6V
Power dissipationP75mW
Collector-emitter voltageV
Output
Emitter-collector voltageV
Collector currentI
Collector power dissipationP
Total power dissipationP
Operating temperatureT
Storage temperatureT
∗1
Soldering temperatureT
∗1 For 3 seconds by manual soldering
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
CEO
ECO
C
C
tot
opr
stg
sol
35V
6V
20mA
75mW
100mW
- 25 to + 85˚C
- 40 to + 100˚C
260˚C
2mm or more
Soldering area
GP2S22
■ Electro-optical Characteristics
ParameterSymbolConditionsMIN.TYP.MAX.Unit
Input
Forward voltageV
Reverse currentI
OutputCollector dark currentI
∗2
Transfer
charac-
teristics
Collector currentI
Response time
∗3
Leak currentI
Rise timet
Fall timet
F
R
CEO
C
r
f
LEAK
∗2 The condition and arrangement of the reflective object are shown in the following drawing.
∗3 Without reflective object
The ranking of collector current shall be classified into
the following 6 ranks.
Rank
A
B34 to 71
C20 to 42
A or B34 to 125
B or C20 to 71
A, B or C20 to 125
(µ A
I
C
58 to 125
)
IF= 20mA-1.21.4V
VR=6V--10µA
VCE= 20V, IF=0-10
VCE= 2V, IF= 4mA20-125µ A
VCE= 2V, I
= 100µ A-20100µ s
C
RL=1kΩ, d= 1mm
VCE= 2V, IF= 4mA--0.1µA
Test Condition and
Arrangement for
Collector Current
(
Ta= 25˚C
-9
-
7
10
A
-20100µ s
Al evaporation
d= 1mm-thick glass
)
Fig. 1 Forward Current vs.
Ambient Temperature
60
50
)
mA
40
(
F
30
20
Forward current I
10
0
- 250255075 85 100
Ambient temperature Ta (˚C
Fig. 2 Power Dissipation vs.
Ambient Temperature
120
P
tot
100
)
P, P
80
mW
(
Power dissipation P
)
C
60
40
20
0
025-25
Ambient temperature T
5010075
(˚C
a
85
)
GP2S22
Fig.3 Forward Current vs. Forward Voltage
500
25˚C
0˚C
-
25˚C
)
mA
(
T
= 75˚C
200
100
50
F
a
50˚C
20
10
Forward current I
5
2
1
0
Forward voltage V
(V)
F
3.532.521.510.5
Fig. 5 Collector Current vs.
Collector-emitter Voltage
500
Ta= 25˚C
400
)
µA
(
C
300
200
Collector current I
100
0
240
Collector-emitter voltage VCE (V
610128
I
F
10mA
7mA
4mA
2mA
= 15mA
)
Fig.4 Collector Current vs. Forward Current
1.0
VCE=2V
T
= 25˚C
a
0.8
)
mA
(
C
0.6
0.4
Collector current I
0.2
0
5101520300
Forward current IF (mA
25
)
Fig. 6 Collector Current vs.
Ambient Temperature
120
100
)
µA
80
(
C
60
40
Collector current I
20
0
025-25
5010075
Ambient temperature Ta (˚C
VCE=2V
I
= 4mA
F
)
Fig. 7 Collector Dark Current vs.
Ambient Temperature
-6
10
VCE= 20V
5
2
)
A
-7
(
10
5
CEO
2
-8
10
5
2
-9
10
Collector dark current I
5
2
-10
10
Ambient temperature Ta (˚C
Fig. 8 Response Time vs. Load Resistance
1000
100
)
µs
(
10
Response time
1
751005025 0
0.1
)
t
f
t
r
t
d
t
s
0.1
Load resistance RL (kΩ
100101
)
V
=2V
CE
I
= 100µ A
C
T
= 25˚C
a
1000
Test Circuit for Response Time
V
CC
R
Input
R
D
L
Output
Output
Input
GP2S22
Fig. 9 Relative Collector Current vs.
Distance between GP2S22 and
Card
100
IF= 4mA
V
=2V
80
)
%
(
60
10%
t
d
t
r
90%
t
s
t
f
40
Relative collector current
20
0
012 45
CE
T
= 25˚C
a
3
Fig.10 Relative Collector Current vs.
Card Moving Distance
100
)
80
%
(
60
40
Relative collector current
20
0
-3-
-
2
Card moving distance L(mm)
1012
d= 1mm
IF= 4mA
V
CE
T
a
=2V
= 25˚C
3
Distance between GP2S22 and test card d (mm
Distance Characteristics Test Condition
Correspond to Fig.9
SHARP OMS TEST CARD
Correspond to Fig.10
SHARP OMS TEST CARD
d
■ Precautions for Use
(1)
Perform soldering manually
(2)
Please refrain from soldering under preheating and refrain from soldering by reflow.
(3)
As for other general cautions, refer to the chapter “ Precautions for Use”.
(
WHITE
GP2S22
)
GP2S22
WhiteBlack
0
Card moving direction
(
Distance= L
)
d
+-
)
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