SICK TriSpector1000,TriSpector1008,TriSpector1030,TriSpector1060 Operating Instructions Manual
TriSpector1000
3D Vision
O P E R A T I N G I N S T R U C T I O N S
Described product
2011/65/EU
TriSpector1000
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be
reserved for SICK AG. Reproduction of this document or parts of this document is only
permissible within the limits of the legal determination of Copyright Law. Any modifica‐
tion, abridgment or translation of this document is prohibited without the express writ‐
ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
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Contents
CONTENTS
1 About this document........................................................................ 7
1.1 Information on the operating instructions.............................................. 7
1.2 Explanation of symbols............................................................................ 7
1.3 Further information................................................................................... 8
2 Safety information............................................................................ 9
2.1 Intended use............................................................................................. 9
2.2 Improper use............................................................................................. 9
2.3 Laser safety............................................................................................... 9
3 Product description........................................................................... 10
3.1 System overview....................................................................................... 10
3.2 Scope of delivery....................................................................................... 10
3.3 System requirements............................................................................... 11
3.4 TriSpector1000 variants.......................................................................... 11
3.5 Dimensional drawings.............................................................................. 11
3.5.1 TriSpector1008........................................................................ 12
3.5.2 TriSpector1030........................................................................ 12
3.5.3 TriSpector1060........................................................................ 13
3.6 LED indicators........................................................................................... 13
4 Transport and storage....................................................................... 15
4.1 Transport................................................................................................... 15
4.2 Transport inspection................................................................................. 15
4.3 Storage...................................................................................................... 15
5 Mounting............................................................................................. 16
5.1 Mounting instructions............................................................................... 16
5.1.1 Mounting a microSD memory card......................................... 16
5.2 Field of view diagrams.............................................................................. 17
6 Electrical installation........................................................................ 18
6.1 Prerequisites for the safe operation of the device in a system............. 18
6.2 Connection diagram................................................................................. 19
6.3 Encoder..................................................................................................... 19
6.4 Pin assignment......................................................................................... 20
7 Operation............................................................................................ 22
7.1 Commissioning......................................................................................... 22
7.1.1 Installing SOPAS....................................................................... 22
7.1.2 Connecting the hardware........................................................ 22
7.1.3 Connecting the TriSpector1000 to SOPAS ET........................ 22
7.2 Description of the user interface............................................................. 23
7.2.1 Menus....................................................................................... 24
7.2.2 Image handling controls.......................................................... 24
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CONTENTS
7.2.3 Image view modes................................................................... 25
7.2.4 Image view options.................................................................. 26
7.2.5 Image view controls................................................................. 27
7.3 Handling jobs and configurations............................................................ 27
7.4 Workflow steps.......................................................................................... 28
7.5 Image workflow step.................................................................................. 29
7.5.1 Scanning an object.................................................................. 29
7.5.2 Setting the field of view........................................................... 30
7.5.3 Adjusting the image settings................................................... 30
7.5.4 Configuring the trigger settings.............................................. 31
7.5.5 Recording images.................................................................... 32
7.6 Task workflow step..................................................................................... 32
7.6.1 Using the tools......................................................................... 32
7.6.2 Setting the region of interest.................................................. 33
7.6.3 Tool groups............................................................................... 34
7.6.4 Shape tool.................................................................................. 34
7.6.5 Blob tool.................................................................................... 35
7.6.6 Edge tool.................................................................................... 36
7.6.7 Plane tool................................................................................... 37
7.6.8 Fix Plane tool.............................................................................. 38
7.6.9 Peak tool.................................................................................... 38
7.6.10 Point tool................................................................................... 39
7.6.11 Area tool.................................................................................... 39
7.6.12 Distance tool.............................................................................. 40
7.6.13 Angle tool................................................................................... 40
7.6.14 Application example: Counting chocolates............................ 41
7.7 Results workflow step................................................................................ 43
7.7.1 Result handling........................................................................ 43
7.7.2 Tool result output..................................................................... 43
7.7.3 Decision model........................................................................ 44
7.7.4 Conditions................................................................................ 44
7.7.5 Digital outputs.......................................................................... 46
7.7.6 Ethernet output string............................................................. 46
7.7.7 Image logging........................................................................... 47
7.7.8 Functions and operators......................................................... 47
7.8 Interfaces workflow step............................................................................ 50
7.8.1 Configuring the digital in- and outputs................................... 50
7.8.2 Using the command channel.................................................. 50
7.8.3 Sending an output string......................................................... 50
7.8.4 Logging images to an FTP server............................................ 51
7.8.5 Enabling the web interface..................................................... 51
7.8.6 Setting parameters of the serial interface............................. 52
7.8.7 Logging images to a microSD memory card.......................... 52
7.8.8 Selecting jobs via digital inputs.............................................. 54
7.8.9 Fieldbuses................................................................................ 54
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7.9 Using the SOPAS ET emulator.................................................................. 54
7.9.1 Starting the emulator.............................................................. 54
7.9.2 Controlling the emulator.......................................................... 55
7.9.3 Selecting images to be used................................................... 56
7.9.4 Copying a configuration from the emulator........................... 56
7.10 Exporting and importing data.................................................................. 56
8 Maintenance...................................................................................... 58
8.1 Cleaning..................................................................................................... 58
8.2 Upgrading the firmware............................................................................ 58
8.3 Data backup and restoration................................................................... 58
9 Troubleshooting................................................................................. 59
9.1 General faults, warnings, and errors....................................................... 59
9.2 Repairs...................................................................................................... 60
9.3 Returns...................................................................................................... 60
9.4 Disposal..................................................................................................... 60
10 Technical data.................................................................................... 61
10.1 Features.................................................................................................... 61
10.2 Ambient data............................................................................................. 61
10.3 Interfaces.................................................................................................. 61
10.4 Mechanics and electronics...................................................................... 62
10.5 Input switching levels............................................................................... 62
10.6 Output switching levels............................................................................. 63
10.7 Performance............................................................................................. 63
11 Accessories........................................................................................ 64
12 Appendix............................................................................................. 65
12.1 Declarations of conformity....................................................................... 65
12.2 Licenses.................................................................................................... 66
12.3 Available commands for command channel........................................... 67
12.3.1 Sending a command............................................................... 67
12.3.2 Command examples................................................................ 67
12.3.3 General commands................................................................. 67
12.3.4 Tool commands........................................................................ 69
12.4 Connecting TriSpector1000 to CDF600-2200....................................... 72
12.5 Setting up a TriSpector1000 to communicate via EtherNet/IP............. 73
12.5.1 Interfacing TriSpector1000 with an Allen Bradley/Rockwell
Programmable Controller........................................................ 73
12.5.2 Input and Output Data Assemblies - TriSpector1000........... 74
12.5.3 Inside the Programmable Controller...................................... 77
12.5.4 Triggering a TriSpector1000.................................................... 80
12.5.5 Switching Jobs.......................................................................... 82
12.5.6 TriSpector1000 EtherNet/IP Compatibility............................ 84
12.6 TriSpector1000 Result Output Function Block....................................... 85
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CONTENTS
12.6.1 About this document............................................................... 85
12.6.2 Overview................................................................................... 86
12.6.3 TriSpector1000 configuration................................................. 86
12.6.4 PLC Configuration.................................................................... 87
12.6.5 Modify the Function Block to fit your output.......................... 94
12.6.6 Troubleshooting....................................................................... 100
12.6.7 Function block differences...................................................... 102
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1 About this document
1.1 Information on the operating instructions
These operating instructions provide important information on how to use devices from
SICK AG.
Prerequisites for safe work are:
Compliance with all safety notes and handling instructions supplied.
•
Compliance with local work safety regulations and general safety regulations for
•
device applications
The operating instructions are intended to be used by qualified personnel and electrical
specialists.
NOTE
Read these operating instructions carefully before starting any work on the device, in
order to familiarize yourself with the device and its functions.
The instructions constitute an integral part of the product and are to be stored in the
immediate vicinity of the device so they remain accessible to staff at all times. Should
the device be passed on to a third party, these operating instructions should be handed
over with it.
ABOUT THIS DOCUMENT 1
These operating instructions do not provide information on operating the machine or
system in which the device is integrated. For information about this, refer to the operat‐
ing instructions of the specific machine.
1.2 Explanation of symbols
Warnings and important information in this document are labeled with symbols. The
warnings are introduced by signal words that indicate the extent of the danger. These
warnings must be observed at all times and care must be taken to avoid accidents, per‐
sonal injury, and material damage.
DANGER
… indicates a situation of imminent danger, which will lead to a fatality or serious
injuries if not prevented.
WARNING
… indicates a potentially dangerous situation, which may lead to a fatality or serious
injuries if not prevented.
CAUTION
… indicates a potentially dangerous situation, which may lead to minor/slight injuries if
not prevented.
NOTICE
… indicates a potentially harmful situation, which may lead to material damage if not
prevented.
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1 ABOUT THIS DOCUMENT
NOTE
… highlights useful tips and recommendations as well as information for efficient and
trouble-free operation.
1.3 Further information
NOTE
Further documentation for the device can be found on the online product page at:
www.sick.com/TriSpector1000
The following information is available for download there:
■
Model-specific online data sheets for device variants, containing technical data,
dimensional drawings and diagrams.
■
EU declaration of conformity for the product family.
■
Dimensional drawings and 3D CAD dimension models in various electronic for‐
mats.
■
These operating instructions.
■
The device quickstart, in English and German.
■
Other publications related to the device described here.
■
Publications dealing with accessories.
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2 Safety information
2.1 Intended use
The TriSpector1000 is an industrial 3D sensor that uses laser triangulation on objects
to produce 3D images. Embedded 3D image analysis tools are applied to the 3D
images. The results are sent to a control system via external interfaces.
The TriSpector1000 series is primarily designed for use in industrial and logistics areas,
and it meets the requirements for industrial ruggedness, interfaces and data process‐
ing.
2.2 Improper use
Any use outside of the stated areas, in particular use outside of the technical specifica‐
tions and the requirements for intended use, will be deemed to be incorrect use.
The device does not constitute a safety-relevant device according to the EC
•
Machinery Directive (2006/42/EC).
The device must not be used in explosion-hazardous areas, in corrosive environ‐
•
ments or under extreme ambient conditions.
Any use of accessories not specifically approved by SICK AG is at your own risk.
•
SAFETY INFORMATION 2
2.3
Laser safety
The TriSpector1000 is equipped with a Class 2 laser according to EN/IEC
60825-1:2014 (Class 2M according to EN/IEC 60825-1:2007). It complies to 21 CFR
1040.10 except for deviations pursuant to Laser Notice No.50, dated June 24, 2007.
The legal regulations on laser safety for the laser class of TriSpector1000 must be
adhered to.
CAUTION
Optical radiation: Laser class 2
The human eye is not at risk when briefly exposed to the radiation for up to 0.25 sec‐
onds. Exposure to the laser beam for longer periods of time may cause damage to the
retina. The laser radiation is harmless to human skin.
■
Do not look into the laser beam intentionally.
■
Never point the laser beam at people's eyes.
■
If it is not possible to avoid looking directly into the laser beam, e.g., during com‐
missioning and maintenance work, suitable eye protection must be worn.
■
Avoid laser beam reflections caused by reflective surfaces. Be particularly careful
during mounting and alignment work.
■
Do not open the housing. Opening the housing will not switch off the laser. Open‐
ing the housing may increase the level of risk.
■
Current national regulations regarding laser protection must be observed.
NOTICE
If the TriSpector1000 is mounted in a system or a casing, so that the laser safety notice
signs are hidden, additional signs must be placed beside the exit aperture of the laser
beam on the system or casing. Additional signs are not included in the delivery.
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21
3 PRODUCT DESCRIPTION
3 Product description
3.1 System overview
The TriSpector1000 uses laser triangulation on objects to produce 3D images. Embed‐
ded 3D image analysis tools are applied to the 3D images. The results are sent to a
control system via external interfaces.
Laser triangulation means that the object is illuminated with a laser from one direction,
and the camera acquires an image of the laser line from another direction. Each
acquired image contains a height profile, which corresponds to a cross-section of the
object. By making a scan, which means collecting height profiles across the object
while it moves, a complete 3D image can be acquired.
3.2
Figure 1: Laser triangulation principle
1
2
Figure 2: Height profile Figure 3: 3D image
Scope of delivery
The delivery of the device includes the following components:
■
TriSpector1000 series sensor
■
Printed quickstart in English and German
■
Printed safety notes
Accessories
Accessories, such as brackets and connecting cables, are only supplied if ordered sep‐
arately.
Field of view
Laser
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3.3 System requirements
For adequate SOPAS ET performance, use a PC with Intel Core I5 540M (2.53 GHz, 4
GB RAM) or better, and a screen resolution of at least 1024x768.
Graphics card: Intel® HD Graphics video card (or NVIDIA® NVS 3100M 512MB
GDDR3), or better. Make sure to use the latest graphic card drivers.
Ethernet connection is required, 100 Mbit/s or better. 1 Gbit/s or faster is recom‐
mended for best performance during configuration of the device via SOPAS ET.
Operating systems: Windows 7 or Windows 10 (64 bit is recommended).
SOPAS ET version: 2018.2 or higher
Hard drive: Minimum 550 MB.
Supported web browsers: Google Chrome (recommended due to advanced support of
WebGL and WebSockets) and Microsoft Edge.
SD memory card (optional): SICK microSD memory card (part no 4051366 or
4077575).
A mouse with at least three buttons (or a scroll wheel) is recommended.
3.4 TriSpector1000 variants
PRODUCT DESCRIPTION 3
TriSpector1000 is available with three different field of view (FoV) sizes and two differ‐
ent window materials. PMMA is a plastic material used as an alternative material to
glass in food processing environments.
Table 1: TriSpector1008 (Small FoV)
Window material No.
Glass 1075604
PMMA 1060426
Table 2: TriSpector1030 (Medium FoV)
Window material No.
Glass 1072923
PMMA 1060427
Table 3: TriSpector1060 (Large FoV)
Window material No.
Glass 1075605
PMMA 1060428
3.5 Dimensional drawings
See chapter 3.5.1, chapter 3.5.2 and chapter 3.5.3 for dimensional drawings for all
three TriSpector1000 variants. The dimensional drawings can also be downloaded as
CAD files from the TriSpector1000 device page at www.sick.com/TriSpector1000.
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61.9 (1.26)
27.9
(1.10)
2
(0.08)
34
(1.34)
38
(1.50)
18.5
(0.73)
136 (5.35)
145.9 (5.74)
9.9
(0.39)
5.6
(0.22)
24 (0.94)
24 (0.94)
18
82 (3.23)
83.3 (3.28)
45
(1.77)
7.4
(0.29)
47
(1.85)
94 (3.70)
21
(0.83)
á ß à
4 5 6 7 8
9
32
1
M12 x 1
M12 x 1
M12 x 1
1
2
4
á ß à
5 6 7 8
9
3
61.9 (2.44)
27.9
(1.10)
114.5 (4.51)
217 (8.54)
226.9 (8.93)
18.5
(0.72)
2
(0.08)
34
(1.34)
M12 x 1
M12 x 1
M12 x 1
45
(1.77)
7.4
(0.29)
61.5 (2.42)94 (3.70)
9.9
(0.39)
5.6
(0.22)
83.3 (3.28)
47 (1.85)
3 PRODUCT DESCRIPTION
3.5.1 TriSpector1008
3.5.2 TriSpector1030
12
Connector Encoder (thread inside)
1
Connector Gigabit Ethernet (Gig E)
2
Connector Power I/O (thread outside)
3
LED: On
4
LED: State
5
LED: Link/Data
6
LED: Result
7
LED: Laser
8
Fastening threads (M5x8.5 length)
9
Optical receiver (center)
ß
Optical sender (center)
à
SD-card
á
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1
61.9 (1.26)
27.9
(1.10)
205.5 (8.09)
307 (12.09)
316.9 (12.48)
2
(0.08)
34
(1.34)
18.5
(0.73)
45
(1.77)
7.4
(0.29)
47
(1.85)
94 (3.70)
106.5
(4.19)
9.9
(0.39)
5.6
(0.22)
24 (0.94)
24 (0.94)
18
(0.71)
82 (3.23)
83.3 (3.28)
á ß à
1
2
4 5 6 7 8
3
9
M12 x 1
M12 x 1
M12 x 1
2
3
4
5
6
7
8
9
ß
à
á
3.5.3 TriSpector1060
PRODUCT DESCRIPTION 3
Connector Encoder (thread inside)
Connector Gigabit Ethernet (Gig E)
Connector Power I/O (thread outside)
LED: On
LED: State
LED: Link/Data
LED: Result
LED: Laser
Fastening threads (M5x8.5 length)
Optical receiver (center)
Optical sender (center)
SD-card
3.6 LED indicators
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Connector Encoder (thread inside)
1
Connector Gigabit Ethernet (Gig E)
2
Connector Power I/O (thread outside)
3
LED: On
4
LED: State
5
LED: Link/Data
6
LED: Result
7
LED: Laser
8
Fastening threads (M5x8.5 length)
9
Optical receiver (center)
ß
Optical sender (center)
à
SD-card
á
Name Color Function
On
State
Link/Data
Green Power on
Green Ready for trig input and image acquisition
Green Gigabit Ethernet (Gig E)
Link: LED on
Activity: LED blink
13
3 PRODUCT DESCRIPTION
Name Color Function
Result
Laser
Green Overall result: Pass
Red Overall result: Fail
Blue Result not found
No light Result invalid or neutral
Green Laser on
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4 Transport and storage
4.1 Transport
For your own safety, please read and observe the following notes:
NOTICE
Damage to the product due to improper transport.
■
The device must be packaged for transport with protection against shock and
damp.
■
Recommendation: Use the original packaging as it provides the best protection.
■
Transport should be performed by trained specialist staff only.
■
The utmost care and attention is required at all times during unloading and trans‐
portation on company premises.
■
Note the symbols on the packaging.
■
Do not remove packaging until immediately before you start mounting.
TRANSPORT AND STORAGE 4
4.2
Transport inspection
4.3 Storage
Immediately upon receipt in Goods-in, check the delivery for completeness and for any
damage that may have occurred in transit. In the case of transit damage that is visible
externally, proceed as follows:
■
Do not accept the delivery or only do so conditionally.
■
Note the scope of damage on the transport documents or on the transport com‐
pany's delivery note.
■
File a complaint.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage
claims are only valid before the applicable complaint deadlines.
Store the device under the following conditions:
■
Recommendation: Use the original packaging.
■
Do not store outdoors.
■
Store in a dry area that is protected from dust.
■
So that any residual damp can evaporate, do not package in airtight containers.
■
Do not expose to any aggressive substances.
■
Protect from sunlight.
■
Avoid mechanical shocks.
■
Storage temperature: see "Ambient data", page 61.
■
Relative humidity: see "Ambient data", page 61.
■
For storage periods of longer than 3 months, check the general condition of all
components and packaging on a regular basis.
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5 MOUNTING
5 Mounting
5.1 Mounting instructions
Mount the TriSpector1000 in a position above the surface to be scanned. See "Field of
view diagrams", page 17 for field of view diagrams and mounting distances. The
default scan direction is shown in figure 4. If a scan is performed in the opposite direc‐
tion, the acquired image will be mirrored.
Figure 4: Mounting position
For optimal performance:
■
Observe the ambient conditions for the operation of the TriSpector1000 (for exam‐
ple, ambient temperature and ground potential). See "Technical data", page 61
for specifications.
■
Ensure adequate heat transfer from the device, for example, via the mounting
bracket to the mounting base, or by means of convection.
■
Use a stable bracket with sufficient load bearing capacity and suitable dimensions
for the TriSpector1000.
■
Minimize shock and vibration.
■
Ensure a clear view of the objects to be detected.
5.1.1 Mounting a microSD memory card
NOTICE
If the TriSpector1000 is powered on, click the Eject button in the SD Card section under
the Interfaces workflow step before removing the microSD memory card.
NOTICE
The screws for the microSD memory card lid must be tightened with a torque of 0.3 Nm
to keep the IP65 classification.
16
Follow the steps below to insert or remove a microSD memory card to or from the
TriSpector1000. The microSD memory card slot is located next to the inspection win‐
dow.
1. Release the two screws to remove the lid.
2. Insert or remove the microSD memory card.
3. Re-mount the lid and tighten the screws with a torque of 0.3 Nm.
For a specification of supported microSD memory cards, see "System requirements",
page 11.
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5.2 Field of view diagrams
56
(2.20)
60
(2.36)
75
(2.95)
H
W
65 x 15
(2.56 x 0.59)
40
(1.57)
TriSpector1008
291
(11.46)
800
(31.50)
660
(25.98)
H
W
540 x 200
(21.26 x 7.87)
180
(7.09)
TriSpector1060
141
(5.55)
400
(15.75)
330
(12.99)
H
W
270 x 100
(10.63 x 3.94)
90
(3.54)
TriSpector1030
Y
X
TriSpector1000
Y = Max. height range
X = Width at max.
working distance
Typical field of view
TriSpector1008
TriSpector1030
TriSpector1060
The maximum guaranteed image acquisition area in mm (inch) for each TriSpector1000
variant is shown in figure 5. The brighter areas represent typical image acquisition
areas.
MOUNTING
5
Figure 5: Field of view diagrams
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ELECTRICAL INSTALLATION
6
6 Electrical installation
6.1 Prerequisites for the safe operation of the device in a system
WARNING
Risk of injury and damage due to electrical current!
Incorrect grounding of the device can result in equipotential bonding currents between
the device and other grounded devices in the system. This can lead to the following
dangers and faults:
Hazardous voltages are applied to the metal housings.
•
Devices will malfunction or sustain irrepairable damage.
•
Cable shieldings are damaged by overheating and cause cable fires.
•
Remedial measures:
Only qualified electricians should be permitted to carry out work on the electrical
•
system.
Install the grounding for the sensor and the system in accordance with national
•
and regional regulations.
Ensure that the ground potential is the same at all grounding points.
•
If the cable insulation is damaged, disconnect the voltage supply immediately and
•
have the damage repaired.
Observe the following safety measures:
■
Only skilled electricians with appropriate training and qualifications are permitted
to perform electrical installation.
■
Standard safety requirements must be met when working in electrical systems.
■
Electrical connections between the TriSpector1000 and other devices may only be
made or disconnected when there is no power to the system. Otherwise, the
devices may be damaged.
■
Where connecting cables with one end open are concerned, make sure that bare
wire ends do not touch each other (risk of short circuit when the supply voltage is
switched on). Wires must be appropriately insulated from each other.
■
Wire cross sections of the supply cable from the customer's power system should
be designed and protected in accordance with the applicable standards.
■
If the supply voltage for the TriSpector1000 is not supplied via the CDB650-204
connection module, the TriSpector1000 must be protected by a separate slowblow fuse with a max. rating of 2.0 A. This fuse must be located at the start of the
supply circuit.
■
All circuits connected to the TriSpector1000 must be designed as SELV circuits
(SELV = Safety Extra Low Voltage).
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6.2 Connection diagram
Power
I/O
Gig
E
Encoder
On
State
Link/Data
Result
Laser
PC
24 V DC
Encoder
Photoelectric
switch
1
2
3
4
Figure 6: Connection diagram
Encoder
1
PC/Network
2
Photoelectric switch
3
24 V DC, voltage supply
4
ELECTRICAL INSTALLATION 6
6.3 Encoder
NOTICE
It is strongly recommended to use an encoder for measuring applications, such as
shape measuring and volume measuring. If no encoder is used, analysis results may be
inaccurate due to object traversing speed variations.
The encoder must fulfill the following requirements:
■
The encoder must be an incremental encoder.
■
The encoder must have a RS-422/TTL interface. In the case of strong magnetic
fields in proximity to the TriSpector1000 a recommended encoder (no. 1068997)
must be used to ensure optimal performance.
■
The connection requires two encoder channels (A/A¯ and B/B¯) to keep track of
movement and direction.
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4
3
6
5
7
8
1
2
4
3
6
5
7
8
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2
6 ELECTRICAL INSTALLATION
6.4 Pin assignment
Encoder I/O
Figure 7: M12 female connector, 8-pin A-coded
Pin Signal
1 A/ - RS-422 inverted input
2 A - RS-422 non-inverted input
3 B/ - RS-422 inverted input
4 B - RS-422 non-inverted input
5 (Not connected)
6 (Not connected)
7 GND (Power / Signal)
8 24 V Voltage supply output
Gigabit Ethernet
Figure 8: M12 female connector, 8-pin X-coded
Pin Signal
1 GETH_L1+
2 GETH_L1-
3 GETH_L2+
4 GETH_L3+
5 GETH_L3-
6 GETH_L2-
7 GETH_L4+
8 GETH_L4-
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7
2
1
10
12
3
4
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8
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ELECTRICAL INSTALLATION 6
Power I/O
Figure 9: M12 male connector, 12-pin A-coded
Pin Signal
1 24 V Voltage supply input
2 Ground (Power / Signal)
3 24 V - I/O 3, Trigger in
4 24 V - I/O 4, Configurable
5 24 V - I/O 2, Input
6 24 V - I/O 5, Configurable
7 24 V - I/O 6, Configurable
8 24 V - I/O 1, Input
9 24 V - I/O 7, Configurable
10 Reserved
11 RS-232 Rx
12 RS-232 Tx
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7 OPERATION
7 Operation
7.1 Commissioning
7.1.1 Installing SOPAS
The SOPAS Engineering Tool (ET) software for PC is used to connect and configure SICK
devices.
To install SOPAS ET:
1. Download the latest version of SOPAS ET from www.sick.com. Version 2018.2 or
higher is required.
2. Run the downloaded installation file.
3. Follow the instructions on the screen.
7.1.2 Connecting the hardware
1. Connect the Ethernet cable between the TriSpector1000 and the PC.
2. Connect the TriSpector1000 Power I/O cable to a 24 V DC power supply:
Brown: +24 V DC, Pin 1
Blue: Ground, Pin 2
3. Connect the encoder cable between the TriSpector1000 and the encoder (if
applicable).
7.1.3 Connecting the TriSpector1000 to SOPAS ET
1. Start SOPAS ET.
✓
The SOPAS ET main window opens. The main window is split into two panes, the
project pane to the left and the device pane to the right.
NOTICE
At the first use, the TriSpector1000 requires a SICK Device Driver (SDD). When
adding the device to a project, a prompt will appear with instructions on how to
install the driver. When prompted for SDD installation source, select Device upload.
NOTE
In the device list, the TriSpector1000 device is available on port 2111 and 2112.
Do not use port 2111. This port is used for debugging and may decrease the oper‐
ation speed.
2. To add the TriSpector1000 to the SOPAS project, select the device on port 2112 in
the device pane and click Add.
✓
A product icon appears in the project pane.
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Figure 10: SOPAS ET main window
2
4 5
1
3
6
OPERATION 7
3. Double-click the product icon to open the SOPAS ET device window and start the
4. If there are IP address connection issues, click the Edit icon in the device tile to
7.2
Description of the user interface
The TriSpector1000 is configured through the SOPAS ET device window.
configuration.
make adjustments. The default IP address is 192.168.0.30.
Figure 11: SOPAS ET device window
Image area
1
Image handling controls and view options
2
Parameter pane
3
Workflow steps
4
Controls for image view, image recording (red), and Force trigger
5
SOPAS ET functions panel
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7 OPERATION
7.2.1 Menus
Three menus are available in the SOPAS ET functions panel: the Device menu, the Para‐
meter menu and the Functions menu.
Device menu
Go online Establish a connection between SOPAS ET and the TriSpec‐
tor1000.
Go offline Switch the connection mode to offline. In this mode, parameter
values cannot be written to the device and measurements cannot
be monitored. The connection information in SOPAS ET remains
intact.
Switch to physical device Switch from the emulator to the TriSpector1000 and import the
configuration. This option is only enabled when running the emula‐
tor. For details, see "Copying a configuration from the emulator",
page 56.
Switch to simulated device Switch from the TriSpector1000 to the emulator. For details, see
"Starting the emulator", page 54.
Login... Log in to the device at a certain user level. When a device is added
to a SOPAS project, the user level is automatically set to Authorized
Client, which is the required level for saving parameter values to
the device. The current user level is shown below the image area.
Logout Cancel the login. Once the user has logged out, parameters
secured by the user level can no longer be changed.
Import... Import a saved device configuration from a PC. For details,
see "Exporting and importing data", page 56.
Export... Export the current device configuration to a PC. For details,
see "Exporting and importing data", page 56.
Create PDF Create a PDF which includes device parameters and their values.
Properties Open the Device Settings window.
Close Close the SOPAS ET device window.
Parameter menu
Write to device Write the configuration saved in the SOPAS project to the device.
Read from device Read the configuration from the device and saves it in the SOPAS
Save permanent Save the configuration in the device flash memory and to the
Functions menu
Load factory defaults Reset all SOPAS ET parameters including IP address.
Load application defaults Reset all SOPAS ET parameters except IP address.
Save image to file Save the current image to disk.
Image recording Save multiple images to disk. For details, see "Recording images",
7.2.2 Image handling controls
Use the image handling controls to manipulate regions and perspective when viewing
images. As an alternative to the buttons, you can use a mouse with a scroll wheel, as
described below.
project.
microSD memory card (when applicable).
page 32.
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Z
XY
OPERATION 7
Button Name Description
Select Click and drag to change the size and position of the image.
Shortcut command: Ctrl+Q.
Move Click and drag to move the image.
Shortcut command: Ctrl+W.
Shift+ press and hold the mouse scroll wheel.
Rotate Click and drag to rotate the image.
Shortcut command: Ctrl+E.
Press and hold the mouse scroll wheel.
Zoom Click and drag upwards to zoom in and downwards to zoom out.
Shortcut command: Ctrl+R.
Rotate the mouse scroll wheel.
3D navigation control
Use the 3D navigation control in the lower left corner of the image viewer to switch
between different viewing angles:
•
•
•
Figure 12: 3D navigation control
7.2.3 Image view modes
The following view modes are available:
View mode Description Example
Reflectance Color is proportional to the
Reflectance
(Hybrid)
Click an arrowhead (X, Y or Z) to view a 2D projection of the object.
Click the same arrowhead twice to flip the 2D projection (for example, to switch
between the top and bottom view for the Z-axis).
Press Home to restore the original viewing position.
reflectance values along the
laser line.
Suitable to show the surface
details of an object, such as a
print.
Figure 13: Reflectance view mode
Color is proportional to depth (zcoordinate), color brightness is
proportional to the laser
reflectance.
Suitable to show large variations
in depth together with surface
details.
Figure 14: Reflectance (Hybrid) view mode
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7 OPERATION
View mode Description Example
Normals Color is proportional to the ori‐
entation of the surface normal
vector.
Suitable to show small varia‐
tions in depth, such as surface
structures.
Figure 15: Normals view mode
X Color is proportional to x-coordi‐
nate.
Figure 16: X view mode
Y Color is proportional to y-coordi‐
nate.
Z Color is proportional to depth (z-
7.2.4 Image view options
The Color and Options buttons contain image view options.
Button Name Description
b
Figure 17: Y view mode
coordinate).
Suitable to show large variations
in depth.
Figure 18: Z view mode
Color View image in color or grayscale
Options Contains options for Color Range, Grid, Surface and Points, as described
below.
Click Color Range to adjust the color interval of the displayed image. This option is
only applicable for the X, Y, Z and Reflectance view modes.
The available color spectrum covers the whole range between the minimum and
the maximum value. Make the interval smaller if the scanned object is small, or to
view a part of the object in detail. This means that the whole color spectrum is
spread over a smaller interval, and it will be easier to see small variations in
depth.
Applied color range Resulting image
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b
b
7.2.5 Image view controls
OPERATION 7
Narrow color
range
Broad color
range
Click Grid to show or hide the grid at the bottom of the field of view.
Click Surface to view the image as a continuous surface, or Points to view the image
as a point cloud. The point size can be adjusted by the user.
The image view controls are used to switch between the Live 3D image, the Job image,
and the Sensor view. Different image view controls are available in different workflow
steps.
Image view Description
Job Show the job image stored with the Save job image button.
Live 3D Display the latest scanned image.
Sensor Display the object as perceived by the image sensor. Use this view to adjust
image acquisition settings.
7.3 Handling jobs and configurations
A set of image, task and result settings is referred to as a job in SOPAS ET, while a set
of jobs and interface settings is referred to as a configuration.
Use SOPAS ET to manage jobs and to save the resulting configuration. A maximum of
32 jobs can be included in a configuration. Up to 32 tools can be applied to each job,
but only one Shape tool.
Loading a configuration
When powering on the TriSpector1000, the configuration stored on the microSD mem‐
ory card is automatically loaded into the device's working memory. If no microSD mem‐
ory card is inserted, or if there is no configuration stored on the microSD memory card,
the configuration is loaded from the device's flash memory to the working memory.
Managing jobs
Click the Select job menu in the SOPAS ET functions panel to manage and select jobs.
At the first use of the TriSpector1000, a new job ('Job 0') is created in the device's work‐
ing memory. When an existing configuration is loaded into the device's working memory,
the job that was active when the configuration was saved is automatically activated.
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7 OPERATION
Saving a configuration
NOTICE
If a configuration is not saved before disconnecting the power to the device, all settings
will be lost.
Select Save permanent from the Parameter menu in the SOPAS ET functions panel to save
a configuration from the device's working memory to the flash memory. If the device
has a microSD memory card inserted, the configuration is saved to both the flash mem‐
ory and the microSD memory card.
Cloning a device using a microSD memory card
Follow the steps below to clone a device, which means copying the configuration and IP
address from one device to another. The instruction requires that the first device has a
microSD card inserted and is connected to SOPAS ET.
1. In SOPAS ET, select Save permanent from the Parameter menu to save the current
configuration to the microSD memory card.
2. Move the microSD memory card from the first to the second device.
3. Power on the second device.
✓
The configuration on the microSD memory card is loaded into the working memory
of the second device.
4. Select Save permanent from the Parameter menu in the SOPAS ET functions panel to
save the configuration to the device's flash memory.
7.4 Workflow steps
To configure the TriSpector1000, click the workflow steps in the user interface (see
figure 19). It is possible to change workflow step at any time during the configuration.
Figure 19: Workflow steps
Image
The Image workflow step is used to set up image acquisition for good image quality. Two
different views are available: Live 3D and Sensor. See "Image workflow step", page 29
for more information.
Task
The Task workflow step contains tools for image analysis. Two different views are avail‐
able: Live 3D and Job. The Job image is the reference image where the tools are applied
and the tool configuration is done. See "Task workflow step", page 32 for more infor‐
mation.
Results
The Results workflow step contains settings for result processing and output handling.
Note that a bold red underscore in the input fields indicates syntax error. See "Results
workflow step", page 43 for more information.
28
Interfaces
The Interfaces workflow step contains settings for connections to external interfaces.
See"Interfaces workflow step", page 50 for more information.
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7.5 Image workflow step
Scan
No scan
Forward scanning direction
Motion
Position Up
Direction Up
Scan
No scan
Scan
7.5.1 Scanning an object
The TriSpector1000 builds the image by acquiring a number of laser line profiles of a
moving object. Use an encoder if motion is not constant.
1. In the Motion section, select Profile trigger:Free running or Incremental encoder and
specify the parameters accordingly. If applicable, click Calculate for assistance with
encoder calculation. See "Encoder modes", page 29 for descriptions of the
encoder modes.
2. Move the object under the TriSpector1000 laser line to make a scan.
7.5.1.1 Encoder modes
The TriSpector1000 has a two directional (up/down) encoder pulse counter. The for‐
ward (up) scanning direction is defined as clockwise encoder shaft movement, as seen
from the tip of the shaft. See the Current speed parameter in the Image workflow step for
traversing speed. There are five encoder pulse counter-modes: direction up/down, posi‐
tion up/down and motion.
OPERATION
7
Figure 20: Encoder pulse counter-modes
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7 OPERATION
7.5.2 Setting the field of view
Figure 21: Field of view
The field of view consists of two regions displayed in the image area:
■
Guaranteed field of view (green region): The field of view where image acquisition
is possible. The guaranteed field of view for the TriSpector1000 consists of 2500
profiles, and the region length is determined by the Profile distance parameter.
■
Selected field of view (blue region): The region in which the camera acquires range
data for image analysis. The Width and Height of this region are set to maximum by
default. The default Length depends on the device model (120-480 mm).
Adjust the field of view to optimize performance:
■
Edit the Profile distance parameter in the Motion section in the parameter pane to
change the length of the guaranteed field of view. A smaller profile distance allows
a higher scan density but reduces the region length.
■
Use the value boxes in the Field of view section in the parameter pane to resize the
selected field of view. A smaller region allows faster processing and higher profile
frequency rate.
■
Make the pixels in the selected field of view more square by setting the X-resolution
parameter to a value similar to the Profile distance parameter.
NOTE
If the X-resolution and the profile distance differ more than a factor 3, some tools may
not work properly.
7.5.3 Adjusting the image settings
To adjust the image settings to get a good 3D image:
1. Click the Sensor button located above the image area to see the laser profile which
can be used as reference when adjusting the exposure time and gain. See "Laser
line exposure time", page 31 for examples.
2. Click the Live 3D button and perform a scan.
3. In the Acquisition section, adjust the Exposure time and Gain until the 3D live view
looks good.
Try to keep the gain low, and instead increase the exposure time. This will reduce
noise in the image.
4. Adjust the Laser threshold parameter to determine which image sensor intensity val‐
ues to include when locating laser peaks. A high threshold value results in less
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