Silicon Laboratories EFR32FG12 User Manual

EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
The Gecko proprietary protocol family of SoCs is part of the Wire­less Gecko portfolio. Gecko SoCs are ideal for enabling energy­friendly proprietary protocol networking for IoT devices.
The single-die solution provides industry-leading energy efficiency, ultra-fast wakeup times, a scalable power amplifier, an integrated balun and no-compromise MCU fea­tures.
• Home and Building Automation and Security
• Metering
• Electronic Shelf Labels
• Industrial Automation
• Commercial and Retail Lighting and Sensing
Core / Memory
TM
ARM Cortex
with DSP extensions and FPU
Flash Program
Memory
M4 processor
RAM Memory
Memory
Protection Unit
Debug Interface
with ETM
Radio Transceiver
RFSENSE
RFSENSE
Lowest power mode with peripheral operational:
BALUN
Sub GHz
LNA
RF Frontend
PA
2.4 GHz
LNA
RF Frontend
PA
I
Q
I
Q
PGA
To Sub GHz receive I/Q mixers and PA
Frequency
Synthesizer
To 2.4 GHz receive I/Q mixers and PA
Controller
DEMOD
IFADC
AGC
MOD
To Sub GHz and 2.4 GHz PA
LDMA
FRC
CRC
BUFC
RAC
Clock Management
High Frequency
Crystal
Oscillator
Low Frequency
RC Oscillator
Low Frequency
Crystal
Oscillator
Peripheral Reflex System
Serial
Interfaces
USART
Low Energy
UART
2
I
32-bit bus
TM
C
High Frequency
RC Oscillator
Auxiliary High Frequency RC
Oscillator
Ultra Low
Frequency RC
Oscillator
I/O Ports Analog I/F
External
Interrupts
General
Purpose I/O
Pin Reset
Pin Wakeup
EM3—StopEM2—Deep SleepEM1—Sleep EM4—Hibernate EM4—ShutoffEM0—Active
KEY FEATURES
• 32-bit ARM® Cortex®-M4 core with 40 MHz maximum operating frequency
• Up to 1 MB of flash and 256 kB of RAM
• Pin-compatible across EFR32FG families (exceptions apply for 5V-tolerant pins)
• 12-channel Peripheral Reflex System, Low-Energy Sensor Interface & Multi­channel Capacitive Sense Interface
• Autonomous Hardware Crypto Accelerator and True Random Number Generator
• Integrated PA with up to 19 dBm (2.4 GHz) or 20 dBm (Sub-GHz) TX power
• Integrated balun for 2.4 GHz
• Robust peripheral set and up to 65 GPIO
Energy Management
Voltage
Regulator
DC-DC
Converter
Brown-Out
Detector
Voltage Monitor
Power-On Reset
Timers and Triggers
Timer/Counter
Low Energy
Timer
Pulse Counter
Low Energy
Sensor Interface
Watchdog Timer
Protocol Timer
Real Time
Counter and
Calendar
Cryotimer
Other
CRYPTO
CRC
True Random
Number Generator
SMU
ADC
Analog
Comparator
IDAC
Capacitive Sense
VDAC
Op-Amp
silabs.com | Building a more connected world. Rev. 1.6

1. Feature List

The EFR32FG12 highlighted features are listed below.
Low Power Wireless System-on-Chip
High Performance 32-bit 40 MHz ARM Cortex®-M4 with DSP instruction and floating-point unit for efficient signal processing
• Embedded Trace Macrocell (ETM) for advanced debugging
• Up to 1024 kB flash program memory
• Up to 256 kB RAM data memory
• 2.4 GHz and Sub-GHz radio operation
• Transmit power:
• 2.4 GHz radio: Up to 19 dBm
• Sub-GHz radio: Up to 20 dBm
Low Energy Consumption
• 8.4 mA RX current at 38.4 kbps, GFSK, 169 MHz
• 10.0 mA RX current at 1 Mbps, GFSK, 2.4 GHz
• 11 mA RX current at 250 kbps, DSSS-OQPSK, 2.4 GHz
• 8.5 mA TX current at 0 dBm output power at 2.4 GHz
• 35.3 mA TX current at 14 dBm output power at 868 MHz
• 70 μA/MHz in Active Mode (EM0)
• 1.5 μA EM2 DeepSleep current (16 kB RAM retention and RTCC running from LFRCO)
High Receiver Performance
• -94.8 dBm sensitivity at 1 Mbit/s GFSK, 2.4 GHz
• -102.7 dBm sensitivity at 250 kbps DSSS-OQPSK, 2.4 GHz
• -126.2 dBm sensitivity at 600 bps, GFSK, 915 MHz
• -120.6 dBm sensitivity at 2.4 kbps, GFSK, 868 MHz
• -107.4 dBm sensitivity at 4.8 kbps, OOK, 433 MHz
• -112.2 dBm sensitivity at 38.4 kbps, GFSK, 169 MHz
Supported Modulation Formats
• 2/4 (G)FSK with fully configurable shaping
• BPSK / DBPSK TX
• OOK / ASK
• Shaped OQPSK / (G)MSK
• Configurable DSSS and FEC
Supported Protocols
• Proprietary Protocols
• Wireless M-Bus
• Selected IEEE 802.15.4g SUN-FSK PHYs
• Low Power Wide Area Networks
Suitable for Systems Targeting Compliance With:
• FCC Part 90.210 Mask D, FCC part 15.247, 15.231, 15.249
• ETSI Category I Operation, EN 300 220, EN 300 328
• ARIB T-108, T-96
• China regulatory
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Feature List
Wide selection of MCU peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 2 × Digital to Analog Converter (VDAC)
• 3 × Operational Amplifier (Opamp)
• Digital to Analog Current Converter (IDAC)
• Low-Energy Sensor Interface (LESENSE)
• Multi-channel Capacitive Sense Interface (CSEN)
• Up to 54 pins connected to analog channels (APORT) shared between analog peripherals
• Up to 65 General Purpose I/O pins with output state reten­tion and asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 × 16-bit Timer/Counter
• 3 or 4 Compare/Capture/PWM channels
• 2 × 32-bit Timer/Counter
• 3 or 4 Compare/Capture/PWM channels
• 32-bit Real Time Counter and Calendar
• 16-bit Low Energy Timer for waveform generation
• 32-bit Ultra Low Energy Timer/Counter for periodic wake-up from any Energy Mode
• 3 × 16-bit Pulse Counter with asynchronous operation
• 2 × Watchdog Timer with dedicated RC oscillator
• 4 × Universal Synchronous/Asynchronous Receiver/Trans­mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
Low Energy UART (LEUART™)
2 × I2C interface with SMBus support and address recogni­tion in EM3 Stop
Wide Operating Range
• 1.8 V to 3.8 V single power supply
• Integrated DC-DC, down to 1.8 V output with up to 200 mA load current for system
• Standard (-40 °C to 85 °C) and Extended (-40 °C to 125 °C) temperature grades available
Support for Internet Security
• General Purpose CRC
• True Random Number Generator
• 2 × Hardware Cryptographic Acceleration for AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and ECC
QFN48 7x7 mm Package
QFN68 8x8 mm Package
BGA125 7x7 mm Package
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2. Ordering Information

EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Ordering Information
Table 2.1. Ordering Information
Protocol
Ordering Code
EFR32FG12P433F1024GL125-C Proprietary 2.4 GHz @ 19 dBm
EFR32FG12P433F1024GM68-C Proprietary 2.4 GHz @ 19 dBm
EFR32FG12P433F1024GM48-C Proprietary 2.4 GHz @ 19 dBm
EFR32FG12P432F1024GL125-C Proprietary 2.4 GHz @ 19 dBm 1024 256 65 BGA125 -40 to +85°C
EFR32FG12P432F1024GM48-C Proprietary 2.4 GHz @ 19 dBm 1024 256 31 QFN48 -40 to +85°C
EFR32FG12P431F1024GL125-C Proprietary Sub-GHz @ 20 dBm 1024 256 65 BGA125 -40 to +85°C
EFR32FG12P431F1024GM68-C Proprietary Sub-GHz @ 20 dBm 1024 256 46 QFN68 -40 to +85°C
EFR32FG12P431F512GM68-C Proprietary Sub-GHz @ 20 dBm 512 128 46 QFN68 -40 to +85°C
EFR32FG12P431F1024GM48-C Proprietary Sub-GHz @ 20 dBm 1024 256 31 QFN48 -40 to +85°C
EFR32FG12P431F1024IM48-C Proprietary Sub-GHz @ 20 dBm 1024 256 31 QFN48 -40 to +125°C
EFR32FG12P232F1024GL125-C Proprietary 2.4 GHz @ 19 dBm 1024 128 65 BGA125 -40 to +85°C
Stack
Frequency Band
@ Max TX Power
Sub-GHz @ 20 dBm
Sub-GHz @ 20 dBm
Sub-GHz @ 20 dBm
Flash
(kB)
1024 256 65 BGA125 -40 to +85°C
1024 256 46 QFN68 -40 to +85°C
1024 256 28 QFN48 -40 to +85°C
RAM
(kB) GPIO Package Temp Range
EFR32FG12P232F1024GM48-C Proprietary 2.4 GHz @ 19 dBm 1024 128 31 QFN48 -40 to +85°C
EFR32FG12P231F1024GL125-C Proprietary Sub-GHz @ 20 dBm 1024 128 65 BGA125 -40 to +85°C
EFR32FG12P231F1024GM68-C Proprietary Sub-GHz @ 20 dBm 1024 128 46 QFN68 -40 to +85°C
EFR32FG12P231F512GM68-C Proprietary Sub-GHz @ 20 dBm 512 64 46 QFN68 -40 to +85°C
EFR32FG12P231F1024GM48-C Proprietary Sub-GHz @ 20 dBm 1024 128 31 QFN48 -40 to +85°C
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Ordering Information
EFR32
G
X
Wireless Gecko 32-bit
2
Series
Gecko
Family – M, B, F
132 1024 L 125
Flash Memory Size in kB
Memory Type (Flash)
Feature Set Code – r2r1r0 r2: Reserved r1: RF Type – 3 (TRX), 2 (RX), 1 (TX) r0: Frequency Band – 1 (Sub-GHz), 2 (2.4 GHz), 3 (Dual-Band)
Performance Grade – P (Performance), B (Basic), V (Value)
Device Configuration
1 P F G A R
Pin Count
Package – M (QFN), L (BGA)
Temperature Grade – G (-40 to +85 °C), -I (-40 to +125 °C)
Tape and Reel (Optional)
Revision
Figure 2.1. Ordering Code Key
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Table of Contents
1. Feature List ................................2
2. Ordering Information ............................3
3. System Overview ..............................8
3.1 Introduction ...............................8
3.2 Radio .................................8
3.2.1 Antenna Interface ...........................8
3.2.2 Fractional-N Frequency Synthesizer .....................9
3.2.3 Receiver Architecture ..........................9
3.2.4 Transmitter Architecture .........................9
3.2.5 Wake on Radio ............................9
3.2.6 RFSENSE ..............................10
3.2.7 Flexible Frame Handling .........................10
3.2.8 Packet and State Trace .........................10
3.2.9 Data Buffering.............................10
3.2.10 Radio Controller (RAC) .........................10
3.2.11 Random Number Generator .......................11
3.3 Power .................................12
3.3.1 Energy Management Unit (EMU) ......................12
3.3.2 DC-DC Converter ...........................12
3.3.3 Power Domains ............................12
3.4 General Purpose Input/Output (GPIO) ......................13
3.5 Clocking ................................13
3.5.1 Clock Management Unit (CMU) .......................13
3.5.2 Internal and External Oscillators.......................13
3.6 Counters/Timers and PWM ..........................13
3.6.1 Timer/Counter (TIMER) .........................13
3.6.2 Wide Timer/Counter (WTIMER) .......................13
3.6.3 Real Time Counter and Calendar (RTCC) ...................13
3.6.4 Low Energy Timer (LETIMER) .......................14
3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER) .................14
3.6.6 Pulse Counter (PCNT) ..........................14
3.6.7 Watchdog Timer (WDOG) .........................14
3.7 Communications and Other Digital Peripherals ...................14
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) ..........14
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) ..........14
3.7.3 Inter-Integrated Circuit Interface (I2C) .....................14
3.7.4 Peripheral Reflex System (PRS) ......................14
3.7.5 Low Energy Sensor Interface (LESENSE) ...................15
3.8 Security Features .............................15
3.8.1 General Purpose Cyclic Redundancy Check (GPCRC) ...............15
3.8.2 Crypto Accelerator (CRYPTO) .......................15
3.8.3 True Random Number Generator (TRNG) ...................15
3.8.4 Security Management Unit (SMU) ......................15
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3.9 Analog.................................15
3.9.1 Analog Port (APORT) ..........................15
3.9.2 Analog Comparator (ACMP) ........................15
3.9.3 Analog to Digital Converter (ADC) ......................16
3.9.4 Capacitive Sense (CSEN) .........................16
3.9.5 Digital to Analog Current Converter (IDAC) ...................16
3.9.6 Digital to Analog Converter (VDAC) .....................16
3.9.7 Operational Amplifiers ..........................16
3.10 Reset Management Unit (RMU) ........................16
3.11 Core and Memory ............................16
3.11.1 Processor Core ............................16
3.11.2 Memory System Controller (MSC) .....................17
3.11.3 Linked Direct Memory Access Controller (LDMA) ................17
3.12 Memory Map ..............................18
3.13 Configuration Summary ..........................20
4. Electrical Specifications ..........................21
4.1 Electrical Characteristics ..........................21
4.1.1 Absolute Maximum Ratings ........................22
4.1.2 Operating Conditions ..........................24
4.1.3 Thermal Characteristics .........................26
4.1.4 DC-DC Converter ...........................27
4.1.5 Current Consumption ..........................29
4.1.6 Wake Up Times ............................39
4.1.7 Brown Out Detector (BOD) ........................40
4.1.8 Frequency Synthesizer ..........................41
4.1.9 2.4 GHz RF Transceiver Characteristics ....................42
4.1.10 Sub-GHz RF Transceiver Characteristics ...................53
4.1.11 Modem...............................77
4.1.12 Oscillators .............................78
4.1.13 Flash Memory Characteristics .......................82
4.1.14 General-Purpose I/O (GPIO) .......................83
4.1.15 Voltage Monitor (VMON) .........................85
4.1.16 Analog to Digital Converter (ADC) .....................86
4.1.17 Analog Comparator (ACMP) .......................88
4.1.18 Digital to Analog Converter (VDAC) .....................91
4.1.19 Current Digital to Analog Converter (IDAC) ..................94
4.1.20 Capacitive Sense (CSEN) ........................96
4.1.21 Operational Amplifier (OPAMP) ......................98
4.1.22 Pulse Counter (PCNT) ........................101
4.1.23 Analog Port (APORT) .........................101
4.1.24 I2C ...............................102
4.1.25 USART SPI ............................105
4.2 Typical Performance Curves ........................106
4.2.1 Supply Current ...........................107
4.2.2 DC-DC Converter ..........................112
4.2.3 2.4 GHz Radio ...........................114
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5. Typical Connection Diagrams ........................116
5.1 Power ................................116
5.2 RF Matching Networks ..........................118
5.3 Other Connections............................119
6. Pin Definitions ..............................120
6.1 BGA125 2.4 GHz and Sub-GHz Device Pinout ..................120
6.2 BGA125 2.4 GHz Device Pinout .......................124
6.3 BGA125 Sub-GHz Device Pinout .......................127
6.4 QFN68 2.4 GHz and Sub-GHz Device Pinout...................130
6.5 QFN68 Sub-GHz Device Pinout .......................133
6.6 QFN48 2.4 GHz and Sub-GHz Device Pinout...................135
6.7 QFN48 2.4 GHz Device Pinout .......................137
6.8 QFN48 Sub-GHz Device Pinout .......................139
6.9 GPIO Functionality Table .........................141
6.10 Alternate Functionality Overview ......................184
6.11 Analog Port (APORT) Client Maps ......................199
7. BGA125 Package Specifications .......................208
7.1 BGA125 Package Dimensions ........................208
7.2 BGA125 PCB Land Pattern .........................210
7.3 BGA125 Package Marking .........................212
8. QFN48 Package Specifications........................213
8.1 QFN48 Package Dimensions ........................213
8.2 QFN48 PCB Land Pattern .........................215
8.3 QFN48 Package Marking .........................217
9. QFN68 Package Specifications........................218
9.1 QFN68 Package Dimensions ........................218
9.2 QFN68 PCB Land Pattern .........................220
9.3 QFN68 Package Marking .........................222
10. Revision History.............................223
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3. System Overview

3.1 Introduction

The EFR32 product family combines an energy-friendly MCU with a highly integrated radio transceiver. The devices are well suited for any battery operated application as well as other systems requiring high performance and low energy consumption. This section gives a short introduction to the full radio and MCU system. The detailed functional description can be found in the EFR32xG12 Wireless Gecko Reference Manual.
A block diagram of the EFR32FG12 family is shown in Figure 3.1 Detailed EFR32FG12 Block Diagram on page 8. The diagram shows a superset of features available on the family, which vary by OPN. For more information about specific device features, consult
Ordering Information.
SUBGRF_IP
SUBGRF_IN SUBGRF_OP SUBGRF_ON
2G4RF_IOP
2G4RF_ION
RESETn
Debug Signals
(shared w/GPIO)
PAVDD
RFVDD
IOVDD
AVDD
DVDD
VREGVDD
VREGSW
DECOUPLE
LFXTAL_P
LFXTAL_N
HFXTAL_P
HFXTAL_N
Sub-GHz RF
LNA
PA
RFSENSE
BALUN
Serial Wire
and ETM
Debug /
Programming
2.4 GHz RF
LNA
PA
Energy Management
bypass
DC-DC
Converter
Voltage
Regulator
Radio Transceiver
I
PGA
Q
I
Frequency
Synthesizer
To RF
Frontend
Q
Circuits
Reset
Management
Unit
Brown Out /
Power-On
Reset
Voltage Monitor
DEMOD
IFADC
AGC
MOD
FRC
CRC
ARM Cortex-M4 Core
Up to 1024 KB ISP Flash
Program Memory
Up to 256 KB RAM
Memory Protection Unit
Floating Point Unit
LDMA Controller
Watchdog
Timer
Clock Management
ULFRCO
AUXHFRCO
LFRCO
LFXO
HFRCO
HFXO
BUFC
RAC
Port I/O Configuration
IOVDD
Digital Peripherals
LETIMER
TIMER
CRYOTIMER
PCNT
RTC / RTCC
USART
LEUART
I2C
CRYPTO
A
A
H
P
B
B
CRC
LESENSE
Port
Mapper
Analog Peripherals
IDAC
-
Mux & FB
Input Mux
+
-
+
Op-Amp
VDD
Temp
Sense
APORT
VDAC
Internal
Reference
12-bit ADC
Capacitive
Sense
Analog Comparator
Port A
Drivers
Port B
Drivers
Port C
Drivers
Port D
Drivers
Port F
Drivers
Port I
Drivers
Port J
Drivers
Port K
Drivers
PAn
PBn
PCn
PDn
PFn
PIn
PJn
PKn
Figure 3.1. Detailed EFR32FG12 Block Diagram

3.2 Radio

The Gecko family features a radio transceiver supporting proprietary wireless protocols.

3.2.1 Antenna Interface

The 2.4 GHz antenna interface consists of two pins (2G4RF_IOP and 2G4RF_ION) that interface directly to the on-chip BALUN. The 2G4RF_ION pin should be grounded externally.
The external components and power supply connections for the antenna interface typical applications are shown in the RF Matching Networks section.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3.2.2 Fractional-N Frequency Synthesizer

The EFR32FG12 contains a high performance, low phase noise, fully integrated fractional-N frequency synthesizer. The synthesizer is used in receive mode to generate the LO frequency used by the down-conversion mixer. It is also used in transmit mode to directly generate the modulated RF carrier.
The fractional-N architecture provides excellent phase noise performance combined with frequency resolution better than 100 Hz, with low energy consumption. The synthesizer has fast frequency settling which allows very short receiver and transmitter wake up times to optimize system energy consumption.

3.2.3 Receiver Architecture

The EFR32FG12 uses a low-IF receiver architecture, consisting of a Low-Noise Amplifier (LNA) followed by an I/Q down-conversion mixer, employing a crystal reference. The I/Q signals are further filtered and amplified before being sampled by the IF analog-to-digital converter (IFADC).
The IF frequency is configurable from 150 kHz to 1371 kHz. The IF can further be configured for high-side or low-side injection, provid­ing flexibility with respect to known interferers at the image frequency.
The Automatic Gain Control (AGC) block adjusts the receiver gain to optimize performance and avoid saturation for excellent selectivity and blocking performance. The 2.4 GHz radio is calibrated at production to improve image rejection performance. The sub-GHz radio can be calibrated on-demand by the user for the desired frequency band.
Demodulation is performed in the digital domain. The demodulator performs configurable decimation and channel filtering to allow re­ceive bandwidths ranging from 0.1 to 2530 kHz. High carrier frequency and baud rate offsets are tolerated by active estimation and compensation. Advanced features supporting high quality communication under adverse conditions include forward error correction by block and convolutional coding as well as Direct Sequence Spread Spectrum (DSSS) for 2.4 GHz and sub-GHz bands.
A Received Signal Strength Indicator (RSSI) is available for signal quality metrics, for level-based proximity detection, and for RF chan­nel access by Collision Avoidance (CA) or Listen Before Talk (LBT) algorithms. An RSSI capture value is associated with each received frame and the dynamic RSSI measurement can be monitored throughout reception.
The EFR32FG12 features integrated support for antenna diversity to mitigate the problem of frequency-selective fading due to multipath propagation and improve link budget. Support for antenna diversity is available for specific PHY configurations in 2.4 GHz and sub-GHz bands. Internal configurable hardware controls an external switch for automatic switching between antennae during RF receive detec­tion operations.
Note: Due to the shorter preamble of 802.15.4 and BLE packets, RX diversity is not supported.

3.2.4 Transmitter Architecture

The EFR32FG12 uses a direct-conversion transmitter architecture. For constant envelope modulation formats, the modulator controls phase and frequency modulation in the frequency synthesizer. Transmit symbols or chips are optionally shaped by a digital shaping filter. The shaping filter is fully configurable, including the BT product, and can be used to implement Gaussian or Raised Cosine shap­ing.
Carrier Sense Multiple Access - Collision Avoidance (CSMA-CA) or Listen Before Talk (LBT) algorithms can be automatically timed by the EFR32FG12. These algorithms are typically defined by regulatory standards to improve inter-operability in a given bandwidth be­tween devices that otherwise lack synchronized RF channel access.

3.2.5 Wake on Radio

The Wake on Radio feature allows flexible, autonomous RF sensing, qualification, and demodulation without required MCU activity, us­ing a subsystem of the EFR32FG12 including the Radio Controller (RAC), Peripheral Reflex System (PRS), and Low Energy peripher­als.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3.2.6 RFSENSE

The RFSENSE peripheral generates a system wakeup interrupt upon detection of wideband RF energy at the antenna interface, provid­ing true RF wakeup capabilities from low energy modes including EM2, EM3 and EM4.
RFSENSE triggers on a relatively strong RF signal and is available in the lowest energy modes, allowing exceptionally low energy con­sumption. RFSENSE does not demodulate or otherwise qualify the received signal, but software may respond to the wakeup event by enabling normal RF reception.
Various strategies for optimizing power consumption and system response time in presence of false alarms may be employed using available timer peripherals.

3.2.7 Flexible Frame Handling

EFR32FG12 has an extensive and flexible frame handling support for easy implementation of even complex communication protocols. The Frame Controller (FRC) supports all low level and timing critical tasks together with the Radio Controller and Modulator/Demodula­tor:
• Highly adjustable preamble length
• Up to 2 simultaneous synchronization words, each up to 32 bits and providing separate interrupts
• Frame disassembly and address matching (filtering) to accept or reject frames
• Automatic ACK frame assembly and transmission
• Fully flexible CRC generation and verification:
• Multiple CRC values can be embedded in a single frame
• 8, 16, 24 or 32-bit CRC value
• Configurable CRC bit and byte ordering
• Selectable bit-ordering (least significant or most significant bit first)
• Optional data whitening
• Optional Forward Error Correction (FEC), including convolutional encoding / decoding and block encoding / decoding
• Half rate convolutional encoder and decoder with constraint lengths from 2 to 7 and optional puncturing
• Optional symbol interleaving, typically used in combination with FEC
• Symbol coding, such as Manchester or DSSS, or biphase space encoding using FEC hardware
• UART encoding over air, with start and stop bit insertion / removal
• Test mode support, such as modulated or unmodulated carrier output
• Received frame timestamping

3.2.8 Packet and State Trace

The EFR32FG12 Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It features:
• Non-intrusive trace of transmit data, receive data and state information
• Data observability on a single-pin UART data output, or on a two-pin SPI data output
• Configurable data output bitrate / baudrate
• Multiplexed transmitted data, received data and state / meta information in a single serial data stream

3.2.9 Data Buffering

The EFR32FG12 features an advanced Radio Buffer Controller (BUFC) capable of handling up to 4 buffers of adjustable size from 64 bytes to 4096 bytes. Each buffer can be used for RX, TX or both. The buffer data is located in RAM, enabling zero-copy operations.

3.2.10 Radio Controller (RAC)

The Radio Controller controls the top level state of the radio subsystem in the EFR32FG12. It performs the following tasks:
• Precisely-timed control of enabling and disabling of the receiver and transmitter circuitry
• Run-time calibration of receiver, transmitter and frequency synthesizer
• Detailed frame transmission timing, including optional LBT or CSMA-CA
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3.2.11 Random Number Generator

The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain. The data is suitable for use in cryptographic applications.
Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num­ber generator algorithms such as Fortuna.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3.3 Power

The EFR32FG12 has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a single external supply voltage is required, from which all internal voltages are created. An optional integrated DC-DC buck regulator can be utilized to further reduce the current consumption. The DC-DC regulator requires one external inductor and one external capaci­tor.
The EFR32FG12 device family includes support for internal supply voltage scaling, as well as two different power domains groups for peripherals. These enhancements allow for further supply current reductions and lower overall power consumption.
AVDD and VREGVDD need to be 1.8 V or higher for the MCU to operate across all conditions; however the rest of the system will operate down to 1.62 V, including the digital supply and I/O. This means that the device is fully compatible with 1.8 V components. Running from a sufficiently high supply, the device can use the DC-DC to regulate voltage not only for itself, but also for other PCB components, supplying up to a total of 200 mA.

3.3.1 Energy Management Unit (EMU)

The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM blocks, and it contains control registers for the DC-DC regulator and the Voltage Monitor (VMON). The VMON is used to monitor multi­ple supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen below a chosen threshold.

3.3.2 DC-DC Converter

The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2 and EM3, and can supply up to 200 mA to the device and surrounding PCB components. Patented RF noise mitigation allows operation of the DC-DC converter without degrading sensitivity of radio components. Protection features include programmable current limiting, short-circuit protection, and dead-time protection. The DC-DC converter may also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the DC-DC input supply is internally connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input supply voltage droops due to excessive output current tran­sients.

3.3.3 Power Domains

The EFR32FG12 has two peripheral power domains for operation in EM2 and lower. If all of the peripherals in a peripheral power do­main are configured as unused, the power domain for that group will be powered off in the low-power mode, reducing the overall cur­rent consumption of the device.
Table 3.1. Peripheral Power Subdomains
Peripheral Power Domain 1 Peripheral Power Domain 2
ACMP0 ACMP1
PCNT0 PCNT1
ADC0 PCNT2
LETIMER0 CSEN
LESENSE DAC0
APORT LEUART0
- I2C0
- I2C1
- IDAC
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3.4 General Purpose Input/Output (GPIO)

EFR32FG12 has up to 65 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or in­put. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripher­als. The GPIO subsystem supports asynchronous external pin interrupts.

3.5 Clocking

3.5.1 Clock Management Unit (CMU)

The Clock Management Unit controls oscillators and clocks in the EFR32FG12. Individual enabling and disabling of clocks to all periph­erals is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscilla­tors.

3.5.2 Internal and External Oscillators

The EFR32FG12 supports two crystal oscillators and fully integrates four RC oscillators, listed below.
• A high frequency crystal oscillator (HFXO) with integrated load capacitors, tunable in small steps, provides a precise timing refer­ence for the MCU. Crystal frequencies in the range from 38 to 40 MHz are supported. An external clock source such as a TCXO can also be applied to the HFXO input for improved accuracy over temperature.
• A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes.
• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.
• An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial Wire Viewer port with a wide frequency range.
• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) can be used as a timing reference in low energy modes, when crys­tal accuracy is not required.
• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con­sumption in low energy modes.

3.6 Counters/Timers and PWM

3.6.1 Timer/Counter (TIMER)

TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit TIMER_0 only.

3.6.2 Wide Timer/Counter (WTIMER)

WTIMER peripherals function just as TIMER peripherals, but are 32 bits wide. They keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the PRS system. The core of each WTIMER is a 32-bit counter with up to 4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed thresh­old value. In PWM mode, the WTIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit WTIMER_0 only.

3.6.3 Real Time Counter and Calendar (RTCC)

The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla­tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy and convenient data storage in all energy modes down to EM4H.
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System Overview

3.6.4 Low Energy Timer (LETIMER)

The unique LETIMER is a 16-bit timer that is available in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop. This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave­forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con­figured to start counting on compare matches from the RTCC.

3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)

The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter­rupt periods, facilitating flexible ultra-low energy operation.

3.6.6 Pulse Counter (PCNT)

The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from among any of the internal oscillators, except the AUXHFRCO. The peripheral may operate in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop.

3.6.7 Watchdog Timer (WDOG)

The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can also monitor autonomous systems driven by PRS.

3.7 Communications and Other Digital Peripherals

3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)

The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O interface. It supports full duplex asynchronous UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup­porting:
• ISO7816 SmartCards
• IrDA
I2S

3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)

The unique LEUARTTM provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication possible with a minimum of software intervention and energy consumption.

3.7.3 Inter-Integrated Circuit Interface (I2C)

The I2C interface enables communication between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system.
The interface provided to software by the I2C peripheral allows precise timing control of the transmission process and highly automated transfers. Automatic recognition of slave addresses is provided in active and low energy modes.

3.7.4 Peripheral Reflex System (PRS)

The Peripheral Reflex System provides a communication network between different peripherals without software involvement. Peripher­als producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals, which in turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied by the PRS to the signals. The PRS allows peripheral to act autonomously without waking the MCU core, saving power.
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System Overview

3.7.5 Low Energy Sensor Interface (LESENSE)

The Low Energy Sensor Interface LESENSETM is a highly configurable sensor interface with support for up to 16 individually configura­ble sensors. By controlling the analog comparators, ADC, and DAC, LESENSE is capable of supporting a wide range of sensors and measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a programmable finite state machine which enables simple processing of measurement results without CPU intervention. LESENSE is available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy budget.

3.8 Security Features

3.8.1 General Purpose Cyclic Redundancy Check (GPCRC)

The GPCRC block implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The suppor­ted 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the needs of the application.

3.8.2 Crypto Accelerator (CRYPTO)

The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. EFR32 devices sup­port AES encryption and decryption with 128- or 256-bit keys, ECC over both GF(P) and GF(2m), SHA-1 and SHA-2 (SHA-224 and
SHA-256).
Supported block cipher modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, GCM, CBC-MAC, GMAC and CCM.
Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.
The CRYPTO1 block is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on data buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention.
CRYPTO also provides trigger signals for DMA read and write operations.

3.8.3 True Random Number Generator (TRNG)

The TRNG is a non-deterministic random number generator based on a full hardware solution. The TRNG is validated with NIST800-22 and AIS-31 test suites as well as being suitable for FIPS 140-2 certification (for the purposes of cryptographic key generation).
Note: TRNG operation is only supported at VSCALE2. TRNG cannot be used at VSCALE0.

3.8.4 Security Management Unit (SMU)

The Security Management Unit (SMU) allows software to set up fine-grained security for peripheral access, which is not possible in the Memory Protection Unit (MPU). Peripherals may be secured by hardware on an individual basis, such that only priveleged accesses to the peripheral's register interface will be allowed. When an access fault occurs, the SMU reports the specific peripheral involved and can optionally generate an interrupt.

3.9 Analog

3.9.1 Analog Port (APORT)

The Analog Port (APORT) is an analog interconnect matrix allowing access to many analog peripherals on a flexible selection of pins. Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differentially, buses are grouped by X/Y pairs.

3.9.2 Analog Comparator (ACMP)

The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high­er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the programmable threshold.
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System Overview

3.9.3 Analog to Digital Converter (ADC)

The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 Msps. The output sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of sources, including pins configurable as either single-ended or differential.

3.9.4 Capacitive Sense (CSEN)

The CSEN peripheral is a dedicated Capacitive Sensing block for implementing touch-sensitive user interface elements such a switches and sliders. The CSEN peripheral uses a charge ramping measurement technique, which provides robust sensing even in adverse conditions including radiated noise and moisture. The peripheral can be configured to take measurements on a single port pin or scan through multiple pins and store results to memory through DMA. Several channels can also be shorted together to measure the combined capacitance or implement wake-on-touch from very low energy modes. Hardware includes a digital accumulator and an aver­aging filter, as well as digital threshold comparators to reduce software overhead.

3.9.5 Digital to Analog Current Converter (IDAC)

The IDAC can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC input pin for capacitive sensing. The full-scale current is programmable between 0.05 µA and 64 µA with several ranges consisting of various step sizes.

3.9.6 Digital to Analog Converter (VDAC)

The Digital to Analog Converter (VDAC) can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500 ksps, 12-bit converter. The opamps are used in conjunction with the VDAC, to provide output buffering. One opamp is used per single­ended channel, or two opamps are used to provide differential outputs. The VDAC may be used for a number of different applications such as sensor interfaces or sound output. The VDAC can generate high-resolution analog signals while the MCU is operating at low frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any CPU intervention. The VDAC is available in all energy modes down to and including EM3.

3.9.7 Operational Amplifiers

The opamps are low power amplifiers with a high degree of flexibility targeting a wide variety of standard opamp application areas, and are available down to EM3. With flexible built-in programming for gain and interconnection they can be configured to support multiple common opamp functions. All pins are also available externally for filter configurations. Each opamp has a rail to rail input and a rail to rail output. They can be used in conjunction with the VDAC peripheral or in stand-alone configurations. The opamps save energy, PCB space, and cost as compared with standalone opamps because they are integrated on-chip.

3.10 Reset Management Unit (RMU)

The RMU is responsible for handling reset of the EFR32FG12. A wide range of reset sources are available, including several power supply monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.

3.11 Core and Memory

3.11.1 Processor Core

The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:
• ARM Cortex-M4 RISC processor achieving 1.25 Dhrystone MIPS/MHz
• Memory Protection Unit (MPU) supporting up to 8 memory segments
• Up to 1024 kB flash program memory
• Up to 256 kB RAM data memory
• Configuration and event handling of all peripherals
• 2-pin Serial-Wire debug interface
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System Overview

3.11.2 Memory System Controller (MSC)

The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a read-only page in the information block containing system and device calibration data. Read and write operations are supported in en­ergy modes EM0 Active and EM1 Sleep.

3.11.3 Linked Direct Memory Access Controller (LDMA)

The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling so­phisticated operations to be implemented.
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System Overview

3.12 Memory Map

The EFR32FG12 memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration.
Figure 3.2. EFR32FG12 Memory Map — Core Peripherals and Code Space
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview
Figure 3.3. EFR32FG12 Memory Map — Peripherals
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
System Overview

3.13 Configuration Summary

The features of the EFR32FG12 are a subset of the feature set described in the device reference manual. The table below describes device specific implementation of the features. Remaining modules support full configuration.
Table 3.2. Configuration Summary
Module Configuration Pin Connections
USART0 IrDA
US0_TX, US0_RX, US0_CLK, US0_CS
SmartCard
USART1
I2S
US1_TX, US1_RX, US1_CLK, US1_CS
SmartCard
USART2 IrDA
US2_TX, US2_RX, US2_CLK, US2_CS
SmartCard
USART3
I2S
US3_TX, US3_RX, US3_CLK, US3_CS
SmartCard
TIMER0 with DTI TIM0_CC[2:0], TIM0_CDTI[2:0]
TIMER1 - TIM1_CC[3:0]
WTIMER0 with DTI WTIM0_CC[2:0], WTIM0_CDTI[2:0]
WTIMER1 - WTIM1_CC[3:0]
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4. Electrical Specifications

4.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on T
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow­er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.
Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits.
=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
AMB
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.1 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia­bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter Symbol Test Condition Min Typ Max Unit
Storage temperature range T
Voltage on any supply pin V
Voltage ramp rate on any supply pin
DC voltage on any GPIO pin V
Voltage on HFXO pins V
Input RF level on pins 2G4RF_IOP and 2G4RF_ION
Voltage differential between RF pins (2G4RF_IOP ­2G4RF_ION)
Absolute voltage on RF pins 2G4RF_IOP and 2G4RF_ION
Absolute voltage on Sub­GHz RF pins
STG
DDMAX
V
DDRAMPMAX
DIGPIN
HFXOPIN
P
RFMAX2G4
V
MAXDIFF2G4
V
MAX2G4
V
MAXSUBG
-50 150 °C
-0.3 3.8 V
1 V / µs
5V tolerant GPIO pins1 2
3
-0.3 Min of 5.25 and IOVDD
+2
Standard GPIO pins -0.3 IOVDD+0.3 V
-0.3 1.4 V
10 dBm
-50 50 mV
-0.3 3.8 V
Pins SUBGRF_OP and
-0.3 3.8 V
SUBGRF_ON
V
Total current into VDD power lines
Total current into VSS ground lines
Current per I/O pin I
Current for all I/O pins I
Junction temperature T
I
VDDMAX
I
VSSMAX
IOMAX
IOALLMAX
J
Pins SUBGRF_IP and
-0.3 0.3 V
SUBGRF_IN,
Source 200 mA
Sink 200 mA
Sink 50 mA
Source 50 mA
Sink 200 mA
Source 200 mA
-G grade devices -40 105 °C
-I grade devices -40 125 °C
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Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. When a GPIO pin is routed to the analog block through the APORT, the maximum voltage = IOVDD.
2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the maximum IO current specifications.
3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet

4.1.2 Operating Conditions

When assigning supply sources, the following requirements must be observed:
• VREGVDD must be greater than or equal to AVDD, DVDD, RFVDD, PAVDD and all IOVDD supplies.
• VREGVDD = AVDD
• DVDD ≤ AVDD
• IOVDD ≤ AVDD
• RFVDD ≤ AVDD
• PAVDD ≤ AVDD
Electrical Specifications
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.2.1 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Operating ambient tempera­ture range
AVDD supply voltage
1
2
VREGVDD operating supply voltage2
3
VREGVDD current I
RFVDD operating supply voltage
DVDD operating supply volt­age
PAVDD operating supply voltage
IOVDD operating supply volt­age
DECOUPLE output capaci-
6
tor5
T
A
V
AVDD
V
VREGVDD
VREGVDD
V
RFVDD
V
DVDD
V
PAVDD
V
IOVDD
C
DECOUPLE
-G temperature grade -40 25 85 °C
-I temperature grade -40 25 125 °C
1.8 3.3 3.8 V
DCDC in regulation 2.4 3.3 3.8 V
DCDC in bypass, 50mA load 1.8 3.3 3.8 V
DCDC not in use. DVDD external-
1.8 3.3 3.8 V
ly shorted to VREGVDD
DCDC in bypass, T ≤ 85 °C 200 mA
DCDC in bypass, T > 85 °C 100 mA
All IOVDD pins
1.62 V
1.62 V
1.62 V
4
1.62 V
VREGVDD
VREGVDD
VREGVDD
VREGVDD
V
V
V
V
0.75 1.0 2.75 µF
Difference between AVDD and VREGVDD, ABS(AVDD-
VREGVDD)
2
HFCORECLK frequency f
HFCLK frequency f
dV
DD
CORE
HFCLK
0.1 V
VSCALE2, MODE = WS1 40 MHz
VSCALE2, MODE = WS0 25 MHz
VSCALE0, MODE = WS2 20 MHz
VSCALE0, MODE = WS1 14 MHz
VSCALE0, MODE = WS0 7 MHz
VSCALE2 40 MHz
VSCALE0 20 MHz
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. The maximum limit on TA may be lower due to device self-heating, which depends on the power dissipation of the specific appli­cation. TA (max) = TJ (max) - (THETAJA x PowerDissipation). Refer to the Absolute Maximum Ratings table and the Thermal Characteristics table for TJ and THETAJA.
2. VREGVDD must be tied to AVDD. Both VREGVDD and AVDD minimum voltages must be satisfied for the part to operate.
3. The minimum voltage required in bypass mode is calculated using R other loads can be calculated as V
DVDD_min+ILOAD
* R
BYP_max
.
4. When the CSEN peripheral is used with chopping enabled (CSEN_CTRL_CHOPEN = ENABLE), IOVDD must be equal to AVDD.
5. The system designer should consult the characteristic specs of the capacitor used on DECOUPLE to ensure its capacitance val­ue stays within the specified bounds across temperature and DC bias.
6. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV / usec for approximately 20 usec. During this transi­tion, peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA (with a 2.7 µF capacitor).

4.1.3 Thermal Characteristics

from the DCDC specification table. Requirements for
BYP
Table 4.3. Thermal Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Thermal resistance, QFN48 Package
THETA
JA_QFN48
2-Layer PCB, Air velocity = 0 m/s 75.7 °C/W
2-Layer PCB, Air velocity = 1 m/s 61.5 °C/W
2-Layer PCB, Air velocity = 2 m/s 55.4 °C/W
4-Layer PCB, Air velocity = 0 m/s 30.2 °C/W
4-Layer PCB, Air velocity = 1 m/s 26.3 °C/W
4-Layer PCB, Air velocity = 2 m/s 24.9 °C/W
Thermal resistance, BGA125 Package
THE­TA
JA_BGA125
2-Layer PCB, Air velocity = 0 m/s 90.7 °C/W
2-Layer PCB, Air velocity = 1 m/s 73.7 °C/W
2-Layer PCB, Air velocity = 2 m/s 66.4 °C/W
4-Layer PCB, Air velocity = 0 m/s 45 °C/W
4-Layer PCB, Air velocity = 1 m/s 39.6 °C/W
4-Layer PCB, Air velocity = 2 m/s 37.6 °C/W
Thermal resistance, QFN68 Package
THETA
JA_QFN68
4-Layer PCB, Air velocity = 0 m/s 21.5 °C/W
4-Layer PCB, Air velocity = 1 m/s 18.9 °C/W
4-Layer PCB, Air velocity = 2 m/s 17.1 °C/W
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.4 DC-DC Converter

Test conditions: L_DCDC=4.7 µH (Murata LQH3NPN4R7MM0L), C_DCDC=4.7 µF (Samsung CL10B475KQ8NQNC), V_DCDC_I=3.3 V, V_DCDC_O=1.8 V, I_DCDC_LOAD=50 mA, Heavy Drive configuration, F_DCDC_LN=7 MHz, unless otherwise indicated.
Table 4.4. DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Input voltage range V
Output voltage programma­ble range
1
DCDC_I
V
DCDC_O
Regulation DC accuracy ACC
Regulation window
2
Steady-state output ripple V
Output voltage under/over-
WIN
R
V
OV
shoot
DC
REG
Bypass mode, I
DCDC_LOAD
mA
Low noise (LN) mode, 1.8 V out­put, I
DCDC_LOAD
= 100 mA, or
= 50
1.8 V
2.4 V
VREGVDD_
MAX
VREGVDD_
MAX
V
V
Low power (LP) mode, 1.8 V out­put, I
DCDC_LOAD
Low noise (LN) mode, 1.8 V out­put, I
DCDC_LOAD
Low Noise (LN) mode, 1.8 V tar-
= 10 mA
= 200 mA
2.6 V
1.8 V
VREGVDD_
MAX
VREGVDD
1.7 1.9 V
V
V
get output
Low Power (LP) mode,
1.63 2.2 V
LPCMPBIASEMxx3 = 0, 1.8 V tar­get output, I
DCDC_LOAD
Low Power (LP) mode,
≤ 75 µA
1.63 2.1 V
LPCMPBIASEMxx3 = 3, 1.8 V tar­get output, I
DCDC_LOAD
≤ 10 mA
Radio disabled 3 mVpp
CCM Mode (LNFORCECCM3 =
25 60 mV
1), Load changes between 0 mA and 100 mA
DC line regulation V
DC load regulation I
REG
REG
DCM Mode (LNFORCECCM3 =
0), Load changes between 0 mA and 10 mA
Overshoot during LP to LN CCM/DCM mode transitions com­pared to DC level in LN mode
Undershoot during BYP/LP to LN CCM (LNFORCECCM3 = 1) mode
transitions compared to DC level in LN mode
Undershoot during BYP/LP to LN DCM (LNFORCECCM3 = 0) mode
transitions compared to DC level in LN mode
Input changes between V
VREGVDD_MAX
and 2.4 V
Load changes between 0 mA and 100 mA in CCM mode
45 90 mV
200 mV
40 mV
100 mV
0.1 %
0.1 %
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Max load current I
LOAD_MAX
Low noise (LN) mode, Heavy
200 mA
Drive4, T ≤ 85 °C
Low noise (LN) mode, Heavy
100 mA
Drive4, T > 85 °C
Low noise (LN) mode, Medium
4
Drive
Low noise (LN) mode, Light
4
Drive
Low power (LP) mode,
100 mA
50 mA
75 µA
LPCMPBIASEMxx3 = 0
Low power (LP) mode,
10 mA
LPCMPBIASEMxx3 = 3
DCDC nominal output ca-
5
pacitor
DCDC nominal output induc-
C
DCDC
L
DCDC
25% tolerance 1 4.7 4.7 µF
20% tolerance 4.7 4.7 4.7 µH
tor
Resistance in Bypass mode R
BYP
1.2 2.5
Note:
1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, V
VREGVDD
.
2. LP mode controller is a hysteretic controller that maintains the output voltage within the specified limits.
3. LPCMPBIASEMxx refers to either LPCMPBIASEM234H in the EMU_DCDCMISCCTRL register or LPCMPBIASEM01 in the EMU_DCDCLOEM01CFG register, depending on the energy mode.
4. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi­um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.
5. Output voltage under/over-shoot and regulation are specified with C must be used if C
is lower than 4.7 µF. See Application Note AN0948 for details.
DCDC
4.7 µF. Different settings for DCDCLNCOMPCTRL
DCDC
silabs.com | Building a more connected world. Rev. 1.6 | 28
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.5 Current Consumption

4.1.5.1 Current Consumption 3.3 V without DC-DC Converter
Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = DVDD = RFVDD = PAVDD = 3.3 V. T = 25 °C. DCDC is off. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C.
Table 4.5. Current Consumption 3.3 V without DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0 mode with all peripherals dis­abled
Current consumption in EM0 mode with all peripherals dis­abled and voltage scaling enabled
Current consumption in EM1 mode with all peripherals dis­abled
I
ACTIVE
I
ACTIVE_VS
I
EM1
38.4 MHz crystal, CPU running while loop from flash
1
38 MHz HFRCO, CPU running
130 µA/MHz
99 µA/MHz
Prime from flash
38 MHz HFRCO, CPU running
99 105 µA/MHz
while loop from flash
38 MHz HFRCO, CPU running
124 µA/MHz
CoreMark from flash
26 MHz HFRCO, CPU running
102 108 µA/MHz
while loop from flash
1 MHz HFRCO, CPU running
280 435 µA/MHz
while loop from flash
19 MHz HFRCO, CPU running
88 µA/MHz
while loop from flash
1 MHz HFRCO, CPU running
234 µA/MHz
while loop from flash
38.4 MHz crystal
1
80 µA/MHz
38 MHz HFRCO 50 54 µA/MHz
26 MHz HFRCO 52 58 µA/MHz
Current consumption in EM1 mode with all peripherals dis­abled and voltage scaling enabled
Current consumption in EM2 mode, with voltage scaling enabled
Current consumption in EM3 mode, with voltage scaling enabled
Current consumption in EM4H mode, with voltage scaling enabled
I
EM1_VS
I
EM2_VS
I
EM3_VS
I
EM4H_VS
1 MHz HFRCO 230 400 µA/MHz
19 MHz HFRCO 47 µA/MHz
1 MHz HFRCO 193 µA/MHz
Full 256 kB RAM retention and
2.9 µA
RTCC running from LFXO
Full 256 kB RAM retention and
3.2 µA
RTCC running from LFRCO
16 kB (1 bank) RAM retention and RTCC running from LFRCO
2
Full 256 kB RAM retention and
2.1 3.5 µA
2.56 4.8 µA CRYOTIMER running from ULFR­CO
128 byte RAM retention, RTCC
1.0 µA running from LFXO
128 byte RAM retention, CRYO-
0.45 µA TIMER running from ULFRCO
128 byte RAM retention, no RTCC 0.43 0.9 µA
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in
I
EM4S
No RAM retention, no RTCC 0.04 0.1 µA
EM4S mode
Note:
1. CMU_HFXOCTRL_LOWPOWER=0.
2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.5.2 Current Consumption 3.3 V using DC-DC Converter
Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD = 1.8 V DC-DC output. T = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C.
Table 4.6. Current Consumption 3.3 V using DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0 mode with all peripherals dis­abled, DCDC in Low Noise
DCM mode
1
Current consumption in EM0 mode with all peripherals dis­abled, DCDC in Low Noise
CCM mode
3
I
ACTIVE_DCM
I
ACTIVE_CCM
38.4 MHz crystal, CPU running while loop from flash
2
38 MHz HFRCO, CPU running Prime from flash
38 MHz HFRCO, CPU running while loop from flash
38 MHz HFRCO, CPU running CoreMark from flash
26 MHz HFRCO, CPU running while loop from flash
1 MHz HFRCO, CPU running while loop from flash
38.4 MHz crystal, CPU running while loop from flash
2
38 MHz HFRCO, CPU running Prime from flash
38 MHz HFRCO, CPU running while loop from flash
38 MHz HFRCO, CPU running CoreMark from flash
88 µA/MHz
70 µA/MHz
70 µA/MHz
85 µA/MHz
77 µA/MHz
636 µA/MHz
98 µA/MHz
81 µA/MHz
82 µA/MHz
95 µA/MHz
Current consumption in EM0 mode with all peripherals dis­abled and voltage scaling enabled, DCDC in Low
Noise CCM mode
3
Current consumption in EM1 mode with all peripherals dis­abled, DCDC in Low Noise
DCM mode
1
Current consumption in EM1 mode with all peripherals dis­abled and voltage scaling enabled, DCDC in Low
Noise DCM mode
1
I
ACTIVE_CCM_VS
I
EM1_DCM
I
EM1_DCM_VS
26 MHz HFRCO, CPU running
95 µA/MHz while loop from flash
1 MHz HFRCO, CPU running
1155 µA/MHz while loop from flash
19 MHz HFRCO, CPU running
101 µA/MHz while loop from flash
1 MHz HFRCO, CPU running
1128 µA/MHz while loop from flash
38.4 MHz crystal
2
59 µA/MHz
38 MHz HFRCO 41 µA/MHz
26 MHz HFRCO 48 µA/MHz
1 MHz HFRCO 610 µA/MHz
19 MHz HFRCO 52 µA/MHz
1 MHz HFRCO 587 µA/MHz
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM2 mode, with voltage scaling
enabled, DCDC in LP mode
4
I
EM2_VS
Full 256 kB RAM retention and RTCC running from LFXO
Full 256 kB RAM retention and
2.1 µA
2.2 µA RTCC running from LFRCO
Current consumption in EM3 mode, with voltage scaling enabled
Current consumption in EM4H mode, with voltage scaling enabled
I
EM3_VS
I
EM4H_VS
16 kB (1 bank) RAM retention and RTCC running from LFRCO
5
Full 256 kB RAM retention and CRYOTIMER running from ULFR­CO
128 byte RAM retention, RTCC running from LFXO
128 byte RAM retention, CRYO-
1.5 µA
1.81 µA
0.69 µA
0.39 µA TIMER running from ULFRCO
128 byte RAM retention, no RTCC 0.39 µA
Current consumption in
I
EM4S
No RAM retention, no RTCC 0.06 µA
EM4S mode
Note:
1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD.
2. CMU_HFXOCTRL_LOWPOWER=0.
3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD.
4. DCDC Low Power Mode = Medium Drive, LPOSCDIV=1, LPCMPBIASEM234H=0, LPCLIMILIMSEL=1, ANASW=DVDD.
5. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.5.3 Current Consumption 1.8 V without DC-DC Converter
Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = DVDD = RFVDD = PAVDD = 1.8 V. T = 25 °C. DCDC is off. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C.
Table 4.7. Current Consumption 1.8 V without DC-DC Converter
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0 mode with all peripherals dis­abled
Current consumption in EM0 mode with all peripherals dis­abled and voltage scaling enabled
Current consumption in EM1 mode with all peripherals dis­abled
I
ACTIVE
I
ACTIVE_VS
I
EM1
38.4 MHz crystal, CPU running while loop from flash
1
38 MHz HFRCO, CPU running
130 µA/MHz
99 µA/MHz Prime from flash
38 MHz HFRCO, CPU running
99 µA/MHz while loop from flash
38 MHz HFRCO, CPU running
124 µA/MHz CoreMark from flash
26 MHz HFRCO, CPU running
102 µA/MHz while loop from flash
1 MHz HFRCO, CPU running
277 µA/MHz while loop from flash
19 MHz HFRCO, CPU running
87 µA/MHz while loop from flash
1 MHz HFRCO, CPU running
231 µA/MHz while loop from flash
38.4 MHz crystal
1
80 µA/MHz
38 MHz HFRCO 50 µA/MHz
26 MHz HFRCO 52 µA/MHz
Current consumption in EM1 mode with all peripherals dis­abled and voltage scaling enabled
Current consumption in EM2 mode, with voltage scaling enabled
Current consumption in EM3 mode, with voltage scaling enabled
Current consumption in EM4H mode, with voltage scaling enabled
Current consumption in EM4S mode
I
EM1_VS
I
EM2_VS
I
EM3_VS
I
EM4H_VS
I
EM4S
1 MHz HFRCO 227 µA/MHz
19 MHz HFRCO 47 µA/MHz
1 MHz HFRCO 190 µA/MHz
Full 256 kB RAM retention and
2.8 µA RTCC running from LFXO
Full 256 kB RAM retention and
3.0 µA RTCC running from LFRCO
16 kB (1 bank) RAM retention and RTCC running from LFRCO
2
Full 256 kB RAM retention and
1.9 µA
2.47 µA CRYOTIMER running from ULFR­CO
128 byte RAM retention, RTCC
0.91 µA running from LFXO
128 byte RAM retention, CRYO-
0.35 µA TIMER running from ULFRCO
128 byte RAM retention, no RTCC 0.35 µA
No RAM retention, no RTCC 0.04 µA
silabs.com | Building a more connected world. Rev. 1.6 | 33
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. CMU_HFXOCTRL_LOWPOWER=0.
2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
silabs.com | Building a more connected world. Rev. 1.6 | 34
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.5.4 Current Consumption Using Radio 3.3 V with DC-DC
Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD = 1.8 V. T = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C.
Table 4.8. Current Consumption Using Radio 3.3 V with DC-DC
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in re­ceive mode, active packet reception (MCU in EM1 @
38.4 MHz, peripheral clocks disabled), T ≤ 85 °C
Current consumption in re­ceive mode, active packet reception (MCU in EM1 @
38.4 MHz, peripheral clocks disabled), T > 85 °C
I
RX_ACTIVE
I
RX_ACTIVE_HT
500 kbit/s, 2GFSK, F = 915 MHz, Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 868 MHz, Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 490 MHz, Radio clock prescaled by 4
50 kbit/s, 2GFSK, F = 433 MHz, Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 315 MHz, Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 169 MHz, Radio clock prescaled by 4
1 Mbit/s, 2GFSK, F = 2.4 GHz, Radio clock prescaled by 4
2 Mbit/s, 2GFSK, F = 2.4 GHz, Radio clock prescaled by 4
802.15.4 receiving frame, F = 2.4 GHz, Radio clock prescaled by 3
500 kbit/s, 2GFSK, F = 915 MHz, Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 868 MHz, Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 490 MHz, Radio clock prescaled by 4
9.3 10.2 mA
8.6 10.2 mA
8.6 10.2 mA
8.6 10.2 mA
8.6 10.2 mA
8.4 10.2 mA
10.0 mA
11.5 mA
11 mA
13 mA
13 mA
13 mA
50 kbit/s, 2GFSK, F = 433 MHz,
13 mA Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 315 MHz,
13 mA Radio clock prescaled by 4
38.4 kbit/s, 2GFSK, F = 169 MHz,
13 mA Radio clock prescaled by 4
silabs.com | Building a more connected world. Rev. 1.6 | 35
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in re­ceive mode, listening for packet (MCU in EM1 @ 38.4 MHz, peripheral clocks disa­bled), T ≤ 85 °C
Current consumption in re­ceive mode, listening for packet (MCU in EM1 @ 38.4 MHz, peripheral clocks disa­bled), T > 85 °C
I
RX_LISTEN
I
RX_LISTEN_HT
500 kbit/s, 2GFSK, F = 915 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 868 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 490 MHz, No radio clock prescaling
50 kbit/s, 2GFSK, F = 433 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 315 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 169 MHz, No radio clock prescaling
1 Mbit/s, 2GFSK, F = 2.4 GHz, No radio clock prescaling
2 Mbit/s, 2GFSK, F = 2.4 GHz, No radio clock prescaling
802.15.4, F = 2.4 GHz, No radio clock prescaling
500 kbit/s, 2GFSK, F = 915 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 868 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 490 MHz, No radio clock prescaling
10.2 11 mA
9.5 11 mA
9.5 11 mA
9.5 11 mA
9.4 11 mA
9.3 11 mA
10.9 mA
11.9 mA
12.5 mA
14 mA
14 mA
14 mA
50 kbit/s, 2GFSK, F = 433 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 315 MHz, No radio clock prescaling
38.4 kbit/s, 2GFSK, F = 169 MHz, No radio clock prescaling
14 mA
14 mA
14 mA
silabs.com | Building a more connected world. Rev. 1.6 | 36
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in transmit mode (MCU in EM1 @ 38.4 MHz, peripheral clocks disabled), T ≤ 85 °C
I
TX
F = 915 MHz, CW, 20 dBm
90.2 134.3 mA match, External PA supply = 3.3V
F = 915 MHz, CW, 14 dBm
36 42.5 mA match, External PA supply con­nected to DCDC output
F = 868 MHz, CW, 20 dBm
79.7 106.7 mA match, External PA supply = 3.3V
F = 868 MHz, CW, 14 dBm
35.3 41 mA match, External PA supply con­nected to DCDC output
F = 490 MHz, CW, 20 dBm
93.8 125.4 mA match, External PA supply = 3.3V
F = 433 MHz, CW, 10 dBm
20.3 24 mA match, External PA supply con­nected to DC-DC output
F = 433 MHz, CW, 14 dBm
34 41.5 mA match, External PA supply con­nected to DCDC output
F = 315 MHz, CW, 14 dBm
33.5 42 mA match, External PA supply con­nected to DCDC output
F = 169 MHz, CW, 20 dBm
88.6 116.7 mA match, External PA supply = 3.3V
F = 2.4 GHz, CW, 0 dBm output power, Radio clock prescaled by 3
F = 2.4 GHz, CW, 0 dBm output power, Radio clock prescaled by 1
F = 2.4 GHz, CW, 3 dBm output power
F = 2.4 GHz, CW, 8 dBm output power
F = 2.4 GHz, CW, 10.5 dBm out­put power
F = 2.4 GHz, CW, 16.5 dBm out­put power, PAVDD connected di­rectly to external 3.3V supply
F = 2.4 GHz, CW, 19.5 dBm out­put power, PAVDD connected di­rectly to external 3.3V supply
8.5 mA
9.5 mA
16.5 mA
26 mA
34 mA
86 mA
131 mA
silabs.com | Building a more connected world. Rev. 1.6 | 37
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in transmit mode (MCU in EM1 @ 38.4 MHz, peripheral clocks disabled), T > 85 °C
I
TX_HT
F = 915 MHz, CW, 20 dBm match, External PA supply = 3.3V
F = 915 MHz, CW, 14 dBm match, External PA supply con­nected to DCDC output
F = 868 MHz, CW, 20 dBm match, External PA supply = 3.3V
F = 868 MHz, CW, 14 dBm match, External PA supply con­nected to DCDC output
F = 490 MHz, CW, 20 dBm match, External PA supply = 3.3V
F = 433 MHz, CW, 10 dBm match, External PA supply con­nected to DC-DC output
F = 433 MHz, CW, 14 dBm match, External PA supply con­nected to DCDC output
F = 315 MHz, CW, 14 dBm match, External PA supply con­nected to DCDC output
F = 169 MHz, CW, 20 dBm match, External PA supply = 3.3V
134.3 mA
42.5 mA
109.8 mA
41.3 mA
130.8 mA
24.4 mA
41.5 mA
42 mA
122.8 mA
silabs.com | Building a more connected world. Rev. 1.6 | 38
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.6 Wake Up Times

Table 4.9. Wake Up Times
Parameter Symbol Test Condition Min Typ Max Unit
Wake up time from EM1 t
Wake up from EM2 t
EM1_WU
EM2_WU
Code execution from flash 10.1 µs
3 AHB
Code execution from RAM 3.2 µs
Wake up from EM3 t
EM3_WU
Code execution from flash 10.1 µs
Code execution from RAM 3.2 µs
Wake up from EM4H
Wake up from EM4S
1
1
Time from release of reset source to first instruction ex­ecution
Power mode scaling time t
t
EM4H_WU
t
EM4S_WU
t
RESET
SCALE
Executing from flash 80 µs
Executing from flash 291 µs
Soft Pin Reset released 43 µs
Any other reset released 350 µs
VSCALE0 to VSCALE2, HFCLK = 19 MHz2
3
VSCALE2 to VSCALE0, HFCLK = 19 MHz
4
31.8 µs
4.3 µs
Note:
1. Time from wake up request until first instruction is executed. Wakeup results in device reset.
2. Scaling up from VSCALE0 to VSCALE2 requires approximately 30.3 µs + 28 HFCLKs.
3. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV/µs for approximately 20 µs. During this transition, peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA (with a 2.7 µF capacitor).
4. Scaling down from VSCALE2 to VSCALE0 requires approximately 2.8 µs + 29 HFCLKs.
Clocks
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.7 Brown Out Detector (BOD)

Table 4.10. Brown Out Detector (BOD)
Parameter Symbol Test Condition Min Typ Max Unit
DVDD BOD threshold V
DVDD BOD hysteresis V
DVDD BOD response time t
AVDD BOD threshold V
AVDD BOD hysteresis V
AVDD BOD response time t
EM4 BOD threshold V
EM4 BOD hysteresis V
EM4 BOD response time t
DVDDBOD
DVDDBOD_HYST
DVDDBOD_DELAY
AVDDBOD
AVDDBOD_HYST
AVDDBOD_DELAY
EM4DBOD
EM4BOD_HYST
EM4BOD_DELAY
DVDD rising 1.62 V
DVDD falling (EM0/EM1) 1.35 V
DVDD falling (EM2/EM3) 1.3 V
18 mV
Supply drops at 0.1V/µs rate 2.4 µs
AVDD rising 1.8 V
AVDD falling (EM0/EM1) 1.62 V
AVDD falling (EM2/EM3) 1.53 V
20 mV
Supply drops at 0.1V/µs rate 2.4 µs
AVDD rising 1.7 V
AVDD falling 1.45 V
25 mV
Supply drops at 0.1V/µs rate 300 µs
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.8 Frequency Synthesizer

Table 4.11. Frequency Synthesizer
Parameter Symbol Test Condition Min Typ Max Unit
RF synthesizer frequency range
LO tuning frequency resolu­tion with 38.4 MHz crystal
Frequency deviation resolu­tion with 38.4 MHz crystal
f
RANGE
f
RES
df
RES
2400 - 2483.5 MHz 2400 2483.5 MHz
779 - 956 MHz 779 956 MHz
584 - 717 MHz 584 717 MHz
358 - 574 MHz 358 574 MHz
191 - 358 MHz 191 358 MHz
110 - 191 MHz 110 191 MHz
2400 - 2483.5 MHz 73 Hz
779 - 956 MHz 24 Hz
584 - 717 MHz 18.3 Hz
358 - 574 MHz 12.2 Hz
191 - 358 MHz 7.3 Hz
110 - 191 MHz 4.6 Hz
2400 - 2483.5 MHz 73 Hz
779 - 956 MHz 24 Hz
584 - 717 MHz 18.3 Hz
358 - 574 MHz 12.2 Hz
Maximum frequency devia­tion with 38.4 MHz crystal
191 - 358 MHz 7.3 Hz
110 - 191 MHz 4.6 Hz
df
MAX
2400 - 2483.5 MHz 1677 kHz
779 - 956 MHz 559 kHz
584 - 717 MHz 419 kHz
358 - 574 MHz 280 kHz
191 - 358 MHz 167 kHz
110 - 191 MHz 105 kHz
silabs.com | Building a more connected world. Rev. 1.6 | 41
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.9 2.4 GHz RF Transceiver Characteristics

4.1.9.1 RF Transmitter General Characteristics for 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz.
Table 4.12. RF Transmitter General Characteristics for 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Maximum TX power
1
POUT
MAX
19 dBm-rated part numbers. PAVDD connected directly to ex­ternal 3.3V supply
19.5 dBm
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs supply at POUT
MAX
Output power variation vs temperature at POUT
MAX
Output power variation vs RF frequency at POUT
MAX
POUT
POUT
POUT
MIN
STEP
VAR_V
VAR_T
VAR_F
CW -30 dBm
-5 dBm< Output power < 0 dBm 1 dB
0 dBm < output power < POUT
MAX
1.8 V < V
VREGVDD
< 3.3 V,
0.5 dB
4.5 dB
PAVDD connected directly to ex­ternal supply, for output power > 10 dBm.
1.8 V < V
VREGVDD
< 3.3 V using
2.2 dB
DC-DC converter
From -40 to +85 °C, PAVDD con-
1.5 dB
nected to DC-DC output
From -40 to +125 °C, PAVDD
2.2 dB
connected to DC-DC output
From -40 to +85 °C, PAVDD con-
1.5 dB
nected to external supply
From -40 to +125 °C, PAVDD
3.4 dB
connected to external supply
Over RF tuning frequency range 0.4 dB
RF tuning frequency range F
RANGE
2400 2483.5 MHz
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
silabs.com | Building a more connected world. Rev. 1.6 | 42
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.2 RF Receiver General Characteristics for 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz.
Table 4.13. RF Receiver General Characteristics for 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Receive mode maximum spurious emission
Max spurious emissions dur­ing active receive mode, per FCC Part 15.109(a)
RANGE
SPUR
SPUR
RX
RX_FCC
30 MHz to 1 GHz -57 dBm
1 GHz to 12 GHz -47 dBm
216 MHz to 960 MHz, Conducted Measurement
Above 960 MHz, Conducted
2400 2483.5 MHz
-55.2 dBm
-47.2 dBm
Measurement
Level above which RFSENSE will trigger
1
Level below which RFSENSE will not trigger
1% PER sensitivity SENS
1
RFSENSE
RFSENSE
2GFSK
TRIG
THRES
CW at 2.45 GHz -24 dBm
CW at 2.45 GHz -50 dBm
2 Mbps 2GFSK signal -89.6 dBm
250 kbps 2GFSK signal -100.7 dBm
Note:
1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
silabs.com | Building a more connected world. Rev. 1.6 | 43
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.3 RF Transmitter Characteristics for 2GFSK in the 2.4GHz Band, 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4MHz. RF center frequency 2.45 GHz. Maximum duty cycle of 85%.
Table 4.14. RF Transmitter Characteristics for 2GFSK in the 2.4GHz Band, 1 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Transmit 6dB bandwidth TXBW 10 dBm 781 kHz
Power spectral density limit PSD
Occupied channel bandwidth
OCP
per ETSI EN300.328
Emissions of harmonics out-
SPUR
of-band, per FCC part
15.247
Spurious emissions out-of-
SPUR band, excluding harmonics captured in SPUR
HARM,FCC
.
Emissions taken at POUT
, PAVDD connec-
MAX
ted to external 3.3 V supply
Spurious emissions out-of-
SPUR band; per ETSI 300.328
LIMIT
ETSI328
HRM_FCC
OOB_FCC
ETSI328
Per FCC part 15.247 at 10 dBm -8.4 dBm/
3kHz
Per FCC part 15.247 at 20 dBm -0.4 dBm/
3kHz
Per ETSI 300.328 at 10 dBm/1
10.1 dBm
MHz
99% BW at highest and lowest
1.1 MHz
channels in band, 10 dBm
2nd,3rd, 5, 6, 8, 9,10 harmonics;
-47 dBm continuous transmission of modu­lated carrier
Per FCC part 15.205/15.209,
-47 dBm Above 2.483 GHz or below 2.4 GHz; continuous transmission of
CW carrier, Restricted Bands1
Per FCC part 15.247, Above
2
-26 dBc
2.483 GHz or below 2.4 GHz; continuous transmission of CW carrier, Non-Restricted Bands
[2400-BW to 2400] MHz, [2483.5
-16 dBm to 2483.5+BW] MHz
[2400-2BW to 2400-BW] MHz,
-26 dBm [2483.5+BW to 2483.5+2BW] MHz per ETSI 300.328
Spurious emissions per ETSI EN300.440
SPUR
ETSI440
47-74 MHz,87.5-108 MHz, 174-230 MHz, 470-862 MHz
-60 dBm
25-1000 MHz -42 dBm
1-12 GHz -36 dBm
Note:
1. For 2476 MHz, 1.5 dB of power backoff is used to achieve this value.
2. For 2478 MHz, 4.2 dB of power backoff is used to achieve this value.
silabs.com | Building a more connected world. Rev. 1.6 | 44
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.4 RF Receiver Characteristics for 2GFSK in the 2.4GHz Band, 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4MHz. RF center frequency 2.45 GHz.
Table 4.15. RF Receiver Characteristics for 2GFSK in the 2.4GHz Band, 1 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
SAT
level, 0.1% BER
Sensitivity, 0.1% BER SENS
Signal to co-channel interfer-
C/I
CC
er, 0.1% BER
N+1 adjacent channel selec-
C/I
1+
tivity, 0.1% BER, with allowa­ble exceptions. Desired is reference signal at -67 dBm
N-1 adjacent channel selec-
C/I
1-
tivity, 0.1% BER, with allowa­ble exceptions. Desired is reference signal at -67 dBm
Alternate selectivity, 0.1%
C/I
2
BER, with allowable excep­tions. Desired is reference signal at -67 dBm
Signal is reference signal1. Packet length is 20 bytes.
Signal is reference signal1. Using DC-DC converter.
Desired signal 3 dB above refer­ence sensitivity.
Interferer is reference signal at +1 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz
Interferer is reference signal at -1 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz
Interferer is reference signal at ± 2 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz, QFN48 and BGA125 packages.
Interferer is reference signal at ± 2 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz, QFN68 package.
10 dBm
-94.8 dBm
10.3 dB
-1.8 dB
-0.7 dB
-40.6 dB
-34.1 dB
Alternate selectivity, 0.1% BER, with allowable excep­tions. Desired is reference signal at -67 dBm
Selectivity to image frequen­cy, 0.1% BER. Desired is ref­erence signal at -67 dBm
Selectivity to image frequen­cy ± 1 MHz, 0.1% BER. De­sired is reference signal at
-67 dBm
Blocking, less than 0.1% BER. Desired is -67dBm BLE reference signal at 2426MHz. Interferer is CW in
OOB range
2
C/I
3
C/I
IM
C/I
IM+1
BLOCK
OOB
Interferer is reference signal at ± 3 MHz offset. Desired frequency 2404 MHz ≤ Fc ≤ 2480 MHz
Interferer is reference signal at im­age frequency with 1 MHz preci­sion
Interferer is reference signal at im­age frequency ± 1 MHz with 1 MHz precision
Interferer frequency 30 MHz ≤ f ≤ 2000 MHz
Interferer frequency 2003 MHz ≤ f ≤ 2399 MHz
Interferer frequency 2484 MHz ≤ f ≤ 2997 MHz
Interferer frequency 3 GHz ≤ f ≤ 6 GHz
Interferer frequency 6 GHz ≤ f ≤
12.75 GHz
-46.2 dB
-38.1 dB
-46.5 dB
-5 dBm
-24 dBm
-10 dBm
-10 dBm
-17 dBm
silabs.com | Building a more connected world. Rev. 1.6 | 45
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm.
2. Interferer max power limited by equipment capabilities and path loss. Minimum specified at 25 °C.
silabs.com | Building a more connected world. Rev. 1.6 | 46
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.5 RF Transmitter Characteristics for 2GFSK in the 2.4GHz Band, 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4MHz. RF center frequency 2.45 GHz. Maximum duty cycle of 85%.
Table 4.16. RF Transmitter Characteristics for 2GFSK in the 2.4GHz Band, 2 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Transmit 6dB bandwidth TXBW 10 dBm 1404 kHz
Power spectral density limit PSD
Occupied channel bandwidth
OCP
per ETSI EN300.328
Emissions of harmonics out-
SPUR
of-band, per FCC part
15.247
Spurious emissions out-of-
SPUR band, excluding harmonics captured in SPUR
HARM,FCC
.
Emissions taken at POUT
, PAVDD connec-
MAX
ted to external 3.3 V supply
Spurious emissions out-of-
SPUR band; per ETSI 300.328
LIMIT
ETSI328
HRM_FCC
OOB_FCC
ETSI328
Per FCC part 15.247 at 10 dBm -12.3 dBm/
3kHz
Per FCC part 15.247 at 20 dBm -4.0 dBm/
3kHz
Per ETSI 300.328 at 10 dBm/1
11.3 dBm
MHz
99% BW at highest and lowest
2.1 MHz
channels in band, 10 dBm
2nd,3rd, 5, 6, 8, 9,10 harmonics;
-47 dBm continuous transmission of modu­lated carrier
Per FCC part 15.205/15.209,
-47 dBm Above 2.483 GHz or below 2.4 GHz; continuous transmission of
CW carrier, Restricted Bands1 2
4
Per FCC part 15.247, Above
3
-26 dBc
2.483 GHz or below 2.4 GHz; continuous transmission of CW carrier, Non-Restricted Bands
[2400-BW to 2400] MHz, [2483.5
-16 dBm to 2483.5+BW] MHz
[2400-2BW to 2400-BW] MHz,
-26 dBm [2483.5+BW to 2483.5+2BW] MHz per ETSI 300.328
Spurious emissions per ETSI EN300.440
SPUR
ETSI440
47-74 MHz,87.5-108 MHz, 174-230 MHz, 470-862 MHz
-60 dBm
25-1000 MHz -42 dBm
1-12 GHz -36 dBm
Note:
1. For 2472 MHz, 1.3 dB of power backoff is used to achieve this value.
2. For 2474 MHz, 3.8 dB of power backoff is used to achieve this value.
3. For 2476 MHz, 7 dB of power backoff is used to achieve this value.
4. For 2478 MHz, 11.2 dB of power backoff is used to achieve this value.
silabs.com | Building a more connected world. Rev. 1.6 | 47
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.6 RF Receiver Characteristics for 2GFSK in the 2.4GHz Band, 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4MHz. RF center frequency 2.45 GHz1.
Table 4.17. RF Receiver Characteristics for 2GFSK in the 2.4GHz Band, 2 Mbps Data Rate
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
SAT
level, 0.1% BER
Sensitivity, 0.1% BER SENS
Signal to co-channel interfer-
C/I
CC
er, 0.1% BER
N+1 adjacent channel selec-
C/I
1+
tivity, 0.1% BER, with allowa­ble exceptions. Desired is reference signal at -67 dBm
N-1 adjacent channel selec-
C/I
1-
tivity, 0.1% BER, with allowa­ble exceptions. Desired is reference signal at -67 dBm
Alternate selectivity, 0.1%
C/I
2
BER, with allowable excep­tions. Desired is reference signal at -67 dBm
Signal is reference signal2. Packet length is 20 bytes.
Signal is reference signal2. Using DC-DC converter. QFN48 and BGA125 packages.
Signal is reference signal2. Using DC-DC converter. QFN68 pack­age.
Desired signal 3 dB above refer­ence sensitivity.
Interferer is reference signal at +2 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz
Interferer is reference signal at -2 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz
Interferer is reference signal at ± 4 MHz offset. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz
10 dBm
-91.3 dBm
-91.3 dBm
7.3 dB
-10.4 dB
-13.9 dB
-40.9 dB
Alternate selectivity, 0.1% BER, with allowable excep­tions. Desired is reference
C/I
3
Interferer is reference signal at ± 6
-43.7 dB MHz offset. Desired frequency 2404 MHz ≤ Fc ≤ 2480 MHz
signal at -67 dBm
Selectivity to image frequen­cy, 0.1% BER. Desired is ref­erence signal at -67 dBm
Selectivity to image frequen­cy ± 2 MHz, 0.1% BER. De­sired is reference signal at
C/I
C/I
IM
IM+1
Interferer is reference signal at im­age frequency with 1 MHz preci­sion
Interferer is reference signal at im­age frequency ± 2 MHz with 2 MHz precision
-10.4 dB
-40.9 dB
-67 dBm
Note:
1. For the BLE 2Mbps in-band blocking performance, there may be up to 5 spurious response channels where the requirement of
30.8% PER is not met and therefore an exception will need to be taken for each of these frequencies to meet the requirements of the BLE standard.
2. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm.
silabs.com | Building a more connected world. Rev. 1.6 | 48
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.7 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Maximum duty cycle of 66%.
Table 4.18. RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Error vector magnitude (off-
EVM Average across frequency. Signal
set EVM), per 802.15.4-2011
Power spectral density limit PSD
Occupied channel bandwidth
OCP
per ETSI EN300.328
Spurious emissions of har­monics in restricted bands per FCC Part 15.205/15.209,
SPUR
R
Emissions taken at POUT
, PAVDD connec-
MAX
ted to external 3.3 V supply, Test Frequency is 2450 MHz
Spurious emissions of har­monics in non-restricted bands per FCC Part
SPUR
NRR
15.247/15.35, Emissions tak­en at POUT
MAX
, PAVDD
connected to external 3.3 V supply, Test Frequency is 2450 MHz
LIMIT
ETSI328
HRM_FCC_
HRM_FCC_
3.8 % rms
is DSSS-OQPSK reference pack-
1
et
Relative, at carrier ± 3.5 MHz, out­put power at POUT
MAX
Absolute, at carrier ± 3.5 MHz, output power at POUT
MAX
2
Per FCC part 15.247, output pow­er at POUT
MAX
-26 dBc/
100kHz
-36 dBm/
100kHz
-4 dBm/
3kHz
ETSI 12.1 dBm
99% BW at highest and lowest
2.25 MHz
channels in band
Continuous transmission of modu-
-45.8 dBm
lated carrier
Continuous transmission of modu-
-26 dBc
lated carrier
Spurious emissions out-of­band (above 2.483 GHz or below 2.4 GHz) in restricted bands, per FCC part
15.205/15.209, Emissions taken at POUT
MAX
, PAVDD
connected to external 3.3 V supply, Test Frequency = 2450 MHz
SPUR
R
OOB_FCC_
Restricted bands 30-88 MHz; con­tinuous transmission of modulated carrier
Restricted bands 88-216 MHz; continuous transmission of modu­lated carrier
Restricted bands 216-960 MHz; continuous transmission of modu-
-61 dBm
-58 dBm
-55 dBm
lated carrier
Restricted bands >960 MHz; con-
-47 dBm
tinuous transmission of modulated carrier3
silabs.com | Building a more connected world. Rev. 1.6 | 49
4
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Spurious emissions out-of­band in non-restricted bands per FCC Part 15.247, Emis­sions taken at POUT
MAX
SPUR
NR
OOB_FCC_
Above 2.483 GHz or below 2.4 GHz; continuous transmission of modulated carrier
-26 dBc
,
PAVDD connected to exter­nal 3.3 V supply, Test Fre­quency = 2450 MHz
Spurious emissions out-of­band; per ETSI 300.328
SPUR
5
ETSI328
[2400-BW to 2400], [2483.5 to
2483.5+BW];
[2400-2BW to 2400-BW],
-16 dBm
-26 dBm [2483.5+BW to 2483.5+2BW]; per ETSI 300.328
Spurious emissions per ETSI EN300.440
5
SPUR
ETSI440
47-74 MHz,87.5-108 MHz, 174-230 MHz, 470-862 MHz
25-1000 MHz, excluding above
-60 dBm
-42 dBm frequencies
1G-14G -36 dBm
Note:
1. Reference packet is defined as 20 octet PSDU, modulated according to 802.15.4-2011 DSSS-OQPSK in the 2.4GHz band, with pseudo-random packet data content.
2. For 2415 MHz, 2 dB of power backoff is used to achieve this value.
3. For 2475 MHz, 2 dB of power backoff is used to achieve this value.
4. For 2480 MHz, 13 dB of power backoff is used to achieve this value.
5. Specified at maximum power output level of 10 dBm.
silabs.com | Building a more connected world. Rev. 1.6 | 50
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.9.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD. RFVDD and PAVDD path is filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz.
Table 4.19. RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input level, 1% PER
SAT
Signal is reference signal1. Packet length is 20 octets.
Sensitivity, 1% PER SENS Signal is reference signal. Packet
length is 20 octets. Using DC-DC converter.
Signal is reference signal. Packet length is 20 octets. Without DC­DC converter.
Co-channel interferer rejec­tion, 1% PER
High-side adjacent channel rejection, 1% PER. Desired is reference signal at 3dB above reference sensitivity
2
level
CCR Desired signal 3 dB above sensi-
tivity limit
ACR
P1
Interferer is reference signal at +1 channel-spacing.
Interferer is filtered reference sig­nal3 at +1 channel-spacing.
Interferer is CW at +1 channel­spacing4.
Low-side adjacent channel rejection, 1% PER. Desired is reference signal at 3dB above reference sensitivity
2
level
ACR
M1
Interferer is reference signal at -1 channel-spacing.
Interferer is filtered reference sig­nal3 at -1 channel-spacing.
Interferer is CW at -1 channel­spacing.
10 dBm
-102.7 dBm
-102.7 dBm
-4.6 dB
40.7 dB
47 dB
54.3 dB
40.8 dB
47.5 dB
56.5 dB
Alternate channel rejection, 1% PER. Desired is refer­ence signal at 3dB above
reference sensitivity level
2
Image rejection , 1% PER, Desired is reference signal at 3dB above reference sensi-
tivity level
2
Blocking rejection of all other channels. 1% PER, Desired is reference signal at 3dB above reference sensitivity
level2. Interferer is reference signal
Blocking rejection of 802.11g signal centered at +12MHz
or -13MHz
5
ACR
2
Interferer is reference signal at ± 2 channel-spacing
Interferer is filtered reference sig­nal3 at ± 2 channel-spacing
Interferer is CW at ± 2 channel­spacing
IR
Interferer is CW in image band
4
BLOCK Interferer frequency < Desired fre-
quency - 3 channel-spacing
Interferer frequency > Desired fre­quency + 3 channel-spacing
BLOCK
80211G
Desired is reference signal at 6dB above reference sensitivity level
2
51.5 dB
53.7 dB
62.4 dB
50.4 dB
58.5 dB
56.4 dB
53 dB
silabs.com | Building a more connected world. Rev. 1.6 | 51
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Upper limit of input power
RSSI
MAX
5 dBm range over which RSSI reso­lution is maintained
Lower limit of input power
RSSI
MIN
-98 dBm range over which RSSI reso­lution is maintained
RSSI resolution RSSI
RSSI accuracy in the linear
RSSI
RES
LIN
over RSSI
to RSSI
MIN
MAX
0.25 dB
+/-6 dB
region as defined by
802.15.4-2003
Note:
1. Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksym­bols/s.
2. Reference sensitivity level is -85 dBm.
3. Filter is characterized as a symmetric bandpass centered on the adjacent channel having a 3dB bandwidth of 4.6 MHz and stop­band rejection better than 26 dB beyond 3.15 MHz from the adjacent carrier.
4. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker tests place the Interferer center frequency at the Desired frequency ± 5 MHz on the channel raster, whereas the image rejection test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster.
5. This is an IEEE 802.11b/g ERP-PBCC 22 MBit/s signal as defined by the IEEE 802.11 specification and IEEE 802.11g adden­dum.
silabs.com | Building a more connected world. Rev. 1.6 | 52

4.1.10 Sub-GHz RF Transceiver Characteristics

EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.6 | 53
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.1 Sub-GHz RF Transmitter characteristics for 915 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 915 MHz.
Table 4.20. Sub-GHz RF Transmitter characteristics for 915 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX Power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs supply at POUT
MAX
Output power variation vs
POUT
POUT
temperature, peak to peak
Output power variation vs RF
POUT
frequency
MAX
MIN
STEP
VAR_V
VAR_T
VAR_F
902 930 MHz
External PA supply = 3.3V, 20
18 19.8 23.3 dBm
dBm output power setting
External PA supply connected to
12.6 14.2 16.1 dBm DC-DC output, 14 dBm output power setting
-45.5 dBm
output power > 0 dBm 0.5 dB
1.8 V < V
VREGVDD
< 3.3 V, Exter-
4.8 dB
nal PA supply = 3.3 V, T = 25 °C
1.8 V < V
VREGVDD
< 3.3 V, Exter-
1.9 dB
nal PA supply connected to DC­DC output, T = 25 °C
-40 to +85 °C with External PA
0.6 1.3 dB
supply = 3.3 V
-40 to +85 °C with External PA
0.7 1.4 dB supply connected to DC-DC out­put
External PA supply = 3.3 V, T =
0.2 0.6 dB 25 °C
Spurious emissions of har­monics at 20 dBm output power, Conducted measure­ment, 20dBm match, Exter­nal PA supply = 3.3V, Test Frequency = 915 MHz
Spurious emissions out-of­band at 20 dBm output pow­er, Conducted measurement, 20dBm match, External PA supply = 3.3V, Test Frequen­cy = 915 MHz
SPUR
_20
SPUR
20
HARM_FCC
OOB_FCC_
External PA supply connected to DC-DC output, T = 25 °C
In restricted bands, per FCC Part
15.205 / 15.209
In non-restricted bands, per FCC Part 15.247
In non-restricted bands, per FCC Part 15.247
In restricted bands (30-88 MHz), per FCC Part 15.205 / 15.209
In restricted bands (88-216 MHz), per FCC Part 15.205 / 15.209
In restricted bands (216-960 MHz), per FCC Part 15.205 /
15.209
In restricted bands (>960 MHz), per FCC Part 15.205 / 15.209
0.3 0.6 dB
-45 -42 dBm
-26 -20 dBc
-26 -20 dBc
-62 -56 dBm
-61 -56 dBm
-58 -52 dBm
-47 -42 dBm
silabs.com | Building a more connected world. Rev. 1.6 | 54
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Spurious emissions of har­monics at 14 dBm output power, Conducted measure­ment, 14dBm match, Exter­nal PA supply connected to DC-DC output, Test Fre­quency = 915 MHz
Spurious emissions out-of­band at 14 dBm output pow­er, Conducted measurement, 14dBm match, External PA supply connected to DC-DC output, Test Frequency = 915 MHz
Error vector magnitude (off­set EVM), per 802.15.4-2011
Power spectral density limit
SPUR
_14
HARM_FCC
In restricted bands, per FCC Part
15.205 / 15.209
In non-restricted bands, per FCC Part 15.247
SPUR
14
OOB_FCC_
In non-restricted bands, per FCC Part 15.247
In restricted bands (30-88 MHz), per FCC Part 15.205 / 15.209
In restricted bands (88-216 MHz), per FCC Part 15.205 / 15.209
In restricted bands (216-960 MHz), per FCC Part 15.205 /
15.209
In restricted bands (>960 MHz), per FCC Part 15.205 / 15.209
EVM Signal is DSSS-OQPSK reference
packet. Modulated according to
802.15.4-2011 DSSS-OQPSK in the 915MHz band, with pseudo­random packet data content. Ex­ternal PA supply = 3.3V.
2
PSD Relative, at carrier ± 1.2 MHz.
Average spectral power shall be measured using a 100kHz resolu­tion bandwidth. The reference lev­el shall be the highest average spectral power measured within ± 600kHz of the carrier frequency. External PA supply = 3.3V.
-47 -42 dBm
-26 -20 dBc
-26 -20 dBc
-62 -56 dBm
-61 -56 dBm
-58 -52 dBm
-45 -42 dBm
1.0 2.8 %rms
-37.1 -24.8 dBc/
100kHz
Absolute, at carrier ± 1.2 MHz.
-24.2 -20 dBm/ Average spectral power shall be measured using a 100kHz resolu­tion bandwidth. External PA sup­ply = 3.3V.
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
2. Definition of reference signal is O-QPSK DSSS per 802.15.4, Frequency Range = 902-928 MHz, Data rate = 250 kbps, 16-chip PN sequence mapping.
100kHz
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.2 Sub-GHz RF Receiver Characteristics for 915 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 915 MHz.
Table 4.21. Sub-GHz RF Receiver Characteristics for 915 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Tuning frequency range F
Max usable input level, 0.1% BER
RANGE
SAT
500K
Desired is reference 500 kbps GFSK signal
1
Sensitivity SENS Desired is reference 4.8 kbps
OOK signal2, 20% PER, T ≤ 85 °C
Desired is reference 600 bps GFSK signal3, 0.1% BER
Desired is reference 50 kbps GFSK signal4, 0.1% BER, T ≤ 85
°C
Desired is reference 100 kbps GFSK signal5, 0.1% BER, T ≤ 85
°C
Desired is reference 500 kbps GFSK signal1, 0.1% BER, T ≤ 85
°C
Desired is reference 400 kbps 4GFSK signal6, 1% PER, T ≤ 85
°C
Desired is reference O-QPSK DSSS signal7, 1% PER, Payload
length is 20 octets
902 930 MHz
10 dBm
-105.2 -100.7 dBm
-126.2 dBm
-108.2 -104.2 dBm
-105.1 -101.5 dBm
-98.2 -93.2 dBm
-95.2 -91 dBm
-100.1 dBm
Level above which RFSENSE will trigger
8
Level below which RFSENSE will not trigger
8
RFSENSE
RFSENSE
TRIG
THRES
CW at 915 MHz -28.1 dBm
CW at 915 MHz -50 dBm
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Adjacent channel selectivity, Interferer is CW at ± 1 × channel-spacing
C/I
1
Desired is 4.8 kbps OOK signal at 3dB above sensitivity level, 20% PER
Desired is 600 bps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 50 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 100 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 500 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
2
3
4
48.1 dB
71.4 dB
49.8 dB
5
51.1 dB
1
48.1 dB
Alternate channel selectivity, Interferer is CW at ± 2 × channel-spacing
C/I
Desired is 400 kbps 4GFSK sig-
41.4 dB
nal6 at 3dB above sensitivity level,
0.1% BER
Desired is reference O-QPSK
49.1 dB
DSSS signal7 at 3dB above sensi­tivity level, 1% PER
2
Desired is 4.8 kbps OOK signal
2
56.3 dB
at 3dB above sensitivity level, 20% PER
Desired is 600 bps GFSK signal
3
74.7 dB
at 3dB above sensitivity level,
0.1% BER
Desired is 50 kbps GFSK signal
4
55.8 dB
at 3dB above sensitivity level,
0.1% BER
5
Desired is 100 kbps GFSK signal
56.4 dB
at 3dB above sensitivity level,
0.1% BER
1
Desired is 500 kbps GFSK signal
51.8 dB
at 3dB above sensitivity level,
0.1% BER
Desired is 400 kbps 4GFSK sig-
46.8 dB
nal6 at 3dB above sensitivity level,
0.1% BER
Desired is reference O-QPSK
57.7 dB
DSSS signal7 at 3dB above sensi­tivity level, 1% PER
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Image rejection, Interferer is CW at image frequency
C/I
IMAGE
Desired is 4.8 kbps OOK signal at 3dB above sensitivity level, 20% PER
Desired is 50 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 100 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 500 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
2
4
48.4 dB
54.9 dB
5
49.1 dB
1
47.9 dB
Blocking selectivity, 0.1%
C/I
BLOCKER
BER. Desired is 100 kbps GFSK signal at 3dB above sensitivity level
Intermod selectivity, 0.1%
C/I
IM
BER. CW interferers at 400 kHz and 800 kHz offsets
Upper limit of input power
RSSI range over which RSSI reso­lution is maintained
Lower limit of input power
RSSI range over which RSSI reso­lution is maintained
RSSI resolution RSSI
Max spurious emissions dur-
SPUR ing active receive mode, per FCC Part 15.109(a)
MAX
MIN
RES
RX_FCC
Desired is 400 kbps 4GFSK sig-
42.8 dB
nal6 at 3dB above sensitivity level,
0.1% BER
Desired is reference O-QPSK
48.9 dB
DSSS signal7 at 3dB above sensi­tivity level, 1% PER
Interferer CW at Desired ± 1 MHz 58.7 dB
Interferer CW at Desired ± 2 MHz 62.5 dB
Interferer CW at Desired ± 10
76.4 dB
MHz
5
Desired is 100 kbps GFSK signal
45 dB
at 3dB above sensitivity level
5 dBm
-98 dBm
Over RSSI
MIN
to RSSI
range 0.25 dBm
MAX
216-960 MHz -55 -49.2 dBm
Above 960 MHz -47 -41.2 dBm
Max spurious emissions dur­ing active receive mode,per ARIB STD-T108 Section 3.3
SPUR
RX_ARIB
Below 710 MHz, RBW=100kHz -60 -54 dBm
710-900 MHz, RBW=1MHz -61 -55 dBm
900-915 MHz, RBW=100kHz -61 -55 dBm
915-930 MHz, RBW=100kHz -61 -55 dBm
930-1000 MHz, RBW=100kHz -61 -55 dBm
Above 1000 MHz, RBW=1MHz -53 -47 dBm
silabs.com | Building a more connected world. Rev. 1.6 | 58
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 175 kHz, RX channel BW = 835.076 kHz, channel spacing = 1 MHz.
2. Definition of reference signal is 4.8 kbps OOK, RX channel BW = 306.036 kHz, channel spacing = 500 kHz.
3. Definition of reference signal is 600 bps 2GFSK, BT=0.5, Δf = 0.3 kHz, RX channel BW = 1.2 kHz, channel spacing = 300 kHz.
4. Definition of reference signal is 50 kbps 2GFSK, BT=0.5, Δf = 25 kHz, RX channel BW = 99.012 kHz, channel spacing = 200 kHz.
5. Definition of reference signal is 100 kbps 2GFSK, BT=0.5, Δf = 50 kHz, RX channel BW = 198.024 kHz, channel spacing = 400 kHz.
6. Definition of reference signal is 400 kbps 4GFSK, BT=0.5, inner deviation = 33.3 kHz, RX channel BW = 368.920 kHz, channel spacing = 600 kHz.
7. Definition of reference signal is O-QPSK DSSS per 802.15.4, Frequency Range = 902-928 MHz, Data rate = 250 kbps, 16-chip PN sequence mapping.
8. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
silabs.com | Building a more connected world. Rev. 1.6 | 59
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.3 Sub-GHz RF Transmitter characteristics for 868 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 868 MHz.
Table 4.22. Sub-GHz RF Transmitter characteristics for 868 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX Power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs supply at POUT
MAX
Output power variation vs
POUT
POUT
temperature, peak to peak
Output power variation vs RF
POUT
frequency
MAX
MIN
STEP
VAR_V
VAR_T
VAR_F
863 876 MHz
External PA supply = 3.3V, 20
17.1 19.3 22.9 dBm dBm output power setting, T ≤ 85 °C
External PA supply connected to
11.4 13.7 16.5 dBm DC-DC output, 14 dBm output power setting
-43.5 dBm
output power > 0 dBm 0.5 dB
1.8 V < V
VREGVDD
< 3.3 V, Exter-
5 dB
nal PA supply = 3.3 V, T = 25 °C
1.8 V < V
VREGVDD
< 3.3 V, Exter-
2 dB
nal PA supply connected to DC­DC output, T = 25 °C
-40 to +85 °C with External PA
0.6 0.9 dB
supply = 3.3 V
-40 to +85 °C with External PA
0.5 1.2 dB supply connected to DC-DC out­put
External PA supply = 3.3 V, T =
0.2 0.6 dB 25 °C
Spurious emissions of har­monics, Conducted meas­urement, Test Frequency = 868 MHz
Spurious emissions out-of­band, Conducted measure­ment, Test Frequency = 868 MHz
SPUR
SPUR
HARM_ETSI
OOB_ETSI
External PA supply connected to DC-DC output, T = 25 °C
Per ETSI EN 300-220, Section
7.8.2.1, External PA supply con­nected to: DCDC at 14 dBm, or
3.3 V at 19.5 dBm
Per ETSI EN 300-220, Section
7.8.2.1 (47-74 MHz, 87.5-118 MHz, 174-230 MHz, and 470-862 MHz), External PA supply connec­ted to: DCDC at 14 dBm, or 3.3 V at 19.5 dBm
Per ETSI EN 300-220, Section
7.8.2.1 (other frequencies below 1 GHz), External PA supply connec­ted to: DCDC at 14 dBm, or 3.3 V at 19.5 dBm
Per ETSI EN 300-220, Section
7.8.2.1 (frequencies above 1 GHz), External PA supply connec­ted to: DCDC at 14 dBm, or 3.3 V at 19.5 dBm
0.2 0.8 dB
-35 -30 dBm
-59 -54 dBm
-42 -36 dBm
-36 -30 dBm
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Error vector magnitude (off­set EVM), per 802.15.4-2015
EVM Signal is DSSS-BPSK reference
packet. Modulated according to
5.7 %rms
802.15.4-2015 DSSS-BPSK in the 868MHz band, with pseudo-ran­dom packet data content. External PA supply connected to external
3.3V supply
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
silabs.com | Building a more connected world. Rev. 1.6 | 61
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.4 Sub-GHz RF Receiver Characteristics for 868 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 868 MHz.
Table 4.23. Sub-GHz RF Receiver Characteristics for 868 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Tuning frequency range F
Max usable input level, 0.1% BER
Max usable input level, 0.1% BER
RANGE
SAT
SAT
2k4
38k4
Desired is reference 2.4 kbps GFSK signal
1
Desired is reference 38.4 kbps GFSK signal
2
Sensitivity SENS Desired is reference 2.4 kbps
GFSK signal1, 0.1% BER
Desired is reference 38.4 kbps GFSK signal2, 0.1% BER, T ≤ 85
°C
Desired is reference 500 kbps GFSK signal3, 0.1% BER
Desired is reference BPSK sig­nal4, 1% PER
Level above which RFSENSE will trigger
5
Level below which RFSENSE will not trigger
Adjacent channel selectivity, Interferer is CW at ± 1 × channel-spacing
5
RFSENSE
RFSENSE
C/I
1
TRIG
THRES
CW at 868 MHz -28.1 dBm
CW at 868 MHz -50 dBm
Desired is 2.4 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Alternate channel selectivity, Interferer is CW at ± 2 × channel-spacing
C/I
2
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Image rejection, Interferer is CW at image frequency
C/I
IMAGE
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
863 876 MHz
10 dBm
10 dBm
-120.6 dBm
-109.5 -105.4 dBm
-96.4 dBm
-110.6 dBm
1
44.5 56.9 dB
2
35.4 43 dB
1
1
56.8 dB
2
48.2 dB
50.2 dB
2
48.7 dB
Blocking selectivity, 0.1% BER. Desired is 2.4 kbps
GFSK signal1 at 3 dB above sensitivity level
C/I
BLOCKER
Interferer CW at Desired ± 1 MHz 72.1 dB
Interferer CW at Desired ± 2 MHz 77.5 dB
Interferer CW at Desired ± 10
90.4 dB
MHz
silabs.com | Building a more connected world. Rev. 1.6 | 62
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Upper limit of input power
RSSI
MAX
5 dBm range over which RSSI reso­lution is maintained
Lower limit of input power
RSSI
MIN
-98 dBm range over which RSSI reso­lution is maintained
RSSI resolution RSSI
Max spurious emissions dur-
SPUR
ing active receive mode
RES
RX
Over RSSI
MIN
to RSSI
range 0.25 dBm
MAX
30 MHz to 1 GHz -63 -57 dBm
1 GHz to 12 GHz -53 -47 dBm
Note:
1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.797 kHz, channel spacing = 12.5 kHz.
2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100 kHz.
3. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 125 kHz, RX channel BW = 753.320 kHz.
4. Definition of reference signal is 20 kbps BPSK
5. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.5 Sub-GHz RF Transmitter characteristics for 490 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 490 MHz.
Table 4.24. Sub-GHz RF Transmitter characteristics for 490 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX Power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs
POUT
supply, peak to peak
Output power variation vs
POUT
temperature, peak to peak
Output power variation vs RF
POUT
frequency
Harmonic emissions, 20
SPUR dBm output power setting, 490 MHz
Spurious emissions, 20 dBm
SPUR output power setting, 490 MHz
MAX
MIN
STEP
VAR_V
VAR_T
VAR_F
HARM_CN
OOB_CN
470 510 MHz
External PA supply = 3.3V 18.1 20.3 23.7 dBm
-44.9 dBm
output power > 0 dBm 0.5 dB
at 20 dBm;1.8 V < V
VREGVDD
<
4.3 dB
3.3 V, External PA supply connec­ted directly to external supply, T = 25 °C
-40 to +85 °C at 20 dBm 0.2 0.9 dB
T = 25 °C 0.2 0.4 dB
Per China SRW Requirement,
-40 -36 dBm Section 2.1, frequencies below 1GHz
Per China SRW Requirement,
-36 -30 dBm Section 2.1, frequencies above 1GHz
Per China SRW Requirement,
-54 dBm Section 3 (48.5-72.5MHz, 76-108MHz, 167-223MHz, 470-556MHz, and 606-798MHz)
Per China SRW Requirement,
-42 dBm Section 2.1 (other frequencies be­low 1GHz)
Per China SRW Requirement,
-36 dBm Section 2.1 (frequencies above 1GHz)
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
silabs.com | Building a more connected world. Rev. 1.6 | 64
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.6 Sub-GHz RF Receiver Characteristics for 490 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 490 MHz.
Table 4.25. Sub-GHz RF Receiver Characteristics for 490 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Tuning frequency range F
Max usable input level, 0.1% BER
Max usable input level, 0.1% BER
RANGE
SAT
SAT
2k4
38k4
Desired is reference 2.4 kbps GFSK signal
1
Desired is reference 38.4 kbps GFSK signal
2
Sensitivity SENS Desired is reference 2.4 kbps
GFSK signal1, 0.1% BER
Desired is reference 38.4 kbps GFSK signal2, 0.1% BER, T ≤ 85
°C
Desired is reference 10 kbps GFSK signal3, 0.1% BER, T ≤ 85
°C
Desired is reference 100 kbps GFSK signal4, 0.1% BER, T ≤ 85
°C
Level above which RFSENSE will trigger
5
Level below which RFSENSE will not trigger
Adjacent channel selectivity, Interferer is CW at ± 1 × channel-spacing
5
RFSENSE
RFSENSE
C/I
1
TRIG
THRES
Desired is reference 100 kbps GFSK signal4, 0.1% BER
CW at 490 MHz -50 dBm
Desired is 2.4 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Alternate channel selectivity, Interferer is CW at ± 2 × channel-spacing
C/I
2
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Image rejection, Interferer is CW at image frequency
C/I
IMAGE
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
470 510 MHz
10 dBm
10 dBm
-122.2 dBm
-111.4 -108.9 dBm
-116.8 -113.9 dBm
-107.3 -104.7 dBm
-28.1 dBm
1
1
1
48 60.3 dB
2
38.3 45.6 dB
60.4 dB
2
52.6 dB
56.5 dB
2
54.1 dB
Blocking selectivity, 0.1% BER. Desired is 2.4 kbps
GFSK signal1 at 3 dB above sensitivity level
C/I
BLOCKER
Interferer CW at Desired ± 1 MHz 73.9 dB
Interferer CW at Desired ± 2 MHz 75.4 dB
Interferer CW at Desired ± 10
90.2 dB
MHz
silabs.com | Building a more connected world. Rev. 1.6 | 65
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Upper limit of input power
RSSI
MAX
5 dBm range over which RSSI reso­lution is maintained
Lower limit of input power
RSSI
MIN
-98 dBm range over which RSSI reso­lution is maintained
RSSI resolution RSSI
Max spurious emissions dur-
SPUR
ing active receive mode
RES
RX
Over RSSI
MIN
to RSSI
range 0.25 dBm
MAX
30 MHz to 1 GHz -53 -47 dBm
1 GHz to 12 GHz -53 -47 dBm
Note:
1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5 kHz.
2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100 kHz.
3. Definition of reference signal is 10 kbps 2GFSK, BT=0.5, Δf = 5 kHz, RX channel BW = 20.038 kHz.
4. Definition of reference signal is 100 kbps 2GFSK, BT=0.5, Δf = 50 kHz, RX channel BW = 198.024 kHz.
5. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
silabs.com | Building a more connected world. Rev. 1.6 | 66
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.7 Sub-GHz RF Transmitter characteristics for 433 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 433 MHz.
Table 4.26. Sub-GHz RF Transmitter characteristics for 433 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX Power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs
POUT supply, peak to peak, Pout = 10dBm
Output power variation vs
POUT temperature, peak to peak, Pout= 10dBm
Output power variation vs RF
POUT frequency, Pout = 10dBm
Spurious emissions of har-
SPUR monics FCC, Conducted measurement, 14dBm match, External PA supply connected to DC-DC output, Test Frequency = 434 MHz
MAX
MIN
STEP
VAR_V
VAR_T
VAR_F
HARM_FCC
426 445 MHz
External PA supply connected to
12.5 15.1 17.4 dBm DC-DC output, 14dBm output power
External PA supply connected to
8.3 10.6 13.3 dBm DC-DC output, 10dBm output power
-42 dBm
output power > 0 dBm 0.5 dB
At 10 dBm;1.8 V < V
VREGVDD
<
1.7 dB
3.3 V, External PA supply = DC­DC output, T = 25 °C
-40 to +85C at 10dBm 0.5 1.2 dB
T = 25 °C 0.1 0.2 dB
In restricted bands, per FCC Part
-47 -42 dBm
15.205 / 15.209
In non-restricted bands, per FCC
-26 -20 dBc
Part 15.231
Spurious emissions out-of­band FCC, Conducted measurement, 14dBm match, External PA supply connected to DC-DC output, Test Frequency = 434 MHz
Spurious emissions of har­monics ETSI, Conducted measurement, 14dBm match, External PA supply connected to DC-DC output, Test Frequency = 434 MHz
SPUR
SPUR
OOB_FCC
HARM_ETSI
In non-restricted bands, per FCC Part 15.231
In restricted bands (30-88 MHz), per FCC Part 15.205 / 15.209
In restricted bands (88-216 MHz), per FCC Part 15.205 / 15.209
In restricted bands (216-960 MHz), per FCC Part 15.205 /
15.209
In restricted bands (>960 MHz), per FCC Part 15.205 / 15.209
Per ETSI EN 300-220, Section
7.8.2.1 (frequencies below 1Ghz)
Per ETSI EN 300-220, Section
7.8.2.1 (frequencies above 1Ghz)
-26 -20 dBc
-52 -46 dBm
-61 -56 dBm
-58 -52 dBm
-47 -42 dBm
-42 -36 dBm
-36 -30 dBm
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Spurious emissions out-of­band ETSI, Conducted measurement, 14dBm match, External PA supply connected to DC-DC output, Test Frequency = 434 MHz
SPUR
OOB_ETSI
Per ETSI EN 300-220, Section
7.8.2.1 (47-74 MHz, 87.5-118 MHz, 174-230 MHz, and 470-862 MHz)
Per ETSI EN 300-220, Section
7.8.2.1 (other frequencies below 1
-60 -54 dBm
-42 -36 dBm
GHz)
Per ETSI EN 300-220, Section
-36 -30 dBm
7.8.2.1 (frequencies above 1 GHz)
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
silabs.com | Building a more connected world. Rev. 1.6 | 68
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.8 Sub-GHz RF Receiver Characteristics for 433 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 433 MHz.
Table 4.27. Sub-GHz RF Receiver Characteristics for 433 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Tuning frequency range F
Max usable input level, 0.1% BER
Max usable input level, 0.1% BER
RANGE
SAT
SAT
2k4
50k
Desired is reference 2.4 kbps GFSK signal
1
Desired is reference 50 kbps GFSK signal
2
Sensitivity SENS Desired is reference 4.8 kbps
OOK signal3, 20% PER
Desired is reference 100 kbps GFSK signal4, 0.1% BER, T ≤ 85
°C
Desired is reference 50 kbps GFSK signal2, 0.1% BER, T ≤ 85
°C
Desired is reference 2.4 kbps GFSK signal1, 0.1% BER
Desired is reference 9.6 kbps GFSK signal5, 1% PER, T ≤ 85 °C
Level above which RFSENSE will trigger
6
Level below which RFSENSE will not trigger
Adjacent channel selectivity, Interferer is CW at ± 1 × channel-spacing
6
RFSENSE
RFSENSE
C/I
1
TRIG
THRES
CW at 433 MHz -28.1 dBm
CW at 433 MHz -50 dBm
Desired is 4.8 kbps OOK signal at 3dB above sensitivity level, 20% PER
Desired is 100 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 2.4 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 50 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
426 445 MHz
10 dBm
10 dBm
-107.4 dBm
-107.3 -105 dBm
-110.3 -107.2 dBm
-123.1 dBm
-112.6 -109 dBm
3
1
2
51.6 dB
4
35 44.1 dB
47 61.5 dB
45.6 53.1 dB
Desired is 9.6 kbps 4GFSK sig-
35.7 dB
nal5 at 3dB above sensitivity level, 1% PER
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Alternate channel selectivity, Interferer is CW at ± 2 × channel-spacing
C/I
2
Desired is 4.8 kbps OOK signal at 3dB above sensitivity level, 20% PER
Desired is 100 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 2.4 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 50 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
3
1
2
57.8 dB
4
54.6 dB
62.4 dB
58.1 dB
Image rejection, Interferer is CW at image frequency
Blocking selectivity, 0.1% BER. Desired is 2.4 kbps
GFSK signal1 at 3dB above sensitivity level
Intermod selectivity, 0.1% BER. CW interferers at 12.5 kHz and 25 kHz offsets
C/I
IMAGE
C/I
BLOCKER
C/I
IM
Desired is 9.6 kbps 4GFSK sig-
50.6 dB
nal5 at 3dB above sensitivity level, 1% PER
Desired is 4.8 kbps OOK signal
3
46.5 dB
at 3dB above sensitivity level, 20% PER
4
Desired is 100 kbps GFSK signal
51.7 dB
at 3dB above sensitivity level,
0.1% BER
Desired is 2.4 kbps GFSK signal
1
57.5 dB
at 3dB above sensitivity level,
0.1% BER
Desired is 50 kbps GFSK signal
2
54.4 dB
at 3dB above sensitivity level,
0.1% BER
Desired is 9.6 kbps 4GFSK sig-
48 dB
nal5 at 3dB above sensitivity level, 1% PER
Interferer CW at Desired ± 1 MHz 75.7 dB
Interferer CW at Desired ± 2 MHz 77.2 dB
Interferer CW at Desired ± 10
92 dB
MHz
Desired is 2.4 kbps GFSK signal
1
58.8 dB
at 3dB above sensitivity level
Upper limit of input power
RSSI
MAX
5 dBm range over which RSSI reso­lution is maintained
Lower limit of input power
RSSI
MIN
-98 dBm range over which RSSI reso­lution is maintained
RSSI resolution RSSI
Max spurious emissions dur-
SPUR
RES
RX_FCC
ing active receive mode, per FCC Part 15.109(a)
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Over RSSI
MIN
to RSSI
range 0.25 dBm
MAX
216-960 MHz -55 -49 dBm
Above 960 MHz -47 -41 dBm
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Max spurious emissions dur­ing active receive mode, per ETSI 300-220 Section 8.6
Max spurious emissions dur-
SPUR
SPUR
RX_ETSI
RX_ARIB
Below 1000 MHz -63 -57 dBm
Above 1000 MHz -53 -47 dBm
Below 710 MHz, RBW=100kHz -60 -54 dBm ing active receive mode, per ARIB STD T67 Section
3.3(5)
Note:
1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5 kHz.
2. Definition of reference signal is 50 kbps 2GFSK, BT=0.5, Δf = 25 kHz, RX channel BW = 99.012 kHz, channel spacing = 200 kHz.
3. Definition of reference signal is 4.8 kbps OOK, RX channel BW = 306.036 kHz, channel spacing = 500 kHz.
4. Definition of reference signal is 100 kbps 2GFSK, BT=0.5, Δf = 50 kHz, RX channel BW = 198.024 kHz, channel spacing = 200 kHz.
5. Definition of reference signal is 9.6 kbps 4GFSK, BT=0.5, inner deviation = 0.8 kHz, RX channel BW = 8.5 kHz, channel spacing = 12.5 kHz.
6. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.9 Sub-GHz RF Transmitter characteristics for 315 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 315 MHz.
Table 4.28. Sub-GHz RF Transmitter characteristics for 315 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX Power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs
POUT
supply
Output power variation vs
POUT
temperature
Output power variation vs RF
POUT
frequency
Spurious emissions of har-
SPUR monics at 14 dBm output power, Conducted measure­ment, 14dBm match, Exter­nal PA supply connected to DC-DC output, Test Fre­quency = 303 MHz
Spurious emissions out-of-
SPUR band at 14 dBm output pow­er, Conducted measurement, 14dBm match, External PA supply connected to DC-DC output, Test Frequency = 303 MHz
MAX
MIN
STEP
VAR_V
VAR_T
VAR_F
HARM_FCC
OOB_FCC
195 358 MHz
External PA supply connected to
13.8 17.2 21.1 dBm
DC-DC output, T ≤ 85 °C
-43.9 dBm
output power > 0 dBm 0.5 dB
1.8 V < V
VREGVDD
< 3.3 V, Exter-
1.8 dB
nal PA supply = DC-DC output, T = 25 °C
-40 to +85C 0.5 1.2 dB
T = 25 °C 0.1 0.7 dB
In restricted bands, per FCC Part
-47 -42 dBm
15.205 / 15.209
In non-restricted bands, per FCC
-26 -20 dBc
Part 15.231
In non-restricted bands, per FCC
-26 -20 dBc
Part 15.231
In restricted bands (30-88 MHz),
-52 -46 dBm
per FCC Part 15.205 / 15.209
In restricted bands (88-216 MHz),
-61 -56 dBm
per FCC Part 15.205 / 15.209
In restricted bands (216-960
-58 -52 dBm
MHz), per FCC Part 15.205 /
15.209
In restricted bands (>960 MHz),
-47 -42 dBm
per FCC Part 15.205 / 15.209
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.10 Sub-GHz RF Receiver Characteristics for 315 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 315 MHz.
Table 4.29. Sub-GHz RF Receiver Characteristics for 315 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Tuning frequency range F
Max usable input level, 0.1% BER
Max usable input level, 0.1% BER
RANGE
SAT
SAT
2k4
38k4
Desired is reference 2.4 kbps GFSK signal
1
Desired is reference 38.4 kbps GFSK signal
2
Sensitivity SENS Desired is reference 2.4 kbps
GFSK signal1, 0.1% BER, T ≤ 85 °C
Desired is reference 38.4 kbps GFSK signal2, 0.1% BER, T ≤ 85
°C
Desired is reference 500 kbps GFSK signal3, 0.1% BER, T ≤ 85
°C
Level above which RFSENSE will trigger
4
Level below which RFSENSE will not trigger
Adjacent channel selectivity, Interferer is CW at ± 1 × channel-spacing
4
RFSENSE
RFSENSE
C/I
1
TRIG
THRES
CW at 315 MHz -28.1 dBm
CW at 315 MHz -50 dBm
Desired is 2.4 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Alternate channel selectivity, Interferer is CW at ± 2 × channel-spacing
C/I
2
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level2,
0.1% BER
Image rejection, Interferer is CW at image frequency
C/I
IMAGE
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
195 358 MHz
10 dBm
10 dBm
-123.2 -120.7 dBm
-111.4 -108.6 dBm
-98.8 -95.5 dBm
1
54.1 63.6 dB
2
49.9 dB
1
1
64.2 dB
2
56.2 dB
53 dB
2
51.4 dB
Blocking selectivity, 0.1% BER. Desired is 2.4 kbps
GFSK signal1 at 3 dB above sensitivity level
C/I
BLOCKER
Interferer CW at Desired ± 1 MHz 75 dB
Interferer CW at Desired ± 2 MHz 76.5 dB
Interferer CW at Desired ± 10
72.6 91.9 dB
MHz
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Upper limit of input power
RSSI
MAX
5 dBm range over which RSSI reso­lution is maintained
Lower limit of input power
RSSI
MIN
-98 dBm range over which RSSI reso­lution is maintained
RSSI resolution RSSI
Max spurious emissions dur-
SPUR ing active receive mode, per FCC Part 15.109(a)
RES
RX_FCC
Over RSSI
MIN
to RSSI
range 0.25 dBm
MAX
216-960 MHz -63 -57 dBm
Above 960MHz -53 -47 dBm
Note:
1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5 kHz.
2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100 kHz.
3. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 125 kHz, RX channel BW = 753.320 kHz.
4. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.11 Sub-GHz RF Transmitter Characteristics for 169 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 169 MHz.
Table 4.30. Sub-GHz RF Transmitter Characteristics for 169 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX Power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs
POUT
supply, peak to peak
Output power variation vs
POUT
temperature, peak to peak
Spurious emissions of har-
SPUR monics, Conducted meas­urement, External PA supply = 3.3 V, Test Frequency = 169 MHz
Spurious emissions out-of-
SPUR band, Conducted measure­ment, External PA supply =
3.3 V, Test Frequency = 169 MHz
MAX
MIN
STEP
VAR_V
VAR_T
HARM_ETSI
OOB_ETSI
169 170 MHz
External PA supply = 3.3 V 18.1 19.7 22.4 dBm
-42.6 dBm
output power > 0 dBm 0.5 dB
1.8 V < V
VREGVDD
< 3.3 V, Exter-
4.8 5.0 dB
nal PA supply = 3.3 V, T = 25 °C
-40 to +85 °C at 20 dBm 0.6 1.2 dB
Per ETSI EN 300-220, Section
-42 dBm
7.8.2.1 (47-74 MHz, 87.5-118 MHz, 174-230 MHz, and 470-862 MHz)
Per ETSI EN 300-220, Section
-38 dBm
7.8.2.1 (other frequencies below 1
2
GHz)
Per ETSI EN 300-220, Section
-36 dBm
7.8.2.1 (frequencies above 1
2
GHz)
Per ETSI EN 300-220, Section
-42 -36 dBm
7.8.2.1 (47-74 MHz, 87.5-118 MHz, 174-230 MHz, and 470-862 MHz)
Per ETSI EN 300-220, Section
-42 -36 dBm
7.8.2.1 (other frequencies below 1 GHz)
Per ETSI EN 300-220, Section
-36 -30 dBm
7.8.2.1 (frequencies above 1 GHz)
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov­ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
2. Typical value marginally passes specification. Additional margin can be obtained by increasing the order of the harmonic filter.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.10.12 Sub-GHz RF Receiver Characteristics for 169 MHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = External PA Supply. RFVDD and external PA supply paths filtered using ferrites. Crystal frequency = 38.4 MHz. RF center frequency 169 MHz.
Table 4.31. Sub-GHz RF Receiver Characteristics for 169 MHz Band
Parameter Symbol Test Condition Min Typ Max Unit
Tuning frequency range F
Max usable input level, 0.1% BER
Max usable input level, 0.1% BER
RANGE
SAT
SAT
2k4
38k4
Desired is reference 2.4 kbps GFSK signal
1
Desired is reference 38.4 kbps GFSK signal
2
Sensitivity SENS Desired is reference 2.4 kbps
GFSK signal1, 0.1% BER
Desired is reference 38.4 kbps GFSK signal2, 0.1% BER, T ≤ 85
°C
Desired is reference 500 kbps GFSK signal3, 0.1% BER, T ≤ 85
°C
Level above which RFSENSE will trigger
4
Level below which RFSENSE will not trigger
Adjacent channel selectivity, Interferer is CW at ± 1 x channel-spacing
4
RFSENSE
RFSENSE
C/I
1
TRIG
THRES
CW at 169 MHz -28.1 dBm
CW at 169 MHz -50 dBm
Desired is 2.4 kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Alternate channel selectivity, Interferer is CW at ± 2 x channel-spacing
C/I
2
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Image rejection, Interferer is CW at image frequency
C/I
IMAGE
Desired is 2.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
Desired is 38.4kbps GFSK signal at 3dB above sensitivity level,
0.1% BER
169 170 MHz
10 dBm
10 dBm
-124 dBm
-112.2 -108 dBm
-99.2 -96 dBm
1
1
1
64.8 dB
1
43.3 51.4 dB
67.4 dB
2
60.6 dB
47.1 dB
2
47.1 dB
Blocking selectivity, 0.1% BER. Desired is 2.4 kbps
GFSK signal1 at 3 dB above sensitivity level
C/I
BLOCKER
Interferer CW at Desired ± 1 MHz 73.4 dB
Interferer CW at Desired ± 2 MHz 75 dB
Interferer CW at Desired ± 10
80 90.1 dB
MHz
Upper limit of input power
RSSI
MAX
5 dBm range over which RSSI reso­lution is maintained
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Lower limit of input power
RSSI
MIN
-98 dBm range over which RSSI reso­lution is maintained
RSSI resolution RSSI
Max spurious emissions dur-
SPUR
ing active receive mode
RES
RX
Over RSSI
MIN
to RSSI
range 0.25 dBm
MAX
30 MHz to 1 GHz -63 -57 dBm
1 GHz to 12 GHz -53 -47 dBm
Note:
1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5 kHz.
2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100 kHz.
3. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 125 kHz, RX channel BW = 753.320 kHz.
4. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

4.1.11 Modem

Table 4.32. Modem
Parameter Symbol Test Condition Min Typ Max Unit
Receive bandwidth BW
IF frequency f
IF
DSSS symbol length SL
DSSS bits per symbol BPS
RX
DSSS
DSSS
Configurable range with 38.4 MHz
0.1 2530 kHz
crystal
Configurable range with 38.4 MHz
150 1371 kHz
crystal. Selected steps available.
Configurable in steps of 1 chip 2 32 chips
Configurable 1 4 bits/
symbol
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.12 Oscillators

4.1.12.1 Low-Frequency Crystal Oscillator (LFXO)
Table 4.33. Low-Frequency Crystal Oscillator (LFXO)
Parameter Symbol Test Condition Min Typ Max Unit
Crystal frequency f
Supported crystal equivalent
LFXO
ESR
LFXO
32.768 kHz
70 kΩ
series resistance (ESR)
Supported range of crystal load capacitance
1
On-chip tuning cap range
C
LFXO_CL
2
C
LFXO_T
On each of LFXTAL_N and
6 18 pF
8 40 pF
LFXTAL_P pins
On-chip tuning cap step size SS
Current consumption after startup
3
Start- up time t
I
LFXO
LFXO
LFXO
ESR = 70 kOhm, CL = 7 pF,
GAIN4 = 2, AGC4 = 1
ESR = 70 kOhm, CL = 7 pF,
0.25 pF
273 nA
308 ms
GAIN4 = 2
Note:
1. Total load capacitance as seen by the crystal.
2. The effective load capacitance seen by the crystal will be C
/2. This is because each XTAL pin has a tuning cap and the
LFXO_T
two caps will be seen in series by the crystal.
3. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.
4. In CMU_LFXOCTRL register.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.12.2 High-Frequency Crystal Oscillator (HFXO)
Table 4.34. High-Frequency Crystal Oscillator (HFXO)
Parameter Symbol Test Condition Min Typ Max Unit
Crystal frequency f
HFXO
38.4 MHz required for radio trans­ciever operation
Supported crystal equivalent
ESR
HFXO_38M4
Crystal frequency 38.4 MHz 60
series resistance (ESR)
Supported range of crystal load capacitance
1
On-chip tuning cap range
C
HFXO_CL
2
C
HFXO_T
On each of HFXTAL_N and HFXTAL_P pins
On-chip tuning capacitance
SS
HFXO
step
Startup time t
HFXO
38.4 MHz, ESR = 50 Ohm, CL = 10 pF
Frequency tolerance for the crystal
FT
HFXO
38.4 MHz, ESR = 50 Ohm, CL = 10 pF
Note:
1. Total load capacitance as seen by the crystal.
2. The effective load capacitance seen by the crystal will be C two caps will be seen in series by the crystal.
38 38.4 40 MHz
6 12 pF
9 20 25 pF
0.04 pF
300 µs
-40 40 ppm
/2. This is because each XTAL pin has a tuning cap and the
HFXO_T
4.1.12.3 Low-Frequency RC Oscillator (LFRCO)
Table 4.35. Low-Frequency RC Oscillator (LFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Oscillation frequency f
Startup time t
Current consumption
2
LFRCO
LFRCO
I
LFRCO
ENVREF1 = 1, T ≤ 85 °C
ENVREF1 = 1, T > 85 °C
ENVREF1 = 0, T ≤ 85 °C
ENVREF1 = 0, T > 85 °C
ENVREF = 1 in
31.3 32.768 33.6 kHz
31.6 32.768 36.8 kHz
31.3 32.768 33.4 kHz
30.0 32.768 33.4 kHz
500 µs
370 nA
CMU_LFRCOCTRL
ENVREF = 0 in
520 nA
CMU_LFRCOCTRL
Note:
1. In CMU_LFRCOCTRL register.
2. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.12.4 High-Frequency RC Oscillator (HFRCO)
Table 4.36. High-Frequency RC Oscillator (HFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Frequency accuracy f
Start-up time t
Current consumption on all supplies
HFRCO_ACC
HFRCO
I
HFRCO
At production calibrated frequen-
-2.5 2.5 % cies, across supply voltage and temperature
f
≥ 19 MHz 300 ns
HFRCO
4 < f
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
f
HFRCO
< 19 MHz 1 µs
HFRCO
≤ 4 MHz 2.5 µs
= 38 MHz 244 265 µA
= 32 MHz 204 222 µA
= 26 MHz 173 188 µA
= 19 MHz 143 156 µA
= 16 MHz 123 136 µA
= 13 MHz 110 124 µA
= 7 MHz 85 94 µA
= 4 MHz 32 37 µA
= 2 MHz 28 34 µA
= 1 MHz 26 31 µA
Coarse trim step size (% of period)
Fine trim step size (% of pe-
SS
E
SS
riod)
Period jitter PJ
HFRCO_COARS
HFRCO_FINE
HFRCO
0.8 %
0.1 %
0.2 % RMS
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
4.1.12.5 Auxiliary High-Frequency RC Oscillator (AUXHFRCO)
Table 4.37. Auxiliary High-Frequency RC Oscillator (AUXHFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Frequency accuracy f
Start-up time t
Current consumption on all supplies
AUXHFRCO_ACC
AUXHFRCO
I
AUXHFRCO
At production calibrated frequen­cies, across supply voltage and temperature
f
AUXHFRCO
4 < f
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
f
AUXHFRCO
≥ 19 MHz 400 ns
AUXHFRCO
< 19 MHz 1.4 µs
≤ 4 MHz 2.5 µs
= 38 MHz 193 213 µA
= 32 MHz 157 175 µA
= 26 MHz 135 151 µA
= 19 MHz 108 122 µA
= 16 MHz 100 113 µA
= 13 MHz 77 88 µA
= 7 MHz 53 63 µA
= 4 MHz 29 36 µA
= 2 MHz 28 34 µA
= 1 MHz 27 31 µA
-3 3 %
Coarse trim step size (% of period)
Fine trim step size (% of pe­riod)
Period jitter PJ
SS
AUXHFR-
CO_COARSE
SS
AUXHFR-
CO_FINE
AUXHFRCO
0.8 %
0.1 %
0.2 % RMS
4.1.12.6 Ultra-low Frequency RC Oscillator (ULFRCO)
Table 4.38. Ultra-low Frequency RC Oscillator (ULFRCO)
Parameter Symbol Test Condition Min Typ Max Unit
Oscillation frequency f
ULFRCO
0.95 1 1.07 kHz
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.13 Flash Memory Characteristics

1
Table 4.39. Flash Memory Characteristics
1
Parameter Symbol Test Condition Min Typ Max Unit
Flash erase cycles before
EC
FLASH
10000 cycles
failure
Flash data retention RET
FLASH
T ≤ 85 °C 10 years
T ≤ 125 °C 10 years
Word (32-bit) programming time
t
W_PROG
Burst write, 128 words, average time per word
20 24.4 30 µs
Single word 60 68.4 80 µs
Page erase time
Mass erase time
2
3
Device erase time4
5
t
PERASE
t
MERASE
t
DERASE
20 26.4 35 ms
20 26.5 35 ms
T ≤ 85 °C 82 100 ms
T ≤ 125 °C 82 110 ms
Erase current
Write current
6
6
I
ERASE
I
WRITE
Page Erase 1.6 mA
3.8 mA
Supply voltage during flash
V
FLASH
1.62 3.6 V
erase and write
Note:
1. Flash data retention information is published in the Quarterly Quality and Reliability Report.
2. From setting the ERASEPAGE bit in MSC_WRITECMD to 1 until the BUSY bit in MSC_STATUS is cleared to 0. Internal setup and hold times for flash control signals are included.
3. Mass erase is issued by the CPU and erases all flash.
4. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock Word (ULW).
5. From setting the DEVICEERASE bit in AAP_CMD to 1 until the ERASEBUSY bit in AAP_STATUS is cleared to 0. Internal setup and hold times for flash control signals are included.
6. Measured at 25 °C.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.14 General-Purpose I/O (GPIO)

Table 4.40. General-Purpose I/O (GPIO)
Parameter Symbol Test Condition Min Typ Max Unit
Input low voltage
Input high voltage
1
1
V
IL
V
IH
GPIO pins IOVDD*0.3 V
GPIO pins IOVDD*0.7 V
Output high voltage relative to IOVDD
Output low voltage relative to IOVDD
V
OH
Sourcing 3 mA, IOVDD ≥ 3 V,
IOVDD*0.8 V
DRIVESTRENGTH2 = WEAK
Sourcing 1.2 mA, IOVDD ≥ 1.62
IOVDD*0.6 V
V,
DRIVESTRENGTH2 = WEAK
Sourcing 20 mA, IOVDD ≥ 3 V,
IOVDD*0.8 V
DRIVESTRENGTH2 = STRONG
Sourcing 8 mA, IOVDD ≥ 1.62 V,
IOVDD*0.6 V
DRIVESTRENGTH2 = STRONG
V
OL
Sinking 3 mA, IOVDD ≥ 3 V,
IOVDD*0.2 V
DRIVESTRENGTH2 = WEAK
Sinking 1.2 mA, IOVDD ≥ 1.62 V,
IOVDD*0.4 V
DRIVESTRENGTH2 = WEAK
Sinking 20 mA, IOVDD ≥ 3 V,
IOVDD*0.2 V
DRIVESTRENGTH2 = STRONG
Sinking 8 mA, IOVDD ≥ 1.62 V,
IOVDD*0.4 V
DRIVESTRENGTH2 = STRONG
Input leakage current I
IOLEAK
All GPIO except LFXO pins, GPIO
0.1 30 nA
≤ IOVDD, T ≤ 85 °C
LFXO Pins, GPIO ≤ IOVDD, T ≤
0.1 50 nA
85 °C
All GPIO except LFXO pins, GPIO
110 nA
≤ IOVDD, T > 85 °C
LFXO Pins, GPIO ≤ IOVDD, T >
250 nA
85 °C
Input leakage current on
I
5VTOLLEAK
IOVDD < GPIO ≤ IOVDD + 2 V 3.3 15 µA
5VTOL pads above IOVDD
I/O pin pull-up/pull-down re-
3
sistor
Pulse width of pulses re-
R
PUD
t
IOGLITCH
30 40 65 kΩ
15 25 45 ns moved by the glitch suppres­sion filter
silabs.com | Building a more connected world. Rev. 1.6 | 83
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Output fall time, From 70% to 30% of V
IO
t
IOOF
CL = 50 pF,
1.8 ns
DRIVESTRENGTH2 = STRONG,
SLEWRATE2 = 0x6
CL = 50 pF,
4.5 ns
DRIVESTRENGTH2 = WEAK,
SLEWRATE2 = 0x6
Output rise time, From 30% to 70% of V
IO
t
IOOR
CL = 50 pF,
2.2 ns
DRIVESTRENGTH2 = STRONG,
SLEWRATE = 0x6
CL = 50 pF,
2
7.4 ns
DRIVESTRENGTH2 = WEAK,
SLEWRATE2 = 0x6
Note:
1. GPIO input threshold are proportional to the IOVDD supply, except for RESETn which is proportional to AVDD.
2. In GPIO_Pn_CTRL register.
3. GPIO pull-ups are referenced to the IOVDD supply, except for RESETn, which connects to AVDD.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.15 Voltage Monitor (VMON)

Table 4.41. Voltage Monitor (VMON)
Parameter Symbol Test Condition Min Typ Max Unit
Supply current (including I_SENSE)
Loading of monitored supply I
Threshold range V
I
VMON
SENSE
VMON_RANGE
In EM0 or EM1, 1 active channel,
6.3 10 µA
T ≤ 85 °C
In EM0 or EM1, 1 active channel,
14 µA
T > 85 °C
In EM0 or EM1, All channels ac-
12.5 17 µA
tive, T ≤ 85 °C
In EM0 or EM1, All channels ac-
21 µA
tive, T > 85 °C
In EM2, EM3 or EM4, 1 channel
62 nA
active and above threshold
In EM2, EM3 or EM4, 1 channel
62 nA
active and below threshold
In EM2, EM3 or EM4, All channels
99 nA
active and above threshold
In EM2, EM3 or EM4, All channels
99 nA
active and below threshold
In EM0 or EM1 2 µA
In EM2, EM3 or EM4 2 nA
1.62 3.4 V
Threshold step size N
Response time t
Hysteresis V
VMON_STESP
VMON_RES
VMON_HYST
Coarse 200 mV
Fine 20 mV
Supply drops at 1V/µs rate 460 ns
26 mV
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.16 Analog to Digital Converter (ADC)

Specified at 1 Msps, ADCCLK = 16 MHz, BIASPROG = 0, GPBIASACC = 0, unless otherwise indicated.
Table 4.42. Analog to Digital Converter (ADC)
Parameter Symbol Test Condition Min Typ Max Unit
Resolution V
Input voltage range
1
Input range of external refer­ence voltage, single ended and differential
Power supply rejection
2
Analog input common mode rejection ratio
Current from all supplies, us­ing internal reference buffer. Continuous operation. WAR-
MUPMODE3 = KEEPADC­WARM
Current from all supplies, us­ing internal reference buffer. Duty-cycled operation. WAR-
MUPMODE3 = NORMAL
RESOLUTION
V
ADCIN
V
ADCREFIN_P
PSRR
ADC
CMRR
ADC
I
ADC_CONTINU-
OUS_LP
I
ADC_NORMAL_LP
6 12 Bits
Single ended V
FS
V
Differential -VFS/2 VFS/2 V
1 V
AVDD
V
At DC 80 dB
At DC 80 dB
1 Msps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 1
4
250 ksps / 4 MHz ADCCLK, BIA­SPROG = 6, GPBIASACC = 1
4
62.5 ksps / 1 MHz ADCCLK, BIA­SPROG = 15, GPBIASACC = 1
35 ksps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 1
4
5 ksps / 16 MHz ADCCLK BIA­SPROG = 0, GPBIASACC = 1
4
4
270 315 µA
125 µA
80 µA
45 µA
8 µA
Current from all supplies, us­ing internal reference buffer. Duty-cycled operation.
AWARMUPMODE3 = KEEP­INSTANDBY or KEEPIN­SLOWACC
Current from all supplies, us­ing internal reference buffer. Continuous operation. WAR-
MUPMODE3 = KEEPADC­WARM
Current from all supplies, us­ing internal reference buffer. Duty-cycled operation. WAR-
MUPMODE3 = NORMAL
Current from all supplies, us­ing internal reference buffer. Duty-cycled operation.
AWARMUPMODE3 = KEEP­INSTANDBY or KEEPIN­SLOWACC
I
ADC_STAND-
BY_LP
I
ADC_CONTINU-
OUS_HP
I
ADC_NORMAL_HP
I
ADC_STAND-
BY_HP
125 ksps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 1
4
35 ksps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 1
4
1 Msps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 0
4
250 ksps / 4 MHz ADCCLK, BIA­SPROG = 6, GPBIASACC = 0
4
62.5 ksps / 1 MHz ADCCLK, BIA­SPROG = 15, GPBIASACC = 0
35 ksps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 0
4
5 ksps / 16 MHz ADCCLK BIA­SPROG = 0, GPBIASACC = 0
4
125 ksps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 0
4
35 ksps / 16 MHz ADCCLK, BIA­SPROG = 0, GPBIASACC = 0
4
105 µA
70 µA
325 µA
175 µA
125 µA
4
85 µA
16 µA
160 µA
125 µA
Current from HFPERCLK I
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ADC_CLK
HFPERCLK = 16 MHz 160 µA
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
ADC clock frequency f
Throughput rate f
Conversion time
5
Startup time of reference generator and ADC core
SNDR at 1Msps and fIN = 10kHz
Spurious-free dynamic range (SFDR)
Differential non-linearity (DNL)
ADCCLK
ADCRATE
t
ADCCONV
t
ADCSTART
SNDR
ADC
SFDR
ADC
DNL
ADC
16 MHz
1 Msps
6 bit 7 cycles
8 bit 9 cycles
12 bit 13 cycles
WARMUPMODE3 = NORMAL
WARMUPMODE3 = KEEPIN-
5 µs
2 µs
STANDBY
WARMUPMODE3 = KEEPINSLO-
1 µs
WACC
Internal reference6, differential
58 67 dB
measurement
External reference7, differential
68 dB
measurement
1 MSamples/s, 10 kHz full-scale
75 dB
sine wave
12 bit resolution, No missing co-
-1 2 LSB
des
Integral non-linearity (INL),
INL
ADC
12 bit resolution -6 6 LSB
End point method
Offset error V
Gain error in ADC V
ADCOFFSETERR
ADCGAIN
Using internal reference -0.2 3.5 %
-3 0 3 LSB
Using external reference -1 %
Temperature sensor slope V
TS_SLOPE
-1.84 mV/°C
Note:
1. The absolute voltage allowed at any ADC input is dictated by the power rail supplied to on-chip circuitry, and may be lower than the effective full scale voltage. All ADC inputs are limited to the ADC supply (AVDD or DVDD depending on EMU_PWRCTRL_ANASW). Any ADC input routed through the APORT will further be limited by the IOVDD supply to the pin.
2. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL.
3. In ADCn_CTRL register.
4. In ADCn_BIASPROG register.
5. Derived from ADCCLK.
6. Internal reference option used corresponds to selection 2V5 in the SINGLECTRL_REF or SCANCTRL_REF register field. The differential input range with this configuration is ± 1.25 V. Typical value is characterized using full-scale sine wave input. Minimum value is production-tested using sine wave input at 1.5 dB lower than full scale.
7. External reference is 1.25 V applied externally to ADCnEXTREFP, with the selection CONF in the SINGLECTRL_REF or SCANCTRL_REF register field and VREFP in the SINGLECTRLX_VREFSEL or SCANCTRLX_VREFSEL field. The differential input range with this configuration is ± 1.25 V.
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.17 Analog Comparator (ACMP)

Table 4.43. Analog Comparator (ACMP)
Parameter Symbol Test Condition Min Typ Max Unit
Input voltage range V
Supply voltage V
Active current not including voltage reference
3
Current consumption of inter­nal voltage reference
3
ACMPIN
ACMPVDD
I
ACMP
I
ACMPREF
ACMPVDD = ACMPn_CTRL_PWRSEL
1
BIASPROG2 ≤ 0x10 or FULL­BIAS2 = 0
0x10 < BIASPROG2 ≤ 0x20 and FULLBIAS2 = 1
BIASPROG2 = 1, FULLBIAS2 = 0
BIASPROG2 = 0x10, FULLBIAS
2
V
1.8 V
2.1 V
ACMPVDD
VREGVDD_
MAX
VREGVDD_
MAX
50 nA
306 nA
V
V
V
= 0
BIASPROG2 = 0x02, FULLBIAS
2
6.5 µA
= 1
BIASPROG2 = 0x20, FULLBIAS
2
75 92 µA
= 1
VLP selected as input using 2.5 V
50 nA
Reference / 4 (0.625 V)
VLP selected as input using VDD 20 nA
VBDIV selected as input using
4.1 µA
1.25 V reference / 1
VADIV selected as input using
2.4 µA
VDD/1
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Hysteresis (VCM = 1.25 V,
BIASPROG2 = 0x10, FULL­BIAS2 = 1)
V
ACMPHYST
HYSTSEL4 = HYST0
HYSTSEL4 = HYST1
HYSTSEL4 = HYST2
HYSTSEL4 = HYST3
HYSTSEL4 = HYST4
HYSTSEL4 = HYST5
HYSTSEL4 = HYST6
HYSTSEL4 = HYST7
HYSTSEL4 = HYST8
HYSTSEL4 = HYST9
HYSTSEL4 = HYST10
HYSTSEL4 = HYST11
HYSTSEL4 = HYST12
HYSTSEL4 = HYST13
HYSTSEL4 = HYST14
-3 0 3 mV
5 18 27 mV
12 33 50 mV
17 46 65 mV
23 57 82 mV
26 68 98 mV
30 79 130 mV
34 90 150 mV
-3 0 3 mV
-27 -18 -5 mV
-50 -33 -12 mV
-65 -45 -17 mV
-82 -57 -23 mV
-98 -67 -26 mV
-130 -78 -30 mV
Comparator delay
5
Offset voltage V
Reference voltage V
Capacitive sense internal re­sistance
t
ACMPDELAY
ACMPOFFSET
ACMPREF
R
CSRES
HYSTSEL4 = HYST15
BIASPROG2 = 1, FULLBIAS2 = 0
BIASPROG2 = 0x10, FULLBIAS
-150 -88 -34 mV
30 µs
2
3.7 µs
= 0
BIASPROG2 = 0x02, FULLBIAS
2
360 ns
= 1
BIASPROG2 = 0x20, FULLBIAS
2
35 ns
= 1
BIASPROG2 =0x10, FULLBIAS
2
-35 35 mV
= 1
Internal 1.25 V reference 1 1.25 1.47 V
Internal 2.5 V reference 2 2.5 2.8 V
CSRESSEL6 = 0
CSRESSEL6 = 1
CSRESSEL6 = 2
CSRESSEL6 = 3
CSRESSEL6 = 4
infinite kΩ
15 kΩ
27 kΩ
39 kΩ
51 kΩ
CSRESSEL6 = 5
CSRESSEL6 = 6
CSRESSEL6 = 7
silabs.com | Building a more connected world. Rev. 1.6 | 89
100 kΩ
162 kΩ
235 kΩ
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Note:
1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD.
2. In ACMPn_CTRL register.
3. The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference. I I
ACMPREF
.
4. In ACMPn_HYSTERESIS registers.
5. ± 100 mV differential drive.
6. In ACMPn_INPUTSEL register.
ACMPTOTAL
= I
ACMP
+
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.18 Digital to Analog Converter (VDAC)

DRIVESTRENGTH = 2 unless otherwise specified. Primary VDAC output.
Table 4.44. Digital to Analog Converter (VDAC)
Parameter Symbol Test Condition Min Typ Max Unit
Output voltage V
Current consumption includ­ing references (2 channels)
Current from HFPERCLK
3
2
I
DAC
I
DAC_CLK
Sample rate SR
DAC clock frequency f
Conversion time t
Settling time t
Startup time t
DAC
DACCONV
DACSETTLE
DACSTARTUP
Output impedance R
DACOUT
DAC
OUT
Single-Ended 0 V
Differential
1
500 ksps, 12-bit, DRIVES-
-V
VREF
V
396 µA
VREF
VREF
TRENGTH = 2, REFSEL = 4
44.1 ksps, 12-bit, DRIVES-
72 µA
TRENGTH = 1, REFSEL = 4
200 Hz refresh rate, 12-bit Sam-
1.2 µA ple-Off mode in EM2, DRIVES­TRENGTH = 2, REFSEL = 4, SETTLETIME = 0x02, WARMUP­TIME = 0x0A
5.8 µA/MHz
500 ksps
1 MHz
f
= 1MHz 2 µs
DAC
50% fs step settling to 5 LSB 2.5 µs
Enable to 90% fs output, settling
12 µs to 10 LSB
DRIVESTRENGTH = 2, 0.4 V ≤ V
≤ V
OUT
I
< 8 mA, Full supply range
OUT
- 0.4 V, -8 mA <
OPA
2
V
V
Power supply rejection ratio
DRIVESTRENGTH = 0 or 1, 0.4 V ≤ V
≤ V
OUT
I
< 400 µA, Full supply range
OUT
- 0.4 V, -400 µA <
OPA
DRIVESTRENGTH = 2, 0.1 V ≤ V
≤ V
OUT
I
< 2 mA, Full supply range
OUT
- 0.1 V, -2 mA <
OPA
DRIVESTRENGTH = 0 or 1, 0.1 V ≤ V
≤ V
OUT
I
< 100 µA, Full supply range
OUT
4
PSRR Vout = 50% fs. DC 65.5 dB
- 0.1 V, -100 µA <
OPA
2
2
2
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EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Signal to noise and distortion ratio (1 kHz sine wave), Noise band limited to 250 kHz
Signal to noise and distortion ratio (1 kHz sine wave), Noise band limited to 22 kHz
SNDR
SNDR
DAC
DAC_BAND
500 ksps, single-ended, internal
1.25V reference
500 ksps, single-ended, internal
2.5V reference
500 ksps, single-ended, 3.3V VDD reference
500 ksps, differential, internal
1.25V reference
500 ksps, differential, internal
2.5V reference
500 ksps, differential, 3.3V VDD reference
500 ksps, single-ended, internal
1.25V reference
500 ksps, single-ended, internal
2.5V reference
500 ksps, single-ended, 3.3V VDD reference
500 ksps, differential, internal
1.25V reference
60.4 dB
61.6 dB
64.0 dB
63.3 dB
64.4 dB
65.8 dB
65.3 dB
66.7 dB
70.0 dB
67.8 dB
500 ksps, differential, internal
69.0 dB
2.5V reference
500 ksps, differential, 3.3V VDD
68.5 dB reference
Total harmonic distortion THD 70.2 dB
5
Differential non-linearity
DNL
Intergral non-linearity INL
Offset error
6
V
OFFSET
DAC
DAC
T = 25 °C -8 8 mV
Across operating temperature
-0.99 1 LSB
-4 4 LSB
-25 25 mV
range
Gain error
6
V
GAIN
T = 25 °C, Low-noise internal ref-
-2.5 2.5 % erence (REFSEL = 1V25LN or 2V5LN)
T = 25 °C, Internal reference (RE-
-5 5 %
FSEL = 1V25 or 2V5)
T = 25 °C, External reference
-1.8 1.8 % (REFSEL = VDD or EXT)
Across operating temperature
-3.5 3.5 % range, Low-noise internal refer­ence (REFSEL = 1V25LN or 2V5LN)
Across operating temperature
-7.5 7.5 % range, Internal reference (RE­FSEL = 1V25 or 2V5)
Across operating temperature
-2.0 2.0 % range, External reference (RE­FSEL = VDD or EXT)
silabs.com | Building a more connected world. Rev. 1.6 | 92
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
External load capactiance,
C
LOAD
75 pF
OUTSCALE=0
Note:
1. In differential mode, the output is defined as the difference between two single-ended outputs. Absolute voltage on each output is limited to the single-ended range.
2. Supply current specifications are for VDAC circuitry operating with static output only and do not include current required to drive the load.
3. Current from HFPERCLK is dependent on HFPERCLK frequency. This current contributes to the total supply current used when the clock to the DAC peripheral is enabled in the CMU.
4. PSRR calculated as 20 * log10(ΔVDD / ΔV
), VDAC output at 90% of full scale
OUT
5. Entire range is monotonic and has no missing codes.
6. Gain is calculated by measuring the slope from 10% to 90% of full scale. Offset is calculated by comparing actual VDAC output at 10% of full scale to ideal VDAC output at 10% of full scale with the measured gain.
silabs.com | Building a more connected world. Rev. 1.6 | 93
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.19 Current Digital to Analog Converter (IDAC)

Table 4.45. Current Digital to Analog Converter (IDAC)
Parameter Symbol Test Condition Min Typ Max Unit
Number of ranges N
Output current I
Linear steps within each
IDAC_OUT
N
range
Step size SS
Total accuracy, STEPSEL1 =
ACC
0x10
IDAC_RANGES
IDAC_STEPS
IDAC
IDAC
RANGESEL1 = RANGE0
RANGESEL1 = RANGE1
RANGESEL1 = RANGE2
RANGESEL1 = RANGE3
RANGESEL1 = RANGE0
RANGESEL1 = RANGE1
RANGESEL1 = RANGE2
RANGESEL1 = RANGE3
EM0 or EM1, AVDD=3.3 V, T = 25 °C
EM0 or EM1, Across operating temperature range
EM2 or EM3, Source mode, RAN­GESEL1 = RANGE0, AVDD=3.3
V, T = 25 °C
4 ranges
0.05 1.6 µA
1.6 4.7 µA
0.5 16 µA
2 64 µA
32 steps
50 nA
100 nA
500 nA
2 µA
-3 3 %
-18 22 %
-2 %
EM2 or EM3, Source mode, RAN­GESEL1 = RANGE1, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Source mode, RAN­GESEL1 = RANGE2, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Source mode, RAN­GESEL1 = RANGE3, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN­GESEL1 = RANGE0, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN­GESEL1 = RANGE1, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN­GESEL1 = RANGE2, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN­GESEL1 = RANGE3, AVDD=3.3
V, T = 25 °C
-1.7 %
-0.8 %
-0.5 %
-0.7 %
-0.6 %
-0.5 %
-0.5 %
Start up time t
IDAC_SU
Output within 1% of steady state
5 µs
value
silabs.com | Building a more connected world. Rev. 1.6 | 94
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Settling time, (output settled within 1% of steady state val­ue),
Current consumption
2
Output voltage compliance in source mode, source current change relative to current sourced at 0 V
t
IDAC_SETTLE
I
IDAC
I
COMP_SRC
Range setting is changed 5 µs
Step value is changed 1 µs
EM0 or EM1 Source mode, ex-
11 18 µA cluding output current, Across op­erating temperature range
EM0 or EM1 Sink mode, exclud-
13 21 µA ing output current, Across operat­ing temperature range
EM2 or EM3 Source mode, ex-
0.023 µA cluding output current, T = 25 °C
EM2 or EM3 Sink mode, exclud-
0.041 µA ing output current, T = 25 °C
EM2 or EM3 Source mode, ex-
11 µA cluding output current, T ≥ 85 °C
EM2 or EM3 Sink mode, exclud-
13 µA ing output current, T ≥ 85 °C
RANGESEL1 = RANGE0, output voltage = min(V
2
V
-100 mV)
AVDD
IOVDD
,
RANGESEL1 = RANGE1, output voltage = min(V
2
V
-100 mV)
AVDD
IOVDD
,
0.11 %
0.06 %
0.04 %
0.03 %
0.12 %
Output voltage compliance in sink mode, sink current
I
COMP_SINK
RANGESEL1 = RANGE2, output voltage = min(V
2
V
-150 mV)
AVDD
IOVDD
,
RANGESEL1 = RANGE3, output voltage = min(V
2
V
-250 mV)
AVDD
IOVDD
,
RANGESEL1 = RANGE0, output voltage = 100 mV
change relative to current sunk at IOVDD
RANGESEL1 = RANGE1, output
0.05 % voltage = 100 mV
RANGESEL1 = RANGE2, output
0.04 % voltage = 150 mV
RANGESEL1 = RANGE3, output
0.03 % voltage = 250 mV
Note:
1. In IDAC_CURPROG register.
2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be­tween AVDD (0) and DVDD (1).
silabs.com | Building a more connected world. Rev. 1.6 | 95
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.20 Capacitive Sense (CSEN)

Table 4.46. Capacitive Sense (CSEN)
Parameter Symbol Test Condition Min Typ Max Unit
Single conversion time (1x accumulation)
Maximum external capacitive load
Maximum external series im­pedance
Supply current, EM2 bonded conversions, WARMUP­MODE=NORMAL, WAR­MUPCNT=0
t
CNV
C
EXTMAX
R
EXTMAX
I
CSEN_BOND
12-bit SAR Conversions 20.2 µs
16-bit SAR Conversions 26.4 µs
Delta Modulation Conversion (sin-
1.55 µs
gle comparison)
IREFPROG=7 (Gain = 1x), includ-
68 pF
ing routing parasitics
IREFPROG=0 (Gain = 10x), in-
680 pF
cluding routing parasitics
1 kΩ
12-bit SAR conversions, 20 ms
326 nA conversion rate, IREFPROG=7 (Gain = 1x), 10 channels bonded
(total capacitance of 330 pF)
Delta Modulation conversions, 20
1
226 nA ms conversion rate, IRE­FPROG=7 (Gain = 1x), 10 chan­nels bonded (total capacitance of
330 pF)
12-bit SAR conversions, 200 ms
1
33 nA conversion rate, IREFPROG=7 (Gain = 1x), 10 channels bonded
(total capacitance of 330 pF)
1
Supply current, EM2 scan conversions, WARMUP­MODE=NORMAL, WAR­MUPCNT=0
I
CSEN_EM2
Delta Modulation conversions, 200 ms conversion rate, IRE­FPROG=7 (Gain = 1x), 10 chan­nels bonded (total capacitance of
330 pF)
1
12-bit SAR conversions, 20 ms scan rate, IREFPROG=0 (Gain =
10x), 8 samples per scan
1
Delta Modulation conversions, 20 ms scan rate, 8 comparisons per sample (DMCR = 1, DMR = 2), IREFPROG=0 (Gain = 10x), 8
samples per scan
1
12-bit SAR conversions, 200 ms scan rate, IREFPROG=0 (Gain =
10x), 8 samples per scan
1
Delta Modulation conversions, 200 ms scan rate, 8 comparisons per sample (DMCR = 1, DMR =
2), IREFPROG=0 (Gain = 10x), 8 samples per scan
1
25 nA
690 nA
515 nA
79 nA
57 nA
silabs.com | Building a more connected world. Rev. 1.6 | 96
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Supply current, continuous conversions, WARMUP­MODE=KEEPCSENWARM
I
CSEN_ACTIVE
SAR or Delta Modulation conver­sions of 33 pF capacitor, IRE­FPROG=0 (Gain = 10x), always
90.5 µA
on
HFPERCLK supply current I
CSEN_HFPERCLK
Current contribution from
2.25 µA/MHz HFPERCLK when clock to CSEN block is enabled.
Note:
1. Current is specified with a total external capacitance of 33 pF per channel. Average current is dependent on how long the periph­eral is actively sampling channels within the scan period, and scales with the number of samples acquired. Supply current for a specific application can be estimated by multiplying the current per sample by the total number of samples per period (total_cur­rent = single_sample_current * (number_of_channels * accumulation)).
silabs.com | Building a more connected world. Rev. 1.6 | 97
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications

4.1.21 Operational Amplifier (OPAMP)

Unless otherwise indicated, specified conditions are: Non-inverting input configuration, VDD = 3.3 V, DRIVESTRENGTH = 2, MAIN­OUTEN = 1, C
specified in table footnotes1 2.
Parameter Symbol Test Condition Min Typ Max Unit
= 75 pF with OUTSCALE = 0, or C
LOAD
= 37.5 pF with OUTSCALE = 1. Unit gain buffer and 3X-gain connection as
LOAD
Table 4.47. Operational Amplifier (OPAMP)
Supply voltage (from AVDD) V
Input voltage V
Input impedance R
Output voltage V
Load capacitance
3
Output impedance R
C
OPA
IN
IN
OUT
LOAD
OUT
HCMDIS = 0, Rail-to-rail input
2 3.8 V
range
HCMDIS = 1 1.62 3.8 V
HCMDIS = 0, Rail-to-rail input
V
VSS
V
OPA
V
range
HCMDIS = 1 V
VSS
V
-1.2 V
OPA
100 MΩ
V
VSS
V
OPA
V
OUTSCALE = 0 75 pF
OUTSCALE = 1 37.5 pF
DRIVESTRENGTH = 2 or 3, 0.4 V ≤ V
≤ V
OUT
I
< 8 mA, Buffer connection,
OUT
- 0.4 V, -8 mA <
OPA
0.25
Full supply range
DRIVESTRENGTH = 0 or 1, 0.4 V ≤ V
≤ V
OUT
I
< 400 µA, Buffer connection,
OUT
- 0.4 V, -400 µA <
OPA
0.6
Full supply range
DRIVESTRENGTH = 2 or 3, 0.1 V ≤ V
≤ V
OUT
I
< 2 mA, Buffer connection,
OUT
- 0.1 V, -2 mA <
OPA
0.4
Full supply range
DRIVESTRENGTH = 0 or 1, 0.1 V ≤ V
≤ V
OUT
I
< 100 µA, Buffer connection,
OUT
- 0.1 V, -100 µA <
OPA
1
Full supply range
Internal closed-loop gain G
CL
Buffer connection 0.99 1 1.01 -
3x Gain connection 2.93 2.99 3.05 -
16x Gain connection 15.07 15.7 16.33 -
Active current
4
I
OPA
DRIVESTRENGTH = 3, OUT-
580 µA
SCALE = 0
DRIVESTRENGTH = 2, OUT-
176 µA
SCALE = 0
DRIVESTRENGTH = 1, OUT-
13 µA
SCALE = 0
DRIVESTRENGTH = 0, OUT-
4.7 µA
SCALE = 0
silabs.com | Building a more connected world. Rev. 1.6 | 98
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Open-loop gain G
Loop unit-gain frequency
5
OL
DRIVESTRENGTH = 3 135 dB
DRIVESTRENGTH = 2 137 dB
DRIVESTRENGTH = 1 121 dB
DRIVESTRENGTH = 0 109 dB
UGF DRIVESTRENGTH = 3, Buffer
connection
DRIVESTRENGTH = 2, Buffer connection
DRIVESTRENGTH = 1, Buffer connection
DRIVESTRENGTH = 0, Buffer connection
DRIVESTRENGTH = 3, 3x Gain connection
DRIVESTRENGTH = 2, 3x Gain connection
DRIVESTRENGTH = 1, 3x Gain connection
DRIVESTRENGTH = 0, 3x Gain connection
3.38 MHz
0.9 MHz
132 kHz
34 kHz
2.57 MHz
0.71 MHz
113 kHz
28 kHz
Phase margin PM DRIVESTRENGTH = 3, Buffer
connection
DRIVESTRENGTH = 2, Buffer connection
DRIVESTRENGTH = 1, Buffer connection
DRIVESTRENGTH = 0, Buffer connection
Output voltage noise N
OUT
DRIVESTRENGTH = 3, Buffer connection, 10 Hz - 10 MHz
DRIVESTRENGTH = 2, Buffer connection, 10 Hz - 10 MHz
DRIVESTRENGTH = 1, Buffer connection, 10 Hz - 1 MHz
DRIVESTRENGTH = 0, Buffer connection, 10 Hz - 1 MHz
DRIVESTRENGTH = 3, 3x Gain connection, 10 Hz - 10 MHz
DRIVESTRENGTH = 2, 3x Gain connection, 10 Hz - 10 MHz
67 °
69 °
63 °
68 °
146 µVrms
163 µVrms
170 µVrms
176 µVrms
313 µVrms
271 µVrms
DRIVESTRENGTH = 1, 3x Gain
247 µVrms
connection, 10 Hz - 1 MHz
DRIVESTRENGTH = 0, 3x Gain
245 µVrms
connection, 10 Hz - 1 MHz
silabs.com | Building a more connected world. Rev. 1.6 | 99
EFR32FG12 Gecko Proprietary Protocol SoC Family Data Sheet
Electrical Specifications
Parameter Symbol Test Condition Min Typ Max Unit
Slew rate
6
SR DRIVESTRENGTH = 3,
INCBW=1
7
4.7 V/µs
Startup time
8
Input offset voltage V
T
START
OSI
DRIVESTRENGTH = 3,
1.5 V/µs
INCBW=0
DRIVESTRENGTH = 2, INCBW=1
7
DRIVESTRENGTH = 2,
1.27 V/µs
0.42 V/µs
INCBW=0
DRIVESTRENGTH = 1, INCBW=1
7
DRIVESTRENGTH = 1,
0.17 V/µs
0.058 V/µs
INCBW=0
DRIVESTRENGTH = 0, INCBW=1
7
DRIVESTRENGTH = 0,
0.044 V/µs
0.015 V/µs
INCBW=0
DRIVESTRENGTH = 2 12 µs
DRIVESTRENGTH = 2 or 3, T =
-2 2 mV
25 °C
DRIVESTRENGTH = 1 or 0, T =
-2 2 mV
25 °C
DRIVESTRENGTH = 2 or 3,
-12 12 mV across operating temperature range
DC power supply rejection
9
ratio
DC common-mode rejection
9
ratio
PSRR
CMRR
Total harmonic distortion THD
DC
OPA
DC
DRIVESTRENGTH = 1 or 0,
-30 30 mV across operating temperature range
Input referred 70 dB
Input referred 70 dB
DRIVESTRENGTH = 2, 3x Gain connection, 1 kHz, V
to V
OPA
- 0.1 V
OUT
= 0.1 V
DRIVESTRENGTH = 0, 3x Gain connection, 0.1 kHz, V
to V
OPA
- 0.1 V
OUT
= 0.1 V
90 dB
90 dB
silabs.com | Building a more connected world. Rev. 1.6 | 100
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