Datasheet TN22 Datasheet (SGS Thomson Microelectronics)

FEATURES
:1200- 1500Vand100 0-1600V versions
V
BR
>175 mA
I
H
<1.5 mA
I
GT
DESCRIPTION
TN22
STARTLIGHT
SOT194
(Plastic)
The TN22 is an high performance asymetrical SCR in high voltage PNPN diffused planar tech-
K
A
G
nology. Packageeither in TO220AB,SOT 82or SOT194,
these parts are intended for use in electronic
TO220AB
(Plastic)
SOT82
(Plastic)
ABSOLUTERATINGS (limiting values)
Symbol Parameter Value Unit
V
DRM
I
T(RMS)
Repetitivepeak off-statevoltage Tj= 110°C 400 V RMS on-state current
Tc=95°C2 A
Fullsine ware (180° conductionangle)
I
T(AV)
Mean on-state current
Tc=95°C 1.8 A
Fullsine ware (180° conductionangle)
I
TSM
Non repetitivesurge peak on-state current
initial= 25°C)
(T
tp = 8.3ms 22 A
tp =10ms 20
2
tI
I
dI/dt Criticalrateof riseof on-statecurrent
2
t Valuefor fusing tp =10ms 2 A2s
50 A/µs
I
=5mA dIG/dt = 70 mA/µs.
G
T
stg
T
j
Storageandoperating junction temperaturerange - 40to + 150
Tl Maximumlead temperaturefor soldering during 10sat
4.5mm from case
April 1995
°C
- 40to + 110 260 °C
1/7
TN22
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth(j-a) Junctionto ambient TO220AB 60 °C/W
SOT 82 / SOT 194 100
Rth(j-c)
Junctionto case
3 °C/W
GATECHARACTERISTICS (maximum values) P
= 300mW PGM=2W(tp=20µs) I
G(AV)
=1 A (tp= 20 µs) V
FGM
RGM
=6V
ELECTRICALCHARACTERISTICS
Symbol Test Conditions Type Value Unit
I
V
V
I
DRM
GT
GT
I
TM
H
VD=12V (DC) RL=33 VD=12V (DC) RL=33
=1K
R
GK
VGK=0V Tj= 25°C MIN 175 mA ITM= 2A tp= 380µs Tj= 25°C MAX 3.1 V V
Rated Tj= 25°C MAX 0.1 mA
DRM
dV/dt Linear slopeup to
=67%V
V
D
DRMVGK
=0V
Tj= 25°C MAX 1.5 mA Tj= 25°C MAX 3 V
Tj=110°C MIN 500 V/µs
Symbol
Test Conditions
V
BR
ID= 5mA VGK=0V Tj = 25°C
ORDERINGINFORMATION
T N 2 2 - XXXX X
THYRISTOR FAMILY
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STARLIGHT Packages
I
T(RMS)
2:2A
MAX
IGTMAX 2 :1.5 mA
Suffix
Unit
TN22-1500 TN22-1600
MIN 1200 1000 V
MAX 1500 1600 V
VBRMAX 1500 : 1500V 1600 : 1600V
T : TO220AB D :SOT 82 K : SOT 194
TN22
This thyristorhas beendesigned for use as a fluo­rescenttube starterswitch.
Auelectronicstarter circuitprovides:
BASIC APPLICATION DIAGRAM
INDUCTANCE
BALLAST
220 V
AV
VOLTAGE
FLUORESCENT
TUBE
A pre-heating period during which a heating current is appliedto the cathodeheaters.
One or severalhigh voltagestriking pulses across the lamp.
STARTER CIRCUIT
R
TN22
S
CONTROLER
(TIMER)
PRINCIPLEOFOPERATION
1/ Pre-heating At resttheswitch S isopenedand when the mains
voltage is applied across the circuita full waverec­tified current flows through the resistor R and the TN22 gate : At every half-cyclewhen this current reachesthe gatetriggeringcurrent(I
) the thyris-
GT
tor turnson. When the device is turned-on the heating current,
limited bythe ballastchoke,flowsthroughthetube heaters.
The pre-heatingtime is typically2 or3 seconds.
2/ Pulsing At theend of thepre-heatingphasethe switch S is
turned on.At thismoment: If thecurrentthroughthe devicesishigherthan the holding current (I the currentfalls (below I
) the thyristor remains on until
H
). Thenthe thyristor turns
H
off. If thecurrent is equalor lower than theholdingcur­rent thethyristorturns off the instantaneously.
When the thyristor turns off the current flowing through the ballas choke generatesa high voltage
pulse. Thisovervoltage is clampedbythe thyristor avalanchecharacteristic(V
BR
).
If thelampisnotstruckafterthefirst pulse,thesys­tem startsa newignitionsequenceagain.
3/ Steadystate When the lamp is on the runningvoltage is about
150V and thestarterswitchis inthe off-state.
IMPLEMENTATION
The resistorR must be chosen toensure a proper triggering in the worst case (minimum operating temperature) according to the specified gate trig­gering currentand thepeakline voltage.
SwitchS : Thisfunctioncan be realizedwithagate sensitiveSCRtype : P0130AA... This component is a low voltage device (< 50V) and the maximum current sink through this switch can reach the levelof thethyristor holdingcurrent.
The pre-heating period can be determinedby the time constant of a capacitor-resistor circuit charged by the voltage drop of diodes usedin se­ries in thethyristorcathode.
3/7
TN22
Fig.1 : Maximum average power dissipation ver-
sus average on-state current (rectified full sine wave).
P (W)
T(av)
6 5
4
=30
=60
o
3 2
=90
o
= 120
o
1 0
0.2 0 .4 0.6 0.8 1.2 1 .4 1.6 1.8 2
0
= 180
o
I (A)
T(av)
1
o
Fig.3 : Averageon-state currentversus case tem­perature(rectifiedfull sine wave).
I (A)
T(av)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0
o
= 180
o
Tcase ( C)
10 20 30 40 50 60
70
80 90 100 110
Fig.2 : Correlation between maximum average
power dissipation and maximum allowable tem­perature (Tamb and Tcase) for different thermal resistancesheatsink+ contact.
P (W)
T(av)
6 5
o
Rth=12 C/W
o
Rth=8 C/W
o
Rth=4 C/W
o
Rth=0 C/W
4 3
2
= 180
o
1
o
0
0
10 20 30 40 50 60 70 80 90 100 110
Tcase ( C)
Fig.4 : Thermal transient impedance junction to
ambientversuspulseduration.
1.0E+02
1.0E+01
1.0E+00
Zth(j-a)(oC/W)
1.0E-01
1.0E-02 1.0E-01 1.0E+0 0 1.0E+01 1.0E +02 1.0E+03
tp(S)
Fig.5: Relativevariationof gatetriggercurrentand
holding current versusjunctiontemperature.
Igt[Tj] Igt[Tj=25 C]
3.0
2.5
2.0
1.5
Ih
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100 120 140
4/7
o
Igt
Ih[Tj]
o
Ih[Tj=25 C]
o
Tj( C)
Fig.6 : Non repetitive surge peak on-state current versusnumber ofcycles.
I (A)
TSM
20 18 16 14 12 10
8 6 4 2
Number of cycles
0
1 10 100 1000
Tj initial = 25 C
F=50Hz
o
TN22
Fig.7 : Nonrepetitive surge peak on-statecurrent
for a sinusoidalpulse with width : tp 10ms, and correspondingvalue ofI
I (A). I2t(A2s)
TSM
100
10
1
1
tp(ms)
2
t.
o
10
I
TSM
I2t
Tj initial = 25 C
Fig.9 : Relativevariation ofholdingcurrent versus gate-cathoderesistance(typical values).
Fig.8: On-statecharacteristics(maximum values).
V (V)
TM
8 7 6 5 4 3 2 1 0
0.1
Tj=110 C Vto =2.50V Rt =0.2 35
o
o
Tj=110 C
o
Tj=25 C
I(A)
TM
110
20
Fig.10 : Maximum allowable RMS current versus
time conduction and initial case temperature (Package: SOT82). Note : Calculation made fot Tj max = 135°C (the failuremode will be short circuit)
I(mA)
H
500
100
10
1
1 10 100 1000
Rgk( )
Tj=25 C
I (A)
T(rms)
o
11 10
9 8 7 6 5
Tc initial = 65 C
4 3 2 1
0.1
Tc initial = 25 C
o
o
Tc initial = 45 C
tp(s)
110100
o
5/7
TN22
PACKAGE MECHANICAL DATA
TO220AB(Plastic)
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A 10.0 10.4 0.393 0.409 B 15.2 15.9 0.598 0.626 C 13 14 0.511 0.551 D 6.2 6.6••••• 0.244 0.260 E 16.4 typ. 0.645 typ. F 3.5 4.2 0.137 0.165 G 2.65 2.95 0.104 0.116 H 4.4 4.6 0.173 0.181
I 3.75 3.85 0.147 0.151
J 1.23 1.32 0.048 0.051
K 1.27 typ. 0.050 typ.
L 0.49 0.70 0.019 0.027
M 2.4 2.72 0.094 0.107
N 4.95 5.15 0.194 0.203
N1 2.40 2.70 0.094 0.106
O 1.14 1.70 0.044 0.067 P 0.61 0.88 0.024 0.034
Cooling method : C Marking : Type number Weight : 2 g
PACKAGEMECHANICAL DATA
SOT 82 (Plastic)
CA
H
D
M
E
F
Recommended torque values : 5.5 m.N. Maximum torque values : 0.70 m.N.
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
B
L
G
A 7.4 7.8 0.291 0.307 B 10.5 10.8 0.413 0.425 C 2.4 2.7 0.094 0.106 D 0.7 0.9 0.027 0.035 E 2.2 typ. 0.087 typ. F 0.49 0.75 0.019 0.029
G 4.15 4.65 0.163 0.183
H (1) 2.54 0.100
L 15.7 typ. 0.618 typ.
M 1.0 1.3 0.039 0.051
(1) Within this region the cross-section of the leads is
uncontrolled
Marking : Type number Weight : 0.72 g
6/7
PACKAGE MECHANICALDATA
SOT194 (Plastic)
CA
L
M
D
F
N
E
I
TN22
DIMENSIONS
REF.
A 7.4 7.8 0.291 0.307
B
O
G
B 10.5 10.8 0.413 0.425 C 2.4 2.7 0.094 0.106 D 0.7 0.9 0.027 0.035 E 2.2 typ. 0.087 typ. F 0.49 0.75 0.019 0.020 G 4.15 4.65 0.163 0.183
I 1.3 typ. 0.051 typ.
L 0.1 typ. 0.004 typ.
M 4typ 0.158 typ
N 2 typ. 0.078 typ. O 6 typ. 0.236 typ. α 45° 45°
Millimeters Inches
Min. Max. Min. Max.
Marking : Type number Weight : 0.68 g
Information furnished is believed to be accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsability for the consequences ofuse of such informationnor for any infringement of patentsor other rights ofthird parties which may result from its use. No license isgranted by implication or otherwise under any patent or patent rightsof SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSONMicroelectronics productsare not authorized for use as critical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
FOOTPRINT
1.2
6.7
8.5
3.5
4.5
1
1995 SGS-THOMSON Microelectronics- Printedin Italy- All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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