Table 14.2. Minimum SDA Setup and Hold Times ................................................ 141
Table 14.3. Sources for Hardware Changes to SMB0CN ..................................... 145
Table 14.4. SMBus Status Decoding ..................................................................... 151
15.UART0
Table 15.1. Timer Settings for Standard Baud Rates Using the Internal Oscillator 160
Table 15.2. Timer Settings for Standard Baud Rates Using an External
•16 kB (C8051F310/1) or 8 kB (C8051F312/3/4/5) of on-chip Flash memory
•1280 bytes of on-chip RAM
•SMBus/I2C, Enhanced UART, and Enhanced SPI serial interfaces implemented in hardware
•Four general-purpose 16-bit timers
•Programmable Counter/Timer Array (PCA) with five capture/compare modules and Watchdog Timer
function
•On-chip Power-On Reset, VDD Monitor, and Temperature Sensor
•On-chip Voltage Comparators (2)
•29/25 Port I/O (5 V tolerant)
With on-chip Power-On Reset, VDD monitor, Watchdog Timer, and clock oscillator, the C8051F31x devices
are truly stand-alone System-on-a-Chip solutions. The Flash memory can be reprogrammed even in-cir
cuit, providing non-volatile data storage, and also allowing field upgrades of the 8051 firmware. User software has complete control of all peripherals, and may individually shut down any or all peripherals for
power savings.
Tab le 1.1 for specific product feature selection.
-
The on-chip Silicon Labs 2-Wire (C2) Development Interface allows non-intrusive (uses no on-chip
resources), full speed, in-circuit debugging using the production MCU installed in the final application. This
debug logic supports inspection and modification of memory and registers, setting breakpoints, single
stepping, run and halt commands. All analog and digital peripherals are fully functional while debugging
using C2. The two C2 interface pins can be shared with user functions, allowing in-system programming
and debugging without occupying package pins.
Each device is specified for 2.7-to-3.6 V operation over the industrial temperature range (–45 to +85 °C).
The Port I/O and
LQFP or a 28-pin MLP package.
RST pins are tolerant of input signals up to 5 V. The C8051F31x are available in a 32-pin
The C8051F31x family utilizes Silicon Labs' proprietary CIP-51 microcontroller core. The CIP-51 is fully
compatible with the MCS-51™ instruction set; standard 803x/805x assemblers and compilers can be used
to develop software. The CIP-51 core offers all the peripherals included with a standard 8052, including
four 16-bit counter/timers, a full-duplex UART with extended baud rate configuration, an enhanced SPI
port, 1280
pins.
1.1.2. Improved Throughput
The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system
clock cycles to execute with a maximum system clock of 12-to-24
cutes 70% of its instructions in one or two system clock cycles, with only four instructions taking more than
four system clock cycles.
The CIP-51 has a total of 109 instructions. The table below shows the total number of instructions that
require each execution time.
bytes of internal RAM, 128 byte Special Function Register (SFR) address space, and 29/25 I/O
MHz. By contrast, the CIP-51 core exe-
Clocks to Execute122/333/444/558
Number of Instructions265051473121
With the CIP-51's maximum system clock at 25 MHz, it has a peak throughput of 25 MIPS. Figure 1.7
shows a comparison of peak throughputs for various 8-bit microcontroller cores with their maximum system clocks.
25
20
15
MIPS
10
5
Silicon Labs
CIP-51
(25 MHz clk)
Microchip
PIC17C75x
(33 MHz clk)
Philips
80C51
(33 MHz clk)
ADuC812
8051
(16 MHz clk)
Figure 1.7. Comparison of Peak MCU Execution Speeds
Rev. 1.525
C8051F310/1/2/3/4/5
1.1.3. Additional Features
The C8051F31x SoC family includes several key enhancements to the CIP-51 core and peripherals to
improve performance and ease of use in end applications.
The extended interrupt handler provides 14 interrupt sources into the CIP-51 (as opposed to 7 for the standard 8051), allowing numerous analog and digital peripherals to interrupt the controller. An interrupt driven
system requires less intervention by the MCU, giving it more effective throughput. The extra interrupt
sources are very useful when building multi-tasking, real-time systems.
Eight reset sources are available: power-on reset circuitry (POR), an on-chip VDD monitor (forces reset
when power supply voltage drops below V
Missing Clock Detector, a voltage level detection from Comparator0, a forced software reset, an external
reset pin, and an errant Flash read/write protection circuit. Each reset source except for the POR, Reset
Input Pin, or Flash error may be disabled by the user in software. The WDT may be permanently enabled
in software after a power-on reset during MCU initialization.
The internal oscillator is factory calibrated to 24.5 MHz ±2%. An external oscillator drive circuit is also
included, allowing an external crystal, ceramic resonator, capacitor, RC, or CMOS clock source to generate
the system clock. If desired, the system clock source may be switched on-the-fly between the internal and
external oscillator circuits. An external oscillator can be extremely useful in low power applications, allow
ing the MCU to run from a slow (power saving) external crystal source, while periodically switching to the
fast internal oscillator as needed.
as given in Ta bl e 9.1 on page 102), a Watchdog Timer, a
RST
-
XTAL1
XTAL2
Internal
Oscillator
External
Oscillator
Drive
Px.x
Px.x
VDD
Supply
Monitor
Comparator 0
+
-
System
Clock
Clock Select
C0RSEF
Missing
Clock
Detector
(one-
shot)
EN
MCD
Enable
CIP-51
Microcontroller
PCA
WDT
EN
WDT
Enable
+
-
System Reset
Enable
(Software Reset)
SWRSF
'0'
Core
Extended Interrupt
Handler
Figure 1.8. On-Chip Clock and Reset
Power On
Reset
Operation
Errant
FLASH
(wired-OR)
Reset
Funnel
/RST
26Rev. 1.5
C8051F310/1/2/3/4/5
1.2.On-Chip Memory
The CIP-51 has a standard 8051 program and data address configuration. It includes 256 bytes of data
RAM, with the upper 128 bytes dual-mapped. Indirect addressing accesses the upper 128 bytes of general
purpose RAM, and direct addressing accesses the 128 byte SFR address space. The lower 128 bytes of
RAM are accessible via direct and indirect addressing. The first 32 bytes are addressable as four banks of
general purpose registers, and the next 16 bytes can be byte addressable or bit addressable.
Program memory consists of 8 or 16 kB of Flash. This memory may be reprogrammed in-system in 512
byte sectors, and requires no special off-chip programming voltage. See
memory map.
Figure 1.9 for the MCU system
PROGRAM/DATA MEMORY
(Flash)
C8051F310/1
0x3E00
0x3DFF
0x0000
0x2000
0x1FFF
RESERVED
16 kB Flash
(In-System
Programmable in 512
Byte Sectors)
C8051F312/3/4/5
RESERVED
0xFF
0x80
0x7F
0x30
0x2F
0x20
0x1F
0x00
0xFFFF
DATA MEMORY (RAM)
INTERNAL DATA ADDRESS SPACE
Upper 128 RAM
(Indirect Addressing
Only)
(Direct and Indirect
Addressing)
Bit Addressable
General Purpose
Registers
Special Function
Register's
(Direct Addressing Only)
Lower 128 RAM
(Direct and Indirect
Addressing)
EXTERNAL DATA ADDRESS SPACE
Same 1024 bytes as from
0x0000 to 0x03FF, wrapped
on 1 kB boundaries
0x0000
8 kB Flash
(In-System
Programmable in 512
Byte Sectors)
Figure 1.9. On-Board Memory Map
0x0400
0x03FF
0x0000
XRAM - 1024 Bytes
(accessable using MOVX
instruction)
Rev. 1.527
C8051F310/1/2/3/4/5
1.3.On-Chip Debug Circuitry
The C8051F31x devices include on-chip Silicon Labs 2-Wire (C2) debug circuitry that provides non-intrusive, full speed, in-circuit debugging of the production part installed in the end application.
Silicon Labs' debugging system supports inspection and modification of memory and registers, breakpoints, and single stepping. No additional target RAM, program memory, timers, or communications channels are required. All the digital and analog peripherals are functional and work correctly while debugging.
All the peripherals (except for the ADC and SMBus) are stalled when the MCU is halted, during single
stepping, or at a breakpoint in order to keep them synchronized.
The C8051F310DK development kit provides all the hardware and software necessary to develop application code and perform in-circuit debugging with the C8051F31x MCUs. The kit includes software with a
developer's studio and debugger, an integrated 8051 assembler, a serial adapter, a target application
board with the associated MCU installed, and the required cables and wall-mount power supply. The Serial
Adapter takes its power from the application board. For applications where there is not sufficient power
available from the target board, the provided power supply can be connected directly to the Serial Adapter.
The Silicon Labs IDE interface is a vastly superior developing and debugging configuration, compared to
standard MCU emulators that use on-board "ICE Chips" and require the MCU in the application board to
be socketed. Silicon Labs' debug paradigm increases ease of use and preserves the performance of the
precision analog peripherals.
Silicon Laboratories Integrated
Development Environment
WINDOWS 95 or later
Serial
Adapter
C2 (x2), VDD, GND
VDD GND
C8051F31x
TARGET PCB
Figure 1.10. Development/In-System Debug Diagram
28Rev. 1.5
C8051F310/1/2/3/4/5
1.4.Programmable Digital I/O and Crossbar
C8051F310/2/4 devices include 29 I/O pins (three byte-wide Ports and one 5-bit-wide Port);
C8051F311/3/5 devices include 25 I/O pins (three byte-wide Ports and one 1-bit-wide Port). The
C8051F31x Ports behave like typical 8051 Ports with a few enhancements. Each Port pin may be config
ured as an analog input or a digital I/O pin. Pins selected as digital I/Os may additionally be configured for
push-pull or open-drain output. The “weak pullups” that are fixed on typical 8051 devices may be globally
disabled, providing power savings capabilities.
The Digital Crossbar allows mapping of internal digital system resources to Port I/O pins (See Figure 1.11).
On-chip counter/timers, serial buses, HW interrupts, comparator output, and other digital signals in the
controller can be configured to appear on the Port I/O pins specified in the Crossbar Control registers. This
allows the user to select the exact mix of general purpose Port I/O and digital resources needed for the
particular application.
-
Highest
Priority
Lowest
Priority
XBR0, XBR1,
PnSKIP Registers
PnMDOUT,
PnMDIN Registers
Priority
Decoder
UART
SPI
SMBus
CP0
Outputs
CP1
Outputs
SYSCLK
(Internal Digital Signals)
PCA
T0, T1
P0
(P0.0-P0.7)
P1
(P1.0-P1.7)
P2
P3
(P2.0-P2.3)
(P2.4-P2.7)
(P3.0-P3.4)
(Port Latches)
2
4
2
2
2
6
2
8
8
4
4
5
Digital
Crossbar
8
8
4
P0
I/O
Cells
P1
I/O
Cells
P2
84
I/O
Cells
P3
5
I/O
Cells
Note: P3.1-P3.4 only available
on the C8051F310/2/4
P0.0
P0.7
P1.0
P1.7
P2.0
P2.7
P3.0
P3.4
Figure 1.11. Digital Crossbar Diagram
Rev. 1.529
C8051F310/1/2/3/4/5
1.5.Serial Ports
The C8051F31x Family includes an SMBus/I2C interface, a full-duplex UART with enhanced baud rate
configuration, and an Enhanced SPI interface. Each of the serial buses is fully implemented in hardware
and makes extensive use of the CIP-51's interrupts, thus requiring very little CPU intervention.
1.6.Programmable Counter Array
An on-chip Programmable Counter/Timer Array (PCA) is included in addition to the four 16-bit general purpose counter/timers. The PCA consists of a dedicated 16-bit counter/timer time base with five programmable capture/compare modules. The PCA clock is derived from one of six sources: the system clock divided
by 12, the system clock divided by 4, Timer 0 overflows, an External Clock Input (ECI), the system clock, or
the external oscillator clock source divided by 8. The external clock source selection is useful for real-time
clock functionality, where the PCA is clocked by an external source while the internal oscillator drives the
system clock.
Each capture/compare module can be configured to operate in one of six modes: Edge-Triggered Capture,
Software Timer, High Speed Output, 8- or 16-bit Pulse Width Modulator, or Frequency Output. Additionally,
Capture/Compare Module 4 offers watchdog timer (WDT) capabilities. Following a system reset, Module 4
is configured and enabled in WDT mode. The PCA Capture/Compare Module I/O and External Clock Input
may be routed to Port I/O via the Digital Crossbar.
SYSCLK/12
SYSCLK/4
Timer 0 Overflow
ECI
SYSCLK
External Clock/8
Capture/Compare
Module 0
ECI
CEX0
PCA
CLOCK
MUX
Capture/Compare
Module 1
CEX1
16-Bit Counter/Timer
Capture/Compare
Module 2
CEX2
Capture/Compare
Module 3
CEX3
Capture/Compare
Module 4 / WDT
CEX4
Crossbar
Port I/O
Figure 1.12. PCA Block Diagram
30Rev. 1.5
C8051F310/1/2/3/4/5
1.7.10-Bit Analog to Digital Converter
The C8051F310/1/2/3 devices include an on-chip 10-bit SAR ADC with a 25-channel differential input multiplexer. With a maximum throughput of 200 ksps, the ADC offers true 10-bit accuracy with an INL of
±1LSB. The ADC system includes a configurable analog multiplexer that selects both positive and nega
tive ADC inputs. Ports1-3 are available as an ADC inputs; additionally, the on-chip Temperature Sensor
output and the power supply voltage (V
) are available as ADC inputs. User firmware may shut down the
DD
ADC to save power.
Conversions can be started in six ways: a software command, an overflow of Timer 0, 1, 2, or 3, or an
external convert start signal. This flexibility allows the start of conversion to be triggered by software
events, a periodic signal (timer overflows), or external HW signals. Conversion completions are indicated
by a status bit and an interrupt (if enabled). The resulting 10-bit data word is latched into the ADC data
SFRs upon completion of a conversion.
Window compare registers for the ADC data can be configured to interrupt the controller when ADC data is
either within or outside of a specified range. The ADC can monitor a key voltage continuously in back
ground mode, but not interrupt the controller unless the converted data is within/outside the specified
range.
-
-
P3.1-3.4
available on
C8051F310/2
Temp
Sensor
P3.1-3.4
available on
C8051F310/2
Analog Multiplexer
P1.0
P1.7
P2.0
P2.7
P3.0
P3.4
VDD
P1.0
P1.7
P2.0
P2.7
P3.0
P3.4
GND
23-to-1
AMUX
22-to-1
AMUX
Configuration, Control, and Data Registers
(+)
10-Bit
SAR
(-)
ADC
End of
Conversion
Interrupt
Start
Conversion
16
Window Compare
000AD0BUSY (W)
001
010
011
100
101
Logic
Timer 0 Overflow
Timer 2 Overflow
Timer 1 Overflow
CNVSTR Input
Timer 3 Overflow
ADC Data
Registers
Window
Compare
Interrupt
Figure 1.13. 10-Bit ADC Block Diagram
Rev. 1.531
C8051F310/1/2/3/4/5
1.8.Comparators
C8051F31x devices include two on-chip voltage comparators that are enabled/disabled and configured via
user software. Port I/O pins may be configured as comparator inputs via a selection mux. Two comparator
outputs may be routed to a Port pin if desired: a latched output and/or an unlatched (asynchronous) output.
Comparator response time is programmable, allowing the user to select between high-speed and lowpower modes. Positive and negative hysteresis are also configurable.
Comparator interrupts may be generated on rising, falling, or both edges. When in IDLE mode, these interrupts may be used as a “wake-up” source. Comparator0 may also be configured as a reset source.
Figure 1.14 shows he Comparator0 block diagram.
CP0EN
CP0OUT
CMX0N1
CMX0N0
CPT0MX
CMX0P1
CMX0P0
P1.0
P1.4
P2.0
P2.4
P1.1
P1.5
P2.1
P2.5
CP0RIF
CP0FIF
CP0HYP1
CPT0CN
CP0HYP0
CP0HYN1
CP0HYN0
CP0 +
CP0 -
VDD
CP0
Interrupt
CP0
Rising-edge
CP0
Falling-edge
Interrupt
Logic
+
-
SET
D
(SYNCHRONIZER)
SET
D
Q
Q
CLR
CLR
Q
Q
Crossbar
GND
CP0
CP0A
Reset
Decision
Tree
CP0RIE
CP0FIE
CPT0MD
CP0MD1
CP0MD0
Figure 1.14. Comparator0 Block Diagram
32Rev. 1.5
2.Absolute Maximum Ratings
C8051F310/1/2/3/4/5
Table 2.1. Absolute Maximum Ratings
ParameterConditionsMinTypMaxUnits
Ambient temperature under bias–55—125°C
Storage Temperature–65—150°C
DD
with
and
or any
Voltage on any Port I/O Pin or RST
respect to GND
Voltage on V
Maximum Total current through V
GND
Maximum output current sunk by RST
Port pin
*Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
with respect to GND–0.3—4.2V
DD
–0.3—5.8V
——500mA
——100mA
*
Rev. 1.533
C8051F310/1/2/3/4/5
3.Global DC Electrical Characteristics
Table 3.1. Global DC Electrical Characteristics
–40°C to +85°C, 25 MHz System Clock unless otherwise specified.
ParameterConditionsMinTypMaxUnits
Digital Supply Voltage
V
RST
†
3.03.6V
Digital Supply Current with
CPU active
Digital Supply Current with
CPU inactive (not accessing
Flash)
Digital Supply Current (shut-
V
= 2.7 V, Clock = 25 MHz
DD
= 2.7 V, Clock = 1 MHz
V
DD
V
= 2.7 V, Clock = 32 kHz
DD
V
= 2.7 V, Clock = 25 MHz
DD
= 2.7 V, Clock = 1 MHz
V
DD
V
= 2.7 V, Clock = 32 kHz
DD
—6.4
0.36
9
—3.2
180
5.5
—mA
—mA
Oscillator not running—< 0.1—µA
mA
µA
µA
µA
down)
Digital Supply RAM Data
—1.5— V
Retention Voltage
Specified Operating Temper-
–40—+85°C
ature Range
SYSCLK (system clock fre-
‡
0
—25MHz
quency)
Tsysl (SYSCLK low time)18——ns
Tsysh (SYSCLK high time)18——ns
†
Given in Table 9.1 on page 102.
‡
SYSCLK must be at least 32 kHz to enable debugging.
34Rev. 1.5
4.Pinout and Package Definitions
Table 4.1. Pin Definitions for the C8051F31x
Pin Numbers
Name
‘F310/2/4 ‘F311/3/5
TypeDescription
C8051F310/1/2/3/4/5
V
DD
GND33Ground.
RST/
C2CK
P3.0/
C2D
P0.0/
VREF
P0.111D I/OPort 0.1. See Section 13 for a complete description.
P0.2/
XTAL1
P0.3/
44
D I/O
55
D I/O
D I/O
66
D I/O
D I/O
22
A In
D I/O
3228
A In
D I/O
Power Supply Voltage.
Device Reset. Open-drain output of internal POR. An external source can initiate a system reset by driving this pin low
for at least 10
Clock signal for the C2 Debug Interface.
Port 3.0. See Section 13 for a complete description.
Bi-directional data signal for the C2 Debug Interface.
Port 0.0. See Section 13 for a complete description.
External VREF input. (‘F310/1/2/3 only)
Port 0.2. See Section 13 for a complete description.
External Clock Input. This pin is the external oscillator return
for a crystal or resonator.
Port 0.3. See Section 13 for a complete description.
µs.
3127
A Out or
XTAL2
P0.43026D I/OPort 0.4. See Section 13 for a complete description.
P0.52925D I/OPort 0.5. See Section 13 for a complete description.
P0.6/
2824
CNVSTR
P0.72723D I/OPort 0.7. See Section 13 for a complete description.
P1.02622
P1.12521
P1.22420
D In
D I/O or
A In
D I/O or
A In
D I/O or
A In
External Clock Output. For an external crystal or resonator,
this pin is the excitation driver. This pin is the external clock
input for CMOS, capacitor, or RC oscillator configurations.
Port 0.6. See Section 13 for a complete description.
Port 1.0. See Section 13 for a complete description.
Port 1.1. See Section 13 for a complete description.
Port 1.2. See Section 13 for a complete description.
Rev. 1.535
C8051F310/1/2/3/4/5
Table 4.1. Pin Definitions for the C8051F31x (Continued)
Pin Numbers
Name
‘F310/2/4 ‘F311/3/5
TypeDescription
P1.32319
P1.42218
P1.52117
P1.62016
P1.71915
P2.01814
P2.11713
P2.21612
P2.31511
P2.41410
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
Port 1.3. See Section 13 for a complete description.
Port 1.4. See Section 13 for a complete description.
Port 1.5. See Section 13 for a complete description.
Port 1.6. See Section 13 for a complete description.
Port 1.7. See Section 13 for a complete description.
Port 2.0. See Section 13 for a complete description.
Port 2.1. See Section 13 for a complete description.
Port 2.2. See Section 13 for a complete description.
Port 2.3. See Section 13 for a complete description.
Port 2.4. See Section 13 for a complete description.
P2.5139
P2.6128
P2.7117
P3.17
P3.28
P3.39
P3.410
36Rev. 1.5
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
D I/O or
A In
Port 2.5. See Section 13 for a complete description.
Port 2.6. See Section 13 for a complete description.
Port 2.7. See Section 13 for a complete description.
Port 3.1. See Section 13 for a complete description.
Port 3.2. See Section 13 for a complete description.
Port 3.3. See Section 13 for a complete description.
Port 3.4. See Section 13 for a complete description.
P0.2
32
P0.3
31
P0.4
30
P0.5
29
C8051F310/1/2/3/4/5
P1.1
P1.0
P0.7
P0.6
28
27
26
25
P0.1
P0.0
GND
/RST/C2CK
P3.0/C2D
P3.1
P3.2
1
2
3
4
5
6
7
8
C8051F310/2/4
Top View
9
10
11
12
P3.3
P3.4
P2.6
P2.7
13
P2.5
14
P2.4
15
P2.3
16
P2.2
Figure 4.1. LQFP-32 Pinout Diagram (Top View)
24
23
22
21
20
19
18
17
P1.2
P1.3
P1.4
P1.5VDD
P1.6
P1.7
P2.0
P2.1
Rev. 1.537
C8051F310/1/2/3/4/5
32
PIN 1
IDENTIFIER
A2
L
D
Table 4.2. LQFP-32
Package Dimensions
D1
MINTYPMAX
A- -1.60
A10.05-0.15
A21.351.401.45
b0.300.370.45
E1
1
E
D-9.00D1-7.00-
e-0.80-
E-9.00E1-7.00-
L0.450.600.75
MM
A
A1
eb
Figure 4.2. LQFP-32 Package Diagram
38Rev. 1.5
C8051F310/1/2/3/4/5
GND
P0.1
P0.0
GND
VDD
/RST/C2CK
P3.0/C2D
P2.7
P0.2
28
1
2
3
P0.3
27
P0.4
26
P0.5
25
P0.6
24
P0.7
23
P1.0
22
21
20
19
P1.1
P1.2
P1.3
C8051F311/3/5
4
18
P1.4
Top View
5
6
GND
7
8
9
10
11
12
13
14
17
16
15
P1.5
P1.6
P1.7
P2.6
P2.5
P2.4
P2.3
P2.2
P2.1
P2.0
Figure 4.3. MLP-28 Pinout Diagram (Top View)
Rev. 1.539
C8051F310/1/2/3/4/5
Bottom View
Table 4.3. MLP-28
Package Dimensions
8
9
L
7
6
b
5
4
e
3
2
1
DETAIL 1
28
D2
2
27
10
26
11
D2
25
6 x e
D
E2
12
24
13
14
MINTYPMAX
15
16
17
E2
2
23
R
22
18
6 x e
19
20
21
A0.800.901.00
A100.020.05
A200.651.00
A3-0.25-
b0.180.230.30
D-5.00-
E
D22.903.153.35
E-5.00E22.903.153.35
e-0.5-
L0.450.550.65
N-28-
ND-7NE-7-
R0.09 --
AA-0.435BB-0.435CC-0.18DD-0.18-
MM
Side View
A3
DETAIL 1
A2
e
AA
BB
CC
DD
A
A1
Figure 4.4. MLP-28 Package Drawing
40Rev. 1.5
C8051F310/1/2/3/4/5
Top View
0.85 mm
0.50 mm
0.20 mm
0.30 mm
0.20 mm
0.50 mm
0.20 mm
Optional
GND
Connection
0.20 mm
0.30 mm
0.50 mm
0.10 mm
0.35 mm
b
D2
L
E2
e
D
0.85 mm
0.50 mm
0.10 mm
0.35 mm
E
Figure 4.5. Typical MLP-28 Landing Diagram
Rev. 1.541
C8051F310/1/2/3/4/5
0.20 mm
0.50 mm
Top View
0.20 mm
0.85 mm
0.30 mm
0.50 mm
0.20 mm
0.20 mm
0.50 mm
0.10 mm
0.60 mm
0.60 mm
0.70 mm
b
L
e
E2
0.30 mm
0.20 mm
0.40 mm
0.35 mm
D2
D
0.30 mm
0.50 mm
0.85 mm
0.35 mm
0.10 mm
Figure 4.6. MLP-28 Solder Paste Recommendation
42Rev. 1.5
E
C8051F310/1/2/3/4/5
5.10-Bit ADC (ADC0, C8051F310/1/2/3 only)
The ADC0 subsystem for the C8051F310/1/2/3 consists of two analog multiplexers (referred to collectively
as AMUX0) with 25 total input selections, and a 200
with integrated track-and-hold and programmable window detector. The AMUX0, data conversion modes,
and window detector are all configurable under software control via the Special Function Registers shown
in
Figure 5.1. ADC0 operates in both Single-ended and Differential modes, and may be configured to mea-
sure P1.0-P3.4, the Temperature Sensor output, or VDD with respect to P1.0-P3.4, VREF, or GND. The
ADC0 subsystem is enabled only when the AD0EN bit in the ADC0 Control register (ADC0CN) is set to
logic
1. The ADC0 subsystem is in low power shutdown when this bit is logic 0.
AMUX0 selects the positive and negative inputs to the ADC. Any of the following may be selected as the
positive input: P1.0-P3.4, the on-chip temperature sensor, or the positive power supply (V
following may be selected as the negative input: P1.0-P3.4, VREF, or GND. When GND is selected as
the negative input, ADC0 operates in Single-ended Mode; all other times, ADC0 operates in Differ
ential Mode. The ADC0 input channels are selected in the AMX0P and AMX0N registers as described in
SFR Definition 5.1 and SFR Definition 5.2.
The conversion code format differs between Single-ended and Differential modes. The registers ADC0H
and ADC0L contain the high and low bytes of the output conversion code from the ADC at the completion
of each conversion. Data can be right-justified or left-justified, depending on the setting of the AD0LJST bit
(ADC0CN.0). When in Single-ended Mode, conversion codes are represented as 10-bit unsigned integers.
Inputs are measured from ‘0’ to VREF * 1023/1024. Example codes are shown below for both right-justified
and left-justified data. Unused bits in the ADC0H and ADC0L registers are set to ‘0’.
). Any of the
DD
-
Input VoltageRight-Justified ADC0H:ADC0L
(AD0LJST = 0)
VREF x 1023/10240x03FF0xFFC0
VREF x 512/10240x02000x8000
VREF x 256/10240x01000x4000
00x00000x0000
When in Differential Mode, conversion codes are represented as 10-bit signed 2’s complement numbers.
Inputs are measured from -VREF to VREF * 511/512. Example codes are shown below for both right-justi
fied and left-justified data. For right-justified data, the unused MSBs of ADC0H are a sign-extension of the
data word. For left-justified data, the unused LSBs in the ADC0L register are set to ‘0’.
Input VoltageRight-Justified ADC0H:ADC0L
(AD0LJST = 0)
VREF x 511/5120x01FF0x7FC0
VREF x 256/5120x01000x4000
00x00000x0000
–VREF x 256/5120xFF000xC000
–VREF 0xFE000x8000
Important Note About ADC0 Input Configuration: Port pins selected as ADC0 inputs should be configured as analog inputs, and should be skipped by the Digital Crossbar. To configure a Port pin for analog
input, set to ‘0’ the corresponding bit in register PnMDIN (for n = 0,1,2,3). To force the Crossbar to skip a
Port pin, set to ‘1’ the corresponding bit in register PnSKIP (for n = 0,1,2). See
Output” on page 119 for more Port I/O configuration details.
Left-Justified ADC0H:ADC0L
(AD0LJST = 1)
Left-Justified ADC0H:ADC0L
(AD0LJST = 1)
Section “13. Port Input/
-
44Rev. 1.5
5.2.Temperature Sensor
C8051F310/1/2/3/4/5
The typical temperature sensor transfer function is shown in Figure 5.2. The output voltage (V
TEMP
) is the
positive ADC input when the temperature sensor is selected by bits AMX0P4-0 in register AMX0P.
(mV)
1200
1100
1000
900
800
700
0-5050100
V
= 3.35*(TEMPC) + 897 mV
TEMP
(Celsius)
Figure 5.2. Typical Temperature Sensor Transfer Function
The uncalibrated temperature sensor output is extremely linear and suitable for relative temperature measurements (see Ta bl e 5.1 for linearity specifications). For absolute temperature measurements, gain and/
or offset calibration is recommended. Typically a 1-point calibration includes the following steps:
Step 1. Control/measure the ambient temperature (this temperature must be known).
Step 2. Power the device, and delay for a few seconds to allow for self-heating.
Step 3. Perform an ADC conversion with the temperature sensor selected as the positive input
and GND selected as the negative input.
Step 4. Calculate the offset and/or gain characteristics, and store these values in non-volatile
memory for use with subsequent temperature sensor measurements.
Figure 5.3 shows the typical temperature sensor error assuming a 1-point calibration at 25 °C. Note that
parameters which affect ADC measurement, in particular the voltage reference value, will also
affect temperature measurement.
Rev. 1.545
C8051F310/1/2/3/4/5
5.00
4.00
3.00
2.00
1.00
0.00
-40.00-20.000.00
-1.00
Error (degrees C)
-2.00
-3.00
-4.00
-5.00
20.00
Temperature (degrees C)
40.00
60.00
80.00
5.00
4.00
3.00
2.00
1.00
0.00
-1.00
-2.00
-3.00
-4.00
-5.00
Figure 5.3. Temperature Sensor Error with 1-Point Calibration
46Rev. 1.5
C8051F310/1/2/3/4/5
5.3.Modes of Operation
ADC0 has a maximum conversion speed of 200 ksps. The ADC0 conversion clock is a divided version of
the system clock, determined by the AD0SC bits in the ADC0CF register (system clock divided by
(AD0SC
5.3.1. Starting a Conversion
A conversion can be initiated in one of five ways, depending on the programmed states of the ADC0 Start
of Conversion Mode bits (AD0CM2-0) in register ADC0CN. Conversions may be initiated by one of the fol
lowing:
Writing a ‘1’ to AD0BUSY provides software control of ADC0 whereby conversions are performed "ondemand". During conversion, the AD0BUSY bit is set to logic 1 and reset to logic 0 when the conversion is
complete. The falling edge of AD0BUSY triggers an interrupt (when enabled) and sets the ADC0 interrupt
flag (AD0INT). Note: When polling for ADC conversion completions, the ADC0 interrupt flag (AD0INT)
should be used. Converted data is available in the ADC0 data registers, ADC0H:ADC0L, when bit AD0INT
is logic 1. Note that when Timer 2 or Timer 3 overflows are used as the conversion source, Low Byte over
flows are used if Timer 2/3 is in 8-bit mode; High byte overflows are used if Timer 2/3 is in 16-bit mode. See
Section “17. Timers” on page 177 for timer configuration.
+ 1) for 0 ≤ AD0SC ≤ 31).
-
1. Writing a ‘1’ to the AD0BUSY bit of register ADC0CN
2. A Timer 0 overflow (i.e., timed continuous conversions)
3. A Timer 2 overflow
4. A Timer 1 overflow
5. A rising edge on the CNVSTR input signal (pin P0.6)
6. A Timer 3 overflow
-
Important Note About Using CNVSTR: The CNVSTR input pin also functions as Port pin P0.6. When the
CNVSTR input is used as the ADC0 conversion source, Port pin P0.6 should be skipped by the Digital
Crossbar. To configure the Crossbar to skip P0.6, set to ‘1’ Bit6 in register P0SKIP. See
Input/Output” on page 119 for details on Port I/O configuration.
Section “13. Port
Rev. 1.547
C8051F310/1/2/3/4/5
5.3.2. Tracking Modes
According to Ta bl e 5.1, each ADC0 conversion must be preceded by a minimum tracking time for the converted result to be accurate. The AD0TM bit in register ADC0CN controls the ADC0 track-and-hold mode.
In its default state, the ADC0 input is continuously tracked, except when a conversion is in progress. When
the AD0TM bit is logic 1, ADC0 operates in low-power track-and-hold mode. In this mode, each conversion
is preceded by a tracking period of 3 SAR clocks (after the start-of-conversion signal). When the CNVSTR
signal is used to initiate conversions in low-power tracking mode, ADC0 tracks only when CNVSTR is low;
conversion begins on the rising edge of CNVSTR (see
down) when the device is in low power standby or sleep modes. Low-power track-and-hold mode is also
useful when AMUX settings are frequently changed, due to the settling time requirements described in
Section “5.3.3. Settling Time Requirements” on page 49.
A. ADC0 Timing for External Trigger Source
CNVSTR
(AD0CM[2:0]=100)
Figure 5.4). Tracking can also be disabled (shut-
SAR Clocks
AD0TM=1
Write '1' to AD0BUSY,
Timer 0, Timer 2,
Timer 1, Timer 3 Overflow
(AD0CM[2:0]=000, 001,010
011, 101)
SAR Clocks
AD0TM=1
SAR Clocks
AD0TM=0
Low Power
or Convert
Track or ConvertConvertTrackAD0TM=0
123456789
TrackConvert
10 11
Low Power
B. ADC0 Timing for Internal Trigger Source
Low Power
or Convert
Track or
Convert
123456789101112
TrackConvertLow Power Mode
123456789
ConvertTrack
10
13 14
11
Mode
Figure 5.4. 10-Bit ADC Track and Conversion Example Timing
48Rev. 1.5
C8051F310/1/2/3/4/5
5.3.3. Settling Time Requirements
When the ADC0 input configuration is changed (i.e., a different AMUX0 selection is made), a minimum
tracking time is required before an accurate conversion can be performed. This tracking time is determined
by the AMUX0 resistance, the ADC0 sampling capacitance, any external source resistance, and the accu
racy required for the conversion. In low-power tracking mode, three SAR clocks are used for tracking at the
start of every conversion. For most applications, these three SAR clocks will meet the minimum tracking
time requirements.
Figure 5.5 shows the equivalent ADC0 input circuits for both Differential and Single-ended modes. Notice
that the equivalent time constant for both input circuits is the same. The required ADC0 settling time for a
given settling accuracy (SA) may be approximated by
Sensor output or VDD with respect to GND, R
TOTAL
settling time requirements.
Equation 5.1. ADC0 Settling Time Requirements
n
2
t
-------
×ln=
SA
R
Equation 5.1. When measuring the Temperature
reduces to R
TOTALCSAMPLE
. See Ta bl e 5.1 for ADC0 minimum
MUX
-
Where:
SA is the settling accuracy, given as a fraction of an LSB (for example, 0.25 to settle within 1/4 LSB)
t is the required settling time in seconds
R
is the sum of the AMUX0 resistance and any external source resistance.
Note that when GND is selected as the Negative Input, ADC0 operates in Single-ended
mode. For all other Negative Input selections, ADC0 operates in Differential mode.
†Only applies to C8051F310/2; selection RESERVED on C8051F311/3 devices.
Rev. 1.551
C8051F310/1/2/3/4/5
SFR Definition 5.3. ADC0CF: ADC0 Configuration
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
AD0SC4AD0SC3AD0SC2AD0SC1AD0SC0 AD0LJST--11111000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-3:AD0SC4-0: ADC0 SAR Conversion Clock Period Bits.
SAR Conversion clock is derived from system clock by the following equation, where
AD0SC refers to the 5-bit value held in bits AD0SC4-0. SAR Conversion clock requirements
are given in Table 5.1.
SYSCLK
AD0SC
Bit2:AD0LJST: ADC0 Left Justify Select.
0: Data in ADC0H:ADC0L registers are right-justified.
1: Data in ADC0H:ADC0L registers are left-justified.
Bits1-0:UNUSED. Read = 00b; Write = don’t care.
----------------------
CLK
SAR
1–=
0xBC
SFR Definition 5.4. ADC0H: ADC0 Data Word MSB
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-0:ADC0 Data Word High-Order Bits.
For AD0LJST = 0: Bits 7-2 are the sign extension of Bit1. Bits 1-0 are the upper 2 bits of the
10-bit ADC0 Data Word.
For AD0LJST = 1: Bits 7-0 are the most-significant bits of the 10-bit ADC0 Data Word.
SFR Definition 5.5. ADC0L: ADC0 Data Word LSB
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-0:ADC0 Data Word Low-Order Bits.
For AD0LJST = 0: Bits 7-0 are the lower 8 bits of the 10-bit Data Word.
For AD0LJST = 1: Bits 7-6 are the lower 2 bits of the 10-bit Data Word. Bits 5-0 will always
read ‘0’.
0: ADC0 Disabled. ADC0 is in low-power shutdown.
1: ADC0 Enabled. ADC0 is active and ready for data conversions.
Bit6:AD0TM: ADC0 Track Mode Bit.
0: Normal Track Mode: When ADC0 is enabled, tracking is continuous unless a conversion is
in progress.
1: Low-power Track Mode: Tracking Defined by AD0CM2-0 bits (see below).
0: ADC0 has not completed a data conversion since the last time AD0INT was cleared.
1: ADC0 has completed a data conversion.
Bit4:AD0BUSY: ADC0 Busy Bit.
Read:
0: ADC0 conversion is complete or a conversion is not currently in progress. AD0INT is set to
logic 1 on the falling edge of AD0BUSY.
1: ADC0 conversion is in progress.
Write:
0: No Effect.
1: Initiates ADC0 Conversion if AD0CM2-0 = 000b
Bit3:AD0WINT: ADC0 Window Compare Interrupt Flag.
0: ADC0 Window Comparison Data match has not occurred since this flag was last cleared.
1: ADC0 Window Comparison Data match has occurred.
Bits2-0:AD0CM2-0: ADC0 Start of Conversion Mode Select.
When AD0TM = 0:
000: ADC0 conversion initiated on every write of ‘1’ to AD0BUSY.
001: ADC0 conversion initiated on overflow of Timer 0.
010: ADC0 conversion initiated on overflow of Timer 2.
011: ADC0 conversion initiated on overflow of Timer 1.
100: ADC0 conversion initiated on rising edge of external CNVSTR.
101: ADC0 conversion initiated on overflow of Timer 3.
11x: Reserved.
When AD0TM = 1:
000: Tracking initiated on write of ‘1’ to AD0BUSY and lasts 3 SAR clocks, followed by conversion.
001: Tracking initiated on overflow of Timer 0 and lasts 3 SAR clocks, followed by conversion.
010: Tracking initiated on overflow of Timer 2 and lasts 3 SAR clocks, followed by conversion.
011: Tracking initiated on overflow of Timer 1 and lasts 3 SAR clocks, followed by conversion.
100: ADC0 tracks only when CNVSTR input is logic low; conversion starts on rising CNVSTR
edge.
101: Tracking initiated on overflow of Timer 3 and lasts 3 SAR clocks, followed by conversion.
11x: Reserved
.
(bit addressable)
0xE8
Rev. 1.553
C8051F310/1/2/3/4/5
5.4.Programmable Window Detector
The ADC Programmable Window Detector continuously compares the ADC0 output registers to user-programmed limits, and notifies the system when a desired condition is detected. This is especially effective in
an interrupt-driven system, saving code space and CPU bandwidth while delivering faster system
response times. The window detector interrupt flag (AD0WINT in register ADC0CN) can also be used in
polled mode. The ADC0 Greater-Than (ADC0GTH, ADC0GTL) and Less-Than (ADC0LTH, ADC0LTL) reg
isters hold the comparison values. The window detector flag can be programmed to indicate when measured data is inside or outside of the user-programmed limits, depending on the contents of the ADC0
Less-Than and ADC0 Greater-Than registers.
SFR Definition 5.7. ADC0GTH: ADC0 Greater-Than Data High Byte
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
11111111
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
0xC4
Bits7-0: High byte of ADC0 Greater-Than Data Word.
-
SFR Definition 5.8. ADC0GTL: ADC0 Greater-Than Data Low Byte
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
11111111
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-0: Low byte of ADC0 Greater-Than Data Word.
0xC3
54Rev. 1.5
C8051F310/1/2/3/4/5
SFR Definition 5.9. ADC0LTH: ADC0 Less-Than Data High Byte
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-0: High byte of ADC0 Less-Than Data Word.
SFR Definition 5.10. ADC0LTL: ADC0 Less-Than Data Low Byte
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-0: Low byte of ADC0 Less-Than Data Word.
0xC6
0xC5
Rev. 1.555
C8051F310/1/2/3/4/5
5.4.1. Window Detector In Single-Ended Mode
Figure 5.6 shows two example window comparisons for right-justified, single-ended data, with
ADC0LTH:ADC0LTL = 0x0080 (128d) and ADC0GTH:ADC0GTL = 0x0040 (64d). In single-ended mode,
the input voltage can range from ‘0’ to VREF x (1023/1024) with respect to GND, and is represented by a
10-bit unsigned integer value. In the left example, an AD0WINT interrupt will be generated if the ADC0
conversion word (ADC0H:ADC0L) is within the range defined by ADC0GTH:ADC0GTL and
ADC0LTH:ADC0LTL (if
will be generated if the ADC0 conversion word is outside of the range defined by the ADC0GT and
ADC0LT registers (if
ple using left-justified data with the same comparison values.
Input Voltage
(Px.x - GND)
VREF x (1023/1024)
0x0040 < ADC0H:ADC0L < 0x0080). In the right example, and AD0WINT interrupt
ADC0H:ADC0L < 0x0040 or ADC0H:ADC0L > 0x0080). Figure 5.7 shows an exam-
ADC0H:ADC0LADC0H:ADC0L
Input Voltage
(Px.x - GND)
0x03FF
VREF x (1023/1024)
0x03FF
VREF x (128/1024)
VREF x (64/1024)
0
0x0081
0x0080
0x007F
0x0041
0x0040
0x003F
0x0000
AD0WINT
not affected
ADC0LTH:ADC0LTL
ADC0GTH:ADC0GT L
AD0WINT
not affected
AD0WINT=1
VREF x (128/1024)
VREF x (64/1024)
0
0x0081
0x0080
0x007F
0x0041
0x0040
0x003F
0x0000
ADC0GTH:ADC0GTL
AD0WINT
not affected
ADC0LTH:ADC0LTL
AD0WINT=1
AD0WINT=1
Figure 5.6. ADC Window Compare Example: Right-Justified Single-Ended Data
ADC0H:ADC0LADC0H:ADC0L
Input Voltage
(Px.x - GND)
VREF x (1023/1024)
VREF x (128/1024)
VREF x (64/1024)
0xFFC0
0x2040
0x2000
0x1FC0
0x1040
0x1000
0x0FC0
AD0WINT
not affected
ADC0LTH:ADC0LTL
AD0WINT=1
ADC0GTH:ADC0GTL
Input Voltage
(Px.x - GND)
VREF x (1023/1024)
VREF x (128/1024)
VREF x (64/1024)
0xFFC0
0x2040
0x2000
0x1FC0
0x1040
0x1000
0x0FC0
ADC0GTH:ADC0GTL
AD0WINT
not affected
ADC0LTH:ADC0LTL
AD0WINT=1
AD0WINT
not affected
0
0x0000
0
0x0000
AD0WINT=1
Figure 5.7. ADC Window Compare Example: Left-Justified Single-Ended Data
56Rev. 1.5
C8051F310/1/2/3/4/5
5.4.2. Window Detector In Differential Mode
Figure 5.8 shows two example window comparisons for right-justified, differential data, with
ADC0LTH:ADC0LTL = 0x0040 (+64d) and ADC0GTH:ADC0GTH = 0xFFFF (-1d). In differential mode, the
measurable voltage between the input pins is between -VREF and VREF*(511/512). Output codes are rep
resented as 10-bit 2’s complement signed integers. In the left example, an AD0WINT interrupt will be generated if the ADC0 conversion word (ADC0H:ADC0L) is within the range defined by ADC0GTH:ADC0GTL
and ADC0LTH:ADC0LTL (if
0xFFFF (-1d) < ADC0H:ADC0L < 0x0040 (64d)). In the right example, an
AD0WINT interrupt will be generated if the ADC0 conversion word is outside of the range defined by the
ADC0GT and ADC0LT registers (if
ADC0H:ADC0L < 0xFFFF (-1d) or ADC0H:ADC0L > 0x0040 (+64d)).
Figure 5.9 shows an example using left-justified data with the same comparison values.
ADC0H:ADC0LADC0H:ADC0L
Input Voltage
(Px.x - Px.x)
VREF x (511/512)
0x01FF
Input Voltage
(Px.x - Px.x)
VREF x (511/512)
0x01FF
-
VREF x (64/512)
VREF x (-1/512)
-VREF
0x0041
0x0040
0x003F
0x0000
0xFFFF
0xFFFE
0x0200
AD0WINT
not affected
ADC0LTH:ADC0LTL
ADC0GTH:ADC0GTL
AD0WINT
not affected
AD0WINT=1
VREF x (64/512)
VREF x (-1/512)
-VREF
0x0041
0x0040
0x003F
0x0000
0xFFFF
0xFFFE
0x0200
ADC0GTH:ADC0GTL
AD0WINT
not affected
ADC0LTH:ADC0LTL
AD0WINT=1
AD0WINT=1
Figure 5.8. ADC Window Compare Example: Right-Justified Differential Data
ADC0H:ADC0LADC0H:ADC0L
Input Voltage
(Px.x - Px.x)
VREF x (511/512)
VREF x (64/512)
VREF x (-1/512)
0x7FC0
0x1040
0x1000
0x0FC0
0x0000
0xFFC0
0xFF80
AD0WINT
not affected
ADC0LTH:ADC0LTL
ADC0GTH:ADC0GTL
AD0WINT=1
Input Voltage
(Px.x - Px.y)
VREF x (511/512)
VREF x (64/512)
VREF x (-1/512)
0x7FC0
0x1040
0x1000
0x0FC0
0x0000
0xFFC0
0xFF80
ADC0GTH:ADC0GTL
AD0WINT
not affected
ADC0LTH:ADC0LTL
AD0WINT=1
AD0WINT=1
-VREF
0x8000
AD0WINT
not affected
-VREF
0x8000
Figure 5.9. ADC Window Compare Example: Left-Justified Differential Data
Rev. 1.557
C8051F310/1/2/3/4/5
Table 5.1. ADC0 Electrical Characteristics
VDD = 3.0 V, VREF = 2.40 V (REFSL=0), –40 to +85 °C unless otherwise specified
Dynamic Performance (10 kHz sine-wave Single-ended input, 0 to 1 dB below Full Scale, 200 ksps)
Signal-to-Noise Plus Distortion5355.5—dB
Total Harmonic Distortion
Spurious-Free Dynamic Range—78—dB
Conversion Rate
SAR Conversion Clock—— 3MHz
Conversion Time in SAR Clocks10——clocks
Track/Hold Acquisition Time300——ns
Throughput Rate——200ksps
Analog Inputs
Input Voltage Range0—VREFV
Input Capacitance—5—pF
Temperature Sensor———
LinearityNotes 1, 2—±0.5—°C
GainNotes 1, 2—3350 ± 10—µV / °C
OffsetNotes 1, 2 (Temp = 0 °C)—897 ± 31—mV
Power Specifications
Power Supply Current
(VDD supplied to ADC0)
Up to the 5th harmonic
Operating Mode, 200 ksps—400900µA
—–67—dB
Power Supply Rejection—±0.3—mV/V
Note 1: Represents one standard deviation from the mean.
Note 2: Includes ADC offset, gain, and linearity variations.
58Rev. 1.5
C8051F310/1/2/3/4/5
6.Voltage Reference (C8051F310/1/2/3 only)
The voltage reference MUX on C8051F310/1/2/3 devices is configurable to use an externally connected
voltage reference, or the power supply voltage (see
register (REF0CN) selects the reference source. For an external source, REFSL should be set to ‘0’; For
V
as the reference source, REFSL should be set to ‘1’.
DD
The BIASE bit enables the internal voltage bias generator, which is used by the ADC, Temperature Sensor,
and Internal Oscillator. This bit is forced to logic 1 when any of the aforementioned peripherals is enabled.
The bias generator may be enabled manually by writing a ‘1’ to the BIASE bit in register REF0CN; see
SFR Definition 6.1 for REF0CN register details. The electrical specifications for the voltage reference circuit are given in Ta bl e 6.1.
Important Note About the VREF Input: Port pin P0.0 is used as the external VREF input. When using an
external voltage reference, P0.0 should be configured as analog input and skipped by the Digital Crossbar.
To configure P0.0 as analog input, set to ‘0’ Bit0 in register P0MDIN. To configure the Crossbar to skip
P0.0, set to ‘1’ Bit0 in register P0SKIP. Refer to
plete Port I/O configuration details.
The temperature sensor connects to the highest order input of the ADC0 positive input multiplexer (see
Section “5.1. Analog Multiplexer” on page 44 for details). The TEMPE bit in register REF0CN
enables/disables the temperature sensor. While disabled, the temperature sensor defaults to a high impedance state and any ADC0 measurements performed on the sensor result in meaningless data.
Figure 6.1). The REFSL bit in the Reference Control
Section “13. Port Input/Output” on page 119 for com-
VDD
GND
R1
REF0CN
BIASE
REFSL
TEMPE
EN
Bias Generator
0
1
IOSCEN
EN
Temp Sensor
External
Voltage
Reference
Circuit
VREF
VDD
Figure 6.1. Voltage Reference Functional Block Diagram
This bit selects the source for the internal voltage reference.
0: VREF input pin used as voltage reference.
1: V
used as voltage reference.
DD
Bit2:TEMPE: Temperature Sensor Enable Bit.
0: Internal Temperature Sensor off.
1: Internal Temperature Sensor on.
Bit1:BIASE: Internal Analog Bias Generator Enable Bit. (Must be ‘1’ if using ADC).
0: Internal Bias Generator off.
1: Internal Bias Generator on.
Bit0:UNUSED. Read = 0b. Write = don’t care.
0xD1
Table 6.1. External Voltage Reference Circuit Electrical Characteristics
VDD = 3.0 V; –40 to +85 °C unless otherwise specified
ParameterConditionsMinTypMaxUnits
Input Voltage Range
Input Current
Sample Rate = 200 ksps;
VREF = 3.0 V
0V
12µA
V
DD
60Rev. 1.5
C8051F310/1/2/3/4/5
7.Comparators
C8051F31x devices include two on-chip programmable voltage comparators: Comparator0 is shown in
Figure 7.1; Comparator1 is shown in Figure 7.2. The two comparators operate identically with the following
exceptions: (1) Their input selections differ as shown in Figure 7.1 and Figure 7.2; (2) Comparator0 can be
used as a reset source.
The Comparator offers programmable response time and hysteresis, an analog input multiplexer, and two
outputs that are optionally available at the Port pins: a synchronous “latched” output (CP0, CP1), or an
asynchronous “raw” output (CP0A, CP1A). The asynchronous CP0A signal is available even when the
system clock is not active. This allows the Comparator to operate and generate an output with the device
in STOP mode. When assigned to a Port pin, the Comparator output may be configured as open drain or
push-pull (see
reset source (see Section “9.5. Comparator0 Reset” on page 100).
The Comparator0 inputs are selected in the CPT0MX register (SFR Definition 7.2). The CMX0P1-CMX0P0
bits select the Comparator0 positive input; the CMX0N1-CMX0N0 bits select the Comparator0 negative
input. The Comparator1 inputs are selected in the CPT1MX register (
CMX1P0 bits select the Comparator1 positive input; the CMX1N1-CMX1N0 bits select the Comparator1
negative input.
Section “13.2. Port I/O Initialization” on page 123). Comparator0 may also be used as a
SFR Definition 7.5). The CMX1P1-
Important Note About Comparator Inputs: The Port pins selected as comparator inputs should be configured as analog inputs in their associated Port configuration register, and configured to be skipped by the
Crossbar (for details on Port configuration, see
CP0EN
CP0OUT
CP0RIF
CP0FIF
CMX0N1
CMX0N0
CPT0MX
CMX0P1
CMX0P0
P1.0
P1.4
P2.0
P2.4
P1.1
P1.5
P2.1
P2.5
CP0HYP1
CPT0CN
CP0HYP0
CP0HYN1
CP0HYN0
CP0 +
CP0 -
Section “13.3. General Purpose Port I/O” on page 126).
VDD
CP0
Interrupt
CP0
Rising-edge
Interrupt
+
-
GND
Reset
Decision
Tree
SET
SET
D
D
Q
Q
CLR
CLR
(SYNCHRONIZER)
Q
Q
Crossbar
Logic
CP0
Falling-edge
CP0
CP0A
CP0RIE
CP0FIE
CPT0MD
CP0MD1
CP0MD0
Figure 7.1. Comparator0 Functional Block Diagram
Rev. 1.561
C8051F310/1/2/3/4/5
The Comparator output can be polled in software, used as an interrupt source, and/or routed to a Port pin.
When routed to a Port pin, the Comparator output is available asynchronous or synchronous to the system
clock; the asynchronous output is available even in STOP mode (with no system clock active). When dis
abled, the Comparator output (if assigned to a Port I/O pin via the Crossbar) defaults to the logic low state,
and its supply current falls to less than 100
page 121 for details on configuring Comparator outputs via the digital Crossbar. Comparator inputs can be
externally driven from –0.25 V to (VDD) + 0.25 V without damage or upset. The complete Comparator electrical specifications are given in Tab le 7.1.
The Comparator response time may be configured in software via the CPTnMD registers (see SFR Definition 7.3 and SFR Definition 7.6). Selecting a longer response time reduces the Comparator supply current.
See Ta bl e 7.1 for complete timing and current consumption specifications.
CP1EN
CP1OUT
CP1RIF
CP1FIF
CMX1N1
CMX1N0
CPT1MX
CMX1P1
CMX1P0
P1.2
P1.6
P2.2
P2.6
P1.3
P1.7
P2.3
P2.7
CP1HYP1
CPT1CN
CP1HYP0
CP1HYN1
CP1HYN0
CP1 +
CP1 -
nA. See Section “13.1. Priority Crossbar Decoder” on
VDD
CP1
Interrupt
CP1
Rising-edge
Interrupt
Logic
+
-
GND
Reset
Decision
Tree
SET
SET
Q
D
D
Q
CLR
CLR
(SYNCHRONIZER)
Q
Q
Crossbar
CP1
Falling-edge
CP1
CP1A
-
CP1RIE
CP1FIE
CPT1MD
CP1MD1
CP1MD0
Figure 7.2. Comparator1 Functional Block Diagram
62Rev. 1.5
CP0+
VIN+
CP0-
VIN-
CIRCUIT CONFIGURATION
Positive Hysteresis Voltage
(Programmed with CP0HYP Bits)
VIN-
INPUTS
VIN+
OUTPUT
V
OL
Positive Hysteresis
Disabled
C8051F310/1/2/3/4/5
+
CP0
_
V
OH
OUT
Maximum
Positive Hysteresis
Negative Hysteresis
Disabled
Negative Hysteresis Voltage
(Programmed by CP0HYN Bits)
Maximum
Negative Hysteresis
Figure 7.3. Comparator Hysteresis Plot
The Comparator hysteresis is software-programmable via its Comparator Control register CPTnCN (for
n
= 0 or 1). The user can program both the amount of hysteresis voltage (referred to the input voltage) and
the positive and negative-going symmetry of this hysteresis around the threshold voltage.
The Comparator hysteresis is programmed using Bits3-0 in the Comparator Control Register CPTnCN
(shown in
determined by the settings of the CPnHYN bits. As shown in Ta b le 7.1, settings of 20, 10 or 5 mV of
negative hysteresis can be programmed, or negative hysteresis can be disabled. In a similar way, the
amount of positive hysteresis is determined by the setting the CPnHYP bits.
Comparator interrupts can be generated on both rising-edge and falling-edge output transitions. (For Interrupt enable and priority control, see Section “8.3. Interrupt Handler” on page 86). The CPnFIF flag is set
to logic 1 upon a Comparator falling-edge interrupt, and the CPnRIF flag is set to logic 1 upon the Comparator rising-edge interrupt. Once set, these bits remain set until cleared by software. The output state of the
Comparator can be obtained at any time by reading the CPnOUT bit. The Comparator is enabled by set
ting the CPnEN bit to logic 1, and is disabled by clearing this bit to logic 0.
The output state of the Comparator can be obtained at any time by reading the CPnOUT bit. The Comparator is enabled by setting the CPnEN bit to logic 1, and is disabled by clearing this bit to logic 0.
Note that false rising edges and falling edges can be detected when the comparator is first powered-on or
if changes are made to the hysteresis or response time control bits. Therefore, it is recommended that the
rising-edge and falling-edge flags be explicitly cleared to logic
enabled or its mode bits have been changed. This Power Up Time is specified in
SFR Definition 7.1 and SFR Definition 7.4). The amount of negative hysteresis voltage is
These bits select the response time for Comparator1.
ModeCP1MD1 CP1MD0CP1 Response Time (TYP)
000Fastest Response Time
101—
210—
311Lowest Power Consumption
0x9C
Rev. 1.569
C8051F310/1/2/3/4/5
Table 7.1. Comparator Electrical Characteristics
VDD = 3.0 V, –40 to +85 °C unless otherwise noted.
All specifications apply to both Comparator0 and Comparator1 unless otherwise noted.
ParameterConditionsMinTypMaxUnits
Response Time:
Mode 0, Vcm† = 1.5 V
Response Time:
Mode 1, Vcm† = 1.5 V
Response Time:
Mode 2, Vcm† = 1.5 V
Response Time:
Mode 3, Vcm† = 1.5 V
Common-Mode Rejection Ratio—1.5 4 mV/V
Positive Hysteresis 1CP0HYP1-0 = 00—01mV
Positive Hysteresis 2CP0HYP1-0 = 01257mV
Positive Hysteresis 3CP0HYP1-0 = 1051013mV
Positive Hysteresis 4CP0HYP1-0 = 11122025mV
Negative Hysteresis 1CP0HYN1-0 = 0001mV
Negative Hysteresis 2CP0HYN1-0 = 01257mV
Negative Hysteresis 3CP0HYN1-0 = 1051013mV
Negative Hysteresis 4CP0HYN1-0 = 11122025mV
Inverting or Non-Inverting Input
Voltage Range
Input Capacitance—7— pF
Input Bias Current—1— nA
Input Offset Voltage–5—+5mV
Power Supply
Power Supply Rejection††
Power-up Time—10— µs
Supply Current at DC
†
Vcm is the common-mode voltage on CP0+ and CP0–.
††
Guaranteed by design and/or characterization.
CP0+ – CP0– = 100 mV—100—ns
CP0+ – CP0– = –100 mV—250—ns
CP0+ – CP0– = 100 mV—175—ns
CP0+ – CP0– = –100 mV—500—ns
CP0+ – CP0– = 100 mV—320—ns
CP0+ – CP0– = –100 mV—1100—ns
CP0+ – CP0– = 100 mV—1050—ns
CP0+ – CP0– = –100 mV—5200—ns
–0.25—VDD +
0.25
—0.1 1 mV/V
Mode 0—7.620µA
Mode 1—3.210µA
Mode 2—1.35µA
Mode 3—0.42.5µA
V
70Rev. 1.5
C8051F310/1/2/3/4/5
8.CIP-51 Microcontroller
The MCU system controller core is the CIP-51 microcontroller. The CIP-51 is fully compatible with the
MCS-51™ instruction set; standard 803x/805x assemblers and compilers can be used to develop soft
ware. The MCU family has a superset of all the peripherals included with a standard 8051. Included are
four 16-bit counter/timers (see description in
in Section 15), an Enhanced SPI (see description in Section 16), 256 bytes of internal RAM, 128 byte
Special Function Register (SFR) address space (Section 8.2.6), and 29 Port I/O (see description in Sec-
tion 13). The CIP-51 also includes on-chip debug hardware (see description in Section 20), and interfaces
directly with the analog and digital subsystems providing a complete data acquisition or control-system
solution in a single integrated circuit.
The CIP-51 Microcontroller core implements the standard 8051 organization and peripherals as well as
additional custom peripherals and functions to extend its capability (see
The CIP-51 includes the following features:
Section 17), an enhanced full-duplex UART (see description
Figure 8.1 for a block diagram).
-
-Fully Compatible with MCS-51 Instruction Set
-25 MIPS Peak Throughput with 25 MHz Clock
-0 to 25 MHz Clock Frequency
-256 Bytes of Internal RAM
-29 Port I/O
ACCUMULATOR
PSW
DATA BUS
PROGRAM COUNTER (PC)
RESET
CLOCK
STOP
IDLE
CONTROL
D8
D8
DATA POINTER
PC INCREMENTER
PRGM. ADDRESS REG.
LOGIC
POWER CONTROL
REGISTER
D8
TMP1TMP2
ALU
D8
BUFFER
PIPELINE
-Extended Interrupt Handler
-Reset Input
-Power Management Modes
-On-chip Debug Logic
-Program and Data Memory Security
DATA BUS
D8
DATA BUS
D8
D8
DATA BUS
D8
B REGISTER
ADDRESS
REGISTER
D8
INTERFACE
D8
A16
INTERFACE
D8
INTERRUPT
INTERFACE
D8
D8
SRAM
D8
SFR
BUS
MEMORY
D8
STACK POINTER
SRAM
(256 X 8)
D8
SFR_ADDRESS
SFR_CONTROL
SFR_WRITE_ DATA
SFR_READ_DATA
MEM_ADDRESS
MEM_CONTROL
MEM_WRITE_DATA
MEM_READ_D ATA
SYSTEM_IRQs
EMULATION_IRQ
Figure 8.1. CIP-51 Block Diagram
Rev. 1.571
C8051F310/1/2/3/4/5
Performance
The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system
clock cycles to execute, and usually have a maximum system clock of 12
core executes 70% of its instructions in one or two system clock cycles, with no instructions taking more
than eight system clock cycles.
With the CIP-51's maximum system clock at 25 MHz, it has a peak throughput of 25 MIPS. The CIP-51 has
a total of 109 instructions. The table below shows the total number of instructions that require each execu
tion time.
Clocks to Execute122/333/444/558
Number of Instructions265051473121
Programming and Debugging Support
In-system programming of the Flash program memory and communication with on-chip debug support
logic is accomplished via the Silicon Labs 2-Wire Development Interface (C2). The re-programmable Flash
can also be read and changed a single byte at a time by the application software using the MOVC and
MOVX instructions. This feature allows program memory to be used for non-volatile data storage as well
as updating program code under software control.
MHz. By contrast, the CIP-51
-
The on-chip debug support logic facilitates full speed in-circuit debugging, allowing the setting of hardware
breakpoints, starting, stopping and single stepping through program execution (including interrupt service
routines), examination of the program's call stack, and reading/writing the contents of registers and mem
ory. This method of on-chip debugging is completely non-intrusive, requiring no RAM, Stack, timers, or
other on-chip resources. C2 details can be found in
The CIP-51 is supported by development tools from Silicon Labs and third party vendors. Silicon Labs provides an integrated development environment (IDE) including an editor, evaluation compiler, assembler,
debugger and programmer. The IDE's debugger and programmer interface to the CIP-51 via the C2 inter
face to provide fast and efficient in-system device programming and debugging. Third party macro assemblers and C compilers are also available.
Section “20. C2 Interface” on page 213.
-
-
72Rev. 1.5
C8051F310/1/2/3/4/5
8.1.Instruction Set
The instruction set of the CIP-51 System Controller is fully compatible with the standard MCS-51™ instruction set. Standard 8051 development tools can be used to develop software for the CIP-51. All CIP-51
instructions are the binary and functional equivalent of their MCS-51™ counterparts, including opcodes,
addressing modes and effect on PSW flags. However, instruction timing is different than that of the stan
dard 8051.
8.1.1. Instruction and CPU Timing
In many 8051 implementations, a distinction is made between machine cycles and clock cycles, with
machine cycles varying from 2 to 12 clock cycles in length. However, the CIP-51 implementation is based
solely on clock cycle timing. All instruction timings are specified in terms of clock cycles.
Due to the pipelined architecture of the CIP-51, most instructions execute in the same number of clock
cycles as there are program bytes in the instruction. Conditional branch instructions take one less clock
cycle to complete when the branch is not taken as opposed to when the branch is taken.
CIP-51 Instruction Set Summary, which includes the mnemonic, number of bytes, and number of clock
cycles for each instruction.
8.1.2. MOVX Instruction and Program Memory
Table 8.1 is the
-
The MOVX instruction is typically used to access external data memory (Note: the C8051F31x does not
support external data or program memory). In the CIP-51, the MOVX write instruction is used to accesses
external RAM and the on-chip program memory space implemented as re-programmable Flash memory.
The Flash access feature provides a mechanism for the CIP-51 to update program code and use the pro
gram memory space for non-volatile data storage. Refer to Section “10. Flash Memory” on page 103 for
further details.
Table 8.1. CIP-51 Instruction Set Summary
MnemonicDescriptionBytes
Arithmetic Operations
ADD A, RnAdd register to A11
ADD A, directAdd direct byte to A22
ADD A, @RiAdd indirect RAM to A12
ADD A, #dataAdd immediate to A22
ADDC A, RnAdd register to A with carry11
ADDC A, directAdd direct byte to A with carry22
ADDC A, @RiAdd indirect RAM to A with carry12
ADDC A, #dataAdd immediate to A with carry22
SUBB A, RnSubtract register from A with borrow11
SUBB A, directSubtract direct byte from A with borrow22
SUBB A, @RiSubtract indirect RAM from A with borrow12
SUBB A, #dataSubtract immediate from A with borrow22
INC AIncrement A11
INC RnIncrement register11
INC directIncrement direct byte22
INC @RiIncrement indirect RAM12
DEC ADecrement A11
Clock
Cycles
-
Rev. 1.573
C8051F310/1/2/3/4/5
Table 8.1. CIP-51 Instruction Set Summary (Continued)
MnemonicDescriptionBytes
DEC RnDecrement register11
DEC directDecrement direct byte22
DEC @RiDecrement indirect RAM12
INC DPTRIncrement Data Pointer11
MUL ABMultiply A and B14
DIV ABDivide A by B18
DA ADecimal adjust A11
Logical Operations
ANL A, RnAND Register to A11
ANL A, directAND direct byte to A22
ANL A, @RiAND indirect RAM to A12
ANL A, #dataAND immediate to A22
ANL direct, AAND A to direct byte22
ANL direct, #dataAND immediate to direct byte33
ORL A, RnOR Register to A11
ORL A, directOR direct byte to A22
ORL A, @RiOR indirect RAM to A12
ORL A, #dataOR immediate to A22
ORL direct, AOR A to direct byte22
ORL direct, #dataOR immediate to direct byte33
XRL A, RnExclusive-OR Register to A11
XRL A, directExclusive-OR direct byte to A22
XRL A, @RiExclusive-OR indirect RAM to A12
XRL A, #dataExclusive-OR immediate to A22
XRL direct, AExclusive-OR A to direct byte22
XRL direct, #dataExclusive-OR immediate to direct byte33
CLR AClear A11
CPL AComplement A11
RL ARotate A left11
RLC ARotate A left through Carry11
RR ARotate A right11
RRC ARotate A right through Carry11
SWAP ASwap nibbles of A11
Data Transfer
MOV A, RnMove Register to A11
MOV A, directMove direct byte to A22
MOV A, @RiMove indirect RAM to A12
MOV A, #dataMove immediate to A22
MOV Rn, AMove A to Register11
MOV Rn, directMove direct byte to Register22
MOV Rn, #dataMove immediate to Register22
MOV direct, AMove A to direct byte22
MOV direct, RnMove Register to direct byte22
MOV direct, directMove direct byte to direct byte33
MOV direct, @RiMove indirect RAM to direct byte22
Clock
Cycles
74Rev. 1.5
C8051F310/1/2/3/4/5
Table 8.1. CIP-51 Instruction Set Summary (Continued)
MnemonicDescriptionBytes
MOV direct, #dataMove immediate to direct byte33
MOV @Ri, AMove A to indirect RAM12
MOV @Ri, directMove direct byte to indirect RAM22
MOV @Ri, #dataMove immediate to indirect RAM22
MOV DPTR, #data16Load DPTR with 16-bit constant33
MOVC A, @A+DPTRMove code byte relative DPTR to A13
MOVC A, @A+PCMove code byte relative PC to A13
MOVX A, @RiMove external data (8-bit address) to A13
MOVX @Ri, AMove A to external data (8-bit address)13
MOVX A, @DPTRMove external data (16-bit address) to A13
MOVX @DPTR, AMove A to external data (16-bit address)13
PUSH directPush direct byte onto stack22
POP directPop direct byte from stack22
XCH A, RnExchange Register with A11
XCH A, directExchange direct byte with A22
XCH A, @RiExchange indirect RAM with A12
XCHD A, @RiExchange low nibble of indirect RAM with A12
Boolean Manipulation
CLR CClear Carry11
CLR bitClear direct bit22
SETB CSet Carry11
SETB bitSet direct bit22
CPL CComplement Carry11
CPL bitComplement direct bit22
ANL C, bitAND direct bit to Carry22
ANL C, /bitAND complement of direct bit to Carry22
ORL C, bitOR direct bit to carry22
ORL C, /bitOR complement of direct bit to Carry22
MOV C, bitMove direct bit to Carry22
MOV bit, CMove Carry to direct bit22
JC relJump if Carry is set22/3
JNC relJump if Carry is not set22/3
JB bit, relJump if direct bit is set33/4
JNB bit, relJump if direct bit is not set33/4
JBC bit, relJump if direct bit is set and clear bit33/4
Program Branching
ACALL addr11Absolute subroutine call23
LCALL addr16Long subroutine call34
RETReturn from subroutine15
RETIReturn from interrupt15
AJMP addr11Absolute jump23
LJMP addr16Long jump34
SJMP relShort jump (relative address)23
JMP @A+DPTRJump indirect relative to DPTR13
JZ relJump if A equals zero22/3
Clock
Cycles
Rev. 1.575
C8051F310/1/2/3/4/5
Table 8.1. CIP-51 Instruction Set Summary (Continued)
MnemonicDescriptionBytes
JNZ relJump if A does not equal zero22/3
CJNE A, direct, relCompare direct byte to A and jump if not equal33/4
CJNE A, #data, relCompare immediate to A and jump if not equal33/4
CJNE Rn, #data, rel
CJNE @Ri, #data, rel
DJNZ Rn, relDecrement Register and jump if not zero22/3
DJNZ direct, relDecrement direct byte and jump if not zero33/4
NOPNo operation11
Notes on Registers, Operands and Addressing Modes:
Rn - Register R0-R7 of the currently selected register bank.
@Ri - Data RAM location addressed indirectly through R0 or R1.
rel - 8-bit, signed (two’s complement) offset relative to the first byte of the following instruction. Used by
SJMP and all conditional jumps.
direct - 8-bit internal data location’s address. This could be a direct-access Data RAM location (0x000x7F) or an SFR (0x80-0xFF).
Compare immediate to Register and jump if not
equal
Compare immediate to indirect and jump if not
equal
33/4
34/5
Clock
Cycles
#data - 8-bit constant
#data16 - 16-bit constant
bit - Direct-accessed bit in Data RAM or SFR
addr11 - 11-bit destination address used by ACALL and AJMP. The destination must be within the same
2K-byte page of program memory as the first byte of the following instruction.
addr16 - 16-bit destination address used by LCALL and LJMP. The destination may be anywhere within
the 8K-byte program memory space.
The memory organization of the CIP-51 System Controller is similar to that of a standard 8051. There are
two separate memory spaces: program memory and data memory. Program and data memory share the
same address space but are accessed via different instruction types. The CIP-51 memory organization is
shown in
Figure 8.2.
PROGRAM/DATA MEMORY
(Flash)
C8051F310/1
0x3E00
0x3DFF
0x0000
0x2000
0x1FFF
RESERVED
16 kB Flash
(In-System
Programmable in 512
Byte Sectors)
C8051F312/3/4/5
RESERVED
8 kB Flash
(In-System
Programmable in 512
Byte Sectors)
0xFF
0x80
0x7F
0x30
0x2F
0x20
0x1F
0x00
0xFFFF
0x0400
0x03FF
0x0000
DATA MEMORY (RAM)
INTERNAL DATA ADDRESS SPACE
Upper 128 RAM
(Indirect Addressing
Only)
(Direct and Indirect
Addressing)
Bit Addressable
General Purpose
Registers
Special Function
Register's
(Direct Addressing Only)
Lower 128 RAM
(Direct and Indirect
Addressing)
EXTERNAL DATA ADDRESS SPACE
Same 1024 bytes as from
0x0000 to 0x03FF, wrapped
on 1 kB boundaries
XRAM - 1024 Bytes
(accessable using MOVX
instruction)
0x0000
Figure 8.2. Memory Map
8.2.1. Program Memory
The CIP-51 core has a 64k-byte program memory space. The C8051F310/1 and C8051F312/3/4/5 implement 16 and 8 kB, respectively, of this program memory space as in-system, re-programmable Flash
memory, organized in a contiguous block from addresses 0x0000 to 0x3FFF or 0x0000 to 0x1FFF.
Addresses above 0x3E00 are reserved on the 16
Program memory is normally assumed to be read-only. However, the CIP-51 can write to program memory
by setting the Program Store Write Enable bit (PSCTL.0) and using the MOVX instruction. This feature pro
vides a mechanism for the CIP-51 to update program code and use the program memory space for nonvolatile data storage. Refer to
Section “10. Flash Memory” on page 103 for further details.
kB devices.
-
Rev. 1.577
C8051F310/1/2/3/4/5
8.2.2. Data Memory
The CIP-51 includes 256 bytes of internal RAM mapped into the data memory space from 0x00 through
0xFF. The lower 128
ory. Either direct or indirect addressing may be used to access the lower 128 bytes of data memory. Locations 0x00 through 0x1F are addressable as four banks of general purpose registers, each bank consisting
of eight byte-wide registers. The next 16
bytes or as 128
The upper 128 bytes of data memory are accessible only by indirect addressing. This region occupies the
same address space as the Special Function Registers (SFR) but is physically separate from the SFR
space. The addressing mode used by an instruction when accessing locations above 0x7F determines
whether the CPU accesses the upper 128
direct addressing will access the SFR space. Instructions using indirect addressing above 0x7F access the
upper 128
bytes of data memory. Figure 8.2 illustrates the data memory organization of the CIP-51.
8.2.3. General Purpose Registers
The lower 32 bytes of data memory, locations 0x00 through 0x1F, may be addressed as four banks of general-purpose registers. Each bank consists of eight byte-wide registers designated R0 through R7. Only
one of these banks may be enabled at a time. Two bits in the program status word, RS0 (PSW.3) and RS1
(PSW.4), select the active register bank (see description of the PSW in
fast context switching when entering subroutines and interrupt service routines. Indirect addressing modes
use registers R0 and R1 as index registers.
bytes of data memory are used for general purpose registers and scratch pad mem-
bytes, locations 0x20 through 0x2F, may either be addressed as
bit locations accessible with the direct addressing mode.
bytes of data memory space or the SFRs. Instructions that use
SFR Definition 8.4). This allows
8.2.4. Bit Addressable Locations
In addition to direct access to data memory organized as bytes, the sixteen data memory locations at 0x20
through 0x2F are also accessible as 128
0x00 to 0x7F. Bit
0x07. Bit 7 of the byte at 0x2F has bit address 0x7F. A bit access is distinguished from a full byte access by
the type of instruction used (bit source or destination operands as opposed to a byte source or destina
tion).
The MCS-51™ assembly language allows an alternate notation for bit addressing of the form XX.B where
XX is the byte address and B is the bit position within the byte. For example, the instruction:
MOVC, 22.3h
moves the Boolean value at 0x13 (bit 3 of the byte at location 0x22) into the Carry flag.
0 of the byte at 0x20 has bit address 0x00 while bit7 of the byte at 0x20 has bit address
individually addressable bits. Each bit has a bit address from
8.2.5. Stack
A programmer's stack can be located anywhere in the 256-byte data memory. The stack area is designated using the Stack Pointer (SP, 0x81) SFR. The SP will point to the last location used. The next value
pushed on the stack is placed at SP+1 and then SP is incremented. A reset initializes the stack pointer to
location 0x07. Therefore, the first value pushed on the stack is placed at location 0x08, which is also the
first register (R0) of register bank 1. Thus, if more than one register bank is to be used, the SP should be
initialized to a location in the data memory not being used for data storage. The stack depth can extend up
to 256
bytes.
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78Rev. 1.5
C8051F310/1/2/3/4/5
8.2.6. Special Function Registers
The direct-access data memory locations from 0x80 to 0xFF constitute the special function registers
(SFRs). The SFRs provide control and data exchange with the CIP-51's resources and peripherals. The
CIP-51 duplicates the SFRs found in a typical 8051 implementation as well as implementing additional
SFRs used to configure and access the sub-systems unique to the MCU. This allows the addition of new
functionality while retaining compatibility with the MCS-51™ instruction set.
mented in the CIP-51 System Controller.
The SFR registers are accessed anytime the direct addressing mode is used to access memory locations
from 0x80 to 0xFF. SFRs with addresses ending in 0x0 or 0x8 (e.g. P0, TCON, SCON0, IE, etc.) are bitaddressable as well as byte-addressable. All other SFRs are byte-addressable only. Unoccupied
addresses in the SFR space are reserved for future use. Accessing these areas will have an indeterminate
effect and should be avoided. Refer to the corresponding pages of the datasheet, as indicated in
for a detailed description of each register.
Table 8.2. Special Function Register (SFR) Memory Map
SFRs are listed in alphabetical order. All undefined SFR locations are reserved
ACC0xE0
ADC0CF0xBCADC0 Configuration52
ADC0CN0xE8ADC0 Control53
ADC0GTH0xC4ADC0 Greater-Than Compare High54
ADC0GTL0xC3ADC0 Greater-Than Compare Low54
ADC0H0xBEADC0 High52
ADC0L0xBDADC0 Low52
ADC0LTH0xC6ADC0 Less-Than Compare Word High55
ADC0LTL0xC5ADC0 Less-Than Compare Word Low55
AMX0N0xBAAMUX0 Negative Channel Select51
AMX0P0xBBAMUX0 Positive Channel Select50
B0xF0B Register85
CKCON0x8EClock Control183
CLKSEL0xA9Clock Select113
CPT0CN0x9BComparator0 Control64
CPT0MD0x9DComparator0 Mode Selection66
CPT0MX0x9FComparator0 MUX Selection65
CPT1CN0x9AComparator1 Control67
CPT1MD0x9CComparator1 Mode Selection69
CPT1MX0x9EComparator1 MUX Selection68
DPH0x83Data Pointer High83
DPL0x82Data Pointer Low82
EIE10xE6Extended Interrupt Enable 191
EIP10xF6Extended Interrupt Priority 192
EMI0CN0xAAExternal Memory Interface Control109
FLKEY0xB7Flash Lock and Key 107
FLSCL0xB6Flash Scale108
IE0xA8Interrupt Enable89
IP0xB8Interrupt Priority90
IT01CF0xE4INT0/INT1 Configuration93
OSCICL0xB3Internal Oscillator Calibration112
OSCICN0xB2Internal Oscillator Control112
OSCXCN0xB1External Oscillator Control115
P00x80Port 0 Latch126
P0MDIN0xF1Port 0 Input Mode Configuration126
P0MDOUT0xA4Port 0 Output Mode Configuration127
P0SKIP0xD4Port 0 Skip127
P10x90Port 1 Latch128
P1MDIN0xF2Port 1 Input Mode Configuration128
P1MDOUT0xA5Port 1 Output Mode Configuration129
P1SKIP0xD5Port 1 Skip129
P20xA0Port 2 Latch130
P2MDIN0xF3Port 2 Input Mode Configuration130
P2MDOUT0xA6Port 2 Output Mode Configuration130
Accumulator84
80Rev. 1.5
C8051F310/1/2/3/4/5
Table 8.3. Special Function Registers (Continued)
RegisterAddressDescriptionPage
P2SKIP0xD6Port 2 Skip 131
P30xB0Port 3 Latch131
P3MDIN0xF4Port 3 Input Mode Configuration132
P3MDOUT0xA7Port 3 Output Mode Configuration132
PCA0CN0xD8PCA Control205
PCA0CPH00xFCPCA Capture 0 High209
PCA0CPH10xEAPCA Capture 1 High209
PCA0CPH20xECPCA Capture 2 High209
PCA0CPH30xEEPCA Capture 3High209
PCA0CPH40xFEPCA Capture 4 High209
PCA0CPL00xFBPCA Capture 0 Low208
PCA0CPL10xE9PCA Capture 1 Low208
PCA0CPL20xEBPCA Capture 2 Low208
PCA0CPL30xEDPCA Capture 3Low208
PCA0CPL40xFDPCA Capture 4 Low208
PCA0CPM00xDAPCA Module 0 Mode207
PCA0CPM10xDBPCA Module 1 Mode207
PCA0CPM20xDCPCA Module 2 Mode207
PCA0CPM30xDDPCA Module 3 Mode207
PCA0CPM40xDEPCA Module 4 Mode207
PCA0H0xFAPCA Counter High208
PCA0L0xF9PCA Counter Low208
PCA0MD0xD9PCA Mode 206
PCON0x87Power Control95
PSCTL0x8FProgram Store R/W Control107
PSW0xD0Program Status Word84
REF0CN0xD1Voltage Reference Control60
RSTSRC0xEFReset Source Configuration/Status101
SBUF00x99UART0 Data Buffer159
SCON00x98UART0 Control158
SMB0CF0xC1SMBus Configuration142
SMB0CN0xC0SMBus Control144
SMB0DAT0xC2SMBus Data146
SP0x81Stack Pointer83
SPI0CFG0xA1SPI Configuration170
SPI0CKR0xA2SPI Clock Rate Control172
SPI0CN0xF8SPI Control171
SPI0DAT0xA3SPI Data172
TCON0x88Timer/Counter Control181
TH00x8CTimer/Counter 0 High184
TH10x8DTimer/Counter 1 High184
TL00x8ATimer/Counter 0 Low184
TL10x8BTimer/Counter 1 Low184
TMOD0x89Timer/Counter Mode182
TMR2CN0xC8Timer/Counter 2 Control187
TMR2H0xCDTimer/Counter 2 High188
Rev. 1.581
C8051F310/1/2/3/4/5
Table 8.3. Special Function Registers (Continued)
RegisterAddressDescriptionPage
TMR2L0xCCTimer/Counter 2 Low188
TMR2RLH0xCBTimer/Counter 2 Reload High188
TMR2RLL0xCATimer/Counter 2 Reload Low188
TMR3CN0x91Timer/Counter 3Control191
TMR3H0x95Timer/Counter 3 High192
TMR3L0x94Timer/Counter 3Low192
TMR3RLH0x93Timer/Counter 3 Reload High192
TMR3RLL0x92Timer/Counter 3 Reload Low192
VDM0CN0xFF
XBR10xE2Port I/O Crossbar Control 1125
XBR00xE1Port I/O Crossbar Control 0124
0x84-0x86, 0x96-0x97,
0xAB-0xAF, 0xB4, 0xB9,
0xBF, 0xC7, 0xC9, 0xCE,
0xCF, 0xD2, 0xD3, 0xD7,
0xDF, 0xE3, 0xE5, 0xF5
VDD Monitor Control
Reserved
99
8.2.7. Register Descriptions
Following are descriptions of SFRs related to the operation of the CIP-51 System Controller. Reserved bits
should not be set to logic
which case the reset value of the bit will be logic
tions of the remaining SFRs are included in the sections of the data sheet associated with their corresponding system function.
1. Future product versions may use these bits to implement new features in
0, selecting the feature's default state. Detailed descrip-
SFR Definition 8.1. DPL: Data Pointer Low Byte
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
0x82
Bits7-0:DPL: Data Pointer Low.
The DPL register is the low byte of the 16-bit DPTR. DPTR is used to access indirectly
addressed Flash memory.
82Rev. 1.5
C8051F310/1/2/3/4/5
SFR Definition 8.2. DPH: Data Pointer High Byte
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
Bits7-0:DPH: Data Pointer High.
The DPH register is the high byte of the 16-bit DPTR. DPTR is used to access indirectly
addressed Flash memory.
SFR Definition 8.3. SP: Stack Pointer
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
00000111
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
0x83
0x81
Bits7-0:SP: Stack Pointer.
The Stack Pointer holds the location of the top of the stack. The stack pointer is incremented
before every PUSH operation. The SP register defaults to 0x07 after reset.
Rev. 1.583
C8051F310/1/2/3/4/5
SFR Definition 8.4. PSW: Program Status Word
R/WR/WR/WR/WR/WR/WR/W RReset Value
CYACF0RS1RS0OVF1PARITY00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
(bit addressable)
Bit7:CY: Carry Flag.
This bit is set when the last arithmetic operation resulted in a carry (addition) or a borrow
(subtraction). It is cleared to logic 0 by all other arithmetic operations.
Bit6:AC: Auxiliary Carry Flag
This bit is set when the last arithmetic operation resulted in a carry into (addition) or a borrow
from (subtraction) the high order nibble. It is cleared to logic 0 by all other arithmetic operations.
Bit5:F0: User Flag 0.
This is a bit-addressable, general purpose flag for use under software control.
Bits4-3:RS1-RS0: Register Bank Select.
These bits select which register bank is used during register accesses.
This bit is set to 1 under the following circumstances: an ADD, ADDC, or SUBB instruction
causes a sign-change overflow, a MUL instruction results in an overflow (result is greater
than 255), or a DIV instruction causes a divide-by-zero condition. The OV bit is cleared to 0
by the ADD, ADDC, SUBB, MUL, and DIV instructions in all other cases.
Bit1:F1: User Flag 1.
This is a bit-addressable, general purpose flag for use under software control.
Bit0:PARITY: Parity Flag.
This bit is set to logic 1 if the sum of the eight bits in the accumulator is odd and cleared if the
sum is even.
SFR Definition 8.5. ACC: Accumulator
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
ACC.7ACC.6ACC.5ACC.4ACC.3ACC.2ACC.1ACC.000000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
(bit addressable)
Bits7-0:ACC: Accumulator.
This register is the accumulator for arithmetic operations.
0xE0
84Rev. 1.5
C8051F310/1/2/3/4/5
SFR Definition 8.6. B: B Register
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
B.7B.6B.5B.4B.3B.2B.1B.000000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
(bit addressable)
Bits7-0:B: B Register.
This register serves as a second accumulator for certain arithmetic operations.
0xF0
Rev. 1.585
C8051F310/1/2/3/4/5
8.3.Interrupt Handler
The CIP-51 includes an extended interrupt system supporting a total of 14 interrupt sources with two priority levels. The allocation of interrupt sources between on-chip peripherals and external inputs pins varies
according to the specific version of the device. Each interrupt source has one or more associated interruptpending flag(s) located in an SFR. When a peripheral or external source meets a valid interrupt condition,
the associated interrupt-pending flag is set to logic
If interrupts are enabled for the source, an interrupt request is generated when the interrupt-pending flag is
set. As soon as execution of the current instruction is complete, the CPU generates an LCALL to a prede
termined address to begin execution of an interrupt service routine (ISR). Each ISR must end with an RETI
instruction, which returns program execution to the next instruction that would have been executed if the
interrupt request had not occurred. If interrupts are not enabled, the interrupt-pending flag is ignored by the
hardware and program execution continues as normal. (The interrupt-pending flag is set to logic
less of the interrupt's enable/disable state.)
Each interrupt source can be individually enabled or disabled through the use of an associated interrupt
enable bit in an SFR (IE-EIE1). However, interrupts must first be globally enabled by setting the EA bit
(IE.7) to logic
all interrupt sources regardless of the individual interrupt-enable settings.
1 before the individual interrupt enables are recognized. Setting the EA bit to logic 0 disables
1.
1 regard-
-
Note: Any instruction that clears the EA bit should be immediately followed by an instruction that
has two or more opcode bytes. For example:
// in 'C':
EA = 0; // clear EA bit
EA = 0; // ... followed by another 2-byte opcode
; in assembly:
CLR EA ; clear EA bit
CLR EA ; ... followed by another 2-byte opcode
If an interrupt is posted during the execution phase of a "CLR EA" opcode (or any instruction which clears
the EA bit), and the instruction is followed by a single-cycle instruction, the interrupt may be taken. How
ever, a read of the EA bit will return a '0' inside the interrupt service routine. When the "CLR EA" opcode is
followed by a multi-cycle instruction, the interrupt will not be taken.
Some interrupt-pending flags are automatically cleared by the hardware when the CPU vectors to the ISR.
However, most are not cleared by the hardware and must be cleared by software before returning from the
ISR. If an interrupt-pending flag remains set after the CPU completes the return-from-interrupt (RETI)
instruction, a new interrupt request will be generated immediately and the CPU will re-enter the ISR after
the completion of the next instruction.
8.3.1. MCU Interrupt Sources and Vectors
The MCUs support 14 interrupt sources. Software can simulate an interrupt by setting any interrupt-pending flag to logic 1. If interrupts are enabled for the flag, an interrupt request will be generated and the CPU
will vector to the ISR address associated with the interrupt-pending flag. MCU interrupt sources, associ
ated vector addresses, priority order and control bits are summarized in Ta bl e 8.4 on page 88. Refer to the
datasheet section associated with a particular on-chip peripheral for information regarding valid interrupt
conditions for the peripheral and the behavior of its interrupt-pending flag(s).
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86Rev. 1.5
C8051F310/1/2/3/4/5
8.3.2. External Interrupts
The /INT0 and /INT1 external interrupt sources are configurable as active high or low, edge or level sensitive. The IN0PL (/INT0 Polarity) and IN1PL (/INT1 Polarity) bits in the IT01CF register select active high or
active low; the IT0 and IT1 bits in TCON (
or edge sensitive. The table below lists the possible configurations.
/INT0 and /INT1 are assigned to Port pins as defined in the IT01CF register (see SFR Definition 8.11).
Note that /INT0 and /INT0 Port pin assignments are independent of any Crossbar assignments. /INT0 and
/INT1 will monitor their assigned Port pins without disturbing the peripheral that was assigned the Port pin
via the Crossbar. To assign a Port pin only to /INT0 and/or /INT1, configure the Crossbar to skip the
selected pin(s). This is accomplished by setting the associated bit in register XBR0 (see
“13.1. Priority Crossbar Decoder” on page 121 for complete details on configuring the Crossbar).
IE0 (TCON.1) and IE1 (TCON.3) serve as the interrupt-pending flags for the /INT0 and /INT1 external
interrupts, respectively. If an /INT0 or /INT1 external interrupt is configured as edge-sensitive, the corre
sponding interrupt-pending flag is automatically cleared by the hardware when the CPU vectors to the ISR.
When configured as level sensitive, the interrupt-pending flag remains logic 1 while the input is active as
defined by the corresponding polarity bit (IN0PL or IN1PL); the flag remains logic 0 while the input is inac
tive. The external interrupt source must hold the input active until the interrupt request is recognized. It
must then deactivate the interrupt request before execution of the ISR completes or another interrupt
request will be generated.
Active low, edge sensitive10Active low, edge sensitive
Section “17.1. Timer 0 and Timer 1” on page 177) select level
Section
-
-
8.3.3. Interrupt Priorities
Each interrupt source can be individually programmed to one of two priority levels: low or high. A low priority interrupt service routine can be preempted by a high priority interrupt. A high priority interrupt cannot be
preempted. Each interrupt has an associated interrupt priority bit in an SFR (IP or EIP1) used to configure
its priority level. Low priority is the default. If two interrupts are recognized simultaneously, the interrupt with
the higher priority is serviced first. If both interrupts have the same priority level, a fixed priority order is
used to arbitrate, given in
Tab le 8.4.
8.3.4. Interrupt Latency
Interrupt response time depends on the state of the CPU when the interrupt occurs. Pending interrupts are
sampled and priority decoded each system clock cycle. Therefore, the fastest possible response time is 5
system clock cycles: 1
ISR. If an interrupt is pending when a RETI is executed, a single instruction is executed before an LCALL
is made to service the pending interrupt. Therefore, the maximum response time for an interrupt (when no
other interrupt is currently being serviced or the new interrupt is of greater priority) occurs when the CPU is
performing an RETI instruction followed by a DIV as the next instruction. In this case, the response time is
18
system clock cycles: 1 clock cycle to detect the interrupt, 5 clock cycles to execute the RETI, 8 clock
cycles to complete the DIV instruction and 4
executing an ISR for an interrupt with equal or higher priority, the new interrupt will not be serviced until the
current ISR completes, including the RETI and following instruction.
clock cycle to detect the interrupt and 4 clock cycles to complete the LCALL to the
clock cycles to execute the LCALL to the ISR. If the CPU is
The SFRs used to enable the interrupt sources and set their priority level are described below. Refer to the
data sheet section associated with a particular on-chip peripheral for information regarding valid interrupt
conditions for the peripheral and the behavior of its interrupt-pending flag(s).
SFR Definition 8.7. IE: Interrupt Enable
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
EAESPI0ET2ES0ET1EX1ET0EX000000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
(bit addressable)
Bit7:EA: Enable All Interrupts.
This bit globally enables/disables all interrupts. It overrides the individual interrupt mask settings.
0: Disable all interrupt sources.
1: Enable each interrupt according to its individual mask setting.
Bit6:ESPI0: Enable Serial Peripheral Interface (SPI0) Interrupt.
This bit sets the masking of the SPI0 interrupts.
0: Disable all SPI0 interrupts.
1: Enable interrupt requests generated by SPI0.
Bit5:ET2: Enable Timer 2 Interrupt.
This bit sets the masking of the Timer 2 interrupt.
0: Disable Timer 2 interrupt.
1: Enable interrupt requests generated by the TF2L or TF2H flags.
Bit4:ES0: Enable UART0 Interrupt.
This bit sets the masking of the UART0 interrupt.
0: Disable UART0 interrupt.
1: Enable UART0 interrupt.
Bit3:ET1: Enable Timer 1 Interrupt.
This bit sets the masking of the Timer 1 interrupt.
0: Disable all Timer 1 interrupt.
1: Enable interrupt requests generated by the TF1 flag.
Bit2:EX1: Enable External Interrupt 1.
This bit sets the masking of External Interrupt 1.
0: Disable external interrupt 1.
1: Enable interrupt requests generated by the /INT1 input.
Bit1:ET0: Enable Timer 0 Interrupt.
This bit sets the masking of the Timer 0 interrupt.
0: Disable all Timer 0 interrupt.
1: Enable interrupt requests generated by the TF0 flag.
Bit0:EX0: Enable External Interrupt 0.
This bit sets the masking of External Interrupt 0.
0: Disable external interrupt 0.
1: Enable interrupt requests generated by the /INT0 input.
This bit sets the priority of the SPI0 interrupt.
0: SPI0 interrupt set to low priority level.
1: SPI0 interrupt set to high priority level.
Bit5:PT2: Timer 2 Interrupt Priority Control.
This bit sets the priority of the Timer 2 interrupt.
0: Timer 2 interrupts set to low priority level.
1: Timer 2 interrupts set to high priority level.
Bit4:PS0: UART0 Interrupt Priority Control.
This bit sets the priority of the UART0 interrupt.
0: UART0 interrupts set to low priority level.
1: UART0 interrupts set to high priority level.
Bit3:PT1: Timer 1 Interrupt Priority Control.
This bit sets the priority of the Timer 1 interrupt.
0: Timer 1 interrupts set to low priority level.
1: Timer 1 interrupts set to high priority level.
Bit2:PX1: External Interrupt 1 Priority Control.
This bit sets the priority of the External Interrupt 1 interrupt.
0: External Interrupt 1 set to low priority level.
1: External Interrupt 1 set to high priority level.
Bit1:PT0: Timer 0 Interrupt Priority Control.
This bit sets the priority of the Timer 0 interrupt.
0: Timer 0 interrupt set to low priority level.
1: Timer 0 interrupt set to high priority level.
Bit0:PX0: External Interrupt 0 Priority Control.
This bit sets the priority of the External Interrupt 0 interrupt.
0: External Interrupt 0 set to low priority level.
1: External Interrupt 0 set to high priority level.
This bit sets the masking of the ADC0 Conversion Complete interrupt.
0: Disable ADC0 Conversion Complete interrupt.
1: Enable interrupt requests generated by the AD0INT flag.
Note: Refer to Figure 17.1 for INT0/1 edge- or level-sensitive interrupt selection.
Bit7:IN1PL: /INT1 Polarity
0: /INT1 input is active low.
1: /INT1 input is active high.
Bits6-4:IN1SL2-0: /INT1 Port Pin Selection Bits
These bits select which Port pin is assigned to /INT1. Note that this pin assignment is inde-
pendent of the Crossbar; /INT1 will monitor the assigned Port pin without disturbing the
peripheral that has been assigned the Port pin via the Crossbar. The Crossbar will not
assign the Port pin to a peripheral if it is configured to skip the selected pin (accomplished by
setting to ‘1’ the corresponding bit in register P0SKIP).
IN1SL2-0/INT1 Port Pin
000P0.0
001P0.1
010P0.2
011P0.3
100P0.4
101P0.5
110P0.6
111P0.7
Bit3:IN0PL: /INT0 Polarity
0: /INT0 interrupt is active low.
1: /INT0 interrupt is active high.
Bits2-0:INT0SL2-0: /INT0 Port Pin Selection Bits
These bits select which Port pin is assigned to /INT0. Note that this pin assignment is independent of the Crossbar. /INT0 will monitor the assigned Port pin without disturbing the
peripheral that has been assigned the Port pin via the Crossbar. The Crossbar will not
assign the Port pin to a peripheral if it is configured to skip the selected pin (accomplished by
setting to ‘1’ the corresponding bit in register P0SKIP).
IN0SL2-0/INT0 Port Pin
000P0.0
001P0.1
010P0.2
011P0.3
100P0.4
101P0.5
110P0.6
111P0.7
Rev. 1.593
C8051F310/1/2/3/4/5
8.4.Power Management Modes
The CIP-51 core has two software programmable power management modes: Idle and Stop. Idle mode
halts the CPU while leaving the peripherals and clocks active. In Stop mode, the CPU is halted, all inter
rupts and timers (except the Missing Clock Detector) are inactive, and the internal oscillator is stopped
(analog peripherals remain in their selected states; the external oscillator is not effected). Since clocks are
running in Idle mode, power consumption is dependent upon the system clock frequency and the number
of peripherals left in active mode before entering Idle. Stop mode consumes the least power.
tion 8.12 describes the Power Control Register (PCON) used to control the CIP-51's power management
modes.
Although the CIP-51 has Idle and Stop modes built in (as with any standard 8051 architecture), power
management of the entire MCU is better accomplished by enabling/disabling individual peripherals as
needed. Each analog peripheral can be disabled when not in use and placed in low power mode. Digital
peripherals, such as timers or serial buses, draw little power when they are not in use. Turning off the oscil
lators lowers power consumption considerably; however, a reset is required to restart the MCU.
8.4.1. Idle Mode
Setting the Idle Mode Select bit (PCON.0) causes the CIP-51 to halt the CPU and enter Idle mode as soon
as the instruction that sets the bit completes execution. All internal registers and memory maintain their
original data. All analog and digital peripherals can remain active during Idle mode.
SFR Defini-
-
-
Idle mode is terminated when an enabled interrupt is asserted or a reset occurs. The assertion of an
enabled interrupt will cause the Idle Mode Selection bit (PCON.0) to be cleared and the CPU to resume
operation. The pending interrupt will be serviced and the next instruction to be executed after the return
from interrupt (RETI) will be the instruction immediately following the one that set the Idle Mode Select bit.
If Idle mode is terminated by an internal or external reset, the CIP-51 performs a normal reset sequence
and begins program execution at address 0x0000.
If enabled, the Watchdog Timer (WDT) will eventually cause an internal watchdog reset and thereby terminate the Idle mode. This feature protects the system from an unintended permanent shutdown in the event
of an inadvertent write to the PCON register. If this behavior is not desired, the WDT may be disabled by
software prior to entering the Idle mode if the WDT was initially configured to allow this operation. This pro
vides the opportunity for additional power savings, allowing the system to remain in the Idle mode indefinitely, waiting for an external stimulus to wake up the system. Refer to Section “9.6. PCA Watchdog
Timer Reset” on page 100 for more information on the use and configuration of the WDT.
Note: Any instruction that sets the IDLE bit should be immediately followed by an instruction that
has 2 or more opcode bytes. For example:
// in 'C':
PCON |= 0x01; // set IDLE bit
PCON = PCON; // ... followed by a 3-cycle dummy instruction
; in assembly:
ORL PCON, #01h ; set IDLE bit
MOV PCON, PCON; ... followed by a 3-cycle dummy instruction
-
If the instruction following the write of the IDLE bit is a single-byte instruction and an interrupt occurs during
the execution phase of the instruction that sets the IDLE bit, the CPU may not wake from IDLE mode when
a future interrupt occurs.
94Rev. 1.5
C8051F310/1/2/3/4/5
8.4.2. Stop Mode
Setting the Stop Mode Select bit (PCON.1) causes the CIP-51 to enter Stop mode as soon as the instruction that sets the bit completes execution. In Stop mode the internal oscillator, CPU, and all digital peripherals are stopped; the state of the external oscillator circuit is not affected. Each analog peripheral (including
the external oscillator circuit) may be shut down individually prior to entering Stop Mode. Stop mode can
only be terminated by an internal or external reset. On reset, the CIP-51 performs the normal reset
sequence and begins program execution at address 0x0000.
If enabled, the Missing Clock Detector will cause an internal reset and thereby terminate the Stop mode.
The Missing Clock Detector should be disabled if the CPU is to be put to in STOP mode for longer than the
MCD timeout of 100
R/WR/WR/WR/WR/WR/WR/WR/WReset Value
GF5GF4GF3GF2GF1GF0STOPIDLE00000000
Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0SFR Address:
µsec.
SFR Definition 8.12. PCON: Power Control
0x87
Bits7-2:GF5-GF0: General Purpose Flags 5-0.
These are general purpose flags for use under software control.
Bit1:STOP: Stop Mode Select.
Setting this bit will place the CIP-51 in Stop mode. This bit will always be read as 0.
1: CPU goes into Stop mode (internal oscillator stopped).
Bit0:IDLE: Idle Mode Select.
Setting this bit will place the CIP-51 in Idle mode. This bit will always be read as 0.
1: CPU goes into Idle mode. (Shuts off clock to CPU, but clock to Timers, Interrupts, Serial
Ports, and Analog Peripherals are still active.)
Rev. 1.595
C8051F310/1/2/3/4/5
Notes
96Rev. 1.5
C8051F310/1/2/3/4/5
9.Reset Sources
Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this
reset state, the following occur:
•CIP-51 halts program execution
•Special Function Registers (SFRs) are initialized to their defined reset values
•External Port pins are forced to a known state
•Interrupts and timers are disabled.
All SFRs are reset to the predefined values noted in the SFR detailed descriptions. The contents of internal
data memory are unaffected during a reset; any previously stored data is preserved. However, since the
stack pointer SFR is reset, the stack is effectively lost, even though the data on the stack is not altered.
The Port I/O latches are reset to 0xFF (all logic ones) in open-drain mode. Weak pullups are enabled during and after the reset. For VDD Monitor and power-on resets, the RST pin is driven low until the device
exits the reset state.
On exit from the reset state, the program counter (PC) is reset, and the system clock defaults to the internal oscillator. Refer to Section “12. Oscillators” on page 111 for information on selecting and configuring
the system clock source. The Watchdog Timer is enabled with the system clock divided by 12 as its clock
source (
Program execution begins at location 0x0000.
Section “18.3. Watchdog Timer Mode” on page 202 details the use of the Watchdog Timer).
Px.x
Px.x
Comparator 0
+
-
System
Clock
C0RSEF
Missing
Clock
Detector
(oneshot)
EN
MCD
Enable
WDT
CIP-51
Microcontroller
Core
Extended Interrupt
Handler
PCA
EN
WDT
VDD
Enable
Supply
Monitor
+
-
System Reset
Enable
(Software Reset)
SWRSF
Power On
Reset
'0'
Errant
FLASH
Operation
(wired-OR)
/RST
Reset
Funnel
Figure 9.1. Reset Sources
Rev. 1.597
C8051F310/1/2/3/4/5
9.1.Power-On Reset
During power-up, the device is held in a reset state and the RST pin is driven low until VDD settles above
V
. An additional delay occurs before the device is released from reset; the delay decreases as the V
RST
ramp time increases (VDD ramp time is defined as how fast VDD ramps from 0 V to V
). Figure 9.2. plots
RST
the power-on and VDD monitor reset timing. For valid ramp times (less than 1 ms), the power-on reset
delay (T
PORDelay
) is typically less than 0.3 ms.
Note: The maximum VDD ramp time is 1 ms; slower ramp times may cause the device to be released from
reset before V
reaches the V
DD
RST
level.
On exit from a power-on reset, the PORSF flag (RSTSRC.1) is set by hardware to logic 1. When PORSF is
set, all of the other reset flags in the RSTSRC Register are indeterminate (PORSF is cleared by all other
resets). Since all resets cause program execution to begin at the same location (0x0000) software can
read the PORSF flag to determine if a power-up was the cause of reset. The content of internal data mem
ory should be assumed to be undefined after a power-on reset. The VDD monitor is disabled following a
power-on reset.
DD
-
volts
2.70
2.55
2.0
1.0
Logic HIGH
Logic LOW
/RST
V
RST
D
D
V
T
PORDelay
Power-On
Reset
VDD
Monitor
Reset
Figure 9.2. Power-On and VDD Monitor Reset Timing
VDD
t
98Rev. 1.5
9.2.Power-Fail Reset / VDD Monitor
C8051F310/1/2/3/4/5
When a power-down transition or power irregularity causes VDD to drop below V
monitor will drive the
to a level above V
RST pin low and hold the CIP-51 in a reset state (see Figure 9.2). When VDD returns
, the CIP-51 will be released from the reset state. Note that even though internal data
RST
memory contents are not altered by the power-fail reset, it is impossible to determine if V
the level required for data retention. If the PORSF flag reads ‘1’, the data may no longer be valid. The V
, the power supply
RST
dropped below
DD
DD
monitor is disabled after power-on resets; however its defined state (enabled/disabled) is not altered by
any other reset source. For example, if the V
monitor will still be enabled after the reset.
V
DD
monitor is enabled and a software reset is performed, the
DD
Important Note: The VDD monitor must be enabled before it is selected as a reset source. Selecting the
V
monitor as a reset source before it is enabled and stabilized may cause a system reset. The proce-
DD
dure for configuring the VDD monitor as a reset source is shown below:
Step 1. Enable the VDD monitor (VDMEN bit in VDM0CN = ‘1’).
Step 2. Wait for the V
monitor to stabilize (see Table 9.1 for the VDD Monitor turn-on time).
DD
Note: This delay should be omitted if software contains routines that erase or write Flash
memory.
Step 3. Select the V
monitor as a reset source (PORSF bit in RSTSRC = ‘1’).
DD
See Figure 9.2 for VDD monitor timing; note that the reset delay is not incurred after a VDD monitor reset.
See Ta bl e 9.1 for complete electrical characteristics of the VDD monitor.
monitor circuit on/off. The VDD Monitor cannot generate system
DD
resets until it is also selected as a reset source in register RSTSRC (Figure 9.2). The V
Monitor must be allowed to stabilize before it is selected as a reset source. Selecting the
V
monitor as a reset source before it has stabilized may generate a system reset.
DD
Monitor turn-on time.
DD
Bit6: V
See Table 9.1 for the minimum V
0: V
Monitor Disabled.
DD
Monitor Enabled.
1: V
DD
STAT: VDD Status.
DD
This bit indicates the current power supply status (V
The external RST pin provides a means for external circuitry to force the device into a reset state. Asserting an active-low signal on the RST pin generates a reset; an external pullup and/or decoupling of the RST
pin may be necessary to avoid erroneous noise-induced resets. See Ta bl e 9.1 for complete RST pin specifications. The PINRSF flag (RSTSRC.0) is set on exit from an external reset.
9.4.Missing Clock Detector Reset
The Missing Clock Detector (MCD) is a one-shot circuit that is triggered by the system clock. If the system
clock remains high or low for more than 100
MCD reset, the MCDRSF flag (RSTSRC.2) will read ‘1’, signifying the MCD as the reset source; otherwise,
this bit reads ‘0’. Writing a ‘1’ to the MCDRSF bit enables the Missing Clock Detector; writing a ‘0’ disables
it. The state of the
RST pin is unaffected by this reset.
9.5.Comparator0 Reset
Comparator0 can be configured as a reset source by writing a ‘1’ to the C0RSEF flag (RSTSRC.5).
Comparator0 should be enabled and allowed to settle prior to writing to C0RSEF to prevent any turn-on
chatter on the output from generating an unwanted reset. The Comparator0 reset is active-low: if the noninverting input voltage (on CP0+) is less than the inverting input voltage (on CP0-), the device is put into
the reset state. After a Comparator0 reset, the C0RSEF flag (RSTSRC.5) will read ‘1’ signifying
Comparator0 as the reset source; otherwise, this bit reads ‘0’. The state of the
this reset.
µs, the one-shot will time out and generate a reset. After a
RST pin is unaffected by
9.6.PCA Watchdog Timer Reset
The programmable Watchdog Timer (WDT) function of the Programmable Counter Array (PCA) can be
used to prevent software from running out of control during a system malfunction. The PCA WDT function
can be enabled or disabled by software as described in
page 202; the WDT is enabled and clocked by SYSCLK / 12 following any reset. If a system malfunction
prevents user software from updating the WDT, a reset is generated and the WDTRSF bit (RSTSRC.5) is
set to ‘1’. The state of the
RST pin is unaffected by this reset.
Section “18.3. Watchdog Timer Mode” on
9.7.Flash Error Reset
If a Flash read/write/erase or program read targets an illegal address, a system reset is generated. This
may occur due to any of the following:
•A Flash write or erase is attempted above user code space. This occurs when PSWE is set to ‘1’ and a
MOVX write operation targets an address above address 0x3DFF for C8051F310/1 or 0x1FFF for
C8051F312/3/4/5.
•A Flash read is attempted above user code space. This occurs when a MOVC operation targets an
address above address 0x3DFF for C8051F310/1 or 0x1FFF for C8051F312/3/4/5.
•A Program read is attempted above user code space. This occurs when user code attempts to branch
to an address above 0x3DFF for C8051F310/1 or 0x1FFF for C8051F312/3/4/5.
•A Flash read, write or erase attempt is restricted due to a Flash security setting (see Section
“10.3. Security Options” on page 105).
The FERROR bit (RSTSRC.6) is set following a Flash error reset. The state of the RST pin is unaffected by
this reset.
100Rev. 1.5
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