I
Siemens Building Technologies
Cerberus Division
06.2000
1 Introduction .................................................................................. 1
1.1 Document overview.......................................................................... 1
1.2 Related publications ........................................................................ 1
2 Product description ....................................................................... 2
2.1 The CPU board............................................................................... 2
2.2 The connection board ...................................................................... 3
2.3 The network configuration of CBS-3 ................................................... 4
3 CPU board configuration ............................................................... 5
3.1 Introduction .................................................................................... 5
3.2 Configuration by dip-switches ........................................................... 5
3.2.1 Subsystem setting........................................................................... 5
3.2.2 Cerban vitality telegram.................................................................... 6
3.3 Configuration by Flash EPROM......................................................... 6
4 Hardware installation ..................................................................... 7
4.1 Inside the CS4 ................................................................................ 7
4.2 Inside the CS11 .............................................................................. 8
4.3 Power supply.................................................................................. 8
5 Cables and connections .................................................................9
5.1 Connection to GW-20 ...................................................................... 9
5.2 Connection to GW-21 ...................................................................... 9
5.3 Connection to an user-provided device..............................................10
6 Baud rates....................................................................................10
7 Dip-switches description ..............................................................11