Simcom 1103022011008 User Manual

SIM5320A_Hardware Design_V1.01

Smart Machine Smart Decision

Document Title
Version
Date
Status
Document Control ID

SIM5320A Hardware Design

1.01

2011-2-29

Release

SIM5320A_Hardware Design_V1.01

General Notes

SIMCom offers this information as a service to its customers, to support application and engineering

efforts that use the products designed by SIMCom. The information provided is based upon requirements

specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search

for additional relevant information, including any information that may be in the customer’s possession.

Furthermore, system validation of this product designed by SIMCom within a larger electronic system

remains the responsibility of the customer or the customer’s system integrator. All specifications supplied

herein are subject to change.

NOTICE:

This device complies with Part 15 of the FCC Rules [and with RSS-210 of Industry Canada].
Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause

undesired operation.

Changes or modifications made to this equipment not expressly approved by SIMCOM may void the
FCC authorization to operate this equipment.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generate s , uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in
a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

• Consult the dealer or an experienced radio/TV technician for help.

This Class [B] digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe [B] est conforme à la norme NMB-003 du Canada.

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Radiofrequency radiation exposure Information:

The module does not contain antenna. It has an antenna PIN. The module is to be used i n mobile
or fixed applications only. For other antenna(s) selection, the antenna gain including cabl e loss must
not exceed 7.2 dBi in the 850 MHz Cellular band and 3.5 dBi in the PCS 1900 MHz band, for the purpose
of satisfying the requirements of FCC 2.1043 and 2.1091. The antenna used for this module must be
installed to provide a separation distance of at least 20 cm from all persons, and must not be co-located
or operating in conjunction with other antennas or transmitters within a host device, except in accordance
with FCC multi-transmitter product procedures. Compliance of this module i n all final product
configurations is the responsibility of the Grantee. OEM integrators must be provided with specific
information required to satisfy RF exposure compliance for all final host devices and installations. OEM
integrators can replace the antenna by themselves. They should comply w ith Consideration for antenna
selection and Consideration for antenna installation.

Copyright

This document contains proprietary technical information which is the property of SIMCom Limited,

copying of this document and giving it to others and the using or communication of the contents thereof,

are forbidden without express authority. Offenders are liable to the payment of damages. All rights

reserved in the event of grant of a patent or the registration of a utility model or design. All specification

supplied herein are subject to change without notice at any time.

Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2011

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Contents

Revision History ........................................................................................................................................ 10

1 Introduction .........................................................................................................................................11

1.1 Product Outline...............................................................................................................................11

1.2 Hardware Interface Overview.........................................................................................................11

1.3 Hardware Diagram......................................................................................................................... 12

1.4 Functional Overview...................................................................................................................... 12

2 Package Information.......................................................................................................................... 14

2.1 Pin Configuration........................................................................................................................... 14

2.2 Pin description ............................................................................................................................... 16

2.3 Package Dimensions...................................................................................................................... 19

2.4 Footprint Recommendation ........................................................................................................... 20

3 Application Interface Specification................................................................................................... 21

3.1 Power Supply................................................................................................................................. 21

3.1.1 Power Supply Pin.................................................................................................................... 21

3.1.2 Design Guide .......................................................................................................................... 22

3.1.3 RTC Backup............................................................................................................................ 25

3.2 Power on/off Time Sequence......................................................................................................... 27

3.2.1 Power on Sequence ................................................................................................................. 27

3.2.2 Power off Sequence ................................................................................................................ 28

3.3 UART Interface.............................................................................................................................. 30

3.3.1 Pin Description........................................................................................................................ 31

3.3.2 Application Guide................................................................................................................... 31

3.4 Audio Interfaces............................................................................................................................. 32

3.4.1 Pin Description........................................................................................................................ 33

3.4.2 Design Guide .......................................................................................................................... 33

3.4.3 Audio Parameter Characteristic .............................................................................................. 35

3.5 USIM Interface .............................................................................................................................. 36

3.5.1 Pin description ........................................................................................................................ 36

3.5.2 Application Guide................................................................................................................... 36

3.5.3 Recommend Components....................................................................................................... 37

3.6 I2C Interface .................................................................................................................................. 38

3.6.1 Pin Description........................................................................................................................ 39

3.6.2 Signal Description................................................................................................................... 39

3.6.3 Design Guide .......................................................................................................................... 39

3.7 Keypad Interface............................................................................................................................ 39

3.7.1 Pin Description........................................................................................................................ 39

3.7.2 Application Guide................................................................................................................... 40

3.8 USB Interface ................................................................................................................................ 41

3.8.1 Application Guide................................................................................................................... 41

3.9 SPI Interface .................................................................................................................................. 42

3.9.1 Pin Description........................................................................................................................ 42

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3.10 GPIO Interface ........................................................................................................................... 43

3.10.1 Pin Description .................................................................................................................... 43

3.10.2 Application Guide ............................................................................................................... 44

3.11 PCM Interface ............................................................................................................................ 46

3.11.1 Pin Description .................................................................................................................... 46

3.11.2 Signal Description ............................................................................................................... 46

3.12 Global Positioning System ......................................................................................................... 50

3.12.1 Technical specification ........................................................................................................ 50

3.12.2 Operate Mode ...................................................................................................................... 50

3.12.3 Application Guide ............................................................................................................... 51

3.13 Multi-functional interface........................................................................................................... 52

3.13.1 Sink Current Source ............................................................................................................ 52

3.13.2 Reset Function..................................................................................................................... 53

3.13.3 ADC..................................................................................................................................... 54

3.13.4 LDO..................................................................................................................................... 55

4 RF Specification.................................................................................................................................. 55

4.1 RF Specification ............................................................................................................................ 55

4.2 Operating Specification ................................................................................................................. 56

4.3 Antenna Design Guide................................................................................................................... 57

5 Reliability and Operating Characteristics........................................................................................ 59

5.1 Electronic Characteristics .............................................................................................................. 59

5.2 Operating Mode ............................................................................................................................. 59

5.2.1 Operating Modes Overview.................................................................................................... 60

5.2.2 Minimize Power Consumption ............................................................................................... 61

5.3 Current Consumption..................................................................................................................... 61

5.4 EMC and ESD Notes ..................................................................................................................... 64

6 Guide for Production.......................................................................................................................... 65

6.1 Top and Bottom View of SIM5320A ............................................................................................ 65

6.2 Typical Solder Reflow Profile ....................................................................................................... 65

6.3 Moisture Sensitivity Level (MSL)................................................................................................. 66

6.4 Stencil Foil Design Recommendation ........................................................................................... 66

6.5 Recommended Pad Design ............................................................................................................ 67

Appendix.................................................................................................................................................... 68

A. System Design..................................................................................................................................... 68

B. SIM5320A GPIOs List........................................................................................................................ 69

C. Digital I/O Characteristics................................................................................................................... 69

D. Related Documents ............................................................................................................................. 70

E. Terms and Abbreviations.....................................................................................................

................ 71

F. Safety Caution...................................................................................................................................... 74

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Table Index

Table 1: SIM5320A series frequency bands.................................................................................................................... 11

Table 2: General Feature ................................................................................................................................................. 12

Table 3: Pin definition..................................................................................................................................................... 15

Table 4: Pin description................................................................................................................................................... 16

Table 5: Pin description................................................................................................................................................... 21

Table 6: Temperature table.............................................................................................................................................. 24

Table 7: Power on timing................................................................................................................................................ 28

Table 8: Power off timing ............................................................................................................................................... 29

Table 9: Pin description................................................................................................................................................... 31

Table 10: Logic level....................................................................................................................................................... 31

Table 11: Pin description................................................................................................................................................. 33

Table 12: MIC input characteristics ................................................................................................................................ 33

Table 13: Audio output characteristics............................................................................................................................ 33

Table 14: Speaker output characteristics......................................................................................................................... 33

Table 15: Audio parameter.............................................................................................................................................. 35

Table 16: Electronic characteristic .................................................................................................................................. 36

Table 17: Pin description................................................................................................................................................. 36

Table 18: Pin description................................................................................................................................................. 39

Table 19: Pin description................................................................................................................................................. 40

Table 20: GPIO configuration......................................................................................................................................... 41

Table 21: Electronic characteristic .................................................................................................................................. 41

Table 22: Electronic characteristic .................................................................................................................................. 42

Table 23: Pin description................................................................................................................................................. 43

Table 24: Electronic characteristic .................................................................................................................................. 43

Table 25: Pin description................................................................................................................................................. 44

Table 26: LED status....................................................................................................................................................... 45

Table 27: Control status .................................................................................................................................................. 45

Table 28: Electronic characteristic .................................................................................................................................. 46

Table 29: Pin description................................................................................................................................................. 46

Table 30: Timing parameters........................................................................................................................................... 48

Table 31: Timing parameters........................................................................................................................................... 49

Table 32: Electronic characteristic .................................................................................................................................. 53

Table 33: Electronic Characteristics................................................................................................................................ 54

Table 34: Electronic characteristic .................................................................................................................................. 55

Table 35: Conducted transmission power ....................................................................................................................... 55

Table 36: Operating frequencies ..................................................................................................................................... 56

Table 37: Conducted receive sensitivity.......................................................................................................................... 56

Table 38: GPRS/EDGE data throughout ......................................................................................................................... 56

Table 39: HSDPA throughout.......................................................................................................................................... 57

Table 40: Absolute maximum ratings.............................................................................................................................. 59

Table 41: Recommended operating ratings ..................................................................................................................... 59

Table 42: Operating temperature..................................................................................................................................... 59

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Table 43: Operating Modes Overview ............................................................................................................................ 60

Table 44: Current consumption....................................................................................................................................... 62

Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) .......................................... 64

Table 46: SIM5320A GPIOs list ..................................................................................................................................... 69

Table 47: Digital I/O characteristics................................................................................................................................ 69

Table 48: Related documents .......................................................................................................................................... 70

Table 49: Terms and Abbreviations................................................................................................................................. 71

Table 50: Safety caution.................................................................................................................................................. 74

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Figure Index

Figure 1: SIM5320A functional architecture................................................................................................................... 12

Figure 2: Pin view........................................................................................................................................................... 14

Figure 3: Top dimensions (Unit: mm)............................................................................................................................. 19

Figure 4: Side dimensions (Unit: mm)............................................................................................................................ 19

Figure 5: Bottom dimensions (Unit: mm)....................................................................................................................... 20

Figure 6: Footprint recommendation (Unit: mm)............................................................................................................ 20

Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)......................................................................... 21

Figure 8: VBAT input application circuit........................................................................................................................ 22

Figure 9: Reference circuit of the LDO power supply .................................................................................................... 23

Figure 10: Reference circuit of the DCDC power supply ............................................................................................... 23

Figure 11: Internal circuit................................................................................................................................................ 24

Figure 12: Application circuit ......................................................................................................................................... 25

Figure 13: RTC supply from capacitor............................................................................................................................ 25

Figure 14: RTC supply from non-chargeable battery...................................................................................................... 26

Figure 15: RTC supply from rechargeable battery.......................................................................................................... 26

Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 26

Figure 17: Power on Timing Sequence ........................................................................................................................... 27

Figure 18: Application circuit ......................................................................................................................................... 28

Figure 19: Power off timing sequence ............................................................................................................................ 29

Figure 20: Full modem.................................................................................................................................................... 30

Figure 21: Null modem................................................................................................................................................... 30

Figure 22: RI behaviour in NULL Modem ..................................................................................................................... 32

Figure 23: RI behaviour in FULL Modem ...................................................................................................................... 32

Figure 24: Speaker interface configuration..................................................................................................................... 34

Figure 25: Receiver interface configuration.................................................................................................................... 34

Figure 26: Microphone interface configuration .............................................................................................................. 34

Figure 27: USIM interface reference circuit ................................................................................................................... 37

Figure 28: Amphenol SIM card socket ........................................................................................................................... 38

Figure 29: Reference circuit............................................................................................................................................ 40

Figure 30: USB interface ................................................................................................................................................ 42

Figure 31: Application circuit ......................................................................................................................................... 44

Figure 32: Flight mode switch ........................................................................................................................................ 45

Figure 33: Synchrony timing .......................................................................................................................................... 47

Figure 34: EXT CODEC to MODULE timing................................................................................................................ 47

Figure 35: MODULE to EXT CODEC timing................................................................................................................ 48

Figure 36: Synchrony timing .......................................................................................................................................... 48

Figure 37: EXT CODEC to MODULE timing................................................................................................................ 49

Figure 38: MODULE to EXT CODEC timing................................................................................................................ 49

Figure 39: Active antenna circuit .................................................................................................................................... 51

Figure 40：Passive antenna circuit (Default) ................................................................................................................. 52

Figure 41: Current drive.................................................................................................................................................. 53

Figure 42: Reset circuit................................................................................................................................................... 54

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Figure 43: Reference circuit............................................................................................................................................ 54

Figure 44: Antenna matching circuit............................................................................................................................... 58

Figure 45: Top and bottom view of SIM5320A .............................................................................................................. 65

Figure 46: The ramp-soak-spike reflow profile of SIM5320A........................................................................................ 66

Figure 47: Recommended pad ........................................................................................................................................ 67

Figure 48: System design................................................................................................................................................ 68

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Revision History

Data Version Description of change Author

2011-2-29 1.01 Original Xiaoyangyang

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1 Introduction

This document describes electronic specifications, RF specifications, function interface, mechanical

characteristic and testing conclusions of the SIMCom SIM5320A module. With the help of this document

and other SIM5320A software application notes, user guides, users can quickly understand and use

SIM5320A module to design and develop applications quickly.

1.1 Product Outline

Designed for global market, SIM5320A is a quad-band GSM/GPRS/EDGE and dual-band UMTS /HSDPA

that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS 1900MHz and

WCDMA 1900/850MHz. User can choose the module based on the wireless network configuration. In this

document, the entire radio band configuration of SIM5320A series is described in the following table.

Table 1: SIM5320A series frequency bands

Standard Frequency SIM5320A

GSM 850MHz

GSM

WCDMA

HSPA

With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320A can meet almost any

space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,

machine-to-machine, vehicle applications, etc..

There are 80 pins on SIM5320A, which provide most application interfaces for customers’ board.

EGSM 900MHz

DCS1800MHz

PCS1900MHz

WCDMA 850MHz

WCDMA 900MHz

WCDMA 1900MHz

WCDMA 2100MHz

HSDPA

HSUPA

3
3
3
3
3

3

3

1.2 Hardware Interface Overview

Sub-interfaces are described in detail in the next chapter, which includes:

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Power Supply

●

● USB Interface

● Serial Interface

● Analog Audio Interfaces

● SIM Interface

● GPIO

● ADC

● LDO Power Output

● Sink Current Source

● PCM Interface

● Keypad Interface

● SPI Interface

● RTC

● I2C Interface

1.3 Hardware Diagram

The global architecture of the SIM5320A Embedded module is described in the figure below.

Figure 1: SIM5320A functional architecture

1.4 Functional Overview

Table 2: General Feature

Feature Implementation

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Power supply

Single supply voltage 3.3～4.2V

● Dual-mode UMTS/HSDPA/EDGE/GPRS operation

● GPRS Class B, multislot class 12 operation, Supports coding scheme:

CS1-4

Transmission data

GPS

SMS

● EDGE multislot class 12 operation, Supports coding schemes

MSC1-9

● UMTS R99 data rates-384 kbps DL/UL

● HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps

● CSD feature: 9.6, 14.4, 64 kbps UL/DL

● Mobile-Assisted mode

● Mobile-based mode

● Standalone mode

● MT, MO, CB, Text and PDU mode

● SMS storage: SIM card

● Support transmission of SMS alternatively over CSD or GPRS.

User can choose preferred mode.

SIM interface Support identity card: 1.8V, 3V.

Speech codec modes:

● Half Rate (ETS 06.20)

● Full Rate (ETS 06.10)

Audio features(optional)

Serial interface

● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)

● AMR (WCDMA)

● AMR+QCP (GSM)

● A5/1, A5/2, and A5/3 ciphering

● Serial Port standard or null modem mode on Serial Port Interface

● Serial Port can be used to control module by sending AT command

USB

Support USB2.0 Slave mode

Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.

SIM application toolkit

Support SAT class 3, GSM 11.14 Release 98
Support USAT

Real Time Clock Support RTC

Timer function Programmable by AT command

Physical characteristics

Size:30*30*2.9mm
Weight:5.6g

Firmware upgrade Firmware upgrade over USB interface

PCM

Temperature range

Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (υ-law or A-law)
and 16 bit (linear).

● Operation temperature: -30°C to +80°C

● Storage temperature -40°C to +85°C

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2 Package Information

2.1 Pin Configuration

All hardware interfaces which connect SIM5320A to customers’ application platform are through 80 pins

pads (Metal half hole). Figure 2 is SIM5320A outline diagram.

Figure 2: Pin view

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Table 3: Pin definition

Pin No. Define Pin No. Define

1 GND 2 GND

3 POWER_ON 4 RESET

5 GND 6 SPI_CLK

7 SPI_MISO_DATA 8 SPI_MOSI_DATA

9 SPI_CS_N 10 GND

11 USB_VBUS 12 USB_DM

13 USB_DP 14 GND

15 RESERVED 16 RESERVED

17 USIM_DATA 18 USIM_RESET

19 USIM_CLK 20 V_USIM

21 SPK_M 22 SPK_P

23 MIC1P 24 MIC1N

25 EAR1N 26 EAR1P

27 KEYSENSE_N1 28 KEYSENSE_N0

29 KEYPAD_0 30 KEYPAD_2

31 KEYSENSE_N2 32 KEYSENSE_N3

33 KEYPAD_1 34 KEYPAD_4

35 KEYPAD_3 36 KEYSENSE_N4

37 GND 38 VBAT_BB

39 VBAT_BB 40 GND

41 GND 42 VRTC

43 GND 44 VREG_AUX

45 CURRENT_SINK 46 ADC2

47 ADC1 48 GPIO44

49 GPIO40 50 GPIO43

51 GPIO1 52 GPIO41

53 GPIO42 54 GPIO4

55 I2C_SCL 56 I2C_SDA

57 GND 58 GND

59 MAIN_ANT 60 GND

61 GND 62 VBAT_RF

63 VBAT_RF 64 GND

65 GND 66 UART_RTS

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67 UART_CTS 68 UART_RXD

69 UART_RI 70 UART_DCD

71 UART_TXD 72 UART_DTR

73 PCM_DOUT 74 PCM_DIN

75 PCM_SYNC 76 PCM_CLK

77 GND 78 GND

79 GPS_ANT 80 GND

2.2 Pin description

Table 4: Pin description

Pin name I/O Description Comment
Power Supply

V B AT_ R F / VB AT _ B B Power supply voltage

VRTC I/O

Power supply for RTC

VREG_AUX O LDO power output

GND

Ground

Power on/off

POWER_ON should be pulled low at

POWER_ON I

least 64ms to power on or 500ms to
power off the module.

Audio interface

MIC1P

I Differential audio input

MIC1N

EAR1P

EAR1N

SPK_P

O

Differential audio output

O

SPK_N

USIM interface

V_USIM O

Voltage Supply for SIM card
Support 1.8V or 3V SIM card

USIM_DATA I/O SIM Data Output/Input

USIM_CLK O SIM Clock

USIM_RESET O SIM Reset

If it is unused, keep open.

If it is unused, connect to
ground through a 100N
capacitor.

If these pins are unused，
keep open.

All signals of SIM

interface should be

protected against

ESD/EMC.

SPI interface

SPI_CLK

SPI_CS_N O

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SPI clock

SPI chip-select

16

If it is unused, keep open.

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p

p

SPI_MOSI_DATA O

SPI_MISO_DATA I

SPI (master only) master out/slave in

data

SPI (master only) master in/slave out

data

USB

USB_VBUS I USB power supply input

Plus (+) line of the differential,

USB_DP I/O

bi-directional USB signal to/from the

eripheral device.

Minus (-) line of the differential,

USB_DM I/O

bi-directional USB signal to/from the

eripheral device.

Serial interface

UART_RXD I Receive Data

UART_TXD O Transmit Data

UART_RTS O Request to send

UART_CTS I Clear to Send

UART_RI O Ring Indicator

UART_DTR I/O DTE get ready

UART_DCD O Carrier detects

They are compliant with

the USB 2.0 specification.

If it is unused, keep open.

UART_RXD has been

pulled down with a 12kR

resistor to ground in the

module.

If it is unused, keep open.

I2C interface

I2C_SDA I/O I2C data

I2C_SCL O I2C clock output

Keypad interface

KEYPAD_0 O

Bit 0 drive to the pad matrix

KEYPAD_1 O Bit 1 drive to the pad matrix
KEYPAD_2 O Bit 2 drive to the pad matrix
KEYPAD_3 O Bit 3 drive to the pad matrix
KEYPAD_4 O Bit 4 drive to the pad matrix

KEYSENSE_N0 I

KEYSENSE_ N1 I

KEYSENSE_ N2 I

KEYSENSE_ N3 I

KEYSENSE_ N4 I

Bit 0 for sensing key press on pad

matrix

Bit 1 for sensing key press on pad

matrix

Bit 2 for sensing key press on pad

matrix

Bit 3 for sensing key press on pad

matrix

Bit 4 for sensing key press on pad

matrix

PCM interface

General Input PIN with module

PCM_DIN/GPIO0 I

wake/interrupt. It also can be
multiplexed as the PCM_DIN pin.

Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.

All Keypad pins can be
configured as GPIOs.

If it is unused, keep open.

If it is unused, keep open.

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PCM_SYNC/GPIO2 I

PCM_CLK/GPIO3 O

PCM_DOUT/GPIO5 O

GPIOs

GPIO1 O

GPIO4 I Input PIN as RF operating control.

GPIO40 O

GPIO41 I/O

GPIO43 I/O

GPIO44 I/O General input/output PIN.

GPIO42 I/O General input/output PIN.

Other interface

General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.

General Output PIN. It also can be
multiplexed as the PCM_CLK pin.

General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.

Output PIN as LED control for
network status.

Output PIN as operating status
indicating of module.

General input/output PIN. It can be
used as wake/interrupt signal to host
from module

General input/output PIN. It can be
used as wake/interrupt signal to
module from host.

If it is unused, keep open.

RESET I System reset in, active low.

CURRENT_SINK I

ADC1 I Analog Digital Converter Input Refer to 3.13

ADC2 I Battery temperature ADC input pin

MAIN_ANT I/O ANT soldering pad

GPS_ANT I/O GPS ANT soldering pad

Current source of ground-referenced
current sink

Refer to 3.13

Detailed description please
refers to chapter 3.1.2.

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2.3 Package Dimensions

The following figure shows mechanical dimensions of SIM5320A.

Figure 3: Top dimensions (Unit: mm)

Figure 4: Side dimensions (Unit: mm)

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Figure 5: Bottom dimensions (Unit: mm)

2.4 Footprint Recommendation

Figure 6: Footprint recommendation (Unit: mm)

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3 Application Interface Specification

3.1 Power Supply

The power supply pins of SIM5320A include VBAT_RF and VBAT_BB. VBAT_RF directly supplies the

power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the ripple due
to GSM/GPRS emission burst (every 4.615ms）may cause voltage drop, and the current consumption rises

typically to peak of 2A. So the power supply must be able to provide sufficient current up to 2A. The

following figure is the VBAT_RF voltage ripple wave at the maximum power transmit phase.

The test condition: VBAT_RF=4.0V, VBAT maximum output current =2A, C

(ESR=0.7Ω) and C

=1µF(Please refer to Figure 8—Application circuit).

B

=100 µF tantalum capacitor

A

Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)

3.1.1 Power Supply Pin

Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage.

Table 5: Pin description

Pin type Pin name Min Typ Max Unit

POWER

VBAT_RF 3.3 3.8 4.2 V

VBAT_BB 3.3 3.8 4.2 V

Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF
is for RF section and VBAT_BB is for baseband system.

2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2
Note2.

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3.1.2 Design Guide

Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input

voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current

consumption rises up to 2A. If the power voltage drops below 3.3V, the module may be shut down

automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the voltage

drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical 1000uF)

to storage electric power, especially GPRS multiple time slots emission.

For the consideration of RF performance and system stability, another large capacitor (above 100uF)

should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF)

need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put

beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the

power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following

figure is the recommended circuit.

Figure 8: VBAT input application circuit

There are three sections about how to design and optimize users’ power systems.

Power supply circuit

We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak

current of power components can rise up to 2A. The following figure is the reference design of +5V input

power supply. The designed output for the power supply is 4.1V, here a linear regulator can be used.

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DC INPUT

C101 C102

+

100uF

1uF

1

PWR_CTRL

MIC29302

2

Vin

/

ON

OFF

3

GND

Vout

FB

4

5

R101
100K

R102
43K

C103

+

330uF

C104

100nF

FB101

270 OHM

VBAT

U101

Figure 9: Reference circuit of the LDO power supply

If there is a big difference between the input voltage and the desired output (VBAT), a switching converter

power will be preferable because of its better efficiency, especially at the high current situation. The

following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple

current intrinsically.

Figure 10: Reference circuit of the DCDC power supply

Voltage monitor

To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two

parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual

value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the

measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For

example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is

low: 3.3v”.

If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module

will be powered off automatically and AT commands cannot be executed any more.

Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.

Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate
value. Please refer to Document [1].

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Temperature monitor

ADC interface can be used to monitor the temperature of power components to avoid over temperature. An

external NTC resistor (such as NCP15XH103F03RC) can be used to measure the device temperature. The

ADC1 pin can be used as external voltage detection. Please refer to Chapter 3.17. ADC2 is the ADC input

pin for temperature detection. The following figure shows the application circuit.

Figure 11: Internal circuit

From above figure, the input voltage can be calculated:

Vadc=2.2* Rt/（Rt+9.76 ）(V) Rt is a NTC thermistor.

The default temperature

Table 6: Temperature table

Temperature degree(℃)

-30 1887

-20 1814

-10 1711

0 1574

10 1408

20 1224

30 1035

VS Va d c voltage table is shown below.

Vadc (mV)

40 856

50 695

60 558

70 446

80 355

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Make sure that the NTC thermistor can meet the above requirement. User can also add some resistors to

get desired voltage. The value of R1, R2 can be calculated according to the NTC curve and the above table.

Please refer to the following circuit for user’s application.

Figure 12: Application circuit

Normally R1=750Ω. Then the input voltage can be calculated by the following formula:

Vadc=2.2* Rf/（Rf+9.76+0.75 ）(V) —— Rf= Rt*R2/(Rt+R2)

User can take out R2 value through the existing Vadc and the value of NTC thermistor in a specific

temperature.

3.1.3 RTC Backup

The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at

no power supply status. The RTC power supply of module can be provided by an external capacitor or a

battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference

circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the

AT commands “AT+CTZU” and “AT +CTZR”.

z External capacitor backup

MODULE

Non-chargeable

Backup Battery

VRTC

RTC
Core

Figure 13: RTC supply from capacitor

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z Non-chargeable battery backup

Figure 14: RTC supply from non-chargeable battery

z Rechargeable battery backup

Figure 15: RTC supply from rechargeable battery

Note: The VRTC can be disabled, jus disconnect it in application circuit.

Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.

Typical charge-discharge curves for this battery are shown in the following figure.

Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic

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3.2 Power on/off Time Sequence

3.2.1 Power on Sequence

SIM5320A can be powered on by POWER_ON pin, which starts normal operating mode.

POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the SIM5320A

by pulling the POWER_ON pin down for a short time. The power-on scenarios are illustrated in the

following figures.

1.8V

200K

POWER_ON

4.7K

Power

on /off logic

Turn on/ off impulse

47K

MODULE

Figure 17: Power on Timing Sequence

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Table 7: Power on timing

Parameter Description Time value Unit

Ton The time to pull POWER_ON down to power on 64< Ton<180 ms

TpD+ The time to indicate connecting with the network >5.5 s

Tpw+

The time to indicate the module is powered on

completely

>4.5 s

Tuart The time to enable UART >4.7 s

Tusb The time to enable USB >9 s

Automatic power on

If user needs to power on SIM5320A automatically whenever the VBAT pins are connected to the power

supply, then POWER_ON pin is just pulled to ground by a resistance in circuit directly. The following is

the reference circuit.

Res et im pulse

RESET

POWER _ON

R1

10 K

200K

1.8V

Power

/off logic

on

MODULE

50ms<t<200ms

VBAT

RESET

( Input)

VIL<0.3V

Figure 18: Application circuit

Note: After automatically powering on the module by pulling down POWER_ON pin to ground anytime, USB/UART may
not communicate normally with host, so it is suggested that SIM5320A should be reset by RESET pin.

3.2.2 Power off Sequence

The following methods can be used to power down SIM5320A. These procedures will make module

disconnect from the network and allow the software to enter a safe state, and then save data before

completely powering the module off.

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● Method 1: Power off SIM5320A by pulling the POWER_ON pin down

● Method 2: Power off SIM5320A by AT command

User can power off the SIM5320A by pulling POWER_ON down for a specific time. The power off

scenario is illustrated in the following figure.

Figure 19: Power off timing sequence

Table 8: Power off timing

Parameter Description Time value Unit

Toff The time pulling POWER_ON down to power off 0.5< Toff<5 s

TpD- The time to indicate disconnecting from the network >7 s

Tpw- The time to indicate the module power off completely >7.5 s

Tuart_off The time to disable UART >6 s

Tusb_off The time to disable USB >7.5 s

User can also use the AT command

“AT + CP O F ” to power down the module. After that, the AT commands

cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.

For details, refer to Document [1].

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3.3 UART Interface

SIM5320A provides a UART (universal asynchronous serial transmission) port. It consists of a flexible

7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is

as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed

through UART interface. The application circuit is in the following figures.

Figure 20: Full modem

Figure 21: Null modem

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3.3.1 Pin Description

Table 9: Pin description

Pin type Pin name Pin No. I/O Active voltage Default Status

UART_RXD 68 I H Pull-Down

UART_TXD 71 O H Pull-Up

UART_RTS 66 O H

UART

UART_CTS 67 I H Pull-Up

UART_DTR 72 I H Pull-Up

UART_DCD 70 O H

UART_RI 69 O H

More pin information refers to chapter 2.2.

Table 10: Logic level
Parameter Min Max Unit

Logic low input 0 0.3*VDD_EXT V

Logic high input 0.7 *VDD_EXT VDD_EXT +0.3 V

Logic low output GND 0.2 V

Logic high output VDD_EXT -0.2 VDD_EXT V

Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.
All pins of all serial ports have 8mA driver capacity.

3.3.2 Application Guide

If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it

will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC

reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until

the master clears the interrupt event with AT command.

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Figure 22: RI behaviour in NULL Modem

If Full Modem is used to establish communication between devices, the pin “RI” is another operation

status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for

about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is

answered or hung up.

Figure 23: RI behaviour in FULL Modem

To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320A to

the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually.

SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information

please refers to the RS-232 chip datasheet.

Note: SIM5320A supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.

3.4 Audio Interfaces

SIM5320A provides two analog signal outputs and one analog input. MIC1P/N is used as microphone,

EAR1P/N and SPK_P/N are used as audio output. Regarding audio parameters configuration, please refer

to the ATC manual.

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3.4.1 Pin Description

Table 11: Pin description

Audio channel Pin name Pin No. Function

MIC1P 23 MIC positive input

Normal

MIC1N 24 MIC negative input
EAR1P 26 Receiver positive output
EAR1N 25 Receiver negative output
MIC1P 23 MIC positive input

Hand-free

MIC1N 24 MIC negative input

SPK_P 22 Loudspeaker positive output
SPK_N 21 Loudspeaker negative output

Table 12: MIC input characteristics

Parameter Min Typ Max Unit

Worki n g Vol t a ge - 1.8 - V

Working Current 0.07 0.4 1 mA

External Microphone Load Resistance 1.2 2.2 k Ohms

Table 13: Audio output characteristics

Parameter Min Typ Max Unit

Load resistance 27 32 - Ohm Normal

Output power - 50 - mW

(EAR_P,EAR_N)

Differential

Table 14: Speaker output characteristics

Parameter Min Typ Max Unit

Quiescent Current - 2.5 4 mA
Output power(1KHz) - 500 - mW

3.4.2 Design Guide

There are three audio channels in SIM5320A，including speaker output , receiver output and microphone

input.

SPEAKER circuit in SIM5320A is a Class-D amplifier, optional EMI filter is shown in the following

figure; these components (two ferrite beads and two capacitors) can reduce electromagnetic interference. If

used, they should be located beside SPK_P and SPK_N pins. Considerable current flows in the channels,

so wider PCB traces are recommended (~ 20 mils).

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Figure 24: Speaker interface configuration

Figure 25: Receiver interface configuration

Figure 26: Microphone interface configuration

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Note: SIM5320A has integrated MIC bias circuit. There is no need to pull the MIC1P and MIC1N up to the external
power, just connect it to microphone. MIC1P and MIC1N must be differential lines.

3.4.3 Audio Parameter Characteristic

Main audio parameters can be changed to satisfy users’ requirement. Here primary register parameters and

related description are listed. User can adjust them through AT command. For more detail please refers to

Audio Application Document.

Table 15: Audio parameter

Parameter Influence to Range Gain range Calculation AT command

MICP/MICN

micAmp1

analogue amplifier

0…1 0…24dB 2 steps AT+CMICAMP1

gain before ADC

txVol

txGain

txFilter

rxGain

rxVol

Digital gain of input

signal after ADC

0,

1...65535

Digital gain of input

signal after

summation of

0,

1...65535

sidetone

Input PCM 13-tap

filter parameters, 7

0...65535 ---

values

Digital gain of

output signal after

summation of

0,

1...65535

sidetone

Digital Volume of

output signal after

speech decoder,

-300…300 dbm

before summation of

sidetone and DAC

Mute,

-84...+12dB

Mute,

-84...+12dB

Mute,

-84...+12dB

20 * log

(txVol/

16384)

20 * log

(txGain/

16384)

MATLAB

calculate

20 * log

(rxGain/

16384)

-300…300d

bm

AT+CTXVOL

AT+CTXGAIN

AT+CTXFTR

AT+CRXGAIN

AT+CLVL

AT+CVLVL

AT+CRXVOL

20 * log

(stGain/

16384) -12

MATLAB

calculate

AT+SIDET

AT+CRXFTR

stGain

Digital attenuation

of sidetone

0, 1...65535

Mute,

-96...0dB

Output PCM 13-tap

rxFilter

filter parameters, 7

0...65535 ---

values

Note: If users require better experience on audio, users should modify these parameters according to their own electronic

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and mechanical design.

3.5 USIM Interface

The USIM provides the required subscription verification information to allow the mobile equipment to

attach to a GSM or UMTS network. Both 1.8V and 3.0V SIM Cards are supported.

3.5.1 Pin description

Table 16: Electronic characteristic

Pin name

3.0V mode 1.8V mode
Min Typ Max Min Typ Max

V_USIM 2.7 3.00 3.3 1.65 1.8 2.0

USIM_RESET 0.8* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM

USIM_CLK 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM

USIM_DATA 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM

Table 17: Pin description

Pin name Pin Description

USIM_CLK 19 USIM Card Clock
USIM_RESET 18 USIM Card Reset

USIM Card data I/O, which has been pulled up with a 22kR resistor to

USIM_DATA 17

V_USIM in module. Do not pull up or pull down in users’ application
circuit.

V_USIM 20

USIM Card Power output depends automatically on USIM mode，one
is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.

3.5.2 Application Guide

It is recommended to use an ESD protection component such as ST (www.st.com

SEMI (www.onsemi.com

) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card

) ESDA6V1W5 or ON

socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.

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Figure 27: USIM interface reference circuit

Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM
is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to
document [1].

3.5.3 Recommend Components

For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit

http://www.amphenol.com

for more information about the holder.

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Figure 28: Amphenol SIM card socket

Table 19: Amphenol USIM socket pin description

Pin Signal Description

SIM Card Power supply, it can identify automatically the

C1 USIM_VDD

SIM Card power mode，one is 3.0V±10%, another is

1.8V±10%.

C2 USIM_RST SIM Card Reset.

C3 USIM_CLK SIM Card Clock.

C5 GND Connect to GND.
C6 VPP Connect to USIM_VDD
C7 USIM_DATA SIM Card data I/O.

3.6 I2C Interface

I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or

receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write

register values of related peripheral equipments connected with I2C interface.

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3.6.1 Pin Description

Table 18: Pin description

Pin name Pin No. Function

I2C_SDA 56 Serial interface data input and output

I2C_SCL 55 Serial interface clock input

3.6.2 Signal Description

Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor

respectively. When the bus is free, both lines are high.

3.6.3 Design Guide

For SIM5320A, the data on the I2C bus can be transferred at rates up to 400kbps. The number of

peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note

that PCB traces length and bending are in users’ control to minimize load capacitance.

Note：I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need
to pull them up in users’ application circuit.

3.7 Keypad Interface

SIM5320A module provides a keypad interface that supports five sense lines, or columns, and five keypad

rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V.

3.7.1 Pin Description

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Table 19: Pin description

Pin name Pin No. Function

KEYSENSE_N0 28
KEYSENSE_N1 27
KEYSENSE_N2 31

Sensing keys

KEYSENSE_N3 32

KEYSENSE_N4 36
KEYPAD_0 30
KEYPAD_1 29
KEYPAD_2 30

Driving pads

KEYPAD_3 35
KEYPAD_4 34

3.7.2 Application Guide

All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as
input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure.

Figure 29: Reference circuit

If these pins are configured for GPIOs, the sequence is listed in the following table.

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Table 20: GPIO configuration

Keypad interface GPIO No.

KEYPAD_4 GPIO6

KEYPAD_3 GPIO7

KEYPAD_2 GPIO8

KEYPAD_1 GPIO9

KEYPAD_0 GPIO10

KEYSENSE_N4 GPIO11

KEYSENSE_N 3 GPIO12

KEYSENSE_N 2 GPIO13

KEYSENSE_N 1 GPIO14

KEYSENSE_N 0 GPIO15

Note: Refer to document [23] for detailed information of Keypad Application Note.

3.8 USB Interface

SIM5320A module contains a USB interface. This interface is compliant with the USB2.0 specification.

The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely

low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is

not supported.

Table 21: Electronic characteristic

Pin name Pin No.

USB_VBUS 11 4.4 5.0 5.25

USB_DP 13

USB_DM 12

3.8.1 Application Guide

Input voltage scope( V )
Min Typ Max

They are compliant with the USB 2.0 specification.

Currently SIM5320A supports the USB suspend and resume mechanism which can help to save power.

If no transaction is on USB bus, SIM5320A will enter suspend mode. When some events such as voice call

or receiving SMS happen, SIM5320A will resume normal mode automatically.

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Figure 30: USB interface

Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component

on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.

Note：The SIM5320A has two kinds of interface (UART and USB) to connect to host CPU. USB interface is mapped to
five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”, “SIMTECH
Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.

3.9 SPI Interface

SPI interface of SIM5320A is master only. It provides a duplex, synchronous, serial communication link

with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz.

3.9.1 Pin Description

Table 22: Electronic characteristic

Pin name

SPI_CLK 1.65 1.8 1.95

SPI_CS_N 1.65 1.8 1.95

SPI_MOMI_DATA 1.65 1.8 1.95

SPI_MIMO_DATA 1.65 1.8 1.95



1.8V mode

Min Typ Max

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Table 23: Pin description

Pin name Pin No. Function

SPI_CS 9

SPI_MISO_DATA 7

SPI_CLK 6

SPI_MOSI_DATA 8

SPI chip-select; not mandatory in a point-to-point connection

SPI master in/slave out data

SPI clock

SPI master out/slave in data

3.10 GPIO Interface

SIM5320A provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs.

User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.

3.10.1 Pin Description

Table 24: Electronic characteristic

Pin name

Min Typ Max

2.6V mode

GPIO1 2.5 2.6 2.7

GPIO4 2.5 2.6 2.7

GPIO40 2.5 2.6 2.7

GPIO41 2.5 2.6 2.7

GPIO43 2.5 2.6 2.7

GPIO44 2.5 2.6 2.7

GPIO42 2.5 2.6 2.7

Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as PCM.
Please refer to GPIO list.

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Table 25: Pin description

Pin name Pin No. I/O Function

GPIO1 51 O

Output PIN as LED control for network status. If it is

unused, left open.

Input PIN as RF operating control.

GPIO4 49 I

H: Normal Mode L:Flight Mode
If it is unused, left open.

Output PIN as operating status indicating of module.

GPIO40 54 O

H: Power on L: Power off
If it is unused, left open.

GPIO41 52 I/O

GPIO42 53 I/O

General input/output PIN. It can be used as wake/interrupt

signal to host from module If it is unused, left open.

General Purpose Input/Output Port.

General Purpose Input/Output Port. It can be used as

GPIO43 50 I/O

wake/interrupt signal to module from host. If it is unused, left

open.

GPIO44 48 I/O

Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.

General Purpose Input/Output Port

3.10.2 Application Guide

Network status

GPIO1 is used to control Network Status LED; application circuit is shown below.

Figure 31: Application circuit

Note: The value of resistor Rx depends on LED characteristic.

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Table 26: LED status

LED Status Module Status

Always On Searching Network/Call Connect
200ms ON, 200ms OFF Data Transmit
800ms ON, 800ms OFF Registered network

Off

Power off / Sleep

Flight mode control

GPIO4 controls SIM5320A module to enter or exit the Flight mode. In Flight mode, SIM5320A closes RF

function to prevent interference with other equipments or minimize current consumption. Bidirectional

ESD protection component is suggested to add on GPIO4.

Figure 32: Flight mode switch

Table 27: Control status

GPIO4 Status Module operation

Low Level Flight Mode: RF is closed.
High Level Normal Mode: RF is working.

Note：1. For SIM5320A, GPIO0, GPIO2, GPIO3 and GPIO5 have multiplex function, user can use them as PCM
interface to connect extend codec. Refer to section 3.10 and document [1] for details.

2. When the module is powered off, make sure all digital interfaces (PCM UART, etc) connected with peripheral devices
have no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in
GPIO pins because current leakage from above digital interfaces may occur.

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3.11 PCM Interface

SIM5320A provides hardware PCM interface for external codec. The PCM interface enables

communication with an external codec to support hands-free applications. SIM5320A PCM interface can

be used in two modes: the default mode is auxiliary PCM (8 KHz long sync mode at 128 KHz PCM CLK);

the other mode is primary PCM (8 KHz short sync mode at 2048 KHz PCM CLK). In short-sync

(primary PCM) mode, SIM5320A can be a master or a slave. In long-sync (auxiliary PCM) mode,

SIM5320A is always a master. SIM5320A also supports 3 kinds of coding formats: 8 bits (

and 16 bits (linear).

Note: PCM interface is multiplexed from GPIO (default setting). The AT command “AT+CPCM” is used to switch
between PCM and GPIO functions. Please refer to document [22] and document [1] for details.

3.11.1 Pin Description

Table 28: Electronic characteristic

υ-law or A-law)

Pin name

2.6V mode

Min Typ Max

PCM_CLK 2.5 2.6 2.7

PCM_SYNC 2.5 2.6 2.7

PCM_DOUT 2.5 2.6 2.7

PCM_DIN 2.5 2.6 2.7

Table 29: Pin description

Pins Pin No.

AUX_PCM
functionality

Primary PCM
functionality

Description

PCM_DIN/GPIO0 74 AUX_PCM_DIN PCM_DIN PCM data input

PCM_SYNC/GPIO2 75 AUX_PCM_SYNC PCM_SYNC PCM data synchrony

PCM_DOUT/GPIO5 73 AUX_PCM_DOUT PCM_DOUT PCM data output

PCM_CLK/GPIO3 76 AUX_PCM_CLK PCM_CLK PCM data clock

3.11.2 Signal Description

The default PCM interface in SIM5320A is the auxiliary PCM interface. The data changes on the high

level of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is

disabled after every power-on or every reset event. So user must use AT command to enable the primary

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PCM mode after powering on or resetting the module every time if user wants to use Primary

PCM.SIM5320A PCM Interface can be operated in Master or Slave mode if it is configured to primary

PCM. In Master Mode, the Module drives the clock and sync signals that are sent to the external codec.

When it is in Slave Mode, the external codec drives the clock and sync signals which are sent to the

module. Both PCM modes are discussed in this section followed by additional PCM topics.

Auxiliary PCM (128 KHz PCM clock)

υ-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard

long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.

υ-law codec support the 128 KHz clock.

Most

 Figure 33: Synchrony timing

Figure 34: EXT CODEC to MODULE timing

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Figure 35: MODULE to EXT CODEC timing

Table 30: Timing parameters

Parameter Description Min Typ Max Unit

T(auxsync) AUX_PCM_SYNC cycle time – 125 - μs

T(auxsynch) AUX_PCM_SYNC high time 62.4 62.5 - μs

T(auxsyncl) AUX_PCM_SYNC low time 62.4 62.5 - μs

T(auxclk)* AUX_PCM_CLK cycle time - 7.8 – μs

T(auxclkh) AUX_PCM_CLK high time 3.8 3.9 – μs

T(auxclkl) AUX_PCM_CLK low time 3.8 3.9 – μs

T(suauxsync)

T(hauxsync)

T(suauxdin)

T(hauxdin)

T(pauxdout)

AUX_PCM_SYNC setup time high before

falling edge of PCM_CLK

AUX_PCM SYNC hold time after falling edge

of PCM_CLK

AUX_PCM_DIN setup time before falling

edge of AUX_PCM_CLK

AUX_PCM_DIN hold time after falling edge

of AUX_PCM_CLK

Delay from AUX_PCM_CLK rising to

AUX_PCM_DOUT valid

1.95 – – μs

1.95 – – μs

70 – – ns

20 – – ns

– – 50 ns

*Note: T(auxclk) = 1/(128 KHz).

Primary PCM (2048 KHz PCM clock)

SIM5320A also supports 2.048 MHz PCM data and sync timing for

υ-law codec. This is called the

primary PCM interface. User can use AT command to take the mode you want as discussed above.

Figure36:Synchronytiming

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Figure 37: EXT CODEC to MODULE timing

Figure 38: MODULE to EXT CODEC timing

Table 31: Timing parameters

Parameter Description Min Typ Max Unit

T(sync) PCM_SYNC cycle time – 125 – μs

T(synch) PCM_SYNC high time 400 500 – ns

T(syncl) PCM_SYNC low time – 124.5 – μs

T(clk) PCM_CLK cycle time – 488 – ns

T(clkh) PCM_CLK high time – 244 – ns

T(clkl) PCM_CLK low time – 244 – ns

T(susync)

T(hsync)

PCM_SYNC setup time high before falling edge of

PCM_CLK

PCM_SYNC hold time after falling edge of

PCM_CLK

60 – – ns

60 – – ns



T(sudin)

T(hdin)

PCM_DIN setup time before falling edge of

PCM_CLK

PCM_DIN hold time after falling edge of

PCM_CLK

50 – – ns

10 – – ns

T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid – – 350 ns

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T(zdout)

Note: SIM5320A can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more
information of PCM Application Note.

Delay from PCM_CLK falling to PCM_DOUT

HIGH-Z

– 160 – ns

3.12 Global Positioning System

SIM5320A merges GPS satellite and network information to provide a high-availability solution that

offers industry-leading accuracy and performance. This solution performs well, even in very challenging

environmental conditions where conventional GPS receivers fail, and provides a platform to enable

wireless operators to address both location-based services and emergency mandates.

3.12.1 Technical specification

Tracking sensitivity -157 dBm
Cold-start sensitivity -144 dBm
Accuracy (Open Sky) <2m (CEP50)
TTFF (Open Sky) Hot start <1s Cold start 35s（good signal）/ 100s(weak signal)
Receiver Type 12-channel, GPS L1 Frequency (1575.42MHz), C/A Code
Update rate Default 1 Hz
GPS data format NMEA-0183
GPS Current consumption (WCDMA/GSM Sleep mode) 100mA (Total supply current)
GPS antenna Passive/Active antenna

Note: Performance will vary depending on the environment, antenna type and signal conditions and so on.

3.12.2 Operate Mode

SIM5320A supports both A-GPS and S-GPS, and then provides three operating modes: mobile-assisted

mode, mobile-based mode and standalone mode. A-GPS includes mobile-assisted and mobile-based mode.

In mobile-assisted mode, when a request for position location is issued, available network information is

provided to the location server (e.g. Cell-ID) and assistance is requested from the location server. The

location server sends the assistance information to the handset. The handset/mobile unit measures the GPS

observables and provides the GPS measurements along with available network data (that is appropriate for

the given air interface technology) to the location server. The location server then calculates the position

location and returns results to the requesting entity.

In mobile-based mode, the assistant data provided by the location server encompasses not only the

information required to assist the handset in measuring the satellite signals, but also the information

required to calculate the handset’s position. Therefore, rather than provide the GPS measurements and

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available network data back to the location server, the mobile calculates the location on the handset and

passes the result to the requesting entity.

In standalone (autonomous) mode, the handset demodulates the data directly from the GPS satellites.

This mode has some reduced cold-start sensitivity, and a longer time to first fix as compared to the assisted

modes. However, it requires no server interaction and works out of network coverage.

This combination of GPS measurements and available network information provides:

● High-sensitivity solution that works in all terrains: Indoor, outdoor, urban, and rural

● High availability that is enabled by using both satellite and network information

Therefore, while network solutions typically perform poorly in rural areas and areas of poor cell

geometry/density, and while unassisted, GPS-only solutions typically perform poorly indoors. The

SIM5320A GPS solution provides optimal time to fix, accuracy, sensitivity, availability, and reduced

network utilization in both of these environments, depending on the given condition.

3.12.3 Application Guide

Users can adopt an active antenna or a passive antenna as GPS signal transceiver. In this document, all

GPS specification mentioned is from passive antenna. The following is the reference circuit.

Figure 39: Active antenna circuit

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Figure 40：Passive antenna circuit (Default)

In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the

components can only be obtained after the antenna tuning usually, and they are provided by antenna

vendor.C2 in Figure 39 is used for DC isolation. In active antenna circuit, users must use an external

LDO/DCDC to provide VDD voltage whose value should be taken according active antenna characteristic,

and VDD can be shut down to avoid consuming additional current when not being used.

GPS can be used by NMEA port. User can select NMEA as output through UART or USB. NMEA

sentences are automatic and no command is provided. NMEA sentences include GSV, GGA, RMC, GSA,

and VTG. Before using GPS, user should configure SIM5320A in proper operating mode by AT command.

Please refer to related document for details. SIM5320A can also get position location information through

AT directly.

Note:GPS is closed by de fault, it c ould be sta rted by AT+CGPS. The AT command has two parameters, the first is on/off,
and the second is GPS mode. Default mode is standalone mode.
AGPS mode needs more support from the mobile telecommunication network. Refer to AGPS application document for
details.

3.13 Multi-functional interface

SIM5320A merges functions for various applications. It can enrich users’ design and lower the cost of

users’ hardware.

3.13.1 Sink Current Source

The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this

implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain

a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.

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Table 32: Electronic characteristic

Symbol Description Min Typ Max Unit

CURRENT_SINK Input voltage 0.5 VDD 5 V

IO Input current - - 150 mA

Since the driver is ground-referenced current sink, the operating device it drives must form a current path

between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference.

VBAT

+

Pin 45 is +5V tolerant-

suitable for driving white

LEDs

High

current

Passive

device

-

CURRENT_SINK

MODULE

Current Controls

Figure 41: Current drive

Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>,
<value>”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA.

3.13.2 Reset Function

SIM5320A also have a RESET pin (PIN4) to reset the module. This function is used as an emergency reset

only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the RESET

pin to ground, then the module will reset.

This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor

close to the RESET pin is strongly recommended. A reference circuit is recommended in the following

figure.

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Figure 42: Reset circuit

：

Note

50ms<t<200ms. ESD components are suggested to be used on Reset pin.

3.13.3 ADC

SIM5320A has a dedicated ADC that is available for digitizing analog signals such as battery voltage and

so on; it is on PIN 47, namely ADC1. This ADC1 is 8 bit successive-approximation circuit, and electronic

specification is shown in the following table.

Table 33: Electronic Characteristics

Specification

Min Typ Max Unit Comments/Conditions

Resolution 8 Bits
Differential nonlinearity -4 +4 LSB
Integral nonlinearity -8 +8 LSB
Gain Error -2.5 +2.5 %

Analog Vdd = ADC reference

2.4MHz sample rate

Offset Error -4 +40 LSB
Input Range GND 2.2V V

Input serial resistance 2 kΩ Sample and hold switch resistance

Input capacitance 53 pF

Power-down to wakeup 9.6 19.2 μs

User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw

data which is between 0 and 255. The data can be transformed to any type such as voltage, temperature etc.

Please refer to Chapter 3.1.2 and document [1].

Figure 43: Reference circuit

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Note: The input signal voltage value in ADC must not be higher than 2.2V.

3.13.4 LDO

SIM5320A has a LDO power output, namely VREG_AUX. The LDO is available and output voltage is

2.85v by default, rated for 250mA. User can switch the LDO on or off by the AT command

“AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.

Table 34: Electronic characteristic

Symbol Description Min Typ Max Unit

VREG_AUX Output voltage 1.5 2.85 3.05 V

IO Output current - - 250 mA

4 RF Specification

4.1 RF Specification

Table 35: Conducted transmission power

Frequency Max Min

GSM850 33dBm ±2dB 5dBm ± 5dB
E-GSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
PCS1900 30dBm ±2dB 0dBm ± 5dB
GSM850 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
E-GSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
PCS1900(8-PSK) 26dBm +3/-4dB 0dBm ±5dB
WCDMA 2100 24dBm +1/-3dB -56dBm ±5dB
WCDMA 1900 24dBm +1/-3dB -56dBm ±5dB
WCDMA 850 24dBm +1/-3dB -56dBm ±5dB
WCDMA 900 24dBm + 1/-3dB -56dBm ±5dB

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Table 36: Operating frequencies

Frequency Receiving Transmission

GSM850

E-GSM900

DCS1800

PCS1900

WCDMA 2100

WCDMA1900

WCDMA 850

WCDMA 900

869 ～894 MHz 824 ～849 MHz

925 ～960 MHz 880 ～915 MHz

1805～1880 MHz 1710～1785 MHz

1930～1990 MHz 1850～1910 MHz

2110～2170 MHz 1920～1980 MHz

1930～1990 MHz 1850～1910 MHz

869 ～894 MHz 824 ～849 MHz

925 ～960 MHz 880 ～915 MHz

Table 37: Conducted receive sensitivity

Frequency Receive sensitivity

GSM850 < -106dBm
E-GSM900 < -106dBm
DCS1800 < -106dBm
DCS1800 < -106dBm
WCDMA 2100 < -108dBm
WCDMA 1900 < -108dBm
WCDMA 850 < -106dBm
WCDMA 900 < -106dBm

4.2 Operating Specification

SIM5320A can support high rate data by GSM/WCDMA wireless network. In the different network

environment, data transmission rate shifts depending on modulation and encoding.

Table 38: GPRS/EDGE data throughout

Function Coding schemes 1 Timeslot 2 Timeslot 4 Timeslot

CS-1 9.05kbps 18.1kbps 36.2kbps

GPRS

EDGE

CS-2 13.4kbps 26.8kbps 53.6kbps
CS-3 15.6kbps 31.2kbps 62.4kbps
CS-4 21.4kbps 42.8kbps 85.6kbps
MCS-1 8.80kbps 17.6kbps 35.20kbps
MCS-2 11.2kbps 22.4kbps 44.8kbps
MCS-3 14.8kbps 29.6kbps 59.2kbps
MCS-4 17.6kbps 35.2kbps 70.4kbps
MCS-5 22.4kbps 44.8kbps 89.6kbps
MCS-6 29.6kbps 59.2kbps 118.4kbps
MCS-7 44.8kbps 89.6kbps 179.2kbps
MCS-8 54.4kbps 108.8kbps 217.6kbps
MCS-9 59.2kbps 118.4kbps 236.8kbps

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Table 39: HSDPA throughout

Category Supported

Max supported
HS-DSCH codes

Theoretical max
peak rate(Mbps)

Modulation

Category1 5 1.2 16QAM,QPSK

Category2 5 1.2 16QAM,QPSK

Category3 5 1.8 16QAM,QPSK

Category4 5 1.8 16QAM,QPSK

Category5

Category6

Category7

Category8

Category9

Category10

Category11

Category12

3
3

3

5 3.6 16QAM,QPSK

5 3.6 16QAM,QPSK

10 7.2 16QAM,QPSK

10 7.2 16QAM,QPSK

15 10.0 16QAM,QPSK

15 14.0 16QAM,QPSK

5 0.9 QPSK

5 1.8 QPSK

Note: Actual throughout rates depend on network configuration, network loading, signal condition and so on.

4.3 Antenna Design Guide

SIM5320A provides RF antenna interface. Customer’s antenna should be located in the host board and

connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace

impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the

antenna pad and antenna should meet the following requirements:

● GSM900/GSM850<0.5dB

● DCS1800/PCS1900 <0.9dB

● WCDMA 2100/1900<0.9dB

● WCDMA 900/850<0.5dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit

should be added. The following figure is the recommended circuit.

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Figure 44: Antenna matching circuit

In this figure, the components R1,C1,C2 and R2 is used for antenna matching, the value of components

can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R1,

R2 are 0 ohm resistors, and the C1, C2 are reserved for tuning.

The RF test connector in the figure is used for the conducted RF performance test, and should be placed as

close as to the module’s antenna pin. The traces impedance between components must be controlled in

50ohm.

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5 Reliability and Operating Characteristics

5.1 Electronic Characteristics

Absolute maximum rating for digital and analog pins of SIM5320A are listed in the following table:

Table 40: Absolute maximum ratings

Parameter Min Max Unit

Voltage at digital pins (1.8v mode) -0.3 1.8+0.3 V
Voltage at digital pins (2.6v mode) -0.3 2.6+0.3 V
Voltage at VBAT -0.5 6.0 V
Voltage at VRTC 1.5 3.2 V
Voltage at USB_VBUS -0.5 6.0 V

Table 41: Recommended operating ratings

Parameter Min Typ Max Unit

Voltage at digital pins (1.8v mode) 1.65 1.8 1.95 V
Voltage at digital pins (2.6v mode) 2.5 2.6 2.7 V
Voltage at VBAT 3.3 3.8 4.2 V
Voltage at VRTC 1.5 - 3.0 V
Voltage at USB_VBUS 4.75 5 5.25 V

The operating temperature and power specification is listed in the following table.

Table 42: Operating temperature

Parameter Min Typ Max Unit

Ambient temperature -30 25 80 ℃

Storage temperature -40 25 +85 ℃

Note: SIMCom recommends user to install a heat sink on the module shielding case if SIM5320A operates in WCDMA
band.

5.2 Operating Mode

The following table summarizes the various operating modes, each operating modes will be referred to in

the following chapters.

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5.2.1 Operating Modes Overview

Table 43: Operating Modes Overview

Mode Function

Module will automatically enter SLEEP mode if DTR is set to high

level and there is no on air or hardware interrupt (such as GPIO

interrupt or data on serial port).

Sleep mode

GSM/WCDM
A SLEEP

In this case, the current consumption of module will be reduced to the

minimal level.
In SLEEP mode, the module can still receive paging message，voice

call and SMS.

GSM

GPRS

EDGE

WCDMA

HSDPA

Power down

Minimum
functionality
mode

GSM IDLE

Software is active. Module has registered to the GSM network, and
the module is ready to communicate.

Connection between two subscribers is in progress. In this case, the

GSM TALK

power consumption depends on network settings (DTX off/on,
FR/EFR/HR, hopping sequences, etc.) and antenna.

GPRS
STANDBY

Module is ready for GPRS data transfer, but no data is currently sent
or received. In this case, power consumption depends on network
settings and GPRS configuration.

There is GPRS data transfer (PPP or TCP or UDP) in progress. In this

GPRS DATA

case, power consumption is related with network settings (e.g. power
control level), uplink/downlink data rates and GPRS configuration
(e.g. used multi-slot settings).

EDGE
STANDBY

Module is ready for data transfer in EDGE mode, but no data is
currently sent or received. In this case, power consumption depends
on network settings and EDGE configuration

There is EDGE data transfer (PPP or TCP or UDP) in progress. In this

EDGE DATA

case, power consumption is related with network settings (e.g. power
control level), uplink/downlink data rates and EDGE configuration.

WCDMA
IDLE

WCDMA
TALK

Module has registered to the WCDMA network, and the module is
ready to communicate.

Module is active in WCDMA mode. The power consumption depends
on network settings.

Module is ready for data transmission, but no data is currently sent or

HSDPA IDLE

received. Power consumption depends on network settings and
HSDPA configuration

There is HSDPA data transfer (PPP or TCP or UDP) in progress. In
HSDPA
DATA

this case, power consumption is related with network settings (e.g.

power control level), uplink/downlink data rates and HSDPA

configuration
Module can be powered down by the AT command “AT+CPOF” or the POWER_ON

pin. The power management unit shuts down the power supply of the module, only the
power supply of RTC is remained. The serial interface is not accessible. Operating
voltage (connected to VBAT) remains applied.

The AT command “AT+CFUN” can be used to set the module to a minimum
functionality mode without removing the power supply. In this mode, the RF part of
the module will not work or the SIM card will not be accessible, or both will be closed,
and the serial port is still accessible. The power consumption in this mode is very low.

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5.2.2 Minimize Power Consumption

There are two modes that SIM5320A achieves low power consumption.

Sleep mode

If peripheral equipments stops working, and there is no on air or hardware interrupts (such as GPIO

interrupts or data on UART), SIM5320A will enter sleep mode automatically. In this mode, SIM5320A can
still receive paging，voice call or SMS from network. If USB interface of SIM5320A is connected to host

CPU, but host CPU does not support USB suspending, then SIM5320A will not enter sleep mode. After

USB is disconnected, SIM5320A will enter sleep mode.

Note: When UART interface is connected with host CPU, SIM5320A can not enter sleep mode until RXD is pulled down
by the host CPU. If the module is in the idle mode, make sure to pull the RXD to low level by host CPU. SIMCom
recommends using GPIO43 or UART_DTR to wake up the module from host CPU and to use GPIO41 or UART_RI to
wake up the host CPU. Before designing, pay attention to how to realize waking function and refer to Document[24] and
Document[25] for more detail.

Minimum functionality mode

Minimum functionality mode ceases a majority function of module, thus minimizing the power

consumption. This mode is set by the AT command which provides a choice of the functionality levels.

● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)

● AT+CFUN=4: Disable RF function of the module (Flight mode)

If SIM5320A has been set to minimum functionality mode, the module will firstly enter sleep mode, then

the RF function and SIM card function will be closed. In this case, the serial port is still accessible, but RF

function or SIM card will be unavailable. When SIM5320A is in minimum functionality or flight mode, it

can return to full functionality by the AT command “AT+CFUN=1”.

Note: For flight mode, please refer to Chapter 2.12.2.

5.3 Current Consumption

The current consumption in suspended mode and without USB connection is listed in the table below.

Here, “suspended mode” means that SIM5320A is connected to USB bus, but it does not transfer data.

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Table 44: Current consumption

GSM Sleep mode (without USB connection)

Sleep @DRX=2 4.5mA

GSM850

Sleep @DRX=5 2.7mA

Sleep @DRX=9 2.3mA

Sleep @DRX=2 4.5mA

GSM900

Sleep @DRX=5 2.7mA

Sleep @DRX=9 2.3mA

Sleep @DRX=2 4.5mA

DCS1800

Sleep @DRX=5 2.7mA

Sleep @DRX=9 2.3mA

Sleep @DRX=2 4.5mA

PCS1900

Sleep @DRX=5 2.7mA

Sleep @DRX=9 2.3mA

GSM Sleep Mode (with USB suspended)

Sleep @DRX=2 4.6mA

GSM850

Sleep @DRX=5 2.8mA

Sleep @DRX=9 2.5mA

Sleep @DRX=2 4.6mA

GSM900

Sleep @DRX=5 2.8mA

Sleep @DRX=9 2.5mA

Sleep @DRX=2 4.6mA

DCS1800

Sleep @DRX=5 2.8mA

Sleep @DRX=9 2.5mA

Sleep @DRX=2 4.6mA

PCS1900

Sleep @DRX=5 2.8mA

Sleep @DRX=9 2.5mA

Voice Call

GSM850 @power level #5 <300mA,Typical 305mA
GSM 900 @power level #5 <300mA,Typical 305mA
DCS1800 @power level #0 <250mA,Typical 237mA
PCS1900 @power level #0 <250mA,Typical 237mA
GPRS Data

DATA mode, GPRS ( 1 Rx,4 Tx ) CLASS 12

GSM 850 @power level #5 <660mA,Typical 488mA
GSM 900 @power level #5 <660mA,Typical 484mA
DCS1800 @power level #0 <530mA,Typical 346mA
PCS1900 @power level #0 <530mA,Typical 353mA

DATA mode, GPRS ( 3Rx, 2 Tx ) CLASS 12

GSM 850 @power level #5 <460mA,Typical 335mA
GSM 900 @power level #5 <440mA,Typical 332mA
DCS1800 @power level #0 <400mA,Typical 260mA
PCS1900 @power level #0 <300mA,Typical 263mA

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EDGE Data

DATA mode, EDGE( 1 Rx,4 Tx ) CLASS 12

GSM 850 @power level #8 <500mA,Typical 335mA
GSM 900 @power level #8 <500mA,Typical 332mA
DCS1800 @power level #2 <450mA,Typical 291mA
PCS1900 @power level #2 <450mA,Typical 293mA

DATA mode, EDGE( 3Rx, 2 Tx ) CLASS 12

GSM 850 @power level #8 <330mA,Typical 235mA
GSM 900 @power level #8 <330mA,Typical 231mA
DCS1800 @power level #2 <300mA,Typical 206mA
PCS1900 @power level #2 <300mA,Typical 209mA

UMTS Sleep Mode (without USB connection)

Sleep @DRX=9 2.2mA

WCDMA 2100

Sleep @DRX=8 2.7 mA

Sleep @DRX=6 4.7mA

Sleep @DRX=9 2.2mA

WCDMA 1900

Sleep @DRX=8 2.7 mA

Sleep @DRX=6 4.7mA

Sleep @DRX=9 2.2mA

WCDMA 850

Sleep @DRX=8 2.7 mA

Sleep @DRX=6 4.7mA

Sleep @DRX=9 2.2mA

WCDMA 900

Sleep @DRX=8 2.7 mA

Sleep @DRX=6 4.7mA

UMTS Sleep Mode (with USB suspended)

Sleep @DRX=9 2.4mA

WCDMA 2100

Sleep @DRX=8 2.8 mA

Sleep @DRX=6 4.8mA

Sleep @DRX=9 2.4mA

WCDMA 1900

Sleep @DRX=8 2.8 mA

Sleep @DRX=6 4.8mA

Sleep @DRX=9 2.4mA

WCDMA 850

Sleep @DRX=8 2.8 mA

Sleep @DRX=6 4.8mA

Sleep @DRX=9 2.4mA

WCDMA 900

Sleep @DRX=8 2.8 mA

Sleep @DRX=6 4.8mA

UMTS Talk

@Power 23dBm Typical 539mA

WCDMA 2100

@Power 21dBm Typical 461mA

@Power 10dBm Typical 195mA

@Power 23dBm Typical 604mA

WCDMA 1900

@Power 21dBm Typical 507mA

@Power 10dBm Typical 195mA

WCDMA 850

@Power 23dBm Typical 517mA
@Power 21dBm Typical 419mA

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@Power 10dBm Typical 189mA

@Power 23dBm Typical 524mA

WCDMA 900

@Power 21dBm Typical 417mA

@Power 10dBm Typical 179mA

HSDPA Data

@Power 23dBm CQI=22 Typical 550mA

WCDMA 2100

@Power 21dBm CQI=5 Typical 520mA

@Power -5dBm CQI=22 Typical 270mA

@Power 23dBm CQI=22 Typical 610mA

WCDMA 1900

@Power 21dBm CQI=5 Typical 540mA

@Power -5dBm CQI=22 Typical 270mA

@Power 23dBm CQI=22 Typical 550mA

WCDMA 850

@Power 21dBm CQI=5 Typical 490mA

@Power -5dBm CQI=22 Typical 220mA

@Power 23dBm CQI=22 Typical 550mA

WCDMA 900

@Power 21dBm CQI=5 Typical 490mA

@Power -5dBm CQI=22 Typical 220mA

5.4 EMC and ESD Notes

EMC tests should be performed to detect any potential problems. Possible harmful emissions radiate by

the application to the RF receiver in the receiver band. RF emissions interfere with audio input/output. It is

recommended to shield the sensitive components and trace with common ground and user can add beads

where necessary.

Normally SIM5320A is mounted on customer host board. Although some ESD components have been

added in SIM5320A, to prevent ESD, user should put some ESD components on customers’ board. The

ESD components should be placed beside the connectors which human body might touch, such as SIM

card holder, audio jacks, switches, keys, etc. The following table is the SIM5320A ESD measurement

performance; the results are from SIMCom EVB test.

Table 45: The ESD performance measurement table (Temperature: 25 , Humidity:℃ 45%)

Part Contact discharge Air discharge

VBAT,GND ±4KV ±6KV

UART,USB ±2KV ±6KV

Antenna port ±4KV ±6KV

Other ports ±2KV ±2KV

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6 Guide for Production

6.1 Top and Bottom View of SIM5320A

Figure 45: Top and bottom view of SIM5320A

These test points are only used for module manufacturing and testing. They are not for customer’s

application.

6.2 Typical Solder Reflow Profile

For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In

final board assembly, the typical solder reflow profile will be determined by the largest component on the

board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown

below is only a generic recommendation and should be adjusted to the specific application and

manufacturing constraints.

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Figure 46: The ramp-soak-spike reflow profile of SIM5320A

For details about secondary SMT, please refer to document [26].

6.3 Moisture Sensitivity Level (MSL)

SIM5320A is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-020.

After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment

(<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not

heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.

6.4 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.18mm.

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6.5 Recommended Pad Design

A

B

A:B=1.0mm:0.8mm

Module Outline

Figure 47: Recommended pad

Note: More designing details refer to Figure 6.

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Appendix

A. System Design

Ferrite Beads Rated current > 1A

Power supply

Main Antenna

FB101

300 OHM

Turn on/off impulse

20~200ms

Reset impulse

UART_TXD
UART_RXD

UART_CTS
UART_RTS

UART_RI

UART_DCD

UART_DTR

SIM_DATA

MIC

32R

8R

0.5W

HOST_WAKEUP

MODULE_WAKEUP

R102

0R

NC

100nF 22pF

100uF

R103

4.7K

R104

TVS

SIM_CLK
SIM_RST
SIM_VDD

C109

220nF

ESD & Decoupling

capacitors required.
Please refers to Audio

interface chapter.

GPS Antenna

GND

GND

GND

GND

GND

GPIO1

GPIO4

SPI_CS

IIC_SCL
IIC_SDA

ADC1

ADC2
Reserve
Reserve

VRTC

79

C107

L101

33pF

77

NC

78

80

38

39
37

40

R106

51

54

11
12
13

If USB interface is used， co nnect

USB_VBUS to DC 4.4V-5.25V

28
27
31
32
36
29
33
30
35
36

74
75
73
76

6
7
8
9

45

44

Output : DC 1.5-3V

55
56

100uF

10K

C105C104

100nF

R107

10K

RF ON/OFF

USB_VBUS

USB_DM
USB_DP

123

456

789

*

Audio CODEC Chip

Display

47

46
15

16
42

C108

100uF

Input range:0-2.2V

If RTC is unused， keep

VRTC pin open.

L102
NC

Power supply

R105

300R

0

or

DSP

LCD

VREG_AUX

I2C_SCL

I2C_SDA

HKADC

LED

Network

Status

#

59

MAIN_ANT

NC

C107C106

57

GND

58

GND

60

GND

62

VBAT_RF
63
61

64

3

VBAT_RF

GND

GND

POWER_ON

C103C102C101

GPS_ANT

VBAT_BB

VBAT_BB

>64ms

47K

USB_VBUS

USB_DM
USB_DP

KEYSENSE_N0
KEYSENSE_N1

KEYSENSE_N2
KEYSENSE_N3
KEYSENSE_N4

KEYPAD_0
KEYPAD_1

KEYPAD_2

KEYPAD_3
KEYPAD_4

PCM_DIN/GPIO0
PCM_SYNC/GPIO2
PCM_DOUT/GPIO5

PCM_CLK/GPIO3

SPI_CLK_N

SPI_MISO_DATA

SPI_MOSI_DATA

CURRENT_SINK

VREG_AUX

TVS
SMF05C

4

71
68
67
66
69
70
72

17
19
18
20

23

24
26
25

22
21

49
52
53
50
48

1
2

5
10
14

41

43
65

RESET

UART_TXD
UART_RXD

UART_CTS
UART_RTS

UART_RI

UART_DCD
UART_DTR

USIM_DATA
USIM_CLK
USIM_RESET
V_USIM

MIC1P
MIC1N
EAR1P
EAR1N

SPK_P
SPK_N

GPIO40
GPIO41
GPIO42
GPIO43
GPIO44

GND
GND
GND
GND
GND
GND
GND
GND

Figure 48: System design

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B. SIM5320A GPIOs List

Table 46: SIM5320A GPIOs list

Name GPIO Index Default Function Alternate Function

PCM_DIN 0 GPIO Interrupt [LEVEL/LOW] PCM_DIN
STATUS_LED 1 Status led GPIO
PCM_SYNC 2 GPIO [IN] PCM_SYNC
PCM_CLK 3 GPIO [OUT/LOW] PCM_CLK
RF_SWITCH 4 RF Switch Enable/Disable RF subsystem
PCM_OUT 5 GPIO [OUT/LOW] PCM_OUT
KEYPAD_4 6 Keypad GPIO
KEYPAD_3 7 Keypad GPIO
KEYPAD_2 8 Keypad GPIO
KEYPAD_1 9 Keypad GPIO
KEYPAD_0 10 Keypad GPIO
KEYSENSE_N4 11 Keypad GPIO
KEYSENSE_N3 12 Keypad GPIO
KEYSENSE_N2 13 Keypad GPIO
KEYSENSE_N1 14 Keypad GPIO
KEYSENSE_N0 15 Keypad GPIO
UART1_CTS 33 CTS GPIO
UART1_RFR 34 RTS GPIO
UART1_DTR 35 DTR wake up module GPIO
UART_DCD 36 DCD GPIO
UART_RI 37 RI wake up host GPIO
GPIO40 40 Module power up status GPIO
GPIO41 41 Wake up host GPIO
GPIO42 42 GPIO GPIO
GPIO43 43 Wake up module GPIO
GPIO44 44 GPIO GPIO

C. Digital I/O Characteristics

Table 47: Digital I/O characteristics

Parameter Description

VREG_AUX LDO output

VIH

VIL

VOH

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High-level
input voltage

Low-level
input voltage

High-level

2.6V Mode 1.8V Mode
Unit

Min Typ Max Min Typ Max

0 2.6 2.9 0 1.8 1.84 V

1.69 2.6 2.9 1.17 1.8 2.1 V

-0.3 0 0.91 -0.3 0 0.63 V

1.17 2.6 2.6 0.81 1.8 1.8 V

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output voltage

VOL

Low-level
output voltage

0 0 0.45 0 0 0.45 V

Input high

IIH

leakage

- - 1 - - 1 uA

current

Input low

IIL

leakage

-1 - - -1 - - uA

current

CIN

Input

- - 7 - - 7 pF

capacitance

Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, SPI and DEBUG. The
SIM5320A includes two kinds of voltages: 1.8v and 2.6v. Digital I/O specifications under both conditions are presented in
the above tables.

D. Related Documents

Table 48: Related documents

SN Document name Remark

[1] SIM5320A_ATC_V1.00 SIM5320A_ATC_V1.00

[2]

[3] GSM 07.07

ITU-T Draft new
recommendationV.25ter

Serial asynchronous automatic dialing and control

Digital cellular telecommunications (Phase 2+); AT command set
for GSM Mobile Equipment (ME)

[4] GSM 07.10 Support GSM 07.10 multiplexing protocol

Digital cellular telecommunications (Phase 2+); Use of Data

[5] GSM 07.05

Terminal Equipment – Data Circuit terminating Equipment (DTE –
DCE) interface for Short Message Service (SMS) and Cell
Broadcast Service (CBS)

Digital cellular telecommunications system (Phase 2+);

[6] GSM 11.14

Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+);

[7] GSM 11.11

Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface

[8] GSM 03.38

Digital cellular telecommunications system (Phase 2+); Alphabets
and language-specific information

Digital cellular telecommunications system (Phase 2)； Mobile

[9] GSM 11.10

Station (MS) conformance specification； Part 1: Conformance
specification

[10] 3GPP TS 51.010-1

Digital cellular telecommunications system (Release 5); Mobile

Station (MS) conformance specification

[11]

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3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and

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ancillary equipment.

[12]

3GPP TS 34.121

Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.

Technical Specification Group Radio Access Network; Terminal

[13] 3GPP TS 34.123-1

conformance specification; Radio transmission and reception
(FDD)

[14]

3GPP TS 34.123-3

User Equipment (UE) conformance specification; Part 3: Abstract
Test Suites.

Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for

[15] EN 301 908-02 V2.2.1

IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article

3.2 of the R&TTE Directive

Electromagnetic compatibility and Radio Spectrum Matters (ERM);
Electromagnetic Compatibility (EMC) standard for radio

[16]

EN 301 489-24 V1.2.1

equipment and services; Part 24: Specific conditions for IMT-2000
CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio
and ancillary equipment

[17]

[18]

[19]

IEC/EN60950-1(2001)

3GPP TS 51.010-1

GCF-CC V3.23.1

Safety of information technology equipment (2000)

Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification

Global Certification Forum - Certification Criteria

Directive of the European Parliament and of the Council of 27

[20] 2002/95/EC

January 2003 on the restriction of the use of certain hazardous
substances in electrical and electronic equipment (RoHS)

[21]

[22]

[23]

Audio Application Note
V1.01

PCM Application Note
V1.02

Keypad Application
Note V1.01

Audio Application Note V1.01

PCM Application Note V1.02

Keypad Application Note V1.01

[24] Sleep_Application_Note Sleep_Application_Note
[25] Waking_up_Applicatio

Waking_up_Application_Note

n_Note

[26]

Module

secondary-SMT-UGD

SMT Note

E. Terms and Abbreviations

Table 49: Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme

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CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HR Half Rate
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
Inorm Normal Current
Imax Maximum Load Current
kbps Kilo bits per second
Li-Ion Lithium-Ion
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
Rx Receive Direction
SIM Subscriber Identification Module
SMS Short Message Service
SPI serial peripheral interface
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
Vmax Maximum Voltage Value
Vnorm Normal Voltage Value

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Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output High Level Voltage Value
VOHmin Minimum Output High Level Voltage Value
VOLmax Maximum Output Low Level Voltage Value
VOLmin Minimum Output Low Level Voltage Value
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
USIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter

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F. Safety Caution

Table 50: Safety caution

Marks Requirements

When in a hospital or other health care facility, observe the restrictions about the use of

mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive

to not operate normally for RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden to prevent

interference with communication systems. Forget to think much of these instructions

may lead to the flight safety or offend against local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or

fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,

chemical plants or where blasting operations are in progress. Operation of any electrical

equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while

switched on. RF interference can occur if it is used close to TV sets, radios, computers

or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when

driving a vehicle, unless it is securely mounted in a holder for hands free operation.

Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular

networks and cannot be guaranteed to connect in all conditions, for example no mobile

fee or a invalid SIM card. While you are in this condition and need emergent help,

please remember using emergency calls. In order to make or receive calls, the cellular

terminal or mobile must be switched on and in a service area with adequate cellular

signal strength.

Some networks do not allow for emergency call if certain network services or phone

features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate

those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular

terminal or mobile.

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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.

Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R.
China 200335
Tel: [phone]
Fax: [phone]
URL: www.sim.com/wm

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