Siemens ME75 Service Manual

Release 1.0
Level 3 (Basic) – ME75
Release Date Department Notes to change
R 1.0 13.10.2005 BenQ Mobile CC S CES New document
Technical Documentation
TD_Repair_L2.5L_ME75_R1.0.pdf Page 1 of 13
Company Confidential
2005©BenQ
10/2005
Release 1.0
Table of Content
1 Introduction ...............................................................................................................................3
1.1 PURPOSE ...............................................................................................................................3
1.2 SCOPE ...................................................................................................................................3
1.3 TERMS AND ABBREVIATIONS ...................................................................................................3
2 List of available level 2.5light parts.........................................................................................4
3 Hardware requirements ............................................................................................................4
4 ME75 Board layout....................................................................................................................5
5 SIM Card Problems ...................................................................................................................6
6 IO Connector Problems ............................................................................................................7
7 B to B connector Problems......................................................................................................8
8 Battery connector Problems ....................................................................................................9
9 Camera Connector Problems.................................................................................................10
10 Main keypad illumination Problems ......................................................................................13
Technical Documentation
TD_Repair_L2.5L_ME75_R1.0.pdf Page 2 of 13
Company Confidential
2005©BenQ
10/2005
Release 1.0
1 Introduction
1.1 Purpose
This Service Repair Documentation is intended to support Service partners to carry out repairs on BenQ repair level 3. The described failures shall only be repaired in BenQ authorized local workshops.
The level 3 (former Level 2.5light) partners are obliged to repair level 3 classified boards, up to their repair level, under consideration of this repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest ME75 Level 1-2 repair documentation. It has to be ensured that every repaired mobile Phone is checked according to the latest released General Test Instruction document (both documents are available in the Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all ME75 related Customer Care Information
ME75 Partnumber on IMEI label: S30880-S6980-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication market), avoid excessive heat.
1.2 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are released to repair BenQ mobile phones up to level 2.5 light.
1.3 Terms and Abbreviations
Technical Documentation
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Company Confidential
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10/2005
Release 1.0
2 List of available level 2.5light parts
(according to Component Matrix V1.09 - check C-market for updates)
Product ID Order Number Description CM
ME75 S2931 L36315-Z77-C218 JOYSTICK ME75 V2650 L36197-F5008-F492 IRDA 115.2 KBIT ME75 X1400 L36334-Z97-C336 CONNECTOR BATTERY 3-POL R65 ME75 X1504 L36334-Z93-C303 IO-JACK SLIM 12-POL ME75 X1604 L50634-Z97-C406 CONNECTOR SIM CARD READER R65 (B) ME75 X2202 L36334-Z97-C205 CONNECTOR DISPLAY 10POL ME75 X2705 L50634-Z97-C383 CONNECTOR BOARD TO BOARD 12-POL. X75 ME75 X3651 L50634-Z97-C379 CONNECTOR CAMERA-SOCKET ME75 X3800 L36334-Z93-C297 CONNECTOR ANTENNA 6mm
3 Hardware requirements
(according to L2.5L-L2.5 General soldering information V1.3 - check C-market for updates)
Jigs, Tools and working materials for all described repairs:
hot air blower soldering gun tweezers flux solder ME75 dome sheet jig
Technical Documentation
10/2005
TD_Repair_L2.5L_ME75_R1.0.pdf Page 4 of 13
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2005©BenQ
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