6-8. IC Pin Function Description ........................................... 22
7.EXPLODED VIEWS
7-1. Case Section .................................................................... 26
7-2. Front Panel Section ......................................................... 27
7-3. CD Mechanism Deck Section (CDM66-5BD27)........... 28
7-4. Base Unit Section (BU-5BD27) ..................................... 29
8.ELECTRICAL PARTS LIST ............................... 30
2
Page 3
CDP-XE270/XE370
r
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester , such as the Simpson 229 or RCA
WT -540A. Follo w the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate lowvoltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V A C range are suitable. (See Fig. A)
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation exposure.
This appliance is classified as a CLASS 1 LASER
product.
The CLASS 1 LASER PRODUCT MARKING is
located on the rear exterior.
The following caution label is located inside the unit.
To Exposed Metal
Parts on Set
1.5 k
0.15 µF
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIA GRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Ω
Earth Ground
AC
voltmete
(0.75 V)
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
3
Page 4
CDP-XE270/XE370
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objecti ve lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Rear Panel –
PART No.
MODELPART No.
CDP-XE270: AEP model4-232-151-0
CDP-XE270: UK model4-232-151-1
CDP-XE270: US and Canadian models4-232-151-2[]
CDP-XE270: Australian model4-232-151-3
CDP-XE270: Singapore model4-232-151-6
CDP-XE370: AEP model4-232-692-0
CDP-XE370: UK model4-232-692-1
CDP-XE370: US model4-232-692-2
CDP-XE370: Australian model4-232-692-3
CDP-XE370: Singapore model4-232-692-6
[]
[]
[]
[]
[]
[]
[]
[]
[]
4
Page 5
LOCATION OF CONTROLS
ANALOG OUT LEVEL +/– qk (7, 9)
CHECK qg (12)
CLEAR qf (12)
CONTINUE 2 (9, 14)
DISPLAY ON/OFF qs (11)
FADER qd (13)
Number buttons 4 (9, 12)
PROGRAM qa (9)
REPEAT 6 (9)
SHUFFLE 1 (9)
TIME 3 (10)
BUTTON DESCRIPTIONS
>10 5 (9, 12)
N qh (9, 11, 12, 14)
X 8 (9, 14)
x qj (9, 14)
. AMS > 9 (9, 12, 14)
m/M 0 (9, 13)
SECTION 2
GENERAL
CDP-XE270/XE370
This section is extracted from
instruction manual.
A OPEN/CLOSE 7 (8, 10, 12)
H 8 (9, 11, 12, 14)
X 9 (9, 14)
x 0 (9, 14)
lAMSL dial qa (9, 12, 14)
m/M qk (9, 13)
– REAR PANEL –
ANALOG OUT L/R jacks 2 (7)
DIGITAL OUT OPTICAL jack 1 (8)
Mains lead 4 (7)
5
Page 6
CDP-XE270/XE370
• This set can be disassembled in the order shown below.
3-1.DISASSEMBLY FLOW
SET
3-2. CASE
(Page 6)
SECTION 3
DISASSEMBLY
3-3. CD MECHANISM DECK
(CDM66-5BD27)
(Page 7)
3-5. BASE UNIT
(BU-5BD27)
(Page 8)
Note: Follow the disassembly procedure in the numerical order given.
3-2.CASE
1
two screws
(case 3 TP2)
3-4. MAIN BOARD
(Page 7)
2
case
1
screw
(case 3 TP2)
1
two screws
(case 3 TP2)
6
Page 7
3-3.CD MECHANISM DECK (CDM66-5BD27)
1
tapering driver
2
3
panel, loading
4
wire (flat type) (21core)
7
connector (CN151)
8
CD mechanism deck
(CDM66-5BD27)
– BOTTOM VIEW –
5
three screws
(BVTP3
×
8)
6
Note:When the power supply does not turn on,
rotate the cam with tepering driver (
∅
3 mm) as the figure shows,
and the loading panel will be moved.
)
CDP-XE270/XE370
3-4.MAIN BOARD
1
connector (CN602)
2
wire (flat type) (17core)
(CN621)
2
wire (flat type) (21core)
(CN651)
4
two screws
(BVTP3 × 8)
5
main board
3
four screws
(BVTP3 × 8
7
Page 8
CDP-XE270/XE370
3-5.BASE UNIT (BU-5BD27)
– BOTTOM VIEW –
3
three screws
(DIA. 12), froating
2
6
base unit
(BU-5BD27)
5
two springs
(932), compression
4
holder (66)
1
screw (DIA. 12), froating
5
two springs
(932), compression
8
Page 9
SECTION 4
Count up displayDisplays button number
10
TEST MODE
CDP-XE270/XE370
AGING MODE
Procedure:
1. While pressing the both x and [CLEAR] buttons, turn the
[ ]
power on.
2. Tray open-close aging is performed.
3. Press the [TIME] button to display time for open-close on the
fluorescent indicator tube.
4. To release the mode, press the [POWER] button to turn OFF
the power.
CHECK MODE
Procedure:
1. Press the [POWER] button to turn ON the power
2. Press the [ OPEN/CLOSE] button and insert the disc.
A
3. Press the [POWER] button to turn OFF the power.
4. While pressing the both [PLAY MODE] and [ ] buttons, turn
H
the power on .
5. CD starts playing, and every time the [TIME] button is pressed,
RFDC and OFFSET are changed over.
6. To release the mode, press the [POWER] button to turn OFF
the power.
ADJ MODE
Procedure:
1. Press the [POWER] button to turn ON the power
2. Press the [ OPEN/CLOSE] button and insert the disc.
3. Press the [POWER] button to turn OFF the power.
4. Short-circuit the test TP (ADJ) of the DISPLAY board and
ground with a lead wire.
5. Press the [POWER] button to turn ON the power and CD plays
the second track.
6. To release the mode, press the [POWER] button to turn OFF
the power.
7. Open-circuit the test TP (ADJ) of the DISPLAY board and
ground with a lead wire.
A
AFADJ MODE (KEY AND FLUORESCENT INDICATOR TUBE DISPLAY CHECK MODE)
Procedure:
1. Short-circuit the test TP (AFADJ) of the DISPLAY board and
ground with a lead wire.
2. Press the [POWER] button to turn ON the power.
The whole fluorescent indicator tube lights up.
3. All buttons have individual button numbers.
When a button is pressed, the button number is counted up
and displayed.
When remote controller signals are received, “RM **” will be
displayed.
(** are the numbers corresponding to the remote controller
buttons.) (CDP-CE370 only)
4. To release the mode, press the [POWER] button to turn OFF
the power.
5. Open-circuit the test TP (AFADJ) of the DISPLAY board and
ground with a lead wire.
Buttons and Corresponding Button Numbers
ButtonButton Number or Display
H (PLAY)Partical lighting 1
X (PAUSE)02
x (STOP)Partical lighting 2
lAMSL (button) 04
m05
M06
TIME07
PLAY MODE08
CLEAR09
REPEAT10
A OPEN/CLOSEAll lit
When rotated clockwise: The music calendar
lAMSL (knob)
numerals light up in ascending order.
When rotated counterclockwise: The music
calendar numerals light up in descending
order.
Partial lighting 1
SECMIN
Partial lighting 2
24
6810
1214
161820
9
Page 10
CDP-XE270/XE370
Checking Location:
– DISPLAY BOARD (Conductor Side) –
(GND)
TP
(AFADJ)
TP
(ADJ)
10
Page 11
+
–
BD board
TP (RFAC)
TP (VC)
oscilloscope
SECTION 5
ELECTRICAL CHECKS
CDP-XE270/XE370
Ver 1.1 2001.07
Note:
1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.
2. Use PATD-012 disc (4-225-203-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩ impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S Curve Check
Connection:
oscilloscope
BD board
TP (FE1)
TP (VC)
+
–
Procedure:
1. Connect an oscilloscope to test point TP (FE1) and TP (VC)
on the BD board.
2. Turn the power on and insert the disc (PATD-012).
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track and press the
x button to stop playing back.
5. Press the [REPEAT] button. (The object lens moves up and
down)
6. Confirm the oscilloscope waveform (S-curve) is symmetrical
between A and B. And check peak to peak level within 2 ± 1
Vp-p.
Procedure:
1. Connect an oscilloscope to test point TP (RFDC) and TP (VC)
on the BD board.
2. Turn the power on and insert the disc (PATD-012).
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track.
5. Confirm that oscilloscope waveform is clear and check RFDC
signal level is correct or not.
Note: A clear RFDC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
RFDC signal waveform
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
±
level: 1.15
VC
0.35 Vp-p
Checking Location: BD board (See page 12)
RFAC Level Check
Connection:
S-curve waveform
Note: • Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
symmetry
A
B
within 2
±
1 Vp-p
Checking Location: BD board (See page 12)
RFDC Level Check
Connection:
oscilloscope
BD board
TP (RFDC)
TP (VC)
+
–
Procedure:
1. Connect an oscilloscope to test point TP (RFA C) and TP (VC)
on the BD board.
2. Turn the power on.
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track.
5. Confirm that oscilloscope waveform is clear and check RF A C
signal level is correct or not.
Note: A clear RFAC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
RFAC signal waveform
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
±
level: 1.35
0.4 Vp-p
Checking Location: BD board (See page 12)
11
Page 12
CDP-XE270/XE370
Ver 1.1 2001.07
E-F Balance Check
Connection:
oscilloscope
BD board
TP (TE1)
TP (VC)
+
–
Procedure:
1. Connect an oscilloscpe to test point TP (TE1) and TP (VC) on
the BD board.
2. Turn the power on.
3. Put the disc (PATD-012) in to playback the number two track.
4. Press the [TIME] button. (The tracking servo and the sledding
servo are turned OFF)
5. Check the level B of the oscilliscope's waveform and the A
(DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than ± 22%
Traverse Wavef orm
Center of
the waveform
B
0V
A (DC
voltage)
Checking Location:
– BD BOARD (Conductor Side) –
IC150
TP
(VC)
IC131
TP
(TE1)
(RFDC)
TP
(FE1)
TP
IC101
TP
(RFAC)
level: 1.15 ± 0.5 Vp-p
6. Press the [TIME] button. (The tracking servo and sledding servo
are turned ON)
Confirm the C (DC voltage) is almost equal to the A (DC
voltage) is step 5.
Traverse Wavef orm
0V
Tracking servo
Sled servo
OFF
Tracking servo
Sled servo
ON
C (DC
voltage)
Checking Location: BD board
12
Page 13
SECTION 6
DIAGRAMS
CDP-XE270/XE370
6-1.NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the par ts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
C
Q
B
B
E
Q
CE
These are omitted.
These are omitted.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
• C : panel designation.
Note:
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part
number specified.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
• Voltages are taken with a V OM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J: CD PLAY (ANALOG OUT)
c : CD PLAY (DIGITAL OUT)
4
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
W or less unless otherwise
• Circuit Boards Location
POWER SW board
KEY board
LOADING board
BD board
MAIN board
DISPLAY board
1313
Page 14
CDP-XE270/XE370
Ver 1.1 2001.07
6-2.PRINTED WIRING BOARD – BD Board –• See page 13 for Circuit Boards Location.
12345678910111213
A
BD BOARD
(COMPONENT SIDE)
B
C
D
E
F
G
C199
FB191
R192
C171
C191
C112
R110
C181
C182
C172
C192
X191
R184
R174
C193
R112
C110
R111
C194
TP (FE1)
TP (TE1)
TP (RFDC)
M101
(SPINDLE)
C122
C121
C120
R120
RB102
IC101
C123
R123
R121
C125
R122
TP (RFAC)
TP (DGND)
(LIMIT)
R127
S101
R126
C126
R125
RB101
C183
C173
R129
R181
R182
R172
R171
R191
C184
BD BOARD
(CONDUCTOR SIDE)
M
R183
C174
R173
(SLED)
1-681-001-
M102
CN101
A
MAIN BOARD
CN651
(Page 16)
11
(11)
M
C151
C150
C130
C103
C111
R103
R143
C102
C101
C132
C131
R101
C140
R134
R102
R140
R142
C152
C153
E
C154
R146
Q132
R149
R136
R137
1-681-001-
R138
R152
R151
C138
Q131
E
C158
C133
C134
C137
11
(11)
R155
TP (VC)
R153
C145
R145
C136
IC150
R141
R144
IC131
C124
R135
R139
C139
CN102
• Semiconductor
Location
Ref. No. Location
IC101E-10
IC131E-8
IC150C-8
Q131F-6
Q132E-6
OPTICAL PICK-UP
BLOCK
(PXR-104X)
1414
Page 15
6-3.SCHEMATIC DIAGRAM – BD Board – • See page 20 for Waveforms. • See page 20 for IC Block Diagrams.
TP
(RFDC)
CDP-XE270/XE370
Ver 1.1 2001.07
(Page 17)
1515
Page 16
CDP-XE270/XE370
6-4.PRINTED WIRING BOARDS – LOADING/MAIN/POWER SW Boards –• See page 13 for Circuit Boards Location.
Subcode Q data output to the system controller (IC501)
Subcode Q data reading clock signal input from the system controller (IC501)
System reset signal input from the system controller (IC501) “L”: reset
Analog line muting on/off control signal input terminal “H”: line muting on
Not used (fixed at “L”)
Serial data input from the system controller (IC501)
Serial data latch pulse signal input from the system controller (IC501)
Serial data transfer clock signal input from the system controller (IC501)
Internal status (SENSE) output to the system controller (IC501)
SENSE serial data reading clock signal input from the system controller (IC501)
Power supply terminal (+5V) (digital system)
Input/output terminal for anti-shock Not used (pull down)
Microcomputer escape interface input A terminal Not used (fixed at “L”)
Microcomputer escape interface input B terminal Not used (fixed at “L”)
Microcomputer escape interface output terminal Not used (open)
Write frame clock signal output terminal Not used (open)
XUGF signal output terminal Not used (open)
XPCK signal output terminal Not used (open)
Guard frame sync signal output terminal Not used (open)
C2 pointer signal output terminal Not used (open)
Subcode sync (S0+S1) detection signal output to the system controller (IC501)
Numbers of track counted signal input/output terminal Not used (open)
Mirror signal input/output terminal Not used (open)
Defect signal input/output terminal Not used (open)
Focus OK signal input/output terminal Not used (open)
GFS is sampled by 460 Hz “H” when GFS is “H” Not used (open)
Spindle motor (M101) servo drive signal output to the AN4800SB (IC150)
Detection signal input from limit in switch (S101)
The optical pick-up is inner position when “H”
Sled servo drive PWM signal (+) output to the AN4800SB (IC150)
Sled servo drive PWM signal (–) output to the AN4800SB (IC150)
Tracking servo drive PWM signal (+) output to the AN4800SB (IC150)
Tracking servo drive PWM signal (–) output to the AN4800SB (IC150)
Focus servo drive PWM signal (+) output to the AN4800SB (IC150)
Focus servo drive PWM signal (–) output to the AN4800SB (IC150)
Ground terminal (digital system)
Input terminal for the test (fixed at “L”)
Input terminal for the test (fixed at “L”)
Input terminal for the system clock frequency setting
“L”: 16.9344 MHz, “H”: 33.8688 MHz (fixed at “L” in this set)
Middle point voltage (+2.5V) input from the CXA2581N (IC131)
Focus error signal input from the CXA2581N (IC131)
Sled error signal input from the CXA2581N (IC131)
Tracking error signal input from the CXA2581N (IC131)
Middle point servo analog signal input from the CXA2581N (IC131)
RF signal input from the CXA2581N (IC131)
Output terminal for the test Not used (open)
Ground terminal (digital system)
Stabilized current input for operational amplifiers
Power supply terminal (+5V) (digital system)
EFM full-swing output terminal
Asymmetry comparator voltage input terminal
Asymmetry circuit constant current input terminal
EFM signal input from the CXA2581N (IC131)
Ground terminal (digital system)
Internal VCO control voltage input
Filter output for master PLL
Filter input for master PLL
Charge pump output for master PLL
Power supply terminal (+5V) (digital system)
Ground terminal (digital system)
Power supply terminal (+5V) (digital system)
Digital audio signal output to the DIGITAL OUT OPTICAL (IC651)
D/A interface L/R sampling clock signal (44.1 kHz) output terminal Not used (open)
D/A interface serial data output terminal Not used (open)
D/A interface bit clock signal (2.8224 MHz) output terminal Not used (open)
“H” is output when playback disc is emphasis on
“L” is output when playback disc is emphasis off Not used (open)
Power supply terminal (+5V) (crystal oscillator system)
System clock input terminal (16.9344 MHz)
System clock output terminal (16.9344 MHz)
Ground terminal (crystal oscillator system)
Power supply terminal (+5V) (analog system)
L-ch analog audio signal output
L-ch operational amplifiers input
L-ch line output
Ground terminal (analog system)
Ground terminal (analog system)
R-ch line output
R-ch operational amplifiers input
R-ch analog audio signal output
Power supply terminal (+5V) (analog system)
R-ch line muting on/off control signal output “L”: line muting on
L-ch line muting on/off control signal output “L”: line muting on
2RMINIRemote control signal input from the remote control receiver (IC561)
3
4 to 6
7
8CLKOSerial data transfer clock signal output to the CXD2587Q (IC101)
9SENSIInternal status (SENSE) signal input from the CXD2587Q (IC101)
10DATAOSerial data output to the CXD2587Q (IC101)
11SQCKOSubcode Q data reading clock signal output to the CXD2587Q (IC101)
12SQSOISubcode Q data signal input from the CXD2587Q (IC101)
13, 14
15XLATOSerial data latch pulse signal output to the CXD2587Q (IC101)
16 to 19
20LDOUTOLoading motor (M151) drive signal output to the BA6956AN (IC631) “H” active *1
21LDINOLoading motor (M151) drive signal output to the BA6956AN (IC631) “H” active *1
061-696-845-11 CORD, POWER (AUS)
061-777-071-43 CORD, POWER (AEP, UK, SP)
061-783-531-32 CORD, POWER (US, CND)
71-823-359-11 WIRE (FLAT TYPE) (21 CORE)
83-363-099-02 SCREW (CASE 3 TP2) (BLACK)
83-363-099-11 SCREW (CASE 3 TP2) (SILVER)
92-660-400-31 CASE (SILVER: for Hair-line Finish) (AEP, UK)
94-232-149-31 CASE (408226) (BLACK)
4
5
11
#1
2
2
Ref. No.Part No.DescriptionRemark
94-232-580-31 CASE (408226) (SILVER)
(XE270: AEP, UK/XE370: AEP)
10A-4725-617-A MAIN BOARD, COMPLETE
114-232-151-02 PANEL, BACK (XE270: AEP)
114-232-151-12 PANEL, BACK (XE270: UK)
114-232-151-23 PANEL, BACK (XE270: US, CND)
114-232-151-31 PANEL, BACK (XE270: AUS)
114-232-151-63 PANEL, BACK (XE270: SP)
114-232-692-02 PANEL, BACK (XE370: AEP)
114-232-692-12 PANEL, BACK (XE370: UK)
114-232-692-23 PANEL, BACK (XE370: US)
114-232-692-31 PANEL, BACK (XE370: AUS)
114-232-692-63 PANEL, BACK (XE370: SP)
0 T6011-437-257-11 TRANSFORMER, POWER (US, CND)
0 T6011-437-258-12 TRANSFORMER, POWER (AEP, UK, SP, AUS)
#17-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S
26
Page 27
7-2.FRONT PANEL SECTION
CDP-XE270/XE370
Ver. 1.3
55
54
53
56
52
60
55
59
58
57
55
51
Ref. No.Part No.DescriptionRemark
51X-2102-909-1 PANEL ASSY, FRONT (SILVER: Hair-line Finish)
(XE270: AEP, UK)
51X-2102-910-1 PANEL ASSY, FRONT (SILVER: Hair-line Finish)
(XE370: AEP, UK)
51X-4953-458-4 PANEL ASSY, FRONT (BLACK)
(XE370: AEP, UK, SP, AUS)
51X-4953-459-4 PANEL ASSY, FRONT (BLACK)
(XE270: AEP, UK, SP, AUS)
51X-4953-460-4 PANEL ASSY, FRONT (SILVER)
(XE270: AEP, UK)
51X-4953-553-5 PANEL ASSY, FRONT (BLACK) (XE370: US)
51X-4953-554-5 PANEL ASSY, FRONT (BLACK)
R1011-216-835-11 METAL CHIP15K5%1/10W
R1021-216-845-11 METAL CHIP100K5%1/10W
R1031-216-835-11 METAL CHIP15K5%1/10W
R1101-216-821-11 METAL CHIP1K5%1/10W
R1111-216-809-11 METAL CHIP1005%1/10W
R1121-216-833-11 METAL CHIP10K5%1/10W
R1201-216-839-11 METAL CHIP33K5%1/10W
R1211-216-833-11 METAL CHIP10K5%1/10W
R1221-216-845-11 METAL CHIP100K5%1/10W
R1231-216-857-11 METAL CHIP1M5%1/10W
R1251-216-827-11 METAL CHIP3.3K5%1/10W
R1261-216-833-11 METAL CHIP10K5%1/10W
R1271-216-821-11 METAL CHIP1K5%1/10W
R1291-216-815-11 METAL CHIP3305%1/10W
R1341-216-853-11 METAL CHIP470K5%1/10W
R1351-216-837-11 METAL CHIP22K5%1/10W
R1361-216-837-11 METAL CHIP22K5%1/10W
R1371-216-797-11 METAL CHIP105%1/10W
R1381-216-798-11 METAL CHIP125%1/10W
R1391-216-846-11 METAL CHIP120K5%1/10W
R1401-216-854-11 METAL CHIP560K5%1/10W
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque 0 sont critiquens pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
When indicating parts by reference
number, please include the board.
< CONNECTOR >
< JUMPER RESISTER >
< IC >
< TRANSISTOR >
< RESISTOR >
30
Note: When you repair or exchange BD board,
please be sure to refer to “Supplement-1”.
Page 31
CDP-XE270/XE370
Ver. 1.4
BD DISPLAY KEY LOADING
Ref. No.Part No.DescriptionRemark
R1411-216-840-11 METAL CHIP39K5%1/10W
R1421-216-841-11 METAL CHIP47K5%1/10W
R1431-216-855-11 METAL CHIP680K5%1/10W
R1441-216-846-11 METAL CHIP120K5%1/10W
R1451-216-830-11 METAL CHIP5.6K5%1/10W
R1461-216-845-11 METAL CHIP100K5%1/10W
R1491-216-821-11 METAL CHIP1K5%1/10W
R1511-216-845-11 METAL CHIP100K5%1/10W
R1521-216-833-11 METAL CHIP10K5%1/10W
R1531-216-864-11 SHORT CHIP0
R1551-216-837-11 METAL CHIP22K5%1/10W
R1711-218-720-11 METAL CHIP15K0.5%1/10W
R1721-218-720-11 METAL CHIP15K0.5%1/10W
R1731-218-720-11 METAL CHIP15K0.5%1/10W
R1741-216-809-11 METAL CHIP1005%1/10W
R1811-218-720-11 METAL CHIP15K0.5%1/10W
R1821-218-720-11 METAL CHIP15K0.5%1/10W
R1831-218-720-11 METAL CHIP15K0.5%1/10W
R1841-216-809-11 METAL CHIP1005%1/10W
R1911-216-817-11 METAL CHIP4705%1/10W
R1921-216-797-11 METAL CHIP105%1/10W
IC6018-759-039-69 IC uPC7805AHF
IC6028-749-011-78 IC BA17807T
IC6038-759-165-81 IC PST600D-T
IC6318-759-598-69 IC BA6956AN
IC6518-749-921-12 IC GP1F32T (DIGITAL OUT OPTICAL)
Note: When you exchange Ref. No. 555, please be sure
to refer to “Supplement-1”.
33
Page 34
CDP-XE270/XE370
MEMO
34
Page 35
CDP-XE270/XE370
CDP-XE270/XE370
SERVICE MANUAL
Ver. 1.4 2006.07
SUPPLEMENT-1
File this supplement with the service manual.
Subject: Change of OPTICAL PICK-UP (PXR-
104XtKSS-213C), and Change of BD board
(Suffix-12) according to it
(CDP-XE270: AEP, UK, Australian, Singapore
models/CDP-XE370: AEP, UK models only)
In the AEP, UK, Australian, Singapore models of CDP-XE270 and AEP,
UK models of CDP-XE370, optical pick-up has been changed in the midway of production, and BD board has been changed according to it.
Difference table of optical pick-up and changed BD board are described
in this supplement-1.
Refer to original service manual for other information.
US Model
AEP Model
UK Model
E Model
Australian Model
CDP-XE270/XE370
Canadian Model
CDP-XE270
1.DESCRIPTION AND DIFFERENCE TABLE
In the AEP, UK, Australian, Singapore models of CDP-XE270 and AEP, UK models of CDP-XE370, optical pick-up has been changed in the
midway of production, and BD board has been changed according to it.
Before repairing, please be sure to confirm which type set according to the table below.
Former type (PXR-104X)New type (KSS-213C)
PXR-104X
KSS-213C
OPTICAL
PICK-UP
Part No.Description
1-796-033-12OPTICAL PICK-UP (PXR-104X)
BD BOARD
Difference
Parts
Note: The service parts of A-4725-568-A are only suffix-11 board.
Part No.A-4725-568-A
Printed of Silk:1-681-001-11
Printed of Silk:1-681-001-12
Ref. No. Part No.DescriptionRef. No. Part No.Description
R1351-216-837-11 METAL CHIP22K5%1/10W
R1361-216-837-11 METAL CHIP22K5%1/10W
R1391-216-846-11 METAL CHIP120K 5%1/10W
R1411-216-840-11 METAL CHIP39K5%1/10W
R1451-216-830-11 METAL CHIP5.6K5%1/10W
Part No.Description
8-848-483-21OPTICAL PICK-UP (KSS-213C/C2RP)
Part No.A-4725-568-B
Printed of Silk:1-681-001-12
R1351-216-833-11 METAL CHIP10K5%1/10W
R1361-216-833-11 METAL CHIP10K5%1/10W
R1391-216-848-11 METAL CHIP180K 5%1/10W
R1411-216-838-11 METAL CHIP27K5%1/10W
R1451-218-344-11 METAL CHIP7.5K5%1/10W
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
C
Q
B
E
These are omitted.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
Note:
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part
number specified.
• A : B+ Line.
• Voltages are dc with respect to ground under no-signal
conditions.
no mark : CD PLAY
• Voltages are taken with a V OM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Signal path.
J: CD PLAY (ANALOG OUT)
c : CD PLAY (DIGITAL OUT)
4
W or less unless otherwise
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
CDP-XE270/XE370
22
Page 37
CDP-XE270/XE370
2-1. PRINTED WIRING BOARD – BD Board –
1
2345678910111213
A
BD BOARD
(COMPONENT SIDE)
B
C
:Uses unleaded solder.
C151
C150
M101
(SPINDLE)
BD BOARD
TP (DGND)
S101
(LIMIT)
RB102
(CONDUCTOR SIDE)
M
M102
(SLED)
C152
C153
C154
R152
R151
C158
C133
R155
TP (VC)
R153
M
IC150
R126
C126
R125
RB101
C183
C173
R129
R181
R182
R172
R171
R191
C184
R183
C174
R173
1-681-001-
CN101
A
MAIN BOARD
CN651
(Refer to page 16
on service manual)
12
(12)
D
E
C171
C191
F
FB191
C199
R192
C112
R110
C181
C182
C172
C192
X191
R184
R174
C193
R112
C110
R111
C194
C111
R143
C102
C101
C131
C103
C132
R103
C130
R101
C140
R134
R102
R140
R142
E
R136
R146
Q132
R149
R137
1-681-001-
R138
E
C138
Q131
C134
C137
12
(12)
R135
CN102
R139
C139
C120
R120
IC101
C123
R123
R121
C125
R122
TP (RFAC)
R127
TP (FE1)
TP (TE1)
TP (RFDC)
C122
C121
R141
C145
R145
C136
R144
IC131
C124
G
OPTICAL PICK-UP
BLOCK
(PXR-104X OR KSS-213C)
CDP-XE270/XE370
33
Page 38
CDP-XE270/XE370
2-2. SCHEMATIC DIAGRAM – BD Board –
120k (FOR PXR-104X)
180k (FOR KSS-213C)
∗
R135,136
10k (FOR KSS-213C)
22k (FOR PXR-104X)
TP
(RFDC)
∗
R141
27k (FOR KSS-213C)
39k (FOR PXR-104X)
∗
∗
∗
R145
5.6k (FOR PXR-104X)
7.5k (FOR KSS-213C)
∗
∗
(Refer to
page 17 on
service manual)
CDP-XE270/XE370
44
Page 39
CDP-XE270/XE370
3.ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
R1011-216-835-11 METAL CHIP15K5%1/10W
R1021-216-845-11 METAL CHIP100K5%1/10W
R1031-216-835-11 METAL CHIP15K5%1/10W
R1101-216-821-11 METAL CHIP1K5%1/10W
R1111-216-809-11 METAL CHIP1005%1/10W
R1121-216-833-11 METAL CHIP10K5%1/10W
R1201-216-839-11 METAL CHIP33K5%1/10W
R1211-216-833-11 METAL CHIP10K5%1/10W
R1221-216-845-11 METAL CHIP100K5%1/10W
R1231-216-857-11 METAL CHIP1M5%1/10W
R1251-216-827-11 METAL CHIP3.3K5%1/10W
R1261-216-833-11 METAL CHIP10K5%1/10W
R1271-216-821-11 METAL CHIP1K5%1/10W
R1291-216-815-11 METAL CHIP3305%1/10W
R1341-216-853-11 METAL CHIP470K5%1/10W
R1351-216-833-11 METAL CHIP10K5%1/10W
R1351-216-837-11 METAL CHIP22K5%1/10W
R1361-216-833-11 METAL CHIP10K5%1/10W
When indicating parts by reference
number, please include the board.
R1381-216-798-11 METAL CHIP125%1/10W
R1391-216-846-11 METAL CHIP120K5%1/10W
R1391-216-848-11 METAL CHIP180K5%1/10W
R1401-216-854-11 METAL CHIP560K5%1/10W
R1411-216-838-11 METAL CHIP27K5%1/10W
(for PXR-104X)
(for PXR-104X)
(for KSS-213C)
(for KSS-213C)
R1411-216-840-11 METAL CHIP39K5%1/10W
R1421-216-841-11 METAL CHIP47K5%1/10W
R1431-216-855-11 METAL CHIP680K5%1/10W
R1441-216-846-11 METAL CHIP120K5%1/10W
R1451-216-830-11 METAL CHIP5.6K5%1/10W
R1451-218-344-11 METAL CHIP7.5K5%1/10W
R1461-216-845-11 METAL CHIP100K5%1/10W
R1491-216-821-11 METAL CHIP1K5%1/10W
R1511-216-845-11 METAL CHIP100K5%1/10W
R1521-216-833-11 METAL CHIP10K5%1/10W
R1531-216-864-11 SHORT CHIP0
R1551-216-837-11 METAL CHIP22K5%1/10W
R1711-218-720-11 METAL CHIP15K0.5%1/10W
R1721-218-720-11 METAL CHIP15K0.5%1/10W
R1731-218-720-11 METAL CHIP15K0.5%1/10W
R1741-216-809-11 METAL CHIP1005%1/10W
R1811-218-720-11 METAL CHIP15K0.5%1/10W
R1821-218-720-11 METAL CHIP15K0.5%1/10W
R1831-218-720-11 METAL CHIP15K0.5%1/10W
R1841-216-809-11 METAL CHIP1005%1/10W
R1911-216-817-11 METAL CHIP4705%1/10W
R1921-216-797-11 METAL CHIP105%1/10W
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver.DateDescription of Revision
1.02001.03New
1.12001.07Addition of Electrical Checks
1.22002.04Addition of Silver type (CDP-XE370 AEP model)(ENG-02006)
1.32006.02Addition of Silver (Hair-line Finish) type (AEP, UK models)(SPM-06013)
1.42006.07Change of OPTICAL PICK-UP (PXR-104XtKSS-213C), and
Change of BD board (Suffix-12) according to it (Supplement-1)
(ECN-ECB51248)
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