Silicon Labs RS9116 Datasheet

RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
RS9116 n-Link™ and WiSeConnect™ Wi-Fi® and Dual-mode Bluetooth® 5
Wireless Connectivity CC1 Module Solutions
Overview
1.1 Features
Wi-Fi
Compliant to 1x1 IEEE 802.11 a/b/g/n with dual band (2.4 and 5 GHz) support
Transmit power up to +18 dBm in 2 GHz and +13.5 dBm in 5 GHz
Receive sensitivity as low as -96 dBm in 2 GHz and -89 dBm in 5 GHz
Data Rates: 802.11b: Up to 11 Mbps; 802.11g/a: Up to 54 Mbps; 802.11n: MCS0 to MCS7
Operating Frequency Range: 2412 MHz – 2484 MHz, 4.9 GHz – 5.975 GHz
Bluetooth
Transmit power up to +16 dBm with integrated PA
Receive sensitivity: LE: -92 dBm, LR 125 Kbps: -
102 dBm
Compliant to dual-mode Bluetooth 5
<8 mA transmit current in Bluetooth 5 mode, 2
Mbps data rate
Data rates: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps, 3 Mbps
Operating Frequency Range: 2.402 GHz - 2.480 GHz
Bluetooth 2.1 + EDR, Bluetooth Low Energy 4.0 /
4.1 / 4.2 / 5.0
Bluetooth Low Energy 1 Mbps, 2 Mbps and Long Range modes
Diversity is supported Power Consumption (2.4 GHz)
Wi-Fi Standby Associated mode current: 102 uA @ 1 second beacon interval
Wi-Fi 1 Mbps Listen current: 14 mA
Wi-Fi LP chain Rx current: 20 mA
Deep sleep current <1 uA, Standby current (RAM
retention) < 10 uA
Operating Conditions
Wide operating supply range: 1.75 V to 3.63 V
Operating temperature: -40 ºC to +85 ºC (Industrial
grade)
Size
Small Form Factor: 15 x 15.7 x 2.2 mm
Software Operating Modes
Hosted mode (n-Link™): Wi-Fi stack, Bluetooth stack and profiles and all network stacks reside on the host processor
Embedded mode (WiSeConnect™): Wi-Fi stack, TCP/IP stack, IP modules, Bluetooth stack and some profiles reside in RS9116; Some of the Bluetooth profiles reside in the host processor
Hosted Mode (n-Link™)
Available host interfaces: SDIO 2.0 and USB HS
Support for 20 MHz channel bandwidth
Bluetooth Low Energy Secure connections
Bluetooth Low Energy supports central role and
peripheral role concurrently
Bluetooth auto rate and auto TX power adaptation
Scatternet* with two slave roles while still being
visible
RF Features
Integrated baseband processor with calibration memory, RF transceiver, high-power amplifier, balun and T/R switch
Modules with Integrated Antenna and u.FL connector
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Application data throughput up to 50 Mbps (Hosted Mode) in 802.11n with 20 MHz bandwidth
Host drivers for Linux
Support for Client mode, Access point mode (Up to
16 clients), Concurrent Client and Access Point mode, and Enterprise Security
Support for concurrent Wi-Fi, dual-mode Bluetooth 5
Embedded Mode (WiSeConnect™)
Available host interface: UART, SPI, and USB CDC
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
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Support for Embedded Client mode, Access Point mode (Up to 8 clients), Concurrent Client and Access Point mode, and Enterprise Security
Supports advanced security features: WPA/WPA2- Personal and Enterprise
Integrated TCP/IP stack, HTTP/HTTPS, SSL/TLS, MQTT
Bluetooth inbuilt stack support for L2CAP, RFCOMM, SDP, SPP, GAP
Bluetooth profile support for GAP, SDP, SPP, GATT, L2CAP, RFCOMM
Wireless firmware update and provisioning
Support for concurrent Wi-Fi, dual-mode
Bluetooth 5
Security
Accelerators: AES128/256 in Embedded Mode
WPA/WPA2-Personal, WPA/WPA2 Enterprise for
Client
Software and Regulatory Certification
Wi-Fi Alliance*
Bluetooth Qualification*
Regulatory certifications (FCC, IC, CE/ETSI,
TELEC)*
Evaluation Kit
Dual Band EVK: RS9116X-DB-EVK1
* For a detailed list of software features and available profiles, refer to the Software Reference Manuals or contact Silicon Labs for availability.
All power and performance numbers are under ideal conditions.
1.2 Applications
Wearables Smart Watches, Wristbands, Fitness Monitors, Smart Glasses, etc. Smart Home Smart Locks, Motion/Entrance Sensors, Water Leak sensors, Smart plugs/switches, LED lights, Door-bell cameras,
Washers/Dryers, Refrigerators, Thermostats, Consumer Security cameras, Voice Assistants, etc. Other Consumer Applications Toys, Anti-theft tags, Smart dispensers, Weighing scales, Blood pressure monitors, Blood sugar monitors, Portable
cameras, etc. Other Applications (Medical, Industrial, Retail, Agricultural, Smart City, etc.) Healthcare Tags, Medical patches/pills, Infusion pumps, Sensors/actuators in Manufacturing, Electronic Shelf labels,
Agricultural sensors, Product tracking tags, Smart Meters, Parking sensors, Street LED lighting, Automotive After­market, Security Cameras, etc.
1.3 Description
Silicon Labs' RS9116 dual band CC1 module provides a comprehensive multi-protocol wireless connectivity solution including 802.11 a/b/g/n (2.4 GHz and 5 GHz), and dual-mode Bluetooth 5. The modules offer high throughput, extended range with power-optimized performance. The modules are FCC, IC, and ETSI/CE certified.
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
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1.4 Block Diagrams
Figure 1. CC1 Module Block Diagram
Figure 2. RS9116 Connectivity Hardware Block Diagram
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
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Figure 3. Hosted Software Architecture Figure 4. Embedded Software Architecture
1.5 Device Information
Part Number
Flash Type
Package Type
Package Size
Silicon Rev
Firmware Version
RS9116W-DB00-CC1-X24
Internal
SIP,LGA(155)
15 mm x 15.7 mm x 2.2 mm
1.3
1.2.24
RS9116W-DB00-CC1-B24
Internal
SIP,LGA(155)
15 mm x 15.7 mm x 2.2 mm
1.4
1.2.24
RS9116W-DB00-CC1-B2A
Internal
SIP,LGA(155)
15 mm x 15.7 mm x 2.2 mm
1.4
2.0
RS9116N-DB00-CC1-X00
Internal
SIP,LGA(155)
15 mm x 15.7 mm x 2.2 mm
1.3
Not Applicable
RS9116N-DB00-CC1-B00
Internal
SIP,LGA(155)
15 mm x 15.7 mm x 2.2 mm
1.4
Not Applicable
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
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Table of Contents
1 Overview ................................................................................................................................................................... 1
1.1 Features ................................................................................................................................................................. 1
1.2 Applications ............................................................................................................................................................ 2
1.3 Description ............................................................................................................................................................. 2
1.4 Block Diagrams ...................................................................................................................................................... 3
1.5 Device Information ................................................................................................................................................. 4
2 RS9116 CC1 Module Pinout and Pin Description ................................................................................................. 7
2.1 Pin Diagram ............................................................................................................................................................ 7
2.2 Pin Description ....................................................................................................................................................... 8
2.2.1 RF & Control Interfaces ....................................................................................................................................................... 8
2.2.2 Power & Ground Pins .......................................................................................................................................................... 8
2.2.3 Host & Peripheral Interfaces ................................................................................................................................................ 9
2.2.4 Miscellaneous Pins ............................................................................................................................................................ 22
3 RS9116 CC1 Module Specifications ..................................................................................................................... 23
3.1 Absolute Maximum Ratings.................................................................................................................................. 23
3.2 Recommended Operating Conditions .................................................................................................................. 24
3.3 DC Characteristics ............................................................................................................................................... 25
3.3.1 Reset Pin ........................................................................................................................................................................... 25
3.3.2 Power Sequence ............................................................................................................................................................... 26
3.3.3 Digital Input Output Signals ............................................................................................................................................... 30
3.3.4 USB ................................................................................................................................................................................... 30
3.3.5 Pin Capacitances ............................................................................................................................................................... 30
3.4 AC Characteristics ................................................................................................................................................ 30
3.4.1 Clock Specifications .......................................................................................................................................................... 30
3.4.2 SDIO 2.0 Slave .................................................................................................................................................................. 32
3.4.3 SPI Slave ........................................................................................................................................................................... 33
3.4.4 USB ................................................................................................................................................................................... 35
3.4.5 UART ................................................................................................................................................................................. 36
3.4.6 I2C Master and Slave ........................................................................................................................................................ 36
3.4.7 I2S/PCM Master and Slave ............................................................................................................................................... 37
3.4.8 GPIO pins .......................................................................................................................................................................... 38
3.5 RF Characteristics ................................................................................................................................................ 39
3.5.1 WLAN 2.4 GHz Transmitter Characteristics ...................................................................................................................... 39
3.5.2 WLAN 2.4 GHz Receiver Characteristics on High-Performance (HP) RF Chain ............................................................... 41
3.5.3 WLAN 2.4 GHz Receiver Characteristics on Low-Power (LP) RF Chain ........................................................................... 42
3.5.4 Bluetooth Transmitter Characteristics on High-Performance (HP) RF Chain .................................................................... 44
3.5.5 Bluetooth Transmitter Characteristics on Low-Power (LP) 0 dBm RF Chain ..................................................................... 45
3.5.6 Bluetooth Receiver Characteristics on High-Performance (HP) RF Chain ........................................................................ 46
3.5.7 Bluetooth Receiver Characteristics on Low-Power (LP) RF Chain .................................................................................... 49
3.5.8 WLAN 5GHz Transmitter Characteristics .......................................................................................................................... 51
3.5.9 WLAN 5GHz Receiver Characteristics .............................................................................................................................. 53
3.6 Typical Current Consumption ............................................................................................................................... 56
3.6.1 3.3 V .................................................................................................................................................................................. 56
4 RS9116 CC1 Module Detailed Description .......................................................................................................... 59
4.1 Overview............................................................................................................................................................... 59
4.2 Module Features .................................................................................................................................................. 59
4.2.1 WLAN ................................................................................................................................................................................ 59
4.2.2 Bluetooth ........................................................................................................................................................................... 59
4.2.3 RF Transceiver .................................................................................................................................................................. 61
4.2.4 Host Interfaces .................................................................................................................................................................. 61
4.2.5 Wireless Coexistence Manager ......................................................................................................................................... 61
4.2.6 Software ............................................................................................................................................................................ 61
4.2.7 Security ............................................................................................................................................................................. 62
4.2.8 Power Management .......................................................................................................................................................... 63
4.2.9 Low power modes ............................................................................................................................................................. 63
4.2.10 Memory ............................................................................................................................................................................. 64
5 RS9116 CC1 Module Reference Schematics, BOM and Layout Guidelines .................................................... 65
5.1 SDIO/SPI/UART ................................................................................................................................................... 65
5.1.1 Schematics ........................................................................................................................................................................ 65
5.1.2 Bill of Materials .................................................................................................................................................................. 67
5.2 USB/USB-CDC ..................................................................................................................................................... 68
5.2.1 Schematics ........................................................................................................................................................................ 68
5.2.2 Bill of Materials .................................................................................................................................................................. 70
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5.3 Layout Guidelines ................................................................................................................................................. 71
6 RS9116 CC1 Module Antenna Specifications ..................................................................................................... 75
6.1 Overview............................................................................................................................................................... 75
6.2 PCB Antenna Performance Specifications ........................................................................................................... 75
6.2.1 Return Loss Characteristic of the Antenna ........................................................................................................................ 75
6.2.2 Module Reference Orientation ........................................................................................................................................... 75
6.2.3 2D Gain Plots at 2.4 GHz .................................................................................................................................................. 76
6.2.4 2D Gain Plots at 2.430 GHz .............................................................................................................................................. 78
6.2.5 2D Gain Plots at 2.480 GHz .............................................................................................................................................. 79
6.2.6 2D Gain Plots at 5.1 GHz .................................................................................................................................................. 81
6.2.7 2D Gain Plots at 5.5 GHz .................................................................................................................................................. 82
6.2.8 2D Gain Plots at 5.9 GHz .................................................................................................................................................. 84
6.3 Antenna Parameters ............................................................................................................................................ 85
6.4 Mechanical Characteristics .................................................................................................................................. 85
7 RS9116 CC1 Module Storage, Handling and Soldering Conditions ................................................................. 86
7.1 Recommended Reflow Profile .............................................................................................................................. 86
7.2 Baking Instructions ............................................................................................................................................... 86
8 RS9116 CC1 Module Package Description.......................................................................................................... 87
8.1 Dimensions ........................................................................................................................................................... 87
8.1.1 Packing Information of Modules with Package Codes CC1 ............................................................................................... 87
8.2 Package Outline ................................................................................................................................................... 88
8.3 PCB Landing Pattern ............................................................................................................................................ 89
9 RS9116 CC1 Module Certification and Ordering Information ........................................................................... 90
9.1 Certification Information ....................................................................................................................................... 90
9.2 Compliance and Certification ............................................................................................................................... 90
9.2.1 Federal Communication Commission Statement ............................................................................................................... 90
9.2.2 Industry Canada / ISED Statement .................................................................................................................................... 91
9.2.3 CE ..................................................................................................................................................................................... 92
9.2.4 TELEC ............................................................................................................................................................................... 92
9.2.5 Qualified Antenna Types ................................................................................................................................................... 92
9.2.6 Module Marking Information .............................................................................................................................................. 93
9.3 Module Package ................................................................................................................................................... 94
9.4 Ordering Information ............................................................................................................................................ 94
9.4.1 Device Nomenclature ........................................................................................................................................................ 95
10 RS9116 CC1 Module Documentation and Support ......................................................................................... 96
10.1 Resource Location ............................................................................................................................................ 96
11 RS9116 CC1 Module Revision History ............................................................................................................. 97
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
2 RS9116 CC1 Module Pinout and Pin Description
2.1 Pin Diagram
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GND
GPIO_51
GPIO_49
GPIO_47
SDIO_CLK/
SPI_CLK
SDIO_D0/ SPI_MOSI
SDIO_D2
/
SPI_INTR
SDIO_IO_VDD
USB_DP
USB_VBUS
USB_AVDD_1P1
GND
GND
GND
GND
VOUTLDOSOC
NC
GPIO_50
GPIO_46
GPIO_48
GPIO_15
SDIO_CMD/
SPI_CSN
SDIO_D1/ SPI_MISO
SDIO_D3/ SP USB_CDC_DIS
USB_DM
USB_AVDD_3P3
UULP_VBATT_1
GND
GND
GND
VIN_3P3
GND
GNDNCNCNCNCNCJP0
NC
RESET_N
GND
GND
GND
GNDNCNCNCNC
GND
GND
GNDNCNCNCJP2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
RF_AVDD_BTTX
PA5G_AVDD
NC
AVDD_1P9_3P3
NC
UULP_VBAT_GPIO_3
ULP_GPIO_10
GND
GND
GND
GND
GND
GND
GND
GND
GND
VOUTLDOAFE
GND
NC
NC
NC
NC
GPIO_11
GPIO_6
UART1_TX
UULP_VBAT_GPIO_4
GND
GND
GND
GPIO_54
GPIO_52
GPIO_10
GPIO_12
GND
GND
GND
GND
GPIO_56
GPIO_55
GPIO_53
UART1_RX
GND
GND
GND
GND
GPIO_57NCUSB_ID
GND
GND
GND
GND
GND
ULP_IO_VDDNCGPIO_38
GPIO_7
GND
GND
GND
GND
VOUTLDO1P8
UULP_AVDD
JNC
JP1
GND
GND
GND
GND
1
3
2
4
6
5
7
9
8
10
11
13
15
14
16
17
58
60
59
61
63
62
64
66
65
67
69
68
70
71
72
57
55
56
54
52
53
51
49
50
48
47
45
43
44
42
41
107
105
106
104
102
103
101
100
999897
96
95
94
93
18
19
20212223242526
27
28
293031
323334
35
36
37
383940
737475
76
77
78
798081
82
83
8485868788
89
90
91
92
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
ULP_GPIO_0
ULP_GPIO_5
UULP_VOUTSCDC
POC_OUT
AVDD_1P2
RF_AVDD33
46
12
I_ERR_INTR/
_RETN
Power Supplies
Host
GPIO & Peripherals
Grounds
RF & Control
Miscellaneous
NC
Figure 5. RS9116 CC1 Pin Diagram
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
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2.2 Pin Description
2.2.1 RF & Control Interfaces
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
RESET_N
33
UULP_VBATT_1
Input
NA
Active-low reset asynchronous reset signal
POC_IN
30
UULP_VBATT_1
Input
NA
Power On Control Input
POC_OUT
84
UULP_VBATT_1
Ouput
NA
Power On Control Output
Table 1. RF & Control Interfaces
2.2.2 Power & Ground Pins
Pin Name
Type
Pin Number
Direction
Description
UULP_VBATT_1
Power
67
Input
Always-on VBATT Power supply to the UULP domains
VIN_3P3
Power
71
Input
Digital Power Supply
VOUTLDOSOC
Power
16
Output
Output of SoC LDO
VOUTLDO1P8
Power
108
Output
Output of 1.8V LDO
VOUTLDOAFE
Power
98
Output
Output of AFE LDO
SDIO_IO_VDD
Power
8
Input
I/O Supply for SDIO I/Os. Refer to the GPIOs section for details on which GPIOs have this as the I/O supply.
ULP_IO_VDD
Power
116
Input
I/O Supply for ULP GPIOs
PA5G_AVDD
Power
47
Input
Power supply for the 5 GHz RF Power Amplifier
RF_AVDD_BTTX
Power
48
Input
Power supply for Bluetooth Transmit circuit.Connect to VOUTLDOAFE as per the Reference Schematics.
RF_AVDD33
Power
86
Input
Power supply for the 5 GHz RF
AVDD_1P9_3P3
Power
45
Input
Power supply for the 5 GHz RF
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Pin Name
Type
Pin Number
Direction
Description
AVDD_1P2
Power
85
Input
Power supply for the 5 GHz RF. Connect to VOUTLDOSOC as per the Reference Schematics.
UULP_VOUTSCDC
Power
79
Output
UULP Switched Cap DCDC Output
UULP_VOUTSCDC_RE TN
Power
77
Output
UULP Retention Supply Output
UULP_AVDD
Power
109
Input
Power supply for the always-on digital and ULP peripherals.Connect to UULP_VOUTSCDC as per the Reference Schematics.
USB_AVDD_3P3
Power
66
Input
Power Supply for the USB interface
USB_AVDD_1P1
Power
11
Input
Power supply for the USB core
GND
Ground
1, 12, 13, 14, 15, 17, 19, 34, 35, 36, 41, 49, 50, 51, 52, 53, 54, 55, 56, 57, 68, 69, 70, 72, 73, 74, 87, 88, 89, 93, 97, 99, 100, 101, 102, 103, 104, 105, 106, 107, 112, 113, 114, 115, 120, 121, 122, 123, 127, 128, 129, 130, 131, 136, 137, 138, 139, 144, 145, 146, 147, 153, 154, 155
GND
Common ground pins
Table 2. Power and Ground Pins
2.2.3 Host & Peripheral Interfaces
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
GPIO_6
150
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
I2S_DOUT - I2S interface output data.
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Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
PCM_DOUT - PCM interface output data.
GPIO_7
119
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
I2S_CLK - I2S interface clock.
PCM_CLK - PCM interface clock.
UART1_RX
135
VIN_3P3
Inout
HighZ
Host
Default
Sleep
UART
UART1_RX
- UART Host
interface serial input.
HighZ
Non UART
HighZ
HighZ
The UART interface is supported only in WiSeConnect™.
UART1_TX
151
VIN_3P3
Inout
HighZ
Host
Default
Sleep
UART
UART1_TX ­UART Host interface serial output.
HighZ
Non UART
HighZ
HighZ
The UART interface is supported only in WiSeConnect™.
GPIO_10
142
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
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Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
This pin can be configured by software to be any of the following
I2S_DIN: I2S interface input data.
PCM_DIN - PCM interface input data.
GPIO_11
149
VIN_3P3
Inout
HighZ
Default : HighZ. Sleep: HighZ
This pin can be configured by software to be any of the following
I2S_WS: I2S interface Word Select.
PCM_FSYNC: PCM interface Frame
Synchronization signal.
GPIO_12
143
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
UART1_RTS - UART interface Request to Send, if UART Host Interface flow control is enabled.
The UART interface is supported only in WiSeConnect™.
GPIO_15
61
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
UART1_CTS - UART interface Clear to Send, if UART Host Interface flow control is enabled.
UART1_TRANSPARENT_MODE -
UART Host interface Transparent Mode, Indication that module has
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Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
entered into TRANSPERENT_MODE
TSF_SYNC - Transmit Synchronization Function signal to indicate to the Host when a packet is transmitted. The signal is toggled once at the end of every transmitted packet.
The UART interface is supported only in WiSeConnect™.
SDIO_CLK/SPI_CLK
5
SDIO_IO_VDD
Inout
HighZ
Host
Default
Sleep
SDIO
SDIO_CLK ­SDIO interface clock
HighZ
SPI
SPI_CLK ­SPI Slave interface clock
HighZ Non
SDIO,SPI
HighZ
HighZ
The SPI interface is supported only in WiSeConnect™.
SDIO_CMD/SPI_CSN
62
SDIO_IO_VDD
Inout
HighZ
Host
Default
Sleep
SDIO
SDIO_CMD
- SDIO
interface CMD signal
HighZ
SPI
SPI_CSN ­Active-low Chip Select signal of SPI
HighZ
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Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
Slave interface
Non SDIO,SPI
HighZ
HighZ
The SPI interface is supported only in WiSeConnect™.
SDIO_D0/SPI_MOSI
6
SDIO_IO_VDD
Inout
HighZ
Host
Default
Sleep
SDIO
SDIO_D0 ­SDIO interface Data0 signal
HighZ
SPI
SPI_MOSI ­SPI Slave interface Master-Out­Slave-In signal
HighZ
Non SDIO,SPI
HighZ
HighZ
The SPI interface is supported only in WiSeConnect™.
SDIO_D1/SPI_MISO
63
SDIO_IO_VDD
Inout
HighZ
Host
Default
Sleep
SDIO
SDIO_D1 ­SDIO interface Data1 signal
HighZ SPI
SPI_MISO ­SPI Slave interface Master-In-
HighZ
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Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
Slave-Out signal
Non SDIO,SPI
HighZ
HighZ
The SPI interface is supported only in WiSeConnect™.
SDIO_D2/SPI_INTR
7
SDIO_IO_VDD
Inout
HighZ
Host
Default
Sleep
SDIO
SDIO_D2 ­SDIO interface Data2 signal
HighZ
SPI
SPI_INTR ­SPI Slave interface Interrupt Signal to the Host
HighZ
Non SDIO,SPI
HighZ
HighZ
The SPI interface is supported only in WiSeConnect™.
SDIO_D3/SPI_ERR_INT R/USB_CDC_DIS
64
SDIO_IO_VDD
Inout
Pullup
Host
Default
Sleep
SDIO
SDIO_D3 ­SDIO interface Data3 signal
HighZ
SPI
SPI_ERR_I NTR - SPI Bus Error Interrupt Signals
HighZ
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 15 | Page PRELIMINARY | Subject to change.
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
USB
USB_CDC_ DIS - USB­CDC Active­High Disable Signal
HighZ
Non SDIO,SPI
HighZ
HighZ
The SPI interface is supported only in WiSeConnect™.
GPIO_38
118
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_46
59
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_47
4
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_48
60
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_49
3
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_50
58
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_51
2
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_52
141
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_53
134
VIN_3P3
Inout
HighZ
Default : HighZ
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 16 | Page PRELIMINARY | Subject to change.
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
Sleep: HighZ
GPIO_54
140
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_55
133
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_56
132
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
GPIO_57
124
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
ULP_GPIO_0
25
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
WLAN_ACTIVE*: Active-High signal to indicate to an external Bluetooth IC that WLAN transmission is active. Part of the 3-wire coexistence interface.
*This pin is intended to act as WLAN_ACTIVE for wireless coexistence. Please contact Silicon Labs to learn about availability of this feature.
ULP_GPIO_1
76
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
BT_ACTIVE*: Active-High signal from an external Bluetooth IC that it is transmitting. Part of the 3-wire coexistence interface.
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 17 | Page PRELIMINARY | Subject to change.
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
*This pin is intended to act as BT_ACTIVE for Bluetooth coexistence. Please contact Silicon Labs to learn about availability of this feature.
ULP_GPIO_4
26
VIN_3P3
Inout
HighZ
Default : HighZ
ULP_GPIO_5
90
VIN_3P3
Inout
HighZ
Default : LP_WAKEUP_IN This is LP Powersave Wakeup indication from Device
Sleep: HighZ This pin can be configured by software to
be any of the following
LP_WAKEUP_IN :This is LP Powersave Wakeup indication to Device from HOST
HOST_WAKEUP_INDICATION : This is used as indication from Host to dev that host is ready to take the packet and Device can transfer the packet to host. This is supported only in UART host mode. The UART interface is supported only in WiSeConnect™.
ULP_GPIO_6
20
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
WAKEUP_FROM_Dev* - Used as a wakeup indication to host from device
BT_PRIORITY**: Active-high signal from an external Bluetooth IC that indicates that the Bluetooth transmissions are a higher priority.
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 18 | Page PRELIMINARY | Subject to change.
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
*For Wake-on-Wireless feature this pin needs to have a weak pull up resistor externally.
**This pin is intended to act as BT_PRIORITY for Bluetooth coexistence. Please contact Silicon Labs to learn about availability of this feature.
ULP_GPIO_7
24
VIN_3P3
Inout
HighZ
Default : HighZ
ULP_GPIO_8
80
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
LED0: Control signal to an external LED.
(* LED0 functionality currently not available in WiSeConnect™ modules)
UART2_TX
91
VIN_3P3
Inout
HighZ
Default : UART2_TX- Debug UART Interface serial output
Sleep: HighZ UART2_TX : Debug UART interface serial
output.
ULP_GPIO_10
42
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
I2C_SCL: I2C interface clock.
ULP_GPIO_11
31
VIN_3P3
Inout
HighZ
Default : HighZ Sleep: HighZ
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 19 | Page PRELIMINARY | Subject to change.
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
This pin can be configured by software to be any of the following
I2C_SDA: I2C interface data.
UULP_VBAT_GPIO_0
83
UULP_VBATT_1
Output
High
Default : EXT_PG_EN Sleep: SLEEP_IND_FROM_DEV /
EXT_PG_EN This pin can be configured by software to
be any of the following
SLEEP_IND_FROM_DEV: This signal is used to send an indication to the Host processor. An indication is sent when the chip enters (logic low) and exits (logic high) the ULP Sleep mode.
EXT_PG_EN: Active-high enable signal to an external power gate which can be used to control the power supplies other than Always-ON VBATT Power Supplies in ULP Sleep mode.
HOST_BYP_ULP_WAK EUP
92
UULP_VBATT_1
Input
HighZ
Default : HOST_BYP Sleep: ULP_WAKEUP
This signal has two functionalities – one during the bootloading process and one after the bootloading. During bootloading, this signal is an active-high input to indicate that the bootloader should bypass any inputs from the Host processor and continue to load the default firmware from Flash. After bootloading, this signal is an active-high input to indicate that the module should wakeup from its Ultra Low Power (ULP) sleep mode. The bootloader bypass functionality is supported only in WiSeConnect™.
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 20 | Page PRELIMINARY | Subject to change.
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
UULP_VBAT_GPIO_3
43
UULP_VBATT_1
Inout
HighZ
Default : HighZ Sleep: XTAL_32KHZ_IN
/ SLEEP_IND_FROM_DEV This pin can be configured by software to
be any of the following
XTAL_32KHZ_IN: This pin can be used to feed external clock from a host processor or from external crystal oscillator.
SLEEP_IND_FROM_DEV: This signal is used to send an indication to the Host processor. An indication is sent when the chip enters (logic low) and exits (logic high) the ULP Sleep mode.
UULP_VBAT_GPIO_4
152
UULP_VBATT_1
Inout
HighZ
Default : HighZ Sleep: HighZ
This pin can be configured by software to be any of the following
XTAL_32KHZ_IN: This pin can be used to feed external clock from a host processor or from external crystal oscillator.
JP0
29
VIN_3P3
Input
Pullup
Default : JP0 Sleep: HighZ
JP0 - Reserved. Connect to a test point for debug purposes.
JP1
111
VIN_3P3
Input
Pullup
Default : JP1 Sleep: HighZ
JP1 - Reserved. Connect to a test point for debug purposes.
JP2
82
VIN_3P3
Input
Pullup
Default : JP2
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
1,2,3,4
Sleep: HighZ
JP2 - Reserved. Connect to a test point for debug purposes.
JNC
110
VIN_3P3
NC
Pullup
Default : JNC Sleep: HighZ
JNC - Reserved. Connect to a test point for debug purposes.
USB_DP
9
USB_AVDD_3P3
Inout
NA
Positive data channel from the USB connector.
USB_DM
65
USB_AVDD_3P3
Inout
NA
Negative data channel from the USB connector.
USB_ID
126
USB_AVDD_3P3
Input
NA
ID signal from the USB connector.
USB_VBUS
10
USB_AVDD_3P3
Input
NA
5V USB VBUS signal from the USB connector
Table 3. Host and Peripheral Interfaces
1. "Default" state refers to the state of the device after initial boot loading and firmware loading is complete.
2. "Sleep" state refers to the state of the device after entering Sleep state which is indicated by Active-High "SLEEP_IND_FROM_DEV" signal.
3. Please refer to "RS9116N Open Source Driver Technical Reference Manual" for software programming information in hosted mode.
4. Please refer to "RS9116W SAPI Programming Reference Manual" for software programming information in embedded mode.
5. There are some functionalities, such as SLEEP_IND_FROM_DEV, that are available on multiple pins. However, these pins have other multiplexed functionalities.
Any pin can be used based on the required functionality. Customer has to note the default states before using appropriate pin.
silabs.com | Building a more connected world. Rev 1.0.8 21 | Page
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RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 22 | Page PRELIMINARY | Subject to change.
2.2.4 Miscellaneous Pins
Pin Name
Pin Number
I/O Supply Domain
Direction
Initial State (Power up, Active Reset)
Description
NC
18,21, 22, 23, 27, 28, 32. 37, 38, 39, 40, 44, 46, 75, 78, 81, 94, 95, 96, 117, 148, 125
NA
NA
NA
No connect.
Table 4. Miscellaneous Pins
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 23 | Page PRELIMINARY | Subject to change.
3 RS9116 CC1 Module Specifications
3.1 Absolute Maximum Ratings
Functional operation above maximum ratings is not guaranteed and may damage the device. Exposure to maximum
rating conditions for extended periods may affect device reliability.
Symbol
Parameter
Min
Max
Units
T
store
Storage temperature
-40
+125 oC
T
j(max)
Maximum junction temperature
-
+125 oC
UULP_VBATT_1
Always-on VBATT supply to the UULP Domains
-0.5
3.63
V
UULP_VBATT_2
Always-on VBATT supply to the UULP Domains
-0.6
3.63
V
RF_VBATT
Always-on VBATT Power supply to the RF
-0.5
3.63
V
VINBCKDC
Power supply for the on-chip Buck
-0.5
3.63
V
VINLDOSOC
Power supply for SoC LDO
-0.5
1.8
V
IO_VDD_1
I/O supplies for GPIOs
-0.5
3.63
V
SDIO_IO_VDD
I/O supplies for SDIO I/Os
-0.5
3.63
V
ULP_IO_VDD
I/O supplies for ULP GPIOs
-0.5
3.63
V
PA2G_AVDD
Power supply for the 2.4 GHz RF Power Amplifier
-0.5
3.63
V
PA5G_AVDD
Power supply for the 5 GHz RF Power Amplifier
-0.5
3.63
V
RF_AVDD
Power supply for the 2.4 GHz RF and AFE
-0.5
1.98
V
RF_AVDD_BTTX
Power supply for Bluetooth Transmit circuit.
-0.5
1.21
V
RF_AVDD33
Power supply for the 5 GHz RF
-0.5
3.63
V
AVDD_1P9_3P3
Power supply for the 5 GHz RF
-0.5
3.63
V
AVDD_1P2
Power supply for the 5 GHz RF
-0.5
1.32
V
UULP_AVDD
Power supply for the always-on digital and ULP peripherals
-0.5
1.21
V
USB_AVDD_3P3
Power supply for the USB interface
-0.5
3.63
V
USB_AVDD_1P1
Power supply for the USB core
-0.5
1.26
V
ESD
HBM
Electrostatic discharge tolerance (HBM) Compliant with JEDEC specification JS-001-
2017
2000 V
ESD
CDM
Electrostatic discharge tolerance (CDM) Compliant with JEDEC specification JS-002­2014
-
500
V
LU
Latchup Immunity ICE criteria at ambient temp of 25oC Compliant with JESD78D
-50
100
mA
I
max
Maximum Current consumption in TX mode
-
400
mA
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 24 | Page PRELIMINARY | Subject to change.
Symbol
Parameter
Min
Max
Units
P
max
RF Power Level Input to the chip
-
10
dBm
I
Pmax
Peak current rating for power supply
-
500
mA
Table 5. Absolute Maximum Ratings
3.2 Recommended Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Units
T
ambient
Ambient temperature
-40
25
85 oC
UULP_VBATT_1
Always-on VBATT supply to the UULP Domains
3
3.3
3.63
V
UULP_VBATT_2
Always-on VBATT supply to the UULP Domains
3
3.3
3.63
V
RF_VBATT
Always-on VBATT Power supply to the RF
1.8
3.3
3.63
V
VINBCKDC
Power supply for the on-chip Buck
3
3.3
3.63
V
VINLDOSOC
Power supply for SoC LDO
1.1
1.35
1.55
V
IO_VDD_1
I/O supply for GPIOs
3
3.3
3.63
V
SDIO_IO_VDD
I/O supply for SDIO I/Os
1.8
3.3
3.63
V
ULP_IO_VDD
I/O supply for ULP GPIOs
1.8
3.3
3.63
V
PA2G_AVDD
Power supply for the 2.4 GHz RF Power Amplifier
1.8
3.3
3.63
V
PA5G_AVDD
Power supply for the 2.4 GHz RF Power Amplifier
3
3.3
3.63
V
RF_AVDD
Power supply for the 2.4 GHz RF and AFE
1.3
1.35
1.8
V
RF_AVDD_BTTX
Power supply for Bluetooth Transmit circuit.
1.0
1.1
1.2
V
RF_AVDD33
Power supply for the 5 GHz RF
3
3.3
3.6
V
AVDD_1P9_3P3
Power supply for the 5 GHz RF
1.9
3.3
3.6
V
AVDD_1P2
Power supply for the 5 GHz RF (1.2V)
1.05
1.1
1.2
V
UULP_AVDD
Power supply for the always-on digital and ULP peripherals
0.95
1.0
1.21
V
USB_AVDD_3P3
Power supply for the USB interface
3.0
3.3
3.63
V
USB_AVDD_1P1
Power supply for the USB core
0.99
1.1
1.21
V
Table 6. Recommended Operating Conditions
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 25 | Page PRELIMINARY | Subject to change.
3.3 DC Characteristics
3.3.1 Reset Pin
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIH
High level input voltage @3.3V
0.8 * VDD
-
3.63
V
High level input voltage @1.8V
1.17 - 2.1
V
VIL
Low level input voltage @3.3V
-0.5
-
0.3 * VDD
V
Low level input voltage @1.8V
-0.3
-
0.63
V
V
hys
Hysteresis voltage
0.05 * VDD
- - V
Table 7. Reset Pin
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
3.3.2 Power Sequence
The POC_IN and RESET_N signals should be controlled from external sources such as R/C circuits, and/or other MCU's GPIOs. However POC_OUT can be connected to POC_IN through an R-C, if the supply voltage is 3.3V. Below waveforms show power sequence (Up & Down) requirements under various application needs. Note that below waveforms are not to scale.
3.3.2.1 Power-Up and Down Sequence with External 1.4V supply and POC_IN
The diagram below shows connections of various power supply voltages, POC_IN and RESET_N. These connections can be used when:
System PMU (outside RS9116) can provide 1.4V supply, and hence the internal Buck regulator in RS9116 can be disabled.
The 1.1V supply is still derived from LDO SoC (internal to RS9116).
POC_IN is controlled externally.
NOTE:
1. Above shown is a typical connection diagram. Some of the supply pins shown above may or may not be present in the IC/Module. Check the Pinout table in this datasheet and connect accordingly.
2. * = Provide the supply voltages as per the specifications mentioned in this datasheet.
3. ** = USB power supply input connection is required if USB interface is present and used. Else, follow the connection as shown in Reference Schematics.
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RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
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NOTE:
1. VBATT supply shown above must be connected to the power supply pins of IC/Module. For example, SDIO_IO_VDD, ULP_IO_VDD, UULP_VBATT_1, etc.
2. Above POC_IN waveform is applicable if it is externally driven. Else, that particular waveform can be ignored, and the RESET_N timing can be considered after/before external power supplies ramp-up/down.
3.3.2.2 Power-Up and Down Sequence with External POC_IN
The diagram below shows connections of various power supply voltages, POC_IN and RESET_N. These connections can be used when:
System PMU cannot provide 1.4V or 1.1V supplies and the internal buck and LDO of RS9116 are used.
POC_IN is controlled externally.
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 28 | Page PRELIMINARY | Subject to change.
NOTE:
1. Above shown is a typical connection diagram. Check the Reference Schematics for connections of other power supplies.
NOTE:
1. VBATT supply shown above must be connected to the power supply pins of IC/Module. For example, SDIO_IO_VDD, ULP_IO_VDD, UULP_VBATT_1, etc.
3.3.2.3 Power-Up and Down Sequence with POC_IN Connected Internally
The diagram below shows connections of various power supply voltages, POC_IN and RESET_N. The typical applications of this connection can be as followws.
System cannot provide external 1.4V & 1.1V supplies and the internal buck and LDO of RS9116 are used.
POC_IN is looped back from POC_OUT.
NOTE:
1. Above shown is a typical connection diagram. Check the Reference Schematics for connections of other power supplies.
2. POC_OUT can be connected to POC_IN if the supply voltage is 3.3V only. Else, POC_IN has to be driven externally.
RS9116 CC1 Connectivity Module Datasheet v1.0.8, Dec-2020
silabs.com | Building a more connected world. Rev 1.0.8 29 | Page PRELIMINARY | Subject to change.
NOTE:
1. VBATT supply shown above must be connected to the power supply pins of IC/Module. For example, SDIO_IO_VDD, ULP_IO_VDD, UULP_VBATT_1, etc.
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