4.1. Power Supply ................................................................................................................. 20
4.1.1. Power Supply Pin ................................................................................................................................ 21
4.1.2. Monitoring Power Supply ................................................................................................................... 22
4.2. Power on/off SIM868 ..................................................................................................... 22
4.2.1. Power on SIM868 ............................................................................................................................... 22
4.2.2. Power off SIM868 ............................................................................................................................... 23
4.3. Power Saving Mode........................................................................................................ 25
4.3.5. Wake Up SIM868 from Sleep Mode 2 ................................................................................................ 26
4.4. Power Saving Mode........................................................................................................ 26
4.5. Serial Port and USB Interface ......................................................................................... 27
4.5.1 Function of Serial Port ........................................................................................................................ 28
4.5.2 Serial Interfaces ................................................................................................................................... 29
5.2.2 Power Supply ...................................................................................................................................... 49
TABLE 8: THE CURRENT CONSUMPTION OF FUNCTION MODE .....................................................................25
TABLE 9: SERIAL PORT AND USB PIN DEFINITION ...........................................................................................27
TABLE 10: SERIAL PORT CHARACTERISTICS.....................................................................................................27
TABLE 11: USB_VBUS OPERATION VOLTAGE ....................................................................................................31
TABLE 12: RI BEHAVIORS......................................................................................................................................31
Note: Every time plug SIM card interval advice is greater than 2s. Otherwise may not be able to correct
detection.
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4.9. SD Interface
SD interface can be configured as PCM interface; the following table shows the detailed multiplexing function.
Table 20: SD multiplexing function
Pin name Pin number Mode 0(default) Mode 1 Mode 2 Mode 3
MCCA3 46 MCCA3 DAIPCMOUT(1.8V) GPIO EINT19
MCCA2 47 MCCA2 DAICLK(1.8v) GPIO EINT18
MCCA1 48 MCCA1 DAIPCMIN(1.8v) GPIO EINT17
MCCA0 49 MCCA0 DAISYNC (1.8v) GPIO
MCCK 50 MCCK GPIO
MCCM0 51 MCCM0 GPIO
Note: Customer can use AT command set mode. For detail, please refer to document [1].
SIM868 provides a hardware SD interface:
Figure 34: SD reference circuit
If power supply is 2.8V for SD card, customer can use VDD_EXT; if power supply is 3.3V, please use external
design LDO.
4.10. I2C Bus
The SIM868 provides an I2C interface which is only used in the embedded AT application.
Table 21: Pin definition of the I2C
Pin name Pin number Description
SCL 65 I2C serial bus clock(open drain output)
SDA 64 I2C serial bus data(open drain output)
Note:
1. I2C should be pulled up to 2.8V via 4.7K externally.
2. I2C function is not supported in the standard firmware. If you need, please contact SIMCom.
4.10.1. I2C Multiplexing Function
Table 22: I2C multiplexing function
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Status
SIM868
behavior
Off Powered off
64ms On/ 800ms Off
Not registered the network
64ms On/ 3000ms Off
Registered to
the network
64ms On/ 300ms Off
GPRS communication is established
NETLIGHT
41
Network Status Indication
Pin name Pin number Mode 0(default) Mode 1
SCL 65 SCL GPIO
SDA 64 SDA GPIO
Note: Customer can use AT command set mode. For detail, please refer to document t[1].
4.11. ADC
Table 23: Pin definition of the ADC
Pin name Pin number Description
ADC 38 Analog voltage input
SIM868 provides an auxiliary ADC, which can be used to measure the voltage. Customer can use AT command
“AT+CADC” to read the voltage value.
Note: Customer can use AT command set mode. For detail, please refer to document t[1].
Table 24: ADC specification
Parameter Min Typ Max Unit
Voltage range 0 - 2.8 V
ADC Resolution - 10 - bits
RIN
CIN
Input resistance
Unselected channel
Selected channel
Input capacitance
Unselected channel
Selected channel
400
1
50
4
M
M
fF
pF
Sampling rate - - 1.08 MHz
ADC precision 10 30 mV
4.12. Network Status Indication
Table 25: Pin definition of the NETLIGHT
Pin name Pin number Description
The NETLIGHT pin can be used to drive a network status indication LED. The status of this pin is listed in
following table:
Table 26: Status of the NETLIGHT pin
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Reference circuit is recommended in the following figure:
Module
VBAT
R
NETLIGHT
4.7K
47K
Figure 35: Reference circuit of NETLIGHT
Table 27: NETLIGHT multiplexing function
Pin name Pin number Mode 0(default) Mode 1
NETLIGHT 41 NETLIGHT GPIO
Note: Customer can use AT command set mode. For detail, please refer to document t[1].
4.13. Operating Status Indication
The pin42 is for operating status indication of the module. The pin output is high when module is powered on,
and output is low when module is powered off.
Table 28: Pin definition of the STATUS
Pin name Pin number Description
STATUS 42 Operating status indication
Note: For timing about STATUS, please reference to the chapter “4.2 power on/down scenarios”
4.14. RF Synchronization Signal
The synchronization signal serves to indicate growing power consumption during the transmit burst.
Table 29: Definition of the RF_SYNC pin
Pin name Pin number Description
RF_SYNC 29 Transmit synchronization signal
The timing of the synchronization signal is shown in the following figure. High level of the RF_SYNC signal
indicates increased power consumption during transmission.
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220us
577us
Transmit burst
RF_SYNC
Figure 36: RF_SYNC signal during transmit burst
4.14.1. RF_SYNC Multiplexing Function
RF_SYNC can also be used as GPIO to indicate the RF Jamming. The RF_SYNC function and RF Jamming
Detection function can be switched by AT+SJDR command.
Table 30: RF_SYNC Multiplexing function
Pin name Pin number Mode 0(default) Mode 1
RF_SYNC 29 RF Synchronization Signal JD(RF jamming detection)
Note: About AT+SJDR, please refer to document [1].
4.15. GNSS
4.15.1. GNSS Overview
SIM868 provide a high-performance L1 GNSS solution for cellular handset applications. The solution offers
best-in-class acquisition and tracking sensitivity, Time-To-First-Fix (TTFF) and accuracy. The GNSS engine
supports both fully-autonomous operations for use in handheld consumer navigation devices and other
standalone navigation systems.
GNSS engine Performance, please refer to Table 3.
GNSS NMEA information is output by serial port. The default baud rate is 115200bps.
4.15.2. Power on/down GNSS
The GNSS engine is controlled by GNSS_EN PIN, so when it is necessary to run GNSS,the GNSS_EN must be
pulled up to 2.8V. When it is necessary to power off GNSS,the GNSS_EN must be pulled down to GND.
4.15.3. 1PPS Output
The 1PPS pin outputs pulse-per-second (1PPS) pulse signal for precise timing purposes. It will come out after
successfully positioning .The 1PPS signal can be provided through designated output pin for many external
applications.
4.16. Antenna Interface
There are two antenna interfaces, GSM_ANT、GPS_ANT.
The input impendence of the two antenna should be 50Ω, and the VSWR should be less than 2.
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It is recommended that the GSM antenna should be placed as far as possible.
The isolations of the two antenna should be bigger than 30dB
The modular connection to the antenna is made through a host’s printed board microstrip trace
layout,the impendence of the microstrip trace is control in 50Ω,the series connection component in the
trace is 0Ω resistors for default, the size of series connection componentcan be 0402 or 0201.the length
of the microstrip trace should be as short as possible for reduce insertion loss.
4.16.1. GSM Antenna Interface
There is a GSM antenna pad named GSM_ANT to connect an external GSM antenna, the connection of the
antenna must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to
ground via an inductor for ESD protection. The external antenna must be matched properly to achieve the best
performance, so the matching circuit is necessary.
It is recommended to reserve the matching circuit as following:
Figure 37: GSM antenna matching circuit
The RF connector is used for conduction test. If the space between RF pin and antenna is not enough, the
matching circuit should be designed as in the following figure:
Figure 38: GSM antenna matching circuit without RF connector
In above figure, the components R101, C101 and C102 are used for antenna matching, the value of components
can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R101 is 0Ω
resistors, and the C101, C102 are reserved for tuning.
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Dipole Antenna Reference PCBLayout Requirements.
Dipole Antenna Reference Design PCB
Mount these devices with brown mark facing up. Units: mm
Line width should be designed to provide 50Ωimpedance matching characteristics.
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The RF test connector in the figure is used for the conducted RF performance test, and should be placed as close
as to the module’s antenna pin. The traces impedance between components must be controlled in 50Ω. The
component D101 is a bidirectional TVS component, which is used for ESD protection, the recommended part
numbers of the TVS are listed in the following table:
Table 31: Recommended TVS component
Package Type Supplier
0201 LXES03AAA1-098 Murata
0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata
0402 LXES15AAA1-100 Murata
0402 LXES15AAA1-017 Murata
4.16.2. GNSS Antenna Interface
The module also provides a GNSS antenna interface named GPS_ANT to connect the antenna on the customer’s
application board. To obtain excellent GNSS reception performance, a good antenna will always be required.
Proper choice and placement of the antenna will ensure that satellites at all elevations can be seen, and therefore,
accurate fix measurements are obtained. There are two normal options: passive antenna and active antenna.
GNSS antenna choice should be based on the designing product and other conditions. For detailed Antenna
designing consideration, please refer to related antenna vendor’s design recommendation. The antenna vendor will
offer further technical support and tune their antenna characteristic to achieve successful GNSS reception
performance.
SIM868 provides GSM antenna named GSM_ANT, customer could use 50Ω microstrip line or stripline antenna
connect to the module. The maximum gain of the Main antenna gain should not exceed 3dBi considering the
SAR radio. No antenna gain may be used that would exceed the 2W EIRP power limit in 1900MHz band。
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It have according to reference trace and matching circuit testing all FCC items,and all items satisfy FCC
requirements.Only the reference trace and matching circuit is certified, antenna design must refer to it, any
other deviations require testing Class II applications as required by FCC. The certified matching circuit as
following:
The external antenna must be matched properly to achieve best performance, so the matching circuit is necessary,
the connection is recommended as the following figure:
Figure 39: GNSS passive antenna matching circuit
The components R101, C101 and C102 are used for antenna matching, the components’ value only can be got
after the antenna tuning. Normally R101 is 0Ω, C101 and C102 are not mounted.
Figure 40: GNSS active antenna matching circuit
Active antennas have an integrated Low-Noise Amplifier (LNA). VCC_ANT is needed on customer’s application
board for the active antenna power input, as shown in Figure 40. The inductor L101 is used to prevent the RF
signal from leaking into the VCC_ANT pass and route the bias supply to the active antenna, the recommended
value of L101 is no less than 27nH. R102 can protect the whole circuit in case the active antenna is shorted to
ground.
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5. PCB Layout
This section will give some guidelines on PCB layout, in order to eliminate interfere or noise.
5.1 Pin Assignment
Before PCB layout, we should learn about pin assignment in order to get reasonable layout with so many
external components. Following figure is the overview of pin assignment of the module.
Figure 41: PIN assignment
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5.2 Principle of PCB Layout
During layout, attention should be paid to the following interfaces, like Antenna, power supply, SIM card
interface, audio interface, and so on.
5.2.1 Antenna Interface
The length of trace between pin output and connector should be as short as possible;
Do not trace RF signal over across the board;
The RF signal should be far away from SIM card, power ICs.
5.2.2 Power Supply
VBAT and return GND are very important in layout;
The positive line of VBAT should be as short and wide as possible;
The correct flow from source to VBAT pin should go though Zener diode then huge capacitor;
Pin 36 and Pin37 are GND signals, and shortest layout to GND of power source should be designed;
There are 23 GND pads in the module; these pads could enhance the GND performances. On the
upper layer of these pads, do not trace any signal if possible.
5.2.3 SIM Card Interface
SIM card holder has no anti-EMI component inside. Thus SIM card interface maybe interfered,
please pay more attention on this interface during layout;
Ensure SIM card holder is far way from antenna or RF cable inside;
Put SIM card holder near the module, as nearer as possible;
Add ESD component to protect SIM_CLK, SIM_DATA, SIM_RST and SIM_VDD signals which
should be far away from power and high-speed-frequency signal.
5.2.4 Audio Interface
The signal trace of audio should far away from antenna and power;
The audio signal should avoid to parallel with VBAT trace.
5.2.5 Others
It is better to trace signal lines of UART bunched, as well as signals of USB.
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6. Electrical, Reliability and Radio Characteristics
6.1 Absolute Maximum Ratings
The absolute maximum ratings stated in following table are stress ratings under non-operating conditions.
Stresses beyond any of these limits will cause permanent damage to SIM868.
Table 32: Absolute maximum ratings
Symbol Min Typ Max Unit
VBAT - - 4.5 V
Current 0 - 2.0 A
USB_VBUS - - 7 V
II* - 4 16 mA
IO* - 4 16 mA
These parameters are for digital interface pins, GPIO, and UART.
6.2 Recommended Operating Conditions
Table 33: Recommended operating conditions
Symbol Parameter Min Typ Max Unit
VBAT Power supply voltage 3.4 4.0 4.4 V
T
Operating temperature -40 +25 +85 ℃
OPER
T
Storage temperature -45 +90 ℃
STG
6.3 Digital Interface Characteristics
Table 34: Digital interface characteristics
Symbol Parameter Min Typ Max Unit
VIH High-level input voltage 2.1 - 3.1 V
VIL Low-level input voltage -0.3 - 0.7 V
VOH High-level output voltage 2.4 - - V
VOL Low-level output voltage - - 0.4 V
Note: These parameters are for digital interface pins, such as keypad, GPIO and UART.
6.4 SIM Card Interface Characteristics
Table 35: SIM card interface characteristics
Symbol Parameter Min Typ Max Unit
IIH High-level input current -1.0 - 1.0 uA
IIL Low-level input current -1.0 - 1.0 uA
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50
VIH High-level input voltage
1.4 - - V
2.4 - - V
- - 0.27 V
VIL Low-level input voltage
0.4 V
1.62 - - V
VOH High-level output voltage
2.7 - - V
- - 0.36 V
VOL Low-level output voltage
- - 0.4 V
6.5 SIM_VDD Characteristics
Table 36: SIM_VDD characteristics
Symbol Parameter Min Typ Max Unit
- 3.0 -
VO Output voltage
V
- 1.8 -
IO Output current - - 10 mA
6.6 VDD_EXT Characteristics
Table 37: VDD_EXT characteristics
Symbol Parameter Min Typ Max Unit
VO Output voltage 2.7 2.8 2.9 V
IO Output current - - 50 mA
6.7 Current Consumption(VBAT=4.0V)
Table 38: Current consumption
Symbol Parameter Conditions Min Typ Max Unit
Voltage 4.0 V
Power drop PCL=5 350 mV
VBAT
Voltage ripple
I
Average current
VBAT
PCL=5
@ f<200kHz
@ f>200kHzss
2.0
mV
mV
Power off mode 130 150 uA
Sleep mode (AT+CFUN=1):
( BS-PA-MFRMS=9 )
( BS-PA-MFRMS=5)
( BS-PA-MFRMS=2)
Idle mode (AT+CFUN=1):
GSM850
EGSM900
DCS1800
0.86
1.02
1.42
13.7
13.7
13.7
mA
mA
mA
mA
mA
mA
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PCS1900 13.7 mA
Voice call (PCL=5):
GSM850
EGSM900
Voice call (PCL=0):
DCS1800
PCS1900
Data mode GPRS (1Rx,4Tx):
GSM850
EGSM900
DCS1800
PCS1900
Data mode GPRS (3Rx,2Tx):
GSM850
EGSM900
DCS1800
PCS1900
Data mode GPRS (4Rx,1Tx):
GSM850
EGSM900
DCS1800
PCS1900
223
234
162
170
378
414
270
308
323
340
212
236
217
223
153
163
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
I
Peak current During Tx burst 2.0 A
MAX
Note: In above table the current consumption value is the typical one of the module tested in laboratory. In
the mass production stage, there may be differences among each individual.
6.8 Electro-Static Discharge
SIM868 is an ESD sensitive component, so attention should be paid to the procedure of handling and packaging.
The ESD test results are shown in the following table.
Table 39: The ESD characteristics (Temperature: 25℃, Humidity: 45 %)
Pin name Contact discharge Air discharge
VBAT ±5KV ±10KV
GND ±5KV ±10KV
UART1_TXD /UART1_RXD ±4KV ±8KV
Antenna port ±5KV ±10KV
SPKP/SPKN/MICP/MICN ±4KV ±8KV
PWRKEY ±4KV ±8KV
6.9 Radio Characteristics
6.9.1 Module RF Output Power
The following table shows the module conducted output power, it is followed by the 3GPP TS 05.05 technical
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specification requirement.
Table 40: GSM850 and EGSM900 conducted RF output power
GSM850,EGSM900
PCL Nominal output power (dBm)
Tolerance (dB) for conditions
Normal Extreme
5 33 ±2 ±2.5
6 31 ±3 ±4
7 29 ±3 ±4
8 27 ±3 ±4
9 25 ±3 ±4
10 23 ±3 ±4
11 21 ±3 ±4
12 19 ±3 ±4
13 17 ±3 ±4
14 15 ±3 ±4
15 13 ±3 ±4
16 11 ±5 ±6
17 9 ±5 ±6
18 7 ±5 ±6
19-31 5 ±5 ±6
Table 41: DCS1800 and PCS1900 conducted RF output power
DCS1800,PCS1900
Tolerance (dB) for conditions
PCL Nominal output power (dBm)
Normal Extreme
0 30 ±2 ±2.5
1 28 ±3 ±4
2 26 ±3 ±4
3 24 ±3 ±4
4 22 ±3 ±4
5 20 ±3 ±4
6 18 ±3 ±4
7 16 ±3 ±4
8 14 ±3 ±4
9 12 ±4 ±5
10 10 ±4 ±5
11 8 ±4 ±5
12 6 ±4 ±5
13 4 ±4 ±5
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14 2 ±5 ±6
15 0 ±5 ±6
For the module’s output power, the following should be noted:
At GSM900 and GSM850 band, the module is a class 4 device, so the module’s output power should not exceed
33dBm, and at the maximum power level, the output power tolerance should not exceed +/-2dB under normal
condition and +/-2.5dB under extreme condition.
At DCS1800 and PCS1900 band, the module is a class 1 device, so the module’s output power should not exceed 30dBm, and at the
maximum power level, the output power tolerance should not exceed +/-2dB under normal condition and +/-2.5dB under extreme
condition.
6.9.2 Module RF Receive Sensitivity
The following table shows the module’s conducted receiving sensitivity, it is tested under static condition.
Table 42: Conducted RF receive sensitivity
Frequency
Receive sensitivity(Typical)
Receive sensitivity(Max)
GSM850,EGSM900 < -109dBm < -107dBm
DCS1800,PCS1900 < -109dBm < -107dBm
6.9.3 Module Operating Frequencies
The following table shows the module’s operating frequency range; it is followed by the 3GPP TS 05.05
technical specification requirement.
Table 43: Operating frequencies
Frequency Receive Transmit
GSM850 869 ~ 894MHz 824 ~ 849MHz
EGSM900 925 ~ 960MHz 880 ~ 915MHz
DCS1800 1805 ~ 1880MHz 1710 ~ 1785MHz
PCS1900 1930 ~ 1990MHz 1850 ~ 1910MHz
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7. Manufacturing
7.1. Top and Bottom View of SIM868
Figure 42: Top and bottom view of SIM868
7.2. Typical Solder Reflow Profile
Figure 43: Typical solder reflow profile of lead-free process
7.3. The Moisture Sensitivity Level
The moisture sensitivity level of SIM868 module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30℃ and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met:
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Table 44: Moisture sensitivity level and floor life
Moisture Sensitivity Level
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
(MSL)
1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
NOTES:
1. If the vacuum package is not open for 3 months or longer than the packing date, baking is also
recommended before re-flow soldering.
2. For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4. Baking Requirements
SIM868 modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under
the following conditions: the environment temperature is lower than 40℃, and the air humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of
permanent damage during re-flow soldering.
If the vacuum package is broken or leakage;
If the vacuum package is opened after 6 months since it’s been packed;
If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient≦30℃
/60%RH or as stated.
Table 45: Baking requirements
Baking temperature Moisture Time
40℃±5℃<5% 192 hours
120℃±5℃<5% 4 hours
Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for
preheating, otherwise the tray may be damaged by high-temperature heating.
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8. Appendix
I. Related Documents
Table 46: Related documents
SN Document name Remark
[1]
[2]
[3]
[4] GSM 07.07:
SIM800_Series_AT_Command_
Manual
SIM800 Series Port Application
Note_V1 02.doc
ITU-T Draft new
recommendation V.25ter:
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command set for