Sierra Wireless HL7688 User Manual

0 (0)

4119272

2.0

August 16, 2016

AirPrime HL7688

Product Technical Specification

4119272 Rev 2.0 August 16, 2016 2

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be

guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant

delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used

in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used

in situations where failure to transmit or receive data could result in damage of any kind to the user or

any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless

accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or

received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or

receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without

proper device certifications. These areas include environments where cellular radio can interfere such

as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to

any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere

with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is

on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When

operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard

systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

is open. Sierra Wireless modems may be used at this time.

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of

a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In

some states and provinces, operating such communications devices while in control of a vehicle is an

offence.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or

implied, including any implied warranties of merchantability, fitness for a particular purpose, or

noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a

commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES

SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,

GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,

BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR

REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS

PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE

POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY

THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability

arising under or in connection with the Sierra Wireless product, regardless of the number of events,

occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the

Sierra Wireless product.

4119272 Rev 2.0 August 16, 2016 3

Product Technical Specification

Patents

This product may contain technology developed by or for Sierra Wireless Inc.

This product includes technology licensed from QUALCOMM

This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents

licensed from InterDigital Group and MMP Portfolio Licensing.

Trademarks

Sierra Wireless

, AirPrime

, AirLink

, AirVantage

, WISMO

, ALEOS

and the Sierra Wireless and

Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher

is a registered trademark of NETGEAR, Inc., used under license.

Windows

and Windows Vista

are registered trademarks of Microsoft Corporation.

Macintosh

and Mac OS X

are registered trademarks of Apple Inc., registered in the U.S. and other

countries.

QUALCOMM

is a registered trademark of QUALCOMM Incorporated. Used under license.

Other trademarks are the property of their respective owners.

Contact Information

Sales information and technical support,

including warranty and returns

Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795

6:00 am to 6:00 pm PST

Corporate and product information

Web: sierrawireless.com

4119272 Rev 2.0 August 16, 2016 4

Product Technical Specification

Document History

Version Date Updates

1.0 May 23, 2016 Creation

1.1 May 26, 2016

Updated:

 Table 2 General Features

 1.8.2 Regulatory

 3.16.2 RF Performances

1.2 May 30, 2016

Updated:

 Figure 2 Mechanical Overview

 4 Mechanical Drawings

2.0 August 16, 2016 Updated section 7 FCC Regulations

4119272 Rev 2.0 August 16, 2016 5

Contents

1. INTRODUCTION .................................................................................................. 10

1.1. Common Flexible Form Factor (CF

) ............................................................................. 10

1.2. Physical Dimensions ..................................................................................................... 10

1.3. General Features .......................................................................................................... 11

1.4. Architecture ................................................................................................................... 13

1.5. Interfaces ...................................................................................................................... 14

1.6. Connection Interface ..................................................................................................... 14

1.7. ESD .............................................................................................................................. 15

1.8. Environmental and Certifications ................................................................................... 15

1.8.1. Environmental Specifications ................................................................................. 15

1.8.2. Regulatory ............................................................................................................. 16

1.8.3. RoHS Directive Compliant ..................................................................................... 16

1.8.4. Disposing of the Product ........................................................................................ 16

1.9. References .................................................................................................................... 16

2. PAD DEFINITION ................................................................................................. 17

2.1. Pad Configuration (Top View, Through Module) ........................................................... 22

3. DETAILED INTERFACE SPECIFICATIONS ....................................................... 23

3.1. Power Supply ................................................................................................................ 23

3.2. Current Consumption .................................................................................................... 23

3.3. VGPIO ........................................................................................................................... 24

3.4. BAT_RTC ...................................................................................................................... 2 5 

3.5. SIM Interface ................................................................................................................. 25

3.5.1. UIM1_DET ............................................................................................................. 26

3.6. USB .............................................................................................................................. 26

3.7. Electrical Information for Digital I/O ............................................................................... 26

3.8. General Purpose Input/Output (GPIO) .......................................................................... 27

3.9. Main Serial Link (UART1) .............................................................................................. 28

3.10. POWER-ON Signal (PWR_ON_N) ................................................................................ 28

3.11. Reset Signal (RESET_IN_N) ........................................................................................ 29

3.12. Analog to Digital Converter (ADC1) ............................................................................... 30

3.13. Clock Interface .............................................................................................................. 3 0 

3.14. PCM .............................................................................................................................. 31

3.15. Debug Interfaces ........................................................................................................... 32

3.15.1. Trace Debug .......................................................................................................... 32

3.15.2. JTAG ...................................................................................................................... 33

3.16. RF Interface .................................................................................................................. 33

3.16.1. RF Connection ....................................................................................................... 33

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Product Technical Specification

3.16.2. RF Performances ................................................................................................... 34

3.16.3. TX_ON Indicator (TX_ON) ..................................................................................... 34

4. MECHANICAL DRAWINGS ................................................................................. 36

5. DESIGN GUIDELINES ......................................................................................... 39

5.1. Power-Up Sequence ..................................................................................................... 39

5.2. Module Switch-Off ......................................................................................................... 40

5.3. Emergency Power OFF ................................................................................................. 40

5.4. Sleep Mode Management ............................................................................................. 40

5.4.1. Using UART1 ......................................................................................................... 40

5.4.2. Using USB ............................................................................................................. 41

5.5. Power Supply Design .................................................................................................... 41

5.6. ESD Guidelines for SIM Card ........................................................................................ 41

5.7. ESD Guidelines for USB ............................................................................................... 42

6. RELIABILITY SPECIFICATION ........................................................................... 43

6.1. Reliability Compliance ................................................................................................... 43

6.2. Reliability Prediction Model ........................................................................................... 43

6.2.1. Life Stress Test ...................................................................................................... 43

6.2.2. Environmental Resistance Stress Tests ................................................................. 44

6.2.3. Corrosive Resistance Stress Tests ........................................................................ 44

6.2.4. Thermal Resistance Cycle Stress Tests ................................................................. 45

6.2.5. Mechanical Resistance Stress Tests ..................................................................... 47

6.2.6. Handling Resistance Stress Tests ......................................................................... 48

7. FCC REGULATIONS ........................................................................................... 50

8. ORDERING INFORMATION ................................................................................ 52

9. TERMS AND ABBREVIATIONS .......................................................................... 53

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List of Figures

Figure 1. Architecture Overview ................................................................................................... 13

Figure 2. Mechanical Overview .................................................................................................... 14

Figure 3. Pad Configuration ......................................................................................................... 22

Figure 4. PCM Timing Waveform ................................................................................................. 32

Figure 5. TX_ON State During Transmission ............................................................................... 35

Figure 6. Mechanical Drawing ...................................................................................................... 36

Figure 7. Dimensions Drawing ..................................................................................................... 37

Figure 8. Footprint ........................................................................................................................ 38

Figure 9. PWR_ON_N Sequence with VGPIO Information .......................................................... 39

Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO ........................................................... 40

Figure 11. Voltage Limiter Example ............................................................................................... 41

Figure 12. EMC and ESD Components Close to the SIM .............................................................. 42

Figure 13. ESD Protection for USB ................................................................................................ 42

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List of Tables

Table 1. Supported Bands/Connectivity ...................................................................................... 10

Table 2. General Features .......................................................................................................... 11

Table 3. ESD Specifications ........................................................................................................ 15

Table 4. Environmental Specifications ........................................................................................ 15

Table 5. Regulation Compliance ................................................................................................. 16

Table 6. Pad Definition ................................................................................................................ 17

Table 7. Power Supply ................................................................................................................ 23

Table 8. Current Consumption .................................................................................................... 23

Table 9. Current Consumption per Power Supply ....................................................................... 24

Table 10. VGPIO Electrical Characteristics ................................................................................... 24

Table 11. BAT_RTC Electrical Characteristics .............................................................................. 25

Table 12. UIM1 Pad Description ................................................................................................... 25

Table 13. Electrical Characteristics of UIM1.................................................................................. 26

Table 14. USB Pad Description .................................................................................................... 26

Table 15. Digital I/O Electrical Characteristics .............................................................................. 27

Table 16. GPIO Pad Description ................................................................................................... 27

Table 17. UART1 Pad Description ................................................................................................ 28

Table 18. PWR_ON_N Electrical Characteristics .......................................................................... 29

Table 19. RESET_IN_N Electrical Characteristics ........................................................................ 29

Table 20. ADC Interface Pad Description ..................................................................................... 30

Table 21. ADC Electrical Characteristics ...................................................................................... 30

Table 22. Clock Interface Pad Description .................................................................................... 30

Table 23. PCM Interface Pad Description ..................................................................................... 31

Table 24. PCM Electrical Characteristics ...................................................................................... 31

Table 25. Trace Debug Pad Description ....................................................................................... 32

Table 26. JTAG Pad Description ................................................................................................... 33

Table 27. RF Main Connection ..................................................................................................... 33

Table 28. RF Diversity Connection ............................................................................................... 33

Table 29. Conducted RX Sensitivity – UMTS Bands ..................................................................... 34

Table 30. Conducted RX Sensitivity – LTE Bands ........................................................................ 34

Table 31. TX_ON Indicator Pad Description ................................................................................. 34

Table 32. TX_ON Characteristics ................................................................................................. 34

Table 33. Standards Conformity ................................................................................................... 43

Table 34. Life Stress Test ............................................................................................................. 4 3 

Table 35. Environmental Resistance Stress Tests ........................................................................ 44

Table 36. Corrosive Resistance Stress Tests ............................................................................... 44

Table 37. Thermal Resistance Cycle Stress Tests ........................................................................ 45

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Product Technical Specification

Table 38. Mechanical Resistance Stress Tests ............................................................................. 47

Table 39. Handling Resistance Stress Tests ................................................................................ 48

Table 40. Ordering Information ..................................................................................................... 52

4119272 Rev 2.0 August 16, 2016 10

1. Introduction

This document is the Product Technical Specification for the AirPrime HL7688 Embedded Module. It

defines the high level product features and illustrates the interfaces for these features. This document

is intended to cover the hardware aspects of the product, including electrical and mechanical.

The AirPrime HL7688 belongs to the AirPrime HL Series from Essential Connectivity Module family.

These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless

networks (as listed in Table 1 Supported Bands/Connectivity).

The HL7688 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide

customers with the highest level of flexibility in implementing high-end solutions.

Table 1. Supported Bands/Connectivity

RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power

LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (+/- 2dBm) Class 3bis

LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23 dBm (+/- 2dBm) Class 3bis

LTE B5 824 to 849 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis

LTE B17 704 to 716 MHz 734 to 746 MHz 23 dBm (+/- 2dBm) Class 3bis

UMTS B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (+/- 2dBm) Class 3bis

UMTS B5 824 to 849 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis

1.1. Common Flexible Form Factor (CF

)

The AirPrime HL7688 belongs to the Common Flexible Form Factor (CF

) family of modules. This

family consists of a series of WWAN modules that share the same mechanical dimensions (same

width and length with varying thicknesses) and footprint. The CF

form factor provides a unique

solution to a series of problems faced commonly in the WWAN module space as it:

 Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings

 Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions

 Offers electrical and functional compatibility

 Provides Direct Mount as well as Socketability depending on customer needs

1.2. Physical Dimensions

AirPrime HL7688 modules are compact, robust, fully shielded modules with the following dimensions:

 Length: 23 mm

 Width: 22 mm

 Thickness: 2.5 mm

 Weight: 3.5 g

Note: Dimensions specified above are typical values.

4119272 Rev 2.0 August 16, 2016 11

Product Technical Specification Introduction

1.3. General Features

The table below summarizes the AirPrime HL7688 features.

Table 2. General Features

Feature Description

Physical

 Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x

2.5mm (nominal)

 Complete body shielding

 RF connection pads (RF main interface)

 Baseband signals connection

Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V

 Quad-band LTE:

 LTE B2: 1900 PCS

 LTE B4: 1700 AWS

 LTE B5: 850 CLR

 LTE B17: 700

 Dual-band UMTS:

 UMTS B2: 1900 PCS

 UMTS B5: 850 CLR

SIM interface

 Dual SIM Single Standby (DSSS)

 1.8V/3V support

 SIM extraction / hot plug detection

 SIM/USIM support

 Conforms with ETSI UICC Specifications

 Supports SIM application tool kit with proactive SIM commands

Application interface

 NDIS NIC interface support (Windows XP, Windows 7, Windows 8,

Windows CE, Linux)

 Multiple non-multiplexed USB channel support

 Dial-up networking

 USB selective suspend to maximize power savings

 CMUX multiplexing over UART*

 AT command interface – 3GPP 27.007 standard, plus proprietary

extended AT commands

4119272 Rev 2.0 August 16, 2016 12

Product Technical Specification Introduction

Feature Description

Protocol Stack

 Single mode LTE operation:

 LTE FDD, bandwidth 1.4-20 MHz

 System Release: 3GPP Rel. 9

 Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)

 Rx Diversity

 Max modulation 64 QAM DL, 16 QAM UL

 Intra-frequency and inter-frequency mobility

 SMS over SGs and IMS

 SON ANR

 Public Warning System PWS

 HSDPA (High Speed Downlink Packet Access)

 Evolved High Speed Downlink Packet Access (HSDPA+)

 Compliant with 3GPP Release 9

 Up to Category 24 (DC, 42.2Mbps)

 Continuous Packet Connectivity (CPC)

 Enhance fractional DPCH

 IPv6 support

 HSUPA (High Speed Uplink Packet Access)

 Compliant with 3GPP Release 9

 Category 7 (11.5Mbps)

 Robust Header Compression (RoHC)

 RXDIV Performance Enhancements

 Type 3i (HSDPA)

 HSPA Enhancements

 MAC-ehs Rel. 7

 HSDPA Enhanced CELL_FACH/PCH states

 HSUPA Enhanced CELL_FACH states (eFACH) Rel 8

 MAC-i/is Rel.8

 Serving cell change enhancements Rel. 8

SMS

 SMS over SGs and IMS

 SMS MO and MT

 SMS saving to SIM card or ME storage

 SMS reading from SIM card or ME storage

 SMS sorting

 SMS concatenation

 SMS Status Report

 SMS replacement support

 SMS storing rules (support of

AT+CNMI, AT+CNMA)

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Product Technical Specification Introduction

Feature Description

Connectivity

 Multiple (up to 20) cellular packet data profiles

 Sleep mode for minimum idle power draw

 Mobile-originated PDP context activation / deactivation

 Support QoS profile

 Release 97 – Precedence Class, Reliability Class, Delay Class, Peak

Throughput, Mean Throughput

 Release 99 QoS negotiation – Background, Interactive, and

Streaming

 Static and Dynamic IP address. The network may assign a fixed IP

address or dynamically assign one using DHCP (Dynamic Host

Configuration Protocol).

 Supports PAP and CHAP authentication protocols

 PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context

 RFC1144 TCP/IP header compression

Environmental

Operating temperature ranges (industrial grade):

 Class A: -30°C to +70°C



Class B: -40°C to +85°C

RTC Real Time Clock (RTC) with calendar

1.4. Architecture

The figure below presents an overview of the AirPrime HL7688’s internal architecture and external

interfaces.

AirPrime HL7688

Memory

(Flash + RAM)

SAW

Filters

26MHz

32.768KHz

UART x 1

Trace Debug (5 pins)

VBATT

GND

VGPIO

BAT_RTC

GPIO x 12

RESET_IN

RF Main

JTAG

LGA-

146

Baseband

SIM1

MCU DSP

PMU RF

Analog Baseband

Peripherals

LGA-

146

26M_CLKOUT

32K_CLKOUT

PWR_ON

Dulpexer

USB

Antenna

Switch

Antenna

Switch

RX_LTE RF

RF DIV

RFRX_LTE

ADC x 1

PCM

TX_ON

Figure 1. Architecture Overview

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Product Technical Specification Introduction

1.5. Interfaces

The AirPrime HL7688 module provides the following interfaces and peripheral connectivity:

 1x – 8-wire UART

 1x – Active Low RESET

 1x – USB 2.0

 1x – Backup Battery Interface

 2x – System Clock Out

 1x – Active Low POWER-ON

 1x – 1.8V/3V SIM

 1x – JTAG Interface

 12x – GPIOs (2 of which have multiplexes)

 1x – Main Antenna

 1x – RX Diversity Antenna

 1x – VGPIO

 1x – TX_ON

 1x – ADC

 1x – PCM

 1x – Debug Interface

1.6. Connection Interface

The AirPrime HL7688 module is an LGA form factor device. All electrical and mechanical connections

are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview

The 146 pads have the following distribution:

 66 inner signal pads, 1x0.5mm, pitch 0.8mm

 1 reserved test point (do not connect), 1.0mm diameter

 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

 4 inner corner ground pads, 1x1mm

 4 outer corner ground pads, 1x0.9mm

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Product Technical Specification Introduction

1.7. ESD

Refer to the following table for ESD Specifications.

Note: Information specified in the following table is preliminary and subject to change.

Table 3. ESD Specifications

Category Connection Specification

Operational RF ports IEC-61000-4-2 – Level (Electrostatic Discharge Immunity Test)

Non-operational

Host connector

interface

Unless otherwise specified:

 JESD22-A114 +/- 1kV Human Body Model

 JESD22-A115 +/- 200V Machine Model

 JESD22-C101C +/- 250V Charged Device Model

Signals

SIM connector

Adding ESD protection is highly recommended at the point where

the USIM contacts are exposed, and for any other signals that

would be subjected to ESD by the user.

Other host signals

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table

below.

Table 4. Environmental Specifications

Conditions Range

Operating Class A -30°C to +70°C

Operating Class B -40°C to +85°C

Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

 Shall exhibit normal function during and after environmental exposure.

 Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

 Shall remain fully functional during and after environmental exposure

 Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

 Unless otherwise stated, full performance should return to normal after the excessive

constraint(s) have been removed.

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Product Technical Specification Introduction

1.8.2. Regulatory

The AirPrime HL7688 is compliant with FCC regulations.

FCC compliance will be reflected on the AirPrime HL7688 label.

Table 5. Regulation Compliance

Document Current Version Description

GCF-CC v3.56.1 or later GCF Conformance Certification Criteria

NAPRD.03 V5.22 or later North American Program Reference Document

FCC Part 22, 24, 27 NA Federal Communications Commission

1.8.3. RoHS Directive Compliant

The AirPrime HL7688 module is compliant with RoHS Directive 2011/65/EU which sets limits for the

use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new

electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,

hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical

and Electronic Equipment (WEEE). As such, this product must not be disposed of at a

municipal waste collection point. Please refer to local regulations for directions on how

to dispose of this product in an environmental friendly manner.

1.9. References

[1] AirPrime HL Series Customer Process Guidelines

Reference Number: 4114330

[2] AirPrime HL7688 AT Commands Interface Guide

Reference Number: TBD

4119272 Rev 2.0 August 16, 2016 17

2. Pad Definition

AirPrime HL7688 pads are divided into 3 functional categories.

 Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF

family of

modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions

and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF

modules.

 Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it

is always at the same pad location.

 Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os.

Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on

other CF

modules.

Other pads marked as “not connected” or “reserved” should not be used.

Table 6. Pad Definition

Pad # Signal Name Function I/O

Active

Low / High

Power Supply

Domain

Recommendation

for Unused Pads

Type

1 GPIO1 General purpose input/output I/O

1.8V Left Open Extension

UART1_RI /

TRACE_DATA3

UART1 Ring indicator / Trace data 3 O

1.8V Connect to test point Core / Custom

3 UART1_RTS UART1 Request to send I L 1.8V Connect to test point Core

4 UART1_CTS UART1 Clear to send O L 1.8V Connect to test point Core

5 UART1_TX UART1 Transmit data I

1.8V Connect to test point Core

6 UART1_RX UART1 Receive data O

1.8V Connect to test point Core

7 UART1_DTR UART1 Data terminal ready I L 1.8V Connect to test point Core

UART1_DCD /

TRACE_DATA1

UART1 Data carrier detect / Trace data 1

O L 1.8V Connect to test point Core / Custom

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