TIME w; (10)

– REMOTE CONTROL – (CDP-XE370 only)

BUTTON DESCRIPTIONS

A OPEN/CLOSE 7 (8, 10, 12) H 8 (9, 11, 12, 14) X 9 (9, 14) x 0 (9, 14) lAMSL dial qa (9, 12, 14) m/M qk (9, 13)

– REAR PANEL –

ANALOG OUT L/R jacks 2 (7) DIGITAL OUT OPTICAL jack 1 (8) Mains lead 4 (7)

CDP-XE270/XE370

• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET

3-2. CASE

(Page 6)

SECTION 3

DISASSEMBLY

3-3. CD MECHANISM DECK

(CDM66-5BD27) (Page 7)

3-5. BASE UNIT

(BU-5BD27) (Page 8)

Note: Follow the disassembly procedure in the numerical order given.

3-2. CASE

two screws (case 3 TP2)

3-4. MAIN BOARD

(Page 7)

case

screw (case 3 TP2)

two screws (case 3 TP2)

3-3. CD MECHANISM DECK (CDM66-5BD27)

tapering driver

panel, loading

wire (flat type) (21core)

connector (CN151)

CD mechanism deck (CDM66-5BD27)

– BOTTOM VIEW –

three screws (BVTP3

Note:When the power supply does not turn on,

rotate the cam with tepering driver (

∅

3 mm) as the figure shows,

and the loading panel will be moved.

)

CDP-XE270/XE370

3-4. MAIN BOARD

connector (CN602)

wire (flat type) (17core) (CN621)

wire (flat type) (21core) (CN651)

two screws (BVTP3 × 8)

main board

four screws (BVTP3 × 8

CDP-XE270/XE370

3-5. BASE UNIT (BU-5BD27)

– BOTTOM VIEW –

three screws (DIA. 12), froating

base unit (BU-5BD27)

two springs (932), compression

holder (66)

screw (DIA. 12), froating

two springs (932), compression

SECTION 4

Count up display Displays button number

TEST MODE

CDP-XE270/XE370

AGING MODE

Procedure:

1. While pressing the both x and [CLEAR] buttons, turn the

[ ]

power on.

2. Tray open-close aging is performed.

3. Press the [TIME] button to display time for open-close on the fluorescent indicator tube.

4. To release the mode, press the [POWER] button to turn OFF the power.

CHECK MODE

Procedure:

1. Press the [POWER] button to turn ON the power

2. Press the [ OPEN/CLOSE] button and insert the disc.

3. Press the [POWER] button to turn OFF the power.

4. While pressing the both [PLAY MODE] and [ ] buttons, turn

the power on .

5. CD starts playing, and every time the [TIME] button is pressed, RFDC and OFFSET are changed over.

6. To release the mode, press the [POWER] button to turn OFF the power.

ADJ MODE

Procedure:

1. Press the [POWER] button to turn ON the power

2. Press the [ OPEN/CLOSE] button and insert the disc.

3. Press the [POWER] button to turn OFF the power.

4. Short-circuit the test TP (ADJ) of the DISPLAY board and ground with a lead wire.

5. Press the [POWER] button to turn ON the power and CD plays the second track.

6. To release the mode, press the [POWER] button to turn OFF the power.

7. Open-circuit the test TP (ADJ) of the DISPLAY board and ground with a lead wire.

AFADJ MODE (KEY AND FLUORESCENT INDICATOR TUBE DISPLAY CHECK MODE)

Procedure:

1. Short-circuit the test TP (AFADJ) of the DISPLAY board and ground with a lead wire.

2. Press the [POWER] button to turn ON the power. The whole fluorescent indicator tube lights up.

3. All buttons have individual button numbers. When a button is pressed, the button number is counted up and displayed.

When remote controller signals are received, “RM **” will be displayed. (** are the numbers corresponding to the remote controller buttons.) (CDP-CE370 only)

4. To release the mode, press the [POWER] button to turn OFF the power.

5. Open-circuit the test TP (AFADJ) of the DISPLAY board and ground with a lead wire.

Buttons and Corresponding Button Numbers

Button Button Number or Display

H (PLAY) Partical lighting 1 X (PAUSE) 02 x (STOP) Partical lighting 2 lAMSL (button) 04 m 05 M 06

TIME 07 PLAY MODE 08 CLEAR 09 REPEAT 10 A OPEN/CLOSE All lit

When rotated clockwise: The music calendar

lAMSL (knob)

numerals light up in ascending order. When rotated counterclockwise: The music calendar numerals light up in descending order.

Partial lighting 1

SECMIN

Partial lighting 2

6810

12 14

16 18 20

CDP-XE270/XE370

Checking Location:

– DISPLAY BOARD (Conductor Side) –

(GND)

(AFADJ)

(ADJ)

–

BD board

TP (RFAC)

TP (VC)

oscilloscope

SECTION 5

ELECTRICAL CHECKS

CDP-XE270/XE370

Ver 1.1 2001.07

Note:

1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.

2. Use PATD-012 disc (4-225-203-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10MΩ impedance.

4. Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.

S Curve Check

Connection:

oscilloscope

BD board

TP (FE1)

TP (VC)

+ –

Procedure:

1. Connect an oscilloscope to test point TP (FE1) and TP (VC)

on the BD board.

2. Turn the power on and insert the disc (PATD-012).

3. Turn the power off and enter the ADJ mode. (Refer to 4. Test

Mode)

4. Turn the power on to playback the second track and press the

x button to stop playing back.

5. Press the [REPEAT] button. (The object lens moves up and

down)

6. Confirm the oscilloscope waveform (S-curve) is symmetrical

between A and B. And check peak to peak level within 2 ± 1 Vp-p.

Procedure:

1. Connect an oscilloscope to test point TP (RFDC) and TP (VC) on the BD board.

2. Turn the power on and insert the disc (PATD-012).

3. Turn the power off and enter the ADJ mode. (Refer to 4. Test Mode)

4. Turn the power on to playback the second track.

5. Confirm that oscilloscope waveform is clear and check RFDC signal level is correct or not.

Note: A clear RFDC signal waveform means that the shape “◊” can be

clearly distinguished at the center of the waveform.

RFDC signal waveform

VOLT/DIV: 200 mV TIME/DIV: 500 ns

level: 1.15

0.35 Vp-p

Checking Location: BD board (See page 12)

RFAC Level Check

Connection:

S-curve waveform

Note: • Try to measure several times to make sure than the ratio of A : B

or B : A is more than 10 : 7.

• Take sweep time as long as possible and light up the brightness to obtain best waveform.

symmetry

within 2

1 Vp-p

Checking Location: BD board (See page 12)

RFDC Level Check

Connection:

oscilloscope

BD board

TP (RFDC)

TP (VC)

–

Procedure:

1. Connect an oscilloscope to test point TP (RFA C) and TP (VC) on the BD board.

2. Turn the power on.

3. Turn the power off and enter the ADJ mode. (Refer to 4. Test Mode)

4. Turn the power on to playback the second track.

5. Confirm that oscilloscope waveform is clear and check RF A C signal level is correct or not.

Note: A clear RFAC signal waveform means that the shape “◊” can be

clearly distinguished at the center of the waveform.

RFAC signal waveform

VOLT/DIV: 200 mV TIME/DIV: 500 ns

level: 1.35

0.4 Vp-p

Checking Location: BD board (See page 12)

CDP-XE270/XE370

Ver 1.1 2001.07

E-F Balance Check

Connection:

oscilloscope

BD board

TP (TE1)

TP (VC)

–

Procedure:

1. Connect an oscilloscpe to test point TP (TE1) and TP (VC) on the BD board.

2. Turn the power on.

3. Put the disc (PATD-012) in to playback the number two track.

4. Press the [TIME] button. (The tracking servo and the sledding servo are turned OFF)

5. Check the level B of the oscilliscope's waveform and the A (DC voltage) of the center of the Traverse waveform. Confirm the following : A/B x 100 = less than ± 22%

Traverse Wavef orm

Center of the waveform

A (DC

voltage)

Checking Location:

– BD BOARD (Conductor Side) –

IC150

(VC)

IC131

(TE1)

(RFDC)

(FE1)

IC101

(RFAC)

level: 1.15 ± 0.5 Vp-p

6. Press the [TIME] button. (The tracking servo and sledding servo are turned ON) Confirm the C (DC voltage) is almost equal to the A (DC voltage) is step 5.

Traverse Wavef orm

Tracking servo

Sled servo

OFF

Tracking servo

Sled servo

C (DC voltage)

Checking Location: BD board

SECTION 6

DIAGRAMS

CDP-XE270/XE370

6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the par ts face side seen from (Component Side) the parts face are indicated.

• Indication of transistor

C Q

These are omitted.

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/ specified.

• C : panel designation.

Note:

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

• A : B+ Line.

• B : B– Line.

• Voltages and waveforms are dc with respect to ground

under no-signal conditions. no mark : CD PLAY

• Voltages are taken with a V OM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances.

• Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances.

• Circled numbers refer to waveforms.

• Signal path.

J : CD PLAY (ANALOG OUT) c : CD PLAY (DIGITAL OUT)

Note:

Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.

W or less unless otherwise

• Circuit Boards Location

POWER SW board

KEY board

LOADING board

BD board

MAIN board

DISPLAY board

1313

+ 29 hidden pages

SONY CDP XE270 Service Manual

TABLE OF CONTENTS

SERVICING NOTES

GENERAL

3-1. DISASSEMBLY FLOW

3-2. CASE

DISASSEMBLY

3-3. CD MECHANISM DECK (CDM66-5BD27)

3-4. MAIN BOARD

3-5. BASE UNIT (BU-5BD27)

TEST MODE

ELECTRICAL CHECKS

DIAGRAMS

6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS