Sony CDCR-104 Service manual

CDC-R104/X104/X144
SERVICE MANUAL
Ver 1.0 2004. 01
Photo: CDC-X104
• The tuner and CD sections have no adjustments.
AUDIO POWER SPECIFICATIONS (US MODEL)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION 22 watts per channel minimum continuous average power into 4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more than 5% total harmonic distortion.
SPECIFICATIONS
Tuner section
FM
Tuning range US, Canadian Model:
Antenna terminal External antenna connector Intermediate frequency 10.7 MHz/450 kHz Usable sensitivity 9 dBf Selectivity 75 dB at 400 kHz Signal-to-noise ratio 67 dB (stereo),
Harmonic distortion at 1 kHz
Separation 35 dB at 1 kHz Frequency response 30 – 15,000 Hz
AM (US, Canadian Model)
Tuning range 530 – 1,710 kHz Antenna terminal External antenna connector Intermediate frequency 10.7 MHz/450 kHz Sensitivity 30 µV
MW/LW (AEP, UK Model)
Tuning range MW: 531 – 1,602 kHz
Antenna terminal External antenna connector Intermediate frequency 10.7 MHz/450 kHz Sensitivity MW: 30 µV
CD player section
Signal-to-noise ratio US, Canadian Model: 110 dB
Frequency response 10 – 20,000 Hz Wow and flutter Below measurable limit
87.5 – 107.9 MHz AEP, UK Model:
87.5 – 108 MHz
69 dB (mono)
0.5% (stereo),
0.3% (mono)
LW: 153 – 279 kHz
LW: 40 µV
AEP, UK Model: 120 dB
FM/MW/LW COMPACT DISC PLAYER
US Model
Canadian Model
AEP Model
UK Model
CDC-R104/X104
Model Name Using Similar Mechanism CDX-R3000/R3000T CD Drive Mechanism Type MG-611XC-186//Q Optical Pick-up Name KSS1000E
Power amplifier section
Outputs Speaker outputs
(sure seal connectors) Speaker impedance 4 – 8 ohms Maximum power output 45 W × 4 (at 4 ohms)
General
Outputs Audio outputs terminal (rear/sub switchable)
Power antenna relay control terminal
Power amplifier control terminal Inputs Telephone ATT control terminal (AEP, UK Model)
Antenna input terminal Tone controls Low: ±10 dB at 60 Hz (HIP-HOP)
Mid: ±10 dB at 1 kHz (HIP-HOP)
High: ±10 dB at 10 kHz (HIP-HOP) Power requirements 12 V DC car battery (negative ground) Dimensions Approx. 178 × 50 × 176 mm
(7 1/8 × 2 × 7 in.) (w/h/d) Mounting dimensions Approx. 182 × 53 × 161 mm
(7 1/4 × 2 1/8 × 6 3/8 in.) (w/h/d) Mass Approx. 1.2 kg (2 lb. 10 oz.) Supplied accessories Parts for installation and connections (1 set)
Front panel case (1)
Design and specifications are subject to change without notice.
FM/AM COMPACT DISC PLAYER
US, Canadian model
AEP, UK model
9-877-520-01
2004A04-1 © 2004. 01
Sony Corporation
e Vehicle Company Published by Sony Engineering Corporation
1
CDC-R104/X104/X144
SERVICE NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission, ob­serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2502-063-1) CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
• US, Canadian model
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
• AEP, UK model
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
This compact disc player is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the exterior.
This label is located on the bottom of the chassis.
If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick-up block.
SAFETY-RELATED COMPONENT WARNING!!
optical pick-up
semi-fixed resistor
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
CDC-R104/X104/X144
D
Notes on CD-R/CD-RW discs
You can play CD-Rs (recordable CDs)/CD-RWs (re writable CDs) designed for audio use on this unit. Look for these marks to distinguish CD-Rs/CD-RWs for audio use.
These marks denote that a disc is not for audio use.
Some CD-Rs/CD-RWs (depending on the equipment used for its recording or the condition of the disc) may not play on this unit.
You cannot play a CD-R/CD-RW that is not finalized∗.
A process necessary for a recorded CD-R/CD-RW disc to be
played on the audio CD player.
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable) as shown below.
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
• Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
• Connect the MAIN board (CN301) and the SERVO board (CN1) with the extension cable (Part No. J-2502-076-1).
MAIN BOARD CN301
J-2502-076-1
SERVO BOAR CN1
3
CDC-R104/X104/X144

TABLE OF CONTENTS

1. GENERAL
Location of Controls................................................................ 5
Connections (US, Canadian Model)........................................ 6
Connections (AEP, UK Model) ............................................... 7
2. DISASSEMBLY
2-1. Sub Panel Assy.................................................................... 9
2-2. CD Mechanism Block ......................................................... 9
2-3. Main Board ....................................................................... 10
2-4. Chassis (T) Sub Assy ........................................................10
2-5. Roller Arm Assy ................................................................ 11
2-6. Chassis (OP) Assy............................................................. 11
2-7. Optical Pick-up ................................................................. 12
2-8. SL Motor Assy (M902) ..................................................... 12
2-9. LE Motor Assy (M903)..................................................... 13
2-10. Servo Board....................................................................... 13
3. DIAGRAMS
3-1. IC Pin Descriptions ...........................................................14
3-2. Block Diagram –CD Section–........................................... 18
3-3. Block Diagram –Main Section–........................................ 19
3-4. Block Diagram –Display Section–.................................... 20
3-5. Circuit Boards Location .................................................... 20
3-6. Note for Printed Wiring Boards and
Schematic Diagrams .......................................................... 21
3-7. Waveforms......................................................................... 21
3-8. Printed Wiring Boards –CD Mechanism Section–............ 22
3-9. Schematic Diagram –CD Mechanism Section– ................ 23
3-10. Schematic Diagram –Main Section (1/2)– ........................ 24
3-11. Schematic Diagram –Main Section (2/2)– ........................ 25
3-12. Printed Wiring Board –Main Section– .............................. 26
3-13. Printed Wiring Boards –Display Section– ........................ 27
3-14. Schematic Diagram –Display Section–............................. 28
3-15. IC Block Diagrams............................................................ 29
4. EXPLODED VIEWS
4-1. Main Section ..................................................................... 32
4-2. Front Panel Section ...........................................................33
4-3. CD Mechanism Section (1) ............................................... 34
4-4. CD Mechanism Section (2) ............................................... 35
4-5. CD Mechanism Section (3) ............................................... 36
4-6. CD Mechanism Section (4) ............................................... 37
5. ELECTRICAL PARTS LIST ........................................38
4
LOCATION OF CONTROLS
SECTION 1

GENERAL

CDC-R104/X104/X144
This section is extracted from instruction manual.
5
CDC-R104/X104/X144
CONNECTIONS (US, Canadian Model)
6
CONNECTIONS (AEP, UK Model)
CDC-R104/X104/X144
7
CDC-R104/X104/X144
SECTION 2

DISASSEMBLY

Note : This set can be disassemble according to the following sequence.
SET
2-1. SUB PANEL ASSY
(Page 9)
2-2. CD MECHANISM BLOCK
(Page 9)
2-3. MAIN BOARD
(Page 10)
2-7. OPTICAL PICK-UP
(Page 12)
2-4. CHASSIS (T) SUB ASSY
(Page 10)
2-5. ROLLER ARM ASSY
(Page 11)
2-6. CHASSIS (OP) ASSY
(Page 11)
2-8. SL MOTOR ASSY (M902)
(Page 12)
2-10. SERVO BOARD
(Page 13)
2-9. LE MOTOR ASSY (M903)
(Page 13)
8
Note : Follow the disassembly procedure in the numerical order given.
s
)
2-1. SUB PANEL ASSY
3
two claws
CDC-R104/X104/X144
1
two
screws
(+PTT 2.6
x
6)
2-2. CD MECHANISM BLOCK
5

CD mechanism block

4

sub panel assy

7
bracket (CD)
6
two
screws
(+PTT 2.6
2
two claw
x
4)
2
screw
(+PTT 2.6
x
6)
3
4
CN301
1
screw
(+PTT 2.6
x
6
9
CDC-R104/X104/X144
)
2-3. MAIN BOARD
1
three ground point screws
(+PTT 2.6
3

MAIN board

x
6)
2
two
screws
x
(+PTT 2.6
insulating sheet
6
2-4. CHASSIS (T) SUB ASSY
2
two
screws
(+P 1.7
5
SENSOR board
3
claw
x
2.2)
4
claw
1
two
screws
x
(+P 1.7
6
2.2)

chassis (T) sub assy

10
2-5. ROLLER ARM ASSY
4
worm wheel (RA)
1
spring (RAL)
3
washer (0.8-2.5)
5

roller arm assy

2
spring (RAR)
CDC-R104/X104/X144
2-6. CHASSIS (OP) ASSY
0
coil spring (damper)
4
washer
5
gear (LE1)
lever (D)
6
8
qa

chassis (OP) assy

1
CN2
9
two coil springs (damper)
7
slider (R)
2
Remove the six solderings.
3
tension coil spring (KF)
11
CDC-R104/X104/X144
)
2-7. OPTICAL PICK-UP
5
claw
2
chucking arm sub assy
1
tension coil spring (CHKG
7

optical pick-up

2-8. SL MOTOR ASSY (M902)
6
main shaft
4
rack (SL)
3
screw
(+B 1.4
x
5)
12
2

SL motor assy (M902)

1
screw
(+P 1.4
x
1.8)
2-9. LE MOTOR ASSY (M903)
qf
two toothed lock
(+M 1.4
bracket (LEM)
qs
(+M 1.7
screw
x
)
screws
2.5)
6
screw
(+P 1.7
x
qd
2.2)
qa
screw
(+M 1.7
qg
(M903)
0
woam (LEB) assy
x
2.5)
LE motor assy
7
leaf spring (LE)
8
screw
(+M 1.7
9
bearing (LEB)
2
washer
gear (LE1)
3
lever (D)
x
CDC-R104/X104/X144
2.5)
4
5
slider (R)
2-10. SERVO BOARD
1
Remove the eight solderings.
1
Remove the soldering.
6

SERVO board

2
Remove the three solderings.
4
toothed lock
(M 1.7)
5
screw
claw
3
CN2
13
CDC-R104/X104/X144
SECTION 3

DIAGRAMS

3-1. IC PIN DESCRIPTIONS
• IC1 µPD63712GC-8EU-A (RF AMP, DIGITAL SERVO, DIGITAL SIGNAL PROCESSOR) (SERVO BOARD)
Pin No. Pin Name I/O Pin Description
1LDOLaser diode ON/OFF control signal output (L: laser OFF, H: laser ON) 2PDIDimmer monitor input from optical pick-up laser diode. 3PNINot used. (Fixed at L in this set) 4AVDD Analog power supply pin (+3.3 V) 5 DGND Ground 6 RFOK O RFOK signal output to system control IC. 7 INTQ O CD text pack synchronization signal output to system control IC. 8 RST I CD reset signal input from system control IC.
9A0I
10 STB I Data strobe signal input from system control IC. 11 SCK I Serial clock input from system control IC. 12 SO O Serial data output to system control IC. 13 SI I Serial data input from system control IC. 14 DVDD Power supply pin (+3.3 V) 15 DAVDD D/A converter power supply (+) pin (+3.3 V) 16 ROUT O Analog audio signal output (R-ch) 17 DAGND Ground 18 REGC Capacitor connection pin for SCF regulator. 19 DAGND Ground 20 LOUT O Analog audio signal output (L-ch) 21 DAVDD D/A converter power supply (+) pin (+3.3 V) 22 XVDD Power supply pin (+3.3 V) 23 XTAL O Main system clock output (16.9344 MHz) 24 XTAL I Main system clock input (16.9344 MHz) 25 XGND Ground 26 DVDD Power supply pin (+3.3 V) 27 C1D1/FZD O Not used. (Open) 28 C1D2/TZD O Not used. (Open) 29 C2D1/RMUTE O CD R-ch data zero detection signal output 30 C2D2/LMUTE O CD L-ch data zero detection signal output 31 C2D3/SHOCK/SBSY O Not used. (Open) 32 LOCK/FR O Not used. (Open) 33 WFCK/MIRR O Not used. (Open) 34 RFCK/HOLD O Not used. (Open) 35 PLCK O Not used. (Open) 36 C16M O Not used. (Open) 37 DGND Ground 38 TX O Not used. (Open) 39 EMPH/RAMOVER O Not used. (Open) 40 FLAG O Not used. (Open) 41 DVDD Power supply pin (+3.3 V) 42 LIMIT I Not used. (Fixed at L in this set)
43 XTALEN I 44 DGND Ground
45 DIN I Not used. (Connect to DOUT in this set) 46 DOUT O Not used. (Connect to DIN in this set) 47 SCKIN I Not used. (Connect to SCKO in this set) 48 SCKO O Not used. (Connect to SCKIN in this set) 49 LRCKIN I Not used. (Connect to LRCK in this set)
Command/parameter discrimination signal input from system control IC. (L: command transmission, H: parameter transmission)
Oscillation circuit ON/OFF control signal input (L: ON, H: OFF) (Fixed at L in this set)
14
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