Sierra Wireless MC8765, MC8755 User Manual

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MC5720, MC8755, MC8765 MiniCard

Hardware Integration Guide

Proprietary and Confidential

2130114

Rev 0.92

Preface

Limitation of Liability

Patents

The information in this manual is subject to change without notice and does not

Wireless. SIERRA WIRELESS AND ITS AFFILIATES

Sierra SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE SIERRA AND/OR ITS POSSIBILITY OF FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra the liability, be in excess of the price paid by the purchaser for the Sierra

Portions of this product may be covered by some or all of the following US patents:

5,515,013 5,629,960 5,845,216 5,847,553 5,878,234 5,890,057 5,929,815 6,339,405 6,359,591 6,561,851 6,653,979 6,847,830 6,876,697 D459,303 and other patents pending.

WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS

number of events, occurrences, or claims giving rise to

Wireless

represent a commitment on the part of

PROFITS OR

USE OR INABILITY TO USE ANY

AFFILIATES HAS BEEN ADVISED OF THE

SUCH DAMAGES OR THEY ARE

Wireless product, regardless of

product.

6,169,884 6,191,741 6,199,168 6,400,336 6,643,501 6,516,204 6,697,030 6,785,830 6,845,249 6,879,585 6,886,049 D442,170

This product technology

Licensed by QUALCOMM Incorporated under one or more of

following United States patents and/or their counterparts

the

other nations:

4,901,307 5,056,109 5,101,501 5,109,390 5,228,054 5,267,261 5,267,262 5,490,165 5,504,773 5,544,196 5,568,483 5,710,784 5,778,338

Manufactured or sold by Sierra Wireless or its licensees under one or more patents

Rev 0.92 Nov.05 1

includes

licensed from:

5,337,338 5,414,796 5,416,797 5,506,865 5,511,073 5,535,239 5,600,754 5,657,420 5,659,569

licensed from InterDigital Group.

MC5720/8755/8765 Hardware Integration Guide

Trademarks

Contact Information

AirCard and “Heart of the Wireless Machine” are registered trademarks of Sierra Wireless.

Wireless, the Sierra Wireless logo, the red wave design,

Sierra

red‐tipped antenna, and Wat cher are trademarks of Sierra

the Wireless.

Windows

Qualcomm

is a registered trademark of Microsoft Corporation.

is a registered trademark of Qualcomm Incorpo‐

rated. Other trademarks are the property of the respective owners.

Sales Desk: Phone: 1-604-232-1488

Hours: 8:00 AM to 5:00 PM Pacific Time

E-mail: sales@sierrawireless.com

Post: Sierra Wireless

13811 Wireless Way Richmond, BC Canada V6V 3A4

Fax: 1-604-231-1109

Web: www.sierrawireless.com

Consult our website for up‐to‐date product descriptions, documentation, application notes, firmware upgrades, trouble‐ shooting tips, and press releases:

www.sierrawireless.com

2 2130114

Table of Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Guide Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Host/Module Communication Interface . . . . . . . . . . . . . . . . . . . . .17

Rev 0.92 Nov.05 3

MC5720/8755/8765 Hardware Integration Guide

LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Important compliance information for North American users . . . . . . . . . . . 20

Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Index 25

4 2130114

1: Introduction

Sierra Wireless’ MiniCard modules form the radio component

the products in which they are embedded. MiniCards are

for available for use on CDMA and GSM networks, including:

• MC5720 — operates on CDMA networks using the IS‐95A

and CDMA 1X, and

• MC8755 and MC8765 — operates on GSM networks using

the

Purpose of this guide

This guide addresses issues that affect the integration of Sierra Wireless modules into host products, and includes design recommendations for the host products.

Note: An understanding of network technology and experience in integrating hardware components into electronic equipment is assumed.

The Universal Development Kit

1xEV‐DO (IS‐866) network standards

GSM/GPRS/EDGE/UMTS/HSDPA network standards

Note: Contact vendors before choosing your connectors — the numbers included here are for reference only. Choose connectors that are appropriate to your design.

Sierra Wireless manufactures a Universal Development Kit (UDK)

This kit is a hardware development platform that is designed to Module product family. It contains the hardware components that are typically necessary for evaluating and developing with the module,

• Development board

• Cables

• Antennas

• Other accessories

that facilitates all phases of the integration process.

support multiple members of the Wireless Embedded

including:

Required connectors

When integrating these modules into your host device, you need the

• RF cable that mates with Hirose U.FL connector (model

• Industry‐standard mating connector for 52‐pin EDGE:

following connector types:

U.FL #CL331‐0471‐0‐10)

Some manufacturers example, the

connector used on the MC5720/MC8755/

include Tyco, Foxconn, and Molex. For

Rev 0.92 Nov.05 5

MC5720/8755/8765 Hardware Integration Guide

MC8765 Universal Development Kit board is a Molex 67910‐0001.

• Industry‐standard USIM/RUIM connector: The actual

connector USIM/RUIM socket. For example, the USIM/RUIM connector used on the Development Kit is an ITT CCM03‐3518.

Guide Organization

This guide includes the following sections:

1. Introduction (this section)

2. Power Interface (p.9)

Describes power control signals used by the module and discusses design issues related to power supply integration.

3. RF Integration (p.13)

Describes antenna connection methods and grounding issues, RF

4. Host/Module Communication Interface (p.17)

Describes the USB interface for host/module communication, and the USIM/RUIM interface for host/module integration.

5. Acronyms and Definitions (p.23)

Lists

6. Regulatory Information (p.19)

Describes regulatory approvals and regulatory information requirements.

you use depends on how your device exposes the

MC5720/MC8755/MC8765 Universal

interference and desense issues.

acronyms and definitions used throughout this guide.

Note: The term "host" always refers to the host device.

2: Power Interface

Overview of operation

Note: This chapter contains information for both the CDMA (MC5720) and GSM (MC8755/8765) modules.

Information that is unique to one module type is clearly identified.

The module is designed to use a 3.3V (nominal) power supply, provided by the host. It is the safe and continuous module protection circuits to guard against electrical issues.

The module’s power state is controlled by the host’s assertion/ de‐assertion of the monitors supply is insufficient.

Power signals

does NOT have an independent power supply, or

its supply voltage and requests shutdown if the

host’s responsibility to provide

power to the module at all times; the

W_Disable# signal. The module also

The module must be connected to a 3.3V power supply (as indicated in PCI Express Mini Card Electromechanical Specifi‐ cation Revision 1.1).

The MC8755/8765 has more power pins than the MC5720 due to higher

For detailed pinout and voltage / current requirements of these modules,

(Document MiniCard Product Specification (Document 2130637).

peak current requirements for GSM devices.

refer to MC5720 MiniCard Product Specification

2130599) and MC8755/MC8765 PCI Express

Electrostatic discharge (ESD)

You are responsible for ensuring that the host has adequate ESD protection on

• (Operational) RF port (antenna launch and RF connector):

IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test)

• (Non‐operational) Host connector interface:

JESD22‐A114‐B+/‐ 1kV Human Body Model and JESD22‐C101 +/‐ 125 V Charged Device Model

Specific recommendations are provided where needed in this guide, however, the level of protection required depends on your application.

digital circuits and antenna ports:

Rev 0.92 Nov.05 9

MC5720/8755/8765 Hardware Integration Guide

Note: ESD protection is highly recommended for the SIM connector at the point where the contacts are exposed, and any other signals from the host interface that would be subjected to ESD by the user of the end product.

Module power states

Note: The modul e un i t defaults to the Normal state when VCC3.3 is first applied in the absence of W_Disable# control.

Note: The differ en ce b e t w ee n the Disconnected and Off states is that in the Off state, the module is still connected to the power source and draws minimal current.

At any time, the module will be in one of four power states:

• Disconnected

No power to the module.

• Off

Power to the module, but the module is powered off.

• Normal

The module is active. Several modes are possible (Receive, Tra nsmit, Sleep, Shutdown).

• Low power (“airplane mode”)

The module is active, but RF is disabled.

State machines are implemented in the module to monitor the power supply and operating temperature.

Disconnected state

This state occurs when there is no power to the module — the

power source is disconnected from the module and all

host voltages associated with the module are at 0V.

Whether the host device is also powered off depends on the power rail design. If the connection between the power rail and the module is powered on and cut the power to put the modem into the disconnected device and the module, the host is powered off when the module is

powered off.

controlled by the host, the host can stay

state. If the power rail is

shared between the host

Off state

In this state, the host is powered up and the module is powered down (but still connected to the power source).

The host keeps the module powered off by asserting (driving low) the minimal current.

10 2130114

W_Disable# signal. In this state, the module draws

Normal state

Power Interface

Note: This is the default state when VCC3.3 is first applied in the absence of W_Disable# control.

Table 2-1: Power consumption of a sample application

This is the active state of the module. While in this state:

• The module is fully powered.

• The module is capable of placing/receiving calls or estab‐

lishing data connections on the wireless network.

• The USB interface is fully active.

Low power mode

In this power state, RF (both Rx and Tx) is disabled in the module, but the

(ʺairplane modeʺ) is controlled by a software command

mode through the host interface.

instructions on using appropriate commands, refer to AT

For

Command Set for User Equipment (UE) (Release 6) (+CFUN=0 command), EM5625/MC5720 CnS Reference (Document 2130643) (CNS_RADIO_POWER [0x1075]), or MC87xx Modem CnS Reference (Document 2130602) (Disable Modem).

USB interface is still active. This low power

Usage models

Usage models can be used to calculate expected current consumption. A

sample usage model is provided in Tabl e 2‐1.

Upload (module Tx)

Download (module Rx)

Coverage / data rate

Hours of operation

Total power consumed over 24 hours

This example model practice, because the module (the host device manages the power source), the mAh ratings will depend on the device’s supply efficiency.

Used by a field worker

(data only)

1000 kB/day 40 kB/h

500 kB/day 100 kB/day

1X / 80 kbps IS-95 / 14.4 kbps

8 / day (off 16 hrs / day) 24 / day

60 mAh 200 mAh

applies to a battery‐operated device. In

will be isolated from the battery

Used for remote data

logging

Rev 0.92 Nov.05 11

MC5720/8755/8765 Hardware Integration Guide

The module automatically enters slotted sleep mode when there is no transmission or reception occurring (SCI = 2).

Tra nsmit power is assumed to be +3 dBm .

12 2130114

3: RF Integration

RF connection

Consider the following when attaching an antenna to the module:

Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01) to prevent damage to the module or coaxial cable assembly.

• Use a Hirose U.FL connector (model

U.FL #CL331‐0471‐0‐10) to attach an antenna to a connection point on the module, as shown in Figure 3‐1 (The main RF connector on the top side; the diversity RF connector on the bottom

• Match coaxial connections between the module and the

antenna to 50 Ω.

• Minimize RF cable losses to the antenna; the recommended

maximum cable

Figure 3-1: Antenna connection points and mounting holes

loss for antenna cabling is 0.5 dB.

side).

Ground connection

When connecting the module to system ground:

• Prevent noise leakage by establishing a very good ground

connection to the module through the host

• Connect to system ground using the two mounting holes at

the top of the module (as shown in Figure 3‐1).

• Minimize ground noise leakage into the RF.

Depending on the host board design, noise could potentially be coupled to the module from the mainly an along the both ends of

Rev 0.92 Nov.05 13

issue for host designs that have signals traveling

length of the module, or circuitry operating at

the module

interconnects.

host board. This is

connector.

MC5720/8755/8765 Hardware Integration Guide

Shielding

The module is fully shielded to protect against EMI and to ensure Devices” (or equivalent regulations in other jurisdictions).

Note: The module shields must NOT be removed.

Antenna and cabling

When selecting the antenna and cable, it is critical to RF perfor‐ mance to match antenna gain and cable loss.

Choosing the correct antenna and cabling

Consider the following points for proper matching of antennas and cabling:

• The antenna (and associated circuitry) should have a

nominal across each frequency band of operation.

• The system gain value affects both radiated power and

regulatory (FCC, IC, CE, etc.)

compliance with FCC Part 15‐ “Radio Frequency

impedance of 50 Ω with a return loss ≤ 10 dB

test results.

Developing custom antennas

Consider the following points when developing custom‐ designed antennas:

• A skilled RF engineer should do the development to ensure

that the RF performance is maintained.

• Identify the bands that need to be supported, particularly

when both the in the same separate

Determining the antenna’s location

Consider the following points when deciding where to put the antenna:

• Antenna location may affect RF performance. Although the

module is tions, the placement of the antenna is still very important‐ if the host broadband or performance.

• Connecting cables between the module and the antenna

have 50 Ω impedance. If the impedance of the module

must

mismatched, RF performance is reduced significantly.

• Antenna cables should be routed, if possible, away from

sources (switching power supplies, LCD assemblies,

noise

MC5720 and MC8755/8765 will be installed

platform. In this case, you may want to develop

antennas for maximum performance.

shielded to prevent interference in most applica‐

device is insufficiently shielded, high levels of

spurious noise can degrade the module’s

14 2130114

RF Integration

etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna.

Disabling the diversity antenna (MC5720)

If your host device is not designed to use the MC5720’s diversity antenna, terminate the interface with a no‐connect.

Interference and sensitivity

Note: These modules are based on ZIF (Zero Intermediate Frequency) technologies; when performing EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate Frequency) components from the module to consider.

Several sources of interference can affect the RF performance of the module (RF supply noise and device‐generated RF.

RF desense can be addressed through a combination of mitigation techniques and radiated sensitivity measurement.

desense). Common sources include power

Power supply noise

Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than

200 mVp‐p1Hz to 100 kHz. This limit includes voltage ripple due to

transmitter burst activity

Interference from other wireless devices

Different wireless devices operating inside the host device can

interference that affects the module.

cause To determine the most suitable locations for each antenna on

your host device, evaluate each wireless device’s radio system, considering the following:

• Any harmonics, sub‐harmonics, or cross‐products of signals

generated by wireless devices that fall in the module’s Rx

may cause spurious response resulting in decreased

range Rx performance.

• The Tx power and corresponding broadband noise of other

wireless devices may overload or increase the noise floor of

module’s receiver, resulting in Rx desense.

the

The severity of this interference depends on the closeness of the other antennas to suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design.

Rev 0.92 Nov.05 15

the module’s antenna. To determine

MC5720/8755/8765 Hardware Integration Guide

Device-generated RF

Note: The module can cause interference with other devices such as hearing aids and onboard speakers.

Wireless devices such as the MiniCard transmit in bursts (pulse transients), for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise.

All electronic computing devices generate RF interference that

negatively affect the receive sensitivity of the module

can

desense).

(RF The proximity of host electronics to the antenna in wireless

devices can contribute to RF desense. Components that are

likely to cause RF desense include:

most

• Microprocessor and memory

• Display panel and display drivers

• Switching‐mode power supplies

These, and other high‐speed devices (in particular, the processor) can cause RF desense because they run at frequencies of tens of MHz. The rapid rise and fall of these clock signals generates

higher‐order harmonics that often fall

within the operating frequency band of the module, causing

desense.

Example

On a sub‐system running at 40 MHz, the 22nd harmonic falls

MHz, which is within the cellular receive frequency

at 880 band.

Note: In practice, there are usually numerous interfering frequencies and harmonics. The net effect can be a series of desensitized receive channels.

16 2130114

4: Host/Module Communication Interface

This chapter provides information about the Host‐Module communication

commands that may be useful for hardware integration

AT testing.

Note: On any given interface (USB, USIM/RUIM, etc.), leave unused inputs and outputs as no-connects.

LED output

The module drives the LED output according to the PCI‐ Express MiniCard specification (summarized in Table 4 ‐1,

below).

Table 4-1: LED States

State Indicates Characteristics

interface (USB interface) and lists of extended

OFF

Slow Blink

Intermittent

Blink

Module is not powered.

Module is powered and connected, but not transmitting or receiving.

Module is powered and searching for a connection.

Module is transmitting LED is flashing intermittently, or receiving. proportional to activity on the

Light is turned off.

Light is turned on.

LED is flashing at a steady, slow rate.

• 250 ms ± 25% ON period

• 0.2 Hz ± 25% blink rate

interface.

• 50% duty cycle

• 3 Hz minimum blink rate

• 20 Hz maximum blink rate

Rev 0.92 Nov.05 17

MC5720/8755/8765 Hardware Integration Guide

Figure 4-1: Example LED

MiniCard

MIO

VCC 3.3V

Current limiting Resistor

LED

18 2130114

5: Regulatory Information

Important notice

Because of the nature of wireless communications, trans‐ mission and reception of data can never be guaranteed. Data may be Although wireless devices such as the Sierra Wireless modem are used in a normal Wireless modem should not be used in situations where failure to to the user or any other personal its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.

Safety and hazards

delayed, corrupted (i.e., have errors) or be totally lost.

significant delays or losses of data are rare when

manner with a well‐constructed network, the Sierra

transmit or receive data could result in damage of any kind

party, including but not limited to

injury, death, or loss of property. Sierra

Wireless and

Do not operate your MC5720/MC8755/MC8765 modem:

• In areas where blasting is in progress

• Where explosive atmospheres may be present including

refuelling points,

• Near medical equipment

• Near life support equipment, or any equipment which may

susceptible to any form of radio interference. In such

be areas, the MC5720/MC8755/MC8765 modem MUST BE

POWERED

MC8765 modem can transmit signals that could interfere with this

In an aircraft, the MC5720/MC8755/MC8765 modem MUST BE

POWERED

modem can transmit signals that could interfere with onboard systems and may be dangerous to the operation of the aircraft or in an aircraft is this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both.

Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC8755/MC8765 modem may be used normally at this time.

equipment.

OFF. Otherwise, the MC5720/MC8755/MC8765

disrupt the cellular network. Use of a cellular phone

fuel depots, and chemical plants

OFF. Otherwise, the MC5720/MC8755/

illegal in some jurisdictions.

Failure to observe

MC5720/

various

Rev 0.92 Nov.05 19

MC5720/8755/8765 Hardware Integration Guide

Important compliance information for North American users

The MC5720/MC8755/MC8765 modem has been granted modular

MC5720/MC8755/MC8765 modem in their final products

the without additional FCC / IC they meet the following conditions. Otherwise, additional FCC / IC

1. At least 20 cm separation distance between the antenna and

the

2. To comply with FCC / IC regulations limiting both maximum

RF output maximum antenna gain including cable loss in a mobile‐only exposure

· 8dBi in the Cellular band and 4dBi in the PCS band for the

· 4.65 dBi in the Cellular band and 3.35 dBi in the PCS band

3. The MC5720/MC8755/MC8765 modem and its antenna

must not be any other

4. A label must be affixed to the outside of the end product into

which the

rated, with a statement similar to the following:

· For MC5720:

· For MC8755:

· For MC8765:

5. A user manual with the end product must clearly indicate the

operating to ensure guidelines.

The end product with an embedded MC5720/MC8755/MC8765 modem may emission testing

Part 15.

FCC

approval for mobile applications. Integrators may use

(Industry Canada) certification if

approvals must be obtained.

user’s body must be maintained at all times.

power and human exposure to RF radiation, the

condition must not exceed:

MC8755/MC8765

for the MC5720

co‐located or operating in conjunction with

transmitter or antenna within a host device.

MC5720/MC8755/MC8765 modem is incorpo‐

This device contains TX FCC ID: N7N‐MC5720 This equipment contains equipment certified under IC:

2417C‐MC5720

This device contains TX FCC ID: N7NMC8755 This equipment contains equipment certified under IC:

2417C‐MC8755

This device contains TX FCC ID: N7NMC8765 This equipment contains equipment certified under

2417C‐MC8765

IC:

requirements and conditions that must be observed

compliance with current FCC / IC RF exposure

also need to pass the FCC Part 15 unintentional

requirements and be properly authorized per

20 2130114

Regulatory Information

Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC

Part 2.1093 and IC RSS‐102.

Rev 0.92 Nov.05 21

MC5720/8755/8765 Hardware Integration Guide

22 2130114

A: Acronyms and Definitions

Table 5-1: Acronyms and definitions

Acronym or term Definition

AGC Automatic Gain Control BER Bit Error Rate - a measure of receive sensitivity BLER Block Error Rate Call Box Base Station Simu lator - Agilent E8285A or 8960, Rohde &

Schwarz CMU200 CDMA Code Division Multiple Access dB Decibel = 10 x log10 (P1/P2)

P1 is calculated power; P2 is reference power

Decibel = 20 x log10 (V1/V2)

V1 is calculated voltage, V2 is reference voltage

dBm Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/

1mW)

DUT Device Under Test EDGE Enhanced Data rates for GSM Evolution EM Embedded Module ESD ElectroStatic Discharge FER Frame Error Rate - a measure of receive sensitivity GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile communications Hz Hertz = 1 cycle/second inrush current Peak current drawn when a device is connected or powered on IS-2000 3G radio standards for voice and data (CDMA only) IS-95 2G radio standards targeted for voice (cdmaONE) LDO Low Drop Out - refers to linear regulator MC5720 Sierra Wireless MiniCard used on CDMA networks

Rev 0.92 Nov.05 23

MC5720/8755/8765 Hardware Integration Guide

Table 5-1: Acronyms and definitions

Acronym or term Definition

MC8755 / MC8765 Sierra Wireless MiniCards used on GSM networks MHz MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second) MIO Module Input/Output MPE Maximum Permissible Exposure — the level of radiation to which a

person may be exposed without hazardou s effect or adve rs e

biological changes OTA Over The Air or Radiated through the antenna PCS Personal Communication System - PCS spans the 1.9 GHz radio

spectrum RF Radio Frequency RMS Root Mean Square RUIM Removable User Identity Module SA Selective Availability Sensitivity (Audio) Measure of lowest power signal that the receiver can measure Sensitivity (RF) Measure of lowest power signal at the receiver input that can

provide a prescribed BER/BLER/SNR value at the receiver output. SIM Subscriber Identity Module SNR Signal to Noise Ratio SOF Start of Frame - a USB function UART Universal Asynchronous Receiver Transmitter UDK Universal Development Kit UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VCC3.3 3.3 V supply voltage WCDMA Wideband Code Division Multiple Access — In this document, the

term “UMTS” is used instead of “WCDMA”. XIM In this document, XIM is used as part of the contact identifiers for

the USIM/RUIM interface (XIM_VCC, XIM_CLK, etc.). It indicates

either RUIM or USIM.

24 2130114

Index

acronyms and definitions 23–24

airplane mode 11 antenna

connection and mounting points 13 connection considerations 13 custom, considerations 14 diversity antenna, disabling 15 limit, matching coaxial connections 13 matching, considerations 14 maximum cable loss 13

AT commands

3GPP specification, details 7 extended, MC5720 7 extended, MC8755/8765 7 low power mode, setting 11

cable loss

antenna, maximum 13

CnS

MC5720 reference, details 7 MC8755 reference, details 7

connection

grounding 13

connectors, required

EDGE mating (52‐pin) 5 host‐module RF, Hirose 5 USIM/RUIM 6

current

consumption

5–6

usage models 11

FCC

regulations, relevant section 7

grounding

connection considerations 13 ground loops, avoiding 14

Host⁄Module interface 17–18

interference

device generated 16 power supply noise 15 wireless devices 15

LED

example 18 state

intermittent blink 17 off 17 on 17 slow blink 17

low power mode

setting, AT commands 11

low power, module power state 11

default state (Normal), module 11 desense. See RF disconnected, module power state 10 diversity antenna

disabling 15

electrostatic discharge. See ESD ESD

protection requirements testing techniques document (IEC‐61000‐4‐2) 7

9–10

MC5720

CnS reference, details 7 extended AT commands 7 product specification 7

MC8755/8765

CnS reference, details 7 extended AT commands 7 product specification 7

mini card

PCI Express Specification, details 8 See also MC5720; MC8755⁄8765

module

power states

module, default power mode (Normal) 11

10–12

Rev 0.92 Nov.05 25

MC5720/8755/8765 Hardware Integration Guide

noise

leakage, minimizing 13 RF interference, power supply 15

normal, module power state 11

off, module power state 10

PCI Express

mini card specification details 8

power

disconnected, characteristics 10 normal, characteristics 11 off, characteristics 10 signals, overview 9 state, disconnected 10 state, low power 11 state, normal 11 state, off 10 states, module

supply, RF interference 15 power interface Product Specification Document. See PSD PSD

MC5720, details 7

MC8755/8765, details 7

10–12

9–12

regulatory information 19–21

FCC 20

limitation of liability 19

safety and hazards 19

antenna cable loss, maximum 13 antenna connection, considerations 13 cable type, required 5 desense

device‐generated 16 integration interference

13–??

other devices 16

power supply 15

wireless devices 15

shielding

module, compliance 14

SIM. See USIM/RUIM

testing

immunity, techniques document (IEC‐61000‐

ESD

4‐2) 7

UDK. See Universal Development Kit Universal Development Kit

components, included 5

Universal Serial Bus. See USB usage models

current consumption 11

USB

specification, details 8

USIM/RUIM

connector type, required 6

26 2130114

Sierra Wireless MC8765, MC8755 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1: Introduction

The Universal Development Kit

Required connectors

Guide Organization

Related documents

2: Power Interface

Overview of operation

Power signals

Electrostatic discharge (ESD)

Module power states

Disconnected state

Off state

Normal state

Low power mode

Usage models

3: RF Integration

RF connection

Ground connection

Shielding

Antenna and cabling

Interference and sensitivity

Power supply noise

Interference from other wireless devices

Device-generated RF

4: Host/Module Communication Interface

LED output

5: Regulatory Information

Important notice

Safety and hazards

Important compliance information for North American users

A: Acronyms and Definitions

Index