Siemens HYB5116160BSJ-50, HYB5116160BSJ-60, HYB5116160BSJ-70 Datasheet

1M x 16-Bit Dynamic RAM (4k-Refresh)

Advanced Information

1 048 576 words by 16-bit organization

•

0 to 70 °C operating temperature

•

Performance:

•

HYB5116160BSJ-50/-60/-70

-50 -60 -70

t

RAC

t

CAC

t

AA

t

RC

t

PC

Single + 5 V (± 10 %) supply

•

Low power dissipation

•

RAS

access time 50 60 70 ns access time 13 15 20 ns

CAS Access time from address 25 30 35 ns Read/Write cycle time 90 110 130 ns Fast page mode cycle time 35 40 45 ns

max. 550 active mW (-50 version) max. 495 active mW (-60 version) max. 440 active mW (-70 version) 11 mW standby (TTL)

5.5. mW standby (MOS) Output unlatched at cycle end allows two-dimensional chip selection

•

Read, write, read-modify-write, CAS-before-RAS refresh, RAS-only refresh, hidden refresh

•

and self refresh Fast page mode capability

•

2 CAS / 1 WE

•

All inputs, outputs and clocks fully TTL-compatible

•

4096 refresh cycles/64 ms

•

Plastic Package: P-SOJ-42-1 400 mil

•

Semiconductor Group 1 1.96

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

The HYB 5116160BSJ is a 16 MBit dynamic RAM organized as 1 048 576 words by 16 bits. The HYB 5116160BSJ utilizes a submicron CMOS silicon gate process technology, as wel l as advanced circuit techniques to provide wide operating margins, both internally and for the system user. Multiplexed address inputs permit the HYB 5116160BSJ to be packaged in a standard SOJ 42 400 mil plastic package. These packages provide hi gh system bit densities and are compatible with commonly used automatic testing a nd insertion equipment. System-oriented feature s include single + 5 V (± 10 %) power supply, direct interfacing with high-perfo rmance logic devi ce families such as Schottky TTL.

Ordering Information Type Ordering Code Package Descriptions

HYB 5116160BSJ-50 on request P-SOJ-42-1 400 mil DRAM (access time 50 ns) HYB 5116160BSJ-60 on request P-SOJ-42-1 400 mil DRAM (access time 60 ns) HYB 5116160BSJ-70 on request P-SOJ-42-1 400 mil DRAM (access time 70 ns)

Pin Names

A0 to A11 Row Address Inputs A0 to A7 Column Addess Inputs RAS OE

Row Address Strobe

Output Enable I/O1-I/O16 Data Input/Output UCAS LCAS WE

V

CC

V

SS

Upper Column Address Strobe

Lower Column Address Strobe

Read/Write Input

Power Supply (+ 5 V)

Ground (0 V) N.C. not connected

Semiconductor Group 2

P-SOJ-42 (400 mil)

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

Pin Configuration

Vcc I/O1 I/O2 I/O3 I/O4 Vcc I/O5 I/O6 I/O7 I/O8 N.C. N.C. WE RAS A11 A10 A0 A1 A2 A3 Vcc

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22

Vss I/O16 I/O15 I/O14 I/O13 Vss I/O12 I/O11 I/O10 I/O9 N.C. LCAS UCAS OE A9 A8 A7 A6 A5 A4 Vss

Truth Table RAS

H

L

LCAS UCAS WE OE I/O1-I/O8 I/O9-I/O16 Operation

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

High-Z

Dout

High-Z

Dout

Din

Don't care

Din

High-Z

Dout

Don't care

Din

High-Z

Standby

Refresh

Lower byte read

Upper byte read

Word read

Lower byte write

Upper byte write

Word write

NOP

Semiconductor Group 3

WE

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

I

I/O1I/O2

/O16

UCAS LCAS

A0

A1

A2 A3 A4 A5 A6 A7 A8 A9

A10 A11

.

&

.

No. 2 Clock

Generator

Column

8

12 12

Address

Buffer(8)

Refresh

Controller

Refresh

Counter (12)

Row

Address

Buffers(12)

12

Data in Buffer

Row

Decoder

16

8

4096

Data out

Buffer

16

Column

Decoder

Sense Amplifier

I/O Gating

256

x16

Memory Array

4096x256x16

OE

16

No. 1 Clock

RAS

Block Diagram

Semiconductor Group 4

Generator

Voltage Down

Generator

VCC VCC (internal)

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

Absolute Maximum Ratings

Operating temperature range ............................................................................................0 to 70 °C

Storage temperature range.........................................................................................– 55 to 150 °C

Input/output voltage................................................................................-0.5 to min (Vcc+0.5,7.0) V

Power supply voltage...................................................................................................-1.0V to 7.0 V

Power dissipation.....................................................................................................................1.0 W

Data out current (short circuit)................................................................................................ 50 mA

Note:

Stresses above those listed under “Absolute Maximum Ratings” may cause perm anent dama ge of the device. Exposure to absolute maximu m rating conditions for extended perio ds may affect device reliability.

DC Characteristics

= 0 to 70 °C,

T

A

V

SS

= 0 V,

= 5 V ± 10 %, tT = 5 ns

V

CC

Parameter Symbol Limit Values Unit Test

mA mA mA

Condition

1)

2) 3) 4)

Input high voltage Input low voltage

= – 5 mA)

Output high voltage ( Output low voltage (

I

OUT

= 4.2 mA)

I

OUT

Input leakage current,any input (0 V ≤

≤ Vcc + 0.3V, all other pins = 0 V)

V

IH

Output leakage current (DO is disabled, 0 V ≤

Average

supply current:

V

CC

≤ Vcc + 0.3V)

V

OUT

-50 ns version

-60 ns version

-70 ns version

V V V V I

I

IH

IL

OH

OL

I(L)

O(L)

CC1

min. max.

2.4 Vcc+0.5 V – 0.5 0.8 V

2.4 – V –0.4V – 10 10 µA

– 10 10 µA

– – –

100 90 80

(RAS

, CAS, address cycling, tRC = tRC

supply current (RAS =CAS=

Standby

Average

V

CC

supply current, during RAS-only

V

CC

min.

)

V

IH

refresh cycles: -50 ns version

-60 ns version

-70 ns version

(RAS

cycling: CAS =

, tRC = tRC min.)

V

IH

Semiconductor Group 5

I I

CC2

CC3

–2mA–

– – –

100 90 80

mA mA mA

2) 4)

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

DC Characteristics

= 0 to 70 °C,

T

A

V

SS

(cont’d)

= 0 V,

= 5 V ± 10 %, tT = 5 ns

V

CC

Parameter Symbol Limit Values Unit Test

mA mA mA

Condition

2) 3) 4)

1)

2) 4)

supply current,

Average

V

CC

during fast page mode: -50 ns version

-60 ns version

-70 ns version

(RAS

=

, CAS, address cycling, tPC = t

V

Standby

(RAS

= CAS =

Average

IL

supply current

V

CC

– 0.2 V)

V

CC

supply current, during CAS-

V

CC

PC

before-RAS refresh mode: -50 ns version

-60 ns version

-70 ns version

(RAS

, CAS cycling, tRC = t

RC

min.)

Average Self Refresh Current

min.

min. max.

I

CC4

– – –

40 35 30

)

I

CC5

CC6

CC7

–1mA

– – –

100 90 80

_1mA

(CBR cycle with tRAS>TRASSmin., CAS held low, WE

=Vcc-0.2V, Address and Din=Vcc-0.2V or 0.2V)

Capacitance

= 0 to 70 °C,

T

A

= 5 V ± 10 %, f = 1 MHz

V

CC

Parameter Symbol Limit Values Unit

min. max.

Input capacitance (A0 to A11) Input capacitance (RAS

, UCAS, LCAS, WE, OE)

I/O capacitance (I/O1-I/O16)

C

I1

C

I2

C

IO

–5pF –7pF –7pF

Semiconductor Group 6

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

AC Characteristics

= 0 to 70 °C,

T

A

5)6)

= 5 V ± 10 %, tT = 5 ns

V

CC

Parameter

common parameters

Random read or write cycle time t RAS

precharge time t pulse width t

RAS CAS

pulse width t Row address setup time t Row address hold time t Column address setup time t Column address hold time t

to CAS delay time t

RAS RAS

to column address delay time

Symbol

RC

RP

RAS

CAS

ASR

RAH

ASC

CAH

RCD

t

RAD

Limit Values

Unit Note

-50 -60 -70

min. max. min. max. min. max.

90 – 110 – 130 – ns 30 – 40 – 50 – ns 50 10k 60 10k 70 10k ns 13 10k 15 10k 20 10k ns 0–0–0–ns 8–10–10–ns 0–0–0–ns 10 – 15 – 15 – ns 18 37 20 45 20 50 13 25 15 30 15 35 ns

16F

hold time t

RAS CAS

hold time t

to RAS precharge time t

CAS Transition time (rise and fall) t Refresh period t

Read Cycle

Access time from RAS Access time from CAS Access time from column address t

access time t

OE Column address to RAS

lead time t Read command setup time t Read command hold time t Read command hold time

referenced to RAS CAS

to output in low-Z t

Output buffer turn-off delay t

t t

t

RSH

CSH

CRP

T

REF

RAC

CAC

AA

OEA

RAL

RCS

RCH

RRH

CLZ

OFF

13 15 – 20 – ns 50 60 – 70 – ns 5–5–5–ns 350350350ns7 –64–64–64ms

–50–60–70ns8, 9 –13–15–20ns8, 9 –25–30–35ns8,10 –13–15–20ns 25 – 30 – 35 – ns 0–0–0–ns 0–0–0–ns11 0–0–0–ns11

0–0–0–ns8 013015020ns12

Semiconductor Group 7

HYB 5116160BSJ-50/-60/-70

1M x 16-DRAM

AC Characteristics

= 0 to 70 °C,

T

A

V

CC

(cont’d)

= 5 V ± 10 %, tT = 5 ns

5)6)

Parameter

Output buffer turn-off delay from OE

Data to OE

high to data delay t

CAS OE

high to data delay t

low delay t

Write Cycle

Write command hold time t Write command pulse width t Write command setup time t Write command to RAS Write command to CAS

lead time t

lead time t Data setup time t Data hold time t Data to CAS

low delay t

Symbol

t

OEZ

DZO

CDD

ODD

WCH

WP

WCS

RWL

CWL

DS

DH

DZC

16F

Limit Values

Unit Note

-50 -60 -70

min. max. min. max. min. max.

013015020ns12

0–0–0–ns13 13 – 15 – 20 – ns 14 13 – 15 – 20 – ns 14

8–10–10–ns 8–10–10–ns 0–0–0–ns15 13 – 15 – 20 – ns 13 – 15 – 20 – ns 0–0–0–ns16 10 – 10 – 15 – ns 16 0–0–0–ns13

Read-Modify-Write Cycle

Read-write cycle time t

to WE delay time t

RAS CAS

to WE delay time t Column address to WE OE

command hold time t

delay time t

RWC

RWD

CWD

AWD

OEH

126 – 150 – 180 – ns 68 – 80 – 95 – ns 15 31 – 35 – 45 – ns 15 43 – 50 – 60 – ns 15 13 – 15 – 20 – ns

Fast Page Mode Cycle

Fast page mode cycle time t CAS

precharge time t Access time from CAS RAS

pulse width t

precharge to RAS Delay t

CAS

precharge t

PC

CP

CPA

RAS

RHPC

35 – 40 – 45 – ns 10 – 10 – 10 – ns –30–35–40ns7 50 200k 60 200k 70 200k ns 30 – 35 – 40 – ns

Semiconductor Group 8