Sierra Wireless HL7688 User Manual

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Product Technical Specification

AirPrime HL7688

4119272

2.0

August 16, 2016

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence.

is open. Sierra Wireless modems may be used at this time.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.

4119272 Rev 2.0 August 16, 2016 2

Product Technical Specification

Patents

This product may contain technology developed by or for Sierra Wireless Inc.

This product includes technology licensed from QUALCOMM

This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing.

Trademarks

Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher

Windows

Macintosh countries.

QUALCOMM

Other trademarks are the property of their respective owners.

is a registered trademark of NETGEAR, Inc., used under license.

and Windows Vista® are registered trademarks of Microsoft Corporation.

and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other

is a registered trademark of QUALCOMM Incorporated. Used under license.

Contact Information

Sales information and technical support, including warranty and returns

Corporate and product information

Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795 6:00 am to 6:00 pm PST

Web: sierrawireless.com

4119272 Rev 2.0 August 16, 2016 3

Product Technical Specification

Document History

Version Date Updates

1.0 May 23, 2016 Creation

Updated:

1.1 May 26, 2016

1.2 May 30, 2016

2.0 August 16, 2016 Updated section 7 FCC Regulations

 Table 2 General Features  1.8.2 Regulatory  3.16.2 RF Performances

Updated:

 Figure 2 Mechanical Overview  4 Mechanical Drawings

4119272 Rev 2.0 August 16, 2016 4

Contents

1. INTRODUCTION .................................................................................................. 10

1.1. Common Flexible Form Factor (CF3) ............................................................................. 10

1.2. Physical Dimensions ..................................................................................................... 10

1.3. General Features .......................................................................................................... 11

1.4. Architecture ................................................................................................................... 13

1.5. Interfaces ...................................................................................................................... 14

1.6. Connection Interface ..................................................................................................... 14

1.7. ESD .............................................................................................................................. 15

1.8. Environmental and Certifications ................................................................................... 15

1.8.1. Environmental Specifications ................................................................................. 15

1.8.2. Regulatory ............................................................................................................. 16

1.8.3. RoHS Directive Compliant ..................................................................................... 16

1.8.4. Disposing of the Product ........................................................................................ 16

1.9. References .................................................................................................................... 16

2. PAD DEFINITION ................................................................................................. 17

2.1. Pad Configuration (Top View, Through Module) ........................................................... 22

3. DETAILED INTERFACE SPECIFICATIONS ....................................................... 23

3.1. Power Supply ................................................................................................................ 23

3.2. Current Consumption .................................................................................................... 23

3.3. VGPIO ........................................................................................................................... 24

3.4. BAT_RTC ...................................................................................................................... 2 5 

3.5. SIM Interface ................................................................................................................. 25

3.5.1. UIM1_DET ............................................................................................................. 26

3.6. USB .............................................................................................................................. 26

3.7. Electrical Information for Digital I/O ............................................................................... 26

3.8. General Purpose Input/Output (GPIO) .......................................................................... 27

3.9. Main Serial Link (UART1) .............................................................................................. 28

3.10. POWER-ON Signal (PWR_ON_N) ................................................................................ 28

3.11. Reset Signal (RESET_IN_N) ........................................................................................ 29

3.12. Analog to Digital Converter (ADC1) ............................................................................... 30

3.13. Clock Interface .............................................................................................................. 3 0 

3.14. PCM .............................................................................................................................. 31

3.15. Debug Interfaces ........................................................................................................... 32

3.15.1. Trace Debug .......................................................................................................... 32

3.15.2. JTAG ...................................................................................................................... 33

3.16. RF Interface .................................................................................................................. 33

3.16.1. RF Connection ....................................................................................................... 33

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Product Technical Specification

3.16.2. RF Performances ................................................................................................... 34

3.16.3. TX_ON Indicator (TX_ON) ..................................................................................... 34

4. MECHANICAL DRAWINGS ................................................................................. 36

5. DESIGN GUIDELINES ......................................................................................... 39

5.1. Power-Up Sequence ..................................................................................................... 39

5.2. Module Switch-Off ......................................................................................................... 40

5.3. Emergency Power OFF ................................................................................................. 40

5.4. Sleep Mode Management ............................................................................................. 40

5.4.1. Using UART1 ......................................................................................................... 40

5.4.2. Using USB ............................................................................................................. 41

5.5. Power Supply Design .................................................................................................... 41

5.6. ESD Guidelines for SIM Card ........................................................................................ 41

5.7. ESD Guidelines for USB ............................................................................................... 42

6. RELIABILITY SPECIFICATION ........................................................................... 43

6.1. Reliability Compliance ................................................................................................... 43

6.2. Reliability Prediction Model ........................................................................................... 43

6.2.1. Life Stress Test ...................................................................................................... 43

6.2.2. Environmental Resistance Stress Tests ................................................................. 44

6.2.3. Corrosive Resistance Stress Tests ........................................................................ 44

6.2.4. Thermal Resistance Cycle Stress Tests ................................................................. 45

6.2.5. Mechanical Resistance Stress Tests ..................................................................... 47

6.2.6. Handling Resistance Stress Tests ......................................................................... 48

7. FCC REGULATIONS ........................................................................................... 50

8. ORDERING INFORMATION ................................................................................ 52

9. TERMS AND ABBREVIATIONS .......................................................................... 53

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List of Figures

Figure 1. Architecture Overview ................................................................................................... 13

Figure 2. Mechanical Overview .................................................................................................... 14

Figure 3. Pad Configuration ......................................................................................................... 22

Figure 4. PCM Timing Waveform ................................................................................................. 32

Figure 5. TX_ON State During Transmission ............................................................................... 35

Figure 6. Mechanical Drawing ...................................................................................................... 36

Figure 7. Dimensions Drawing ..................................................................................................... 37

Figure 8. Footprint ........................................................................................................................ 38

Figure 9. PWR_ON_N Sequence with VGPIO Information .......................................................... 39

Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO ........................................................... 40

Figure 11. Voltage Limiter Example ............................................................................................... 41

Figure 12. EMC and ESD Components Close to the SIM .............................................................. 42

Figure 13. ESD Protection for USB ................................................................................................ 42

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List of Tables

Table 1. Supported Bands/Connectivity ...................................................................................... 10

Table 2. General Features .......................................................................................................... 11

Table 3. ESD Specifications ........................................................................................................ 15

Table 4. Environmental Specifications ........................................................................................ 15

Table 5. Regulation Compliance ................................................................................................. 16

Table 6. Pad Definition ................................................................................................................ 17

Table 7. Power Supply ................................................................................................................ 23

Table 8. Current Consumption .................................................................................................... 23

Table 9. Current Consumption per Power Supply ....................................................................... 24

Table 10. VGPIO Electrical Characteristics ................................................................................... 24

Table 11. BAT_RTC Electrical Characteristics .............................................................................. 25

Table 12. UIM1 Pad Description ................................................................................................... 25

Table 13. Electrical Characteristics of UIM1.................................................................................. 26

Table 14. USB Pad Description .................................................................................................... 26

Table 15. Digital I/O Electrical Characteristics .............................................................................. 27

Table 16. GPIO Pad Description ................................................................................................... 27

Table 17. UART1 Pad Description ................................................................................................ 28

Table 18. PWR_ON_N Electrical Characteristics .......................................................................... 29

Table 19. RESET_IN_N Electrical Characteristics ........................................................................ 29

Table 20. ADC Interface Pad Description ..................................................................................... 30

Table 21. ADC Electrical Characteristics ...................................................................................... 30

Table 22. Clock Interface Pad Description .................................................................................... 30

Table 23. PCM Interface Pad Description ..................................................................................... 31

Table 24. PCM Electrical Characteristics ...................................................................................... 31

Table 25. Trace Debug Pad Description ....................................................................................... 32

Table 26. JTAG Pad Description ................................................................................................... 33

Table 27. RF Main Connection ..................................................................................................... 33

Table 28. RF Diversity Connection ............................................................................................... 33

Table 29. Conducted RX Sensitivity – UMTS Bands ..................................................................... 34

Table 30. Conducted RX Sensitivity – LTE Bands ........................................................................ 34

Table 31. TX_ON Indicator Pad Description ................................................................................. 34

Table 32. TX_ON Characteristics ................................................................................................. 34

Table 33. Standards Conformity ................................................................................................... 43

Table 34. Life Stress Test ............................................................................................................. 4 3 

Table 35. Environmental Resistance Stress Tests ........................................................................ 44

Table 36. Corrosive Resistance Stress Tests ............................................................................... 44

Table 37. Thermal Resistance Cycle Stress Tests ........................................................................ 45

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Product Technical Specification

Table 38. Mechanical Resistance Stress Tests ............................................................................. 47

Table 39. Handling Resistance Stress Tests ................................................................................ 48

Table 40. Ordering Information ..................................................................................................... 52

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1. Introduction

This document is the Product Technical Specification for the AirPrime HL7688 Embedded Module. It defines the high level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical.

The AirPrime HL7688 belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless networks (as listed in Table 1 Supported Bands/Connectivity).

The HL7688 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions.

Table 1. Supported Bands/Connectivity

RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power

LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (+/- 2dBm) Class 3bis

LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23 dBm (+/- 2dBm) Class 3bis

LTE B5 824 to 849 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis

LTE B17 704 to 716 MHz 734 to 746 MHz 23 dBm (+/- 2dBm) Class 3bis

UMTS B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (+/- 2dBm) Class 3bis

UMTS B5 824 to 849 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis

1.1. Common Flexible Form Factor (CF3)

The AirPrime HL7688 belongs to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF solution to a series of problems faced commonly in the WWAN module space as it:

 Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings

 Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions

 Offers electrical and functional compatibility

 Provides Direct Mount as well as Socketability depending on customer needs

form factor provides a unique

1.2. Physical Dimensions

AirPrime HL7688 modules are compact, robust, fully shielded modules with the following dimensions:

 Length: 23 mm

 Width: 22 mm

 Thickness: 2.5 mm

 Weight: 3.5 g

Note: Dimensions specified above are typical values.

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Product Technical Specification Introduction

1.3. General Features

The table below summarizes the AirPrime HL7688 features.

Table 2. General Features

Feature Description

 Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x

2.5mm (nominal)

Physical

Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V

 Complete body shielding

 RF connection pads (RF main interface)

 Baseband signals connection

 Quad-band LTE:

 LTE B2: 1900 PCS  LTE B4: 1700 AWS  LTE B5: 850 CLR  LTE B17: 700

 Dual-band UMTS:

 UMTS B2: 1900 PCS  UMTS B5: 850 CLR

SIM interface

Application interface

 Dual SIM Single Standby (DSSS)

 1.8V/3V support

 SIM extraction / hot plug detection

 SIM/USIM support

 Conforms with ETSI UICC Specifications

 Supports SIM application tool kit with proactive SIM commands

 NDIS NIC interface support (Windows XP, Windows 7, Windows 8,

Windows CE, Linux)

 Multiple non-multiplexed USB channel support

 Dial-up networking

 USB selective suspend to maximize power savings

 CMUX multiplexing over UART*

 AT command interface – 3GPP 27.007 standard, plus proprietary

extended AT commands

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Product Technical Specification Introduction

Feature Description

 Single mode LTE operation:

 LTE FDD, bandwidth 1.4-20 MHz

 System Release: 3GPP Rel. 9

 Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)

 Rx Diversity

 Max modulation 64 QAM DL, 16 QAM UL

 Intra-frequency and inter-frequency mobility

 SMS over SGs and IMS

 SON ANR

 Public Warning System PWS

 HSDPA (High Speed Downlink Packet Access)

 Evolved High Speed Downlink Packet Access (HSDPA+)

 Compliant with 3GPP Release 9

 Up to Category 24 (DC, 42.2Mbps)

Protocol Stack

 Continuous Packet Connectivity (CPC)

 Enhance fractional DPCH

 IPv6 support

 HSUPA (High Speed Uplink Packet Access)

 Compliant with 3GPP Release 9

 Category 7 (11.5Mbps)

 Robust Header Compression (RoHC)

 RXDIV Performance Enhancements

 Type 3i (HSDPA)

 HSPA Enhancements

 MAC-ehs Rel. 7

 HSDPA Enhanced CELL_FACH/PCH states

 HSUPA Enhanced CELL_FACH states (eFACH) Rel 8

 MAC-i/is Rel.8

 Serving cell change enhancements Rel. 8

 SMS over SGs and IMS

 SMS MO and MT

 SMS saving to SIM card or ME storage

 SMS reading from SIM card or ME storage

SMS

 SMS sorting

 SMS concatenation

 SMS Status Report

 SMS replacement support

 SMS storing rules (support of

AT+CNMI, AT+CNMA)

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Product Technical Specification Introduction

Feature Description

 Multiple (up to 20) cellular packet data profiles

 Sleep mode for minimum idle power draw

 Mobile-originated PDP context activation / deactivation

 Support QoS profile

 Release 97 – Precedence Class, Reliability Class, Delay Class, Peak

Throughput, Mean Throughput

Connectivity

 Release 99 QoS negotiation – Background, Interactive, and

Streaming

 Static and Dynamic IP address. The network may assign a fixed IP

address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).

 Supports PAP and CHAP authentication protocols

 PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context

 RFC1144 TCP/IP header compression

Operating temperature ranges (industrial grade):

Environmental

 Class A: -30°C to +70°C



Class B: -40°C to +85°C

RTC Real Time Clock (RTC) with calendar

1.4. Architecture

The figure below presents an overview of the AirPrime HL7688’s internal architecture and external interfaces.

LGA-

146

VBATT

GND

VGPIO

BAT_RTC

GPIO x 12

UART x 1

Trace Debug (5 pins)

JTAG

26M_CLKOUT

32K_CLKOUT

SIM1

RESET_IN

PWR_ON

USB

ADC x 1

PCM

TX_ON

Memory

(Flash + RAM)

Baseband

MCU DSP

PMU RF

Analog Baseband

Peripherals

Dulpexer

RX_LTE RF

SAW

Filters

AirPrime HL7688

RFRX_LTE

Antenna

Switch

Antenna

Switch

RF Main

LGA-

146

RF DIV

26MHz

32.768KHz

Figure 1. Architecture Overview

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Product Technical Specification Introduction

1.5. Interfaces

The AirPrime HL7688 module provides the following interfaces and peripheral connectivity:

 1x – 8-wire UART

 1x – Active Low RESET

 1x – USB 2.0

 1x – Backup Battery Interface

 2x – System Clock Out

 1x – Active Low POWER-ON

 1x – 1.8V/3V SIM

 1x – JTAG Interface

 12x – GPIOs (2 of which have multiplexes)

 1x – Main Antenna

 1x – RX Diversity Antenna

 1x – VGPIO

 1x – TX_ON

 1x – ADC

 1x – PCM

 1x – Debug Interface

1.6. Connection Interface

The AirPrime HL7688 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview

The 146 pads have the following distribution:

 66 inner signal pads, 1x0.5mm, pitch 0.8mm

 1 reserved test point (do not connect), 1.0mm diameter

 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

 4 inner corner ground pads, 1x1mm

 4 outer corner ground pads, 1x0.9mm

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Product Technical Specification Introduction

1.7. ESD

Refer to the following table for ESD Specifications.

Note: Information specified in the following table is preliminary and subject to change.

Table 3. ESD Specifications

Category Connection Specification

Operational RF ports IEC-61000-4-2 – Level (Electrostatic Discharge Immunity Test)

Unless otherwise specified:

 JESD22-A114 +/- 1kV Human Body Model

 JESD22-A115 +/- 200V Machine Model

 JESD22-C101C +/- 250V Charged Device Model

Non-operational

Host connector interface

Signals

SIM connector

Other host signals

Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user.

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table below.

Table 4. Environmental Specifications

Conditions Range

Operating Class A -30°C to +70°C

Operating Class B -40°C to +85°C

Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

 Shall exhibit normal function during and after environmental exposure.

 Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

 Shall remain fully functional during and after environmental exposure

 Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

 Unless otherwise stated, full performance should return to normal after the excessive

constraint(s) have been removed.

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Product Technical Specification Introduction

1.8.2. Regulatory

The AirPrime HL7688 is compliant with FCC regulations.

FCC compliance will be reflected on the AirPrime HL7688 label.

Table 5. Regulation Compliance

Document Current Version Description

GCF-CC v3.56.1 or later GCF Conformance Certification Criteria

NAPRD.03 V5.22 or later North American Program Reference Document

FCC Part 22, 24, 27 NA Federal Communications Commission

1.8.3. RoHS Directive Compliant

The AirPrime HL7688 module is compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner.

1.9. References

[1] AirPrime HL Series Customer Process Guidelines

Reference Number: 4114330

[2] AirPrime HL7688 AT Commands Interface Guide

Reference Number: TBD

4119272 Rev 2.0 August 16, 2016 16

2. Pad Definition

AirPrime HL7688 pads are divided into 3 functional categories.

 Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF

modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF

modules.

 Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it

is always at the same pad location.

 Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os.

Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on

other CF

modules.

Other pads marked as “not connected” or “reserved” should not be used.

Table 6. Pad Definition

family of

Pad # Signal Name Function I/O

1 GPIO1 General purpose input/output I/O

3 UART1_RTS UART1 Request to send I L 1.8V Connect to test point Core

4 UART1_CTS UART1 Clear to send O L 1.8V Connect to test point Core

5 UART1_TX UART1 Transmit data I

6 UART1_RX UART1 Receive data O

7 UART1_DTR UART1 Data terminal ready I L 1.8V Connect to test point Core

UART1_RI / TRACE_DATA3

UART1_DCD / TRACE_DATA1

UART1 Ring indicator / Trace data 3 O

UART1 Data carrier detect / Trace data 1

O L 1.8V Connect to test point Core / Custom

Active Low / High

Power Supply Domain

1.8V Left Open Extension

1.8V Connect to test point Core / Custom

1.8V Connect to test point Core

Recommendation for Unused Pads

Type

4119272 Rev 2.0 August 16, 2016 17

Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

10 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 I/O

11 RESET_IN_N Input reset signal I L 1.8V Left Open Core

12 USB_D-

13 USB_D+

14 NC Not Connected (Reserved for future use)

15 NC Not Connected (Reserved for future use)

16 USB_VBUS USB VBUS I

17 NC Not Connected (Reserved for future use)

18 NC Not Connected (Reserved for future use)

19 NC Not Connected (Reserved for future use)

20 NC Not Connected (Reserved for future use)

21 BAT_RTC Power supply for RTC backup I/O

22 26M_CLKOUT 26MHz System Clock Output O

23 32K_CLKOUT 32.768kHz System Clock Output O

24 ADC1 Analog to digital converter

25 NC Not Connected (Reserved for future use)

26 UIM1_VCC 1.8V/3V SIM1 Power supply O

27 UIM1_CLK 1.8V/3V SIM1 Clock O

28 UIM1_DATA 1.8V/3V SIM1 Data I/O

UART1_DSR / TRACE_DATA0

UART1 Data set ready / Trace data 0

USB Data Negative (Low / Full Speed)

USB Data Negative (High Speed) 0.38V

USB Data Positive (Low / Full Speed)

USB Data Positive (High Speed) 0.38V

O L 1.8V Connect to test point Core / Custom

I/O

I 1.2V

Active Low / High

Power Supply Domain

1.8V Connect to test point Core / Custom

3.3V

5V Connect to test point Extension

1.8V Left Open Extension

1.8V/3V

Recommendation for Unused Pads

Connect to test point Extension

Left Open Not connected

Left Open Extension

Left Open Not connected

Mandatory connection

Type

Core

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Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

29 UIM1_RESET 1.8V/3V SIM1 Reset O L 1.8V/3V

30 GND Ground 0V

31 RF_DIV RF Input - Diversity

32 GND Ground 0V

33 PCM_OUT PCM data out O

34 PCM_IN PCM data in I

35 PCM_SYNC PCM sync out I/O

36 PCM_CLK PCM clock I/O

37 GND Ground 0V

38 NC Not Connected (Reserved for future use)

39 GND Ground 0V

40 GPIO7 General purpose input/output I/O

41 GPIO8 / TRACE_CLK General purpose input/output / Trace clock I/O

42 NC Not Connected (Reserved for future use)

43 NC Not Connected (Reserved for future use)

44 GPIO13 General purpose input/output O

45 VGPIO GPIO voltage output O

46 GPIO6 General purpose input/output I/O

47 NC Not Connected (Reserved for future use)

48 GND Ground 0V

Active Low / High

Power Supply Domain

1.8V Left Open Extension

1.8V Left Open Core

1.8V Connect to test point Core/Custom

1.8V Left Open Extension

1.8V Left Open Core

Recommendation for Unused Pads

Mandatory connection

Left Open Not connected

Mandatory connection

Left Open Not connected

Mandatory connection

Type

Core

Extension

Core

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Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

49 RF_MAIN RF Input/output

50 GND Ground 0V

51 GPIO14 General purpose input/output I

52 GPIO10 General purpose input/output I/O

53 GPIO11 General purpose input/output I/O

54 GPIO15 General purpose input/output I/O

55 NC Not Connected (Reserved for future use)

56 NC Not Connected (Reserved for future use)

57 NC Not Connected (Reserved for future use)

58 NC Not Connected (Reserved for future use)

59 PWR_ON Active Low Power On control signal I L 1.8V

60 TX_ON TX indicator O 2.3V Left Open Extension

61 VBATT_PA

62 VBATT_PA

63 VBATT Power supply I

64 UIM1_DET UIM1 Detection I/O H 1.8V Left Open Core

65 GPIO4 General purpose input/output I/O H 1.8V Left Open Extension

66 GPIO5 General purpose input/output I/O

67-70 GND Ground GND

Power supply (refer to section 3.1 Power Supply for more information)

Active Low / High

Power Supply Domain

1.8V Left Open Extension

3.2V (min)

3.7V (typ)

4.5V (max)

3.2V (min)

3.7V (typ)

4.5V (max)

3.2V (min)

3.7V (typ)

4.5V (max)

1.8V Left Open Extension

Recommendation for Unused Pads

Mandatory connection

Left Open Not connected

Mandatory connection

Type

Core

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Product Technical Specification Pad Definition

Pad # Signal Name Function I/O

71 - 166

167 - 234 GND Ground GND 0V Core

236 JTAG_RESET JTAG RESET I L 1.8V Left Open Extension

237 JTAG_TCK JTAG Test Clock I

238 JTAG_TDO JTAG Test Data Output O

239 JTAG_TMS JTAG Test Mode Select I

240 JTAG_TRST JTAG Test Reset I L 1.8V Left Open Extension

241 JTAG_TDI JTAG Test Data Input I

242 JTAG_RTCK JTAG Returned Test Clock O

Note: These pads are not available on the AirPrime HL7688 module.

Active Low / High

Power Supply Domain

1.8V Left Open Extension

Recommendation for Unused Pads

Type

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Product Technical Specification Pad Definition

2.1. Pad Configuration (Top View, Through Module)

Figure 3. Pad Configuration

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3. Detailed Interface Specifications

Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of

25°C.

For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7688 modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled.

3.1. Power Supply

The AirPrime HL7688 modules is supplied through the VBATT signal with the following characteristics.

Table 7. Power Supply

Supply Minimum Typical Maximum

VBATT voltage (V) 3.2* 3.7 4.5

VBATT_PA voltage (V) Full Specification 3.2* 3.7 4.5

VBATT_PA voltage (V) Extended Range 2.8 3.7 4.5

* This value has to be guaranteed during the burst.

Note: Load capacitance for VBATT is around 32µF ± 20% embedded inside the module.

Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module.

3.2. Current Consumption

The following table lists the current consumption of the AirPrime HL7688 at different conditions.

Note: The following data is with USB disconnected to achieve the lowest current consumption. An

Table 8. Current Consumption

Parameter Minimum Typical Maximum Unit

Off mode 95 110 202 µA

Sleep mode – LTE DRX = 1.28s USB = disconnected

additional 0.6mA will be consumed if USB is connected.

Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF ports. Maximum values are provided for VSWR3:1 with worst conditions among supported ranges of voltages and temperature.

Band 2 1.2 1.4 6.2 mA

Band 4 1.2 1.4 6.2 mA

Band 5 1.2 1.4 6.2 mA

Band 17 1.2 1.4 6.2 mA

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Product Technical Specification Detailed Interface Specifications

Parameter Minimum Typical Maximum Unit

Band 2 630 650 895 mA

LTE in communication mode (TX Max)

UMTS (TX Max)

Table 9. Current Consumption per Power Supply

Parameter (at nominal voltage, 3.7 V) Typical Unit

LTE in communication mode (TX Max) USB = disconnected

VBATT_BB

UMTS (TX Max) USB = disconnected

LTE in communication mode (TX Max) USB = disconnected

VBATT_PA

UMTS (TX Max) USB = disconnected

Band 4 510 610 945 mA

Band 5 440 520 745 mA

Band 17 540 560 780 mA

Band 2

Band 5

570

400

660

460

Band 2 214 mA

Band 4 207 mA

Band 5 211 mA

Band 17 218 mA

Band 2 124 mA

Band 5 118 mA

Band 2 436 mA

Band 4 403 mA

Band 5 309 mA

Band 17 342 mA

Band 2 536 mA

Band 5 342 mA

770

500

3.3. VGPIO

The VGPIO output can be used to:

 Pull-up signals such as I/Os

 Supply the digital transistors driving LEDs

The VGPIO output is available when the AirPrime HL7688 module is switched ON.

Table 10. VGPIO Electrical Characteristics

Parameter Minimum Typical Maximum Remarks

Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode

Current capability Active Mode (mA)

Current capability Sleep Mode (mA)

Rise Time(ms) - - 1.5 Start-Up time from 0V

- - 50

- - 3

Power management support up to 50mA output in Active mode

Power management support up to 3mA output in Sleep mode

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Product Technical Specification Detailed Interface Specifications

3.4. BAT_RTC

The AirPrime HL7688 module provides an input/output to connect a Real Time Clock power supply.

This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported when VBATT is available but a back-up power supply is needed to save date and hour when VBATT is switched off.

If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator.

Table 11. BAT_RTC Electrical Characteristics

Parameter Minimum Typical Maximum Unit

Input voltage - 1.8 - V

Input current consumption - 2.5 (TBC) - µA

Output voltage -5% 1.8 +5% V

Max charging current (@VBATT=3.7V) - 25 - mA

Note: When used with the HL Series snap-in socket, or when compatibility with HL6528x is needed,

Sierra Wireless recommends adding a 10µF capacitor to the BAT_RTC pad.

3.5. SIM Interface

The AirPrime HL7688 has one physical SIM interface, UIM1, which has optional support for dual SIM application with an external SIM switch.

The UIM1 interface allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11 recommendations concerning SIM functions.

The five signals used by this interface are as follows:

 UIM1_VCC: power supply

 UIM1_CLK: clock

 UIM1_DATA: I/O port

 UIM1_RESET: reset

 UIM1_DET: SIM detection

Table 12. UIM1 Pad Description

Pad # Signal Name Description

26 UIM1_VCC 1.8V/3V SIM1 Power supply

27 UIM1_CLK 1.8V/3V SIM1 Clock

28 UIM1_DATA 1.8V/3V SIM1 Data

29 UIM1_RESET 1.8V/3V SIM1 Reset

64 UIM1_DET UIM1 Detection

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Product Technical Specification Detailed Interface Specifications

Table 13. Electrical Characteristics of UIM1

Parameter Minimum Typical Maximum Remarks

UIM1 Interface Voltage (V) (VCC,CLK,IO,RST)

UIM1 Detect - 1.80 - High active

UIM1_VCC Current (mA) - - 10

UIM1_VCC Line Regulation (mV/V)

UIM1_VCC Power-up Setting Time (µs) from power down

- 2.9 -

- 1.80 -

- - 50 At Iout_Max

- 10 -

The appropriate output voltage is auto detected and selected by software.

Max output current in sleep mode = 3 mA

3.5.1. UIM1_DET

UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM device in the SIM socket connected to the SIM interface. When a SIM is inserted, the state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of UIM1_DET transitions from logic 1 to logic 0.

3.6. USB

The AirPrime HL7688 has one USB interface.

Table 14. USB Pad Description

Pad Number Signal Name I/O Function

12 USB_D- I/O USB Data Negative

13 USB_D+ I/O USB Data Positive

16 USB_VBUS I USB VBUS

Note: When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB

interface.

3.7. Electrical Information for Digital I/O

The AirPrime HL7688 supports two groups of digital interfaces with varying current drain limits. The following list enumerates these interface groupings and the following table enumerates the electrical characteristics of each digital interface.

 Group 1 (6mA current drain limit)

 GPIO2, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15

 Group 2 (1mA current drain limit)

 GPIO1, GPIO5, GPIO7

 UART1

 JTAG

 PCM

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Product Technical Specification Detailed Interface Specifications

Table 15. Digital I/O Electrical Characteristics

Parameter Symbol Minimum Typical Maximum Remarks

Input Current-High(µA) IIH - - 240

Input Current-Low(µA) IIL - - 240

Group 1

Group 2

DC Output Current-High (mA) I

DC Output Current-Low (mA) IOL -6 - -

DC Output Current-High (mA) I

DC Output Current-Low (mA) IOL -1 - -

- - 6

- - 1

Input Voltage-High(V) VIH 1.19 - 2.10

Input Voltage-Low(V) VIL -0.20 - 0.38

1.35 - - IOH = -6mA

Output Voltage-High(V)

Output Voltage-Low(V)

VOH 1.50 - - IOH = -0.1mA

- - 0.35 I

VOL - - 0.2 I

= 6mA

= 0.1mA

3.8. General Purpose Input/Output (GPIO)

The AirPrime HL7688 module provides 12 GPIOs, 2 of which have multiplexes.

Table 16. GPIO Pad Description

Pad Number Signal Name Multiplex I/O Power Supply Domain

1 GPIO1 I/O 1.8V

10 GPIO2 TRACE_DATA2 I/O 1.8V

40 GPIO7 I/O 1.8V

41 GPIO8 TRACE_CLK I/O 1.8V

44 GPIO13 I/O 1.8V

46 GPIO6 I/O 1.8V

51 GPIO14 I/O 1.8V

52 GPIO10 I/O 1.8V

53 GPIO11 I/O 1.8V

54 GPIO15 I/O 1.8V

65 GPIO4 I/O 1.8V

66 GPIO5 I/O 1.8V

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Product Technical Specification Detailed Interface Specifications

3.9. Main Serial Link (UART1)

The main serial link (UART1) is used for communication between the AirPrime HL7688 module and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface.

The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s.

The signals used by UART1 are as follows:

 TX data (UART1_TX)

 RX data (UART1_RX)

 Request To Send (UART1_RTS)

 Clear To Send (UART1_CTS)

 Data Terminal Ready (UART1_DTR)

 Data Set Ready (UART1_DSR)

 Data Carrier Detect (UART1_DCD)

 Ring Indicator (UART1_RI)

Note: Signal names are according to PC view.

UART1 pad description is summarized in the table below.

Table 17. UART1 Pad Description

Pad # Signal Name* I/O* Description

2 UART1_RI O Signal incoming calls (data only), SMS, etc.

3 UART1_RTS I Request to send

4 UART1_CTS O AirPrime HL7688 is ready to receive AT commands

5 UART1_TX I Transmit data

6 UART1_RX O Receive data

7 UART1_DTR I (active low)

8 UART1_DCD O Signal data connection in progress

9 UART1_DSR O Signal UART interface is ON

* According to PC view.

Prevents the AirPrime HL7688 from entering sleep mode, switches between data mode and command mode, and wakes the module up.

3.10. POWER-ON Signal (PWR_ON_N)

A low level signal has to be provided to switch the AirPrime HL7688 module ON.

It is internally connected to the permanent 1.8V supply regulator inside the HL7688 via a pull-up resistor. Once VBAT is supplied to the HL7688 module, this 1.8V supply regulator will be enabled and so the PWR_ON_N signal is by default at high level.

The PWR_ON_N signal’s characteristics are listed in the table below.

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Product Technical Specification Detailed Interface Specifications

Table 18. PWR_ON_N Electrical Characteristics

Parameter Minimum Typical Maximum

Input Voltage-Low (V) - 0.51

Input Voltage-High (V) 1.33 - 2.2

Power-up period (ms) from PWR_ON_N falling edge 2000 - -

PWR_ON_N assertion time (ms) 25

Note: As PWR_ON_N is internally pulled up with 47kΩ, an open collector or open drain transistor must be

used for ignition.

VGPIO is an output from the module that can be used to check if the module is active.

 When VGPIO = 0V, the module is OFF

 When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)

Note: PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT

command AT+CPWROFF.

3.11. Reset Signal (RESET_IN_N)

To reset the module, a low level pulse must be sent on the RESET_IN_N pad for 20ms. This action will immediately restart the AirPrime HL7688 module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor has to be used to control this signal.

The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for the next power on.

Note: As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open

Table 19. RESET_IN_N Electrical Characteristics

collector or open drain transistor has to be used to control this signal.

Parameter Minimum Typical Maximum

Input Voltage-Low (V) - 0.51

Input Voltage-High (V) 1.33 - 2.2

Reset assertion time (ms) 20 - -

Power-up period (ms) from RESET_IN_N falling edge* 2000 - -

* With the PWR_ON_N Signal at low level

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Product Technical Specification Detailed Interface Specifications

3.12. Analog to Digital Converter (ADC1)

One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7688 module. This converter is a 10-bit resolution ADC ranging from 0 to 1.2V.

The following table describes the pad description of the ADC interface.

Table 20. ADC Interface Pad Description

Pad Number Signal Name I/O Description

24 ADC1 I Analog to digital converter

Typical ADC1 use is for monitoring external voltage; wherein an application is used to safely power OFF an external supply in case of overvoltage.

Table 21. ADC Electrical Characteristics

Parameter Minimum Typical Maximum Remarks

ADC1 Resolution (bits) - 10 -

Input Voltage Range (V) 0 - 1.2 General purpose input

Update rate per channel (kHz) - - 125

Integral Nonlinearity (bits) - - ±2 LSB

Offset Error (bits) - - ±1 LSB

Gain 849 853 858

Input Resistance (MΩ) 1 - -

Input Capacitance (pF) - 1 -

3.13. Clock Interface

The AirPrime HL7688 module supports two digital clock interfaces.

The following table describes the pad description of the clock out interfaces.

Table 22. Clock Interface Pad Description

Pad Number Signal Name I/O I/O Type Description

22 26M_CLKOUT O 1.8V 26MHz Digital Clock output

23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output

Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to document [2] AirPrime HL7688 AT Commands Interface Guide.

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Product Technical Specification Detailed Interface Specifications

3.14. PCM

The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec.

The programmability of this interface allows addressing a large range of audio peripherals.

The signals used by the Digital Audio Interface are as follows:

 PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that

synchronizes the frame data in and the frame data out.

 PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.

 PCM_OUT: The frame “data out” relies on the selected configuration mode.

 PCM_IN: The frame “data in” relies on the selected configuration mode.

The PCM interface is a high speed full duplex interface that can be used to send and receive digital audio data to external audio ICs. The Digital Audio Interface also features the following:

 PCM master or slave

 16 bits data word length, linear mode

 MSB first

 Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz

 Long frame sync

The following table describes the pad description of the PCM interface.

Table 23. PCM Interface Pad Description

Pad Number Signal Name I/O Description

33 PCM_OUT O PCM data out

34 PCM_IN I PCM data in

35 PCM_SYNC I/O PCM sync out

36 PCM_CLK I/O PCM clock

Refer to the following table for the electrical characteristics of the digital audio interface.

Table 24. PCM Electrical Characteristics

Signal Description Minimum Typical Maximum Unit

Tsync_low + Tsync_high

Tsync_low PCM-SYNC low time 62.5 µs

Tsync_high PCM-SYNC high time 62.5 µs

TCLK-cycle PCM-CLK period (T) 1.95 2.6 3.9 µs

TIN-setup PCM-IN setup time 59.6 ns

TIN-hold PCM-IN hold time 12 ns

TOUT-delay PCM-OUT delay time 21.6 ns

PCM-SYNC period 125 µs

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Product Technical Specification Detailed Interface Specifications

Signal Description Minimum Typical Maximum Unit

TSYNC-delay PCM-SYNC output delay -24 31.2 ns

The following figure shows the PCM timing waveform.

Figure 4. PCM Timing Waveform

3.15. Debug Interfaces

The AirPrime HL7688 module provides 2 interfaces for a powerful debug system.

3.15.1. Trace Debug

The AirPrime HL7688 module provides a Trace Debug interface, providing real-time instruction and data trace of the modem core.

Table 25. Trace Debug Pad Description

Pad Number Signal Name Function Multiplex

2 TRACE_DATA3 Trace data 3

8 TRACE_DATA1 Trace data 1

9 TRACE_DATA0 Trace data 0

10 TRACE_DATA2 Trace data 2 GPIO2

41 TRACE_CLK Trace clock GPIO8

Note: It is strongly recommended to provide access to this interface through Test Points.

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Product Technical Specification Detailed Interface Specifications

3.15.2. JTAG

The JTAG interface provides debug access to the core of the AirPrime HL7688. These JTAG signals are accessible through solder-able test points.

Table 26. JTAG Pad Description

Pad Number Signal Name Function

236 JTAG_RESET JTAG RESET

237 JTAG_TCK JTAG Test Clock

238 JTAG_TDO JTAG Test Data Output

239 JTAG_TMS JTAG Test Mode Select

240 JTAG_TRST JTAG Test Reset

241 JTAG_TDI JTAG Test Data Input

242 JTAG_RTCK JTAG Returned Test Clock

Note: It is recommended to provide access through Test Points to this interface the JTAG pads (for

Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board to allow JTAG debugging.

3.16. RF Interface

The RF interface of the HL7688 module allows the transmission of RF signals. This interface has a 50Ω nominal impedance.

3.16.1. RF Connection

A 50Ω stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for antenna connection.

Table 27. RF Main Connection

Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)

49 RF_MAIN 50Ω 1.5:1 1.5:1

Table 28. RF Diversity Connection

Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)

31 RF_DIV 50Ω 1.5:1 ---

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Product Technical Specification Detailed Interface Specifications

3.16.2. RF Performances

Note: Values in the tables below are preliminary and subject to change.

Table 29. Conducted RX Sensitivity – UMTS Bands

Conducted Rx Sensitivity (dBm)

Frequency Band

Primary (Typical) Secondary (Typical)

Band 2

Band 5 -110.0 -110.5

0.1% BER 12.2 kbps

-109.5 -110.0

4G RF performances are compliant with 3GPP recommendation TS 36.101.

Table 30. Conducted RX Sensitivity – LTE Bands

Conducted Rx Sensitivity (dBm)

Frequency Band

Primary (Typical) Secondary (Typical) SIMO (Typical)

LTE B2 Full RB; BW: 20 MHz* -93 -94 -97

LTE B4 Full RB; BW: 20 MHz* -95 -95 -98

LTE B5 Full RB; BW: 10 MHz* -98 -99 -101

LTE B17 Full RB; BW: 10 MHz* -98 -99 -101

* Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz)

3.16.3. TX_ON Indicator (TX_ON)

The AirPrime HL7688 module provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V signal and its status signal depends on the module transmitter state.

Refer to the following table for the status of the TX_ON signal depending on the embedded module’s state.

Table 31. TX_ON Indicator Pad Description

Pad Number Signal Name Function I/O Type Power Supply Domain

60 TX_ON TX indicator O 2.3V

Table 32. TX_ON Characteristics

Parameter Minimum Typical Maximum

30µs

advance

10µs

delay

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Product Technical Specification Detailed Interface Specifications

Figure 5. TX_ON State During Transmission

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4. Mechanical Drawings

Figure 6. Mechanical Drawing

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Product Technical Specification Mechanical Drawings

Figure 7. Dimensions Drawing

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Product Technical Specification Mechanical Drawings

Figure 8. Footprint

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5. Design Guidelines

5.1. Power-Up Sequence

Apply a LOW level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB.

When using UART1, the AT command interface is available after the transition of UART1_CTS from high to low level.

When using a USB connection, the HL7688 will start communicating with the host after USB enumeration. The time when AT commands can be sent will depend on the initialization time on the USB host.

Figure 9. PWR_ON_N Sequence with VGPIO Information

Note: As PWR_ON_N is internally pulled up with 47kΩ, an open collector or open drain transistor must be

The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once the valid power on trigger is detected, the PWR_ON_N pad status can be left open.

The maximum inrush current is 1.3 A and lasts less than 1.5 ms.

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used for ignition.

Product Technical Specification Design Guidelines

5.2. Module Switch-Off

AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7688 module off.

Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO

Note: PWR_ON_N is internally pulled up by 47kΩ to 1.8V.

5.3. Emergency Power OFF

If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must only be used in emergency situations if the system freezes (not responding to AT commands).

To perform an emergency power off, a low level pulse must be sent on the RESET_IN_N pad for 20ms while the PWR_ON_N signal is inactive (high level). This action will immediately shut the HL7688 module down and the registers of the CPU and RAM memory will be reset for the next power on.

5.4. Sleep Mode Management

5.4.1. Using UART1

AT command AT+KSLEEP enables sleep mode configuration.

AT+KSLEEP=0:

 The module is active when DTR signal is active (low electrical level).

 When DTR is deactivated (high electrical level), the module enters sleep mode after a while.

 On DTR activation (low electrical level), the module wakes up.

AT+KSLEEP=1

 The module determines when it enters sleep mode (when no more tasks are running).

 “0x00” character on the serial link wakes the module up.

AT+KSLEEP=2

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Product Technical Specification Design Guidelines

 The module never enters sleep mode.

5.4.2. Using USB

Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is in use.

5.5. Power Supply Design

The AirPrime HL7688 module should not be supplied with voltage over 4.5V even temporarily or however briefly.

If the system’s main board power supply unit is unstable or if the system’s main board is supplied with over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier may be severely damaged.

To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as simple as a Zener diode with decoupling capacitors as shown in the diagram below.

Figure 11. Voltage Limiter Example

5.6. ESD Guidelines for SIM Card

Decoupling capacitors must be added according to the drawings below as close as possible to the SIM card connectors on UIM1_CLK, UIM1_RST, UIM1_VCC, UIM1_DATA and UIM1_DET signals to avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the SIM electrical interface.

A typical schematic including SIM detection is provided below.

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Product Technical Specification Design Guidelines

Figure 12. EMC and ESD Components Close to the SIM

5.7. ESD Guidelines for USB

When the USB interface is externally accessible, it is required to have ESD protection on the USB_VBUS, USB_D+ and USB_D- signals.

Figure 13. ESD Protection for USB

Note: It is not recommended to have an ESD diode with feedback path from USB_VBUS to either

Sierra Wireless recommends using a 90Ω DLP0NSN900HL2L EMC filter and an RCLAMP0503N or ESD5V3U2U-03LRH ESD diode.

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USB_D+ or USB_D-.

6. Reliability Specification

AirPrime HL7688 modules are tested against the Sierra Wireless Industrial Reliability Specification defined below.

6.1. Reliability Compliance

The AirPrime HL7688 module connected on a development kit board application is compliant with the following requirements.

Table 33. Standards Conformity

Abbreviation Definition

IEC International Electro technical Commission

ISO International Organization for Standardization

6.2. Reliability Prediction Model

6.2.1. Life Stress Test

The following tests the AirPrime HL7688 module’s product performance.

Table 34. Life Stress Test

Designation Condition

Standard: N/A

Performance Test PT3T & PTRT

Special conditions:

 Temperature:

 Class A: -30°C to +70°C

 Class B: -40°C to +85°C

 Rate of temperature change: ± 3°C/min

 Recovery time: 3 hours

Operating conditions: Powered

Duration: 14 days

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Product Technical Specification Reliability Specification

6.2.2. Environmental Resistance Stress Tests

The following tests the AirPrime HL7688 module’s resistance to extreme temperature.

Table 35. Environmental Resistance Stress Tests

Designation Condition

Cold Test Active COTA

Resistance to Heat Test RH

Standard: IEC 680068-2-1, Test Ad

Special conditions:

 Temperature: -40°C

 Temperature variation: 1°C/min

Operating conditions: Powered ON with a power cycle of 1 minute ON and 2 minutes OFF

Duration: 3 days

Standard: IEC 680068-2-2, Test Bb

Special conditions:

 Temperature: +85°C

 Temperature variation: 1°C/min

Operating conditions: Powered ON with a power cycle of 15 minutes ON and 15 minutes OFF

Duration: 50 days

6.2.3. Corrosive Resistance Stress Tests

The following tests the AirPrime HL7688 module’s resistance to corrosive atmosphere.

Table 36. Corrosive Resistance Stress Tests

Designation Condition

Humidity Test HUT

Standard: IEC 60068-2-3, Test Ca

Special conditions:

 Temperature: +65°C

 RH: 95%

 Temperature variation: 3 +/- 0.6°C/min

Operating conditions: Powered on, DUT is powered up for 15 minutes and OFF for 15 minutes

Duration: 10 days

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Product Technical Specification Reliability Specification

Designation Condition

Component Solder Wettability CSW

Moist Heat Cyclic Test MHCT

Standard: JESD22 – B102, Method 1/Condition C, Solderability Test Method

Special conditions:

 Test method: Dip and Look Test with Steam preconditioning 8

h+/-15min. dip for 5 +0/-0.5 seconds

Operating conditions: Un-powered

Duration: 1 day

Standard: IEC 60068-2-30, Test Db

Special conditions:

 Upper temperature: +40 ± 2°C

 Lower temperature: +25 ± 5°C

 RH:

 Upper temperature: 93%

 Lower temperature: 95%

 Number of cycles: 21 (1 cycle/24 hours)

 Temperature Variation: 3 +/- 0.6°C/min

Operating conditions: Powered ON for 15 minutes during each 3 hours ramp up and 3 hours ramp down (in middle) for every cycle

Duration: 21 days

6.2.4. Thermal Resistance Cycle Stress Tests

The following tests the AirPrime HL7688 module’s resistance to extreme temperature cycling.

Table 37. Thermal Resistance Cycle Stress Tests

Designation Condition

Standard: IEC 60068-2-14, Test Na

Thermal Shock Test TSKT

Special conditions:

 Temperature: -30°C to +80°C

 Temperature Variation: less than 30s

 Number of cycles: 600

 Dwell Time: 10 minutes

Operating conditions: Un-powered

Duration: 9 days

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Product Technical Specification Reliability Specification

Designation Condition

Standard: IEC 60068-2-14, Test Nb

Temperature Change TCH

Special conditions:

 Temperature: -40°C to +90°C

 Temperature Variation: 3 +/- 0.6°C/min

 Number of cycles: 400

 Dwell Time: 10 minutes

Operating conditions: Un-powered

Duration: 29 days

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Product Technical Specification Reliability Specification

6.2.5. Mechanical Resistance Stress Tests

The following tests the AirPrime HL7688 module’s resistance to vibrations and mechanical shocks.

Table 38. Mechanical Resistance Stress Tests

Designation Condition

Standard: IEC 60068-2-6, Test Fc

Special conditions:



Sinusoidal Vibration Test SVT

Frequency range: 16 Hz to 1000 Hz

Displacement: 0.35mm (peak-peak)



 Acceleration:

 5G from 16 to 62 Hz

 3G from 62 to 200 Hz

 1G from 200 to 1000 Hz

 Sweep rate: 1 octave / cycle

 Number of Sweep: 20 sweeps/axis

 Sweep direction: +/- X,+/- Y, +/- Z

Operating conditions: Un-powered

Duration: 2 days

Standard: IEC 60068-2-64, Test Fh

Special conditions:

Random Vibration Test RVT

Mechanical Shock Test Standard: IEC 60068-2-27, Test Ea

 Frequency range: 10 Hz – 2000 Hz

 Power Spectral Density in [(m/s²)²/Hz]

 0.1 g2/Hz at 10Hz

 0.01 g2/Hz at 250Hz

 0.005 g2/Hz at 1000Hz

 0.005 g2/Hz at 2000Hz

 Peak factor: 3

 Duration per Axis: 1 hr / axis

Operating conditions: Un-powered

Duration: 1 day

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Product Technical Specification Reliability Specification

Designation Condition

MST

Special conditions:

 Shock Test 1:

 Wave form: Half sine

 Peak acceleration: 30g

 Duration: 11ms

 Number of shocks: 8

 Direction: ±X, ±Y, ±Z

 Shock Test 2:

 Wave form: Half sine

 Peak acceleration: 100g

 Duration: 6ms

 Number of shocks: 3

 Direction: ±X, ±Y, ±Z

Operating conditions: Un-powered

Duration: 72 hours

6.2.6. Handling Resistance Stress Tests

The following tests the AirPrime HL7688 module’s resistance to handling malfunctions and damage.

Table 39. Handling Resistance Stress Tests

Designation Condition

Standard: JESD22-A114, JESD22-A115, JESD22-C101

ESDC Test

ESD Test

Free Fall Test FFT 1

Special conditions:

 HBM (Human Body Model): 1KV (Class 1C)

 MM (Machine Model): 200V

 CDM (Charged Device Model): 250V (Class II)

Operating conditions: Powered

Duration: 3 days

Standard: IEC 61000-4-2

Special conditions:

 Contact Voltage: ±2kV, ±4kV, ±6kV

 Air Voltage: ±2kV, ±4kV, ±8kV

Operating conditions: Powered

Duration: 3 days

Standard : IEC 60068-2-32, Test Ed

Special conditions:

 Number of drops: 2 drops per unit

 Height: 1m

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Product Technical Specification Reliability Specification

Designation Condition

Operating conditions: Un-powered

Duration: 6 hours

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7. FCC Regulations

The AirPrime HL7688 module has been granted modular approval for mobile applications. Integrators may use the HL7688 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained.

1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times.

2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed:

 9.01 dBi in Band 2

 6.00 dBi in Band 4

 10.41 dBi in Band 5

 9.74 dBi in Band 17

3. The HL7688 module must not transmit simultaneously with other collocated radio transmitters within a host device.

4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at

http://www.agilent.com).

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Product Technical Specification FCC Regulations

If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply).

If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below.

Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (microcontrollers, etc.) may degrade the reception performances. The antenna connector is intended to be directly connected to a 50Ω antenna and no matching is needed.

5. A label must be affixed to the outside of the end product into which the HL7688 module is incorporated, with a statement similar to the following:

This device contains FCC ID:

N7NHL7688

6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

The end product with an embedded HL7688 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.

Note: If this module is intended for use in a portable device, you are responsible for separate approval to

satisfy the SAR requirements of FCC Part 2.1093.

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8. Ordering Information

Table 40. Ordering Information

Model Name Description Part Number

HL7688 HL7688 embedded module Contact Sierra Wireless for the latest SKU

DEV-KIT HL Series Development Kit 6000620

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9. Terms and Abbreviations

Abbreviation Definition

ADC Analog to Digital Converter

AGC Automatic Gain Control

AT Attention (prefix for modem commands)

CDMA Code Division Multiple Access

CF3 Common Flexible Form Factor

CLK Clock

CODEC Coder Decoder

CPU Central Processing Unit

DAC Digital to Analog Converter

DTR Data Terminal Ready

EGNOS European Geostationary Navigation Overlay Service

EMC Electromagnetic Compatibility

EMI Electromagnetic Interference

EN Enable

ESD Electrostatic Discharges

ETSI European Telecommunications Standards Institute

FDMA Frequency-division multiple access

GAGAN GPS aided geo augmented navigation

GLONASS Global Navigation Satellite System

GND Ground

GNSS Global Navigation Satellite System

GPIO General Purpose Input Output

GPRS General Packet Radio Service

GSM Global System for Mobile communications

Hi Z High impedance (Z)

IC Integrated Circuit

IMEI International Mobile Equipment Identification

I/O Input / Output

LED Light Emitting Diode

LNA Low Noise Amplifier

MAX Maximum

MIN Minimum

MSAS Multi-functional Satellite Augmentation System

N/A Not Applicable

PA Power Amplifier

PC Personal Computer

PCB Printed Circuit Board

PCL Power Control Level

PLL Phase Lock Loop

PWM Pulse Width Modulation

QZSS Quasi-Zenith Satellite System

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Product Technical Specification Terms and Abbreviations

Abbreviation Definition

RF Radio Frequency

RFI Radio Frequency Interference

RMS Root Mean Square

RST Reset

RTC Real Time Clock

RX Receive

SCL Serial Clock

SDA Serial Data

SIM Subscriber Identification Module

SMD Surface Mounted Device/Design

SPI Serial Peripheral Interface

SW Software

PSRAM Pseudo Static RAM

TBC To Be Confirmed

TBD To Be Defined

TP Test Point

TX Transmit

TYP Typical

UART Universal Asynchronous Receiver-Transmitter

UICC Universal Integrated Circuit Card

USB Universal Serial Bus

UIM User Identity Module

VBATT Main Supply Voltage from Battery or DC adapter

VSWR Voltage Standing Wave Ratio

WAAS Wide Area Augmentation System

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Sierra Wireless HL7688 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual