Silicon Labs BLE113 DATA SHEET
BLE113
DATA SHEET
Wednesday, 02 December 2020
Version 1.9
Silicon Labs
VERSION HISTORY
Version
Comment
1.0
Preliminary datasheet -> production datasheet. No changes
1.1
Pull-up resistors added to P1_0 and P1_1 in the example schematic
1.2
5 mm restriction removed from the FCC statement
1.3
Product code for 256k variant added. Peripheral mapping table: analog
comparator added. Added note that pins configured as peripheral I/O signals
do not have pull-up / -down capability. RF Characteristics added.
1.4
Product numbering updated
1.41
CE info
1.42
Updated FCC ID in one incorrect location
1.43
PIO current drive capability figures added
1.44
Current consumption profile added
1.45
SPI slave mode removed
1.46
Example layouts added
1.47
TXP vs hw config figure corrected
1.48
Updated I2C description on table 2
1.49
I2C description corrected as it cannot be used as digital I/O.
1.50
Recommended stencil thickness updated
1.51
Added section on package marking
1.6
Added tape and reel information
1.7
Updated description of encryption modes
1.8
Updated certification information
1.9
Renamed "Bluetooth Smart" to "Bluetooth Low Energy" according to the
official Bluetooth SIG nomenclature
Silicon Labs
TABLE OF CONTENTS
1 BLE113 Product numbering ..........................................................................................................................5
2 Pinout and Terminal Description ...................................................................................................................6
2.1 I/O Ports .................................................................................................................................................9
2.2 UART ......................................................................................................................................................9
2.3 Electrical Characteristics ..................................................................................................................... 10
2.4 Absolute Maximum Ratings ................................................................................................................ 10
2.5 Recommended Operating Conditions ................................................................................................. 10
2.6 DC Characteristics .............................................................................................................................. 10
2.7 Current Consumption .......................................................................................................................... 12
2.8 RF Characteristics ............................................................................................................................... 13
2.9 Antenna characteristics ....................................................................................................................... 14
3 Physical Dimensions .................................................................................................................................. 17
4 Power-On Reset and Brownout Detector ................................................................................................... 19
5 Design Guidelines ...................................................................................................................................... 20
5.1 General Design Guidelines ................................................................................................................. 20
5.2 Layout Guide Lines ............................................................................................................................. 20
5.3 BLE113-A Layout Guide ..................................................................................................................... 21
6 Soldering Recommendations ..................................................................................................................... 23
7 Block diagram ............................................................................................................................................. 24
8 Package Marking ........................................................................................................................................ 27
9 Certifications ............................................................................................................................................... 28
9.1 Bluetooth ............................................................................................................................................. 28
9.2 FCC and IC ......................................................................................................................................... 28
9.2.1 FCC et IC ..................................................................................................................................... 29
9.3 CE ....................................................................................................................................................... 31
9.4 MIC Japan ........................................................................................................................................... 31
9.5 KCC (Korea) ........................................................................................................................................ 31
9.6 Anatel (Brazil) ...................................................................................................................................... 31
9.7 NCC (Taiwan) ...................................................................................................................................... 31
10 Tape and reel information ....................................................................................................................... 33
11 Reel appearance and dimensions .......................................................................................................... 34
Silicon Labs
BLE113 Bluetooth® Low Energy Module
DESCRIPTION
BLE113 is a Bluetooth Low Energy module
targeted for small and low power sensors and
accessories. It integrates all features required
for a Bluetooth Low Energy application:
Bluetooth radio, software stack and GATT
based profiles.
BLE113 Bluetooth Low Energy module can
also host end user applications, which means
no external micro controller is required in size
or price constrained devices.
BLE113 module has flexible hardware
interfaces to connect to different peripherals
and sensors. BLE113 can be powered directly
from a standard 3V coin cell battery or pair of
AAA batteries.
In lowest power sleep mode it consumes only
500nA and will wake up in few hundred
microseconds.
APPLICATIONS:
• Health and fitness sensors
• Medical sensors
• iPhone and iPad accessories
• Security and proximity tags
• Key fobs
• Smart home sensors and collectors
• Wireless keys
• HID keyboards and mice
KEY FEATURES:
• Bluetooth v. 4.0, single mode compliant
o Supports master and slave modes
o Up to eight connections
• Integrated Bluetooth Low Energy stack
o GAP, GATT, L2CAP and SMP
o Bluetooth Low Energy profiles
• Radio performance
o TX power : 0 dBm to -23 dBm
o Receiver sensitivity: -93 dBm
• Ultra low current consumption
o Transmit: 18.2 mA (0dBm)
o Transmit: 14.3 mA (0dBm +
DC/DC)
o Receive: 14.3 mA
o Sleep mode 3: 0.4 uA
• Flexible peripheral interfaces
o UART and SPI
o I2C, PWM and GPIO
o 12-bit ADC
• Host interfaces:
o UART
• Programmable 8051 processor for stand-
alone operation
• Dimensions: 9.15 x 15.75 x 2.1 mm
• Bluetooth, CE, FCC, IC, South Korea,
Japan, Brazil and Taiwan qualified
Silicon Labs
Page 5 of 35
1 BLE113 Product numbering
Product code
Description
BLE113-A
BLE113 with integrated chip antenna, 128k flash memory
BLE113-A-M256K
BLE113 with integrated chip antenna, 256k flash memory
Silicon Labs
Page 6 of 35
2 Pinout and Terminal Description
GND
GND
GND
GND
GND
GND
GND
AVDD
P2_2
P2_1
P2_0
P1_7
P1_6
SCL
SDA
NC
DVDD
GND
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
GND
P0_7
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
NC
GND
Reset#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
1920212223
24
25
26
27
28
29
30
31
32
33
35
36
34
Figure 1: BLE113
RESET 34 Active low reset. Internal pull-up.
GND
1 - 7, 18,
25, 36
GND GND
DVDD 17 Supply voltage Supply voltage 2V - 3.6V
AVDD 8 Supply voltage Supply voltage 2V - 3.6V
Table 1: Supply and RF Terminal Descriptions
Silicon Labs
Page 7 of 35
9 P2_2
10 P2_1
11 P2_0
12 P1_7
13 P1_6
19 P1_5
20 P1_4
21 P1_3
22 P1_2
26 P0_7
27 P0_6
28 P0_5
29 P0_4
30 P0_3
31 P0_2
32 P0_1
33 P0_0
23 P1_1
24 P1_0
14 SCL
I2C clock
I2C clock pin. Leave floating if not used.
15 SDA
I2C data
I2C data pin. Leave floating if not used.
Configurable I/O port, See table 3
Digital I/O
Configurable I/O port with 20mA driving
capability, See table 3
Digital I/O
Table 2: Terminal Descriptions
Silicon Labs
Page 8 of 35
HARDWARE.XML Example (*
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 2 1 0
+ -
(***
A7 A6 A5 A4 A3 A2 A1 A0
(***
Alt.1
C SS MO MI
<usart channel="0" mode="spi_master" alternate="1" ...
Alt.2
MO MI C SS
<usart channel="0" mode="spi_master" alternate="2" ...
Alt.1
RT CT TX RX
<usart channel="0" mode="uart" alternate="1" ...
Alt.2
TX RX RT CT
<usart channel="0" mode="uart" alternate="2" ...
Alt.1
MI MO C SS
<usart channel="1" mode="spi_master" alternate="1" ...
Alt.2
MI MO C SS
<usart channel="1" mode="spi_master" alternate="2" ...
Alt.1
RX TX RT CT
<usart channel="1" mode="uart" alternate="1" ...
Alt.2
RX TX RT CT
<usart channel="1" mode="uart" alternate="2" ...
Alt.1
4 3 2 1 0
<timer index="1" alternate="1" ...
Alt.2
3 4 0 1 2
<timer index="1" alternate="2" ...
Alt.1
1 0
<timer index="3" alternate="1" ...
Alt.2
1 0
<timer index="3" alternate="2" ...
Alt.1
1 0
<timer index="4" alternate="1" ...
Alt.2
0
<timer index="4" alternate="2" ...
DC DD
5 4 3 2 1 0
OBSSEL
ADC
TIMER 3
TIMER 4
P0
USART 0 UART
USART 1 SPI (**
USART 1 UART
TIMER 1
P1
PERIPHERAL /
FUNCTION
P2
USART 0 SPI (**
Analog Comparator
DEBUG
*) Refer to Profile Toolkit Developer Guide for detailed settings
**) SS is the slave select signal when BLE113 is set as SPI slave. When set as SPI master, any available I/O can be used as chip select signal of
BLE113
***) The analog comparator and the ADC will be turned on automatically when taken in use and the configuration is done using API (Application
Programming Interface). Refer to Bluetooth Low Energy Software API Reference
NOTE: Pins configured as peripheral I/O signals do not have pull-up / -down capability
Table 3: Peripheral I/O Pin Mapping
Silicon Labs
Page 9 of 35
2.1 I/O Ports
Each I/O port can be configured as an input or output. When configured as input, each I/O port, except pins
P1_0 and P1_1, can also be configured with internal pull-up, pull-down or tri-state. Pull-down or pull-up can
only be configured to whole port, not individual pins. Unused I/O pins should have defined level and not be
floating. See the Profile Toolkit developer guide for more information about the configuration.
During reset the I/O pins are configured as inputs with pull-ups. P1_0 and P1_1 are inputs but do not have
pull-up or pull-down.
NOTE: Pins configured as peripheral I/O signals do not have pull-up / -down capability
2.2 UART
UART baud rate can be configured up 2 Mbps. See the Profile Toolkit developer guide for more information.
Following table lists commonly used baud rates for BLE113
Baud rate (bps)
Error (%)
2400
0.14
4800
0.14
9600
0.14
14 400
0.03
19 200
0.14
28 800
0.03
38 400
0.14
57 600
0.03
76 800
0.14
115 200
0.03
230 400
0.03
Table 4: Commonly used baud rates for BLE113
Silicon Labs
Page 10 of 35
2.3 Electrical Characteristics
2.4 Absolute Maximum Ratings
Note: These are absolute maximum ratings beyond which the module can be permanently damaged. These are not
maximum operating conditions. The maximum recommended operating conditions are in the table 6.
Rating
Min
Max
Unit
Storage Temperature
-40
+85
°C
AVDD, DVDD
-0.3
3.9
V
Other Terminal Volatages
VSS-0.4
VDD+0.4
V
*)All supply nets must have the same voltage
Table 5: Absolute Maximum Ratings
2.5 Recommended Operating Conditions
Rating
Min
Max
Unit
Operationg Temperature Range
-40
+85
°C
AVDD, DVDD (*
2.0
3.6
V
*) Supply voltage noise should be less than 10mVpp. Excessive noise at the supply voltage will reduce the RF
performance.
Table 6: Recommended Operating Conditions
2.6 DC Characteristics
Parameter
Test Conditions
Min
Typ
Max
Unit
Logic-0 input voltage
0.5
V
Logic-1 input voltage
DVDD =3V0
2.5
V
Logic-0 input current
Input equals 0V
-50 50
nA
Logic-1 input current
Input equals VDD
-50 50
nA
I/O pin pull-up and pull-down resistors
20 kΩ
Logic-0 output voltage, 4 mA pins
Output load 4 mA
0.5(*
V
Logic-1 output voltage, 4 mA pins
Output load 4 mA
2.4(*
V
*) See Figure 2 and Figure 3
Table 7: DC Characteristics @ VDD=3.0V
For detailed I/O terminal characteristic and timings refer to the CC2541 datasheet available in
(http://www.ti.com/lit/ds/symlink/cc2541.pdf)
Silicon Labs
Page 11 of 35
Figure 2: 4mA PIO Current Drive Capability @ VDD=3.0V
Figure 3: 20mA PIO (P1_0 and P1_1) Current Drive Capability @ VDD=3.0V
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