SIM7500V_User Manual_V1.00
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Compliance Information:
This device complies with part 15B FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference (2) this device must accept any interference,
including interference that may cause undesired operation.” WARNING:Changes or modifications
to this unit not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment.
FCC Caution:
(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in
accordance with provided instructions and the antenna(s) used for this transmitter must be installed
to provide a separation distance of at least 20 cm from all persons and must not be collocated or
operating in conjunction with any other antenna or transmitter. End-users and installers must be
provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance.
(2)Any changes or modifications not expressly approved by the grantee of this device could void the
user's authority to operate the equipment.
(3)This Transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
(4)Changes or modifications to this unit not expressly approved by the party responsible for
compliance could void the user authority to operate the equipment.
(5) the modules FCC ID is not visible when installed in the host, or (6) if the host is marketed so that
end users do not have straight forward commonly used methods for access to remove the module so
that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed
module: Contains Transmitter Module FCC ID: UDV-201706 or Contains FCC ID: UDV-201706.
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Document Title
Version
Date
Status
Document Control ID
SIM7500V_User Manual
V1.00
2017-06-30
Released
SIM7500V_User Manual_V1.00
General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.
Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
Copyright © SIMCom Wireless Solutions Co., Ltd. 2017
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Contents
Contents ............................................................................................................................................. 4
Table Index ........................................................................................................................................ 6
Figure Index ...................................................................................................................................... 7
Revision History ................................................................................................................................ 8
1 Introduction ................................................................................................................................ 9
1.1 Product Outline ..................................................................................................................... 9
1.2 Hardware Interface Overview ............................................................................................... 9
1.3 Hardware Block Diagram...................................................................................................... 9
1.4 Functional Overview ........................................................................................................... 10
2 Package Information ............................................................................................................... 12
2.1 Pin Assignment Overview ................................................................................................... 12
2.2 Pin Description .................................................................................................................... 14
2.3 Mechanical Information ...................................................................................................... 16
2.4 Footprint Recommendation ................................................................................................. 17
3 Interface Application ............................................................................................................... 18
3.1 Power Supply ...................................................................................................................... 18
3.1.1 Power supply Design Guide ......................................................................................... 18
3.1.2 Recommended Power Supply Circuit .......................................................................... 19
3.1.3 Voltage Monitor ............................................................................................................ 20
3.2 Power on/Power of
f/Reset Function .................................................................................... 20
3.2.1 Power on ....................................................................................................................... 20
3.2.2 Power off ...................................................................................................................... 21
3.2.3 Reset Function .............................................................................................................. 22
3.3 UART Interface ................................................................................................................... 23
3.3.1 UART Design Guide .................................................................................................... 23
3.3.2 RI and DTR Behavior ................................................................................................... 25
3.4 USB Interface ...................................................................................................................... 25
3.4.1 USB Application Guide ................................................................................................ 26
3.5 USIM Interface.................................................................................................................... 26
3.5.1 USIM Application Guide .............................................................................................. 27
3.5.2 SIM Card Design Guide ............................................................................................... 27
3.5.3 Recommended USIM Card Holder .............................................................................. 28
3.6 PCM Interface ..................................................................................................................... 29
3.6.1 PCM Timing ................................................................................................................. 29
3.6.2 PCM Application Guide ............................................................................................... 30
3.7 I2C Interface ....................................................................................................................... 31
3.7.1 I2C Design Guide ......................................................................................................... 31
us .................................................................................................................... 32
3.8 Network Sta
t
3.9 Operating Status Indication ................................................................................................. 32
3.10 Pin Multiplex Function .................................................................................................... 32
3.11 Other interface ................................................................................................................. 33
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3.11.1 Sink Current Source .................................................................................................. 33
3.11.2 ADC .......................................................................................................................... 3 4
4 RF Specifications ...................................................................................................................... 35
4.1 LTE RF Specifications ........................................................................................................ 3 5
4.2 LTE Antenna Design Guide ................................................................................................ 35
4.3 Dipole Antenna PCB Layout Requirements ........................................................................ 37
4.4 Dipole Antenna Reference Design PCB .............................................................................. 37
5 Electrical Specifications ........................................................................................................... 40
5.1 Absolute Maximum Ratings................................................................................................ 40
5.2 Operating Conditions .......................................................................................................... 40
5.3 Operating Mode .................................................................................................................. 41
5.3.1 Operating Mode Definition .......................................................................................... 41
5.3.2 Sleep Mode ................................................................................................................... 4 2
5.3.3 Minimum Functionality Mode and Flight Mode .......................................................... 42
5.4 Current Consumption .......................................................................................................... 4 2
5.5 ESD Notes ........................................................................................................................... 43
6 SMT Production Guide ........................................................................................................... 44
6.1 Top and Bottom View of Module ........................................................................................ 44
6.2 Labe
l Inform
ation ................................................................................................................ 44
6.3 Typical SMT Reflow Profile ............................................................................................... 45
6.4 Moisture Sensitivity Level (MSL) ...................................................................................... 45
6.5 Stencil Foil Design Recommendation ................................................................................. 46
7 Packaging .................................................................................................................................. 47
Appendix .......................................................................................................................................... 49
A. Reference Design ...................................................................................................................... 49
B. Coding Schemes and Maximum Net Data Rates over Air Interface......................................... 50
C. Related Documents ................................................................................................................... 52
D. Terms and Abbreviations .......................................................................................................... 54
E. Safety Caution ........................................................................................................................... 56
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Table Index
Table 1: SIM7500 series frequency bands ........................................................................................................... 9
Table 2: General features ................................................................................................................................... 10
Table 3: Pin Definitions ..................................................................................................................................... 13
Table 4: IO parameters definition....................................................................................................................... 14
Table 5: Pin description...................................................................................................................................... 14
Table 6: VBAT Pins electronic characteristic ..................................................................................................... 18
Table 7: Recommended zener diode list ............................................................................................................. 19
Table 8: Power on timing and electronic characteristic ...................................................................................... 21
Table 9: Power off timing and Electronic Characteristic .................................................................................... 22
Table 10: RESET pin electronic characteristic ................................................................................................... 23
Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V) .................................................. 26
Table 12: USIM Electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 27
Table 13: Amphenol USIM Socket Pin Description ........................................................................................... 28
Table 14: PCM Format ....................................................................................................................................... 29
Table 15: PCM Timing Parameters .................................................................................................................... 30
Table 16: NETLIGHT pin status ........................................................................................................................ 32
Table 17: Pin definition of the STATUS ............................................................................................................ 32
Table 18: Pin multiplex function list .................................................................................................................. 33
Table 19: Sink current electronic characteristic ................................................................................................. 33
Table 20: ADC Electronic Characteristics .......................................................................................................... 34
Table 21: Conducted transmission power .......................................................................................................... 35
Table 22: Operating frequencies ........................................................................................................................ 35
Table 23: Reference sensitivity (QPSK) ............................................................................................................ 35
Table 24: Trace Loss .......................................................................................................................................... 35
Table 25: Recommended TVS ........................................................................................................................... 37
Table 26: Absolute maximum ratings ................................................................................................................. 40
Table 27: Recommended operating ratings ........................................................................................................ 40
Table 28: 1.8V Digital I/O characteristics* ........................................................................................................ 40
Table 29: Operating temperature ........................................................................................................................ 41
Table 30: Operating mode Definitions ............................................................................................................... 41
Table 31: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 43
Table 32: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ............................. 43
Table 35: The Description of Label Information ................................................................................................ 45
Table 36: Moisture Sensitivity Level and Floor Life ......................................................................................... 46
Table 37: Tray size ............................................................................................................................................. 47
Table 38: Small Carton size ............................................................................................................................... 48
Table 39: Big carton size .................................................................................................................................... 48
Table 40: Coding schemes and maximum net data rates over air interface ........................................................ 50
Table 41: Related documents ............................................................................................................................. 52
Table 42: Terms and Abbreviations .................................................................................................................... 54
Table 43: Safety caution ..................................................................................................................................... 56
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Figure Index
Figure 1: SIM7500 series Block Diagram .......................................................................................................... 10
Figure 2: Pin assignment overview .................................................................................................................... 12
Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 16
Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 17
Figure 5: Power supply application circuit......................................................................................................... 18
Figure 6: Linear regulator reference circuit ....................................................................................................... 19
Figure 7: Switching modepower supply reference circuit .................................................................................. 19
Figure 8: ReferencePower on/offCircuit ............................................................................................................ 20
Figure 9: Power on timing sequence .................................................................................................................. 21
Figure 10: Power off timing sequence ............................................................................................................... 22
Figure 11: Reference reset circuit ...................................................................................................................... 23
Figure 12: UART full modem ............................................................................................................................ 24
Figure 13: UART null Modem ........................................................................................................................... 24
Figure 14: Reference circuit of level shift .......................................................................................................... 24
Figure 15: RI behaviour（SMS and URC report） ........................................................................................... 25
Figure 16: RI behaviour（voice call） .............................................................................................................. 25
Figure 17: USB reference circuit ....................................................................................................................... 26
Figure 18: USIM interface reference circuit ...................................................................................................... 27
Figure 19: Amphenol SIM card socket .............................................................................................................. 28
Figure 20: PCM_SYNC timing .......................................................................................................................... 29
Figure 21: EXT codec to module timing ............................................................................................................ 29
Figure 22: Module to EXT codec timing ........................................................................................................... 30
Figure 23: Audio codec reference circuit ........................................................................................................... 31
Figure 24: I2C reference circuit ......................................................................................................................... 31
Figure 25: NETLIGHT reference circuit ............................................................................................................ 32
Figure 26: ISINK reference circuit .................................................................................................................... 33
Figure 27: Antenna matching circuit (MAIN_ANT) .......................................................................................... 36
Figure 28: Antenna matching circuit (DIV_ANT) ............................................................................................. 36
Figure 31: Top and bottom view of Module ....................................................................................................... 44
Figure 32: Label Information ............................................................................................................................. 44
Figure 33: The ramp-soak-spike Reflow Profile of Module............................................................................... 45
Figure 34: Packaging introduce ......................................................................................................................... 47
Figure 35: Module tray drawing introduce......................................................................................................... 47
Figure 36: Small carton drawing introduce ........................................................................................................ 48
Figure 37: Big carton drawing introduce ........................................................................................................... 48
Figure 38: Reference design .............................................................................................................................. 49
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Revision History
Data Version Description of change Author
2017-06-30 V1.00
new
Shengwu.sun
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1 Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical
characteristics and testing results of the SIMCom SIM7500 series. With the help of this document
and other software application notes/user guides, users can understand and use modules to design
and develop applications quickly.
1.1 Product Outline
The SIM7500V support many air-interface standards, refer to the following table.
Table 1: SIM7500 series frequency bands
Standard Frequency SIM7500V
LTE-FDD B4
LTE
LTE-FDD B13
With a small physical dimension of 24*27*2.75 mm and with the functions integrated, the Module
can meet almost any space requirement in users’ applications, such as smart phones, PDA’s,
industrial handhelds, machine-to-machine, vehicle applications, etc.
1.2 Hardware Interface Overview
The interfaces that are described in detail in the next chapters include:
● Power Supply
● USB Interface
● UART Interface
● USIM Interface
● GPIO
● ADC
● Power Output
● Current Sink Source
● PCM Interface
● I2C Interface
1.3 Hardware Block Diagram
The block diagram of the Module is shown in the figure below.
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GNSS Antenna
Main Antenna
GSM/WCDMA
/LTE
RF FEM
AUX Antenna
WCDMA
/LTE
RF FEM
GSM/
WCDMA/LTE PA
VBAT
DDR
NAND
GNSS RF
Qualcomm
Chip
RF
Transceiver
SYSTEM POWER
XO
19.2MHz
Flash
Baseband
Power
Management
Figure 1: SIM7500 series Block Diagram
SMT Interface
USIM
UART
I2C
USB
GPIOs
ADC
LDO
Sink Current Source
Power On
Reset
VBAT
PCM
Interrupt
Status LED
1.4 Functional Overview
Table 2: General features
Feature Implementation
Power supply Single supply voltage 3.4～4.2V
Power saving
Radio frequency bands Please refer to the table 1
Transmitting power LTE: Class 3 (0.25W)
Data Transmission
Throughout
Antenna
SMS
USIM interface Support identity card: 1.8V/ 3V
USIM application toolkit
Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
Current in sleep mode : <5mA
LTE Category 1: 10 Mbps (DL)
LTE Category 1: 5 Mbps (UL)
LTE main antenna
LTE auxiliary antenna
MT, MO, CB, Text and PDU mode
SMS storage: USIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
Support SAT class 3, GSM 11.14 Release 98
Support USAT
Support PCM interface
Audio feature
Only support PCM master mode and short frame sync, 16-bit linear data
formats
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A full modem serial port by default
Baud rate: 300bps to 4Mbps(default:115200bps)
UART interface
Auto-bauding baud rate: 9600,19200,38400,57600,115200bps
Can be used as the AT commands or data stream channel.
Support RTS/CTS hardware handshake
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
USB USB 2.0 specification-compliant as a peripheral
Firmware upgrade USB
Physical characteristics
Firmware upgrade over USB interface
USB 2.0 specification-compliant as a peripheral
Weigh t: 4.0 g
Size:24*27*2.75mm
Normal operation temperature: -30°C to +80°C
Temperature range
Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from
the 3GPP specifications if the temperature is outside the normal operating temperature range
and still within the extreme operating temperature range.
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2 Package Information
2.1 Pin Assignment Overview
All functions of the SIM7500 series will be provided through 56 pads that will be connected to the
customers’ platform. The following Figure is a high-level view of the pin assignment of the
SIM7500 series.
DBG_TXD
GND
56
55
GNSS_ANT
GND
54
GND
53
NETLIGHT
51
52
50
STATUS
GPIO_49
48
49
GPIO_37
GND
47
GND
46
45
MAIN_ANT
GND
44
16
GND
18
17
PCM_CLK
I2S_MCLK
19
PCM_SYNC
20
PCM_IN
22
21
GND
PCM_OUT
24
23
L11_1V8
RESET
25
ADC
26
GPIO_1
27
ISINK
28
GND
Figure 2: Pin assignment overview
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Table 3: Pin Definitions
Pin No. Pin Name Pin No. Pin Name
1 GND 2 DIV_ANT
3 GND 4 SCL
5 SDA 6 GND
7 USB_DM 8 USB_DP
9 VBUS 10 USIM_DATA
11 USIM_CLK 12 USIM_DET
13 USIM_RST 14 USIM_VDD
15 GND 16 GND
17 MCLK 18 PCM_CLK
19 PCM_SYNC 20 PCM_IN
21 PCM_OUT 22 GND
23 L11_1V8 24 RESET
25 ADC 26 GPIO_1
27 ISINK 28 GND
29 GND 30 PWRKEY
31 GND 32 GND
33 VBAT 34 VBAT
35 GND 36 RTS
37 DCD 38 TXD
39 RXD 40 DTR
41 CTS 42 RI
43 GND 44 GND
45 MAIN_ANT 46 GND
47 GND 48* GPIO_37
49 GPIO_49 50 STATUS
51 DBG_TXD 52 NETLIGHT
53 GND 54 GND
55 GNSS_ANT 56 GND
*Note: SIM7500V could not support GNSS Function.
Before the normal power up, pin48 cannot be pulled up.
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2.2 Pin Description
Table 4: IO parameters definition
Pin type Description
PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down
Table 5: Pin description
Pin name Pin No.
Default
status
Power Supply
VBAT
33,34 PI
L11_1V8 23 PO
1, 3, 6,
15,16,22
,28,29,3
GND
1,32,35,
Ground
43,44,46
,47,53,5
4,56
System Control
PWRKEY 30 DI,PU
RESET 24 DI, PU
USIM interface
Description Comment
Power supply, voltage range: 3.4～
4.2V.
1.8V output with Max. 50Ma
current output for external circuit,
If unused, keep it
open.
such as level shift circuit.
System power on/off control input,
active low.
Default 0.8V
RESET has been
System reset control input, active
low.
pulled up to 1.8V
via a resistor
internally.
USIM Card data I/O, which has
USIM_DATA 10 I/O,PU
been pulled up via a 100KR resistor
to USIM_VDD internally.
USIM_RST 13 DO USIM Reset
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USIM_CLK 11 DO USIM clock
Power output for USIM card, its
USIM_VDD 14 PO
output Voltage depends on USIM
card type automatically. Its output
current is up to 50Ma.
USB
VBUS 9 DI,PD
USB_DM 7 I/O
USB_DP
8 I/O
Valid USB detection input with
3.6～5.85V detection voltage
Negative line of the differential,
bi-directional USB signal.
Positiveline of the differential,
bi-directional USB signal.
UART interface
RTS 36 DOH Request to send
CTS 41 DI,PU Clear to Send
RXD 39 DI,PU Receive Data
RI 42 DOH Ring Indicator
DCD 37 DOH Carrier detects
TXD 38 DOH Transmit Data
DTR 40 DI,PU DTE get ready
I2C interface
SCL 4 DO I2C clock output
SDA 5 I/O I2C data input/output
PCM interface
If unused, keep
them open.
If unused, keep
them open.
PCM_OUT 21 DO PCM data output.
PCM_IN 20 DI PCM data input.
PCM_SYNC 19 DO PCM data frame sync signal.
PCM_CLK 18 DO PCM data bit clock.
MCLK 17 DO Audio Master clock
GPIO
NETLIGHT 52 DO
LED control output as network
status indication.
Operating status output.
STATUS 50 DO
High level: Power on and firmware
ready
Low level: Power off
GPIO_1 26 IO GPIO
GPIO_49 49 IO GPIO
Default: GPIO
Optional: USIM card detecting
USIM_DET 12 IO
input.
H: USIM is removed
L: USIM is inserted
GPIO_37 48 IO GPIO
If unused, please
keep them open.
If unused, please
keep them open.
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RF interface
MAIN _ANT 45 AIO MAIN antenna soldering pad
DIV_ANT 2 AI Auxiliary antenna soldering pad
NC 55 AI
Other interface
ISINK 27 AI Ground-referenced current sink.
DGB_TXD 51 DO Use for debug
ADC 25 AI Analog-digital converter input
2.3 Mechanical Information
The following figure shows the package outline drawing of Module.
If unused, please
keep them open.
Figure 3: Dimensions (Unit: mm)
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2.4 Footprint Recommendation
Figure 4: Footprint recommendation (Unit: mm)
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3 Interface Application
3.1 Power Supply
On VBAT pads, a ripple current up to 2A typically, may cause voltage drop. Therefore, the power
supply for these pads must be able to provide sufficient current up to more than 2A in order to
avoid the voltage drop of more than 300mV.
Table 6: VBAT Pins electronic characteristic
Symbol Description Min. Typ. Max. Unit
VBAT Module power voltage 3.4 3.8 4.2 V
I
VBAT(peak)
I
VBAT(average)
I
VBAT(sleep)
I
VBAT(power-off)
Module power peak current in normal mode. 1.0 - 2 A
Module power average current in normal mode
Please refer to the table 34
Power supply current in sleep mode
Module power current in power off mode. - - 20 uA
3.1.1 Power supply Design Guide
Make sure that the voltage on the VBAT pins will never drop below 3.4V.
Note: If the power supply for BAT pins can support up to 2A, using a total of more than 220uF
capacitors is recommended, or else users must use a total of 1000uF capacitors, in order to avoid
the voltage drop of more than 300mV.
Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band
can be used for EMC.
These capacitors should be put as close as possible to VBAT pads. Also, user should keep VBAT
trace on the circuit board wider than 2 mm to minimize PCB trace impedance. The following figure
shows the recommended circuit.
Figure 5: Power supply application circuit
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In addition, in order to guard over voltage protection, it is suggested to use a zener diode with 5.1V
reverse zener voltage and more than 500mW power dissipation.
Table 7: Recommended zener diode list
No. Manufacturer Part Number power dissipation Package
1 On semi MMSZ5231BT1G 500mW SOD123
2 Prisemi PZ3D4V2H 500mW SOD323
3 Vishay MMSZ4689-V 500mW SOD123
4 Crownpo CDZ55C5V1SM 500mW 0805
3.1.2 Recommended Power Supply Circuit
It is recommended that a switching modepower supply or linear regulator power supply is used. It
is important to make sure that all the components used in the power supply circuit can resist a peak
current up to 2A.
The following figure shows the linear regulatorreference circuit with 5V input and 3.8V output.
Figure 6: Linear regulator reference circuit
If there is a big voltage difference between input and output for VBAT power supply, orthe
efficiency is extremely important,then a switching mode power supply will be preferable. The
following figure shows theswitching mode power supply reference circuit.
Figure 7: Switching modepower supply reference circuit
Note: The Switching Mode power supply solution for VBAT must be chosen carefully against
Electro Magnetic Interference and ripple current from depraving RF performance.
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3.1.3 Vo lt ag e Mo ni to r
To monitor the VBAT voltage, the AT command “AT+CBC” can be used.
For monitoring the VBAT voltage outside or within a special range, the AT command
“AT+CVALARM” can be used to enable the under-voltage warning function.
If users need to power off Module, when the VBAT voltage is out of a range, the AT command
“AT+CPMVT” can be used to enable under-voltage power-off function.
Note: Under-voltage warning function and under-voltage power-off function are disabled by
default. For more information about these AT commands, please refer to Document [1].
3.2 Power on/Power off/Reset Function
3.2.1 Power on
Module can be powered on by pulling the PWRKEY pin down to ground.
The PWRKEY pin has been pulled up to dVDDinternally, so you does not need to pull it up
externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close
to the PWRKEY pin. Please refer to the following figure for the recommended reference circuit.
Turn on /off
PWRKEY
100Ω
impulse
4.7K
100nF
47K
Figure 8: ReferencePower on/offCircuit
The power-on scenarios are illustrated in the following figure.
dVDD
Diode
Power
On off logic
MODULE
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VBAT
PWRKEY
(Input)
STATUS
(Output)
UART Port
USB Port T
T
on
Undefined
Undefined
Figure 9: Power on timing sequence
Table 8: Power on timing and electronic characteristic
T
on(status)
T
on(uart)
Active
on(usb)
Active
Symbol Parameter Min. Ty p. Max. Unit
Ton
T
on(status)
T
The time from power-on issue to UART port ready 20 s
on(uart)
T
The time from power-on issue to USB port ready 20 s
on(usb)
The time of active low level impulse of PWRKEY
pin to power on module
The time from power-on issue to STATUS pin
output high level(indicating power up ready )
100 500 - ms
22 - -
s
VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V
VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V
3.2.2 Power off
The following methods can be used to power off Module.
● Method 1: Power off Module by pulling the PWRKEY pin down to ground.
● Method 2: Power off Module by AT command“AT+ C PO F ”.
● Method 3: Over-voltage or under-voltage automatic power off. The voltage range can be set by
AT command
● Method 4: Over-temperature or under-temperature automatic power off.
“AT + CP M V T ”.
Note: If the temperature is outside the range of -30~+80℃, some warning will be reported via
AT port. If the temperature is outside the range of -40~+85℃, Module will be powered off
automatically.
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For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].
These procedures will make modules disconnect from the network and allow the software to enter a
safe state and save data before modules are powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
T
off-on
PWRKEY
)
( Input
STATUS
(
Output
T
off
)
T
off(status)
T
off(uart)
T
on
UART Port
T
off(usb)
USB Port
Active
Figure 10: Power off timing sequence
Table 9: Power off timing and Electronic Characteristic
Symbol Parameter
T
off
T
T
T
T
off(status)
The time from power-off issue to UART port off 15 - - s
off(uart)
The time from power-off issue to USB port off 15 - - s
off(usb)
off-on
The active low level time pulse on PWRKEY pin to
power off module
The time from power-off issue to STATUS pin output
low level(indicating power off )*
The buffer time from power-off issue to power-on
issue
UndefinedActive
Undefined
Time value
Unit
Min. Ty p. Max.
2.5 -- -- s
22 - - s
0 - - s
3.2.3 Reset Function
Module can be reset by pulling the RESET pin down to ground.
Note: This function is only used as an emergency reset when AT command “AT+CPOF” and the
PWRKEY pin all have lost efficacy.
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The RESET pin has been pulled up to 1.8V internally, so it does not need to be pulled up externally.
It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the
RESET pin. Please refer to the following figure for the recommended reference circuit.
Figure 11: Reference reset circuit
Table 10: RESET pin electronic characteristic
Symbol Description Min. Ty p. Max. Unit
T
reset
The active low level time impulse on
RESET pin to reset module
100 ms
VIH Input high level voltage 1.17 1.8 2.1 V
VIL Input low level voltage -0.3 0 0.8 V
3.3 UART Interface
Module provides a 7-wire UART (universalasynchronous serial transmission) interface as DCE
(Data Communication Equipment). AT commands and data transmission can be performed through
UART interface.
3.3.1 UART Design Guide
The following figures show the reference design.
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Figure 12: UART full modem
Figure 13: UART null Modem
The Module UART is 1.8V voltage interface. If user’s UART application circuit is a 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
reference design.
Figure 14: Reference circuit of level shift
To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect
Module to the RS-232-C interface, for example SP3238ECA, etc.
Note: Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400,
57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate
is 115200bps.
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3.3.2 RI and DTR Behavior
The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU.
Normally RI will stay at high level until certain conditions such as receiving SMS, or a URC report
come in. It will then change to low level. It will stay low until the host controller clears the
interrupted event with “AT+CRIRS” AT command.
Figure 15: RI behaviour（SMS and URC report）
Normally RI will be kept high until a voice call, then it will output periodic rectangular wave with
5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until
the call is answered or hung up.
Figure 16: RI behaviour（voice call）
Note: For more details of AT commands about UART, please refer to document [1] and [22].
DTR pin can be used to wake Module from sleep. When Module enters sleep mode, pulling down
DTR can wake Module.
3.4 USB Interface
The Module contains a USB interface compliant with the USB2.0 specification as a peripheral, but
the USB charging function is not supported.
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3.4.1 USB Application Guide
Module can be used as a USB device. Module supports the USB suspend and resume mechanism
which can reduce power consumption. If there is no data transmission on the USB bus, Module will
enter suspend mode automatically and will be resumed by some events such as voice call, receiving
SMS, etc.
Figure 17: USB reference circuit
Because of the high bit rate on USB bus, more attention should be paid to the influence of the
junction capacitance of the ESD component on USB data lines. Typically, the capacitance should
be less than1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G
provided by On Semiconductor (
www.onsemi.com ).
D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
add a ZENER diode for surge clamping. The recommend diodes list please refer to table 7.
L is recommended (MURATA) DLW21SN371SQ2L.
：
Note
The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential
impedance.
3.5 USIM Interface
Module supports both 1.8V and 3.0V USIM Cards.
Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V)
Symbol Parameter
USIM_
VDD
LDO power output voltage
Min. Typ. Max. Unit
1.75 1.8 1.95 V
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
VOL Low-level output voltage
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0.65*USIM_VDD - USIM_VDD +0.3 V
-0.3 0 0.35*USIM_VDD V
USIM_VDD -0.45 - USIM_VDD V
0 0 0.45 V
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Table 12: USIM Electronic characteristic 3.0V mode (
Symbol Parameter
USIM_
VDD
LDO power output voltage
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
VOL Low-level output voltage
Min. Typ. Max. Unit
2.75 2.95 3.05 V
0.65*USIM_VDD - USIM_VDD +0.3 V
-0.3 0 0.25*USIM_VDD V
USIM_VDD -0.45 - USIM_VDD V
0 0 0.45 V
USIM_VDD=2.95V)
3.5.1 USIM Application Guide
It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST
(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM
peripheral circuit should be close to the USIM card socket.The following figure shows the 6-pin
SIM card holder reference circuit.
Figure 18: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a100KΩ resistor to USIM_VDD in module. A 100nF
capacitor on USIM_VDD is used to reduceinterference. For more details of AT commands about
USIM, please refer to document [1].
3.5.2 SIM Card Design Guide
SIM card signal could be interferenced by some high frequency signal, it is strongly recommended
to follow these guidelines while designing:
SIM card holder should be far away from antenna
SIM traces should keep away from RF lines, VBAT and high-speed signal lines
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The traces should be as short as possible
Keep SIM card holder’s GND connect to main ground directly
Shielding the SIM card signal by ground well
Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the SIM
card holder
Add some TVS which parasitic capacitance should not exceed 50pF
Add 51Ω resistor to (SIM_RST/SIM_CLK/SIM_DATA) signal could enhance ESD
protection
Add 22pF capacitor to (SIM_RST/SIM_CLK/SIM_DATA) signal to induce RF signal
interference
3.5.3
Recommended USIM Card Holder
It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by
Amphenol. User can visit http://www.amphenol.com for more information about the holder.
Figure 19: Amphenol SIM card socket
Table 13: Amphenol USIM Socket Pin Description
Pin Signal Description
C1 USIM_VDD USIM Card Power supply.
C2 USIM_RST USIM Card Reset.
C3 USIM_CLK USIM Card Clock.
C5 GND Connect to GND.
C6 VPP
C7 USIM_DATA USIM Card data I/O.
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3.6 PCM Interface
Module provides a PCM interface for external codec, which can be used inmaster mode with short
sync and 16 bits linear format.
Table 14: PCM Format
Characteristics Specification
LineInterfaceFormat Linear(Fixed)
Datalength 16bits(Fixed)
PCM Clock/Sync Source Master Mode(Fixed)
PCMClockRate 2048 KHz (Fixed)
PCMSyncFormat Shortsync(Fixed)
Data Ordering MSB
Note: For more details about PCM AT commands, please refer to document [1].
3.6.1 PCM Timing
Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.
Figure 20: PCM_SYNC timing
Figure 21: EXT codec to module timing
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Figure 22: Module to EXT codec timing
Table 15: PCM Timing Parameters
Parameter Description Min. Typ. Max. Unit
T(sync) PCM_SYNC cycle time – 125 – μs
T(synch) PCM_SYNC high level time – 488 – ns
T(syncl) PCM_SYNC low level time – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high level time – 244 – ns
T(clkl) PCM_CLK low level time – 244 – ns
T(susync)
T(hsync)
T(sudin)
PCM_SYNC setup time high before falling edge of
PCM_CLK
PCM_SYNC hold time after falling edge of
PCM_CLK
PCM_IN setup time before falling edge of
PCM_CLK
– 122 – ns
– 366 – ns
60 – – ns
T(hdin) PCM_IN hold time after falling edge of PCM_CLK 60 – – ns
T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns
T(zdout)
Delay from PCM_CLK falling to PCM_OUT
HIGH-Z
– – 60 ns
3.6.2 PCM Application Guide
The following figure shows the external codec reference design.
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Figure 23: Audio codec reference circuit
Note: Module can transmit PCM data by theUSB portbesidesthe PCM interface. For more
details please refer to documents [1] and [23].
3.7 I2C Interface
Module provides a I2C interface compatible with I2C specification, version 2.1, with clock rate up
to 400 kbps. Its operation voltage is 1.8V.
3.7.1 I2C Design Guide
The following figure shows the I2C bus reference design.
Figure 24: I2C reference circuit
Note
：
SDA and SCLhave pull-up resistors in module. So, 2 external pull up resistors are not needed in
application circuit.
“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the
I2C peripheral devices.For more details about AT commands please refer to document [1].
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3.8 Network Status
The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.
Figure 25: NETLIGHT reference circuit
Note: The value of the resistor named “R” depends on the LED characteristic.
Table 16: NETLIGHT pin status
NETLIGHT pin status Module status
Always On Searching Network/Call Connect
200ms ON, 200ms OFF Data Transmit
800ms ON, 800ms OFF Registered network
OFF
Power off / Sleep
Note: NETLIGHT output low level as “OFF”, and high level as “ON”.
3.9 Operating Status Indication
The pin50 is for operating status indication of the module. The pin output is high when module is
powered on, and output is low when module is powered off.
Table 17: Pin definition of the STATUS
Pin name Pin number Description
STATUS 50 Operating status indication
Note: For timing about STATUS, please reference to the chapter “3.2 power on/down scenarios”
3.10 Pin Multiplex Function
Some pins of Module could be used for alternate function besides default function.
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Table 18: Pin multiplex function list
Pin Number
Pin Name Default Function Alternate Function
4 SCL SCL GPIO11
5 SDA SDA GPIO10
12 USIM_DET GPIO34 USIM_DET
18 PCM_CLK PCM_CLK
GPIO23,SPI_CLK
I2C_SCL
19 PCM_SYNC PCM_SYNC GPIO20,SPI_MOSI
20 PCM_IN PCM_IN, GPIO21,SPI_MISO
21 PCM_OUT PCM_OUT
Note
：
For more details of AT commands about GPIO multiplex function,please refer to
GPIO22,SPI_CS_N
I2C_SDA
document [1].
3.11 Other interface
3.11.1 Sink Current Source
The ISINK pin is VBATtolerant and intended to drive some passive devices such as LCD backlight,
white LED, etc. Its output current can be up to 40 mA and be set by the AT command “AT+
CLEDITST”.
Table 19: Sink current electronic characteristic
Symbol Description Min. Typ. Max. Unit
V
Voltage tolerant 0.5 - VBAT V
ISINK
I
Current tolerant 0 - 40 mA
ISINK
ISINK is a ground-referenced current sink. The following figure shows its reference circuit.
Figure 26: ISINK reference circuit
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Note: The sinking current can be adjusted to meet the design requirement through the AT
command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the
current from 0mA to 40mA by 5mA step.
3.11.2 ADC
Module has 1 dedicated ADC pins named ADC. They are available fordigitizing analog signals
such as battery voltage and so on. These electronic specifications are shown in the following table.
Table 20: ADC Electronic Characteristics
Characteristics
Resolution
Min. Typ. Max. Unit
–
15
–
Bits
Input Range 0.1 1.7 V
Input serial resistance 1
– –
MΩ
Note: “AT+CADC” can be used to read the voltage of the ADC pins, for more details, please
refer to document [1].
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4 RF Specifications
4.1 LTE RF Specifications
Table 21: Conducted transmission power
Frequency Power Min.
LTE-FDD B4 23dBm +/-2.7dB <-40dBm
LTE-FDD B13 23dBm +/-2.7dB <-40dBm
Table 22: Operating frequencies
Frequency Receiving Transmission
LTE-FDD B4 2110~2155 MHz 1710 ~1755 MHz
LTE-FDD B13 777 ~787MHz 746~756 MHz
Table 23: Reference sensitivity (QPSK)
E-UTRA
band
1.4 MHz 3MHz 5MHz 10MHz 10 MHz 15 MHz 20 MHz
3GPP standard Test value 3GPP standard
Duplex
4 -104.7 -101.7 -100 -97 -102 -95.2 -94 FDD
13 -97 -94 -95 FDD
4.2 LTE Antenna Design Guide
Users should connect antennas to Module’s antenna pads through the micro-strip line or other types
of RF trace. The trace impedance must be controlled in 50Ω. SIMCom recommends that the total
insertion loss between Module and antenna should meet the following requirements:
Table 24: Trace Loss
Frequency Loss
700MHz-960MHz <0.5dB
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
circuit should be added. The following figure is the recommended circuit.
SIM7500V provides LTE antenna named MAIN_ANT, customer could use 50Ω microstrip
line or stripline antenna connect to the module.
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The maximum gain of the Main antenna gain should not exceed 3.49dBi for LTE Band 4
and 2.2dBi for LTE Band 13 considering the SAR radio. It has according to reference trace
and matching circuit testing all FCC items, and all items satisfy FCC requirements. Only
the reference trace and matching circuit is certified,antenna design must refer to it, any
other deviations require testing Class II applications as required by FCC.
The certified matching circuit as following:
Figure 27: Antenna matching circuit (MAIN_ANT)
In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the value of
components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1
is a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the module’s MAIN_ANT pin. The traces impedance between Module and antenna must be
controlled in 50Ω.
Figure 28: Antenna matching circuit (DIV_ANT)
In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4
are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is
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optional for users according to application environment.
Two TVS are recommended in the table below.
Table 25: Recommended TVS
Package Part Number Vender
0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata
Note：SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high
bands in the designing of FDD-LTE. Because of the high insert loss of the RF cable and layout
lines, the receiver sensitivity of these bands above will have risk to meet the authentication
without the diversity antenna.For more details about auxiliary antenna design notice,please
refer to document [25]
4.3 Dipole Antenna PCB Layout Requirements
4.4 Dipole Antenna Reference Design PCB
Mount these devices with brown mark facing up. Units: mm
Line width should be designed to provide 50Ωimpedance matching characteristics.
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LAYER1 - TOP
LAYER2 – BOTTOM
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5 Electrical Specifications
5.1 Absolute Maximum Ratings
Absolute maximumrating for digital and analog pins of Module are listed in the following table:
Table 26: Absolute maximum ratings
Parameter Min. Max. Unit
Voltage at VBAT -0.5 6.0 V
Voltage at VBUS -0.5 6.3 V
Voltage at digital pins (RESET,SPI,GPIO,I2C,UART,PCM) -0.3 2.1 V
Voltage at digital pins :USIM -0.3 3.05 V
Voltage at PWRKEY -0.3 1.8
5.2 Operating Conditions
Table 27: Recommended operating ratings
Parameter Min. Ty p. Max. Unit
Voltage at VBAT 3.4 3.8 4.2 V
Voltage at VBUS 3.6 5 5.25 V
Table 28: 1.8V Digital I/O characteristics*
Parameter Description Min. Typ. Max. Unit
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
VOL Low-level output voltage
IOH
IOL
High-level output current(no
pull down resistor)
Low-level output current(no pull
up resistor)
1.17 1.8 2.1 V
-0.3 0 0.63 V
1.35 - 1.8 V
0 - 0.45 V
- 2 mA
- -2 - mA
IIH
IIL
*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT), I2C,
UART, PCM.
The operating temperature of Module is listed in the following table.
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Input high leakage current (no
pull down resistor)
Input low leakage current(no
pull up resistor)
- - 1 uA
-1 - - uA
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Table 29: Operating temperature
Parameter Min. Ty p. Max. Unit
Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 +90 ℃
*Note: Module is able to make and receive voice calls, data calls, SMS and make
WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from
the 3GPP specifications if the temperature is outside the normal operating temperature range
and still within the extreme operating temperature range.
5.3 Operating Mode
5.3.1 Operating Mode Definition
The table below summarizes the various operating modes of Module series products.
Table 30: Operating mode Definitions
Mode Function
In this case, the current consumption of module will be reduced to the
LTE Sleep
minimal level and the module can still receive paging message and
SMS.
LTE Idle
Software is active. Module is registered to the network, and the
module is ready to communicate.
Connection between two subscribers is in progress. In this case, the
LTE Talk
power consumption depends on network settings such as DTX off/on,
FR/EFR/HR, hopping sequences, antenna.
Normal operation
LTE Standby
Module is ready for data transmission, but no data is currently sent or
received. In this case, power consumption depends on network
settings.
There is data transmission in progress. In this case, power
LTE transmission
consumption is related to network settings (e.g. power control level);
uplink/downlink data rates, etc.
AT command “AT+CFUN=0” can be used to set the module to a
minimum functionality mode without removing the power supply. In
Minimum functionality
mode
this mode, the RF part of the module will not work and the USIM
card will not be accessible, but the serial port and USB port are still
accessible. The power consumption in this mode is lower than normal
mode.
AT command “AT+CFUN=4” or pulling down the FLIGHTMODE
Flight mode
pin can be used to set the module to flight mode without removing the
power supply. In this mode, the RF part of the module will not work
but the serial port and USB port are still accessible. The power
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consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command
Power off
“AT+CPOF” or by pulling down the PWRKEY pin normally. In this
mode the power management unit shuts down the power supply and
software is not active. The serial port and USB are is not accessible.
5.3.2 Sleep Mode
In sleep mode, the current consumption of module will be reduced to the minimal level, and
module can still receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let Module enter
into sleep mode:
1. UART condition
2. USB condition
3. Software condition
Note: Before designing, pay attention to how to realize sleeping/waking function and refer to
Document [26] for more details.
5.3.3 Minimum Functionality Mode and Flight Mode
Minimum functionality mode ceasesa majority functionof module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
levels.
● AT+CFUN=0: Minimum functionality
● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Flight mode
If Module has been set to minimum functionality mode, the RF function and USIM card function
will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM
card will be unavailable.
If Module has been set to flight mode, the RF function will be closed. In this case, the serial port
and USB are still accessible, but RF function will be unavailable.
When Module is in minimum functionality or flight mode, it can return to full functionality by the
AT command “AT+CFUN=1”.
5.4 Current Consumption
The current consumption is listed in the table below.
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Table 31: Current consumption on VBAT Pins (VBAT=3.8V)
LTE Sleep/Idle mode
LTE supply current
(without USB connection)
Sleep mode Typical: 1.56
Idle mode Typical: 22
LTE Data
@5 MHz 23.05dBm Typical: 519mA
LTE-FDD B4
@10 MHz 23.04dBm Typical: 556mA
@20 MHz 22.83dBm Typical: 600mA
LTE-FDD B13
@5 MHz 22.69dBm Typical: 516mA
@10 MHz 22.9dBm Typical: 512mA
5.5 ESD Notes
Module is sensitive to ESD in the process of storage, transporting and assembling. Especially,
Module is mounted on the users’ mother board, The ESD components should be placed beside the
connectors which human body might touch, such as USIM card holder, audio jacks, switches and
keys, etc. The following table shows the Module ESD measurement performance without any
external ESD component.
Table 32: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
Part Contact discharge Air discharge
GND
+/-6K +/-12K
VBAT +/-5K +/-10K
Antenna port
+/-5K +/-10K
USB +/-4K +/-8K
UART
+/-4K +/-8K
PCM +/-4K +/-8K
Other PADs
+/-3K +/-6K
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6 SMT Production Guide
6.1 Top and Bottom View of Module
Figure 29: Top and bottom view of Module
6.2 Label Information
B
A
D
F
H
C
E
G
Figure 30: Label Information
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Table 33: The Description of Label Information
No. Description
A LOGO
B No.1 Pin
C Project Name
D Part Number
E Serial Number (SN)
F International Mobile Equipment Identity (IMEI)
G FCC ID
H QR code
6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 31: The ramp-soak-spike Reflow Profile of Module
Note: For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
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Table 34: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
1 Unlimited at 30℃/85% RH≦
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
6.5 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.1mm.
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7 Packaging
Module module support tray packaging.
Module tray drawing：
Figure 32: Packaging introduce
Figure 33: Module tray drawing introduce
Table 35: Tray size
Length（±3mm） Width（±3mm）
Module number
242.0 161.0 15
Small carton drawing：
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Figure 34: Small carton drawing introduce
Table 36: Small Carton size
Length（±10mm） Width（±10mm） Height（±10mm）
Module number
270 180 120 15*20=300
Big carton drawing：
Figure 35: Big carton drawing introduce
Table 37: Big carton size
Length（±10mm） Width（±10mm） Height（±10mm）
Module number
380 280 280 300*4=1200
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Appendix
A. Reference Design
Figure 36: Reference design
Note: The UART port suggest to be used by isolated circuit .
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B. Coding Schemes and Maximum Net Data Rates over Air Interface
Table 38: Coding schemes and maximum net data rates over air interface
Multislot definition(GPRS/EDGE)
Slot class DL slot number UL slot number Active slot number
1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5
GPRS coding scheme
Max data rata（4 slots）
Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK
CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK
EDGE coding scheme
Max data rata（4 slots）
Modulation type
MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK
MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK
MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK
MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK
MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK
MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK
MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK
HSDPA device category
Max data rate（peak）
Modulation type
Category 1 1.2Mbps 16QAM,QPSK
Category 2 1.2Mbps 16QAM,QPSK
Category 3 1.8Mbps 16QAM,QPSK
Category 4 1.8Mbps 16QAM,QPSK
Category 5 3.6Mbps 16QAM,QPSK
Category 6 3.6Mbps 16QAM,QPSK
Category 7 7.2Mbps 16QAM,QPSK
Category 8 7.2Mbps 16QAM,QPSK
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Category 9 10.2Mbps 16QAM,QPSK
Category 10 14.4Mbps 16QAM,QPSK
Category 11 0.9Mbps QPSK
Category 12 1.8Mbps QPSK
Category 13 17.6Mbps 64QAM
Category 14 21.1Mbps 64QAM
Category 15 23.4Mbps 16QAM
Category 16 28Mbps 16QAM
Category 17 23.4Mbps 64QAM
Category 18 28Mbps 64QAM
Category 19 35.5Mbps 64QAM
Category 20 42Mbps 64QAM
Category 21 23.4Mbps 16QAM
Category 22 28Mbps 16QAM
Category 23 35.5Mbps 64QAM
Category 24 42.2Mbps 64QAM
HSUPA device category
Max data rate（peak）
Modulation type
Category 1 0.96Mbps QPSK
Category 2 1.92Mbps QPSK
Category 3 1.92Mbps QPSK
Category 4 3.84Mbps QPSK
Category 5 3.84Mbps QPSK
Category 6 5.76Mbps QPSK
LTE-FDD device category
(Downlink)
Max data rate（peak）
Modulation type
Category 1 10Mbps QPSK/16QAM/64QAM
Category 2 50Mbps QPSK/16QAM/64QAM
Category 3 100Mbps QPSK/16QAM/64QAM
Category 4 150Mbps QPSK/16QAM/64QAM
LTE-FDD device category
(Uplink)
Max data rate（peak）
Modulation type
Category 1 5Mbps QPSK/16QAM
Category 2 25Mbps QPSK/16QAM
Category 3 50Mbps QPSK/16QAM
Category 4 50Mbps QPSK/16QAM
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C. Related Documents
Table 39: Related documents
SN Title Description
[1]
[2]
[3] GSM 07.07
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
[5] GSM 07.05
[6] GSM 11.14
[7] GSM 11.11
[8] GSM 03.38
[9] GSM 11.10
[10] 3GPP TS 51.010-1
[11] 3GPP TS 34.124
[12] 3GPP TS 34.121
[13] 3GPP TS 34.123-1
[14] 3GPP TS 34.123-3
[15] EN 301 908-02 V2.2.1
[16] EN 301 489-24 V1.2.1
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[18] 3GPP TS 51.010-1
SIM7X00 Series_AT
Command Manual_V1.xx
ITU-T Draft new
recommendationV.25ter
SIM7X00 Series_AT Command Manual
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command
set for GSM Mobile Equipment (ME)
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
(DTE – DCE) interface for Short Message Service (SMS)
and Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the
Subscriber Identity Module – Mobile Equipment (SIM – ME)
interface
Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
Mobile Station (MS) conformance specification； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
Technical Specification Group Radio Access Network;
Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
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[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of
[20] 2002/95/EC
27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment
(RoHS)
[21] Module
Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
[22]
SIM7X00
Series_UART_Application
SIM7X00 Series_UART_Application Note
Note_V1.xx
SIM7X00 Series_USB
[23]
AUDIO_Application
Note_V1.xx
[24] Antenna design guidelines for
SIM7X00 Series_USB AUDIO_Application Note
Antenna design guidelines for diversity receiver system
diversity receiver system
[25] SIM7X00 Series_Sleep Mode_
SIM7X00 Series_Sleep Mode_ Application Note
Application Note_V1.xx
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D. Terms and Abbreviations
Table 40: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
EVDO Evolution Data Only
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
GNSS Global Navigation Satellite System
HR Half Rate
HSPA High Speed Packet Access
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
SIM Subscriber Identification Module
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SMS Short Message Service
SPI serial peripheral interface
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
USIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter
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E. Safety Caution
Table 41: Safety caution
Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to
prevent interference with communication systems. Forgeting to think much of these
instructions may impact the flight safety or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to
deactivate those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China
200335
Tel：+86 21 3235 3300
Fax：+86 21 3235 3020
URL：www.simcomm2m.com
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