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data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
65mA
1A
6V
7V
20mA
250mW
0 to + 70˚C
- 40 to + 80˚C
260˚C
GP1A33R
■ Electro-optical Characteristics
Parameter
Input
Forward voltage
Reverse current
Operating supply voltage
Output
High level output voltage
Low level output voltage
Supply current
Transfer
characteristics
*3 Measured under the condition shown in Measurement Condition.
*4 In the condition that output A and B are low level.
t
=
*5 D
A
t
Duty ratio
Response frequency
AH
100, Dx 100
x
AP
B
t
BH
=
t
BP
SymbolMIN.TYP.MAX.Unit
V
F
I
R
V
CC
V
OH
V
OL
I
CC
*5
D
A
*5
D
B
f
MAX.
■ Output Waveforms
Output A
)
(V
OA
Output B
(V
OB
)
t
AH
t
AP
t
t
BH
AB1
t
BP
(
Unless otherwise specified, Ta= 0 to + 70˚C
Conditions
Ta= 25˚C, IF= 30mA
Ta= 25˚C, V
*3
= 5V, IF= 30mA
CC
V
*3
IOL= 8mA, VCC= 5V, IF= 30mA
*3*4
IF= 30mA, VCC=5V
V
CC
*3
f=2.5kHz
*3
VCC= 5V, IF= 30mA
=3V
R
= 5V, IF= 30mA,
)
-1.21.5V
--10µA
4.55.05.5V
2.44.9-V
-0.10.4V
-520mA
20
20
50
50
--kHz
80
80
%
%
5
Rotational direction : Counterclockwise when seen
from OPIC light detector
Fig. 1 Forward Current vs. Ambient
Temperature
100
90
80
)
70
mA
65
(
F
60
50
40
30
Forward current I
20
10
0
0
2550
Ambient temperature Ta (˚C
75
70
)
100
Fig. 2 Output Power Dissipation vs.
Ambient Temperature
300
250
)
mW
(
O
200
150
100
50
Output power dissipation P
0
0
Ambient temperature T
70
)
(˚C
a
100755025
GP1A33R
Fig. 3 Duty Ratio vs. Frequency
0.9
0.8
0.7
0.6
0.5
Duty ratio
0.4
0.3
0.2
0.1
110
25
Frequency f (kHz
1.0
0.9
0.8
0.7
0.6
0.5
Duty ratio
0.4
t
AH
(
Output A
t
AP
t
BH
(
Output B
t
BP
0.3
0.2
0.1
0
0
25
5075100
Ambient temperature T
)
)
)
a
VCC=5V
= 30mA
I
F
T
= 25˚C
a
t
AH
(
Output A
t
AP
t
BH
(
Output B
t
BP
VCC=5V
= 30mA
I
F
f = 2.5kHz
)
(˚C
)
)
20
Fig. 7 Duty Ratio vs. Distance (X direction
0.9
0.8
0.7
0.6
0.5
Duty ratio
0.4
0.3
0.2
0.1
- 1.0
t
AH
(
Output A
t
AP
t
BH
(
Output B
t
BP
- 0.5
Distance X (mm) (Shifting encoder
VCC=5V
= 30mA
I
F
f= 2.5kHz
Ta= 25˚CT
)
)
0.5
1.00
)
Fig. 4 Phase Difference vs. Frequency
Temperature
)
(
130
120
110
deg.
ABI
100
=x 360˚
θ
ABI
t
ABI
t
AP
V
CC
I
= 30mA
F
= 25˚C
T
a
=5V
90
80
70
Phase difference θ
60
50
1
25
Frequncy f (kHz
1020
)
Fig. 6 Phase Difference vs. AmbientFig. 5 Duty Ratio vs. Ambient Temperature
RO (distance between the disk center and half point of a slit),
P (slit pitch), S1 and S2 (installing position of photoint-
4-R1.3
15
1.4
6.4
)
4
9.9
errupter) will be provided by the following equations.
O
)
(mm)
Slit pitch : P (slit center
R
20
S
1=RO
P=
N
=x 10.89 (mm) N: number of slits
O
60
2x p x R
N
- 1.765(mm), S2=S1+ 6.7(mm
Note) When the number of slits is changed, values in
parenthesis are also changed according to the number.
(
2
r
1
r
2
Ex. ) In the case of
Enlarged drawing
12
of A portion
7.5
Slit pitch : P
Disk center
P
r1= r
)
N= 100P/R
100
R
=x 10.89 (mm
O
60
= 18.15mm
2x p x 18.15
P=
100
= 1.14mm
= 18.15- 1.765
S
1
= 16.385mm
= 16.385+ 6.7
S
2
= 23.085mm
)
■ Precautions for Use
(1) This module is designed to be operated at IF= 30mA TYP.
(2) Fixing torque : MAX. 0.6N • m
(3) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01µF
between Vcc and GND near the device.
(4) As for other general cautions, refer to the chapter “ Precautions for Use .”
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