The VND830SP is a monolithic dev ice made by
usingSTMicroelectronics VIPower M0-3
Technology, i ntended for dr iving any ki nd of load
with one side connected to ground.
Active VCC pin voltage clamp protec ts the device
against low energy spikes (see ISO7637 transient
BLO C K DIAG RA M
10
1
PowerSO-10™
ORDER CODES
PACKAGETUBET&R
PowerSO-10™ VND830SPVND830SP13TR
compatibility table). Active current limitation
combined with thermal shutdown a nd automatic
restart protects the device against over load. The
device detects open load condition both in on and
off state. Output shorted to VCC is detected in the
off state. Device automatically turns off in case of
ground pin disconnection.
V
CC
V
CC
CLAMP
GND
INPUT1
STATUS1
OVERTEMP. 1
INPUT2
STATUS2
OVERTEMP. 2
(**) See application schematic at page 8
LOGIC
OVERVOLTAGE
UNDERVOLTAGE
CLAMP 1
DRIVER 1
CURRENT LIMITER 1
OPENLOAD ON 1
OPENLOAD OFF 1
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPENLOAD ON 2
OPENLOAD OFF 2
OUTPUT1
OUTPUT2
July 20021/18
VND830SP
ABSOLUTE MAXIMUM RATI NG
SymbolParameterValueUnit
tot
DC Supply Voltag e41V
Reverse DC Supply Voltage- 0.3V
CC
DC Reverse Ground Pin Current- 200mA
DC Output CurrentInternally LimitedA
Reverse DC Output Current - 6A
DC Input Current+/- 10mA
DC Status Cur rent+/- 10mA
Electros tatic Discharge (Hum an Body Model: R=1.5KΩ; C=100pF)
- INPUT
- STATUS
- OUTPU T
- V
CC
Maximum Switching Energy
(L=1.8mH; R
=0Ω; V
L
=13.5V; T
bat
=150ºC; IL=9A)
jstart
4000
4000
5000
5000
100mJ
Powe r Dissipation TC=25°C73.5W
Junction Operating TemperatureInternally Limited°C
j
Case Operating Temperature- 40 to 150°C
c
Storage Temperature- 55 to 150°C
V
CC
- V
- I
GND
I
OUT
- I
OUT
I
IN
I
STAT
V
ESD
E
MAX
P
T
T
T
stg
CONNECTION DIAGRAM (TOP VIEW)
V
V
V
V
GROUND
INPUT 1
STATUS 1
STATUS 2
INPUT 2
V
CC
CURRENT AND VOLTAGE CONVENTIO NS
I
IN1
I
V
IN1
V
STAT1
STAT1
I
IN2
I
V
STAT2
IN2
V
STAT2
INPUT 1
STATUS 1
INPUT 2
STATUS 2
CC
OUTPUT 1
OUTPUT 1
N.C.
OUTPUT 2
OUTPUT 2
I
OUT1
I
S
V
CC
6
7
8
9
10
11
5
4
3
2
1
V
OUTPUT 1
V
OUT1
I
OUT2
V
OUT2
GND
OUTPUT 2
I
GND
2/18
VND830SP
THERMAL DATA
SymbolParameterValueUnit
R
thj-case
R
thj-amb
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial air
CAll functions of the device are perf ormed as designed af ter expos ure to dis turbance .
EOne or more functions of the device is not performed as designed after exposure and cannot be returned
to proper operation without replacing the device.
IIIIIIIVDela ys an d
IIIIIIIV
TEST LEVELS
TEST LEVELS R ESULTS
Impedance
Ω
Ω
6/18
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