Sierra Wireless HL7648 Users manual

AirPrime HL7648
Product Technical Specification
4119069
3.1
Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.
4119069 Rev 3.1 October 27, 2016 2
Product Technical Specification
Sales information and technical support, including warranty and returns
Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795
6:00 am to 6:00 pm PST
Corporate and product information
Web: sierrawireless.com
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product includes technology licensed from QUALCOMM®.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing.
Copyright
© 2016 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
4119069 Rev 3.1 October 27, 2016 3
Product Technical Specification
Versi on
Date
Updat es
1.0
May 05, 2016
Creation
2.0
August 05, 2016
Added 5.5 Power Supply Design
Updated:
3.2 Current Consumption  Table 39 Ordering Information
3.0
October 25, 2016
Updated:
PWR_ON_N pull up resistor value from 47kΩ to 100kΩ 7 FCC Legal Information
3.1
October 27, 2016
Updated 7 FCC Legal Information
Document History
4119069 Rev 3.1 October 27, 2016 4

Contents

INTRODUCTION ................................................................................................ 10
1.
1.1. Common Flexible Form Factor (CF3) .............................................................................. 10
1.2. Physical Dimensions ....................................................................................................... 10
1.3. General Features ............................................................................................................. 11
1.4. Architecture ..................................................................................................................... 12
1.5. Interfaces ......................................................................................................................... 13
1.6. Connection Interface ....................................................................................................... 13
1.7. ESD ................................................................................................................................. 14
1.8. Environmental and Certifications ..................................................................................... 14
1.8.1. Environmental Specifications ................................................................................... 14
1.8.2. Regulatory ................................................................................................................ 15
1.8.3. RoHS Directive Compliant ....................................................................................... 15
1.8.4. Disposing of the Product .......................................................................................... 15
1.9. References ...................................................................................................................... 15
2. PAD DEFINITION ............................................................................................... 16
2.1. Pad Configuration (Top View, Through Module) ............................................................. 20
3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 21
3.1. Power Supply .................................................................................................................. 21
3.2. Current Consumption ...................................................................................................... 21
3.3. VGPIO ............................................................................................................................. 22
3.4. BAT_RTC ........................................................................................................................ 22
3.5. SIM Interface ................................................................................................................... 23
3.5.1. UIM1_DET................................................................................................................ 23
3.6. USB ................................................................................................................................. 24
3.7. Electrical Information for Digital I/O ................................................................................. 24
3.8. General Purpose Input/Output (GPIO) ............................................................................ 25
3.9. Main Serial Link (UART1) ................................................................................................ 25
3.10. POWER-ON Signal (PWR_ON_N) ................................................................................. 26
3.11. Reset Signal (RESET_IN_N) .......................................................................................... 27
3.12. Analog to Digital Converter (ADCs) ................................................................................. 27
3.13. Clock Interface ................................................................................................................. 28
3.14. Digital Audio (PCM) ......................................................................................................... 28
3.15. Debug Interfaces ............................................................................................................. 30
3.15.1. Trace Debug ............................................................................................................ 30
3.15.2. JTAG ........................................................................................................................ 30
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Product Technical Specification
3.16. RF Interface ..................................................................................................................... 31
3.16.1. RF Connection ......................................................................................................... 31
3.16.2. RF Performances ..................................................................................................... 31
3.16.3. TX_ON Indicator (TX_ON) ....................................................................................... 32
4. MECHANICAL DRAWINGS ............................................................................... 33
5. DESIGN GUIDELINES ....................................................................................... 35
5.1. Power-Up Sequence ....................................................................................................... 35
5.2. Module Switch-Off ........................................................................................................... 35
5.3. Emergency Power OFF ................................................................................................... 36
5.4. Sleep Mode Management ............................................................................................... 36
5.4.1. Using UART1 ........................................................................................................... 36
5.4.2. Using USB ................................................................................................................ 36
5.5. Power Supply Design ...................................................................................................... 36
5.6. ESD Guidelines for SIM Card .......................................................................................... 37
5.7. ESD Guidelines for USB.................................................................................................. 38
6. RELIABILITY SPECIFICATION ......................................................................... 39
6.1. Reliability Compliance ..................................................................................................... 39
6.2. Reliability Prediction Model ............................................................................................. 39
6.2.1. Life Stress Test ........................................................................................................ 39
6.2.2. Environmental Resistance Stress Tests .................................................................. 40
6.2.3. Corrosive Resistance Stress Tests .......................................................................... 40
6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 41
6.2.5. Mechanical Resistance Stress Tests ....................................................................... 42
6.2.6. Handling Resistance Stress Tests ........................................................................... 43
7. FCC LEGAL INFORMATION ............................................................................. 44
8. ORDERING INFORMATION .............................................................................. 46
9. TERMS AND ABBREVIATIONS ........................................................................ 47
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List of Figures

Figure 1.
Figure 2. AirPrime HL7648 Mechanical Overview (Top View and Bottom View) ........................... 13
Figure 3. Pad Configuration ............................................................................................................ 20
Figure 4. PCM Timing Waveform ................................................................................................... 29
Figure 5. TX_ON State During Transmission ................................................................................. 32
Figure 6. AirPrime HL7648 Mechanical Drawing ........................................................................... 33
Figure 7. AirPrime HL7648 Dimensions Drawing ........................................................................... 34
Figure 8. PWR_ON_N Sequence with VGPIO Information ............................................................ 35
Figure 9. Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 35
Figure 10. Voltage Limiter Example ................................................................................................. 37
Figure 11. EMC and ESD Components Close to the SIM ................................................................ 37
Figure 12. ESD Protection for USB .................................................................................................. 38
AirPrime HL7648 Architecture Overview ......................................................................... 12
4119069 Rev 3.1 October 27, 2016 7

List of Tables

Table 1.
Table 2. AirPrime HL7648 Features .............................................................................................. 11
Table 3. ESD Specifications .......................................................................................................... 14
Table 4. AirPrime HL7648 Environmental Specifications .............................................................. 14
Table 5. Regulation Compliance ................................................................................................... 15
Table 6. Pad Definition .................................................................................................................. 16
Table 7. Power Supply .................................................................................................................. 21
Table 8. Current Consumption ...................................................................................................... 21
Table 9. Current Consumption per Power Supply ......................................................................... 22
Table 10. VGPIO Electrical Characteristics ..................................................................................... 22
Table 11. BAT_RTC Electrical Characteristics................................................................................ 22
Table 12. UIM1 Pad Description ..................................................................................................... 23
Table 13. Electrical Characteristics of UIM1 ................................................................................... 23
Table 14. USB Pad Description ....................................................................................................... 24
Table 15. Digital I/O Electrical Characteristics ................................................................................ 24
Table 16. GPIO Pad Description ..................................................................................................... 25
Table 17. UART1 Pad Description .................................................................................................. 26
Supported Bands/Connectivity ........................................................................................ 10
Table 18. PWR_ON_N Electrical Characteristics ........................................................................... 26
Table 19. RESET_IN_N Electrical Characteristics .......................................................................... 27
Table 20. ADC Interface Pad Description ....................................................................................... 27
Table 21. ADC Electrical Characteristics ........................................................................................ 27
Table 22. Clock Interface Pad Description ...................................................................................... 28
Table 23. PCM Interface Pad Description ....................................................................................... 29
Table 24. PCM Electrical Characteristics ........................................................................................ 29
Table 25. Trace Debug Pad Description ......................................................................................... 30
Table 26. JTAG Pad Description ..................................................................................................... 30
Table 27. RF Main Connection ........................................................................................................ 31
Table 28. RF Diversity Connection .................................................................................................. 31
Table 29. Conducted RX Sensitivity (dBm) ..................................................................................... 31
Table 30. TX_ON Indicator Pad Description ................................................................................... 32
Table 31. TX_ON Characteristics .................................................................................................... 32
Table 32. Standards Conformity ...................................................................................................... 39
Table 33. Life Stress Test................................................................................................................ 39
Table 34. Environmental Resistance Stress Tests ......................................................................... 40
Table 35. Corrosive Resistance Stress Tests ................................................................................. 40
Table 36. Thermal Resistance Cycle Stress Tests ......................................................................... 41
Table 37. Mechanical Resistance Stress Tests .............................................................................. 42
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Product Technical Specification
Table 38. Handling Resistance Stress Tests .................................................................................. 43
Table 39. Ordering Information ....................................................................................................... 46
4119069 Rev 3.1 October 27, 2016 9

1. Introduction

RF Band
Maximum Outpu t Power
LTE B2
1850 to 1910 MHz
1930 to 1990 MHz
23dBm ± 2dBm
LTE B4
1710 to 1755 MHz
2110 to 2155 MHz
23dBm ± 2dBm
LTE B12
699 to 716 MHz
729 to 746 MHz
23dBm ± 2dBm
This document is the Product Technical Specification for the AirPrime HL7648 Embedded Module. It defines the high level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7648 belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides LTE category 1 data connectivity on LTE networks (as listed in Table 1 Supported Bands/Connectivity).
The HL7648 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions.
Table 1. Supported Bands/Connectivity
Trans mit B and (Tx) Rece ive Band (Rx )

1.1. Common Flexible Form Factor (CF3)

The AirPrime HL7648 belongs to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF solution to a series of problems faced commonly in the WWAN module space as it:
Accommodates LTE radio technology and band groupings
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
Offers electrical and functional compatibility
Provides Direct Mount as well as Socketability depending on customer needs
3
form factor provides a unique

1.2. Physical Dimensions

AirPrime HL7648 modules are compact, robust, fully shielded modules with the following dimensions:
Length: 23 mm
Width: 22 mm
Thickness: 2.5 mm
Weight: 3.5 g
Note: Dimensions specified above are typical values.
4119069 Rev 3.1 October 27, 2016 10
Product Technical Specification
Introduction
Featu re
Descr iption
Physical
Small form factor (146-pad solderable LGA pad) 23mm x 22mm x 2.5mm
(nominal)
Complete body shielding  RF connection pads (RF main interface)  Baseband signals connection
Electrical
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
RF
Triple-band, LTE 1900MHz (B2), 1700MHz (B4), 700 MHz (B12) with MFBI
SIM interface
Dual SIM Single Standby (DSSS)  1.8V/3V support  SIM extraction / hot plug detection  SIM/USIM support  Conforms with ETSI UICC Specifications.  Supports SIM application tool kit with proactive SIM commands
Application interface
NDIS NIC interface support (Windows 7, Windows 8, Linux)  MBIM support  Multiple non-multiplexed USB channel support  Dial-up networking  USB selective suspend to maximize power savings  CMUX multiplexing over UART  AT command interface – 3GPP 27.007 standard, plus proprietary extended
AT commands
Protocol Stack
Single mode LTE operation:
LTE FDD, bandwidth 1.4-20 MHz  System Release: 3GPP Rel. 9  Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)  Max modulation 64 QAM DL, 16 QAM UL  Intra-frequency and inter-frequency mobility SON ANR  Public Warning System PWS
SMS
SMS over SGs  SMS MO and MT  SMS saving to SIM card or ME storage  SMS reading from SIM card or ME storage  SMS sorting  SMS concatenation  SMS Status Report  SMS replacement support  SMS storing rules (support of AT+CNMI, AT+CNMA)
Voice over LTE
Basic VoLTE call (MO / MT)  Dialing & DTMF  Basic Supplementary Services

1.3. General Features

The table below summarizes the AirPrime HL7648 features.
Table 2. AirPrime HL7648 Features
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Product Technical Specification
Introduction
Featu re
Descr iption
Connectivity
Multiple (up to 20) cellular packet data profiles  Sleep mode for minimum idle power draw  Mobile-originated PDP context activation / deactivation  Support QoS profile
Release 97 Precedence Class, Reliability Class, Delay Class, Peak
Throughput, Mean Throughput
Release 99 QoS negotiation Background, Interactive, and Streaming
Static and Dynamic IP address. The network may assign a fixed IP address
or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).
Supports PAP and CHAP authentication protocols  PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context  RFC1144 TCP/IP header compression
Environmental
Operating temperature ranges (industrial grade):
Class A: -30°C to +70°C Class B: -40°C to +85°C
RTC
Real Time Clock (RTC) with calendar
LGA-146
LGA-146
VBATT
GND
VGPIO
BAT_RTC
GPIO x 12
8-pin UART
5-pin Debug
JTAG
26M_CLK
32K_CLK
SIM 1
RESET_IN_N
POWER_ON_N
USB
ADC x 2
PCM
TX_ON
Stack Up MCP
(1G/512)
MCU DSP
PMU RF
Analog Baseband
Peripherals
PA
PA
PA
Dup B2
Dup B4
Dup B12
ASM
ASM
Filter
Filter
Filter
Baseband
32.768 KHz 26 MHz
RF MAIN
RF DIV

1.4. Architecture

The figure below presents an overview of the AirPrime HL7648 internal architecture and external interfaces.
Figure 1. AirPrime HL7648 Architecture Overview
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Product Technical Specification
Introduction

1.5. Interfaces

The AirPrime HL7648 module provides the following interfaces and peripheral connectivity:
1x - VGPIO
1x - Backup Battery Interface
1x - 1.8V/3V SIM
1x - USB 2.0
12x - GPIOs (2 of which have multiplexes)
1x - 8-wire UART
1x - Active Low POWER ON
1x - Active Low RESET
2x - ADC
2x - System Clock Out
1x - Digital Audio (PCM)
1x - Debug Interface
1x - JTAG Interface
1x - Main Antenna
1x - RX Diversity
1x - TX Burst Indicator

1.6. Connection Interface

The AirPrime HL7648 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.
Figure 2. AirPrime HL7648 Mechanical Overview (Top View and Bottom View)
The 146 pads have the following distribution:
66 inner signal pads, 1x0.5mm, pitch 0.8mm
1 reserved test point (do not connect), 1.0mm diameter
7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
4 inner corner ground pads, 1x1mm
4 outer corner ground pads, 1x0.9mm
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Product Technical Specification
Introduction
Categ ory
Conne ctio n
Speci fica tion
Operational
RF ports
IEC-61000-4-2 Level (Electrostatic Discharge Immunity Test)
Non-operational
Host connector interface
Unless otherwise specified:
JESD22-A114 +/- 1kV Human Body Model JESD22-A115 +/- 200V Machine Model JESD22-C101C +/- 250V Charged Device Model
Signals SIM connector
Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user.
Other host signals
Condi tions
Range
Operating Class A
-30°C to +70°C
Operating Class B
-40°C to +85°C
Storage
-40°C to +85°C

1.7. ESD

Refer to the following table for ESD Specifications.
Table 3. ESD Specifications

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table below.
Table 4. AirPrime HL7648 Environmental Specifications
Class A is defined as the operating temperature ranges that the device:
Shall exhibit normal function during and after environmental exposure.
Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:
Shall remain fully functional during and after environmental exposure
Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
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Product Technical Specification
Introduction
Docum ent
Current Vers ion
Descr iption
NAPRD.03
V5.22 or later
North American Program Reference Document
FCC Part 27
NA
Federal Communications Commission
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner.

1.8.2. Regulatory

The AirPrime HL7648 is compliant with FCC regulations.
FCC compliance will be reflected on the AirPrime HL7648 label.
Table 5. Regulation Compliance

1.8.3. RoHS Directive Compliant

The AirPrime HL7648 module is compliant with RoHS Directive 2011/65/EU which sets limits for the
use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

1.9. References

[1] AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
[2] AirPrime HL76xx AT Commands Interface Guide
Reference Number: 4118395
[3] AirPrime HL Series Development Kit User Guide
Reference Number: 4114877
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