Siemens HMI devices Operating Instructions

Basic Panels 2nd Generation

___________________

SIMATIC HMI

HMI devices Basic Panels 2nd Generation

Operating Instructions

03/2014

Preface

Overview

Safety instructions

Mounting and connecting

Operating the device

Configuring the device

Commissioning a project

Maintenance and care

Technical specifications

Technical Support

Abbreviations

A5E33293231-AA

Legal information

Warning notice system

DANGER

will

WARNING

may

CAUTION

NOTICE

Qualified Personnel

personnel qualified

Proper use of Siemens products

WARNING

Trademarks

Disclaimer of Liability

This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are graded according to the degree of danger.

indicates that death or severe personal injury

indicates that minor personal injury can result if proper precautions are not taken.

indicates that property damage can result if proper precautions are not taken.

If more than one degree of danger is present, the warning notice representing the highest degree of danger will be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property damage.

The product/system described in this documentation may be operated only by task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified personnel are those who, based on their training and experience, are capable of identifying risks and avoiding potential hazards when working with these products/systems.

result if proper precautions are not taken.

for the specific

Note the following:

Siemens products may only be used for the applications described in the catalog and in the relevant technical documentation. If products and components from other manufacturers are used, these must be recommended or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and maintenance are required to ensure that the products operate safely and without any problems. The permissible ambient conditions must be complied with. The information in the relevant documentation must be observed.

All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.

We have reviewed the contents of this publication to ensure consistency with the hardware and software described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in this publication is reviewed regularly and any necessary corrections are included in subsequent editions.

Siemens AG

Industry Sector Postfach 48 48 90026 NÜRNBERG GERMANY

A5E33293231-AA Ⓟ 03/2014 Subject to change

Preface

Purpose of the operating instructions

Target group

Chapter

All

Operators

Commissioning engineers

Service technicians Maintenance technicians

These operating instructions provide information based on the requirements defined by IEC 62079 for documentation. This information relates to the HMI device, its storage, transportation, place of use, installation, use and maintenance.

These operating instructions are intended for a variety of target groups. The following table shows the chapters of these operating instructions that are of particular importance for the respective target group.

"Safety instructions"

The operator operates and monitors the system during the process control phase.

The commissioning engineer integrates the HMI device into the system and ensures the operating capability of the HMI device for the process control phase.

Service technicians rectify faults that occur during the process control phase.

Maintenance technicians carry out servicing and maintenance work during the process control phase.

"Overview" "Operating the device"

All chapters. Depending on the use of the HMI device,

certain chapters may not be of relevance to the commissioning engineer, e.g. the section "Maintenance and servicing."

All chapters. Depending on the use of the HMI device,

certain chapters may not be of relevance to the service technicians, e.g. the section "Maintenance and servicing."

Maintenance and care

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

The information system of WinCC contains additional information. The information system is integrated as online help in WinCC and contains instructions, examples and reference information in electronic form.

Preface

Scope

Device designation SIMATIC HMI

Device type

Interface type

Can be configured with

Basic knowledge required

These operating instructions are valid for all versions of the SIMATIC HMI Basic Panels. The following naming conventions apply:

KTP400 Basic Touch device with KTP700 Basic PROFINET KTP700 Basic DP PROFIBUS KTP900 Basic PROFINET KTP1200 Basic PROFINET KTP1200 Basic DP PROFIBUS

Knowledge of automation technology and process communication is necessary to understand the operating instructions.

An understanding of the use of computers and operating systems is also required.

PROFINET WinCC (TIA Portal) as of V13

function keys

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Preface

Illustrations and text highlighting

Graphical highlighting

Description

Text highlighting

Scope

This manual contains figures of the described devices. The figures may deviate from the supplied device in certain details.

The following graphical highlighting facilitates reading these operating instructions:

If the instructions involve several tasks, the individual tasks are highlighted by a red number circle.

A light blue highlight indicates components and tools that are required in the course of a task.

KTP700 Basic is sometimes shown in the figures as a representation of all Basic Panels.

The following text highlighting facilitates reading these operating instructions:

"Add screen"

"File > Edit" Operational sequences, for example, menu commands, shortcut

<F1> Keyboard operation

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

• Terms that appear in the user interface, for example, dialog names, tabs, buttons, menu commands

• Input values, for example, limits, tag values

• Path information

menu commands

Preface

Note

Names of the software

Names of the hardware

Trademarks

Note information highlighted as follows:

A note contains important information on described products and their handling or on a section of this documentation.

Configuration and runtime software have different names as follows:

● "WinCC (TIA Portal) V13", for example, refers to the configuration software.

The term "WinCC" is used in a general context. The full name is always used when it is necessary to differentiate between different versions of the configuration software.

● "WinCC Runtime" refers to the runtime software that can run on HMI devices.

These operating instructions describe the new "Basic Panels 2nd Generation" which replaces the current Basic Panels. The term "Basic Panel" is used synonymously for a "Basic Panel 2nd Generation" in these instructions.

Names labeled with a ® symbol are registered trademarks of the Siemens AG. Other names used in this documentation may be trademarks, the use of which by third parties for their own purposes could violate the rights of the owner.

● HMI

● SIMATIC

● SIMATIC HMI

● WinCC

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Preface ................................................................................................................................................... 3

1 Overview............................................................................................................................................... 11

2 Safety instructions ................................................................................................................................. 17

3 Mounting and connecting ...................................................................................................................... 21

4 Operating the device ............................................................................................................................. 39

1.1 Product overview.......................................................................................................................... 11

1.2 Design of the PROFINET devices ............................................................................................... 12

1.3 Design of the PROFIBUS devices ............................................................................................... 13

1.4 Scope of delivery.......................................................................................................................... 14

1.5 Accessories .................................................................................................................................. 15

2.1 General safety instructions .......................................................................................................... 17

2.2 Notes about usage ....................................................................................................................... 19

3.1 Preparations ................................................................................................................................. 21

3.1.1 Checking the package contents ................................................................................................... 21

3.1.2 Checking the operating conditions ............................................................................................... 21

3.1.3 Selecting a mounting position ...................................................................................................... 21

3.1.4 Checking clearances .................................................................................................................... 23

3.1.5 Making the mounting cutout ......................................................................................................... 24

3.2 Mounting the HMI device ............................................................................................................. 25

3.3 Connecting the HMI device .......................................................................................................... 26

3.3.1 Connection sequence .................................................................................................................. 27

3.3.2 Connecting the equipotential bonding circuit ............................................................................... 27

3.3.3 Connecting the power supply ....................................................................................................... 29

3.3.4 Connecting a programming device .............................................................................................. 31

3.3.5 Connecting the configuration PC ................................................................................................. 31

3.3.6 Connecting the controller ............................................................................................................. 33

3.3.7 Connecting a USB device ............................................................................................................ 35

3.4 Switching on and testing the HMI device ..................................................................................... 36

3.5 Securing the cables ..................................................................................................................... 37

4.1 Overview ...................................................................................................................................... 39

4.2 General functions of the screen keyboard ................................................................................... 41

4.3 The screen keyboards ................................................................................................................. 42

4.4 Entering data ................................................................................................................................ 46

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Table of contents

5 Configuring the device .......................................................................................................................... 47

6 Commissioning a project ....................................................................................................................... 63

5.1 Opening the settings ................................................................................................................... 47

5.2 Overview ..................................................................................................................................... 48

5.3 Configuring the time server ......................................................................................................... 49

5.4 Enter time and date ..................................................................................................................... 50

5.5 Activating the acoustic signal ...................................................................................................... 51

5.6 Configuring Autostart or wait time ............................................................................................... 52

5.7 Changing the password settings ................................................................................................. 52

5.8 Displaying licensing information for the HMI device ................................................................... 55

5.9 Displaying information about the HMI device .............................................................................. 56

5.10 Changing the network configuration ........................................................................................... 57

5.11 Changing the MPI/DP settings .................................................................................................... 58

5.12 Enabling a data channel .............................................................................................................. 59

5.13 Calibrating the touch screen ....................................................................................................... 60

5.14 Changing the monitor settings .................................................................................................... 61

5.15 Setting the screen saver ............................................................................................................. 62

6.1 Overview ..................................................................................................................................... 63

6.2 Operating modes ......................................................................................................................... 64

6.3 Data transmission options ........................................................................................................... 65

6.4 Transfer ....................................................................................................................................... 65

6.4.1 Overview ..................................................................................................................................... 65

6.4.2 Starting the manual transfer ........................................................................................................ 65

6.4.3 Starting the transfer automatically .............................................................................................. 66

6.4.4 Testing a project .......................................................................................................................... 68

6.5 Backup and restore ..................................................................................................................... 69

6.5.1 Overview ..................................................................................................................................... 69

6.5.2 Backup and restore using ProSave ............................................................................................ 70

6.5.3 Backup and restore using WinCC ............................................................................................... 71

6.6 Updating the operating system - Basic Panel DP ....................................................................... 72

6.6.1 Overview ..................................................................................................................................... 72

6.6.2 Resetting the factory settings ...................................................................................................... 73

6.6.3 Updating the operating system using ProSave ........................................................................... 73

6.7 Updating the operating system - Basic Panel with PROFINET interface ................................... 74

6.7.1 Overview ..................................................................................................................................... 75

6.7.2 Resetting the factory settings ...................................................................................................... 75

6.7.3 Updating the operating system using ProSave ........................................................................... 76

6.7.4 Updating the operating system using WinCC ............................................................................. 77

6.7.5 Resetting to factory settings with ProSave ................................................................................. 78

6.7.6 Resetting to factory settings with WinCC .................................................................................... 80

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Table of contents

7 Maintenance and care ........................................................................................................................... 81

8 Technical specifications ........................................................................................................................ 83

A Technical Support ............................................................................................................................... 103

B Abbreviations ...................................................................................................................................... 105

Glossary ............................................................................................................................................. 107

Index................................................................................................................................................... 113

7.1 Maintenance and care ................................................................................................................. 81

7.2 Recycling ...................................................................................................................................... 82

8.1 Certificates and approvals ........................................................................................................... 83

8.2 Electromagnetic compatibility ...................................................................................................... 84

8.2.1 Emitted interference ..................................................................................................................... 84

8.2.2 Immunity to interferences ............................................................................................................. 84

8.3 Mechanical ambient conditions .................................................................................................... 84

8.3.1 Transport and storage conditions ................................................................................................ 84

8.3.2 Operating Conditions ................................................................................................................... 84

8.4 Climatic ambient conditions ......................................................................................................... 85

8.4.1 Transport and storage conditions ................................................................................................ 85

8.4.2 Operating Conditions ................................................................................................................... 85

8.4.3 Climate diagram ........................................................................................................................... 86

8.5 Protection classes ........................................................................................................................ 86

8.5.1 Insulation test ............................................................................................................................... 87

8.5.2 Protection against foreign objects and water ............................................................................... 87

8.6 Dimension drawings ..................................................................................................................... 88

8.6.1 Dimensional drawing of KTP400 Basic ........................................................................................ 88

8.6.2 Dimensional drawing of KTP700 Basic ........................................................................................ 88

8.6.3 Dimensional drawing of KTP700 Basic DP .................................................................................. 89

8.6.4 Dimensional drawing of KTP900 Basic ........................................................................................ 90

8.6.5 Dimension drawings of KTP1200 Basic ....................................................................................... 91

8.6.6 Dimensional drawing of KTP1200 Basic DP ................................................................................ 92

8.7 Technical specifications ............................................................................................................... 93

8.7.1 Power supply ................................................................................................................................ 94

8.7.2 KTP400 Basic, KTP700 Basic and KTP700 Basic DP ................................................................ 94

8.7.3 KTP900 Basic, KTP1200 Basic and KTP1200 Basic DP ............................................................ 95

8.8 Interface description ..................................................................................................................... 97

8.8.1 Power supply ................................................................................................................................ 98

8.8.2 PROFIBUS (Sub-D RS422/485) .................................................................................................. 98

8.8.3 PROFINET (Ethernet) .................................................................................................................. 98

8.8.4 USB .............................................................................................................................................. 99

8.9 Scope of functions with WinCC .................................................................................................. 100

A.1 Service and support ................................................................................................................... 103

A.2 System events............................................................................................................................ 103

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Table of contents

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1.1

Product overview

The beauty of simplicity

New, cost-efficient HMI generation meets the trend for high-quality visualization even in small machines and plants

Siemens meets the requirements of users for high-quality visualization and operation even in small and medium-size machines and plants with the second generation of SIMATIC HMI Basic Panels. While the price of the new devices is based on the current panels, their scope of performance has been expanded tremendously. The high resolution and a color depth of up to 65,500 colors are major factors contributing to the increased performance.

Even the connectivity either by PROFINET or PROFIBUS interface plus USB port could be significantly improved. Configuration and operation of the new panels has become easier in connection with simplified programming by means of the new WinCC software version in the TIA Portal.

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Overview

1.2

Design of the PROFINET devices

①

Power supply connection

⑥

Mounting seal

②

USB port

⑦

Function keys

③

PROFINET interface

⑧

Rating plate

④

Recesses for a mounting clip

⑨

Connection for functional ground

⑤

Display/touch screen

⑩

Guide for labeling strips

1.2 Design of the PROFINET devices

The figure below shows the design of the PROFINET devices using KTP700 Basic as an example.

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Overview

1.3

Design of the PROFIBUS devices

①

Power supply connection

⑥

Mounting seal

②

RS 422/RS 485 port

⑦

Function keys

③

USB port

⑧

Rating plate

④

Recesses for a mounting clip

⑨

Functional earth connection

⑤

Display/touch screen

⑩

Guides for labeling strips

1.3 Design of the PROFIBUS devices

The figure below shows the design of the PROFIBUS devices using KTP700 Basic DP as an example.

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Overview

1.4

Scope of delivery

Name

Figure

Quantity

1.4 Scope of delivery

The scope of delivery of the HMI device includes the following components:

HMI device

Quick Installation Guide

Mounting clips with grub screw

Power supply terminal

According to the quantity required for mounting, in accessory kit

1, in accessory kit

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Overview

1.5

Accessories

Storage media and I/O devices

Name

Article number

Converters, adapters and connectors

Name

Purpose

Article number

Protective foil

Name

Purpose

Article number

Service packages

Name

Article number

1.5 Accessories

Accessories are not included in the HMI device scope of delivery, but can be ordered on the Internet under Industry Mall (http://mall.automation.siemens.com

This section contains the number of accessories available at the time of publication of the operating instructions.

USB memory stick 8 GB 6ES7648-0DC50-0AA0 Industrial USB Hub 4 6AV6671-3AH00-0AX0

RS 422 to RS 232 converter

90 degree elbow adapter

PROFIBUS connector Recommended PROFIBUS connector with

PROFINET RJ45 connector "IE FC RJ45 Plug 2x2"

Connection of third-party controllers to Basic Panels DP

For RS 422/RS 485 port, cable outlet to rear 6AV6671-8XD00-0AX0

straight cable outlet Required for connection of Basic Panels with

PROFINET interface to PROFINET

6AV6671-8XE00-0AX0

6GK1500-0FC10

6GK1901-1BB10-2AA0

Protective film 4" Protective film set for KTP400 Basic 6AV2124-6DJ00-0AX0 Protective film 7" Protective film set for KTP700 Basic and

Protective film 9" Protective film set for KTP900 Basic 6AV2181-3JJ20-0AX0 Protective film 12" Protective film set for KTP1200 Basic and

Set of 20 mounting clips 6AV6671-8KX00-0AX2 Set of 10 power supply terminals 6AV6671-8XA00-0AX0

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

6AV2124-6GJ00-0AX0

KTP700 Basic DP

6AV2181-3MJ20-0AX0

KTP1200 Basic DP

Overview

1.5 Accessories

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2.1

General safety instructions

Working on the control cabinet

WARNING

Open equipment

Dangerous voltage

High frequency radiation

Note Unwanted operating states

Installation as intended

WARNING

Installation only in machinery that conforms to the machinery directive

The HMI device is an open equipment. This means the HMI device may only be installed in cubicles or cabinets that provide front panel access for operating the device.

The cubicle or cabinet in which the HMI device is installed may only be accessed with a key or tool and only by trained, authorized personnel.

Opening the cabinet will expose high voltage parts. Contact with these parts could be fatal.

Always disconnect the cabinet from the mains before opening it.

High-frequency radiation, for example, from cellular phones, can trigger unwanted operating states.

You are not permitted to commission the HMI device unless it has been verified that the machine in which the HMI device is to be installed complies with directive 2006/42/EC.

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Safety instructions

ESD

Industrial Security

2.1 General safety instructions

A device equipped with electronic components is an electrostatic sensitive device. Due to their design, electronic components are sensitive to overvoltage and thus to the discharge of static electricity. Note the corresponding regulations when handling ESD.

Siemens offers products and solutions with Industrial Security functions that support the safe operation of equipment, solutions, machines, devices and/or networks. They are important components in a comprehensive Industrial Security concept. As a result the products and solutions from Siemens are constantly evolving. Siemens recommends obtaining regular information regarding product updates.

For safe operation of Siemens products and solutions appropriate protective measures (e.g., cell protection concept) must be taken and each component must be integrated in a comprehensive Industrial Security concept, which corresponds with the current state of technology. The products of other manufacturers need to be taken into consideration if they are also used. You can find addition information on Industrial Security under (http://www.siemens.com/industrialsecurity

Sign up for our product-specific newsletter to receive the latest information on product updates. For more information, see under (http://www.siemens.de/automation/csi_en_WW

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Safety instructions

2.2

Notes about usage

NOTICE

The HMI device is approved for indoor use only.

Industrial applications

Use in residential areas

Note

Use with additional measures

2.2 Notes about usage

The HMI device may be damaged if it is operated outdoors.

Operate the HMI device indoors only.

The HMI device is designed for industrial applications. It conforms to the following standards:

● Requirements of the emission standard for industrial environments, EN 61000-6-4: 2007 + A1:2011

● ESD immunity requirements to DIN EN 61000-6-2:2005

The HMI device is not intended for use in residential areas. Operation of an HMI device in residential areas can have a negative influence on radio/TV reception.

If the HMI device is used in a residential area, you must take measures to achieve Limit Class B conforming to EN 55011 for RF interference.

Individual acceptance is required.

The HMI device should not be used at the following locations unless additional measures are taken:

● In locations with a high degree of ionizing radiation

● In locations with severe operating conditions, for example, due to:

– Corrosive vapors, gases, oils or chemicals

– Electrical or magnetic fields of high intensity

● In systems that require special monitoring, for example, in:

– Elevators

– Systems in especially hazardous rooms

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Safety instructions

Notes on communication

Note Communication errors caused by address conflict

Note Updating tag values following a communication error

Ethernet communication with Basic Panels with PROFINET interface

2.2 Notes about usage

Communication errors can occur if several devices in a network share the same bus address or IP address.

Make sure that your HMI device is assigned a unique address in the network.

If communication between an HMI device and controller is interrupted, all tag values displayed on the HMI device will be replaced by a hash mark ("#").

When the communication between the HMI device and controller is restored, all tag values will be updated immediately. The cycle time for updating the tag values begins again at "0".

Basic Panels with PROFINET interface support the following types of communication:

• PROFINET basic function for commissioning and diagnostics

• Standard Ethernet communication

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3.1

Preparations

3.1.1

Checking the package contents

Note Damaged parts

3.1.2

Checking the operating conditions

Check the package content for visible signs of transport damage and for completeness.

Do not install parts damaged during shipment. In the case of damaged parts, contact your Siemens representative.

The package content is described in section Scope of delivery (Page 14).

Keep the provided documentation in a safe place. The documentation is part of the HMI device and is required for subsequent commissioning.

Note the information in the following sections of these operating instructions before installing the HMI device:

● Certificates and approvals (Page 83)

● Electromagnetic compatibility (Page 84)

● Mechanical ambient conditions (Page 84)

● Climatic ambient conditions (Page 85)

● Protection classes (Page 86)

● Technical specifications (Page 93)

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Mounting and connecting

3.1.3

Selecting a mounting position

NOTICE

Damage due to overheating

Mounting position

Mounting in horizontal format

3.1 Preparations

The device is suitable for installation in:

● Mounting cabinets

● Control cabinets

● Switchboards

● Consoles

In the following, all of these mounting options are referred to by the general term "cabinet".

The device is self-ventilated and approved for inclined mounting at angles up to +/-35° from the vertical in stationary cabinets.

Inclined installation reduces the convection by the device and therefore the maximum permitted ambient temperature for operation.

If there is sufficient forced ventilation, the device can also be operated in the inclined mounting position up to the maximum permitted ambient temperature for vertical installation. The device may otherwise be damaged and its certifications and warranty will be rendered null and void.

The ambient temperature ranges listed in this section apply to the temperature inside the cabinet.

Select one of the approved mounting positions for your device. The approved mounting positions are described in the following sections.

Ambient temperature in the cabinet with horizontal mounting:

● Vertical mounting (0° inclined): Maximum +50 °C

● Inclined mounting (inclined up to 35°): Maximum +40 °C

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Mounting and connecting

Mounting in vertical format

Checking clearances

3.1 Preparations

Ambient temperature in the cabinet with vertical mounting:

● Vertical mounting (0° inclined): Maximum +40 °C

● Inclined mounting (inclined up to 35°): Maximum +35 °C

Operating Conditions (Page 85)

The following clearances are required around the HMI device to ensure sufficient selfventilation:

Required clearance around the HMI devices.

All dimensions in mm

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Mounting and connecting

3.1.5

Making the mounting cutout

Note Stability of the mounting cutout

Degrees of protection

Mounting compatibility

Mounting cutout Basic Panel

Compatible with the mounting cutouts of the HMI device

3.1 Preparations

The material in the area of the mounting cutout must provide sufficient strength to guarantee the lasting and safe mounting of the HMI device.

The force of the mounting clips or operation of the device may not lead to deformation of the material in order to achieve the degrees of protection described below.

The degrees of protection of the HMI device can only be guaranteed if the following requirements are met:

● Material thickness at the mounting cutout for a protection rating of IP65 or Front face only Type 4X/Type 12 (indoor use only): 2 mm to 6 mm.

● Permitted deviation from plane at the mounting cutout: ≤ 0.5 mm

This condition must be met for the mounted HMI device.

● Permitted surface roughness in the area of the seal: ≤ 120 µm (R

The mounting cutouts of the Basic panels are compatible with the mounting cutouts of the following SIMATIC HMI devices:

KTP400 Basic KTP400 Basic color PN KTP700 Basic, KTP700 Basic DP KTP600 Basic color PN; TP700 Comfort KTP900 Basic TP900 Comfort KTP1200 Basic, KTP1200 Basic DP TP1200 Comfort

120)

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Mounting and connecting

3.2 Mounting the HMI device

Dimensions of the mounting cutout

Dimensions of the mounting cutout for the Basic HMI devices in horizontal mounting position:

Dimensions of the mounting cutout for the Basic HMI devices in vertical mounting position:

All dimensions in mm

Connection sequence

Required tools and accessories

Procedure

Note Strain relief

3.3 Connecting the HMI device

Before you start connecting the HMI device, have the following tools and accessories at hand:

Keep to the following sequence of tasks when connecting the HMI device:

Slotted screwdriver, size 2

Phillips screwdriver, size 3

Crimp pliers

Power supply terminal

24 V DC with sufficient amperage. See Technical specifications (Page 93)

1. Connecting the equipotential bonding circuit (Page 27)

2. Connecting the power supply (Page 29)

3. Connecting the configuration PC (Page 31)

4. Connecting the controller (Page 33)

Contacts can be broken or wires can be torn off if cables are not provided adequate strain relief.

Provide adequate strain relief for all cables.

Securing the cables (Page 37)

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Mounting and connecting

3.3.2

Connecting the equipotential bonding circuit

Differences in electrical potential

General requirements for equipotential bonding

Note Equipotential bonding conductor

3.3 Connecting the HMI device

Differences in electrical potential can develop between spatially separated system components. Such electrical potential differences can lead to high equalizing currents on the data cables and therefore to the destruction of their interfaces. Equalizing currents can develop if the cable shielding is terminated at both ends and grounded to different system parts.

Differences in potential may develop when a system is connected to different mains supplies.

Differences in potential must be reduced by means of equipotential bonding conductors to ensure trouble-free operation of the relevant components of the electronic system. The following must therefore be observed when installing the equipotential bonding circuit:

● The effectiveness of equipotential bonding increases as the impedance of the equipotential bonding conductor decreases or as its cross-section increases.

● If two system parts are interconnected by means of shielded data cables and their shielding is bonded at both ends to the grounding/protective conductor, the impedance of the additionally installed equipotential bonding conductor must not exceed 10% of the shielding impedance.

● The cross-section of an equipotential bonding conductor must be capable of handling the maximum equalizing current. The best practical results for equipotential bonding between two cabinets have been achieved with a minimum conductor cross-section of 16 mm².

● Use equipotential bonding conductors made of copper or galvanized steel. Establish a large surface contact between the equipotential bonding conductors and the grounding/protective conductor and protect them from corrosion.

● Clamp the shielding of the data cable from the HMI device flush at the equipotential rail using suitable cable clamps. The equipotential rail should be very close to the HMI device.

● Route the equipotential bonding conductor and data cables in parallel and with minimum clearance between them.

Cable shielding is not suitable for equipotential bonding. Always use the prescribed equipotential bonding conductors. The cross-section of the equipotential bonding conductor must not be less than 16 mm². Always use cables with an adequate cross-section when installing MPI and PROFIBUS DP networks. The interface modules may otherwise be damaged or destroyed.

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Mounting and connecting

Procedure

3.3.3

Connecting the power supply

Stripping the cable

3.3 Connecting the HMI device

1. Interconnect the functional earth

connection of the HMI device with an equipotential bonding

conductor, cross-section 4 mm

2. Connect the equipotential bonding

conductor to the equipotential bonding rail.

Use power supply cables with a maximum cross-section of 1.5 mm

1. Strip the ends of two power supply

cables to a length of 6 mm.

2. Attach cable sleeves to the bare

cable ends.

3. Install the end sleeves on the

cable ends using the crimp pliers.

Basic Panels 2nd Generation Operating Instructions, 03/2014, A5E33293231-AA

Mounting and connecting

Procedure

NOTICE

24 V DC only

NOTICE

Safe electrical isolation

3.3 Connecting the HMI device

An incorrectly dimensioned power supply can destroy the HMI device.

Use a 24 V DC power supply with adequate amperage; see Technical specifications (Page 93).

Use only 24 V DC power supply units with safe electrical isolation in accordance with IEC 60364-4-41 or HD 384.04.41 (VDE 0100, Part 410), for example, to PELV standard.

The supply voltage must be within the specified voltage range. Otherwise, malfunctions at the HMI device cannot be ruled out.

Applies to non-isolated system configurations:

Connect the connection for GND 24 V from the 24 V power supply output to equipotential bonding for uniform reference potential. You should always select a central point of termination.

1. Insert the two power cables into the mains terminal and secure them with a slotted screwdriver.

2. Connect the mains terminal to the HMI device.

3. Switch off the power supply.

4. Insert the two remaining cable ends into the power supply terminals and secure them with the slotted screwdriver.

Ensure correct polarity.

Basic Panels 2nd Generation

30 Operating Instructions, 03/2014, A5E33293231-AA

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