Shuttle HOT-675V User Manual
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HOT-675V
Pentium™ II processor
Based AGP MAIN BOARD
User's Manual
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FCC Notice:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy. If not installed and used properly, in strict accordance with the manufacturer’s instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures :
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/television technician for help and for additional suggestions.
The user may find the following booklet prepared by the Federal Communications Commission helpful “How to Identify
and Resolve Radio-TV Interference Problems.” This booklet is available from the U.S. Government Printing Office.
Washington, DC 20402, Stock 004-000-00345-4
FCC Warning
The user is cautioned that changes or modifications not expressly approved by the manufacturer could void the user’s
authority to operate this equipment.
Note : In order for an installation of this product to maintain compliance with the limits for a Class B device, shielded
cables and power cord must be used.
CE Notice:
Following standards were applied to this product, in order to achieve compliance with the electromagnetic
compatibility :
- Immunity in accordance with EN 50082-1: 1992
- Emissions in accordance with EN 55022: 1987 Class B.
NOTICE
Copyright 1998.
All Right Reserved
Manual Ver 1.0
All information, documentation, and specifications contained in this manual are subject to change without prior
notification by the manufacturer.
The author assumes no responsibility for any errors or omissions which may appear in this document nor does
it make a commitment to update the information contained herein.
TRADEMARKS
Intel is a registered trademark of Intel Corporation
VIA is a registered trademark of VIA Technologies, INC.
PC/AT is a registered trademark of International Business Machine Corporation.
PS/2 is a registered trademark of IBM Corporation.
All other brand and product names referred to in this manual are trademarks or registered trademarks of their
respective holders.
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TABLE OF CONTENTS
T
T
PREFACE .............................................................................................................. 4
CHAPTER 1 INTRODUCTION.......................................................................................5
Specification................................................................................................................................ 5
Accessories of HOT-675V .......................................................................................................... 7
CHAPTER 2 HARDWARE CONFIGURATION .................................................................... 8
The Pentium II Processor ............................................................................................................ 8
What does the URM (Universal Retention Mechanism) consist of .............................................. 9
Install the Universal Retention Mechanism ................................................................................. 9
Install Pentium II Processor....................................................................................................... 11
Celeron Processor S.E.P.P only RM Assembly Procedure ......................................................... 12
Install Celeron Processor ........................................................................................................... 13
Install S.E.C.C.2 Processor ........................................................................................................ 14
Jumpers ..................................................................................................................................... 15
CPU Clock Speed Selection - JP1 and JP10 .............................................................................. 15
Clear CMOS - JP8 ..................................................................................................................... 18
Flash EEPROM Vpp - JP7......................................................................................................... 18
Keyboard & PS/2 Mouse Power-on Setting - JP2 ...................................................................... 18
On Board Audio Controller Setting - JP12 ................................................................................ 19
Connectors ................................................................................................................................ 19
CHAPTER 3 MEMORY CONFIGURATION ..................................................................... 22
CHAPTER 4 FLASH UTILITY .................................................................................... 23
CHAPTER 5 AWARD BIOS SETUP .......................................................................... 25
The Main Menu ......................................................................................................................... 26
Standard CMOS Setup............................................................................................................... 28
BIOS Features Setup ................................................................................................................. 30
Chipset Features Setup .............................................................................................................. 33
Power Management Setup ......................................................................................................... 36
PCI Configuration Setup ........................................................................................................... 39
Integrated Peripherals ................................................................................................................ 41
Password Setting ....................................................................................................................... 44
CHAPTER 6 ON BOARD AUDIO CONTROLLER ............................................................ 45
Introduction ............................................................................................................................... 45
General Specifications ............................................................................................................... 46
Connecting Audio Devices to 675V .......................................................................................... 47
Auto-installing Applications and Drivers .................................................................................. 49
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PREFACE
P
P
HOT-675V is a highly integrated IBM PC/ATX compatible system board designed to
meet the industry's most demanding desktop applications.
Based on the VIA VT82C692 AGPset chipset which support up to 500MHz Pentium
TM
II
processor with MMX technology.
HOT-675V is equipped with an Accelerated Graphics Port (A.G.P.), a high-performance
interconnect for graphic-intensive application, such as 3D applications. The A.G.P. is
independent of the PCI bus and is designed to exclusively use with graphical-display
devices. The HOT-675V supports 3.3 V A.G.P. devices with data transfer rates up to 133
MHz, allowing data throughput of 500 MB/sec.
The VIA's VT82C692 AGPset chipset provides an integrated Bus Mastering IDE
controller with two high performance IDE interfaces which allows up to four IDE
devices connection and up to 33 MB/sec of data transfer rates.
The on-board I/O controller provides standard PC I/O functions:
floppy drive interface, two FIFO serial ports, an IrDA device port and a SPP/EPP/ECP
capable parallel port.
HOT-675V is built with two PCI local bus slots providing a high bandwidth data path
for data-movement intensive functions such as graphics, and with two ISA slots.
HOT-675V provides the foundation for cost effective, high performance and highly
expandable platforms, which delivers the latest in the Intel PentiumTM II processor and
new advanced chipset technology.
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INTRODUCTION
The HOT-675V Mainboard is carefully designed for the demanding PC user who wants high performance and many intelligent features in a compact package:
Intel Chipset:
Features VIA VT82C692 CHIPSet with I/O subsystems.
CPU Support:
Intel Pentium II processor 233/66 ~ 333/66 MHz and 350/100 ~ 500/100 MHz.
Celeron processor 266/66 ~ 333/66 MHz.
Versatile Memory Supports:
Supports three banks of normal or PC/100 SDRAM maximum memory size up to 768MB.
Configurable support for ECC (Error Checking and Correcting)
PCI and ISA Expansion Slots:
Provides two 32-bit PCI slots and two 16-bit ISA slot.
AGP Slot:
Supports Accelerated Graphics Port cards for high performance, component level interconnect
targeted at 3D graphical display applications.
Onboard I/O:
Provides one Floppy port; one PS/2 mouse connector; two high-speed UART compatible serial
ports and one parallel port with ECP and EPP capabilities. Serial Port 2 can also be directed from
COM2 to the Infrared Module for wireless connections.
Onboard PCI Bus Master IDE Controller:
Two Ultra DMA/33 Bus Master IDE Ports supports four IDE devices up to 33 MB/sec IDE transfers and supports Enhanced PIO Modes 3 and 4 and Bus Master IDE DMA Mode 2 devices.
Onboard 20-pin ATX Power Supply:
Provides ATX power connector onboard supports soft-on/off function.
System BIOS:
Provides licensed Award V4.51PG BIOS on Flash EEPROM.
Supports Green PC, DMI and Bundled with NCR SCSI BIOS.
ACPI:
Support ACPI (Advanced Configuration and Power Interface) function. ACPI provide more
Energy Saving Features for the future operating system supporting OS Direct Power Management
(OSPM) functionality.
11
11
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On Board Audio Controller:
Creative ES1371 AC97 digital controller
Advanced 64 polyphonic wavetable synthesis with additional DOS support
Full-Duples Record/Playback at up to 48KHz
Supports Microsoft DirectSound 3D
Digital effects engine for reverb, chorus, tone control
Board Size:
MicroATX form factor 244mm x 170mm.
Advanced Features:
CPU Plug & Play -- HOT-675V featuring CPU Plug & Play function, the user needn't to adjust
onboard system clock and CPU multiplier. When the system first power-on, BIOS will set CPU
clock speed to 233 MHz or 350 MHz (depend on CPU external frequency) automatically. If your
CPU speed higher than 233 MHz or 350 MHz, one thing you only have to do is entry BIOS to set
CPU speed to the higher one.
Low EMI -- Spread Spectrum built in - ±1.5% modulation and automatic clock shut-off of unused
PCI/SDRAMS slots to reduce the EMI.
Dual Function Power Button -- The system can be one of two states, one is Suspend mode and
the other is the Soft-off mode. Pushing the power button for less than 4 seconds will place the
system into Suspend mode. When push the power button for more than 4 seconds, the system
enters the Soft-off mode.
Wake-On-LAN -- The system will power-on automatically by activating of LAN.
(This function support Intel LAN card only).
Modem Ring Power-on -- The system will power-on automatically by activating of modem ring.
PS/2 Keyboard & Mouse Power-on -- The system will power-on automatically by stroke key-
board or double click PS/2 mouse.
More Advanced Features (optional):
Voltages Monitoring -- System voltages levels are monitored to ensure stable current to main
board components.
System voltages include VCORE and VL2 for CPU, and +5V, +12V, -5V, -12V for system.
FAN Status Monitoring -- To prevent CPU overheat, CPU fans is monitored for RPM and failure.
(CPU Cooling FAN with RPM sensor is required)
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ACCESSORIES OF HOT-675V
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HARDWARE CONFIGURATION
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22
The Pentium™ II Processor
Figure 2-1
Figure 2-2
Figure 2-3
The Pentium™ II and Celeron™ processor is the next member of the P6 processor family.
It combines the architectural advances in the Pentium Pro processor with the instruction set
extensions of MMX technology. It is fully compatible with the huge base of Intel architecture-based PC software. Additional, the Pentium™ II processor delivers new levels of
performance for advance media and communications software including powerful, realistic
graphics and imaging capabilities, video conference, and the ability to run full-screen, fullmotion video. The combination of these advanced technologies makes the Pentium™ II
processor the ideal choice foe executing modem 32-bit compute-intensive and multimediaenhanced application work loads using advanced 32-bit operating systems.
The Pentium™ II and Celeron processor both have a separate, 32KB, on-chip, non-blocking
L1 cache which run at the processor frequency, Pentium™ II processor also has a 512KB or
256KB on-board L2 non-blocking cache runs at half the processor speed.
The Pentium™ II processor using Single Edge Contact Cartridge (S.E.C.C.) and S.E.C.C.2
packaging technology which enables high volume availability, improved handling protection.
The Celeron™ processor using Single Edge Processor Package. ( S.E.P.P.)
Figure 2-1 shows the front, rear and top views of Pentium™ II processor (without heat sink
mounted).
Figure 2-2 shows the S.E.C.C.2 package of Pentium™ II processor.
Figure 2-3 shows the primary and non-primary side of Celeron™ processor without heat
sink mounted and with heat sink mounted.
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What does the URM (Universal Retention Mechanism) consist of
Pentium II processor requires the Retention Mechanism (RM) and optional Heat Sink
Support (HSS) to hold the base processor in the S.E.C. cartridge.(or SECC 2)
Following installation procedure will display how to install these mechanism.
Retention Mechanism package consists of 2 separate parts and optional Heat Sink Support
consists of 3 separate parts.
Normally, depend on the type of heat sink, Heat Sink Support is not always available. For
some heat sink attached on pentium II processor might not fit to install the Heat Sink
Support. The introduction of Heat Sink Support installation on this manual only for your
reference.
Universal Retention Mechanism (URM) Plastic Guide with captive nuts that hold the
S.E.C. Cartridge in the Slot1 connector.
(Refer to Figure 2-4)
URM Attach Mount (URMAM) Bolt/Bridge assemblies inserted up through
the bottom of the mainboard. Then secures the
URM to URMAM (two URMAM required per URM).
(Refer to Figure 2-5)
Figure 2-4
Figure 2-5
Install the Universal Retention Mechanism
Place the mainboard on a workbench (not in a chassis). Be sure that the mainboard is bare
(that is, no DIMMs, cables, or cards are installed).
Install the Retention Mechanism :
1. Finds out the Universal Retention
Mechanism (URM) Mounting Holes
of Slot1 on HOT-675V main board.
(Refer to Figure 2-6)
2. Install two Universal Retention
Mechanism Attach Mounts (URMAM)
with Bolt/Bridge assemblies inserted
up through the bottom of the
mainboard. (Notice the URMAM's
bridge orientation as Figure 2-7)
Figure 2-7
Figure 2-6
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Figure 2-8
Figure 2-9
Install the Heat Sink Support: (optional)
If your Heat Sink comes with the Heat Sink suport then install it according to the instruction
comes with your Heat Sink.
Figure 2-8 and Figure 2-9 shows some Heat Sink examples.
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Install Pentium II Processor
Figure 2-10
Figure 2-11
Push the latches on the processor toward the center of the processor until they click into place.
Hold the processor so that the fan shroud is facing toward the Heat Sink Support Base bar on
the mainboard. Slide the processor into the Universal Retention Mechanism. Ensure that the
alignment notch in the processor fits over the plug in Slot 1. Push the processor down firmly,
with even pressure on both sides of the top, until it is seated.
Push the latches on the processor outward until they click into place in the Universal Retention
Mechanism. The latches must be secured for proper electrical connection of the processor.
Attach the end of the power cable to the three-pin connector on the mainboard or to the CPU
fan connector on the HOT-675V.
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Celeron™ Processor S.E.P.P. Only Retention Mechanism Assembly
Procedures
These procedures have been included to help assemble the S.E.P.P. (Single
Edge Processor Package) only Retention Mechanism.
Please follow them exactly:
Required Components
SEPP (Figure 2-12)
Heatsink (Figure 2-13)
Heatsink Retention Clip (Figure 2-14)
Primary Side
Figure 2-13
Figure 2-14
Procedures
Assemble all parts on a static free bench using
proper operator grounding and an ESD mat.
Carefully insert all four heatsink clip legs into
SEPP. (Figure 2-15)
Clip base must be located on the non-primary
side.(Figure 2-16) FYI - The side of the clip plate
which touches the substrate is covered with a
mylar insulator. This insulator prevents the clip
from shorting lines on the substrate.
Before you fully engage two legs of the clip into
the heatsink (Figure 2-17), make sure you remove
the blue film covering the thermal interface. The
blue film protects the thermal interface from
damage during shipping.
Grasp the heatsink clip assembly between the clip
base and the heatsink. Do not bend or apply
pressure directly to SEPP.
Using a nonmetallic stock or screw driver, push
the remaining two clip legs into the heatsink.
Caution: Take care not to contact passively or
scratch SEPP when using screw driver or bar
stock.
Verify that all the feet on the clip are fully engaged and seated on the heatsink. (Figure 2-18)
Non-primary Side
Non-primary Side
Primary Side
Figure 2-18
Figure 2-17
Figure 2-16
Figure 2-15
Figure 2-12
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Install Celeron™ Processor
Hold the processor unit so that the Heat sink faces toward the DIMM sockets on the mainboard.
Insert the processor into the Universal Retention Mechanism. Press the processor down firmly
with even pressure on both sides of the top until it is seated.
(Refer to Figure 2-19 and Figure 2-20)
Figure 2-19
Figure 2-20
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Install S.E.C.C.2™ Processor
Hold the processor unit so that the Heat sink faces toward the DIMM sockets on the mainboard.
Insert the processor into the Universal Retention Mechanism. Press the processor down firmly
with even pressure on both sides of the top until it is seated.
(Refer to Figure 2-21 and Figure 2-22)
Figure 2-21
Figure 2-22
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Jumpers
Several hardware settings are made through the use of jumper caps to connect jumper pins on
the main board. The jumper's pin 1 on main board will be on the top or on the left when holding the main board with the keyboard connector away from yourself.
Jumpers with two pins will be shown as for Close (On) and for Open (Off).
To connect the pins, simply place a plastic jumper cap over the two pins.
HOT-675V featuring CPU Plug & Play function, the user needn't to adjust onboard system
clock and CPU multiplier. When the system power-on first time, BIOS will set CPU clock
speed to 233 MHz or 350 MHz (depend on CPU external frequency) automatically. If
your CPU speed higher than 233 MHz or 350 MHz, you only have to entry BIOS to set CPU
speed to the higher one.
HOT-675V mainboard features a clock generator to provide adjustable system clock frequency.
JP1 is a 6-pin jumpers which determine the system clock frequency 66 MHz to 133 MHz.
CPU Plug & Play function is supported by 66MHz / 100MHz.
HOT-675V mainboard provides Jumper group of JP10 to figure the CPU core clock multiplier.
By inserting mini jumpers on MANUAL group, the user can figure the Host Bus Clock/CPU
Core Clock ratio (multiplier) manually.
CPU Plug & Play function is supported when an Jumper Pack inserted on
AUTO group.
Listed diagrams on right side show the sample position on jumper group of JP10:
1) Setting CPU Clock from BIOS
- jumper pack on AUTO.
(Factory default)
2) Adjust multiplier manually from hardware
- jumper pack on MANUAL, multiplier set to 5X manually.
Figure 2-23 shows the position of JP1 and JP10 on the mainboard.
Figure 2-23
CPU Clock Speed Selection - JP1 and JP10
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