Simcom 1403022014009 User Manual

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SIM5320ALD_User_Manual

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Document Title SIM5320ALD User Manual

Version 1.01

Date 2014-08-20

Status Release

Document Control ID SIM5320ALD_User Manual_V1.01

Compliance Information

FCC Compliance Statement: This device complies with Part 15 of the FCC Rules . Operation is subject to

the following two conditions: 1. This device may not cause harmful interference, and 2. This device must

accept any interference received, including interference that may cause undesired operation. This device

must accept any interference received, including interference that may cause undesired operation. Product

that is a radio transmitter is labeled with FCC ID.

FCC Caution

(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance

with provided instructions and the antenna(s) used for this transmitter must be installed to provide a

separation distance of at least 20 cm from all persons and must not be collocated or operating in

conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna

installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

(2) Any changes or modifications not expressly approved by the grantee of this device could void the

user's authority to operate the equipment.

(3) This Transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

(4) Changes or modifications to this unit not expressly approved by the party responsible for compliance

could void the user authority to operate the equipment.

(5) the modules FCC ID is not visible when installed in the host, or

(6) if the host is marketed so that end users do not have straight forward commonly used methods for

access to remove the module so that the FCC ID of the module is visible; then an additional permanent

label referring to the enclosed module: Contains Transmitter Module FCC ID: UDV-1403022014009 or

Contains FCC ID: UDV-1403022014009 must be used.

General Notes

SIMCom offers this information as a service to its customers, to support application and engineering

efforts that use the products designed by SIMCom. The information provided is based upon requirements

specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search

for additional relevant information, including any information that may be in the customer’s possession.

Furthermore, system validation of this product designed by SIMCom within a larger electronic system

remains the responsibility of the customer or the customer’s system integrator. All specifications supplied

herein are subject to change.

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This document contains proprietary technical information which is the property of SIMCom Limited,

copying of this document and giving it to others and the using or communication of the contents thereof,

are forbidden without express authority. Offenders are liable to the payment of damages. All rights

reserved in the event of grant of a patent or the registration of a utility model or design. All specification

supplied herein are subject to change without notice at any time.

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Contents

Revision History............................................................................................................................................10

1 Introduction................................................................................................................................................11

1.1 Product Outline......................................................................................................................................11

1.2 Hardware Interface Overview...............................................................................................................11

1.3 Hardware Diagram................................................................................................................................ 11

1.4 Functional Overview.............................................................................................................................12

2 Package Information................................................................................................................................. 13

2.1 Pin Configuration..................................................................................................................................13

2.2 Pin description.......................................................................................................................................17

2.3 Package Dimensions............................................................................................................................. 19

2.4 Footprint Recommendation...................................................................................................................21

3 Application Interface Specification..........................................................................................................22

3.1 Power Supply........................................................................................................................................ 22

3.1.1 Power Supply Pin........................................................................................................................... 22

3.1.2 Design Guide.................................................................................................................................. 22

3.1.3 RTC Backup....................................................................................................................................24

3.2 Power on/off Time Sequence................................................................................................................ 26

3.2.1 Power on Sequence.........................................................................................................................26

3.2.2 Power off Sequence........................................................................................................................28

3.3 UART Interface.....................................................................................................................................29

3.3.1 Pin Description............................................................................................................................... 30

3.3.2 Application Guide...........................................................................................................................31

3.4 Audio Interfaces (For SIM5320ALD only）....................................................................................... 32

3.4.1 Pin Description............................................................................................................................... 32

3.4.2 Design Guide.................................................................................................................................. 32

3.4.3 Audio Parameter Characteristic......................................................................................................34

3.5 USIM Interface......................................................................................................................................35

3.5.1 Pin description................................................................................................................................ 35

3.5.2 Application Guide...........................................................................................................................36

3.5.3 Recommend Components...............................................................................................................36

3.6 I2C Interface..........................................................................................................................................37

3.6.1 Pin Description............................................................................................................................... 38

3.6.2 Signal Description.......................................................................................................................... 38

3.6.3 Design Guide.................................................................................................................................. 38

3.7 Keypad Interface................................................................................................................................... 38

3.7.1 Pin Description............................................................................................................................... 38

3.7.2 Application Guide...........................................................................................................................39

3.8 USB Interface........................................................................................................................................40

3.8.1 Application Guide...........................................................................................................................40

3.9 SPI Interface..........................................................................................................................................41

3.9.1 Pin Description............................................................................................................................... 41

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3.10 GPIO Interface.................................................................................................................................... 41

3.10.1 Pin Description............................................................................................................................. 41

3.10.2 Application Guide.........................................................................................................................42

3.11 PCM Interface..................................................................................................................................... 44

3.11.1 Pin Description............................................................................................................................. 44

3.11.2 Signal Description.........................................................................................................................45

3.12 Multi-functional interface...................................................................................................................48

3.12.1 Sink Current Source......................................................................................................................48

3.12.2 Reset Function.............................................................................................................................. 49

3.12.3 ADC.............................................................................................................................................. 49

3.12.4 LDO.............................................................................................................................................. 50

4 RF Specification.........................................................................................................................................50

4.1 RF Specification....................................................................................................................................50

4.2 Operating Specification.........................................................................................................................51

4.3 Antenna Design Guide.......................................................................................................................... 51

5 Reliability and Operating Characteristics.............................................................................................. 53

5.1 Electronic Characteristics..................................................................................................................... 53

5.2 Operating Mode.................................................................................................................................... 53

5.2.1 Operating Modes Overview........................................................................................................... 54

5.2.2 Minimize Power Consumption.......................................................................................................54

5.3 Current Consumption............................................................................................................................55

5.4 EMC and ESD Notes............................................................................................................................ 56

6 Guide for Production.................................................................................................................................57

6.1 Top and Bottom View of SIM5320ALD..............................................................................................57

6.2 Typical Solder Reflow Profile.............................................................................................................. 57

6.3 Moisture Sensitivity Level (MSL)........................................................................................................58

6.4 Stencil Foil Design Recommendation.................................................................................................. 58

6.5 Recommended Pad Design................................................................................................................... 59

Appendix........................................................................................................................................................60

A. System Design........................................................................................................................................60

B. SIM5320ALD GPIOs List......................................................................................................................61

C. Digital I/O Characteristics......................................................................................................................61

D. Related Documents................................................................................................................................ 62

E. Terms and Abbreviations........................................................................................................................63

F. Safety Caution.........................................................................................................................................66

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Table Index

Table 1: General Feature....................................................................................................................................................10

Table 2: Pin definition....................................................................................................................................................... 14

Table 3: Pin description..................................................................................................................................................... 15

Table 4: Pin description..................................................................................................................................................... 20

Table 5: Power on timing...................................................................................................................................................25

Table 6: Power off timing.................................................................................................................................................. 26

Table 7: Pin description..................................................................................................................................................... 28

Table 8: Logic level........................................................................................................................................................... 28

Table 9: Pin description..................................................................................................................................................... 30

Table 10: MIC input characteristics...................................................................................................................................30

Table 11: Audio output characteristics...............................................................................................................................30

Table 12: Speaker output characteristics........................................................................................................................... 30

Table 13: Audio parameter.................................................................................................................................................32

Table 14: Electronic characteristic.....................................................................................................................................33

Table 15: Pin description................................................................................................................................................... 33

Table 17: Pin description................................................................................................................................................... 36

Table 18: Pin description................................................................................................................................................... 36

Table 19: GPIO configuration........................................................................................................................................... 37

Table 20: Electronic characteristic.....................................................................................................................................38

Table 21: Electronic characteristic.....................................................................................................................................39

Table 22: Pin description................................................................................................................................................... 39

Table 23: Electronic characteristic.....................................................................................................................................40

Table 24: Pin description................................................................................................................................................... 40

Table 25: LED status......................................................................................................................................................... 41

Table 26: Control status.....................................................................................................................................................42

Table 27: Electronic characteristic.....................................................................................................................................42

Table 28: Pin description................................................................................................................................................... 43

Table 29: Timing parameters............................................................................................................................................. 44

Table 30: Timing parameters............................................................................................................................................. 45

Table 31: Electronic characteristic.....................................................................................................................................46

Table 32: Electronic Characteristics..................................................................................................................................48

Table 33: Electronic characteristic.....................................................................................................................................48

Table 34: Conducted transmission power..........................................................................................................................49

Table 35: Operating frequencies........................................................................................................................................ 49

Table 36: Conducted receive sensitivity............................................................................................................................ 49

Table 37: HSDPA throughout............................................................................................................................................ 49

Table 38: Absolute maximum ratings................................................................................................................................51

Table 39: Recommended operating ratings....................................................................................................................... 51

Table 40: Operating temperature....................................................................................................................................... 51

Table 41: Operating Modes Overview...............................................................................................................................52

Table 42: Current consumption......................................................................................................................................... 53

Table 43: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)............................................54

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Table 43: SIM5320ALD GPIOs list.................................................................................................................................. 58

Table 44: Digital I/O characteristics.................................................................................................................................. 58

Table 45: Related documents.............................................................................................................................................59

Table 46: Terms and Abbreviations................................................................................................................................... 60

Table 47: Safety caution.................................................................................................................................................... 63

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Figure Index

Figure 1: SIM5320ALD functional architecture............................................................................................................... 11

Figure 2: Pin view..............................................................................................................................................................14

Figure 3: Top dimensions (Unit: mm)............................................................................................................................... 19

Figure 4: Side dimensions (Unit: mm).............................................................................................................................. 19

Figure 5: Bottom dimensions (Unit: mm)......................................................................................................................... 20

Figure 6: Footprint recommendation (Unit: mm)..............................................................................................................20

Figure 8: VBAT input application circuit.......................................................................................................................... 22

Figure 9: Reference circuit of the LDO power supply...................................................................................................... 22

Figure 10: Reference circuit of the DCDC power supply................................................................................................. 23

Figure 11: RTC supply from capacitor.............................................................................................................................. 24

Figure 12: RTC supply from non-chargeable battery........................................................................................................24

Figure 13: RTC supply from rechargeable battery............................................................................................................ 24

Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic.................................................................................25

Figure 15: Power on Timing Sequence..............................................................................................................................26

Figure 16: Power off timing sequence...............................................................................................................................27

Figure 17: Full modem...................................................................................................................................................... 28

Figure 18: Null modem......................................................................................................................................................29

Figure 19: RI behaviour in NULL Modem........................................................................................................................30

Figure 20: RI behaviour in FULL Modem........................................................................................................................ 30

Figure 21: Speaker interface configuration....................................................................................................................... 32

Figure 22: Receiver interface configuration......................................................................................................................32

Figure 23: Microphone interface configuration.................................................................................................................33

Figure 24: USIM interface reference circuit......................................................................................................................35

Figure 25: Amphenol SIM card socket..............................................................................................................................36

Figure 26: Reference circuit.............................................................................................................................................. 38

Figure 27: USB interface................................................................................................................................................... 39

Figure 28: Application circuit............................................................................................................................................42

Figure 29: Flight mode switch...........................................................................................................................................43

Figure 30: Synchrony timing............................................................................................................................................. 44

Figure 31: EXT CODEC to MODULE timing..................................................................................................................45

Figure 32: MODULE to EXT CODEC timing..................................................................................................................45

Figure 33: Synchrony timing............................................................................................................................................. 46

Figure 34: EXT CODEC to MODULE timing..................................................................................................................46

Figure 35: MODULE to EXT CODEC timing..................................................................................................................46

Figure 36: Current drive.................................................................................................................................................... 48

Figure 37: Reset circuit......................................................................................................................................................48

Figure 38: Reference circuit.............................................................................................................................................. 49

Figure 39: Antenna matching circuit................................................................................................................................. 51

Figure 40: Top and bottom view of SIM5320ALD........................................................................................................... 56

Figure 41: The ramp-soak-spike reflow profile of SIM5320ALD.................................................................................... 56

Figure 42: Recommended pad........................................................................................................................................... 57

Figure 43: System design...................................................................................................................................................58

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Revision History

Data

Version

Description of change

Author

2014-08-20

1.01

Original

Libing

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1 Introduction

1.1 Product Outline

1.2 Hardware Interface Overview

● Power Supply

● USB Interface

● Serial Interface

● Analog Audio Interfaces (SIM5320ALD only)

● SIM Interface

● GPIO

● ADC

● LDO Power Output

● Sink Current Source

● Keypad Interface

● SPI Interface

● RTC

● I2C Interface

1.3 Hardware Diagram

This document describes electronic specifications, RF specifications, function interface, mechanical

characteristic and testing conclusions of the SIMCom SIM5320ALD module. With the help of this

document and other SIM5320ALD software application notes, user guides, users can quickly understand

and use SIM5320ALD module to design and develop applications quickly.

Designed for global market, SIM5320ALD is a dual-band UMTS /HSDPA that works on frequencies of

WCDMA 1900/850MHz. The SIM5320ALD support HSDPA.

With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320ALD can meet almost any

space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,

machine-to-machine, vehicle applications, etc..

There are 80 pins on SIM5320ALD, which provide most application interfaces for customers’ board.

Sub-interfaces are described in detail in the next chapter, which includes:

The global architecture of the SIM5320ALD Embedded module is described in the figure below.

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1.4 Functional Overview

● Dual-mode UMTS/HSDPA operation

● UMTS R99 data rates-384 kbps DL/UL

● HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps

● CSD feature: 9.6, 14.4, 64 kbps UL/DL

● Half Rate (ETS 06.20)

● Full Rate (ETS 06.10)

● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)

● AMR (WCDMA)

●

A5/1, A5/2, and A5/3 ciphering

● MT, MO, CB, Text and PDU mode

● SMS storage: SIM card

● Support transmission of SMS alternatively over CSD. User can

● Serial Port standard or null modem mode on Serial Port Interface

● Serial Port can be used to control module by sending AT command

Figure 1: SIM5320ALD functional architecture

Table 1: General Feature

Feature Implementation

Power supply Single supply voltage 3.3～4.2V

Transmission data

Speech codec modes:

Audio features (SIM5320ALD only)

SMS

choose preferred mode.

SIM interface Support identity card: 1.8V, 3V.

Serial interface

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●

Operation temperature: -30°C to +80°C

●

Storage temperature -40°C to +85°C

2 Package Information

2.1 Pin Configuration

USB Support USB2.0 Slave mode

Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.

SIM application toolkit

Support SAT class 3, GSM 11.14 Release 98 Support USAT

Real Time Clock Support RTC

Timer function Programmable by AT command

Physical characteristics

PCM (SIM5320ALD only)

Size:30*30*2.9mm Weight:5.6g

Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (-law or A-law) and 16 bit (linear).

Firmware upgrade Firmware upgrade over USB interface

Temperature range

All hardware interfaces which connect SIM5320ALD to customers’ application platform are through 80

pins pads (Metal half hole). Figure 2 is SIM5320ALD outline diagram.

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Figure 2: Pin view

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Table 2: Pin definition

Pin No. Define Pin No. Define

1 GND 2 GND

3 POWER_ON 4 RESET

5 GND 6 SPI_CLK

7 SPI_MISO_DATA 8 SPI_MOSI_DATA

9 SPI_CS_N 10 GND

11 USB_VBUS 12 USB_DM

13 USB_DP 14 GND

15 RESERVED 16 RESERVED

17 USIM_DATA 18 USIM_RESET

19 USIM_CLK 20 V_USIM

21 NC 22 NC

25 NC 26 NC

27 KEYSENSE_N1 28 KEYSENSE_N0

29 KEYPAD_0 30 KEYPAD_2

31 KEYSENSE_N2 32 KEYSENSE_N3

33 KEYPAD_1 34 KEYPAD_4

35 KEYPAD_3 36 KEYSENSE_N4

37 GND 38 VBAT_BB

39 VBAT_BB 40 GND

41 GND 42 VRTC

43 GND 44 VREG_AUX

45 CURRENT_SINK 46 ADC2

47 ADC1 48 GPIO44

49 GPIO40 50 GPIO43

51 GPIO1 52 GPIO41

53 GPIO42 54 GPIO4

55 I2C_SCL 56 I2C_SDA

57 GND 58 GND

59 MAIN_ANT 60 GND

61 GND 62 VBAT_RF

63 VBAT_RF 64 GND

65 GND 66 UART_RTS

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2.2 Pin description

USIM_DATA

I/O

SIM Data Output/Input

USIM_CLK

SIM Clock

USIM_RESET

SIM Reset

67 UART_CTS 68 UART_RXD

69 UART_RI 70 UART_DCD

71 UART_TXD 72 UART_DTR

73 NC 74 NC

75 NC 76 NC

77 GND 78 GND

79 GPS_ANT 80 GND

Table 3: Pin description

Pin name I/O Description Comment

Power Supply

VBAT_RF/VBAT_BB Power supply voltage

VRTC I/O Power supply for RTC

VREG_AUX O LDO power output

GND Ground

Power on/off

POWER_ON should be pulled low at

POWER_ON I

least 64ms to power on or 500ms to power off the module.

Audio interface

MIC1P

I Differential audio input

MIC1N

EAR1P

EAR1N

Differential audio output

SPK_P

SPK_N

USIM interface

V_USIM O

Voltage Supply for SIM card Support 1.8V or 3V SIM card

If it is unused, keep open.

If it is unused, connect to ground through a 100N capacitor.

If these pins are unused ， keep open.

All signals of SIM

interface should be

protected against

ESD/EMC.

SPI interface

SPI_CLK O SPI clock

SPI_CS_N O SPI chip-select

If it is unused, keep open.

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USB_VBUS

USB power supply input

They are compliant with

the USB 2.0 specification.

If it is unused, keep open. USB_DP

I/O

Plus (+) line of the differential, bi-directional USB signal to/from the

peripheral device.

USB_DM

I/O

Minus (-) line of the differential, bi-directional USB signal to/from the

peripheral device.

UART_RXD

Receive Data

UART_RXD has been

pulled down with a 12kR

resistor to ground in the

module.

If it is unused, keep open.

UART_TXD

Transmit Data

UART_RTS

Request to send

UART_CTS

Clear to Send

UART_RI

Ring Indicator

UART_DTR

I/O

DTE get ready

UART_DCD

Carrier detects

SPI_MOSI_DATA O

SPI_MISO_DATA I

USB

Serial interface

SPI (master only) master out/slave in

data

SPI (master only) master in/slave out

data

I2C interface

I2C_SDA I/O I2C data

I2C_SCL O I2C clock output

Keypad interface

KEYPAD_0 O Bit 0 drive to the pad matrix

KEYPAD_1 O Bit 1 drive to the pad matrix

KEYPAD_2 O Bit 2 drive to the pad matrix

KEYPAD_3 O Bit 3 drive to the pad matrix

KEYPAD_4 O Bit 4 drive to the pad matrix

KEYSENSE_N0 I

KEYSENSE_ N1 I

KEYSENSE_ N2 I

KEYSENSE_ N3 I

KEYSENSE_ N4 I

PCM interface

PCM_DIN/GPIO0 I

Bit 0 for sensing key press on pad

matrix

Bit 1 for sensing key press on pad matrix

Bit 2 for sensing key press on pad matrix

Bit 3 for sensing key press on pad matrix

Bit 4 for sensing key press on pad matrix

General Input PIN with module wake/interrupt. It also can be multiplexed as the PCM_DIN pin.

Pulled up with a 2.2kR resistor to 2.6V internally. If it is unused, keep open.

All Keypad pins can be configured as GPIOs. If it is unused, keep open.

If it is unused, keep open.

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2.3 Package Dimensions

PCM_SYNC/GPIO2 I

PCM_CLK/GPIO3 O

PCM_DOUT/GPIO5 O

General Input PIN. It also can be multiplexed as the PCM_SYNC pin.

General Output PIN. It also can be multiplexed as the PCM_CLK pin.

General Output PIN. It also can be multiplexed as the PCM_DOUT pin.

GPIOs

GPIO1 O

Output PIN as LED control for network status.

GPIO4 I Input PIN as RF operating control.

GPIO40 O

Output PIN as operating status indicating of module.

General input/output PIN. It can be

GPIO41 I/O

used as wake/interrupt signal to host from module

General input/output PIN. It can be

GPIO43 I/O

used as wake/interrupt signal to module from host.

GPIO44 I/O General input/output PIN.

GPIO42 I/O General input/output PIN.

Other interface

If it is unused, keep open.

RESET I System reset in, active low.

CURRENT_SINK I

Current source of ground-referenced current sink

ADC1 I Analog Digital Converter Input

ADC2 I Battery temperature ADC input pin

MAIN_ANT I/O ANT soldering pad

The following figure shows mechanical dimensions of SIM5320ALD.

Refer to 3.13.1

Refer to 3.13.3

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Figure 3: Top dimensions (Unit: mm)

Figure 4: Side dimensions (Unit: mm)

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Figure 5: Bottom dimensions (Unit: mm)

2.4 Footprint Recommendation

Figure 6: Footprint recommendation (Unit: mm)

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3 Application Interface Specification

3.1 Power Supply

3.1.1 Power Supply Pin

3.1.2 Design Guide

The power supply pins of SIM5320ALD include VBAT_RF and VBAT_BB. VBAT_RF directly supplies

the power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the current

consumption rises typically to peak of more than 2A. So the power supply must be able to provide

sufficient current up to more than 2A. The following figure is the VBAT_RF voltage ripple wave at the

maximum power transmit phase.

Please refer to Figure 8—Application circuit VBAT_RF=4.0V, VBAT maximum output current =2A,

CA=100 µF tantalum capacitor (ESR=0.7Ω) and CB=1µF.

Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage.

Table 4: Pin description

Pin type Pin name Min Typ Max Unit

VBAT_RF 3.3 3.8 4.2 V

POWER

VBAT_BB 3.3 3.8 4.2 V

Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF

is for RF section and VBAT_BB is for baseband system.

2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2

Note2.

Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input

voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current

consumption rises up to more than 2A. If the power voltage drops below 3.3V, the module may be shut

down automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the

voltage drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical

1000uF) to storage electric power.

For the consideration of RF performance and system stability, another large capacitor (above 100uF)

should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF)

need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put

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beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the

power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following

figure is the recommended circuit.

Figure 8: VBAT input application circuit

There are three sections about how to design and optimize users’ power systems.

Power supply circuit

We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak

current of power components can rise up to more than 2A. The following figure is the reference design of

+5V input power supply. The designed output for the power supply is 4.1V, here a linear regulator can be

used.

Figure 9: Reference circuit of the LDO power supply

If there is a big difference between the input voltage and the desired output (VBAT), a switching converter

power will be preferable because of its better efficiency, especially at the high current situation. The

following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple

current intrinsically.

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3.1.3 RTC Backup

 External capacitor backup

Figure 10: Reference circuit of the DCDC power supply

Voltage monitor

To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two

parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual

value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the

measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For

example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is

low: 3.3v”.

If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module

will be powered off automatically and AT commands cannot be executed any more.

Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.

Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate

value. Please refer to Document [1].

The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at

no power supply status. The RTC power supply of module can be provided by an external capacitor or a

battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference

circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the

AT commands “AT+CTZU” and “AT +CTZR”.

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Figure 11: RTC supply from capacitor

 Non-chargeable battery backup

 Rechargeable battery backup

Figure 12: RTC supply from non-chargeable battery

Figure 13: RTC supply from rechargeable battery

Note: The VRTC can be disabled, jus disconnect it in application circuit.

Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.

Typical charge-discharge curves for this battery are shown in the following figure.

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3.2 Power on/off Time Sequence

3.2.1 Power on Sequence

Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic

SIM5320ALD can be powered on by POWER_ON pin, which starts normal operating mode.

POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the

SIM5320ALD by pulling the POWER_ON pin down for a short time. The power-on scenarios are

illustrated in the following figures.

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Figure 15: Power on Timing Sequence

Table 5: Power on timing

Time value

Parameter Description

Unit

Min. Typ. Max.

Ton The time to pull POWER_ON down to power on 64 180 - ms

TpD+ The time to indicate connecting with the network - - 5.5 s

Tpw+

The time to indicate the module is powered on

completely

4.5 s

Tuart The time to enable UART - - 5 s

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3.2.2 Power off Sequence

● Method 1: Power off SIM5320ALD by pulling the POWER_ON pin down

● Method 2: Power off SIM5320ALD by AT command

Tusb The time to enable USB - - 9 s

Note: Module could be automatically power on by connecting Power ON pin to Low level directly.

Before designing, please refer to Document [25] for more detail.

The following methods can be used to power down SIM5320ALD. These procedures will make module

disconnect from the network and allow the software to enter a safe state, and then save data before

completely powering the module off.

User can power off the SIM5320ALD by pulling POWER_ON down for a specific time. The power off

scenario is illustrated in the following figure.

Figure 16: Power off timing sequence

Table 6: Power off timing

Time value

Parameter Description

Min. Typ. Max. Unit

Toff The time pulling POWER_ON down to power off 0.5 - 5 s

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3.3 UART Interface

TpD- The time to indicate disconnecting from the network - - 7 s

Tpw- The time to indicate the module power off completely - - 7.5 s

Tuart_off The time to disable UART - - 6 s

Tusb_off The time to disable USB - - 7.5 s

Tona The time to power on again after Tpw- 0 - - s

User can also use the AT command “AT+CPOF” to power down the module. After that, the AT commands

cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.

For details, refer to Document [1].

SIM5320ALD provides a UART (universal asynchronous serial transmission) port. It consists of a flexible

7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is

as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed

through UART interface.

In order to prevent the UART signals of the module damaged due to voltage spikes or ESD, some resistors

can be added on UART signals. The values of resistors are adjusted according to the actual circuit. The

resistors should be placed close to the module.

The application circuit is in the following figures.

Figure 17: Full modem

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Figure 18: Null modem

3.3.1 Pin Description

Table 7: Pin description

Pin type Pin name Pin No. I/O Active voltage Default Status

UART_RXD 68 I H Pull-Down

UART_TXD 71 O H Pull-Up

UART_RTS 66 O H

UART

UART_CTS 67 I H Pull-Up

UART_DTR 72 I H Pull-Up

UART_DCD 70 O H

UART_RI 69 O H

More pin information refers to chapter 2.2.

Table 8: Logic level

Parameter Min Max Unit

Logic low input 0 0.3*VDD_EXT V

Logic high input 0.7 *VDD_EXT VDD_EXT +0.3 V

Logic low output GND 0.2 V

Logic high output VDD_EXT -0.2 VDD_EXT V

Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.

All pins of all serial ports have 8mA driver capacity.

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3.3.2 Application Guide

If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it

will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC

reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until

the master clears the interrupt event with AT command.

Figure 19: RI behaviour in NULL Modem

If Full Modem is used to establish communication between devices, the pin “RI” is another operation

status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for

about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is

answered or hung up.

Figure 20: RI behaviour in FULL Modem

To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320ALD

to the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually.

SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information

please refers to the RS-232 chip datasheet.

Note: SIM5320ALD supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,

230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.

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3.4 USIM Interface

3.4.1 Pin description

3.4.2 Application Guide

Pin name

3.0V mode 1.8V mode

Min Typ Max Min Typ Max

V_USIM 2.7 3.00 3.3 1.65 1.8 2.0

USIM_RESET 0.8* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM

USIM_CLK 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM

USIM_DATA 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM

Pin name Pin Description

USIM_CLK 19 USIM Card Clock USIM_RESET 18 USIM Card Reset

USIM_DATA 17

USIM Card data I/O, which has been pulled up with a 22kR resistor to V_USIM in module. Do not pull up or pull down in users’ application circuit.

V_USIM 20

USIM Card Power output depends automatically on USIM mode，one is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.

The USIM provides the required subscription verification information to allow the mobile equipment to

attach to a UMTS network. Both 1.8V and 3.0V SIM Cards are supported.

Table 14: Electronic characteristic

Table 15: Pin description

It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON

SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card

socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.

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3.4.3 Recommend Components

Figure 24: USIM interface reference circuit

Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM

is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to

document [1].

For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit

http://www.amphenol.com for more information about the holder.

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3.5 I2C Interface

Figure 25: Amphenol SIM card socket

Table 16: Amphenol USIM socket pin description

Pin Signal Description

SIM Card Power supply, it can identify automatically the

C1 USIM_VDD

SIM Card power mode ， one is 3.0V±10%, another is

1.8V±10%.

C2 USIM_RST SIM Card Reset.

C3 USIM_CLK SIM Card Clock.

C5 GND Connect to GND. C6 VPP Connect to USIM_VDD C7 USIM_DATA SIM Card data I/O.

I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or

receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write

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3.5.1 Pin Description

3.5.2 Signal Description

3.5.3 Design Guide

3.6 Keypad Interface

3.6.1 Pin Description

Pin name Pin No. Function

I2C_SDA 56 Serial interface data input and output

I2C_SCL 55 Serial interface clock input

Table 17: Pin description

Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor

respectively. When the bus is free, both lines are high.

For SIM5320ALD, the data on the I2C bus can be transferred at rates up to 400kbps. The number of

peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note

that PCB traces length and bending are in users’ control to minimize load capacitance.

Note：I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need

to pull them up in users’ application circuit.

SIM5320ALD module provides a keypad interface that supports five sense lines, or columns, and five

keypad rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V.

Table 18: Pin description

Pin name Pin No. Function

KEYSENSE_N0 28 KEYSENSE_N1 27 KEYSENSE_N2 31

Sensing keys

KEYSENSE_N3 32

KEYSENSE_N4 36

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3.6.2 Application Guide

KEYPAD_0 30 KEYPAD_1 29 KEYPAD_2 30

Driving pads KEYPAD_3 35 KEYPAD_4 34

All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure.

Figure 26: Reference circuit

If these pins are configured for GPIOs, the sequence is listed in the following table.

Table 19: GPIO configuration

Keypad interface GPIO No.

KEYPAD_4 GPIO6

KEYPAD_3 GPIO7

KEYPAD_2 GPIO8

KEYPAD_1 GPIO9

KEYPAD_0 GPIO10

KEYSENSE_N4 GPIO11

KEYSENSE_N 3 GPIO12

KEYSENSE_N 2 GPIO13

KEYSENSE_N 1 GPIO14

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3.7 USB Interface

Pin name

Pin No. Input voltage scope( V )

Min

Typ

Max

USB_VBUS

4.4

5.0

5.25

USB_DP

They are compliant with the USB 2.0 specification. USB_DM

3.7.1 Application Guide

KEYSENSE_N 0 GPIO15

Note: Refer to document [21] for detailed information of Keypad Application Note.

SIM5320ALD module contains a USB interface. This interface is compliant with the USB2.0 specification.

The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely

low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is

not supported.

Table 20: Electronic characteristic

Currently SIM5320ALD supports the USB suspend and resume mechanism which can help to save power.

If no transaction is on USB bus, SIM5320ALD will enter suspend mode. When some events such as voice

call or receiving SMS happen, SIM5320ALD will resume normal mode automatically.

Figure 27: USB interface

Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component

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3.8 SPI Interface

3.8.1 Pin Description

3.9 GPIO Interface

3.9.1 Pin Description

Pin name Pin No. Function

SPI_CS 9 SPI chip-select; not mandatory in a point-to-point connection

SPI_MISO_DATA 7 SPI master in/slave out data

SPI_CLK 6 SPI clock

SPI_MOSI_DATA 8 SPI master out/slave in data

on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.

Note：The SIM5320ALD has two kinds of interface (UART and USB) to connect to host CPU. USB interface is mapped

to five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”,

“SIMTECH Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.

SPI interface of SIM5320ALD is master only. It provides a duplex, synchronous, serial communication

link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz.

Table 21: Electronic characteristic

Pin name

1.8V mode

Min Typ Max

SPI_CLK 1.65 1.8 1.95

SPI_CS_N 1.65 1.8 1.95

SPI_MOMI_DATA 1.65 1.8 1.95

SPI_MIMO_DATA 1.65 1.8 1.95

Table 22: Pin description

SIM5320ALD provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs.

User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.

Table 23: Electronic characteristic

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3.9.2 Application Guide

Pin name

2.6V mode

Min Typ Max

GPIO1 2.5 2.6 2.7

GPIO4 2.5 2.6 2.7

GPIO40 2.5 2.6 2.7

GPIO41 2.5 2.6 2.7

GPIO43 2.5 2.6 2.7

GPIO44 2.5 2.6 2.7

GPIO42 2.5 2.6 2.7

Pin name Pin No. I/O Function

GPIO1 51 O

Output PIN as LED control for network status. If it is

unused, left open.

GPIO4 54 I

Input PIN as RF operating control. H: Normal Mode L:Flight Mode

If it is unused, left open.

GPIO40 49 O

Output PIN as operating status indicating of module. H: Power on L: Power off

If it is unused, left open.

GPIO41 52 I/O

General input/output PIN. It can be used as wake/interrupt

signal to host from module If it is unused, left open.

GPIO42 53 I/O General Purpose Input/Output Port.

GPIO43 50 I/O

General Purpose Input/Output Port. It can be used as

wake/interrupt signal to module from host. If it is unused, left

open.

GPIO44 48 I/O General Purpose Input/Output Port

Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as KEYPAD.

Please refer to GPIO list.

Table 24: Pin description

Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.

Network status

GPIO1 is used to control Network Status LED; application circuit is shown below.

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Figure 28: Application circuit

Note: The value of resistor Rx depends on LED characteristic.

Table 25: LED status

LED Status Module Status

Always On Searching Network/Call Connect 200ms ON, 200ms OFF Data Transmit 800ms ON, 800ms OFF Registered network

Off Power off / Sleep

Flight mode control

GPIO4 controls SIM5320ALD module to enter or exit the Flight mode. In Flight mode, SIM5320ALD

closes RF function to prevent interference with other equipments or minimize current consumption.

Bidirectional ESD protection component is suggested to add on GPIO4.

Figure 29: Flight mode switch

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3.9.3 Pin Description

3.9.4 Signal Description

Table 26: Control status

GPIO4 Status Module operation

Low Level Flight Mode: RF is closed. High Level Normal Mode: RF is working.

Note

：

1. When the module is powered off, make sure all digital interfaces (UART, etc) connected with peripheral devices have

no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in GPIO

pins because current leakage from above digital interfaces may occur.

Table 27: Electronic characteristic

Pin name

DC Characteristics

Min Typ Max

PCM_CLK -0.3 2.6 2.9

PCM_SYNC -0.3 2.6 2.9

PCM_DOUT -0.3 2.6 2.9

PCM_DIN -0.3 2.6 2.9

Table 28: Pin description

Pins Pin No.

AUX_PCM

functionality

Primary PCM

functionality

Description

PCM_DIN/GPIO0 74 AUX_PCM_DIN PCM_DIN PCM data input

PCM_SYNC/GPIO2 75 AUX_PCM_SYNC PCM_SYNC PCM data synchrony

PCM_DOUT/GPIO5 73 AUX_PCM_DOUT PCM_DOUT PCM data output

PCM_CLK/GPIO3 76 AUX_PCM_CLK PCM_CLK PCM data clock

The default PCM interface in SIM5320 is the auxiliary PCM interface. The data changes on the high level

of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is disabled

after every power-on or every reset event. So user must use AT command to enable the primary PCM

mode after powering on or resetting the module every time if user wants to use Primary PCM.SIM5320

PCM Interface can be operated in Master or Slave mode if it is configured to primary PCM. In Master

Mode, the Module drives the clock and sync signals that are sent to the external codec. When it is in Slave

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Figure 30: Synchrony timing

Figure 31: EXT CODEC to MODULE timing

Figure 32: MODULE to EXT CODEC timing

Mode, the external codec drives the clock and sync signals which are sent to the module. Both PCM

modes are discussed in this section followed by additional PCM topics.

Auxiliary PCM (128 KHz PCM clock)

-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard



long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.

Most-law codec support the 128 KHz clock.

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Table 29: Timing parameters

Parameter Description Min Typ Max Unit

T(auxsync) AUX_PCM_SYNC cycle time – 125 - μs

T(auxsynch) AUX_PCM_SYNC high time 62.4 62.5 - μs

T(auxsyncl) AUX_PCM_SYNC low time 62.4 62.5 - μs

T(auxclk)* AUX_PCM_CLK cycle time - 7.8 – μs

T(auxclkh) AUX_PCM_CLK high time 3.8 3.9 – μs

T(auxclkl) AUX_PCM_CLK low time 3.8 3.9 – μs

T(suauxsync)

T(hauxsync)

T(suauxdin)

T(hauxdin)

T(pauxdout)

AUX_PCM_SYNC setup time high before

falling edge of PCM_CLK

AUX_PCM SYNC hold time after falling edge

of PCM_CLK

AUX_PCM_DIN setup time before falling

edge of AUX_PCM_CLK

AUX_PCM_DIN hold time after falling edge

of AUX_PCM_CLK

Delay from AUX_PCM_CLK rising to

AUX_PCM_DOUT valid

1.95 – – μs

70 – – ns

20 – – ns

– – 50 ns

*Note: T(auxclk) = 1/(128 KHz).

Primary PCM (2048 KHz PCM clock)

SIM5320 also supports 2.048 MHz PCM data and sync timing for -law codec. This is called the primary

PCM interface. User can use AT command to take the mode you want as discussed above.

Figure 33: Synchrony timing

Figure 34: EXT CODEC to MODULE timing

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3.10 Multi-functional interface

Figure 35: MODULE to EXT CODEC timing

Table 30: Timing parameters

Parameter Description Min Typ Max Unit

T(sync) PCM_SYNC cycle time – 125 – μs

T(synch) PCM_SYNC high time 400 500 – ns

T(syncl) PCM_SYNC low time – 124.5 – μs

T(clk) PCM_CLK cycle time – 488 – ns

T(clkh) PCM_CLK high time – 244 – ns

T(clkl) PCM_CLK low time – 244 – ns

T(susync)

T(hsync)

T(sudin)

T(hdin)

PCM_SYNC setup time high before falling edge of

PCM_CLK

PCM_SYNC hold time after falling edge of

PCM_CLK

PCM_DIN setup time before falling edge of

PCM_CLK

PCM_DIN hold time after falling edge of

PCM_CLK

60 – – ns

50 – – ns

10 – – ns

T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid – – 350 ns

T(zdout)

Note: SIM5320 can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more

information of PCM Application Note.

Delay from PCM_CLK falling to PCM_DOUT

HIGH-Z

– 160 – ns

SIM5320ALD merges functions for various applications. It can enrich users’ design and lower the cost of

users’ hardware.

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3.10.1 Sink Current Source

3.10.2 Reset Function

The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this

implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain

a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.

Table 31: Electronic characteristic

Symbol Description Min Typ Max Unit

CURRENT_SINK Input voltage 0.5 VDD 5 V

Input current - - 150 mA

Since the driver is ground-referenced current sink, the operating device it drives must form a current path

between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference.

Figure 36: Current drive

Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>,

<value>”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA.

SIM5320ALD also have a RESET pin (PIN4) to reset the module. This function is used as an emergency

reset only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the

RESET pin to ground, then the module will reset.

This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor

close to the RESET pin is strongly recommended. A reference circuit is recommended in the following

figure.

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3.10.3 ADC

Figure 37: Reset circuit

Note：50ms<t<200ms. ESD components are suggested to be used on Reset pin.

SIM5320ALD has a dedicated ADC that is available for digitizing analog signals such as battery voltage

and so on; it is on PIN 47 and PIN 46 , namely ADC1 and ADC2 . This ADC is 12 bit

successive-approximation circuit, and electronic specification is shown in the following table.

Table 32: Electronic Characteristics

Specification Min Typ Max Unit Comments/Conditions

Resolution 12 Bits Differential nonlinearity -4 +4 LSB Integral nonlinearity -8 +8 LSB Gain Error -2.5 +2.5 %

Analog Vdd = ADC reference

2.4MHz sample rate

Offset Error -4 +40 LSB Input Range GND 2.2V V

Input serial resistance 2 kΩ Sample and hold switch resistance

Input capacitance 53 pF

Power-down to wakeup 9.6 19.2 μs

User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw

data which is between 0 and 4095. The data can be transformed to any type such as voltage, temperature

etc. Please refer to document [1].

Figure 38: Reference circuit

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3.10.4 LDO

4 RF Specification

4.1 RF Specification

Note: The input signal voltage value in ADC must not be higher than 2.2V.

SIM5320ALD has a LDO power output, namely VREG_AUX. The LDO is available and output voltage is

2.85v by default, rated for 250mA. User can switch the LDO on or off by the AT command

“AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.

Table 33: Electronic characteristic

Symbol Description Min Typ Max Unit

VREG_AUX Output voltage 1.5 2.85 3.05 V

Output current - - 250 mA

Table 34: Conducted transmission power

Frequency Max Min

WCDMA 1900 24dBm +1/-3dB -56dBm ±5dB WCDMA 850 24dBm +1/-3dB -56dBm ±5dB

Table 35: Operating frequencies

Frequency Receiving Transmission

WCDMA1900 1930～1990 MHz 1850～1910 MHz

WCDMA 850 869 ～894 MHz 824 ～849 MHz

Table 36: Conducted receive sensitivity

Frequency Receive sensitivity

WCDMA 1900 < -108dBm WCDMA 850 < -106dBm

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4.2 Operating Specification

4.3 Antenna Design Guide

● WCDMA 1900<0.9dB

● WCDMA 850<0.5dB

SIM5320ALD can support high rate data by WCDMA wireless network. In the different network

environment, data transmission rate shifts depending on modulation and encoding.

Table 37: HSDPA throughout

Category Supported

Max supported

HS-DSCH codes

Theoretical max

peak rate(Mbps)

Modulation

Category1 5 1.2 16QAM,QPSK

Category2 5 1.2 16QAM,QPSK

Category3 5 1.8 16QAM,QPSK

Category4 5 1.8 16QAM,QPSK

Category5

Category6



5 3.6 16QAM,QPSK

Category7 10 7.2 16QAM,QPSK

Category8 10 7.2 16QAM,QPSK

Category9 15 10.0 16QAM,QPSK

Category10 15 14.0 16QAM,QPSK

Category11 5 0.9 QPSK

Category12

Note: Actual throughout rates depend on network configuration, network loading, signal condition and so on.



5 1.8 QPSK

SIM5320ALD provides RF antenna interface. Customer’s antenna should be located in the host board and

connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace

impedance must be controlled in 50Ω.The maximum gain of the Main antenna gain should not exceed

1dBi considering the SAR radio. No antenna gain may be used that would exceed the 2W EIRP power

limit in 1900MHz band.The input impendence of the antenna should be 50Ω, and the VSWR should be

less than 2.

SIMCom recommends that the total insertion loss between the antenna pad and antenna should meet the

following requirements:

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit

should be added. The following figure is the recommended circuit.

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Figure 39: Antenna matching circuit

In this figure, the components R1,C1,C2 and R2 is used for antenna matching, the value of components

can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R1,

R2 are 0 ohm resistors, and the C1, C2 are reserved for tuning.

The RF test connector in the figure is used for the conducted RF performance test, and should be placed as

close as to the module’s antenna pin. The traces impedance between components must be controlled in

50ohm.

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5 Reliability and Operating Characteristics

5.1 Electronic Characteristics

5.2 Operating Mode

Absolute maximum rating for digital and analog pins of SIM5320ALD are listed in the following table:

Table 38: Absolute maximum ratings

Parameter Min Max Unit

Voltage at digital pins (1.8v mode) -0.3 1.8+0.3 V Voltage at digital pins (2.6v mode) -0.3 2.6+0.3 V Voltage at VBAT -0.5 6.0 V Voltage at VRTC 1.5 3.2 V Voltage at USB_VBUS -0.5 6.0 V

Table 39: Recommended operating ratings

Parameter Min Typ Max Unit

Voltage at digital pins (1.8v mode) 1.65 1.8 1.95 V Voltage at digital pins (2.6v mode) 2.5 2.6 2.7 V Voltage at VBAT 3.3 3.8 4.2 V Voltage at VRTC 1.5 - 3.0 V Voltage at USB_VBUS 4.75 5 5.25 V

The operating temperature and power specification is listed in the following table.

Table 40: Operating temperature

Parameter Min Typ Max Unit

Ambient temperature -30 25 80 ℃

Storage temperature -40 25 +85 ℃

Note: SIMCom recommends user to install a heat sink on the module shielding case if SIM5320ALD operates in

WCDMA band.

The following table summarizes the various operating modes, each operating modes will be referred to in

the following chapters.

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5.2.1 Operating Modes Overview

Table 41: Operating Modes Overview

Module will automatically enter SLEEP mode if DTR is set to high

level and there is no on air or hardware interrupt (such as GPIO

interrupt or data on serial port).

In this case, the current consumption of module will be reduced to the

minimal level. In SLEEP mode, the module can still receive paging message，voice

call and SMS.

WCDMA WCDMA

IDLE

Module has registered to the WCDMA network, and the module is ready to communicate.

HSDPA

HSDPA IDLE

Module is ready for data transmission, but no data is currently sent or received. Power consumption depends on network settings and HSDPA configuration

5.2.2 Minimize Power Consumption

Mode Function

Sleep mode

Power down

Minimum functionality mode

WCDMA SLEEP

WCDMA TALK

Module is active in WCDMA mode. The power consumption depends on network settings.

There is HSDPA data transfer (PPP or TCP or UDP) in progress. In HSDPA DATA

this case, power consumption is related with network settings (e.g.

power control level), uplink/downlink data rates and HSDPA

configuration Module can be powered down by the AT command “AT+CPOF” or the POWER_ON

pin. The power management unit shuts down the power supply of the module, only the power supply of RTC is remained. The serial interface is not accessible. Operating voltage (connected to VBAT) remains applied.

The AT command “AT+CFUN” can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work or the SIM card will not be accessible, or both will be closed, and the serial port is still accessible. The power consumption in this mode is very low.

There are two modes that SIM5320ALD achieves low power consumption.

Sleep mode

If peripheral equipments stops working, and there is no on air or hardware interrupts (such as GPIO

interrupts or data on UART), SIM5320ALD will enter sleep mode automatically. In this mode, SIM5320ALD can still receive paging ， voice call or SMS from network. If USB interface of

SIM5320ALD is connected to host CPU, but host CPU does not support USB suspending, then

SIM5320ALD will not enter sleep mode. After USB is disconnected, SIM5320ALD will enter sleep mode.

Note: When UART interface is connected with host CPU, SIM5320ALD can not enter sleep mode until RXD is pulled

down by the host CPU. If the module is in the idle mode, make sure to pull the RXD to low level by host CPU. SIMCom

recommends using GPIO43 or UART_DTR to wake up the module from host CPU and to use GPIO41 or UART_RI to

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● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)

● AT+CFUN=4: Disable RF function of the module (Flight mode)

5.3 Current Consumption

wake up the host CPU. Before designing, pay attention to how to realize waking function and refer to Document[24] and

Document[25] for more detail.

Minimum functionality mode

Minimum functionality mode ceases a majority function of module, thus minimizing the power

consumption. This mode is set by the AT command which provides a choice of the functionality levels.

If SIM5320ALD has been set to minimum functionality mode, the module will firstly enter sleep mode,

then the RF function and SIM card function will be closed. In this case, the serial port is still accessible,

but RF function or SIM card will be unavailable. When SIM5320ALD is in minimum functionality or

flight mode, it can return to full functionality by the AT command “AT+CFUN=1”.

Note: For flight mode, please refer to Chapter3.9.2.

The current consumption in suspended mode and without USB connection is listed in the table below.

Here, “suspended mode” means that SIM5320ALD is connected to USB bus, but it does not transfer data.

Table 42: Current consumption

UMTS Sleep Mode (without USB connection)

Sleep @DRX=9 2.2mA

WCDMA 1900

Sleep @DRX=8 2.7 mA

Sleep @DRX=6 4.7mA

Sleep @DRX=9 2.2mA

WCDMA 850

Sleep @DRX=8 2.7 mA

Sleep @DRX=6 4.7mA

UMTS Sleep Mode (with USB suspended)

Sleep @DRX=9 2.4mA

WCDMA 1900

Sleep @DRX=8 2.8 mA

Sleep @DRX=6 4.8mA

Sleep @DRX=9 2.4mA

WCDMA 850

Sleep @DRX=8 2.8 mA

Sleep @DRX=6 4.8mA

HSDPA Data

WCDMA 1900

@Power 23dBm CQI=22 Typical 610mA @Power 21dBm CQI=5 Typical 540mA

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5.4 EMC and ESD Notes

@Power -5dBm CQI=22 Typical 270mA

@Power 23dBm CQI=22 Typical 550mA

WCDMA 850

@Power 21dBm CQI=5 Typical 490mA

@Power -5dBm CQI=22 Typical 220mA

EMC tests should be performed to detect any potential problems. Possible harmful emissions radiate by

the application to the RF receiver in the receiver band. It is recommended to shield the sensitive

components and trace with common ground and user can add beads where necessary.

Normally SIM5320ALD is mounted on customer host board. Although some ESD components have been

added in SIM5320ALD, to prevent ESD, user should put some ESD components on customers’ board. The

ESD components should be placed beside the connectors which human body might touch, such as SIM

card holder, switches, keys, etc. The following table is the SIM5320ALD ESD measurement performance;

the results are from SIMCom EVB test.

Table 43: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

Part Contact discharge Air discharge

VBAT,GND ±4KV ±6KV

UART,USB ±2KV ±6KV

Antenna port ±4KV ±6KV

Other ports ±2KV ±2KV

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6 Guide for Production

6.1 Top and Bottom View of SIM5320ALD

6.2 Typical Solder Reflow Profile

Figure 40: Top and bottom view of SIM5320ALD

These test points are only used for module manufacturing and testing. They are not for customer’s

application.

For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In

final board assembly, the typical solder reflow profile will be determined by the largest component on the

board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown

below is only a generic recommendation and should be adjusted to the specific application and

manufacturing constraints.

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Figure 41: The ramp-soak-spike reflow profile of SIM5320ALD

6.3 Moisture Sensitivity Level (MSL)

6.4 Stencil Foil Design Recommendation

For details about secondary SMT, please refer to document [24].

SIM5320ALD is qualified to Moisture Sensitivity Level (MSL) 5 in accordance with JEDEC J-STD-020.

After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment

(<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not

heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.

The recommended thickness of stencil foil is more than 0.15mm.

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6.5 Recommended Pad Design

Figure 42: Recommended pad

Note: More designing details refer to Figure 6.

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Appendix

A. System Design

Figure 43: System design

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B. SIM5320ALD GPIOs List

Table 43: SIM5320ALD GPIOs list

Name GPIO Index Default Function Alternate Function

STATUS_LED 1 Status led GPIO RF_SWITCH 4 RF Switch Enable/Disable RF subsystem KEYPAD_4 6 Keypad GPIO KEYPAD_3 7 Keypad GPIO KEYPAD_2 8 Keypad GPIO KEYPAD_1 9 Keypad GPIO KEYPAD_0 10 Keypad GPIO KEYSENSE_N4 11 Keypad GPIO KEYSENSE_N3 12 Keypad GPIO KEYSENSE_N2 13 Keypad GPIO KEYSENSE_N1 14 Keypad GPIO KEYSENSE_N0 15 Keypad GPIO UART1_CTS 33 CTS GPIO UART1_ RTS 34 RTS GPIO UART1_DTR 35 DTR wake up module GPIO UART_DCD 36 DCD GPIO UART_RI 37 RI wake up host GPIO GPIO40 40 Module power up status GPIO GPIO41 41 Wake up host GPIO GPIO42 42 GPIO GPIO GPIO43 43 Wake up module GPIO GPIO44 44 GPIO GPIO

C. Digital I/O Characteristics

Table 44: Digital I/O characteristics

Parameter Description

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

2.6V Mode 1.8V Mode Unit

Min Typ Max Min Typ Max

1.69 2.6 2.9 1.17 1.8 2.1 V

-0.3 0 0.91 -0.3 0 0.63 V

1.17 2.6 2.6 0.81 1.8 1.8 V

0 0 0.45 0 0 0.45 V

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Digital cellular telecommunications system (Phase 2) ； Mobile Station (MS) conformance specification ； Part 1: Conformance specification

Input high

leakage

- - 1 - - 1 uA

current

Input low

leakage

-1 - - -1 - - uA

current

Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, SPI and DEBUG. The

SIM5320ALD includes two kinds of voltages: 1.8v and 2.6v. Digital I/O specifications under both conditions are

presented in the above tables.

Input

capacitance

- - 7 - - 7 pF

D. Related Documents

Table 45: Related documents

SN Document name Remark

[1]

[2]

[3] GSM 07.07

[4] GSM 07.10 Support GSM 07.10 multiplexing protocol

[5] GSM 07.05

[6] GSM 11.14

[7] GSM 11.11

[8] GSM 03.38

SIM5320ALD_ATC_V1 .00

ITU-T Draft new recommendationV.25ter

SIM5320ALD_ATC_V1.00

Serial asynchronous automatic dialing and control

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information

[9] GSM 11.10

[10] 3GPP TS 51.010-1

[11] 3GPP TS 34.124

[12] 3GPP TS 34.121

Digital cellular telecommunications system (Release 5); Mobile

Station (MS) conformance specification

Electromagnetic Compatibility (EMC) for mobile terminals and

ancillary equipment.

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

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Technical Specification Group Radio Access Network; Terminal

[13] 3GPP TS 34.123-1

conformance specification; Radio transmission and reception (FDD)

[14] 3GPP TS 34.123-3

User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.

Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for

[15] EN 301 908-02 V2.2.1

IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article

3.2 of the R&TTE Directive

Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio

[16] EN 301 489-24 V1.2.1

equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)

[18] 3GPP TS 51.010-1

Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification

[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria

Directive of the European Parliament and of the Council of 27

[20] 2002/95/EC

January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

[21]

Keypad Application Note V1.01

[22] Sleep_Application_Note Sleep_Application_Note

[23] Waking_up_Applicatio

Waking_up_Application_Note

n_Note

[24]

[25]

Module

secondary-SMT-UGD

SIM5xxx_Automatic_powe

r_on_Application_Note

SMT Note

SIM5xxx_Automatic_power_on_Application_Note

E. Terms and Abbreviations

Table 46: Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter ARP Antenna Reference Point BER Bit Error Rate BTS Base Transceiver Station CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DRX Discontinuous Reception

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DSP Digital Signal Processor DTE Data Terminal Equipment (typically computer, terminal, printer) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FD SIM fix dialing phonebook FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate I2C Inter-Integrated Circuit IMEI International Mobile Equipment Identity Inorm Normal Current Imax Maximum Load Current kbps Kilo bits per second Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCS Personal Communication System, also referred to as GSM 1900 RF Radio Frequency RMS Root Mean Square (value) RTC Real Time Clock Rx Receive Direction SIM Subscriber Identification Module SMS Short Message Service SPI serial peripheral interface TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TX Transmit Direction UART Universal Asynchronous Receiver & Transmitter VSWR Voltage Standing Wave Ratio Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value

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VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value SM SIM phonebook NC Not connect EDGE Enhanced data rates for GSM evolution HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access ZIF Zero intermediate frequency WCDMA Wideband Code Division Multiple Access VCTCXO Voltage control temperature-compensated crystal oscillator USIM Universal subscriber identity module UMTS Universal mobile telecommunications system UART Universal asynchronous receiver transmitter

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F. Safety Caution

Table 47: Safety caution

Marks Requirements

When in a hospital or other health care facility, observe the restrictions about the use of

mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive

to not operate normally for RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden to prevent

interference with communication systems. Forget to think much of these instructions

may lead to the flight safety or offend against local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or

fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,

chemical plants or where blasting operations are in progress. Operation of any electrical

equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while

switched on. RF interference can occur if it is used close to TV sets, radios, computers

or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when

driving a vehicle, unless it is securely mounted in a holder for hands free operation.

Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular

networks and cannot be guaranteed to connect in all conditions, for example no mobile

fee or a invalid SIM card. While you are in this condition and need emergent help,

please remember using emergency calls. In order to make or receive calls, the cellular

terminal or mobile must be switched on and in a service area with adequate cellular

signal strength.

Some networks do not allow for emergency call if certain network services or phone

features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate

those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular

terminal or mobile.

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Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel: +86 21 3235 3300 Fax: +86 21 3235 3301 URL: www.sim.com/wm

Simcom 1403022014009 User Manual

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