Sierra Wireless HL7618RD Users manual

4119874

2.0

September 21, 2016

AirPrime HL7618RD

Product Technical Specification

Product Technical Specification

Important Notice

Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door

is open. Sierra Wireless modems may be used at this time.

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.

Limitations of Liability

This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.

The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.

4119874 Rev 2.0 September 21, 2016 2

Product Technical Specification

Sales information and technical support,
including warranty and returns

Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795
6:00 am to 6:00 pm PST

Corporate and product information

Web: sierrawireless.com

Patents

This product may contain technology developed by or for Sierra Wireless Inc.

This product includes technology licensed from QUALCOMM®.

This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from InterDigital Group and MMP Portfolio Licensing.

Copyright

© 2016 Sierra Wireless. All rights reserved.

Trademarks

Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.

Watcher® is a registered trademark of NETGEAR, Inc., used under license.

Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.

Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.

QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.

Other trademarks are the property of their respective owners.

Contact Information

4119874 Rev 2.0 September 21, 2016 3

Product Technical Specification

Versi on

Date

Updat es

1.0

September 05, 2016

Creation

2.0

September 21, 2016

Updated section 7 FCC Legal Information

Document History

4119874 Rev 2.0 September 21, 2016 4

Contents

INTRODUCTION ................................................................................................ 10

1.

1.1. Common Flexible Form Factor (CF3) .............................................................................. 10

1.2. Physical Dimensions ....................................................................................................... 10

1.3. General Features ............................................................................................................. 11

1.4. Architecture ..................................................................................................................... 12

1.5. Interfaces ......................................................................................................................... 13

1.6. Connection Interface ....................................................................................................... 13

1.7. ESD ................................................................................................................................. 14

1.8. Environmental and Certifications ..................................................................................... 14

1.8.1. Environmental Specifications ................................................................................... 14

1.8.2. Regulatory ................................................................................................................ 15

1.8.3. RoHS Directive Compliant ....................................................................................... 15

1.8.4. Disposing of the Product .......................................................................................... 15

1.9. References ...................................................................................................................... 15

2. PAD DEFINITION ............................................................................................... 16

2.1. Pad Configuration (Top View, Through Module) ............................................................. 20

3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 21

3.1. Power Supply .................................................................................................................. 21

3.2. Current Consumption (TBC) ............................................................................................ 21

3.3. VGPIO ............................................................................................................................. 22

3.4. BAT_RTC ........................................................................................................................ 22

3.5. SIM Interface ................................................................................................................... 23

3.5.1. UIM1_DET................................................................................................................ 23

3.6. USB ................................................................................................................................. 24

3.7. Electrical Information for Digital I/O ................................................................................. 24

3.8. General Purpose Input/Output (GPIO) ............................................................................ 25

3.9. Main Serial Link (UART1) ................................................................................................ 25

3.10. POWER ON Signal (PWR_ON_N) .................................................................................. 26

3.11. Reset Signal (RESET_IN_N) .......................................................................................... 27

3.12. Analog to Digital Converter (ADC) .................................................................................. 27

3.13. Clock Interface ................................................................................................................. 28

3.14. Digital Audio (PCM) (TBC) .............................................................................................. 28

3.15. Debug Interfaces ............................................................................................................. 30

3.15.1. Trace Debug ............................................................................................................ 30

3.15.2. JTAG ........................................................................................................................ 30

3.16. RF Interface ..................................................................................................................... 31

3.16.1. RF Connection ......................................................................................................... 31

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Product Technical Specification

3.16.2. RF Performances ..................................................................................................... 31

3.16.3. TX_ON Indicator (TX_ON) ....................................................................................... 32

4. MECHANICAL DRAWINGS ............................................................................... 33

5. DESIGN GUIDELINES ....................................................................................... 36

5.1. Power-Up Sequence ....................................................................................................... 36

5.2. Module Switch-Off ........................................................................................................... 36

5.3. Emergency Power OFF ................................................................................................... 37

5.4. Sleep Mode Management ............................................................................................... 37

5.4.1. Using UART1 ........................................................................................................... 37

5.4.2. Using USB ................................................................................................................ 37

5.5. Power Supply Design ...................................................................................................... 37

5.6. ESD Guidelines for SIM Card .......................................................................................... 38

5.7. ESD Guidelines for USB.................................................................................................. 39

6. RELIABILITY SPECIFICATION ......................................................................... 40

6.1. Reliability Compliance ..................................................................................................... 40

6.2. Reliability Prediction Model ............................................................................................. 40

6.2.1. Life Stress Test ........................................................................................................ 40

6.2.2. Environmental Resistance Stress Tests .................................................................. 41

6.2.3. Corrosive Resistance Stress Tests .......................................................................... 41

6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 42

6.2.5. Mechanical Resistance Stress Tests ....................................................................... 43

6.2.6. Handling Resistance Stress Tests ........................................................................... 44

7. FCC LEGAL INFORMATION ............................................................................. 45

8. ORDERING INFORMATION .............................................................................. 47

9. TERMS AND ABBREVIATIONS ........................................................................ 48

4119874 Rev 2.0 September 21, 2016 6

List of Figures

Figure 1.

Figure 2. Mechanical Overview (Top View and Bottom View) ....................................................... 13

Figure 3. Pad Configuration ............................................................................................................ 20

Figure 4. PCM Timing Waveform ................................................................................................... 29

Figure 5. TX_ON State During Transmission ................................................................................. 32

Figure 6. Mechanical Drawing ........................................................................................................ 33

Figure 7. Dimensions Drawing ....................................................................................................... 34

Figure 8. Footprint .......................................................................................................................... 35

Figure 9. PWR_ON_N Sequence with VGPIO Information ............................................................ 36

Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 36

Figure 11. Voltage Limiter Example ................................................................................................. 38

Figure 12. EMC and ESD Components Close to the SIM ................................................................ 38

Figure 13. ESD Protection for USB .................................................................................................. 39

Architecture Overview ..................................................................................................... 12

4119874 Rev 2.0 September 21, 2016 7

List of Tables

Table 1.

Table 2. General Features ............................................................................................................ 11

Table 3. ESD Specifications .......................................................................................................... 14

Table 4. Environmental Specifications .......................................................................................... 14

Table 5. Regulation Compliance ................................................................................................... 15

Table 6. Pad Definition .................................................................................................................. 16

Table 7. Power Supply .................................................................................................................. 21

Table 8. Current Consumption ...................................................................................................... 21

Table 9. Current Consumption per Power Supply ......................................................................... 22

Table 10. VGPIO Electrical Characteristics ..................................................................................... 22

Table 11. BAT_RTC Electrical Characteristics................................................................................ 22

Table 12. UIM1 Pad Description ..................................................................................................... 23

Table 13. Electrical Characteristics of UIM1 ................................................................................... 23

Table 14. USB Pad Description ....................................................................................................... 24

Table 15. Digital I/O Electrical Characteristics ................................................................................ 24

Table 16. GPIO Pad Description ..................................................................................................... 25

Table 17. UART1 Pad Description .................................................................................................. 26

Supported Bands/Connectivity ........................................................................................ 10

Table 18. PWR_ON_N Electrical Characteristics ........................................................................... 26

Table 19. RESET_IN_N Electrical Characteristics .......................................................................... 27

Table 20. ADC Interface Pad Description ....................................................................................... 27

Table 21. ADC Electrical Characteristics ........................................................................................ 27

Table 22. Clock Interface Pad Description ...................................................................................... 28

Table 23. PCM Interface Pad Description ....................................................................................... 28

Table 24. PCM Electrical Characteristics ........................................................................................ 29

Table 25. Trace Debug Pad Description ......................................................................................... 30

Table 26. JTAG Pad Description ..................................................................................................... 30

Table 27. RF Main Connection ........................................................................................................ 31

Table 28. RF Diversity Connection .................................................................................................. 31

Table 29. Conducted RX Sensitivity (dBm) ..................................................................................... 31

Table 30. TX_ON Indicator Pad Description ................................................................................... 32

Table 31. TX_ON Characteristics .................................................................................................... 32

Table 32. Standards Conformity ...................................................................................................... 40

Table 33. Life Stress Test................................................................................................................ 40

Table 34. Environmental Resistance Stress Tests ......................................................................... 41

Table 35. Corrosive Resistance Stress Tests ................................................................................. 41

Table 36. Thermal Resistance Cycle Stress Tests ......................................................................... 42

Table 37. Mechanical Resistance Stress Tests .............................................................................. 43

4119874 Rev 2.0 September 21, 2016 8

Product Technical Specification

Table 38. Handling Resistance Stress Tests .................................................................................. 44

Table 39. Ordering Information ....................................................................................................... 47

4119874 Rev 2.0 September 21, 2016 9

1. Introduction

RF Band

Trans mit band (Tx)

Recei ve band (Rx )

Maximum Outpu t Power

LTE B4

1710 to 1755 MHz

2110 to 2155 MHz

23dBm ± 2dBm

LTE B13

777 to 787 MHz

746 to 756 MHz

23dBm ± 2dBm

This document is the Product Technical Specification for the AirPrime HL7618RD Embedded Module.
It defines the high level product features and illustrates the interfaces for these features. This
document is intended to cover the hardware aspects of the product, including electrical and
mechanical.

The AirPrime HL7618RD belongs to the AirPrime HL Series from Essential Connectivity Module
family. These are industrial grade Embedded Wireless Modules that provides LTE Category 1 data
connectivity on LTE networks (as listed in Table 1 Supported Bands/Connectivity).

The HL7618RD supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide
customers with the highest level of flexibility in implementing high-end solutions.

Table 1. Supported Bands/Connectivity

1.1. Common Flexible Form Factor (CF3)

The AirPrime HL7618RD belongs to the Common Flexible Form Factor (CF3) family of modules. This
family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF
solution to a series of problems faced commonly in the WWAN module space as it:

 Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings

 Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions

 Offers electrical and functional compatibility

 Provides Direct Mount as well as Socketability depending on customer needs

3

form factor provides a unique

1.2. Physical Dimensions

AirPrime HL7618RD modules are compact, robust, fully shielded modules with the following
dimensions:

 Length: 23 mm

 Width: 22 mm

 Thickness: 2.5 mm

 Weight: 3.5 g

Note: Dimensions specified above are typical values.

4119874 Rev 2.0 September 21, 2016 10

Product Technical Specification

Introduction

Featu re

Descr iption

Physical

 Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x

2.5mm (nominal)

 Complete body shielding
 RF connection pads (RF main interface)
 Baseband signals connection

Electrical

Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V

RF

Dual-band LTE (AWS (B4), 700 MHz (B13))

SIM interface

 Dual SIM Single Standby (DSSS)
 1.8V/3V support
 SIM extraction / hot plug detection
 SIM/USIM support
 Conforms with ETSI UICC Specifications.
 Supports SIM application tool kit with proactive SIM commands

Application interface

 NDIS NIC interface support (Windows 7, Windows 8, Linux)
 MBIM support
 Multiple non-multiplexed USB channel support
 Dial-up networking
 USB selective suspend to maximize power savings
 CMUX multiplexing over UART
 AT command interface – 3GPP 27.007 standard, plus proprietary

extended AT commands

Protocol Stack

Single mode LTE operation:

 LTE FDD, bandwidth 1.4-20 MHz
 System Release: 3GPP Rel. 9
 Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)
 Max modulation 64 QAM DL, 16 QAM UL
 Intra-frequency and inter-frequency mobility
 SON ANR
 Public Warning System PWS

SMS

 SMS over SGs and IMS
 SMS MO and MT
 SMS saving to SIM card or ME storage
 SMS reading from SIM card or ME storage
 SMS sorting
 SMS concatenation
 SMS Status Report
 SMS replacement support
 SMS storing rules (support of AT+CNMI, AT+CNMA)

Voice over LTE

 Basic VoLTE call (MO / MT)
 Dialing and DTMF
 Basic Supplementary Services

1.3. General Features

The table below summarizes the AirPrime HL7618RD features.

Table 2. General Features

4119874 Rev 2.0 September 21, 2016 11

Product Technical Specification

Introduction

Featu re

Descr iption

Connectivity

 Multiple (up to 20) cellular packet data profiles
 Sleep mode for minimum idle power draw
 Mobile-originated PDP context activation / deactivation
 Support QoS profile

 Release 97 – Precedence Class, Reliability Class, Delay Class,

Peak Throughput, Mean Throughput

 Release 99 QoS negotiation – Background, Interactive, and

Streaming

 Static and Dynamic IP address. The network may assign a fixed IP

address or dynamically assign one using DHCP (Dynamic Host
Configuration Protocol).

 Supports PAP and CHAP authentication protocols
 PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
 RFC1144 TCP/IP header compression

Environmental

Operating temperature ranges (industrial grade):

 Class A: -30°C to +70°C

 Class B: -40°C to +85°C

RTC

Real Time Clock (RTC) with calendar

LGA-146

LGA-146

VBATT

GND

VGPIO

BAT_RTC

GPIO x 12

8-pin UART

5-pin Debug

JTAG

26M_CLK

32K_CLK

SIM 1

RESET_IN_N

POWER_ON_N

USB

ADC x 2

PCM

TX_ON

Memory

(Flash + RAM)

MCU DSP

PMU RF

Analog Baseband

Peripherals

PA

PA

Dup B4

Dup
B13

Diplexer

Diplexer

Filter

(B4)

Filter
(B13)

Baseband

32.768 KHz 26 MHz

RF MAIN

RF DIV

AirPrime HL7618RD

1.4. Architecture

The figure below presents an overview of the AirPrime HL7618RD internal architecture and external
interfaces.

Figure 1. Architecture Overview

4119874 Rev 2.0 September 21, 2016 12

Product Technical Specification

Introduction

1.5. Interfaces

The AirPrime HL7618RD module provides the following interfaces and peripheral connectivity:

 1x - 8-wire UART

 1x - Active Low RESET

 1x - USB 2.0

 1x - Backup Battery Interface

 2x - System Clock Out

 1x - Active Low POWER ON

 1x - 1.8V/3V SIM

 1x - JTAG Interface

 12x - GPIOs (2 of which have multiplexes)

 1x - Main Antenna

 1x - RX Diversity

 1x - VGPIO

 1x - TX ON

 2x - ADC

 1x - Debug Interface

1.6. Connection Interface

The AirPrime HL7618RD module is an LGA form factor device. All electrical and mechanical
connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview (Top View and Bottom View)

The 146 pads have the following distribution:

 66 inner signal pads, 1x0.5mm, pitch 0.8mm

 1 reserved test point (do not connect), 1.0mm diameter

 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

 4 inner corner ground pads, 1x1mm

 4 outer corner ground pads, 1x0.9mm

4119874 Rev 2.0 September 21, 2016 13

Product Technical Specification

Introduction

Categ ory

Conne ctio n

Speci fica tion

Operational

RF ports

IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)

Non-operational

Host connector
interface

Unless otherwise specified:

 JESD22-A114 +/- 1kV Human Body Model
 JESD22-A115 +/- 200V Machine Model
 JESD22-C101C +/- 250V Charged Device Model

Signals
SIM connector

Adding ESD protection is highly recommended at the point where
the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.

Other host signals

Condi tions

Range

Operating Class A

-30°C to +70°C

Operating Class B

-40°C to +85°C

Storage

-40°C to +85°C

1.7. ESD

Refer to the following table for ESD Specifications.

Table 3. ESD Specifications

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table
below.

Table 4. Environmental Specifications

Class A is defined as the operating temperature ranges that the device:

 Shall exhibit normal function during and after environmental exposure.

 Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

 Shall remain fully functional during and after environmental exposure

 Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even

when one or more environmental constraint exceeds the specified tolerance.

 Unless otherwise stated, full performance should return to normal after the excessive

constraint(s) have been removed.

4119874 Rev 2.0 September 21, 2016 14

Product Technical Specification

Introduction

Docum ent

Current Vers ion

Title

GCF-CC

v3.59.0 or later

GCF Conformance Certification Criteria

FCC Part 27

NA

Miscellaneous wireless communication services

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.

1.8.2. Regulatory

The AirPrime HL7618RD is compliant with FCC regulations.

FCC compliance will be reflected on the AirPrime HL7618RD label.

Table 5. Regulation Compliance

1.8.3. RoHS Directive Compliant

The AirPrime HL7618RD module is compliant with RoHS Directive 2011/65/EU which sets limits for
the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.

1.8.4. Disposing of the Product

1.9. References

[1] AirPrime HL Series Customer Process Guidelines

Reference Number: 4114330

[2] AirPrime HL7618, HL7690 and HL7692 AT Commands Interface Guide

Reference Number: 4118395

[3] AirPrime HL Series Development Kit User Guide

Reference Number: 4114877

4119874 Rev 2.0 September 21, 2016 15