Siemens E71 Service Manual

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Service manual Level 3

for

E71

Release Date Department Notes to change R 1.0 22.09.2006 ISC S CES New document

Technical Documentation Release 1.0 TD_Repair_L3 _Theory of Operation_E71_R1.0.pdf Page 1 of 35

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Table of Content

1 Introduction ...............................................................................................................................4

1.1 PURPOSE...............................................................................................................................4

1.2 SCOPE...................................................................................................................................4

1.3 TERMS AND ABBREVIATIONS ...................................................................................................4

2 List of available level 3 parts....................................................................................................5

3 Required Equipment for Level 3 ..............................................................................................6

4 Required Software for Level 3..................................................................................................6

5 PCB Main Board Overview .......................................................................................................7

6 Radio Part ..................................................................................................................................8

6.1 BLOCK DIAGRAM RF PART.......................................................................................................9

6.2 POWER SUPPLY RF-PART ......................................................................................................9

6.3 FREQUENCY GENERATION -...................................................................................................10

6.4 RECEIVER ............................................................................................................................11

6.5 TRANSMITTER.......................................................................................................................12

6.6 BRIGHT IC OVERVIEW...........................................................................................................14

6.7 ANTENNA SWITCH (ELECTRICAL/MECHANICAL) .......................................................................16

6.8 TRANSMITTER: POWER AMPLIFIER ........................................................................................17

7 Logic / Control.........................................................................................................................18

7.1 OVERVIEW HARDWARE STRUCTURE E71...............................................................................18

7.2 SGOLD2 .............................................................................................................................19

7.3 EXTERNAL MEMORY..............................................................................................................22

7.3.1 FLASH..........................................................................................................................22

7.3.2 Low Power SDRAM......................................................................................................22

7.4 MEMORY CARD ....................................................................................................................22

7.5 SIM......................................................................................................................................23

7.6 FM-RADIO............................................................................................................................23

7.7 SERVICE INDICATION LED.....................................................................................................23

7.8 VIBRATION MOTOR ...............................................................................................................23

8 Display......................................................................................................................................24

9 Camera .....................................................................................................................................24

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10 Bluetooth..................................................................................................................................25

11 Power Supply...........................................................................................................................26

11.1 PMU MOZART BOOST+ / TWIGO4 BOOST+............................................................................26

11.2 BATTERY..............................................................................................................................26

11.3 CHARGING CONCEPT............................................................................................................26

12 MMI ...........................................................................................................................................28

12.1 KEYBOARD...........................................................................................................................28

12.2 SIDE KEYS:...........................................................................................................................28

12.3 KEYPAD ILLUMINATION:.........................................................................................................28

13 Interfaces .................................................................................................................................28

13.1 MICROPHONE (XG1901).......................................................................................................28

13.2 BATTERY (X1400) ................................................................................................................29

13.3 VIBRATION MOTOR (XG2100)...............................................................................................29

13.4 INTERFACE SIM MODULE WITH ESD PROTECTION .................................................................30

13.5 NANO IO CONNECTOR WITH ESD PROTECTION .....................................................................31

13.6 DISPLAY CONNECTOR...........................................................................................................33

13.7 MMI CONNECTOR.................................................................................................................34

13.8 CAMERA CONNECTOR...........................................................................................................35

14 E71 Diagram Sets....................................................................................................................35

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1 Introduction

1.1 Purpose

This Service Repair Documentation is intended to carry out repairs on BenQ repair level 3.

1.2 Scope

This document is the reference document for all BenQ authorised Service Partners which are released to repair BenQ Siemens mobile phones up to level 3.

1.3 Terms and Abbreviations

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2 List of available level 3 parts

(according to Component Matrix V1.13 - check C-market for updates)

Product ID OrderNumber DescriptionCM

E71 D1000 L50610-G6282-D670 IC SGOLD2PMB8876X2.1J11 E71 D1300 L50645-J4683-Y23 IC ASIC TWIGO4+BOOST MOZART-BOOST+BGA196 E71 D1800 L50620-L6172-D670 IC TELEC TEA5761UK E71 D5100 L50610-U6122-D670 IC BLUETOOTHBRF6150PB-FREE E71 D5930 L50645-K280-Y303 IC FEM HITACHIGSM90018001900 (FEM -Type 5) E71 D5932 L50620-L6175-D670 IC TRANCEIVER Bright 6PL E71 D5933 L50651-Z200-2A91 IC MODUL PA PF09039B (PA-Type 8)PBFree E71 L1301 L50651-F5103-M1 Coil 10U (Co-Type 9) E71 L1302 L36151-F5103-M7 Coil 10U (Co-Type 2) E71 N3500 L50610-C6153-D670 IC V-REG 2.9V (Vr-Type 2)PBFree E71 N4800 L50610-C6153-D670 IC V-REG 2.9V (Vr-Type 2)PBFree E71 R1347 L36120-F4223-H Resistor TEMP22K (Res-Type 7) E71 R5967 L36120-F4223-H Resistor TEMP22K (Res-Type 7) E71 V1302 L36840-D5076-D670 Diode SOD323 (Di-Type 7) E71 V1305 L50630-C1127-D670 Transistor FDMA1027P (Tra-Type 19) E71 V1376 L50630-C1152-D670 Transistor FDMA3N109 (Tra-Type 18) E71 V1400 L50640-D70-D670 Diode BAV99T (Di-Type 9) E71 V2100 L50640-D5084-D670 Diode RB548W (Di-Type 8) E71 V2300 L36840-C4061-D670 Transistor BC847BSBC846S (Tra-Type 10) E71 V2302 L50640-C2131-D670 Transistor NPN+R1 R2 PDTC (Tra-Type 20) E71 V2405 L50640-L2110-D670 LED GREEN SIDE-SHOOTER E71 V2801 L36840-C4061-D670 Transistor BC847BSBC846S (Tra-Type 10) E71 V2802 L50640-C2131-D670 Transistor NPN+R1 R2 PDTC (Tra-Type 20) E71 X1400 L50634-Z97-C467 CONNECTOR BATTERY 3-POLX85 E71 X1504 L50634-Z93-C364 IO-JACK NANO 12-POL E71 X1604 L50634-Z97-C406 CONNECTOR SIM CARD READER R65 (B) E71 X2200 L50634-Z97-C457 CONNECTOR B2B 20-POL MALE E71 X2705 L50634-Z97-C363 CONNECTOR BOARD TO BOARD 14-POL.X75 E71 X3500 L50634-Z97-C516 CONNECTOR HYDRA-CAMERA-SOCKET E71 X4081 L50634-Z97-C382 CONNECTOR COAX SOCKET SWITCH ED2 E71 X4899 L50634-Z97-C448 CONNECTOR CARD READER TRANSFLASHHINGE E71 Z1001 L50645-F102-Y40 QUARZ32,768KHZ (Q-Type 4) E71 Z1501 L50620-U6067-D670 FILTER EMI (Fi-Type 8)PBFree E71 Z1601 L50620-U6029-D670 FILTER EMI (Fi-Type 6)PBFree E71 Z4801 L50620-U6030-D670 FILTER EMI (Fi-Type 10)PBFree E71 Z5100 L50645-K280-Y330 FILTER BPBLUETOOTH E71 Z5930 L50645-F260-Y37 QUARZ26MHZ (Q-Type 10)

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3 Required Equipment for Level 3

 GSM-Tester (CMU200 or 4400S incl. Options)  PC-incl. Monitor, Keyboard and Mouse  Bootadapter 2000/2002 (L36880-N9241-A200)  Adapter cable for Bootadapter due to  Troubleshooting Frame E71 (F30032-P)  Power Supply  Spectrum Analyser  Active RF-Probe incl. Power Supply  Oscilloscope incl. Probe  RF-Connector (N<>SMA(f))  Power Supply Cables  Dongle (F30032-P28-A1) if USB-Dongle is used a special driver for NT is required  BGA Soldering equipment

Reference: Equipment recommendation V2.0 (downloadable from the technical support page)

new Lumberg connector (F30032-P226-A2)

4 Required Software for Level 3

 Windows XP  X-Focus version 2.04 or higher  GRT Version 4.04 or higher  Internet unblocking solution (JPICS)

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5 PCB Main Board Overview

PCB Main Board Top Side

32,768 kHz Oscillator

IC SGOLD2

IC FLASHSDRAM

IC Flash SDRAM

PCB Main Board Back Side

IC TELEC TEA5761UK

CONNECTOR B2B 20-POL MALE

IC BLUETOOTHBRF6150

IC TRANCEIVER

26 MHz Oscillator

CONNECTOR BTOB 14-POL

IC FEM HITACHI

IC MODUL PA

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IC ASIC

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CONNECTOR CARD READER TRANSFLASH

CONNECTOR CAMERA-SOCKET

6 Radio Part

The radio part realizes the conversion of the GMSK/8PSK RF-signals from the antenna to the base-band and vice versa. In the receiving direction, the signals are split in the I- and Qcomponent and led to the A/D-converter of the logic part. In the transmission direction, the GMSK/8PSK signals are generated digitally by the baseband section. After D/A conversion the analogue signals are fed into an IQ modulator and up-converted to radio frequencies by the polar loop system. After that the signals are amplified in the power amplifier.

Transmitter and Receiver are never active at the same time. Therefore full duplex operation is not possible. However the monitoring band (monitoring timeslot) in the TDMA-frame can be chosen independently of the receiving respectively the transmitting band (RX- and TX timeslot of the band). The RF part is dimensioned for quad band operation in the frequency ranges GSM850/ EGSM900/DCS1800/ PCS1900 supporting EGPRS functionality up to multi class 12.

E71 supports EGSM900/DCS1800/PCS1900.

The RF-circuit consists of the following components:

• Renesas Bright 6PLA chip set

 PLL for integrated local oscillator LO including loop filter  Fully integrated TxVCO and TX-PLL including loop filter  Direct conversion receiver including LNA, DC-mixer, channel filtering and PGC-

amplifier

 Active part of 26 MHz reference oscillator and varicap

• Integrated Polar Loop, phase and amplitude control of transmitted output power

• Renesas transmit PA PF09036B

• Hitachi Front-end Module

HWXQ521 including RX-/TX-switch and EGSM900 / DCS1800 / PCS 1900 receiver SAW-filters or HWXQ522 including RX-/TX-switch and GSM850 / DCS1800 / PCS 1900 receiver SAW-filters or HWXR591 including RX-/TX-switch and GSM850 / EGSM900 / DCS1800 / PCS 1900 receiver SAW-filters

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6.1 Block diagram RF part

6.2 Power Supply RF-Part

The voltage regulator for the RF-part is located inside the ASIC D1300. It generates the required 2,8V “RF-Voltages” named VDD_RF1 and VDD_RF2. The voltage regulator is activated as well as deactivated via VCXOEN_UC The temporary deactivation is used to extend the stand by time.

okay

Technical Documentation Release 1.0

(Functional K19) provided by the SGOLD2.

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6.3 Frequency generation -

Discrete 26MHz VCXO reference oscillator The 26 MHz signal is created by an integrated VCXO. A Colpitts oscillator is used with a

post-connected buffer stage. The active part and the varicaps are realized within the Bright. The integrated varicap is split up into different smaller varicaps to adjust the center frequency of the VCXO with different crystal vendors and mass production variation. For temperature measurements of the VCXO an external temperature sensor is used. The frequency of the reference oscillator can be fine tuned by the SGOLD2 via a filtered PNM modulated AFC signal(RF_AFC). Three active buffer stages are included in Bright 6PLA to provide clock signals for the baseband IC, Bluetooth and the PMU ASIC.

The required voltage VDD_RF1/VDD_RF2 is provided by the ASCI D1300

Waveform of the AFC_PNM signal from SGOLD2 to Oscillator

Signalform

SGOLD2

1 2 3

RF_AFC

AFC_PNM

GND

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Synthesizer: LO The local oscillator (LO) consists of a PLL and VCO inside Bright D5932 and an integrated

loop filter. The VCO includes a calibration mechanism which is triggered automatically before each synthesizer programming.

RF PLL The RF-PLL is a fractional-N-PLL. The RF frequency is calculated within Bright D5932 from the channel frequency information which is programmed into Bright D5932. In TX mode there is the possibility to correct the RF frequency by a few 100Hz to correct for TX frequency errors. The reference frequency of the PLL is 26MHz. The PLL is controlled by the internal state machine.

RFVCO (LO) The first local oscillator is needed to generate frequencies which enable the transceiver IC to demodulate the receiver signal and to perform the channel selection in the TX part. The VCO module is switched on with the signal PLLON.The full oscillation range is divided into 256 sub bands and covers 3476 to 4026MHz. The choice of the appropriate band and the complete operation is controlled internally by the Bright state machine.

TX IF Generation The TX IF signal is derived from the RFVCO signal by a divider. Four different divider ratios

(40, 44, 48, and 52) can be selected by programming. As with the channel frequency also the RFVCO frequency changes the TX IF is no longer a fixed frequency but changes also depending on the divider ratio in the range from 68.4MHz to 100.6MHz.

6.4 Receiver

Receiver: Filter to Demodulator The Bright D5932 incorporates four RF LNAs for GSM850, EGSM900, DCS1800 and

PCS1900 operation followed by direct conversion mixers which are IQ demodulators. The LNA/mixer can be switched in normal-, low- and lower-gain and high isolation mode. For the “normal gain“ state the mixers are optimised in terms of conversion gain and noise figure, in the “low gain“ state the mixers are optimised for large-signal behaviour for operation at a high input power levels. The "lower gain mode" reduces the RF-level by activating differential impedance in front of the LNA to improve the large signal performance. Triple band operation (GSM850, DCS1800 and PCS1900) is also possible because both low band LNA’s can both operate in the GSM850 and EGSM900 bands. The frequency bands are determined by the front-end module D5930 which is used and by the synthesizer programming.

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Furthermore the IC includes a programmable gain baseband amplifier PGA (90dB control range, 2dB steps) with automatic DC offset calibration. The channel filtering is realized inside the chip with a four stage baseband filter for both IQ chains. Two capacitors which are part of the first passive RC-filters are now integrated and calibrated during the initialization sequence of B6PLA. The second, third and fourth filters are active filters and are fully integrated. The distributed channel filter is necessary to suppress adjacent channel and inband-blocking interferer to avoid any compression in each amplifier stage.

The down converted IQ signals are fed into the A/D converters inside the SGOLD2. By a special algorithm the level of the IQ signals is kept constant on a defined level by varying the PGA gain and selecting the appropriate LNA gains.

Filter

LNA

Demodulator

PGC

D5930 Bright(D5932)

The required voltage VDD_RF1/VDD_RF2 is provided by the ASIC D1300

6.5 Transmitter

Polar Loop The generation of the modulated RF signal in Bright is based on the principle of the polar loop architecture. The IQ signals generated by the SGOLD2 baseband are modulated to the transmit IF of 68.4MHz to 100.6MHz by an IQ modulator. The required IF is generated by dividing the RFVCO signal. As in a conventional up-conversion loop the IF signal is up-converted to the transmit frequency. There-fore a down-converter and a phase detector are used in order to compare the IF signal to the down-converted transmit signal. This loop is called PM loop and is used for GMSK operation.

In 8PSK mode the transmit IF-signal is split into PM and AM components. A second loop is then used to control the AM components. Therefore an AM detector is implemented which compares the transmit IF-signal and the down-converted transmit signal. The AM loop is also used for power ramping. Inside the AM loop there are two analogue gain controlled amplifiers. These are used for setting the output power level and to keep the loop bandwidth constant. External attenuators are required in the feedback paths from PA to Bright to adjust the feedback level to PA’s from different suppliers. The separated AM and PM components of an 8PSK signal are finally fit together inside the PA. The PA is driven by the TXVCO signals containing the PM components. The AM component is added by an amplitude control input pin, which controls the supply voltage of the RF transistors and therefore the PA output power level.

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All loop filters for PM and AM loops are fully integrated within Bright. To achieve a good output modulation spectrum it is necessary that the bandwidths of the PM loop and the AM loop are quite well adjusted to their target bandwidth. For the PM loop there is an automatic calibration mechanism within B6PLA running prior to each TX slot. The AM loop bandwidth is calibrated only one time in the factory.

TxVCO The TxVCO is integrated inside Bright. It consists of 256 VCO bands operating in the frequency range 1648MHz to 1910MHz. The signal for the low bands GSM850 and EGSM900 is generated by a 1/2 divider. Two independent output buffers, one for each band, deliver the output signal to the PA module input. The choice of the appropriate VCO band is done automatically and controlled by the internal state machine.

Modulator

Filter

TxVCO

Bright(D5932)

The required voltage VDD_RF1/VDD_RF2 is provided by the ASIC D1300

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6.6 Bright IC Overview

BRIGHT 6PL IC Overview

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IC top view (ball overview)

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6.7 Antenna switch (electrical/mechanical)

Internal/External <> Receiver/Transmitter The E71 mobile have two antenna switches. a) The mechanical antenna switch for the differentiation between the internal and

external antenna which is used

b) The electrical antenna switch, for the differentiation between the receiving and

transmitting signals. To activate the correct tx pathes of this diplexer, the SGOLD2 signals FEMC1 and FEMC2 are required.

Internal/External antenna switch

The electrical antenna switch

only for RF adjustments on the board.

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6.8 Transmitter: Power Amplifier

The power amplifier is a PA module matched to 50 Ω at all signal ports. It contains a two stage amplifier for the GSM850/EGSM900 and a three stage amplifier for DCS1800/PCS1900 operation. It is possible to control the output power level of both bands via one VRAMP port. The appropriate amplifier chain is activated by a logic signal, which is provided by Bright (TXBAND). The module is switched on by a control signal generated by the Bright internal state machine (TX_ON). The RF transistor bias voltage is generated inside the PA module. The PA module consists also of two additional directional couplers to provide the needed RF feedback signal for the AM control in 8PSK mode. In GMSK operation the output power is directly controlled by a control voltage coming from

SGOLD2. This voltage is fed through Bright and connected to the PA module (VRAMP).

The 3GPP specification can be fulfilled without power sensing or any type of feedback. In 8PSK operation the AM loop controls the output power level. Therefore the same SGOLD2 signal is used but connected to the variable gain amplifiers inside Bright. The AM control voltage finally controls the PA module (VRAMP). All switching between GMSK and 8PSK modes is controlled by the Bright internal state machine.

The required voltage BATT+ is provided by the battery.

okay

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7 Logic / Control

7.1 Overview Hardware Structure E71

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7.2 SGOLD2

Baseband Processor SGOLD2 Features

Supported Standards

• EGPRS class 12 MCS 1..9

• GSM speech FR, HR, EFR and AMR-NB

• GSM data 2.4kbit/s, 4.8kbit/s, 9.6kbits, and 14.4kbit/s

• HSCSD class 10

• GPRS class 12 CS 1..4 Processing cores

• ARM926EJ-S 32 bit processor core with operating frequency up to 208 MHz for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

• TEAKLite® DSP core with operating frequency 138.67 MHz. ARM-Memory TEAKLite®-Memory (word: 16bit) Shared Memory Blocks (word: 16bit) Controller Bus System TEAKLite® Bus System Clock System

The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLDliteTM. Thus power consumption and performance can be optimized for each application.

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Functional Hardware blocks

• CPU and DSP Timers

• Programmable PLL with additional phase shifters for system clock generation

• GSM Timer Module that off-loads the CPU from radio channel timing

• GMSK Modulator according to GSM-standard 05.04 (5/2000) – GMSK Modulator: gauss-filter with B*T=0.3

• Hardware accelerators for equalizer and channel decoding

• A5/1, A5/2, A5/3 Cipher Unit (A5/3 added in S-GOLDliteTM V1.1)

• GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission (GEA3 added in S-GOLDliteTM V1.1)

• Advanced static and dynamic power management features including TDMA-Frame synchronous low-power mode and enhanced CPU modes (idle and sleep modes)

• Incremental Redundancy Memory for EDGE class 12 support

• GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000) – GMSK Modulator: gauss-filter with B*T=0.3 – EDGE Modulator: 8PSK-modulation with linearised GMSK-pulse-filter

• MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

Signal Processing Firmware Support

• FR, HR, EFR, and AMR

• data transmission channel codecs for 2.4, 4.8, 9.6 and 14.4 kbit/s

• HSCDS class 10 support

• GPRS class 12 support with coding schemes CS1..4

• Support for Handsfree, side- and signaling tone generation

• MMS-support

• EGPRS class 12 with modulation and coding schemes MCS1..9 (Release 5 compliant)

• Polyphonic ringer for up to 64 voices at sampling rates up to 48kHz

• 64 voices midi (pseudo) stereo

• enhanced audio visualization

• voice control

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Interfaces and Features

• Keypad Interface for scanning keypads up to 8 rows and 8 columns

• Pulse Number Modulation output for Automatic Frequency Correction (AFC)

• Serial RF Control Interface; support of direct conversion RF

• 2 USARTs

• IrDA Controller

• 1 Serial Synchronous SPI compatible interfaces in the controller domain

• 1 Serial Synchronous SPI compatible interface in the TEAKLite® domain

• I2C-bus interface

• 2 bidirectional and one unidirectional I2S interface accessible from the TEAKLite®

• USB V1.1 mini host interface

• IEEE 1149.1 compliant JTAG port for Boundary Scan and debug

• ISO 7816 compatible SIM card interface

• Enhanced digital baseband filters, including analog prefilters a/d converters.

• Digital and analog audio filters including wideband audio capable digital-to-analog and analog-to-digital converters.

• Audio front-end will be accessible from MCU (via shared memory) and the TEAKLite® (i.e. voice recognition and echo cancellation can run on TEAKLite®)

• Hifi Stereo voiceband with CD-Quality

• Separate analog-to-digital converter for various general purpose measurements like battery voltage, battery, VCXO and environmental temperature, battery technology, transmission power, offset, onchip temperature, etc.

• Ringer support for highly oversampled PDM/PWM input signals

• Differential VMIC generation

• RF power ramping functions

• DAI Interface according to GSM 11.10 is implemented via dedicated I2S mode

• 26 MHz master clock input

• External memory interface:

• Port logic for external port signals

• Comprehensive static and dynamic Power Management – Various frequency options during operation mode – 32 kHz clock in standby mode – Sleep control in standby mode – RAMs and ROMs in power save mode during standby mode

• 2 General Purpose Timers with 3 32-bit timers

• Serial number

• A real time clock with alarm functions

• 2 capture/compare units with 16 channels

• A fast parallel Display Interface

• Camera Interface

• Programmable clock output for a camera

• An Multimedia/Secure Digital Card Interface (MMCI/SD; SDIO capable)

• A Flash Controller DMA Port (FCDP) supporting NAND flash

• A multimedia extension interface (MMIC-IF) supporting external hardware accelerator

• A Fast IrDA Interface

• A Universal Serial Interface enabling asynchronous or synchronous serial data transmission.

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7.3 External memory

The external memory is a two die stacked device with one Flash for code and data and one LP-SDRAM as main memory. The densities are 512Mbit flash and 128Mbit SD-Ram.

7.3.1 FLASH

It is a non-volatile-, re-programmable- memory (SW-updateable), with a high performance interface. The mobile-SW can be executed directly. The Flash has an unchangeable serial number.

Memory Size: 512 Mbit (64 MByte) Data Bus: 16 Bit IO / Core Voltage Supply: typ. 1.8V Boot Block: Top

Access Time: Asynchronous (Initial) Mode: 93 ns Synchronous Burst Mode: 108 MHz / 7ns clock to data output Support 8-, 16-, or continuous-burst-read

Architecture: 8 partitions

7.3.2 Low Power SDRAM

The SDRAM (Synchronic Dynamic Random Access Memory) is for volatile data.

Memory Size: 128 Mbit (16 MByte) Data Bus: 16Bit IO / Core Voltage Supply: typ. 1.8 V Synchronous Burst Mode: 105MHz (CL=3) Burst

7.4 Memory Card

The memory card is controlled by the MMC/SD interface of the SGOLD2. The new card type used in E71 is called MicroSD. The SD-card interface is based on the MMC-card interface with three signals MMC_CMD,

MC_DAT, MMC_CLK.

The MicroSD card has differently from the normal sized SD/MMC card, only one GND pin. That is why we cannot use the same detection as with MMC cards. We use the internal pull up resistor of the card on Pin 1 (DAT2) in combination with an external pull down resistor. When the card is inserted and powered, we get a high signal on the external pull down resistor which creates a state change on a SGOLD2 GPIO. A simple RC-Low pass Filter is used on the detection signal for de-bouncing.

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Created by inservio GmbH for BenQ mobile GmbH & Co. OHG - Company Confidential2006©inservio

7.5 SIM

The SIM-interface of S-GOLD2 is powered with 2.9V on the supply-line. Although VDD_SIM is always 2.9V the interface supports both 3V SIM-cards and 1.8V SIMcards.

7.6 FM-Radio

E71 has a FM-Radio mounted on the PCB. The FM-Radio is a normal FM-Radio without RDS. The FM-radio is controlled by I2C and the audio is connected via Mozart Boost+/Twigo Boost+ The tuning range is the EU/US 87.5 - 108.0 MHz band, but the FM radio IC also supports the Japanese 76.0 - 91.0 MHz band. The pre-emphasis is controlled by software and set to either 50 us (EU) or 75 us (US) based on information from the GSM network. The FM radio is based on a fully integrated low IF architecture with an integrated integer synthesizer. Programming of the FM radio is performed over the I2C bus. A 32.768 kHz clock signal is provided by the base band for the FM radio.

7.7 Service Indication LED

Due to the fact that the display will be switched off in Standby Mode for power saving reasons a service indication LED is used to indicate that the device is switched on. The service indication LED can also indicate other action has occurred (incoming call, network lost, download ongoing, etc.). The colour of the LED is green. The LED is controlled by the Mozart Boost+. The blinking frequency is controlled by the Mozart Boost+ and will be set by SW.

7.8 Vibration Motor

The vibration motor is mounted in the base frame of the phone. The electrical connection to the PCB is realized with spring contacts. The vibration motor uses a silicon grommet motor housing to improve drop shock performance. The vibration motor is supplied from Mozart Boost+/Twigo Boost+.

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Created by inservio GmbH for BenQ mobile GmbH & Co. OHG - Company Confidential2006©inservio

8 Display

In the E71 a display module with an intelligent graphic Liquid Crystal Display (LCD) is used. The display module consists of the following parts and features

• Active Matrix Liquid Crystal Display Panel, transflective, 2.0”, 240x320 dots, 262k colors, negative mode with wide viewing angle technology.

• The display will have a display controller mounted on the display glass (COG) which is connected to a FPC inside the module

•

Light guide with 4 white LEDs

•

Camera as well as display are driven directly be the S_GOLD2TM chip. Commands to the camera are sent via the I2C interface, the picture-data output of the camera goes over a parallel 8-bit interface.

The 4 white LED’s for the display are in series and supplied by one constant current source, to ensure homogeneous brightness and colour of the backlight.

9 Camera

The camera module is a 1.3MPix-CMOS sensor, image processor circuitry, lens and holder, lens hood, cover glass and housing to attach the camera on the PCB. Connectivity from camera module to PCB is realized by using a socket. The socket is shielding the camera.

Resolution: 1.3 MPix Focus range [mm]: 300 - ∞

Centre Resolution CTF(30%): 200 lph The camera can maximum run with a frame-rate of 15pictires/second (f/s). When the

camera detects low light condition it automatically shifts to 7.5f/s which improves the picture quality (sensitivity).

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Created by inservio GmbH for BenQ mobile GmbH & Co. OHG - Company Confidential2006©inservio

10 Bluetooth

The Bluetooth Interface is compatible to the Bluetooth specification version 1.2 power class 2 (-6 dBm up to +4dBm) with a RX sensitivity better than –70 dBm and support multipoint connections. It supports a transmission rate up to 723 kBit/s data asymmetrically over the air interface. The transmission range is approx. 10 m. Between SGOLD2 and BRF6150 a data rate up to

921.6 kbit/s is used. The following table shows the interface between SGOLD2, PMU and the BRF6150:

Pin name BRF6150

VDD_IN_BB VDD_IN_RFIO VDD_IN_ANA VDD_IN_OSC VDD_IO_x VDD_IO_SF_x

HCI_RTS OUT USART IF SGOLD2 “USART1_CTS” HCI_RX IN USART IF SGOLD2 “IRDA_TX” or

HCI_TX OUT USART IF SGOLD2 “USART1_RX”or

HCI_CTS IN USART IF SGOLD2 “USART1_RTS” AUD_CLK IN PCM IF SGOLD2 “I2S1_CLK” AUD_FSYNC IN PCM IF SGOLD2 “I2S1_WA0” AUD_IN IN PCM IF SGOLD2 ”I2 S1_TX” AUD_OUT OUT PCM IF SGOLD2 “I2S1_RX” HCI_TX OUT Wakeup-line,

NSHUT_DOWN IN Reset PMU “Outport” CLK32 IN 32,768 kHz +-250ppm

XTALP_FAST_ CK_IN IO0_EXT_CLK_ REQ_OUT

@ BRF6150

IN Main power supply STV-ASIC "VRF3"

IN IO Power supply

IN 26MHz clock signal OUT 26MHz clock request PMU

Meaning Connected to

PMU

2.9V needed for stacked flash

needed if H5 is not used

Rectangular wave sine wave

VDD IO SGOLD REG3 2.65V (REG1 2.9V)

SGOLD2 "USIF_TXD_MSTR" SGOLD2

"USIF_RXD_MSTR"

SGOLD2 “KP_IN6"

S-GOLD2 “CLK32” RF-GSM “VOUTEF2”

“SLEEP2N”

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11 Power Supply

11.1 PMU Mozart Boost+ / Twigo4 Boost+

The power supply ASIC control the following functions:

• Powerdown-Mode

• Sleep Mode

• Trickle Charge Mode

• Power on Reset

• Digital state machine to control switch on and supervise the µC with a watchdog

• 17 Voltage regulators

• 2 internal DC/DC converters (Step-up and Step-down converter)

• Low power voltage regulator

• Additional output ports

• Voltage supervision

• Temperature supervision with external and internal sensor

• Battery charge control

• TWI Interface (I2C interface)

• Bandgap reference

• High performance audio quality

• Audio multiplexer for selection of audio input

• Audio amplifier stereo/mono

• 16 bit Sigma/Delta DAC with Clock recovery and I2S Interface

11.2 Battery

The Li-Ion Battery for E71 with a nominal capacity1 of 760 mAh is used. Under GSM – discharge conditions the battery will provide a discharge capacity of 730 mAh. An internal safety circuit protects against over-charging, over-discharging and over-current. There are planned two sources of the battery.

11.3 Charging Concept

General:

The battery is charged in the phone. The hardware and software is designed for Li-Ion with

4.2V technology. Charging is started as soon as the phone is connected to an external charger. If the phone is not switched on, then charging takes place in the background (the customer can see this via the “Charge” symbol in the display). During normal use the phone is being charged.

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Charging is enabled via a PMOS switch in the phone. This PMOS switch closes the circuit for the external charger to the battery. The processor takes over the control of this switch depending on the charge level of the battery, whereby a disable function in the PMU hardware can override/interrupt the charging in the case of a too high voltage on the battery

For controlling the charging process it is necessary to measure the ambient (phone) temperature and the battery voltage. The temperature sensor will be an NTC resistor with a nominal resistance of 22kΩ at 25°C. The determination of the temperature is achieved via a voltage measurement on a voltage divider in which one of the components is the NTC. Charging is ongoing as long the temperature is within the range +0°C to 50°C. The maximal charge time will be approx. 3 hours with a standard charger. With travel charge the charge time is approx. 2 hours.

Charging Characteristic of Lithium-Ion Cells: Li-Ion batteries are charged with a U/I characteristic, i.e. the charging current is regulated in relation to the battery voltage until a minimal charging current has been achieved. The maximum charging current is given by the connected charger. The battery voltage must not exceed 4.2V ±50mV average. During the charging pulse current the voltage may reach

4.3V. The temperature range in which charging of the phone may be performed is in the ranges from 0...50°C. Outside this range no charging takes place, the battery only supplies current.

Trickle Charging:

The PMU is able to charge the battery at voltages below 3.2V without any support from the charge SW. The current will by measured indirectly via the voltage drop over a shunt resistor and linearly regulated inside the PMU by means of the external PMOS transistor. The current level during trickle charge for voltages <2.8V is in the range of 20-40mA and in the range of 50-100mA for voltages up to 3.2V. To limit the power dissipation of the dual PMOS charge transistor the trickle charging is stopped in case the output voltage of the charger exceeds 10 Volt. The maximum trickle charge time is limited to 1 hour. As soon as the battery voltage exceeds 3.2 V the PMU will switch on the phone automatically and normal charging will be initiated by software.

Normal Charging (Rapid charge):

For battery voltages above 3.2 Volt and normal ambient temperature between 0 and 50°C the battery can be charged with a charge current up to 1C. This charging mode is SW controlled and starts if an accessory (charger) is detected with a supply voltage above 5.8 Volt by the PMU ASIC. The level of charge current is only limited by the external charger.

USB Charging:

The PMU can support USB charging when USB charging is integrated in the charging software. If voltage of the external supply is in the range 4.4V to 5.25 V USB charging will be initiated. USB charging will only be initiated if the phone is switched on before insertion of the USB cable. During USB charging only limited charging is possible. Charge current is limited to 75, 150, 300 or 400mA.

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12 MMI

12.1 Keyboard

The Keypad matrix consists of the keys "0" to "9", "*", "#", two soft keys, a 5-way-navy-key, a "SEND"-, an "END"-key. They are located on there own MMI PCB which is connected to the main board by a 14-pin-Connector.

12.2 Side Keys:

There are two side keys in E71 also connected to the keyboard matrix. This is volume up and down.

12.3 Keypad Illumination:

The Keyboard is illuminated by 8 white LED’s. The LED´s are connected with two strings with 4 LED’s and a resistor in each string and supplied by one constant current source. This is done to ensure homogeneous brightness of the backlight.

13 Interfaces

13.1 Microphone (XG1901)

Pin Name IN/OUT Remarks

1 MIC1A O Microphone power supply. The same line carries the low

frequency speech signal.

2 MIC1B GND_MIC

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13.2 Battery (X1400)

Pin Name Remarks

1 GND Ground 2 AKKU_TYP Recognition of battery/supplier 3 BATT+ Positive battery pole

13.3 Vibration Motor (XG2100)

Pin Name IN/OUT Remarks

1 GND 2 VDD_VIBRA Vbatt will be switched by PWM-signal with

internal FET to VDD_Vibra in Asic

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13.4 Interface SIM Module with ESD protection

Pin Name IN/OUT Remarks

SIM_CLK O Pulse for chipcard. The SIM is controlled directly from the SGOLD. SIM_RST O Reset for chipcard SIM_IO I/O Data pin for chipcard

VDD_SIM O Switchable power supply for chipcard;

The Z1601 is a 3-channel filter with over-voltage and ESD Protection array which is designed to provide filtering of undesired RF signals. Additionally diodes are contained to protect downstream components from Electrostatic Discharge (ESD) voltages

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13.5 Nano IO Connector with ESD protection

IO Connector

Pin Name IN/OUT Notes 1 D+/RTS I/O Use as RTS in data-operation. 2 D+/CTS I/O Data-line for accessory-bus

Use as CTS in data operation. 3 TX O Serial interface 4 RX I Serial interface 5 GND 6 FLASH/DCD I/O Clock-line for accessory-bus.

Use as DTC in data-operation. 7 POWER I/O POWER is needed for charging batteries and for supplying

the accessories. If accessories are supplied by mobile, talk-

time and standby-time from telephone are reduced.

Therefore it has to be respected on an as low as possible

power consumption in the accessories. 8 GND_MIC Analog I for ext. microphone driving ext. left speaker

9 MICP2 Analog I External microphone 10 AUDIO_R Analog O driving ext. right speaker

With mono-headset Audio_L and Audio_R differential Signal 11 AUDIO_REF Analog O mid-voltage in stereo mode refernce to AUDIO_L and

AUDIO_R in mono mode not used 12 AUDIO_L Analog O driving ext. left speaker

With mono-headset Audio_L and Audio_R differential mode

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ESD Protection with EMI filter The Z1501 is a 5-channel filter with over-voltage and ESD Protection array which is designed to

provide filtering of undesired RF signals in the 800-4000MHz frequency band Additionally the Z1501 contains diodes to protect downstream components from Electrostatic Discharge (ESD) voltages

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13.6 Display Connector

Pin Number Pin Name Description 1 DISP_RESET1 Display Reset 2 DISP_D1 Data Line 3 DISP_D0 Data Line 4 GND Ground 5 DISP_CD Data command select signal 6 2,9V Power Supply 7 2,65V Power Supply for LED 8 DISP_CS1 Chipset signal 9 LCD_BCKLT Signal for Backlight Illumination 10 VBOOST Power Supply for LED 11 DISP_VD Synch Pin 12 GND Ground 13 DISP_WR Write signal 14 DISP_RD Read signal 15 DISP_D2 Data Line 16 DISP_D3 Data Line 17 DISP_D4 Data Line 18 DISP_D5 Data Line 19 DISP_D6 Data Line 20 DISP_D7 Data Line 21 GND Ground 22 GND Ground 23 GND Ground 24 GND Ground

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13.7 MMI Connector

Pin Number Pin Name Description 1 VBOOST Power Supply for LED 2 GND Ground 3 KP_OUT2 Keypad Matrix Line 4 KP_OUT1 Keypad Matrix Line 5 KP_OUT0 Keypad Matrix Line 6 KP_IN0 Keypad Matrix Line 7 KP_IN1 Keypad Matrix Line 8 KP_IN2 Keypad Matrix Line 9 KP_IN3 Keypad Matrix Line 10 KP_IN4 Keypad Matrix Line 11 KP_ON_OFF ON OFF Key 12 KPD_BCKLT Signal for Keypad Illumination 13 KP_OUT3 Keypad Matrix Line 14 KPI_IN5_OUT6 Keypad Matrix Line

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13.8 Camera Connector

Pin Number Pin Name Description 1 GND Ground 2 CAM_CLKOUT Camera Clock Signal 3 GDN Ground 4 CAM_PCLK Pixel Clock Signal 5 GND Ground 6 I2C_2_DAT I2C Bus Data Line 7 I2C_2_CLKT I2C Bus Clock Line 8 GND Ground 9 CAM_HSYNC Horizontal Synch Line 10 CAM_VSYNC Vertical Synch Line 11 GND Ground 12 CAM_DAT7 Data Line 13 CAM_DAT6 Data Line 14 CAM_DAT5 Data Line 15 CAM_DAT4 Data Line 16 CAM_DAT3 Data Line 17 CAM_DAT2 Data Line 18 CAM_DAT1 Data Line 19 CAM_DAT0 Data Line 20 DVDD Camera Voltage Supply from N3500

14 E71 Diagram Sets

Double click the tag symbol to open the files.

TD_Repair_E71

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Siemens E71 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual