Sierra Wireless HL7748 User Manual

AirPrime HL77xx

Product Technical Specification

41110555

1.0

September 21, 2017

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

is open. Sierra Wireless modems may be used at this time.

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.

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Product Technical Specification

Patents

This product may contain technology developed by or for Sierra Wireless Inc.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents

licensed from MMP Portfolio Licensing.

Copyright

© 2017 Sierra Wireless. All rights reserved.

Trademarks

Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other

countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.

Contact Information

Sales information and technical support,
including warranty and returns

Corporate and product information

Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795

6:00 am to 5:00 pm PST

Web: sierrawireless.com

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Product Technical Specification

Document History

Version Date Updates

1.0 September 21, 2017 Creation

41110555 Rev 1.0 September 21, 2017 4

Contents

1. INTRODUCTION ................................................................................................ 10

1.1. Common Flexible Form Factor (CF3) ................................................................................ 10

1.2. Physical Dimensions ......................................................................................................... 11

1.3. General Features ............................................................................................................... 11

1.4. Architecture........................................................................................................................ 13

1.5. Interfaces ........................................................................................................................... 13

1.6. Connection Interface ......................................................................................................... 14

1.7. ESD ................................................................................................................................... 15

1.8. Environmental and Certifications ....................................................................................... 15

1.8.1.

Environmental Specifications ................................................................................... 15

1.8.2.

Regulatory ................................................................................................................ 16

1.8.3.

RoHS Directive Compliant ....................................................................................... 16

1.8.4.

Disposing of the Product .......................................................................................... 16

1.9. References ........................................................................................................................ 16

2. PAD DEFINITION ............................................................................................... 17

2.1. Pad Types .......................................................................................................................... 21

2.2. Pad Configuration (Top View, Through Module) ............................................................... 22

3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23

3.1. Power Supply..................................................................................................................... 23

3.2. Current Consumption ........................................................................................................ 24

3.3. VGPIO ............................................................................................................................... 25

3.4. USIM Interface ................................................................................................................... 25

3.4.1.

UIM1_DET ............................................................................................................... 26

3.5. USB Interface .................................................................................................................... 26

3.6. Electrical Information for Digital I/O ................................................................................... 27

3.7. General Purpose Input/Output (GPIO) .............................................................................. 28

3.8. Main Serial Link (UART1) .................................................................................................. 28

3.9. Power On Signal (PWR_ON_N) ........................................................................................ 29

3.10. Reset Signal (RESET_IN_N) ............................................................................................. 30

3.11. Analog to Digital Converter (ADC)..................................................................................... 31

3.12. Clock Interface ................................................................................................................... 32

3.13. Debug Interface ................................................................................................................. 32

3.14. JTAG Interface................................................................................................................... 32

3.15. Wake Up Signal (WAKE-UP) ............................................................................................. 33

3.16. Fast Shutdown Signal (FAST_SHUTDOWN) .................................................................... 34

3.17. PWM .................................................................................................................................. 34

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Product Technical Specification

3.18. RF Interface ....................................................................................................................... 35

3.18.1. RF Connection ......................................................................................................... 35

3.18.2. RF Performances ..................................................................................................... 35

4. MECHANICAL DRAWINGS ............................................................................... 37

5. DESIGN GUIDELINES ....................................................................................... 39

5.1. Power-Up Sequence ......................................................................................................... 39

5.2. Module Switch-Off ............................................................................................................. 39

5.3. Sleep Mode Management ................................................................................................. 39

5.4. Power Supply Design ........................................................................................................ 40

5.5. Power On Connection Examples....................................................................................... 40

5.6. USIM1 Application ............................................................................................................. 41

5.7. EMC and ESD Guidelines for USIM1 Card ....................................................................... 41

5.8. ESD Guidelines for USB .................................................................................................... 42

5.9. PWM .................................................................................................................................. 42

6. RELIABILITY SPECIFICATION (TBC) .............................................................. 44

6.1. Reliability Compliance ....................................................................................................... 44

6.2. Reliability Prediction Model ............................................................................................... 44

6.2.1.

Life Stress Test ........................................................................................................ 44

6.2.2.

Environmental Resistance Stress Tests .................................................................. 45

6.2.3.

Corrosive Resistance Stress Tests ......................................................................... 45

6.2.4.

Thermal Resistance Cycle Stress Tests .................................................................. 46

6.2.5.

Mechanical Resistance Stress Tests ....................................................................... 47

6.2.6.

Handling Resistance Stress Tests ........................................................................... 48

7. FCC LEGAL INFORMATION ............................................................................. 49

8. ORDERING INFORMATION .............................................................................. 51

9. TERMS AND ABBREVIATIONS ........................................................................ 52

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List of Figures

Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.

Figure 10. Dimensions and Footprint Drawing ................................................................................. 38

Figure 11. Voltage Limiter Example ................................................................................................. 40

Figure 12. PWR_ON_N Connection Example with Switch ............................................................... 40

Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor ........................... 40

Figure 14. Design Application with USIM1 Slot ................................................................................ 41

Figure 15. EMC and ESD Components Close to the USIM1. .......................................................... 41

Figure 16. ESD Protection for USB .................................................................................................. 42

Figure 17. Example of an LED Driven by the PWM0 Output ........................................................... 42

Architecture Overview ..................................................................................................... 13

Mechanical Overview (Top View and Bottom View) ....................................................... 14

Actual Module (Top View) ............................................................................................... 14

Actual Module (Bottom View) .......................................................................................... 14

Pad Configuration ............................................................................................................ 22

PWR_ON_N and PWR_OFF Sequence ......................................................................... 30

JTAG Timing Waveform .................................................................................................. 33

Relative Timing for the PWM Output ............................................................................... 34

Mechanical Drawing ........................................................................................................ 37

Figure 18. Example of a BUZZER Driven by the PWM0 Output ...................................................... 43

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List of Tables

Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.

Table 10. Current Consumption (Nominal Voltage at 3.7V; Ambient Temperature at +25°C) ....... 24

Table 11. VGPIO Pad Description ................................................................................................... 25

Table 12. VGPIO Electrical Characteristics ..................................................................................... 25

Table 13. USIM1 Pad Description ................................................................................................... 26

Table 14. USIM1 Electrical Characteristics ..................................................................................... 26

Table 15. USB Pad Description ....................................................................................................... 26

Table 16. USB Electrical Characteristics ......................................................................................... 27

Table 17. Digital I/O Electrical Characteristics ................................................................................ 27

Supported Bands/Connectivity ........................................................................................ 10

General Features ............................................................................................................ 11

ESD Specifications .......................................................................................................... 15

Environmental Specifications .......................................................................................... 15

Pin Definition ................................................................................................................... 17

Pad Type Codes .............................................................................................................. 21

Power Supply Pad Description ........................................................................................ 23

Power Supply Electrical Characteristics .......................................................................... 23

Low Current Consumption Mode ..................................................................................... 24

Table 18. GPIO Pad Description ..................................................................................................... 28

Table 19. UART1 Pad Description .................................................................................................. 28

Table 20. PWR_ON_N Pad Description .......................................................................................... 29

Table 21. PWR_ON_N Electrical Characteristics ........................................................................... 29

Table 22. RESET_IN_N Pad Description ........................................................................................ 30

Table 23. RESET_IN_N Electrical Characteristics .......................................................................... 31

Table 24. ADC Pad Description ...................................................................................................... 31

Table 25. ADC Electrical Characteristics ........................................................................................ 31

Table 26. Clock Interface Pad Description ...................................................................................... 32

Table 27. Software Trace Pad Description...................................................................................... 32

Table 28. JTAG Pad Description ..................................................................................................... 32

Table 29. JTAG Electrical Characteristics ....................................................................................... 33

Table 30. WAKE-UP Pad Description ............................................................................................. 33

Table 31. WAKE-UP Electrical Characteristics ............................................................................... 34

Table 32. FAST_SHUTDOWN Pad Description ............................................................................. 34

Table 33. FAST_SHUTDOWN Electrical Characteristics ............................................................... 34

Table 34. PWM Pad Description ..................................................................................................... 35

Table 35. PWM Electrical Characteristics (TBC)............................................................................. 35

Table 36. RF Pad Connection ......................................................................................................... 35

Table 37. Typical RX Sensitivity ...................................................................................................... 36

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Product Technical Specification

Table 38. Standards Conformity ...................................................................................................... 44

Table 39. Life Stress Test................................................................................................................ 44

Table 40. Environmental Resistance Stress Tests ......................................................................... 45

Table 41. Corrosive Resistance Stress Tests ................................................................................. 45

Table 42. Thermal Resistance Cycle Stress Tests ......................................................................... 46

Table 43. Mechanical Resistance Stress Tests .............................................................................. 47

Table 44. Handling Resistance Stress Tests .................................................................................. 48

Table 45. Ordering Information ....................................................................................................... 51

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1. Introduction

This document is the Product Technical Specification for the AirPrime HL77xx series of embedded
modules. It defines the high-level product features and illustrates the interfaces for these features; and
is intended to cover the hardware aspects of the product, including electrical and mechanical.

Variants covered in this document are:

• HL7718

• HL7748

• HL7749

The AirPrime HL77xx modules belong to the AirPrime HL Series from Essential Connectivity Module
family. These are industrial grade Embedded Wireless Modules that provides data connectivity on
LTE networks (as listed in Table 1 Supported Bands/Connectivity).

The AirPrime HL77xx modules support a large variety of interfaces such as USB 2.0, UART, ADC,
USIM interface, PWM and GPIOs to provide customers with the highest level of flexibility in
implementing high-end solutions.

Table 1. Supported Bands/Connectivity

RF Band Transmit Band (Tx) Receive Band (Rx)

LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23dBm ± 2dBm
LTE B3 1710 to 1785 MHz 1805 to 1880 MHz 23dBm ± 2dBm
LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23dBm ± 2dBm
LTE B12 699 to 716 MHz 729 to 746 MHz 23dBm ± 2dBm
LTE B13 777 to 787 MHz 746 to 756 MHz 23dBm ± 2dBm
LTE B28 703 to 748 MHz 758 to 803 MHz 23dBm ± 2dBm

Maximum
Output Power



HL7718

HL7748






HL7749





1.1. Common Flexible Form Factor (CF3)

The AirPrime HL77xx modules belong to the Common Flexible Form Factor (CF3) family of modules.
This family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF
solution to a series of problems faced commonly in the WWAN module space as it:

• Accommodates multiple radio technologies (LTE advanced) and band groupings.

• Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions.

3

form factor provides a unique

• Offers electrical and functional compatibility.

• Provides Direct Mount as well as Socketability depending on customer needs.

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Product Technical Specification Introduction

1.2. Physical Dimensions

AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions:

• Length: 23 mm

• Width: 22 mm

• Thickness: 2.5 mm

• Weight: 2.6 g

Note: Dimensions specified above are typical values.

1.3. General Features

The table below summarizes the AirPrime HL77xx modules’ features.

Table 2. General Features

Feature Description

• Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm
(nominal)

Physical

Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V

RF

SIM interface

Application interface

• Metal shield can.

• RF connection pads (RF main interface)

• Baseband signals connection

HL7718 (Mono-band LTE):

• LTE B13

HL7748 (Tri-band LTE):

• LTE B2

• LTE B4

• LTE B12

HL7749 (Dual-band LTE):

• LTE B3

• LTE B28

• Only 1.8V support for USIM1

• SIM extraction / hot plug detection

• SIM/USIM support

• Conforms with ETSI UICC Specifications.

• Supports SIM application tool kit with proactive SIM commands

• NDIS NIC interface support (Windows 7, Windows 8, Linux)

• MBIM support

• Multiple non-multiplexed USB channel support

• Dial-up networking

• USB selective suspend to maximize power savings

• CMUX multiplexing over UART

• AT command interface – 3GPP 27.007 standard, plus proprietary extended

AT commands

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Product Technical Specification Introduction

Feature Description

Single mode LTE operation:

• LTE FDD, bandwidth 1.4-20 MHz

Protocol stack

SMS

Connectivity

Environmental

RTC Real Time Clock (RTC)

• System Release: 3GPP Rel. 13

• Category M1 (up to 375 kbit/s in uplink, 300 kbit/s in downlink)

• Max modulation 16 QAM UL/DL

• Intra-frequency and inter-frequency mobility

• SMS over SGs

• SMS MO and MT

• SMS saving to SIM card or ME storage

• SMS reading from SIM card or ME storage

• SMS sorting

• SMS concatenation

• SMS Status Report

• SMS replacement support

• SMS storing rules (support of AT+CNMI, AT+CNMA)

• Multiple cellular packet data profiles

• Sleep mode for minimum idle power draw

• Mobile-originated PDP context activation / deactivation

• Static and Dynamic IP address. The network may assign a fixed IP address

or dynamically assign one using DHCP (Dynamic Host Configuration
Protocol).

• PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context

• RFC1144 TCP/IP header compression

Operating temperature ranges (industrial grade):

• Class A: -30°C to +70°C

• Class B: -40°C to +85°C

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Product Technical Specification Introduction

1.4. Architecture

The figure below presents an overview of the AirPrime HL77xx modules’ internal architecture and
external interfaces.

Note: Dotted parts are optional depending on variant.

AirPrime HL7718, HL7748 and HL7749

26MHz

VGPIO

LGA-

146

RESET_IN_N

PWR_ON

USB

SIM

Switch

Embedded

SIM

Figure 1. Architecture Overview

Transceiver

Baseband

MCU DSP

PMU

Analog Baseband

Peripherals

RAM Memory

32.768KHz

RX

SAW

Filters

Flash

Memory

Front-End

VBATT_PA

Module

(SAW/PA/

Switch)

LGA-

146

1.5. Interfaces

The AirPrime HL77xx modules provide the following interfaces and peripheral connectivity:

• 1x - VGPIO (1.8V)

• 1x - 1.8V USIM

• 1x - eUICC/USIM (optional embedded SIM)

• 1x - USB 2.0

• 10x - GPIOs (1 of which has a multiplex)

• 1x - 8-wire UART

• 1x - Active Low POWER ON

• 1x - Active Low RESET

• 2x - ADC

• 2x - System Clock Out (32,768KHz and 26MHz)

• 1x – Debug Interface

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Product Technical Specification Introduction

• 1x - JTAG Interface

• 1x - Wake up signal

• 1x - Fast shutdown signal

• 1x - PWM

• 1x - Main RF Antenna

1.6. Connection Interface

The AirPrime HL77xx modules are an LGA form factor device. All electrical and mechanical
connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview (Top View and Bottom View)

The 146 pads have the following distribution:

• 66 inner signal pads, 1x0.5mm, pitch 0.8mm

• 1 reserved test point (do not connect), 1.0mm diameter

• 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

• 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

• 4 inner corner ground pads, 1x1mm

• 4 outer corner ground pads, 1x0.9mm

Figure 3. Actual Module (Top View)

Figure 4. Actual Module (Bottom View)

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Product Technical Specification Introduction

1.7. ESD

Refer to the following table for ESD Specifications.

Table 3. ESD Specifications

Category Connection Specification

Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)

Unless otherwise specified:

Non-operational

Signals

Host connector
interface

SIM connector Adding ESD protection is highly recommended at the point where
Other host signals

• JESD22-A114 ± 1kV Human Body Model (TBC)

• JESD22-A115 ± 200V Machine Model (TBC)

•

JESD22-C101C ± 250V Charged Device Model (TBC)

the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table
below.

Table 4. Environmental Specifications

Conditions Range

Operating Class A -30°C to +70°C
Operating Class B -40°C to +85°C
Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

• Shall exhibit normal function during and after environmental exposure.

• Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

• Shall remain fully functional during and after environmental exposure

• Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

• Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.

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Product Technical Specification Introduction

1.8.2. Regulatory

The AirPrime HL7718 and HL7748 modules will be compliant with FCC regulations, while the
AirPrime HL7749 module will be compliant with RCM regulations.

1.8.3. RoHS Directive Compliant

The AirPrime HL77xx modules are compliant with RoHS Directive 2011/65/EU which sets limits for
the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.

1.9. References

[1] AirPrime HL Series Customer Process Guidelines

Reference Number: 4114330

[2] AirPrime HL77xx AT Commands Interface Guide

Reference Number: 41110842

[3] AirPrime HL Series Development Kit User Guide

Reference Number: 4114877

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