Sierra Wireless HL7748 User Manual

AirPrime HL77xx

Product Technical Specification

41110555

1.0

September 21, 2017

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

is open. Sierra Wireless modems may be used at this time.

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.

41110555 Rev 1.0 September 21, 2017 2

Product Technical Specification

Patents

This product may contain technology developed by or for Sierra Wireless Inc.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents

licensed from MMP Portfolio Licensing.

Copyright

© 2017 Sierra Wireless. All rights reserved.

Trademarks

Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other

countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.

Contact Information

Sales information and technical support,
including warranty and returns

Corporate and product information

Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795

6:00 am to 5:00 pm PST

Web: sierrawireless.com

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Product Technical Specification

Document History

Version Date Updates

1.0 September 21, 2017 Creation

41110555 Rev 1.0 September 21, 2017 4

Contents

1. INTRODUCTION ................................................................................................ 10

1.1. Common Flexible Form Factor (CF3) ................................................................................ 10

1.2. Physical Dimensions ......................................................................................................... 11

1.3. General Features ............................................................................................................... 11

1.4. Architecture........................................................................................................................ 13

1.5. Interfaces ........................................................................................................................... 13

1.6. Connection Interface ......................................................................................................... 14

1.7. ESD ................................................................................................................................... 15

1.8. Environmental and Certifications ....................................................................................... 15

1.8.1.

Environmental Specifications ................................................................................... 15

1.8.2.

Regulatory ................................................................................................................ 16

1.8.3.

RoHS Directive Compliant ....................................................................................... 16

1.8.4.

Disposing of the Product .......................................................................................... 16

1.9. References ........................................................................................................................ 16

2. PAD DEFINITION ............................................................................................... 17

2.1. Pad Types .......................................................................................................................... 21

2.2. Pad Configuration (Top View, Through Module) ............................................................... 22

3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23

3.1. Power Supply..................................................................................................................... 23

3.2. Current Consumption ........................................................................................................ 24

3.3. VGPIO ............................................................................................................................... 25

3.4. USIM Interface ................................................................................................................... 25

3.4.1.

UIM1_DET ............................................................................................................... 26

3.5. USB Interface .................................................................................................................... 26

3.6. Electrical Information for Digital I/O ................................................................................... 27

3.7. General Purpose Input/Output (GPIO) .............................................................................. 28

3.8. Main Serial Link (UART1) .................................................................................................. 28

3.9. Power On Signal (PWR_ON_N) ........................................................................................ 29

3.10. Reset Signal (RESET_IN_N) ............................................................................................. 30

3.11. Analog to Digital Converter (ADC)..................................................................................... 31

3.12. Clock Interface ................................................................................................................... 32

3.13. Debug Interface ................................................................................................................. 32

3.14. JTAG Interface................................................................................................................... 32

3.15. Wake Up Signal (WAKE-UP) ............................................................................................. 33

3.16. Fast Shutdown Signal (FAST_SHUTDOWN) .................................................................... 34

3.17. PWM .................................................................................................................................. 34

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Product Technical Specification

3.18. RF Interface ....................................................................................................................... 35

3.18.1. RF Connection ......................................................................................................... 35

3.18.2. RF Performances ..................................................................................................... 35

4. MECHANICAL DRAWINGS ............................................................................... 37

5. DESIGN GUIDELINES ....................................................................................... 39

5.1. Power-Up Sequence ......................................................................................................... 39

5.2. Module Switch-Off ............................................................................................................. 39

5.3. Sleep Mode Management ................................................................................................. 39

5.4. Power Supply Design ........................................................................................................ 40

5.5. Power On Connection Examples....................................................................................... 40

5.6. USIM1 Application ............................................................................................................. 41

5.7. EMC and ESD Guidelines for USIM1 Card ....................................................................... 41

5.8. ESD Guidelines for USB .................................................................................................... 42

5.9. PWM .................................................................................................................................. 42

6. RELIABILITY SPECIFICATION (TBC) .............................................................. 44

6.1. Reliability Compliance ....................................................................................................... 44

6.2. Reliability Prediction Model ............................................................................................... 44

6.2.1.

Life Stress Test ........................................................................................................ 44

6.2.2.

Environmental Resistance Stress Tests .................................................................. 45

6.2.3.

Corrosive Resistance Stress Tests ......................................................................... 45

6.2.4.

Thermal Resistance Cycle Stress Tests .................................................................. 46

6.2.5.

Mechanical Resistance Stress Tests ....................................................................... 47

6.2.6.

Handling Resistance Stress Tests ........................................................................... 48

7. FCC LEGAL INFORMATION ............................................................................. 49

8. ORDERING INFORMATION .............................................................................. 51

9. TERMS AND ABBREVIATIONS ........................................................................ 52

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List of Figures

Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.

Figure 10. Dimensions and Footprint Drawing ................................................................................. 38

Figure 11. Voltage Limiter Example ................................................................................................. 40

Figure 12. PWR_ON_N Connection Example with Switch ............................................................... 40

Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor ........................... 40

Figure 14. Design Application with USIM1 Slot ................................................................................ 41

Figure 15. EMC and ESD Components Close to the USIM1. .......................................................... 41

Figure 16. ESD Protection for USB .................................................................................................. 42

Figure 17. Example of an LED Driven by the PWM0 Output ........................................................... 42

Architecture Overview ..................................................................................................... 13

Mechanical Overview (Top View and Bottom View) ....................................................... 14

Actual Module (Top View) ............................................................................................... 14

Actual Module (Bottom View) .......................................................................................... 14

Pad Configuration ............................................................................................................ 22

PWR_ON_N and PWR_OFF Sequence ......................................................................... 30

JTAG Timing Waveform .................................................................................................. 33

Relative Timing for the PWM Output ............................................................................... 34

Mechanical Drawing ........................................................................................................ 37

Figure 18. Example of a BUZZER Driven by the PWM0 Output ...................................................... 43

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List of Tables

Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.

Table 10. Current Consumption (Nominal Voltage at 3.7V; Ambient Temperature at +25°C) ....... 24

Table 11. VGPIO Pad Description ................................................................................................... 25

Table 12. VGPIO Electrical Characteristics ..................................................................................... 25

Table 13. USIM1 Pad Description ................................................................................................... 26

Table 14. USIM1 Electrical Characteristics ..................................................................................... 26

Table 15. USB Pad Description ....................................................................................................... 26

Table 16. USB Electrical Characteristics ......................................................................................... 27

Table 17. Digital I/O Electrical Characteristics ................................................................................ 27

Supported Bands/Connectivity ........................................................................................ 10

General Features ............................................................................................................ 11

ESD Specifications .......................................................................................................... 15

Environmental Specifications .......................................................................................... 15

Pin Definition ................................................................................................................... 17

Pad Type Codes .............................................................................................................. 21

Power Supply Pad Description ........................................................................................ 23

Power Supply Electrical Characteristics .......................................................................... 23

Low Current Consumption Mode ..................................................................................... 24

Table 18. GPIO Pad Description ..................................................................................................... 28

Table 19. UART1 Pad Description .................................................................................................. 28

Table 20. PWR_ON_N Pad Description .......................................................................................... 29

Table 21. PWR_ON_N Electrical Characteristics ........................................................................... 29

Table 22. RESET_IN_N Pad Description ........................................................................................ 30

Table 23. RESET_IN_N Electrical Characteristics .......................................................................... 31

Table 24. ADC Pad Description ...................................................................................................... 31

Table 25. ADC Electrical Characteristics ........................................................................................ 31

Table 26. Clock Interface Pad Description ...................................................................................... 32

Table 27. Software Trace Pad Description...................................................................................... 32

Table 28. JTAG Pad Description ..................................................................................................... 32

Table 29. JTAG Electrical Characteristics ....................................................................................... 33

Table 30. WAKE-UP Pad Description ............................................................................................. 33

Table 31. WAKE-UP Electrical Characteristics ............................................................................... 34

Table 32. FAST_SHUTDOWN Pad Description ............................................................................. 34

Table 33. FAST_SHUTDOWN Electrical Characteristics ............................................................... 34

Table 34. PWM Pad Description ..................................................................................................... 35

Table 35. PWM Electrical Characteristics (TBC)............................................................................. 35

Table 36. RF Pad Connection ......................................................................................................... 35

Table 37. Typical RX Sensitivity ...................................................................................................... 36

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Product Technical Specification

Table 38. Standards Conformity ...................................................................................................... 44

Table 39. Life Stress Test................................................................................................................ 44

Table 40. Environmental Resistance Stress Tests ......................................................................... 45

Table 41. Corrosive Resistance Stress Tests ................................................................................. 45

Table 42. Thermal Resistance Cycle Stress Tests ......................................................................... 46

Table 43. Mechanical Resistance Stress Tests .............................................................................. 47

Table 44. Handling Resistance Stress Tests .................................................................................. 48

Table 45. Ordering Information ....................................................................................................... 51

41110555 Rev 1.0 September 21, 2017 9

1. Introduction

This document is the Product Technical Specification for the AirPrime HL77xx series of embedded
modules. It defines the high-level product features and illustrates the interfaces for these features; and
is intended to cover the hardware aspects of the product, including electrical and mechanical.

Variants covered in this document are:

• HL7718

• HL7748

• HL7749

The AirPrime HL77xx modules belong to the AirPrime HL Series from Essential Connectivity Module
family. These are industrial grade Embedded Wireless Modules that provides data connectivity on
LTE networks (as listed in Table 1 Supported Bands/Connectivity).

The AirPrime HL77xx modules support a large variety of interfaces such as USB 2.0, UART, ADC,
USIM interface, PWM and GPIOs to provide customers with the highest level of flexibility in
implementing high-end solutions.

Table 1. Supported Bands/Connectivity

RF Band Transmit Band (Tx) Receive Band (Rx)

LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23dBm ± 2dBm
LTE B3 1710 to 1785 MHz 1805 to 1880 MHz 23dBm ± 2dBm
LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23dBm ± 2dBm
LTE B12 699 to 716 MHz 729 to 746 MHz 23dBm ± 2dBm
LTE B13 777 to 787 MHz 746 to 756 MHz 23dBm ± 2dBm
LTE B28 703 to 748 MHz 758 to 803 MHz 23dBm ± 2dBm

Maximum
Output Power



HL7718

HL7748






HL7749





1.1. Common Flexible Form Factor (CF3)

The AirPrime HL77xx modules belong to the Common Flexible Form Factor (CF3) family of modules.
This family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF
solution to a series of problems faced commonly in the WWAN module space as it:

• Accommodates multiple radio technologies (LTE advanced) and band groupings.

• Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions.

3

form factor provides a unique

• Offers electrical and functional compatibility.

• Provides Direct Mount as well as Socketability depending on customer needs.

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Product Technical Specification Introduction

1.2. Physical Dimensions

AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions:

• Length: 23 mm

• Width: 22 mm

• Thickness: 2.5 mm

• Weight: 2.6 g

Note: Dimensions specified above are typical values.

1.3. General Features

The table below summarizes the AirPrime HL77xx modules’ features.

Table 2. General Features

Feature Description

• Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm
(nominal)

Physical

Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V

RF

SIM interface

Application interface

• Metal shield can.

• RF connection pads (RF main interface)

• Baseband signals connection

HL7718 (Mono-band LTE):

• LTE B13

HL7748 (Tri-band LTE):

• LTE B2

• LTE B4

• LTE B12

HL7749 (Dual-band LTE):

• LTE B3

• LTE B28

• Only 1.8V support for USIM1

• SIM extraction / hot plug detection

• SIM/USIM support

• Conforms with ETSI UICC Specifications.

• Supports SIM application tool kit with proactive SIM commands

• NDIS NIC interface support (Windows 7, Windows 8, Linux)

• MBIM support

• Multiple non-multiplexed USB channel support

• Dial-up networking

• USB selective suspend to maximize power savings

• CMUX multiplexing over UART

• AT command interface – 3GPP 27.007 standard, plus proprietary extended

AT commands

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Product Technical Specification Introduction

Feature Description

Single mode LTE operation:

• LTE FDD, bandwidth 1.4-20 MHz

Protocol stack

SMS

Connectivity

Environmental

RTC Real Time Clock (RTC)

• System Release: 3GPP Rel. 13

• Category M1 (up to 375 kbit/s in uplink, 300 kbit/s in downlink)

• Max modulation 16 QAM UL/DL

• Intra-frequency and inter-frequency mobility

• SMS over SGs

• SMS MO and MT

• SMS saving to SIM card or ME storage

• SMS reading from SIM card or ME storage

• SMS sorting

• SMS concatenation

• SMS Status Report

• SMS replacement support

• SMS storing rules (support of AT+CNMI, AT+CNMA)

• Multiple cellular packet data profiles

• Sleep mode for minimum idle power draw

• Mobile-originated PDP context activation / deactivation

• Static and Dynamic IP address. The network may assign a fixed IP address

or dynamically assign one using DHCP (Dynamic Host Configuration
Protocol).

• PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context

• RFC1144 TCP/IP header compression

Operating temperature ranges (industrial grade):

• Class A: -30°C to +70°C

• Class B: -40°C to +85°C

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Product Technical Specification Introduction

1.4. Architecture

The figure below presents an overview of the AirPrime HL77xx modules’ internal architecture and
external interfaces.

Note: Dotted parts are optional depending on variant.

AirPrime HL7718, HL7748 and HL7749

26MHz

VGPIO

LGA-

146

RESET_IN_N

PWR_ON

USB

SIM

Switch

Embedded

SIM

Figure 1. Architecture Overview

Transceiver

Baseband

MCU DSP

PMU

Analog Baseband

Peripherals

RAM Memory

32.768KHz

RX

SAW

Filters

Flash

Memory

Front-End

VBATT_PA

Module

(SAW/PA/

Switch)

LGA-

146

1.5. Interfaces

The AirPrime HL77xx modules provide the following interfaces and peripheral connectivity:

• 1x - VGPIO (1.8V)

• 1x - 1.8V USIM

• 1x - eUICC/USIM (optional embedded SIM)

• 1x - USB 2.0

• 10x - GPIOs (1 of which has a multiplex)

• 1x - 8-wire UART

• 1x - Active Low POWER ON

• 1x - Active Low RESET

• 2x - ADC

• 2x - System Clock Out (32,768KHz and 26MHz)

• 1x – Debug Interface

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Product Technical Specification Introduction

• 1x - JTAG Interface

• 1x - Wake up signal

• 1x - Fast shutdown signal

• 1x - PWM

• 1x - Main RF Antenna

1.6. Connection Interface

The AirPrime HL77xx modules are an LGA form factor device. All electrical and mechanical
connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview (Top View and Bottom View)

The 146 pads have the following distribution:

• 66 inner signal pads, 1x0.5mm, pitch 0.8mm

• 1 reserved test point (do not connect), 1.0mm diameter

• 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

• 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

• 4 inner corner ground pads, 1x1mm

• 4 outer corner ground pads, 1x0.9mm

Figure 3. Actual Module (Top View)

Figure 4. Actual Module (Bottom View)

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Product Technical Specification Introduction

1.7. ESD

Refer to the following table for ESD Specifications.

Table 3. ESD Specifications

Category Connection Specification

Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)

Unless otherwise specified:

Non-operational

Signals

Host connector
interface

SIM connector Adding ESD protection is highly recommended at the point where
Other host signals

• JESD22-A114 ± 1kV Human Body Model (TBC)

• JESD22-A115 ± 200V Machine Model (TBC)

•

JESD22-C101C ± 250V Charged Device Model (TBC)

the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table
below.

Table 4. Environmental Specifications

Conditions Range

Operating Class A -30°C to +70°C
Operating Class B -40°C to +85°C
Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

• Shall exhibit normal function during and after environmental exposure.

• Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

• Shall remain fully functional during and after environmental exposure

• Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

• Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.

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Product Technical Specification Introduction

1.8.2. Regulatory

The AirPrime HL7718 and HL7748 modules will be compliant with FCC regulations, while the
AirPrime HL7749 module will be compliant with RCM regulations.

1.8.3. RoHS Directive Compliant

The AirPrime HL77xx modules are compliant with RoHS Directive 2011/65/EU which sets limits for
the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.

1.9. References

[1] AirPrime HL Series Customer Process Guidelines

Reference Number: 4114330

[2] AirPrime HL77xx AT Commands Interface Guide

Reference Number: 41110842

[3] AirPrime HL Series Development Kit User Guide

Reference Number: 4114877

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2. Pad Definition

AirPrime HL77xx pads are divided into 2 functional categories.

• Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.

• Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.

Other pads marked as “not connected” or “reserved” should not be used.

Table 5. Pin Definition

Pad # Signal Name Function I/O

1 GPIO1 General purpose input/output I/O - 1.8V Left Open Extension
2 UART1_RI UART1 Ring indicator O - 1.8V Connect to test point Core
3 UART1_RTS UART1 Request to send I L 1.8V Connect to test point Core
4 UART1_CTS UART1 Clear to send O L 1.8V Connect to test point Core
5 UART1_TX UART1 Transmit data I - 1.8V Connect to test point Core
6 UART1_RX UART1 Receive data O - 1.8V Connect to test point Core
7 UART1_DTR UART1 Data terminal ready I L 1.8V Connect to test point Core
8 UART1_DCD UART1 Data carrier detect O L 1.8V Connect to test point Core
9 UART1_DSR UART1 Data set ready O L 1.8V Connect to test point Core
10 GPIO2 General purpose input/output I/O - 1.8V Connect to test point Core
11 RESET_IN_N Input reset signal I L 1.8V Left Open Core

Active
Low/High

Power
Supply
Domain

Recommendation
for Unused Pads

Type

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Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

12 USB_D-

13 USB_D+

14 NC Not Connected Not connected
15 NC Not Connected Not connected
16 NC Not Connected Not connected
17 NC Not Connected (Reserved for future use) Not connected
18 NC Not Connected (Reserved for future use) Not connected
19 WAKE-UP Wake Up I H 1.8V Left Open Extension
20 NC Not Connected (Reserved for future use) Not connected
21 NC Not Connected Not connected
22 GNSS_FREQ_OUT 26MHz System Clock Output O - 1.8V Left Open Extension
23 32K_CLKOUT 32.768kHz System Clock Output O - 1.8V Left Open Extension
24 ADC1 Analog to digital converter I - 1.2V Left Open Extension
25 ADC0 Analog to digital converter I - 1.2V Left Open Extension
26 UIM1_VCC 1.8V USIM1 Power supply O - 1.8V Mandatory connection Core
27 UIM1_CLK 1.8V USIM1 Clock O - 1.8V Mandatory connection Core
28 UIM1_DATA 1.8V USIM1 Data I/O - 1.8V Mandatory connection Core
29 UIM1_RESET 1.8V USIM1 Reset O L 1.8V Mandatory connection Core
30 GND Ground 0V 0V Mandatory connection Extension
31 NC Not Connected Not connected
32 GND Ground 0V 0V Mandatory connection Extension
33 PCM_OUT* PCM data out O - 1.8V Left Open Extension
34 PCM_IN* PCM data in I - 1.8V Left Open Extension
35 PCM_SYNC* PCM sync out I/O - 1.8V Left Open Extension

USB Data Negative (Low / Full Speed)
USB Data Negative (High Speed) 0.38V
USB Data Positive (Low / Full Speed)
USB Data Positive (High Speed) 0.38V

I/O -

I/O -

Active
Low/High

Power
Supply
Domain

3.3V

3.3V

Recommendation
for Unused Pads

Connect to test point Extension

Connect to test point Extension

Type

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Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

36 PCM_CLK* PCM clock I/O - 1.8V Left Open Extension
37 GND Ground 0V 0V Mandatory connection Core
38 NC Not Connected (Reserved for future use) Not connected
39 GND Ground 0V 0V Mandatory connection Core
40 GPIO7 General purpose input/output I/O - 1.8V Left Open Core
41 GPIO8 General purpose input/output I/O - 1.8V Connect to test point Core
42 NC Not Connected (Reserved for future use) Not connected
43 NC Not Connected (Reserved for future use) Not connected
44 DEBUG_TX Debug Transmit data O 1.8V Left Open Extension
45 VGPIO GPIO voltage output O 1.8V Left Open Core
46 GPIO6 General purpose input/output I/O - 1.8V Left Open Core
47 NC Not Connected (Reserved for future use) Left Open Not connected
48 GND Ground 0V 0V Mandatory connection Core
49 RF_MAIN RF Input/output - Mandatory connection Core
50 GND Ground 0V 0V Mandatory connection Core
51 DEBUG_RX Debug Receive data I 1.8V Left Open Extension
52 GPIO10 General purpose input/output I/O - 1.8V Left Open Extension
53 GPIO11 General purpose input/output I/O - 1.8V Left Open Extension
54 GPIO15 General purpose input/output I/O - 1.8V Left Open Extension
55 NC Not Connected Not connected
56 NC Not Connected Not connected
57 NC Not Connected Not connected
58 PWM0 Pulse Width Modulation O - 1.8V/3V Left Open Extension
59 PWR_ON_N Active Low Power On control signal I L 1.8V Mandatory connection Core
60 NC Not Connected Not connected

Active
Low/High

Power
Supply
Domain

Recommendation
for Unused Pads

Type

41110555 Rev 1.0 September 21, 2017 19

Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

61 VBATT_PA

62 VBATT_PA

63 VBATT Power supply I -

64 UIM1_DET / GPIO3 USIM1 Detection / General purpose input/output I/O H 1.8V Left Open Core
65 FAST_SHUTDOWN Fast Shutdown I L 1.8V Left Open Extension
66 GPIO5 General purpose input/output I/O - 1.8V Left Open Extension
67-70 GND Ground GND 0V Core
71 -

166
167 -

234
236 JTAG_RESET JTAG RESET I L 1.8V Left Open Extension
237 JTAG_TCK JTAG Test Clock I - 1.8V Left Open Extension
238 JTAG_TDO JTAG Test Data Output O - 1.8V Left Open Extension
239 JTAG_TMS JTAG Test Mode Select I - 1.8V Left Open Extension
240 JTAG_TRST JTAG Test Reset I L 1.8V Left Open Extension
241 JTAG_TDI JTAG Test Data Input I - 1.8V Left Open Extension
242 NC Not Connected Not connected

Note: These pads are not available on the AirPrime HL77xx modules.

GND Ground GND 0V Core

Power supply (refer to section 3.1 Power Supply
for more information)

Power supply (refer to section 3.1 Power Supply
for more information)

I -

I -

Active
Low/High

Power
Supply
Domain

3.2V (min)

3.7V (typ)

4.5V (max)

3.2V (min)

3.7V (typ)

4.5V (max)

3.2V (min)

3.7V (typ)

4.5V (max)

Recommendation
for Unused Pads

Mandatory connection Core

Mandatory connection Core

Mandatory connection Core

Type

* This pad is not supported on the AirPrime HL77xx.

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Product Technical Specification Pad Definition

2.1. Pad Types

Table 6. Pad Type Codes

Type Definition

I Digital Input
O Digital Output
I/O Digital Input / Output
L Active High
H Active Low
T Tristate
T/PU Tristate with pull-up enabled
T/PD Tristate with pull-down enabled
PU Pull-up enabled
PD Pull-down enabled
N/A Not Applicable

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Product Technical Specification Pad Definition

2.2. Pad Configuration (Top View, Through Module)

NCNCNCNCNC

168

GND

WAKE-U P

NC

NC

GNSS_F REQ_OUT

32K_CLKOUT

ADC1

ADC0

UIM1_VCC

UIM1_CLK

UIM1_D ATA

UIM1_RES ET

GND

NC

GND

PCM_OUT

GND

68

181716151413121110

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

69

34353637383940414243444546

169

PCM_IN

Figure 5. Pad Configuration

USB_D+

USB_D-

RESET_I N_N

GPIO2

UART1_D SR

UART1_D CD

UART1_D TR

UART1_R X

UART1_TX

UART1_CT S

UART1_R TS

987

6

432

5

192 193 194 1 95 196 197 198 171

191 214 215 2 16 217 218 199 172

190 213 228 2 29 230 219 200 173

189 212 227 2 34 231 220 201 174

188 211 226 2 33 232 221 202 175

187 210 225 2 24 223 222 203 176

186 209 208 2 07 206 205 204 177

185 184 183 1 82 181 180 179 178

484950

47

NC

GNDNCGND

PCM_CLK

PCM_SY NC

NC

GPIO7

GPIO8

NC

GND

GPIO6

VGPIO

DEBUG_TX

RF_MAI N

UART1_R I

GPIO1

JTAG_TDI

NC

JTAG_TRS T

236237238239240241242

1

51

167

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

70

GND

GPIO5

FAST_SHUT DO WN

UIM1_DET / GPIO3

VBATT

VBATT_PA

VBATT_PA

NC

PWR_ON_ N

PWM0

NC

NC

NC

GPIO15

GPIO11
GPIO10

GND

JTAG_TMS

Core pin

Extension pin

JTAG_RESET

JTAG_TDO

JTAG_TCK

236237238239240241242

170

GND

DEBUG _RX

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3. Detailed Interface Specifications

Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C.

For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply.
For some specific applications, AirPrime HL77xx modules support separate VBATT and VBATT_PA
connections if requirements below are fulfilled.

3.1. Power Supply

The AirPrime HL77xx modules are supplied through the VBATT and VBATT_PA signals.
Refer to the following table for the pad description of the Power Supply interface.

Table 7. Power Supply Pad Description

Pad Number Signal Name I/O Description

63 VBATT I Power supply (base band)
61, 62 VBATT_PA I Power supply (radio frequency)
37, 39, 48, 67-70, 167-234 GND Ground

Refer to the following table for the electrical characteristics of the Power Supple interface.

Table 8. Power Supply Electrical Characteristics

Supply Minimum Typical Maximum

VBATT voltage (V) 3.21 3.7 4.5
VBATT_PA voltage (V) Full Specification 3.21 3.7 4.5
VBATT_PA voltage (V) Extended Range 2.82 (TBC) 3.7 4.5

1 This value must be guaranteed during the burst
2 No guarantee of 3GPP performances over extended range

Note: Load capacitance for VBATT is around 37µF ± 20% (TBC) embedded inside the module.

Load capacitance for VBATT_PA is around 11µF ± 20% (TBC) embedded inside the module.

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Product Technical Specification Detailed Interface Specifications

BW=10Mhz RMC

BW=10Mhz RMC

BW=10Mhz RMC

BW=10Mhz RMC

BW=10Mhz RMC

BW=10Mhz RMC

3.2.

3.2. Current Consumption

The following table lists the current consumption of the AirPrime HL77xx modules at different
conditions.

Note: Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF

ports with VSWR1:1 and CMW500. Maximum values are defined with worst conditions among
supported ranges of voltages and temperature (50Ω, VSWR1:1 and CMW500).

Table 9. Low Current Consumption Mode

Parameter Typical Maximum Unit

Off mode 15 TBD µA
Sleep mode (deregistered from the network) 1.3 TBD mA
PSM mode 100 (TBC) TBD µA

Table 10. Current Consumption (Nominal Voltage at 3.7V; Ambient Temperature at +25°C)

Parameter Band Frequency Typical Unit

LTE in communication mode (TX Max)
Pout=23dBm

mode 4RB_DL & 6RB_UL

LTE in communication mode (TX Max)
Pout=23dBm

mode 4RB_DL & 6RB_UL

LTE in communication mode (TX Max)
Pout=23dBm

mode 4RB_DL & 6RB_UL

LTE in communication mode (TX Max)
Pout=23dBm

mode 4RB_DL & 6RB_UL

LTE in communication mode (TX Max)
Pout=23dBm

mode 4RB_DL & 6RB_UL
LTE in communication mode (TX Max)

Pout=23dBm
mode 4RB_DL & 6RB_UL

1810 MHz 290 mA

B3

B28

B12

B2

B4

B13 751 MHz 250 mA

1843 MHz 285 mA
1875 MHz 285 mA
763 MHz 275 mA
781 MHz 268 mA
798 MHz 260 mA
734 MHz 265 mA
738 MHz 260 mA
741 MHz 260 mA
1935 MHz 290 mA
1960 MHz 292 mA
1985 MHz 303 mA
2115 MHz 280 mA
2133 MHz 284 mA
2150 MHz 280 mA

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Product Technical Specification Detailed Interface Specifications

3.3. VGPIO

The VGPIO output can be used to:

• Pull-up signals such as I/Os

• Supply the digital transistors driving LEDs

The VGPIO output is available when the AirPrime HL77xx module is switched ON.
Refer to the following table for the pad description of the VGPIO interface.

Table 11. VGPIO Pad Description

Pad Number Signal Name I/O Description

45 VGPIO O GPIO voltage output

Refer to the following table for the electrical characteristics of the VGPIO interface.

Table 12. VGPIO Electrical Characteristics

Parameter Minimum Typical Maximum Remarks

Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode
Current capability

Active Mode (mA)
Current capability

Sleep Mode (mA)
Rise Time (ms) - - TBD Start-Up time from 0V

- - TBD

- - TBD

Power management support up to
(TBD) mA output in Active mode

Power management support up to
(TBD) mA output in Sleep mode

3.4. USIM Interface

The AirPrime HL77xx modules have one physical USIM interface, USIM1, and an optional internal
USIM or eUICC.

The USIM1 interface allows control of a 1.8V USIM and is fully compliant with GSM 11.11
recommendations concerning USIM functions.

The five signals used by the UIM1 are as follows:

• UIM1_VCC: Power supply

• UIM1_CLK: Clock

• UIM1_DATA: I/O port

• UIM1_RESET: Reset

• UIM1_DET/GPIO3: Hardware SIM detection

Refer to the following table for the pad description of the USIM1 interface.

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Product Technical Specification Detailed Interface Specifications

Table 13. USIM1 Pad Description

Pad Number Signal Name Description Multiplex

26 UIM1_VCC 1.8V USIM1 Power supply
27 UIM1_CLK 1.8V USIM1 Clock
28 UIM1_DATA 1.8V USIM1 Data
29 UIM1_RESET 1.8V USIM1 Reset
64 UIM1_DET / GPIO3 1.8V USIM1 Detection GPIO3

Refer to the following table for the electrical characteristics of the USIM1 interface.

Table 14. USIM1 Electrical Characteristics

Parameter Minimum Typical Maximum Remarks

UIM1 Interface Voltage (V)
(VCC, CLK, IO, RESET)

UIM1 Detect - 1.80 - High active
UIM1_VCC Current (mA) - - 10 (TBC)

- 1.80 -

The appropriate output
voltage is auto detected and
selected by software.

Refer to section 5.6 USIM1 Application for a USIM application example.

3.4.1. UIM1_DET

UIM1_DET is used to detect and notify the application about the insertion and removal of a USIM
device in the USIM socket connected to the main USIM interface (UIM1). When a USIM is inserted, the
state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a USIM is removed, the state of
UIM1_DET transitions from logic 1 to logic 0.

Enabling or disabling this USIM detect feature can be done using an AT command. Refer to document
[2] AirPrime HL77xx AT Commands Interface Guide for more information.

3.5. USB Interface

The AirPrime HL77xx modules have one Universal Serial Bus interface compliant with USB Rev 2.0
(self-powered).

Refer to the following table for the pad description of the USB interface.

Table 15. USB Pad Description

Pad Number Signal Name I/O Function

12 USB_D- I/O USB Data Negative
13 USB_D+ I/O USB Data Positive

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Product Technical Specification Detailed Interface Specifications

Refer to the following table for the electrical characteristics of the USB interface.

Table 16. USB Electrical Characteristics

Parameter Minimum Typical Maximum Units

Input voltage at pins USB_D+ / USB_D- 3.15 3.3 3.45 V

3.6. Electrical Information for Digital I/O

The table below enumerates the electrical characteristics of the following digital interfaces:

• UART

• PCM

• JTAG

• GPIOs

• RESET

• PWM

• WAKE_UP

Table 17. Digital I/O Electrical Characteristics

Parameter Description Minimum Typical Maximum Units

VIH Logic High Input Voltage 0.85 x VDDIO* VDDIO* + 0.3 V
VIL Logic Low Input Voltage -0.3 0.25 x VDDIO* V

Input Leakage Current (either

IIH / IIL

VOH Logic High Output Voltage VDDIO* – 0.45 VDDIO* V
VOL Logic Low Output Voltage 0 0.8 V

IOH / IOL

RPU Internal Pull Down Resistor 53 89 164 KΩ
RPD Internal Pull Up Resistor 54 96 189 KΩ
Input

Capacitance

* VDDIO = VGPIO = 1.8V.

Low or High, and No Pull
enabled)

Output Leakage Current
(either Low or High) – assume

no external load

Input Pin Capacitance 7 pF

0.03 µA

0.03 µA

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Product Technical Specification Detailed Interface Specifications

3.7. General Purpose Input/Output (GPIO)

The AirPrime HL77xx modules provide 10 GPIOs, 1 of which has a multiplex.
The following table describes the pin description of the GPIO interface.

Table 18. GPIO Pad Description

Pad Number Signal Name

1 GPIO1 I/O 1.8V
10 GPIO2 I/O 1.8V
40 GPIO7 I/O 1.8V
41 GPIO8 I/O 1.8V
46 GPIO6 I/O 1.8V
52 GPIO10 I/O 1.8V
53 GPIO11 I/O 1.8V
54 GPIO15 I/O 1.8V
64 GPIO3 UIM1_DET I/O 1.8V
66 GPIO5 I/O 1.8V

Multiplex

I/O

Power Supply Domain

3.8. Main Serial Link (UART1)

The main serial link (UART1) is used for communication between the AirPrime HL77xx modules and a
PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface.

The main serial link (UART1) is an asynchronous serial interface.
The signals used by UART1 are as follows:

• TX data (UART1_TX)

• RX data (UART1_RX)

• Request To Send (UART1_RTS)

• Clear To Send (UART1_CTS)

• Data Terminal Ready (UART1_DTR)

• Data Set Ready (UART1_DSR)

• Data Carrier Detect (UART1_DCD)

• Ring Indicator (UART1_RI)

Note: Signal names are according to PC view.

Refer to the following table for the pad description of the main serial link (UART1) interface.

Table 19. UART1 Pad Description

Pad Number Signal Name* I/O* Description

2 UART1_RI O Signal incoming calls (data only), SMS, etc.
3 UART1_RTS I Request to send

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Product Technical Specification Detailed Interface Specifications

Pad Number Signal Name* I/O* Description

4 UART1_CTS O
5 UART1_TX I Transmit data

6 UART1_RX O Receive data

7 UART1_DTR I (active low)

8 UART1_DCD O Signal data connection in progress
9 UART1_DSR O Signal UART interface is ON

* According to PC view.

Note: UART1_CTS must be left floating or set to level “0” before starting the HL77xx module.

The AirPrime HL77xx is ready to receive AT
commands

Prevents the AirPrime HL77xx from entering sleep
mode, switches between data mode and command
mode, and wakes the module up.

3.9. Power On Signal (PWR_ON_N)

The PWR_ON_N signal is internally connected to the permanent 1.8V supply regulator inside the
AirPrime HL77xx module via a pull-up resistor. Once VBATT is supplied to the module, this 1.8V
supply regulator will be enabled and so the PWR_ON_N signal is by default at high level.

A low-level signal on PWR_ON_N must be provided to switch the AirPrime HL77xx module ON, and the
signal must be kept at low level to keep the module ON.

Refer to the following table for the pad description of the PWR_ON_N interface.

Table 20. PWR_ON_N Pad Description

Pad Number Signal Name I/O Description

59 PWR_ON_N I Power the AirPrime HL77xx On

Refer to the following table for the electrical characteristics of the PWR_ON_N interface.

Table 21. PWR_ON_N Electrical Characteristics

Parameter Minimum Typical Maximum

Input Voltage-Low (V) - 0.51 (TBC)
Input Voltage-High (V) 1.33 (TBC) - 2.2 (TBC)
Power-up period (ms) from PWR_ON_N falling edge Always set to GND - ­PWR_ON_N assertion time (ms) 25 (TBC)

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Product Technical Specification Detailed Interface Specifications

Power OFF

VBATT

RESET

PWR_ON_N

VGPIO ( pin 45 )

Base Band

PMU supply

Module is ‘ OFF ‘ Module is ‘ OFF ‘Module is ‘ ON ‘

Figure 6. PWR_ON_N and PWR_OFF Sequence

Power ON

Power OFF

Note: As PWR_ON_N is internally pulled up with 1MΩ, an open collector or open drain transistor must be

used for ignition.

VGPIO is an output from the module that can be used to check if the module is active.

• When VGPIO = 0V, the module is OFF

• When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)

Note: To power the module off, use AT command

AT+CPOF

or

AT+CPWROFF

.

3.10. Reset Signal (RESET_IN_N)

To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms (TBC). This
action will immediately restart the AirPrime HL77xx module with the PWR_ON_N signal at low level. (If
the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally
pulled up, an open collector or open drain transistor should be used to control this signal.

Note: As RESET_IN_N is referenced to the VGPIO signal (1kΩ pull-up resistor to VGPIO 1.8V) an open

collector or open drain transistor should be used to control this signal.

Refer to the following table for the pad description of the RESET_IN_N interface.

Table 22. RESET_IN_N Pad Description

Pad Number

12 RESET_IN_N I Hardware reset the module

Signal Name

I/O

Description

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Product Technical Specification Detailed Interface Specifications

Refer to the following table for the electrical characteristics of the RESET_IN_N interface.

Table 23. RESET_IN_N Electrical Characteristics

Parameter Minimum Typical Maximum

Input Voltage-Low (V) - 0.51 (TBC)
Input Voltage-High (V) 1.33 (TBC) - 2.2 (TBC)
Reset assertion time (ms) 20 (TBC) - ­Power-up period (ms) from RESET_IN_N falling edge* 2000 (TBC) - -

* With the PWR_ON_N signal at low level.

3.11. Analog to Digital Converter (ADC)

Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by AirPrime HL77xx modules.
These converters are 8-bits resolution ADCs ranging from 0 to 1.8V.

Typical ADC use is for monitoring external voltage, wherein an application is used to safely power OFF
an external supply in case of overvoltage.

Refer to the following table for the pad description of the ADC interface.

Table 24. ADC Pad Description

Pad Number Signal Name I/O Description

24 ADC1 I Analog to digital converter
25 ADC0 I Analog to digital converter

Refer to the following table for the electrical characteristics of the ADC interface.

Table 25. ADC Electrical Characteristics

Parameter Minimum Typical Maximum Unit Remarks

ADCx Resolution - 8 - bits
Conversion Rate - - 2 MHz
Input Voltage Range 0 - 1.8 V General purpose input
Integral Nonlinearity - ± 1 ± 2 LSB
Differential Nonlinearity - ± 0.5 ± 1 LSB
Offset Error - ± 1 ± 2 LSB %FS
Gain Error - ± 1 ± 2 LSB %FS
Input Resistance 43 52 61 kΩ
Input Capacitance

during sampling phase

- 3 pF

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Product Technical Specification Detailed Interface Specifications

3.12. Clock Interface

The AirPrime HL77xx modules support two digital clock interfaces.
Enabling or disabling the clock out feature can be done using AT commands. For more information

about AT commands, refer to document [2] AirPrime HL77xx AT Commands Interface Guide.
Refer to the following table for the pad description of the clock out interfaces.

Table 26. Clock Interface Pad Description

Pad Number Signal Name I/O I/O Type Description

22 GNSS_FREQ_OUT O 1.8V 26MHz Digital Clock output
23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output

3.13. Debug Interface

The AirPrime HL77xx modules provide a 2-wire debug port interface.

Table 27. Software Trace Pad Description

Pad Number Signal Name* I/O* I/O Type Description

44 DEBUG_TX O 1.8V Debug Transmit Data
51 DEBUG_RX I 1.8V Debug Receive Data

* According to module view.

Note: It is strongly recommended to provide access through Test Points to this interface.

3.14. JTAG Interface

The JTAG interface provides debug access to the core of the AirPrime HL77xx modules. These JTAG
signals are accessible through solder-able test points.

Refer to the following table for the pad description of the JTAG interface.

Table 28. JTAG Pad Description

Pad Number Signal Name Function

236 JTAG_RESET JTAG RESET
237 JTAG_TCK JTAG Test Clock
238 JTAG_TDO JTAG Test Data Output
239 JTAG_TMS JTAG Test Mode Select
240 JTAG_TRST JTAG Test Reset
241 JTAG_TDI JTAG Test Data Input

Note: It is recommended to provide access through Test Points to this interface the JTAG pads (for Failure

Analysis debugging). All signals listed in the table above should be outputs on the customer board to
allow JTAG debugging.

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Product Technical Specification Detailed Interface Specifications

Refer to the following table for the electrical characteristics of the JTAG interface.

Table 29. JTAG Electrical Characteristics

Symbol Parameter Minimum Typical Maximum Unit

F

JTAG_TCK clock period 0.038 (TBC) 26 (TBC) 78 (TBC) MHz

tck

tc2 JTAG_TCK clock period high 12 (TBC) - - ns
tc3 JTAG_TCK clock period low 12 (TBC) - - ns
tc4 JTAG_TDI setup time to JTAG_TCK 12 (TBC) - - ns
tc5 JTAG_TDI hold time from JTAG_TCK 10 (TBC) - - ns

tc6

tc7

JTAG_TDO valid before JTAG_TCK
low-end

JTAG_TDO valid after JTAG_TCK
high begin

- 0 (TBC) - s

- 20 (TBC) - ns

Figure 7. JTAG Timing Waveform

3.15. Wake Up Signal (WAKE-UP)

The AirPrime HL77xx modules provide one WAKE-UP signal.
The WAKE-UP signal is used to wake the system up from ultra-low power modes (from OFF or Sleep

modes, FAST_SHUTDOWN, or after a software power off). This signal should be set to high level
(external 1.8V) for at least (TBD) ms until the system is active to wake the module up from these
modes.

The system will not be allowed to go into ultra-low or off mode for as long as this signal is kept high.
By default, the software waits for a high state to wake-up.

Note: The module has an embedded pull-down on this signal. After a power off mode, the only way to

restart the module is to perform a hardware power off then power on if this signal is not used.

Refer to the following table for the pad description of the WAKE-UP interface.

Table 30. WAKE-UP Pad Description

Pad Number Signal Name I/O I/O Type Description

19 WAKE-UP I 1.8V WAKE-UP

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Product Technical Specification Detailed Interface Specifications

Refer to the following table for the electrical characteristics of the WAKE-UP interface.

Table 31. WAKE-UP Electrical Characteristics

I/O Type Parameter Minimum Typical Maximum Unit

Digital

* VDDIO = VGPIO = 1.8 V.

VIL 0.3 V
VIH 0.7 x VDDIO* V

3.16. Fast Shutdown Signal (FAST_SHUTDOWN)

The AirPrime HL77xx modules provide one FAST_SHUTDOWN signal.
Refer to the following table for the pad description of the FAST_SHUTDOWN interface.

Table 32. FAST_SHUTDOWN Pad Description

Pad Number Signal Name I/O I/O Type Description

65 FAST_SHUTDOWN I 1.8V

Refer to the following table for the electrical characteristics of the FAST_SHUTDOWN interface.

Table 33. FAST_SHUTDOWN Electrical Characteristics

Shuts down the module without
deregistration from the network

I/O Type Parameter Minimum Typical Maximum Unit

Digital

* VDDIO = VGPIO = 1.8 V.

VIL 0.3xVDDIO V
VIH 0.7 x VDDIO V

3.17. PWM

The AirPrime HL77xx modules provide one PWM signal that can be used in conjunction with an
external transistor for driving a vibrator, or a backlight LED.

The PWM uses two 7-bit unsigned binary numbers – one for the output period and one for the pulse
width or the duty cycle.

The relative timing for the PWM output is shown in the figure below.

Figure 8. Relative Timing for the PWM Output

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Product Technical Specification Detailed Interface Specifications

Refer to the following table for the pad description of the PWM interface.

Table 34. PWM Pad Description

Pad Number Signal Name I/O I/O Type Description

58 PWM0 O 1.8V PWM output

Refer to the following table for the electrical characteristics of the PWM interface.

Table 35. PWM Electrical Characteristics (TBC)

Parameter Conditions Minimum Typical Maximum Unit

VOH High impedance load -- 1.8 - V
VOL - - - 0.2 V
I

- - - 8 mA

PEAK

Frequency - 25.6 - 1625 kHz
Duty cycle - 1 - 99 %

3.18. RF Interface

The RF interface of the AirPrime HL77xx modules allow the transmission of RF signals. This interface
has a 50Ω nominal impedance.

3.18.1. RF Connection

A 50Ω (with maximum VSWR 1.1:1, and 0.5dB loss) RF track is recommended to be connected to
standard RF connectors such as SMA, UFL, etc. for antenna connection.

Refer to the following table for the pad description of the RF interface.

Table 36. RF Pad Connection

Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)

49 RF_MAIN 50Ω 1.5:1 1.5:1

3.18.2. RF Performances

RF performances are compliant with 3GPP recommendation TS 36.101.
The following table shows typical RX sensitivity with the reference sensitivity level at 95% of the

maximum throughput, using the following 3GPP test conditions:

• 3GPP Pattern

• QPSK modulation

• 4RB_DL, 6RB_UL

• 23dBm UL power

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Product Technical Specification Detailed Interface Specifications

Table 37. Typical RX Sensitivity

LTE Band dBm/15kHz dBm/1.4MHz 3GPP Limit (dBm)

2 -126 -107, 4 -100.3
3 -126 -107, 4 -99.3
4 -125.5 -106, 9 -102.3
12 -125.5 -106, 9 -99.3
13 -126.5 -107, 9 -99.3
28 -126.5 -107, 9 -100.7

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4. Mechanical Drawings

Figure 9. Mechanical Drawing

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Product Technical Specification Mechanical Drawings

Figure 10. Dimensions and Footprint Drawing

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5. Design Guidelines

5.1. Power-Up Sequence

Apply voltage to the VBATT pin for at least 10 ms (TBC) prior to applying a low-level logic to the
PWR_ON_N pin.

Apply a low-level logic to the PWR_ON_N pin (pin 59); within approximately 25ms, VGPIO will appear
to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT
command interface is available in about 25 seconds (TBC) after PWR_ON_N for either UART or USB.

When using UART, the AT command interface is available after the transition of UART1_CTS from
high to low level.

When using a USB connection, the AirPrime HL77xx module will start communicating with the host
after USB enumeration. The time when AT commands can be sent will depend on the initialization
time on the USB host.

Note: As PWR_ON_N is internally pulled up with 1MΩ, an open collector or open drain transistor must be

used for ignition.

5.2. Module Switch-Off

AT commands AT+CPOF and AT+CPWROFF enables the user to properly switch the AirPrime HL77xx
module off.

5.3. Sleep Mode Management

AT command AT+KSLEEP enables sleep mode configuration; this command can only be used with
serial link UART1.

AT+KSLEEP=0:

• The module is active when the DTR signal is active (low electrical level).

• When DTR is deactivated (high electrical level), the module enters sleep mode after a while.

• On DTR activation (low electrical level), the module wakes up.

AT+KSLEEP=1:

• The module determines when it enters sleep mode (when no more tasks are running).

• Any character on the serial link wakes the module up. The first character is lost.

AT+KSLEEP=2: The module never enters sleep mode.

Note: The DTR signal must only be set to low-level “0” to wake up from Sleep mode. This pin must be set

to high-level “1” (1.8V) or left floating (internal pull-up) for all other modes.

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Product Technical Specification Design Guidelines

5.4. Power Supply Design

The AirPrime HL77xx module should not be supplied with voltage over 4.5V even temporarily or
however briefly.

If the system’s main board power supply unit is unstable or if the system’s main board is supplied over

4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier may
be severely damaged.

To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as
simple as a Zener diode with decoupling capacitors as shown in the diagram below.

Power Supply

D404

0.5 pF

Figure 11. Voltage Limiter Example

+

D405

C404

1.5 mF

+

C405

C407

150 µF

100 nF

VBATT/VBATT _PA

5.5. Power On Connection Examples

Refer to the following figures for PWR_ON_N connection examples using a switch and an open
collector transistor.

X

Switch

1

3

2

PWR_ON

GND

Figure 12. PWR_ON_N Connection Example with Switch

PWR_ON

From application

MCU GPIO control

T1
Rohm DTC144EE

GND

Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor

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Product Technical Specification Design Guidelines

5.6. USIM1 Application

The AirPrime HL77xx modules support one USIM1 slot.

Figure 14. Design Application with USIM1 Slot

5.7. EMC and ESD Guidelines for USIM1 Card

Decoupling capacitors must be added according to the drawing below, as close as possible to the
UIM1 card connectors on UIM1_CLK, UIM1_RESET, UIM1_VCC, UIM1_DATA and UIM1_DET
signals to avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards
covering the USIM1 electrical interface.

A typical schematic including USIM1 detection is provided below.

Figure 15. EMC and ESD Components Close to the USIM1.

Sierra Wireless recommends using a ESDALC6V1-5P6 ESD diode for D100.

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Product Technical Specification Design Guidelines

5.8. ESD Guidelines for USB

When the USB interface is externally accessible, it is required to have ESD protection on the USB_D+
and USB_D- signals.

Figure 16. ESD Protection for USB

Sierra Wireless recommends using the following components:

• FIL400: 90Ω DLP0NSN900HL2L EMC filter

• D400: RCLAMP0503N or ESD5V3U2U-03LRH ESD diode

5.9. PWM

Refer to the following figures for examples of using the PWM0 signal for driving an LED or a BUZZER.

Figure 17. Example of an LED Driven by the PWM0 Output

The value of R607 can be harmonized depending on LED (D605) characteristics.
The recommended digital transistor to use for T601 is the DTC144EE from ROHM.

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Product Technical Specification Design Guidelines

Figure 18. Example of a BUZZER Driven by the PWM0 Output

The recommended MOS transistor to use for T1 is the RUM003N02 from ROHM, and the
recommended diode to use for D1 is the BAS16W from NXP.

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6. Reliability Specification (TBC)

AirPrime HL77xx modules will be tested against the Sierra Wireless Industrial Reliability Specification
defined below.

6.1. Reliability Compliance

AirPrime HL77xx modules connected on a development kit board application are targeted to be
compliant with the following requirements.

Table 38. Standards Conformity

Abbreviation Definition

IEC International Electro technical Commission
ISO International Organization for Standardization

6.2. Reliability Prediction Model

6.2.1. Life Stress Test

The following tests the AirPrime HL77xx modules’ product performance.

Table 39. Life Stress Test

Designation Condition

Performance Test
PT3T & PTRT

Standard: N/A
Special conditions:

• Temperature:

 Class A: -30°C to +70°C
 Class B: -40°C to +85°C
 Rate of temperature change: ± 3°C/min

• Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days

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Product Technical Specification Reliability Specification (TBC)

6.2.2. Environmental Resistance Stress Tests

The following tests the AirPrime HL77xx modules’ resistance to extreme temperature.

Table 40. Environmental Resistance Stress Tests

Designation Condition

Cold Test Active
COTA

Resistance to Heat Test
RH

Standard: IEC 680068-2-1, Test Ad
Special conditions:

• Temperature: -40°C

• Temperature variation: 1°C/min

Operating conditions: Powered ON with a power cycle of 1 minute ON and
2 minutes OFF

Duration: 3 days
Standard: IEC 680068-2-2, Test Bb
Special conditions:

• Temperature: +85°C

• Temperature variation: 1°C/min

Operating conditions: Powered ON with a power cycle of 15 minutes ON
and 15 minutes OFF

Duration: 50 days

6.2.3. Corrosive Resistance Stress Tests

The following tests the AirPrime HL77xx modules’ resistance to corrosive atmosphere.

Table 41. Corrosive Resistance Stress Tests

Designation Condition

Humidity Test
HUT

Standard: IEC 60068-2-3, Test Ca
Special conditions:

• Temperature: +65°C

• RH: 95%

• Temperature variation: 3 +/- 0.6°C/min

Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes

Duration: 10 days

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Product Technical Specification Reliability Specification (TBC)

Designation Condition

Component Solder Wettability
CSW

Moist Heat Cyclic Test
MHCT

Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
Method

Special conditions:

• Test method: Dip and Look Test with Steam preconditioning 8
h+/-15min. dip for 5 +0/-0.5 seconds

Operating conditions: Un-powered
Duration: 1 day
Standard: IEC 60068-2-30, Test Db

• Special conditions:

• Upper temperature: +40 ± 2°C

• Lower temperature: +25 ± 5°C

• RH:

 Upper temperature: 93%
 Lower temperature: 95%

• Number of cycles: 21 (1 cycle/24 hours)

• Temperature Variation: 3 +/- 0.6°C/min

Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle

Duration: 21 days

6.2.4. Thermal Resistance Cycle Stress Tests

The following tests the AirPrime HL77xx modules’ resistance to extreme temperature cycling.

Table 42. Thermal Resistance Cycle Stress Tests

Designation Condition

Thermal Shock Test
TSKT

Temperature Change
TCH

Standard: IEC 60068-2-14, Test Na
Special conditions:

• Temperature: -30°C to +80°C

• Temperature Variation: less than 30s

• Number of cycles: 600

• Dwell Time: 10 minutes

Operating conditions: Un-powered
Duration: 9 days
Standard: IEC 60068-2-14, Test Nb
Special conditions:

• Temperature: -40°C to +90°C

• Temperature Variation: 3 +/- 0.6°C/min

• Number of cycles: 400

• Dwell Time: 10 minutes

Operating conditions: Un-powered
Duration: 29 days

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Product Technical Specification Reliability Specification (TBC)

6.2.5. Mechanical Resistance Stress Tests

The following tests the AirPrime HL77xx modules’ resistance to vibrations and mechanical shocks.

Table 43. Mechanical Resistance Stress Tests

Designation Condition

Standard: IEC 60068-2-6, Test Fc
Special conditions:

Sinusoidal Vibration Test
SVT

Random Vibration Test
RVT

Mechanical Shock Test
MST

• Frequency range: 16 Hz to 1000 Hz

• Displacement: 0.35mm (peak-peak)

• Acceleration:

 5G from 16 to 62 Hz
 3G from 62 to 200 Hz
 1G from 200 to 1000 Hz

• Sweep rate: 1 octave / cycle

• Number of Sweep: 20 sweeps/axis

• Sweep direction: ±X, ±Y, ±Z

Operating conditions: Un-powered
Duration: 2 days
Standard: IEC 60068-2-64, Test Fh
Special conditions:

• Frequency range: 10 Hz – 2000 Hz

• Power Spectral Density in [(m/s²)²/Hz]

 g2/Hz at 10Hz
 g2/Hz at 250Hz
 0.005 g2/Hz at 1000Hz
 0.005 g2/Hz at 2000Hz

• Peak factor: 3

• Duration per Axis: 1 hr / axis

Operating conditions: Un-powered
Duration: 1 day
Standard: IEC 60068-2-27, Test Ea
Special conditions:

• Shock Test 1:

 Wave form: Half sine
 Peak acceleration: 30g
 Duration: 11ms
 Number of shocks: 8
 Direction: ±X, ±Y, ±Z

• Shock Test 2:

 Wave form: Half sine
 Peak acceleration: 100g
 Duration: 6ms
 Number of shocks: 3

Operating conditions: Un-powered
Duration: 72 hours

 Direction: ±X, ±Y, ±Z

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Product Technical Specification Reliability Specification (TBC)

6.2.6. Handling Resistance Stress Tests

The following tests the AirPrime HL77xx modules’ resistance to handling malfunctions and damage.

Table 44. Handling Resistance Stress Tests

Designation Condition

ESDC Test

ESD Test

Free Fall Test
FFT 1

Standard: JESD22-A114, JESD22-A115, JESD22-C101
Special conditions:

• HBM (Human Body Model): 1KV (Class 1C)

• MM (Machine Model): 200V

• CDM (Charged Device Model): 250V (Class II)

Operating conditions: Powered
Duration: 3 days
Standard: IEC 61000-4-2
Special conditions:

• Contact Voltage: ±2kV, ±4kV, ±6kV

• Air Voltage: ±2kV, ±4kV, ±8kV

Operating conditions: Powered
Duration: 3 days

Standard: IEC 60068-2-32, Test Ed
Special conditions:

• Number of drops: 2 drops per unit

• Height: 1m

Operating conditions: Un-powered

Duration: 6 hours

41110555 Rev 1.0 September 21, 2017 48

7. FCC Legal Information

The HL7718 and HL7748 modules have been granted modular approval for mobile applications.
Integrators may use the HL7718 or HL7748 modules in their final products without additional FCC
certification if they meet the following conditions. Otherwise, additional FCC approvals must be
obtained.

1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.

2. To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed:

For HL7718: TBD dBi in Band 13
For HL7748:

 9.0 dBi in Band 2
 6.0 dBi in Bands 4 and 12

3. The HL7718 and HL7748 modules must not transmit simultaneously with other collocated
radio transmitters within a host device.

4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width
and the ground plane spacing. In order to respect this constraint, Sierra Wireless
recommends using MicroStrip or StripLine structure and computing the Tracks width with a
simulation tool (like AppCad shown in the figure below and that is available free of charge at

http://www.agilent.com).

41110555 Rev 1.0 September 21, 2017 49

Product Technical Specification FCC Legal Information

If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital,
analog or supply).

If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.

Stripline and Coplanar design requires having a correct ground plane at both sides.
Consequently, it is necessary to add some vias along the RF path. It is recommended to use
Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not
shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring
electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro­controllers, etc.) may degrade the reception performances. The GSM/GPRS connector is
intended to be directly connected to a 50Ω antenna and no matching is needed.

5. A label must be affixed to the outside of the end product into which the HL7718 or HL7748
module is incorporated, with a statement similar to the following:

This device contains FCC ID: <FCC ID as listed in the table below>

Embedded Module FCC ID

HL7718 TBD
HL7748 N7NHL7748

6. A user manual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.

The end product with an embedded HL7718 or HL7748 module may also need to pass the FCC Part
15 unintentional emission testing requirements and be properly authorized per FCC Part 15.

Note: If this module is intended for use in a portable device, you are responsible for separate approval to

satisfy the SAR requirements of FCC Part 2.1093.

41110555 Rev 1.0 September 21, 2017 50

8. Ordering Information

Table 45. Ordering Information

Model Name Description Part Number

HL7718 HL7718 embedded module Contact Sierra Wireless for the latest SKU
HL7748 HL7748 embedded module Contact Sierra Wireless for the latest SKU
HL7749 HL7749 embedded module Contact Sierra Wireless for the latest SKU
DEV-KIT HL Series Development Kit 6000620

41110555 Rev 1.0 September 21, 2017 51

9. Terms and Abbreviations

Abbreviation Definition

ADC Analog to Digital Converter
AGC Automatic Gain Control
AT Attention (prefix for modem commands)
CDMA Code Division Multiple Access
CF3 Common Flexible Form Factor
CLK Clock
CODEC Coder Decoder
CPU Central Processing Unit
DAC Digital to Analog Converter
DTR Data Terminal Ready
EGNOS European Geostationary Navigation Overlay Service
EMC Electro-Magnetic Compatibility
EMI Electro-Magnetic Interference
EN Enable
ESD Electro-Static Discharges
ETSI European Telecommunications Standards Institute
FDMA Frequency-division multiple access
GAGAN GPS aided geo augmented navigation
GLONASS Global Navigation Satellite System
GND Ground
GNSS Global Navigation Satellite System
GPIO General Purpose Input Output
GPRS General Packet Radio Service
GSM Global System for Mobile communications
Hi Z High impedance (Z)
IC Integrated Circuit
IMEI International Mobile Equipment Identification
I/O Input / Output
LED Light Emitting Diode
LNA Low Noise Amplifier
MAX Maximum
MIN Minimum
MSAS Multi-functional Satellite Augmentation System
N/A Not Applicable
PA Power Amplifier
PC Personal Computer
PCB Printed Circuit Board
PCL Power Control Level
PLL Phase Lock Loop
PWM Pulse Width Modulation
QZSS Quasi-Zenith Satellite System

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Product Technical Specification Terms and Abbreviations

Abbreviation Definition

RF Radio Frequency
RFI Radio Frequency Interference
RMS Root Mean Square
RST Reset
RTC Real Time Clock
RX Receive
SCL Serial Clock
SDA Serial Data
SIM Subscriber Identification Module
SMD Surface Mounted Device/Design
SPI Serial Peripheral Interface
SW Software
PSRAM Pseudo Static RAM
TBC To Be Confirmed
TBD To Be Defined
TP Test Point
TX Transmit
TYP Typical
UART Universal Asynchronous Receiver-Transmitter
UICC Universal Integrated Circuit Card
USB Universal Serial Bus
UIM User Identity Module
VBATT Main Supply Voltage from Battery or DC adapter
VSWR Voltage Standing Wave Ratio
WAAS Wide Area Augmentation System

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