Siemens ME75 Service Manual

Release 1.0

Service Repair Documentation

Level 3 (Basic) – ME75

Release	Date	Department	Notes to change
R 1.0	13.10.2005	BenQ Mobile CC S CES	New document

Technical Documentation	10/2005
TD_Repair_L2.5L_ME75_R1.0.pdf	Page 1 of 13
	Company Confidential
	2005©BenQ

Release 1.0

Table of Content

1	Introduction ...............................................................................................................................		3
1.1		PURPOSE ...............................................................................................................................	3
1.2		SCOPE ...................................................................................................................................	3
1.3		TERMS AND ABBREVIATIONS ...................................................................................................	3
2	List of available level 2.5light parts .........................................................................................		4
3	Hardware requirements ............................................................................................................		4
4	ME75 Board layout ....................................................................................................................		5
5	SIM Card Problems ...................................................................................................................		6
6	IO Connector Problems ............................................................................................................		7
7	B to B connector Problems ......................................................................................................		8
8	Battery connector Problems ....................................................................................................		9
9	Camera Connector Problems.................................................................................................		10
10	Main keypad illumination Problems ......................................................................................		13

Technical Documentation	10/2005
TD_Repair_L2.5L_ME75_R1.0.pdf	Page 2 of 13
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1Introduction

1.1Purpose

This Service Repair Documentation is intended to support Service partners to carry out repairs on BenQ repair level 3. The described failures shall only be repaired in BenQ authorized local workshops.

The level 3 (former Level 2.5light) partners are obliged to repair level 3 classified boards, up to their repair level, under consideration of this repair instruction.

All repairs have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered.

Assembling/disassembling has to be done according to the latest ME75 Level 1-2 repair documentation. It has to be ensured that every repaired mobile Phone is checked according to the latest released General Test Instruction document (both documents are available in the Technical Support section of the C-market).

Check at least weekly C-market for updates and consider all ME75 related Customer Care Information

ME75 Partnumber on IMEI label: S30880-S6980-#xxx

, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....

Scrap Handling: All Scrap information given in this manual are related to the SCRAP-Rules and instructions.

Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication market), avoid excessive heat.

1.2 Scope

This document is the reference document for all BenQ mobile authorised Service Partners which are released to repair BenQ mobile phones up to level 2.5 light.

1.3 Terms and Abbreviations

Technical Documentation	10/2005
TD_Repair_L2.5L_ME75_R1.0.pdf	Page 3 of 13
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2 List of available level 2.5light parts

(according to Component Matrix V1.09 - check C-market for updates)

Product	ID	Order Number	Description CM
ME75	S2931	L36315-Z77-C218	JOYSTICK
ME75	V2650	L36197-F5008-F492	IRDA 115.2 KBIT
ME75	X1400	L36334-Z97-C336	CONNECTOR BATTERY 3-POL R65
ME75	X1504	L36334-Z93-C303	IO-JACK SLIM 12-POL
ME75	X1604	L50634-Z97-C406	CONNECTOR SIM CARD READER R65 (B)
ME75	X2202	L36334-Z97-C205	CONNECTOR DISPLAY 10POL
ME75	X2705	L50634-Z97-C383	CONNECTOR BOARD TO BOARD 12-POL. X75
ME75	X3651	L50634-Z97-C379	CONNECTOR CAMERA-SOCKET
ME75	X3800	L36334-Z93-C297	CONNECTOR ANTENNA 6mm

3 Hardware requirements

(according to L2.5L-L2.5 General soldering information V1.3 - check C-market for updates)

Jigs, Tools and working materials for all described repairs: hot air blower

soldering gun tweezers flux

solder

ME75 dome sheet jig

Technical Documentation	10/2005
TD_Repair_L2.5L_ME75_R1.0.pdf	Page 4 of 13
	Company Confidential
	2005©BenQ