Sierra Wireless HL7650 User Manual

Product Technical Specification

AirPrime HL7650

41110363

4.0

October 18, 2017

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence.

is open. Sierra Wireless modems may be used at this time.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.

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Product Technical Specification

Patents

This product may contain technology developed by or for Sierra Wireless Inc.

This product includes technology licensed from QUALCOMM®.

This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing.

Trademarks

Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher® is a registered trademark of NETGEAR, Inc., used under license.

Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.

Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries.

QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.

Other trademarks are the property of their respective owners.

Contact Information

Sales information and technical support, including warranty and returns

Corporate and product information

Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST

Web: sierrawireless.com

41110363 Rev 4.0 October 18, 2017 3

Product Technical Specification

Document History

Vers ion Date Upda tes

1.0 January 26, 2017 Creation

1.1 February 01, 2017 Changed remaining instances of SIM to USIM

Updated:

 Protocol Stack row of Table 2 General Features

2.0 May 04, 2017

3.0 June 22, 2017

4.0 October 18, 2017

 3.2 Current Consumption  3.16.2 RF Performances  4 Mechanical Drawings

Added section 5.3 Hardware Fast Shut Down

Updated:

 3.2 Current Consumption  Table 20 Digital I/O Electrical Characteristics  3.16.2 RF Performances  3.16.3 TX_ON Indicator (TX_ON)  4 Mechanical Drawings

Added 7 FCC Regulations

Updated Table 43 TX_ON Burst Characteristics

41110363 Rev 4.0 October 18, 2017 4

Contents

1. INTRODUCTION ................................................................................................ 10

1.1. Common Flexible Form Factor (CF3) ................................................................................ 10

1.2. Physical Dimensions ......................................................................................................... 10

1.3. General Features ............................................................................................................... 11

1.4. Architecture........................................................................................................................ 13

1.5. Interfaces ........................................................................................................................... 13

1.6. Connection Interface ......................................................................................................... 14

1.7. ESD ................................................................................................................................... 15

1.8. Environmental and Certifications ....................................................................................... 15

1.8.1. Environmental Specifications ................................................................................... 15

1.8.2. Regulatory ................................................................................................................ 16

1.8.3. RoHS Directive Compliant ....................................................................................... 16

1.8.4. Disposing of the Product .......................................................................................... 16

1.9. References ........................................................................................................................ 16

2. PAD DEFINITION ............................................................................................... 17

2.1. Pad Types .......................................................................................................................... 21

2.2. Pad Configuration (Top View, Through Module) ............................................................... 22

3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23

3.1. Power Supply..................................................................................................................... 23

3.2. Current Consumption ........................................................................................................ 24

3.3. VGPIO ............................................................................................................................... 25

3.4. BAT_RTC .......................................................................................................................... 25

3.5. USIM Interface ................................................................................................................... 26

3.5.1. UIMx_CLK ................................................................................................................ 27

3.5.2. UIMx_DET ............................................................................................................... 27

3.6. USB Interface .................................................................................................................... 28

3.7. Electrical Information for Digital I/O ................................................................................... 29

3.8. General Purpose Input/Output (GPIO) .............................................................................. 29

3.9. Main Serial Link (UART1) .................................................................................................. 30

3.10. POWER-ON Signal (PWR_ON_N).................................................................................... 31

3.11. Reset Signal (RESET_IN_N) ............................................................................................. 31

3.12. Analog to Digital Converter (ADC)..................................................................................... 32

3.13. Clock Out Interface ............................................................................................................ 33

3.14. Digital Audio (PCM) Interface ............................................................................................ 34

3.14.1. PCM Waveforms ...................................................................................................... 35

3.14.2. PCM Master Mode ................................................................................................... 36

3.14.3. PCM Slave Mode ..................................................................................................... 37

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Product Technical Specification

3.15. JTAG .................................................................................................................................. 38

3.16. RF Interface ....................................................................................................................... 39

3.16.1. RF Connection ......................................................................................................... 39

3.16.2. RF Performances ..................................................................................................... 39

3.16.3. TX_ON Indicator (TX_ON) ....................................................................................... 40

4. MECHANICAL DRAWINGS ............................................................................... 42

5. DESIGN GUIDELINES ....................................................................................... 45

5.1. Power-Up Sequence ......................................................................................................... 45

5.2. Module Switch-Off ............................................................................................................. 45

5.3. Hardware Fast Shut Down ................................................................................................ 46

5.4. Emergency Power OFF ..................................................................................................... 46

5.5. Sleep Mode Management ................................................................................................. 46

5.6. Power Supply Design ........................................................................................................ 47

5.7. EMC and ESD Guidelines for USIM .................................................................................. 47

5.8. ESD Guidelines for USB .................................................................................................... 48

5.9. USIM Application ............................................................................................................... 49

5.9.1. Single USIM Design ................................................................................................. 49

5.9.2. Dual SIM Single Standby Design............................................................................. 50

6. RELIABILITY SPECIFICATION ......................................................................... 51

6.1. Reliability Compliance ....................................................................................................... 51

6.2. Reliability Prediction Model ............................................................................................... 51

6.2.1. Life Stress Test ........................................................................................................ 51

6.2.2. Environmental Resistance Stress Tests .................................................................. 52

6.2.3. Corrosive Resistance Stress Tests ......................................................................... 52

6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 53

6.2.5. Mechanical Resistance Stress Tests ....................................................................... 54

6.2.6. Handling Resistance Stress Tests ........................................................................... 55

7. FCC REGULATIONS ......................................................................................... 56

8. ORDERING INFORMATION .............................................................................. 58

9. TERMS AND ABBREVIATIONS ........................................................................ 59

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List of Figures

Figure 1. Architecture Overview ..................................................................................................... 13

Figure 2. Mechanical Overview (Top and Bottom Views) .............................................................. 14

Figure 3. AirPrime HL7650 Top View ............................................................................................. 14

Figure 4. AirPrime HL7650 Bottom View ........................................................................................ 14

Figure 5. Pad Configuration ............................................................................................................ 22

Figure 6. UIMx Timing Waveform ................................................................................................... 27

Figure 7. CLKOUTx Timing Waveform ........................................................................................... 33

Figure 8. PCM Timing Waveform ................................................................................................... 35

Figure 9. PCM Master Mode Timing ............................................................................................... 36

Figure 10. PCM Master Mode Timing ............................................................................................... 37

Figure 11. JTAG Timing Waveform .................................................................................................. 38

Figure 12. TX_ON State During Transmission ................................................................................. 41

Figure 13. Mechanical Drawing ........................................................................................................ 42

Figure 14. Dimensions Drawing ....................................................................................................... 43

Figure 15. Footprint .......................................................................................................................... 44

Figure 16. PWR_ON_N Sequence with VGPIO Information ............................................................ 45

Figure 17. Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 45

Figure 18. Fast Shutdown Power OFF Sequence ............................................................................ 46

Figure 19. Voltage Limiter Example ................................................................................................. 47

Figure 20. EMC and ESD Components Close to the USIM ............................................................. 48

Figure 21. ESD Protection for USB .................................................................................................. 48

Figure 22. Single USIM Application (1 USIM Slot and 1 USIM Connector) ..................................... 49

Figure 23. Dual SIM Single Standby Application (1 USIM Slot and 2 USIM Connectors) ............... 50

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List of Tables

Table 1. Supported Bands/Connectivity ........................................................................................ 10

Table 2. General Features ............................................................................................................ 11

Table 3. ESD Specifications .......................................................................................................... 15

Table 4. Environmental Specifications .......................................................................................... 15

Table 5. Pad Definition .................................................................................................................. 17

Table 6. Pad Types ....................................................................................................................... 21

Table 7. Power Supply Pad Description ........................................................................................ 23

Table 8. Power Supply Electrical Characteristics .......................................................................... 23

Table 9. Current Consumption ...................................................................................................... 24

Table 10. Current Consumption per Power Supply ......................................................................... 24

Table 11. VGPIO Pad Description ................................................................................................... 25

Table 12. VGPIO Electrical Characteristics ..................................................................................... 25

Table 13. BAT_RTC Pad Description .............................................................................................. 25

Table 14. BAT_RTC Electrical Characteristics................................................................................ 26

Table 15. UIM1 Pad Description ..................................................................................................... 26

Table 16. UIM2 Pad Description ..................................................................................................... 26

Table 17. UIM1 and UIM2 Electrical Characteristics ....................................................................... 27

Table 18. USB Pad Description ....................................................................................................... 28

Table 19. USB Electrical Characteristics ......................................................................................... 28

Table 20. Digital I/O Electrical Characteristics ................................................................................ 29

Table 21. GPIO Pad Description ..................................................................................................... 29

Table 22. UART1 Pad Description .................................................................................................. 30

Table 23. PWR_ON_N Pad Description .......................................................................................... 31

Table 24. PWR_ON_N Electrical Characteristics ........................................................................... 31

Table 25. RESET_IN_N Pad Description ........................................................................................ 32

Table 26. RESET_IN_N Electrical Characteristics .......................................................................... 32

Table 27. ADC Pad Description ...................................................................................................... 32

Table 28. ADC Electrical Characteristics ........................................................................................ 32

Table 29. Clock Out Interface Pad Description ............................................................................... 33

Table 30. Clock Out Interface Electrical Characteristics ................................................................. 33

Table 31. Digital Audio Pad Description .......................................................................................... 34

Table 32. Digital Audio Electrical Characteristics ............................................................................ 34

Table 33. PCM Master Mode Parameters ....................................................................................... 36

Table 34. PCM Slave Mode Parameters ......................................................................................... 37

Table 35. JTAG Pad Description ..................................................................................................... 38

Table 36. JTAG Electrical Characteristics ....................................................................................... 38

Table 37. RF Main Connection ........................................................................................................ 39

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Product Technical Specification

Table 38. RF Diversity Connection .................................................................................................. 39

Table 39. Conducted RX Sensitivity (dBm) – UMTS Bands @ 25°C .............................................. 39

Table 40. Conducted RX Sensitivity (dBm) – LTE Bands @ 25°C ................................................. 40

Table 41. TX_ON Indicator Pad Description ................................................................................... 40

Table 42. Burst Indicator States ...................................................................................................... 40

Table 43. TX_ON Burst Characteristics .......................................................................................... 40

Table 44. Standards Conformity ...................................................................................................... 51

Table 45. Life Stress Test................................................................................................................ 51

Table 46. Environmental Resistance Stress Tests ......................................................................... 52

Table 47. Corrosive Resistance Stress Tests ................................................................................. 52

Table 48. Thermal Resistance Cycle Stress Tests ......................................................................... 53

Table 49. Mechanical Resistance Stress Tests .............................................................................. 54

Table 50. Handling Resistance Stress Tests .................................................................................. 55

Table 51. Ordering Information ....................................................................................................... 58

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1. Introduction

This document is the Product Technical Specification for the AirPrime HL7650 Embedded Module. It defines the high-level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical.

The AirPrime HL7650 belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE and 3G networks (as listed in Table 1 Supported Bands/Connectivity).

The HL7650 supports a large variety of interfaces such as USB 2.0, UART, Digital Audio, ADC, USIM and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions.

Table 1. Supported Bands/Connectivity

Tr ansmi t B an d (Tx) Rece ive Band (R x)

RF B and

Uplink Down lin k U plink D ownlink

LTE B3 1710 MHz 1785 MHz 1805 MHz 1880 MHz 23 dBm ± 2 dBm

LTE B5 824 MHz 849 MHz 869 MHz 894 MHz 23 dBm ± 2 dBm

LTE B8 880 MHz 915 MHz 925 MHz 960 MHz 23 dBm ± 2 dBm

LTE B28 703 MHz 748 MHz 758 MHz 808 MHz 23 dBm ± 2 dBm

UMTS B1 1920 MHz 1980 MHz 2110 MHz 2170 MHz 24 dBm +1 / -3 dBm

UMTS B5 824 MHz 849 MHz 869 MHz 894 MHz 24 dBm +1 / -3 dBm

UMTS B8 880 MHz 915 MHz 925 MHz 960 MHz 24 dBm +1 / -3 dBm

Maximum Outp ut Power

1.1. Common Flexible Form Factor (CF3)

The AirPrime HL7650 belongs to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF solution to a series of problems faced commonly in the WWAN module space as it:

 Accommodates multiple radio technologies (from 3G to LTE advanced) and band groupings

 Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions

 Offers electrical and functional compatibility

 Provides Direct Mount as well as Socket-ability depending on customer needs

form factor provides a unique

1.2. Physical Dimensions

AirPrime HL7650 modules are compact, robust, fully shielded modules with the following dimensions:

 Length: 23 mm

 Width: 22 mm

 Thickness: 2.5 mm

 Weight: 3.5 g

Note: Dimensions specified above are typical values.

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Product Technical Specification Introduction

1.3. General Features

The table below summarizes the AirPrime HL7650 features.

Table 2. General Features

Feat ure Descrip tion

 Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x

2.5mm (nominal)

Physical

Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V

RF Quad-band LTE (B3, B5, B8 and B28) and tri-band UMTS (B1, B5 and B8)

USIM interface

 Metal shield can  RF connection pads (RF main interface)  Baseband signals connection

 Dual SIM Single Standby (DSSS)  1.8V/3V support  SIM extraction / hot plug detection  SIM/USIM support  Conforms to ETSI UICC Specifications.  Supports SIM application tool kit with proactive SIM commands

Application interface

Protocol stack

Note: Although UIM2 connectivity is available in the hardware, this feature is

not activated in the firmware.

 NDIS NIC interface support (Windows 7, Windows 8, Linux)  MBIM support  Multiple non-multiplexed USB channel support  Dial-up networking  USB selective suspend to maximize power savings  CMUX multiplexing over UART  AT command interface – 3GPP 27.007 standard, plus proprietary

extended AT commands

 LTE mode operation:

 LTE FDD, bandwidth 1.4-20 MHz  System Release: 3GPP Rel. 9  Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)  Rx Diversity  Max modulation 64 QAM DL, 16 QAM UL  Intra-frequency and inter-frequency mobility  SON ANR  Public Warning System PWS

 HSDPA (High Speed Downlink Packet Access)

 Compliant with 3GPP Rel. 8  Category 10 (10.1Mbps)  IPv6 support

 HSUPA (High Speed Uplink Packet Access)

 Compliant with 3GPP Release 8  Category 6 (5.76Mbps)

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Product Technical Specification Introduction

Feat ure Descrip tion

 SMS over SGs and IMS  SMS MO and MT  SMS saving to SIM card or ME storage  SMS reading from SIM card or ME storage

SMS

Connectivity

Environmental

RTC Real Time Clock (RTC) with calendar

 SMS sorting  SMS concatenation  SMS Status Report  SMS replacement support  SMS storing rules (support of

 Multiple (up to 20) cellular packet data profiles  Sleep mode for minimum idle power draw  Mobile-originated PDP context activation / deactivation  Support QoS profile

 Release 97 – Precedence Class, Reliability Class, Delay Class,

Peak Throughput, Mean Throughput

 Release 99 QoS negotiation – Background, Interactive, and

Streaming

 Static and Dynamic IP address. The network may assign a fixed IP

address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).

 Supports PAP and CHAP authentication protocols  PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context  RFC1144 TCP/IP header compression

Operating temperature ranges (industrial grade):

 Class A: -30°C to +70°C  Class B: -40°C to +85°C

AT+CNMI, AT+CNMA

)

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Product Technical Specification Introduction

1.4. Architecture

The figure below presents an overview of the AirPrime HL7650 internal architecture and external interfaces.

VBAT T

GND

VGPIO

BAT_RTC

USIM1

USIM2

USB

GPIO x 12

LGA-

146

UART1 (8 pins)

PWR_ON_N

RESET_IN_N

ADC x 2

32K_CLKOUT

PCM

JTAG

TX_ON

26MHz

Figure 1. Architecture Overview

1.5. Interfaces

Baseband

Memory

(Flash + RAM)

MCU DSP

PMU RF

Analog Baseband

Peripherals

32.768KHz

TX_LTE

AirPrime HL7650

Dulpexer

SAW

Filters

Antenna

Switch

Antenna

Switch

LGA-

146

RF DIV

The AirPrime HL7650 module provides the following interfaces and peripheral connectivity:

 1x – VGPIO

 1x – BAT_RTC Backup Battery Interface

 2x – 1.8V/3V USIM

 1x – USB 2.0

 12x – GPIOs (1 of which is multiplexed)

 1x – 8-wire UART

 1x – Active Low PWR_ON_N

 1x – Active Low RESET_IN_N

 2x – ADC

 2x – System Clock out (32.768 KHz and 26 MHz)

 1x – Digital Audio Interface (PCM)

 1x – JTAG Interface

 1x – RF Main Antenna

 1x – RF Diversity

 1x – TX Indicator

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Product Technical Specification Introduction

1.6. Connection Interface

The AirPrime HL7650 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview (Top and Bottom Views)

The 146 pads have the following distribution:

 66 inner signal pads, 1x0.5mm, pitch 0.8mm

 1 reserved test point (do not connect), 1.0mm diameter

 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

 4 inner corner ground pads, 1x1mm

 4 outer corner ground pads, 1x0.9mm

Figure 3. AirPrime HL7650 Top View

Figure 4. AirPrime HL7650 Bottom View

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Product Technical Specification Introduction

1.7. ESD

Refer to the following table for ESD Specifications.

Table 3. ESD Specifications

Cate gor y Conne ction Speci fication

Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)

Unless otherwise specified:

JESD22-A114 ± 1kV Human Body Model

Non-operational

Signals

Host connector interface

USIM connector Adding ESD protection is highly recommended at the point where

Other host signals

 

JESD22-A115 ± 200V Machine Model

JESD22-C101C ± 250V Charged Device Model



the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user.

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table below.

Table 4. Environmental Specifications

Cond iti ons Rang e

Operating Class A -30°C to +70°C

Operating Class B -40°C to +85°C

Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

 Shall exhibit normal function during and after environmental exposure.

 Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

 Shall remain fully functional during and after environmental exposure

 Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

 Unless otherwise stated, full performance should return to normal after the excessive

constraint(s) have been removed.

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Product Technical Specification Introduction

1.8.2. Regulatory

Sierra Wireless hereby declares that the HL7650 is in compliance with all essential requirements of Directive <TBD>.

The Declaration of Conformity will be available for viewing at the following location in the EU community:

Sierra Wireless (UK) Limited Suite 5, The Hub Fowler Avenue Farnborough Business Park Farnborough, United Kingdom GU14 7JP

1.8.3. RoHS Directive Compliant

The AirPrime HL7650 module is compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner.

1.9. References

[1] AirPrime HL Series Customer Process Guidelines

Reference Number: 4114330

[2] AirPrime HL76xx AT Commands Interface Guide

Reference Number: 4118395

[3] AirPrime HL Series Development Kit User Guide

Reference Number: 4114877

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2. Pad Definition

AirPrime HL7650 pads are divided into 2 functional categories.

 Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of

modules. These Core functions are always available and always at the same physical pad location. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.

 Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it

is always at the same pad location.

Other pads marked as “not connected” or “reserved” should not be used.

Table 5. Pad Definition

Pad #

1 GPIO1 General purpose input/output I/O I, T - 1.8V Left Open Extension

2 UART1_RI UART1 Ring indicator O O, L - 1.8V Connect to test point Core

3 UART1_RTS UART1 Request to send I I, T/PU L 1.8V Connect to test point Core

4 UART1_CTS UART1 Clear to send O I, T/PU L 1.8V Connect to test point Core

5 UART1_TX UART1 Transmit data I I, T/PD - 1.8V Connect to test point Core

6 UART1_RX UART1 Receive data O I, T/PU - 1.8V Connect to test point Core

7 UART1_DTR UART1 Data terminal ready I I, T/PD L 1.8V Connect to test point Core

8 UART1_DCD UART1 Data carrier detect O O, L L 1.8V Connect to test point Core

9 UART1_DSR UART1 Data set ready O O, H L 1.8V Connect to test point Core

10 GPIO2 General purpose input/output I/O O, L - 1.8V Connect to test point Core

11 RESET_IN_N Input reset signal I N/A L 1.8V Left Open Core

Signal Na me Function I/O

I/O HW Reset Stat e

Acti ve Low/ Hi gh

Power Supp ly Domain

Recomm end ation for Unused P ads

Type

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Product Technical Specification Pad Definition

Pad #

12 USB_D-

13 USB_D+

14 NC Not Connected - - - Not connected

15 NC Not Connected - - - Not connected

16 USB_VBUS USB VBUS I N/A - 5V Connect to test point Extension

17 NC Not Connected (Reserved for future use) - - - Left Open Not connected

18 NC Not Connected (Reserved for future use) - - - Left Open Not connected

19 NC Not Connected (Reserved for future use) - - - Left Open Not connected

20 NC Not Connected (Reserved for future use) - - - Left Open Not connected

21 BAT_RTC Power supply for RTC backup I/O N/A - 1.8V Left Open Extension

22 26M_CLKOUT 26MHz System Clock Output O I, T/PD - 1.8V Left Open Extension

23 32K_CLKOUT 32.768kHz System Clock Output O I, T/PD - 1.8V Left Open Extension

24 ADC1 Analog to digital converter I N/A - 1.2V Left Open Extension

25 ADC0 Analog to digital converter I N/A - 1.2V Left Open Extension

26 UIM1_VCC 1.8V/3V USIM1 Power supply O N/A - 1.8V/3V Mandatory connection Core

27 UIM1_CLK 1.8V/3V USIM1 Clock O O, L - 1.8V/3V Mandatory connection Core

28 UIM1_DATA 1.8V/3V USIM1 Data I/O O, L - 1.8V/3V Mandatory connection Core

29 UIM1_RESET 1.8V/3V USIM1 Reset O O, L L 1.8V/3V Mandatory connection Core

30 GND Ground 0V N/A - 0V Mandatory connection Extension

31 RF_DIV RF Input - Diversity - N/A - Mandatory connection Extension

32 GND Ground 0V N/A - 0V Mandatory connection Extension

33 PCM_OUT PCM data out O I, T/PD - 1.8V Left Open Extension

34 PCM_IN PCM data in I I, T/PD - 1.8V Left Open Extension

35 PCM_SYNC PCM sync out I/O I, T/PD - 1.8V Left Open Extension

Sign al Name Fun ct ion I/O

USB Data Negative (Low / Full Speed)

USB Data Negative (High Speed) 0.38V

USB Data Positive (Low / Full Speed)

USB Data Positive (High Speed) 0.38V

I/O T -

I/O HW Reset State

Acti ve Low/ High

Power Supp ly Domain

3.3V

Reco mm end ation for Unused P ads

Connect to test point Extension

Type

41110363 Rev 4.0 October 18, 2017 18

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