TV VERTICALDEFLECTION OUTPUT CIRCUIT
.
POWERAMPLIFIER
.
FLYBACKGENERATOR
.
THERMAL PROTECTION
DESCRIPTION
The TDA8172 is a monolithic integrated circuit in
HEPTAWATT
power booster fordirectdriving of verticalwindings
of TVyokes. It is intendedfor usein Color andB &
W televisionas wellas in monitorsand displays.
PIN CONNECTIONS(top view)
TM
package. It is a high efficiency
TDA8172
HEPTAWATT
(Plastic Package)
ORDER CODE : TDA8172
BLOCK DIAGRAM
Tab connectedto Pin 4
236
1
7
TDA8172
POWER
AMPLIFIER
4
7
6
5
4
3
2
1
FLYBACK
GENERATOR
THERMAL
PROTECTION
+V
NON-INVERTING INPUT
OUTPUT STAGE SUPPLY
OUTPUT
GROUND
FLYBACK GENERATOR
SUPPLY VOLTAGE
INVERTING INPUT
8172-01.EPS
S
5
YOKE
May 1996
8172-02.EPS
1/5
TDA8172
ABSOLUTEMAXIMUM RATINGS
Symbol Parameter Value Unit
V
S
V
5,V6
V
3
V1,V7Amplifier InputVoltage + V
I
o
I
o
I
o
I
3
I
3
P
tot
T
stg,Tj
THERMALDATA
Symbol Parameter Value Unit
R
th (j–c)
Supply Voltage (pin 2) 35 V
Flyback Peak Voltage 60 V
Voltage at Pin 3 + V
– 0.5
s
s
Output Peak Current (non repetitive, t = 2 ms) 2.5 A
Output Peak Current at f = 50 or 60 Hz, t ≤ 10 µs3A
Output Peak Current at f = 50 or 60 Hz, t >10 µs2A
Pin 3 DC Current at V5<V
2
Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, t
Total Power Dissipation at T
=90°C20W
case
≤ 1.5 ms 3 A
fly
100 mA
Storage and Junction Temperature – 40, +150 °C
Thermal Resistance Junction-case Max. 3 °C/W
V
8172-01.TBL
8172-02.TBL
ELECTRICAL CHARACTERISTICS
(refer to the testcircuits, V
=35V, T
S
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
Pin 2 Quiescent Current I3=0,I5=0 8 16 mA 1a
I
2
Pin 6 Quiescent Current I3=0,I5= 0 16 36 mA 1a
I
6
Amplifier Input Bias Current V1= 1 V, V7= 2 V – 0.1 – 1 µA1a
I
1
V
V
V
V
Pin 3 Saturation Voltage to GND I3= 20 mA 1 1.5 V 1c
3L
Quiescent Output Voltage Vs= 35V, Ra=39kΩ 18 V 1d
5
Output Saturation Voltage to GND I5= 1.2 A 1 1.4 V 1c
5L
Output Saturation Voltage to Supply – I5= 1.2A 1.6 2.2 V 1b
5H
Junction Temperature for Thermal Shut Down 140 °C
T
j
=25oC unlessotherwisespecified)
amb
= 2 V, V7= 1 V – 0.1 – 1 µA1a
V
1
= 0.7 A 0.7 1 V 1c
I
5
= 0.7A 1.3 1.8 V 1b
–I
5
8172-03.TBL
2/5
Figure 1 : DC TestCircuits.
TDA8172
Figure 1 a : Measurementof I1;I2;I
2
7
S1:(a) I2and I6; (b) I
I
2
V
7
1
I
6
6
5
S1
1
4
Figure 1 c : Measurementof V3L;V
3V
2
1
7
V
7
6
3
5
4
V
3L
5L
6
V
10kΩ
a
b
b
S
I
1V
S1
1
or
I
3I5
a
Figure1 b : Measurementof V
2
1
5H
V
S
6
V
5H
5
1V
7
V
7
8172-03.EPS
Figure1 d : Measurementof V
V
S
2
Ω
12k
2V
V
5L
1
5.6kΩ
7
V
7
4
I
5
8172-04.EPS
5
V
6
5
4
R
a
S
V
5
S1:(a) V3L;(b) V
5L
8172-05.EPS
8172-06.EPS
3/5
TDA8172
Figure 2 : AC Test Circuit
V
GND
to
i
RT1
R1
10kΩ
4.7k
Ω
IN
*
V
S
REF
R2
5.6k
7
1
V
Re comme nde d for V filtering
C1 C2
F
µ
R3 R4
12k
Ω
Ω
REF
TDA8172
4
1N4001
D1
C6
F
4.7
µ
C3
220µF470µF0.1
632
Iy
5
8.2k
C4
0.22µF
R7
1.5Ω
Ω
2200µF
8.2
C5
R5
Ω
R6
330Ω
Ly
24.6mH
to
Ry
9.6
t
fly
V
7
to
Ω
R5 Iy
8172-07.EPS
MOUNTINGINSTRUCTIONS
The power dissipated in the circuit must be removed by adding an externalheatsink.
Thanks to the HEPTAWATT
TM
package attaching
the heatsinkis verysimple, a screw or a compression spring(clip)being sufficient.
Figure 3 : Mounting Examples
Between the heatsink and the packageit is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is connectedto Pin 4 whichis ground.
4/5
8172-08.EPS - 8172-09.EPS
PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT
Dimensions
Min. Typ. Max. Min. Typ. Max.
A 4.8 0.189
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.6 08 0.024 0.031
F1 0.9 0.035
G 2.41 2.54 2.67 0.095 0.100 0.105
G1 4.91 5.08 5.21 0.193 0.200 0.205
G2 7.49 7.62 7.8 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 16.97 0.668
L1 14.92 0.587
L2 21.54 0.848
L3 22.62 0.891
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
M 2.8 0.110
M1 5.08 0.200
Dia. 3.65 3.85 0.144 0.152
Millimeters Inches
TDA8172
PM-HEPTV.EPS
HEPTV.TBL
Information furnishedis believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or otherrights of third partieswhich may result
from its use. Nolicence is granted by implication or otherwise underany patent or patent rights ofSGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSONMicroelectronics products arenot authorized for use as critical components inlife
support devices or systems without express written approvalof SGS-THOMSON Microelectronics.
1996 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics,conveys a license under the Philips
2
I
C Patent. Rights to use these components in a I2C system,is granted provided that the systemconforms to
Australia - Brazil -Canada - China -France - Germany - HongKong - Italy -Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland- Taiwan - Thailand - United Kingdom -U.S.A.
2
the I
C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
5/5
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