.
POWER AMPLIFIER
.
THERMAL PROTECTION
.
OUTPUT CURRENT UP T O 3. 0A
.
FLYBACK VOLTAGE UP TO 70V (on Pin 5)
.
SUITABLE FOR DC COUPLING APPLICATION
.
EXTER NAL FLYBA CK SUPPLY
PP
TDA8177F
VERTICAL DEFLECTION BOOSTER
DESCRIPTION
Designed for monitors and high performance TVs,
the TDA8177F vertical deflection booster can handle flyback voltage up to 70V. More than this it is
possible to have a flyback voltage which is more
than the double of the supply (Pin 2). This allows
to decrease the power consumption or to decrease
the flyback time for a given supply voltage.
PIN CONNECTIONS
Tab connected to Pin 4
BLOCK DIAGRAM
SUPPLY
VOLTAGE
2 36
HEPTAWATT
(Plastic Package)
ORDER CODE :
The TDA8177F operates with supplies up to 35V and
provides up to 3A
The TDA8 177F is offere d in HEPT A WA TT pa ckage.
7
6
5
4
3
2
1
OUTPUT
STAGE
SUPPLY
FLYBACK
SUPPLY
output current to drive the yoke.
PP
NON-INVERTING INPUT
OUTPUT STAGE SUPPLY
OUTPUT
GROUND
FLYBACK SUPPLY
SUPPLY VOLTAGE
INVERTING INPUT
TDA8177F
8177F-01.EPS
December 1998
INVERTING INPUT
NON-INVERTING INPUT
1
7
TDA8177F
POWER
AMPLIFIER
4
GROUND
THERMAL
PROTECTION
5
OUTPUT
8177F-02.EPS
1/5
TDA8177F
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
, V7Amplifier Input Voltage (Pins 1-7) (see note 1) - 0.3, + V
V
1
I
V
ESD1
V
ESD2
- V2Voltage Difference between Flyback Supply and Supply Voltage 50 V
V
3
, V5, V6Min. Voltage (see note 1) -0.4 V
V
3
T
oper
T
T
Notes :
Supply Voltage (Pin 2) (see note 1) 40 V
S
Flyback Peak Voltage (Pin 6) (see note 1) 75 V
6
Maximum Output Peak Current (see notes 2 and 3) 2.5 A
O
Maximum Sink Current (t < 1ms) 2.5 A
I
3
Maximum Source Current (t < 1ms) (in the diode, see Block Diagram) 2.5 A
I
3
ESD Susceptibility Tool Model (see note 4)
Human Model (see note 5)
300
2
Operating Ambient Temperature - 20, + 75
Storage Temperature - 40, + 150
stg
Junction Temperature +150
j
1. Versus Pin 4.
2. The output current can reach 4A peak for t ≤ 10µs (up to 120Hz).
3. Provided SOAR is respected (see Figures 1 and 2).
4. Equivalent to discharging a 200pF capacitor through a 0Ω series resistor.
5. Equivalent to discharging a 150pF capacitor through a 1.5kΩ series resistor.
S
kV
o
o
o
V
V
C
C
C
8177F-01.TBL
THERMAL DATA
Symbol Parameter Value Unit
R
th (j-c)
T
∆
T
Junction-case Thermal Resistance Max. 3
Temperature for Thermal Shutdown 150
t
Hysteresis on T
T
t
Recommended Max. Junction Temperature 120
jr
t
10
ELECTRICAL CHARACTERISTICS
(V
= 35V, TA = 25oC, unless otherwise specified)
S
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
I
V
∆
V
GV Voltage Gain 80 dB
V
V
V
D5 - 6
V
D3 - 6
V
Operating Supply Voltage Range 10 35 V
S
Operating Flyback Supply Voltage V
3M
Pin 2 Quiescent Current I3 = 0, I5 = 0 10 20 mA
I
2
Pin 6 Quiescent Current I3 = 0, I5 = 0 25 35 mA
I
6
Max. Scanning Peak Output Current 1.5 A
O
Amplifier Bias Current V1 = 20V, V7 = 21V - 0.4 - 2
I
1
Amplifier Bias Current V1 = 21V, V7 = 20V - 0.4 - 2
I
7
Offset Voltage 0 7 mV
IO
/dt Offset Drift versus Temperature - 10
IO
Output Saturation Voltage to GND (Pin 4) I5 = 1.5A 1.0 2 V
5L
Output Saturation Voltage to Supply (Pin 6) I5 = - 1.5A 1.7 2.5 V
5H
S
Diode Forward Voltage between Pins 5-6 I5 = 1.5A 1.5 2.1 V
Diode Forward Voltage between Pins 3-6 I3 = 1.5A 2.3 3 V
Voltage Drop between Pins 3-6 (2nd part of flyback) I3 = - 1.5A 4 5 V
3-6
70 V
o
C/W
µ
V/oC
o
C
o
C
o
C
µ
A
µ
A
8177F-02.TBL
8177F-03.TBL
2/5
APPLICATION CIRCUITS
AC COUPLING
TDA8177F
+ V
S
Flyback
6
2
3
Supply
DC COUPLING
V
REF
2.2V
R5
1
7
TDA8177F
POWER
AMPLIFIER
4
6
2
THERMAL
PROTECTION
R3
R2
+ V
3
5
W
W
1.5
330
C
R1
L
Flyback
Supply
YOKE
8177F-03.EPS
F
m
0.47
R4
S
V
V
REF
REF
+
Adjustment
-
Vertical
Position
R5
1
7
TDA8177F
-V
POWER
AMPLIFIER
4
EE
THERMAL
PROTECTION
5
W
W
1.5
330
F
m
YOKE
0.47
R2
R1
8177F-04.EPS
3/5
TDA8177F
Figure 1 :
Output Transistors SOA
Figure 2 :
(for secondary breakdown)
IC (A)
10
@ T
= 25°C
case
1
-1
10
t = 1ms
t = 10ms
10
t = 100ms
-2
V
(V)
CE
11010
100
90
80
70
60
2
8177F-05.EPS
25 50 75 100 125
ISB (%)
Secondary Breakdown Temperature
Derating Curve
(ISB = secondary breakdown current)
T
(°C)
case
8177F-06.EPS
4/5
TDA8177F
PACKAGE MECHANICAL DATA :
Dimensions
Min. Typ. Max. Min. Typ. Max.
HEPTAW AT
Millimeters Inches
A 4.8 0.189
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.6 08 0.024 0.031
F1 0.9 0.035
G 2.41 2.54 2.67 0.095 0.100 0.105
G1 4.91 5.08 5.21 0.193 0.200 0.205
G2 7.49 7.62 7.8 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 16.97 0.668
L1 14.92 0.587
L2 21.54 0.848
L3 22.62 0.891
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
M 2.8 0.110
M1 5.08 0.200
Dia. 3.65 3.85 0.144 0.152
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No licence is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or sys tem s
without express written approv al of STMi cr oelec troni cs.
Purchase of I
Rights to use these components in a I
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The ST logo is a registered trademark of STMicroelectronics
© 1998 STMicroelectronics - All Rights Reserved
2
C Components of STMicroelectronics, conveys a license under the Philips I2C Pate n t .
2
the I
C Standard Specifications as defined by Phili ps.
STMicroelectronics GROUP OF COMPANIES
2
C system, is granted provided that the system conforms to
http://www.st.com
5/5
PM-HEPTV.EPS
HEPTV.TBL
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