Sierra Wireless HL78 User Manual

AirPrime HL7800 and HL7800-M

Product Technical Specification

41111094

1.7

August 10, 2018

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.

is open. Sierra Wireless modems may be used at this time.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.

41111094 Rev 1.7 August 10, 2018 2

Product Technical Specification

Patents

This product may contain technology developed by or for Sierra Wireless Inc.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents

licensed from MMP Portfolio Licensing.

Copyright

© 2018 Sierra Wireless. All rights reserved.

Trademarks

Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other

countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.

Contact Information

Sales information and technical support, including
warranty and returns

Corporate and product information Web: sierrawireless.com

Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795

6:00 am to 5:00 pm PST

41111094 Rev 1.7 August 10, 2018 3

Product Technical Specification

Document History

Version Date Updates

1.0 November 24, 2017 Creation
Added 3.3 Power Consumption States
Updated:

 Table 2 General Features

1.1 February 01, 2018

1.2 May 04, 2018

1.3 July 05, 2018

1.4 July 10, 2018 Updated Table 10 Low Current Consumption Mode

1.5 July 25, 2018

1.6 August 10, 2018

 Table 5 Pin Definition
 3.2 Current Consumption
 Table 11 Current Consumption Mode
 3.16 Debug Interface
 3.19.3 Rx Sensitivity

Added:

 Table 9 Maximum Current Consumption

Updated:

 GNSS to GPS
 1.7 ESD Specifications
 1.8.5 RoHS Directive Compliance
 3.2 Current Consumption
 Table 21 Digital I/O Electrical Characteristics
 3.11 Power On Signal (PWR_ON_N)
 3.19 RF Interface
 5 Reliability Specification

Added 1.8.3 ATEX Compliance
Updated:

 Table 1 Supported Bands/Connectivity
 Table 2 General Features
 1.5 Interfaces
 Table 5 Pin Definition
 Table 9 Maximum Current Consumption
 3.2 Current Consumption
 3.3 Power Consumption States
 3.11 Power On Signal (PWR_ON_N)
 3.12 Reset Signal (RESET_IN_N)
 Table 40 Typical Conducted RX Sensitivity

Added:

 1.8.2 Frequency Drift Correction
 6 Legal Information
 HL7800-M

Updated:

 Table 9 Maximum Current Consumption
 Moved Japan Approval to 6.1; updated Figure 16 Sample Japan

Certification Indication

Updated:

 6.2 FCC Statement
 6.3 IC Statement

41111094 Rev 1.7 August 10, 2018 4

Contents

1. INTRODUCTION ................................................................................................ 10

1.1. Common Flexible Form Factor (CF3) ................................................................................ 11

1.2. Physical Dimensions ......................................................................................................... 11

1.3. General Features ............................................................................................................... 11

1.4. Architecture........................................................................................................................ 13

1.5. Interfaces ........................................................................................................................... 14

1.6. Connection Interface ......................................................................................................... 14

1.7. ESD Specifications ............................................................................................................ 15

1.8. Environmental and Certifications ....................................................................................... 15

1.8.1. Environmental Specifications ................................................................................... 15

1.8.2. Frequency Drift Correction ....................................................................................... 16

1.8.3. ATEX Compliance ................................................................................................... 16

1.8.4. Regulatory ................................................................................................................ 16

1.8.5. RoHS Directive Compliance .................................................................................... 16

1.8.6. Disposing of the Product .......................................................................................... 17

1.9. References ........................................................................................................................ 17

2. PAD DEFINITION ............................................................................................... 18

2.1. Pin Types ........................................................................................................................... 22

2.2. Pad Configuration (Top View, Through Module) ............................................................... 23

3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 24

3.1. Power Supply..................................................................................................................... 24

3.2. Current Consumption ........................................................................................................ 25

3.3. Power Consumption States ............................................................................................... 26

3.3.1. 3GPP Power Saving Features ................................................................................. 26

3.3.2. Power Modes ........................................................................................................... 29

3.4. VGPIO ............................................................................................................................... 29

3.5. Real Time Clock (BAT_RTC) ............................................................................................ 30

3.6. USIM Interface ................................................................................................................... 30

3.6.1. UIM1_DET ............................................................................................................... 31

3.7. USB Interface .................................................................................................................... 32

3.8. Electrical Information for Digital I/O ................................................................................... 32

3.9. General Purpose Input/Output (GPIO) .............................................................................. 33

3.10. Main Serial Link (UART1) .................................................................................................. 33

3.10.1. 8-wire Application .................................................................................................... 34

3.10.2. 4-wire Application (TBC) .......................................................................................... 35

3.10.3. 2-wire Application (TBC) .......................................................................................... 35

3.11. Power On Signal (PWR_ON_N) ........................................................................................ 35

3.11.1. Not Managed (Default) ............................................................................................ 36

41111094 Rev 1.7 August 10, 2018 5

Product Technical Specification

3.11.2. Managed .................................................................................................................. 37

3.12. Reset Signal (RESET_IN_N) ............................................................................................. 38

3.13. Analog to Digital Converter (ADC)..................................................................................... 39

3.14. Clock Interface ................................................................................................................... 39

3.15. PCM ................................................................................................................................... 40

3.16. Debug Interface ................................................................................................................. 40

3.17. Wake Up Signal (WAKE_UP) ............................................................................................ 40

3.18. Fast Shutdown Signal (FAST_SHUTDOWN_N) ............................................................... 41

3.19. RF Interface ....................................................................................................................... 42

3.19.1. RF Connection ......................................................................................................... 42

3.19.2. Maximum Output Power .......................................................................................... 42

3.19.3. Rx Sensitivity ........................................................................................................... 42

3.19.4. TX Indicator (TX_ON) .............................................................................................. 43

3.20. GPS Interface .................................................................................................................... 44

3.20.1. GPS Performance .................................................................................................... 44

3.20.2. GPS Antenna Indicator (EXT_LNA_GPS_EN) ........................................................ 44

4. MECHANICAL DRAWINGS ............................................................................... 45

5. RELIABILITY SPECIFICATION ......................................................................... 48

5.1. Preconditioning Test .......................................................................................................... 48

5.2. Performance Test .............................................................................................................. 48

5.3. Aging Tests ........................................................................................................................ 49

5.4. Characterization Tests ....................................................................................................... 50

6. LEGAL INFORMATION ..................................................................................... 51

6.1. Japan Radio and Telecom Approval ................................................................................. 51

6.2. FCC Statement .................................................................................................................. 51

6.2.1. Radiation Exposure Statement ................................................................................ 51

6.2.2. End Product Labeling .............................................................................................. 52

6.2.3. Manual Information to the End User ........................................................................ 53

6.3. IC Statement ...................................................................................................................... 54

6.3.1. Radiation Exposure Statement / Déclaration d'Exposition aux Radiations ............. 55

6.3.2. End Product Labeling / Plaque Signalétique du Produit Final ................................. 56

6.3.3. Manual Information to the End User / Manuel d'Information à l'Utilisateur Final ..... 56

7. ORDERING INFORMATION .............................................................................. 57

8. TERMS AND ABBREVIATIONS ........................................................................ 58

41111094 Rev 1.7 August 10, 2018 6

List of Figures

Figure 1. Architecture Overview ..................................................................................................... 13

Figure 2. Mechanical Overview (Top View) .................................................................................... 14

Figure 3. Pad Configuration (Top View through Module) ............................................................... 23

Figure 4. PSM Example (Simplified) ............................................................................................... 26

Figure 5. eDRX Example (PTW=4) ................................................................................................ 28

Figure 6. 8-wire UART Application Example .................................................................................. 34

Figure 7. 4-wire UART Application Example .................................................................................. 35

Figure 8. 2-wire UART Application Example .................................................................................. 35

Figure 9. Power Up and Power Down Sequence without PWR_ON_N ......................................... 36

Figure 10. Power Up Sequence with PWR_ON_N Cold Start ......................................................... 37

Figure 11. Power On Sequence with PWR_ON_N .......................................................................... 37

Figure 12. TX_ON State during TX Burst ......................................................................................... 43

Figure 13. Mechanical Drawing ........................................................................................................ 45

Figure 14. Dimensions Drawing ....................................................................................................... 46

Figure 15. Footprint Drawing ............................................................................................................ 47

Figure 16. Sample Japan Certification Indication ............................................................................. 51

41111094 Rev 1.7 August 10, 2018 7

List of Tables

Table 1. Supported Bands/Connectivity ........................................................................................ 10

Table 2. General Features ............................................................................................................ 11

Table 3. Environmental Specifications .......................................................................................... 15

Table 4. Values for ATEX Compliance .......................................................................................... 16

Table 5. Pin Definition ................................................................................................................... 18

Table 6. Pin Type Codes ............................................................................................................... 22

Table 7. Power Supply Pin Description ......................................................................................... 24

Table 8. Power Supply Electrical Characteristics .......................................................................... 24

Table 9. Maximum Current Consumption...................................................................................... 24

Table 10. Low Current Consumption Mode ..................................................................................... 25

Table 11. Current Consumption Mode ............................................................................................ 26

Table 12. eDRX-Related Commands .............................................................................................. 28

Table 13. Low Power Modes ........................................................................................................... 29

Table 14. VGPIO Pin Description .................................................................................................... 30

Table 15. VGPIO Electrical Characteristics ..................................................................................... 30

Table 16. BAT_RTC Electrical Characteristics................................................................................ 30

Table 17. USIM1 Pin Description .................................................................................................... 31

Table 18. USIM1 Electrical Characteristics ..................................................................................... 31

Table 19. USB Pin Description ........................................................................................................ 32

Table 20. USB Electrical Characteristics ......................................................................................... 32

Table 21. Digital I/O Electrical Characteristics ................................................................................ 32

Table 22. GPIO Pin Description ...................................................................................................... 33

Table 23. UART1 Pin Description ................................................................................................... 34

Table 24. PWR_ON_N Pin Description ........................................................................................... 36

Table 25. PWR_ON_N Electrical Characteristics ........................................................................... 36

Table 26. PWR_ON_N Not Managed Timing.................................................................................. 36

Table 27. PWR_ON_N Managed Timing ........................................................................................ 38

Table 28. RESET_IN_N Pin Description ......................................................................................... 38

Table 29. RESET_IN_N Electrical Characteristics .......................................................................... 38

Table 30. ADC Pin Description ........................................................................................................ 39

Table 31. ADC Electrical Characteristics ........................................................................................ 39

Table 32. Clock Interface Pin Description ....................................................................................... 40

Table 33. Debug Pin Description ..................................................................................................... 40

Table 34. WAKE_UP Pin Description .............................................................................................. 40

Table 35. WAKE_UP Electrical Characteristics .............................................................................. 41

Table 36. FAST_SHUTDOWN_N Pin Description .......................................................................... 41

Table 37. FAST_SHUTDOWN_N Electrical Characteristics ........................................................... 41

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Product Technical Specification

Table 38. RF Main Pin Description .................................................................................................. 42

Table 39. Maximum Output Power .................................................................................................. 42

Table 40. Typical Conducted RX Sensitivity ................................................................................... 42

Table 41. TX_ON Pin Description ................................................................................................... 43

Table 42. TX_ON Characteristics .................................................................................................... 44

Table 43. GPS Antenna Specifications ........................................................................................... 44

Table 44. GPS Performance ........................................................................................................... 44

Table 45. Preconditioning Test ........................................................................................................ 48

Table 46. Performance Test ............................................................................................................ 48

Table 47. Aging Tests ...................................................................................................................... 49

Table 48. Characterization Tests .................................................................................................... 50

Table 49. Ordering Information ....................................................................................................... 57

41111094 Rev 1.7 August 10, 2018 9

1. Introduction

This document is the Product Technical Specification for the AirPrime HL7800 and HL7800-M
Embedded Modules designed for M2M and Internet of Things (IoT) markets. It defines the high-level
product features and illustrates the interfaces for these features. This document is intended to cover
the hardware aspects of the product, including electrical and mechanical.

The AirPrime HL7800 and HL7800-M modules belongs to the AirPrime HL Series from Essential
Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides
data connectivity on LTE (as listed in Table 1 Supported Bands/Connectivity).

The AirPrime HL7800 and HL7800-M modules supports a large variety of interfaces such as USB FS,
UART, ADC, and GPIOs to provide customers with the highest level of flexibility in implementing high­end solutions.

Table 1. Supported Bands/Connectivity

Transmit Band (Tx) Receive Band (Rx)

LTE Band

Minimum Maximum Minimum Maximum

B1 1920 MHz 1980 MHz 2110 MHz 2170 MHz
B2 1850 MHz 1910 MHz 1930 MHz 1990 MHz
B3 1710 MHz 1785 MHz 1805 MHz 1880 MHz
B4 1710 MHz 1755 MHz 2110 MHz 2155 MHz
B5 824 MHz 849 MHz 869 MHz 894 MHz
B8 880 MHz 915 MHz 925 MHz 960 MHz
B9 1749.9 MHz 1784.9 MHz 1844.9 MHz 1879.9 MHz * *
B10 1710 MHz 1770 MHz 2110 MHz 2170 MHz * *
B12 699 MHz 716 MHz 729 MHz 746 MHz
B13 777 MHz 787 MHz 746 MHz 756 MHz
B14 788 MHz 798 MHz 758 MHz 768 MHz
B17 704 MHz 716 MHz 734 MHz 746 MHz *
B18 815 MHz 830 MHz 860 MHz 875 MHz
B19 830 MHz 845 MHz 875 MHz 890 MHz
B20 832 MHz 862 MHz 791 MHz 821 MHz
B25 1850 MHz 1915 MHz 1930 MHz 1995 MHz
B26 814 MHz 849 MHz 859 MHz 894 MHz
B27 807 MHz 824 MHz 852 MHz 869 MHz
B28 703 MHz 748 MHz 758 MHz 803 MHz
B66 1710 MHz 1780 MHz 2110 MHz 2200 MHz

Cat-M1
(HL7800
and
HL7800-M)

 
 
 

 
 

 
 


 
 
 
 
 

 
 

Cat-NB1
(HL7800
only)

*

*


*

* Will be supported in a future release.

Note: RF bands supported are configurable through AT command. The software-based radio allows for

the ability to support extra bands for worldwide connectivity.

41111094 Rev 1.7 August 10, 2018 10

Product Technical Specification Introduction

1.1. Common Flexible Form Factor (CF3)

The AirPrime HL7800 and HL7800-M modules belong to the Common Flexible Form Factor
(CF3) family of modules. This family consists of a series of WWAN modules that share the same
mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF
factor provides a unique solution to a series of problems faced commonly in the WWAN module space
as it:

 Accommodates multiple radio technologies (LTE advanced) and band groupings.

 Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions.

 Offers electrical and functional compatibility.

 Provides Direct Mount as well as Socketability depending on customer needs.

3

form

1.2. Physical Dimensions

AirPrime HL7800 and HL7800-M modules are compact, robust, fully shielded modules with the
following dimensions:

 Length: 18.0 mm

 Width: 15.0 mm

 Thickness: 2.4 mm

 Weight: 1.17 g

Note: Dimensions specified above are typical values.

1.3. General Features

The table below summarizes the AirPrime HL7800 and HL7800-M’s features.

Table 2. General Features

Feature Description

 Small form factor (86-pad solderable LGA pad) – 15.0mm x 18.0mm x

2.4mm (nominal)

Physical

Power supply Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.35V

 Metal shield can
 RF connection pads (RF main and RF GPS)
 Baseband signals connection

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Product Technical Specification Introduction

Feature Description

 Cat-M1

 Power Class 3 (23dBm)
 Software based radio allowing support of extra bands for worldwide

operation (will be supported in a future release)

 Cat-NB1 (not supported on the HL7800-M)

 Power Class 3 (23dBm)

RF

 Software based radio allowing support of extra bands for worldwide

operation (will be supported in a future release)

 GPS*

 1575.42 MHz

SIM interface

Application interface

Protocol stack

Protocol stack

Note: The GPS receiver shares

The end-device target should allow GPS positioning for asset
management applications where infrequent and no real-time position
updates are required.

 1.8V only support (3V SIM is not supported)
 SIM extraction / hot plug detection
 SIM/USIM support
 Conforms with ETSI UICC Specifications.
 Supports SIM application tool kit with proactive SIM commands

 AT command interface – 3GPP 27.007 standard, plus proprietary extended

AT commands

 CMUX multiplexing over UART
 USB FS*

 Cat-M1

 3GPP Rel. 13
 Half-duplex
 Channel bandwidth 1.4MHz
 LTE carrier bandwidth 1.4 / 3 / 5 / 10 / 15 / 20 MHz
 Up to 375kbit/s uplink, 300 kbit/s downlink
 Extended Coverage Mode A
 PSM (Power Save Mode)
 I-DRX
 C-DRX
 Idle mode mobility
 Connected mode mobility
 eDRX (Extended Discontinuous Reception)
 CiOT optimizations (U-Plane, C-Plan)*

 Cat-NB1* (not supported on the HL7800-M)

 3GPP Rel. 13
 Half-duplex
 Channel bandwidth 180KHz
 LTE carrier bandwidth 1.4 / 3 / 5 / 10 / 15 / 20 MHz
 Up to 100 kbit/s in downlink
 Operational mode – Inband, Guard band, Standalone
 CioT EPS optimizations (Data over NAS)
 Extended coverage

 Flexible selection

 Manual system selection across RATs
 Dynamic system selection across RATs (preferred RAT)*

the

same RF resources as the 4G receiver.

41111094 Rev 1.7 August 10, 2018 12

Product Technical Specification Introduction

Feature Description

 SMS over SG

SMS

Connectivity

Environmental

RTC Real Time Clock (RTC)

* Will be available in a future release.

 MO/MT
 SMS storage to SIM card or ME storage

 Multiple cellular packet data profiles
 Sleep mode for minimum idle power draw
 Mobile-originated PDP context activation / deactivation
 Static and Dynamic IP address. The network may assign a fixed IP address

or dynamically assign one using DHCP (Dynamic Host Configuration
Protocol).

 PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
 RFC1144 TCP/IP header compression

Operating temperature ranges (industrial grade):

 Class A: -30°C to +70°C

Class B: -40°C to +85°C



1.4. Architecture

The figure below presents an overview of the AirPrime HL7800 and HL7800-M’s internal architecture
and external interfaces.

AirPrime HL7800 and HL7800-M

Baseband/Transceiver

RF 4G

LGA-

86

VGPIO

BAT_RTC*

USIM
USB*

PWR_ON_N

RESET_IN_N

PCM*

Transceiver

MCU DSP

PMU

Analog Baseband

Peripherals

RAM Memory

TX FEM

32.768KHz

26MHz

Embedded SIM

Flash Memory

RF GPS*

LGA-

86

* Will be available in a future release

Figure 1. Architecture Overview

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Product Technical Specification Introduction

1.5. Interfaces

The AirPrime HL7800 and HL7800-M modules provide the following interfaces and peripheral
connectivity:

 1x – VGPIO (1.8V)

 1x – BAT_RTC backup battery interface (will be available in a future release)

 1x – 1.8V USIM

 1x – USB FS (will be available in a future release)

 11x – GPIOs

 1x – 8-wire UART

 1x – Active Low POWER ON (will be available in a future release)

 1x – Active Low RESET

 2x – ADC (will be available in a future release)

 2x – System clock out (32.768 KHz and 26 MHz) (will be available in a future release)

 1x – PCM (will be available in a future release)

 1x – 4-wire UART for debug interface only

 1x – Wake up signal

 1x – Fast shutdown signal (will be available in a future release)

 1x – Main RF Antenna

 1x – TX indicator

 1x – GPS Antenna (will be available in a future release)

1.6. Connection Interface

AirPrime HL7800 and HL7800-M modules are LGA form factor devices. All electrical and mechanical
connections are made through the 86 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview (Top View)

The 86 pads have the following distribution:

 66 inner signal pads, 1x0.5mm, pitch 0.8mm

 16 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

 4 outer corner ground pads, 0.85x0.97mm

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Product Technical Specification Introduction

1.7. ESD Specifications

 IEC-61000-4-2 (test carried out on test vehicle including ESD protection)

 Contact Voltage: ±2kV, ±4kV, ±6kV (design target)
 Air Voltage: ±2kV, ±4kV, ±8kV (design target)

 Unless otherwise specified:

 JESD22-A114 ± 250kV Human Body Model
 JESD22-C101C ± 250V Charged Device Model

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table
below.

Table 3. Environmental Specifications

Conditions Range

Operating Class A -30°C to +70°C
Operating Class B -40°C to +85°C
Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

 Shall exhibit normal function during and after environmental exposure.

 Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

 Shall remain fully functional during and after environmental exposure

 Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

 Unless otherwise stated, full performance should return to normal after the excessive

constraint(s) have been removed.

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Product Technical Specification Introduction

1.8.2. Frequency Drift Correction

The HL7800 and HL7800-M are environmental sensitive and able to correct temperature and aging
effects automatically. Parameters to be considered when addressing the environmental effect on the
HL7800 and HL7800-M are as follows:

 Maximum deviation correction: 20 ppm

 Environmental Temperature effect: 0.5 ppm

 Factory reflow effect: 1 ppm + 1 ppm / reflow

 Aging effect: 1 ppm /year of use

For example, if an HL7800 module is mounted on a single side (1 reflow) customer PCB and used for
10 years between -40 and +85°C, the frequency drift will be up to 0.5 + (1 + 1) + (1 * 10) = 12.5 ppm,
which is in the limits of the 20 ppm maximum correction.

1.8.3. ATEX Compliance

The following table lists the inductor and capacitor values to be considered for ATEX certification of
the system hosting the HL7800 and HL7800-M modules. All supplies in the modules are linear LDO
except for one 1.3V DC/DC step-down.

Table 4. Values for ATEX Compliance

Parameter Valu e Tolerance

Total Inductance 2.21 µH 30%
Total Capacitance 43.64 µF 20 %

1.8.4. Regulatory

The AirPrime HL7800 and HL7800-M modules will be compliant with the following regulations:

 RED

 FCC

 IC

 RCM

 JRF/JPA

1.8.5. RoHS Directive Compliance

AirPrime HL7800 and HL7800-M modules are compliant with RoHS Directive 2011/65/EU, including
directive 2015/863 amending annex II, which sets limits for the use of certain restricted hazardous
substances. This directive states that electrical and electronic equipment put on the market does not
contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB),
polybrominated diphenyl ethers (PBDE), Bis (2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate
(BBP), Dibutyl phthalate (DBP) or Diisobutyl phthalate (DIBP) above threshold limits.

41111094 Rev 1.7 August 10, 2018 16

Product Technical Specification Introduction

1.8.6. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.

1.9. References

[1] AirPrime HL78xx Customer Process Guidelines

Reference Number: 41112095

[2] AirPrime HL78xx AT Commands Interface Guide

Reference Number: 41111821

[3] AirPrime HL Series Development Kit User Guide

Reference Number: 4114877

[4] AirPrime HL7800 Low Power Modes Application Note

Reference Number: 41112578

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2. Pad Definition

AirPrime HL7800 and HL7800-M pins are divided into 2 functional categories.

 Core functions and associated pins cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of

modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.

 Extension functions and associated pins bring additional capabilities to the customer. Whenever an Extension function is available on a module, it

is always at the same pad location.

Other pins marked as “not connected” or “reserved” should not be used.

Table 5. Pin Definition

Pad # Signal Name Function I/O

C1 GPIO1 General purpose input/output I/O PU 1.8V Left Open Extension
C2 UART1_RI UART1 Ring indicator O PU 1.8V Connect to test point Core
C3 UART1_RTS UART1 Request to send I PU 1.8V Connect to test point Core
C4 UART1_CTS UART1 Clear to send O PU 1.8V Connect to test point Core
C5 UART1_TX UART1 Transmit data I PU 1.8V Connect to test point Core
C6 UART1_RX UART1 Receive data O PU 1.8V Connect to test point Core
C7 UART1_DTR UART1 Data terminal ready I PU 1.8V Connect to test point Core
C8 UART1_DCD UART1 Data carrier detect O PU 1.8V Connect to test point Core
C9 UART1_DSR UART1 Data set ready O PU 1.8V Connect to test point Core
C10 GPIO2 General purpose input/output I/O PD 1.8V Connect to test point Core
C11 RESET_IN_N Input reset signal I 1.8V Left Open Core
C12 USB_D- USB Data Negative (Full Speed) I/O 3.3V Connect to test point Extension
C13 USB_D+ USB Data Positive (Full Speed) I/O 3.3V Connect to test point Extension

Pre and Post
Reset State*

Power Supply
Domain

Recomm endation
for Unused Pads

Type

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