3 STEPS OVERRATING CHIP TEMPERATURE WITH THERMAL WARNING
LOADDUMP VOLTAGE
FORTUITOUSOPEN GND
BLOCK & APPLICATIONDIAGRAM
MULTIPOWER BCD TECHNOLOGY
Flexiwatt 25
LOUDSPEAKERDC CURRENT
ESD
DESCRIPTION
The TD A7454 is a new BCD technology QUAD
BRIDGE type of car radio amplifier in Flexiwatt25
packagespeciallyintendedforcarradioapplications.
Among the features, its superior efficiency performance coming from the internal exclusive
structure, makes it the most suitable device to
simplify the thermal management in high power
sets. The dissipated output power under average
listening condition is in fact reduced up to 50%
when compared to the level provided by conventional class AB solutions.
October 1999
STD/HI- EFF16
RIGHT
IN
FRONT
ST-BY4
IN
RIGHT
REAR
MUTE22
IN LEFT
FRONT
IN LEFT
REAR
CD25
0.22µF
0.22µF
0.22µF
100µF
0.22µF
SVR
V
CC1
6
20
V
CC2
7
11
12
15
10
14
8
9
S-GND
13
5
2
3
19
18
17
TAB
1
21
24
23
D94AU172C
-
RIGHT FRONT
+
+
RIGHT REAR
-
-
LEFT FRONT
+
+
LEFT REAR
-
V
CC
1/13
TDA7454
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
op
V
V
peak
I
O
I
O
P
tot
T
stg,Tj
THERMAL DATA
SymbolDescriptionValueUnit
R
th j-case
Operating Supply Voltage18V
DC Supply Voltage28V
S
Peak Supply Voltage (for t = 50ms)40V
Output Peak Current (not repetitive t = 100µs)8A
Output Peak Current (repetitive f > 10Hz)6A
Power Dissipation T
=70°C86W
case
Storage and Junction Temperature-55 to 150
Thermal Resistance Junction-caseMax1
°
C/W
°
C
PIN CONNECTION (Topview)
25
24
23
22
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
4
3
2
1
CD
PW GND LR
OUT LRMUTE
OUT LR+
V
CC2
OUT LFPW GND LF
OUT LF+
STD/HEFF
IN LF
IN LR
S GND
IN RR
IN RF
SVR
OUT RF+
PW GND RF
OUT RFV
CC1
OUT RR+
ST-BY
OUT RRPW GND RR
TAB
D94AU173A
2/13
TDA7454
ELECTRICALCHARACTERISTICS(Refer to the test circuit VS=14.4V; RL=4Ω; f = 1KHz;
T
=25°C,unless otherwise specified
amb
SymbolParameterTest ConditionMin.Typ.Max.Unit
V
S
I
d
P
o
Supply Voltage Range818V
Total Quiescent Drain Current60140250mA
Output PowerTHD = 10%
THD = 1%
23
18
25
20
W
W
THD = 10% RL = 2Ω;
P
o EIAJ
THD = 1% R
EIAJ Output Power (*)Vs = 13.7V
=2Ω;
L
Vs = 13.7V, RL = 2Ω
P
o max.
Max. Output Power (*)Vs = 14.4V
Vs = 14.4V, RL = 2
THDTotal harmonic distortionP
C
T
R
IN
G
V
G
∆
E
IN
Cross Talkf = 1KHz to 10KHz4555dB
Input Impedance111519KΩ
Voltage Gain252627dB
Voltage Gain Match1dB
V
Output Noise VoltageRg= 600
= 1W to 10W; STD MODE
O
P
= 1W;HE MODE
O
P
= 10W; HE MODE
O
=2Ω; HE MODE; PO =3W
R
L
R
=2Ω; HE MODE; PO= 15W
L
Ω
SVRSupply Voltage Rejectionf = 300Hz; Vr = 1Vrms;
R
= 0 to 100Ω;
g
40
28
32
50
38
Ω
55
4552dB
42
30
35
52
40
60
0.03
0.04
0.1
0.06
0.15
0.3
0.3
0.5
0.3
0.5
100150mV
BWPower Bandwidth(–3dB)75KHz
A
SB
V
sb IN
V
sb OUT
I
sb
A
M
V
MIN
V
M OUT
I
M
CDClip Det. out Current
(*) Saturated square wave output.
Stand-by Attenuation90100dB
Stand-by in Threshold1.5V
Stand-by out Threshold3.5V
Stand-by Current Consumption100µA
Mute Attenuation8090dB
Mute in Thereshold1.5V
Mute out Threshold3.5V
Mute pin Current (Sourced)V = 0 to V
Thanks to its unique operating principle, the
TDA7454 obtains a substantialreductionof power
dissipation from traditional class-AB amplifiers
without being affected by the massive radiation
effects and complex circuitry normally associated
with class-Dsolutions.
Its is composed of 8 amplifierblocks, making up
4 bridge-equivalent channels. Half of this structure is drafted in fig 15. These blocks continuously change their connections during every single signal event, according to the instantaneous
power demand. This means that at low volumes
(output power steadily lower than 2.5 W) the
TDA7454 acts as a SingleEnded amplifier, condition where block “C” remains disabled and the
block “D” behaveslike a buffer, which, by furnishing the correct DC biasing (half-Vcc) to each pair
of speakers, eliminate the needs of otherwise required output-decouplingcapacitors. At the same
time, SW1 keeps closed. thus ensuring a common biasing point for L-R front / L-R rear speakers couples.As a result, the equivalentcircuit becomes that of fig.16.
The internal switches (SW1) are high-speed, dissipation-freepower MOS types, whose realization
has been made possible by the ST- exclusive Bypolar-CMOS-DMOS mixed technology process
(BCD). From fig. 16 it can be observed that “A”
and “B” amplifiers work in phase opposition. Supposing their output have the same signal (equal
shape/amplitude), the current sourced by “B” will
be entirely sunk by “A”, while no current will flow
into “D”, causing no power dissipation in the latter.
“A” and “B” are practically configured as a bridge
whose load is constitutedby Ra + Rb (= 8 Ohm, if
4 Ohm speakers are used), with considerable advantages in terms of power dissipation. Designating“A” and “B” for the reproduction of either
FRONT or REAR sections of the same channel
(LEFT or RIGHT), keeping the fader in centre position (same amplitude for FRONT and REAR
sections) and using the same speakers,as it happens during most of the time, will transpose this
best-case dissipation condition into practical applications.
To fully take advantageof the TDA7454’s low-dissipation feature, it is then especially important to
adopt some criteria in the channels assignment,
using the schematic of fig. 1 as a reference.
When the power demand increases to more than
2.5 W, all the blocks will operate as amplifiers,
SW1 is opened,leading to the seemingly conventional bridge configuration of fig. 17.
The efficiency enhancement is based upon the
concept that the average output power during the
reproduction of normal music/speech programs
will stand anywhere between 10 % and 15 % of
the rated power (@ THD= 10 %)that the amplifier
can deliver. This holds true even at high volumes
and frequent clipping occurrence.
Applied to the TDA7454 (rated power= 25 W),
this will result into an average output level of 2.5
- 3 W in sine-wave operation, region where the
dissipatedpower is about 50 % less than that of a
traditionalamplifier of equivalentpower class (see
TDA7454 vs. CLASS-AB characteristics, fig. 18).
Equally favourable is the case shown by fig. 19,
when gaussian-distributed signal amplitudes,
which best simulates the amplifier’s real working
conditions,are used.
APPLICATION HINTS (ref. to the circuit of fig. 1)
STAND-BYand MUTING (pins 4 & 22)
Both STAND-BY and MUTING pins are CMOS-
compatible. The current sunk by each of them is
about 1 µA. For pop prevention it is essential that
during TURN ON/OFF sequences the muting be
preventively inserted before making stand-by
transitions.But, if for any reason, either muting or
stand-by are not used, they have to be connected
to Vcc through a 100 Kohm (minimum) resistance.
The R-C networksvaluesin fig. 1 (R1-C6and R2C7) are meant to be the minimum-necessary for
obtaining the lowest pop levels possible. Any reductions (especially for R2-C7) will inevitably impair this parameter.
SVR (pin10)
The duty of the SVR capacitor (C5) is double: as-
suring adequate supply-ripple rejection and controllingturn ON/OFF operations. Its indicated
value (100 uF) is the minimum-recommended to
correctlyserve both the purposes.
INPUTS (pins 11-12-13-14)
The inputs are internally biased at half-Vcc level.
The typical input impedance is 15 KOhm, which
implies using Cin (C1-C2-C3-C4) = 220 nF for obtaining a theoretical minimum-reproducible frequency of 48 Hz (-3 dB). In any case, Cin values can be enlarged if a lower frequency bound
is desired, but, at any Cin enlargement must correspond a proportional increase of Csvr (C5), to
safeguardthe on/off pop aspect.
The following table indicatesthe right values to be
used for Cin and Csvr, whose operating voltage
can be 10 V.
LOW FREQUENCY
ROLL-OFF (-3dB)
480.22100
220.47220
160.68330
111470
Cin (µF)Csvr (µF)
8/13
Table 1: MODE SELECTIONTABLE OPERATIONOF THE DEVICE
1) STD/HI-EFF (pin 16 = OPEN)
TDA7454
STANDARD QUAD
BRIDGE MODE
HIGH-EFF QUAD
BRIDGE MODE
STANDARD QUAD
SINGLE-ENDED MODE
100150170
2) STD/HI-EFF (pin 16 = GND)
HIGH-EFF QUAD BRIDGE MODE
STANDARD QUAD
SINGLE-ENDED MODE
150170
3) STD/HI-EFF (pin 16 connected as shown in thefigure below.
STANDARD QUAD
BRIDGE MODE OR
HIGH-EFF MODE
(Theatsink dependent)
HIGH-EFF QUAD
BRIDGE MODE
STANDARD QUAD
SINGLE-ENDED MODE
100150170
ST-BY MODE
Tchip (deg)
ST-BY MODE
Tchip (deg)
ST-BY MODE
Tchip (deg)
Vref
NTC t(Theatsink)STD/HI-EFF (pin 16)
D94AU174A
OUTPUT STAGE STABILITY
The TDA7454’s is intrinsically stable and will
properly drive any kind of conventional car-radio
speakers without the need of supplementary output compensation (e.g. Boucherot cells), thus allowing a drastic reduction of the external parts
whose number, abated to the essentials, reflects
that of traditional amplifiers. In this respect, perfect pin-to-pin compatibility with the entire SgsThomson’s4-BTLfamily (TDA738X)exists.
STANDARD / HIGH-EFFICIENCY OPERATION
(pin 16)
The TDA7454’s operating mode can be selected
by changing the connection of pin 16, according
to table 1.
At low battery levels (<10 V), the device will automaticallyturn into STANDARDBRIDGE mode, independentlyfrom the status of pin 16.
Condition # 3 in table1 is particularlyuseful when
the TDA7454’s operation has to be conditioned
by the temperature in other more heat-sensitive
devices in the same environment. The NTC resistor is a temperature sensor, to be situated near
the critical part(s), will appropriately drive pin 16
through a low-power transitor.Initially the
TDA7454can be set to operate as a STANDARD
BRIDGE, turning into HIGH EFFICIENCY mode
only if overheating is recognised in the critical
spot, thus reducing the overall temperature in the
circuit.
CLIPPINGDETECTOR / DIAGNOSTIC (pin 25)
The TDA7454 is equipped with a diagnostic function whose output is available at pin 25. This pin
requires a pull-up resistor (10 KOhm min.) to a
DC source that may range from 5 V to Vcc. The
following events will be recognized and signaled
out:
Clipping
A train of negative-goingpulses will appear, each
of them syncronized with every single clipping
eventtakingplace in ant of the outputs.
A possible application consists of filtering / integrating the pulses and implement a routine for
automatically reducing / restoring the volume using microprocessor - driven audioprocessors, to
counteract the clipping sound-damagingeffects.
Overheating
Chip temperatures above 150 oC will be signaled
out at pin 25 in the form of longer-lastingpulses,
as the stepping back into the operating temperature requires some time.
9/13
TDA7454
This constitues a substantial difference from the
“clipping” situation, making the two information
unmistakable. Associated to a suitable external
circuitry, this “warning” signal could be used to
mute some portions of the I.C. (e.g. the rear
channels) or to attenuatethe volume.
Short Circuit
Some kinds of short circuit (OUT - GND, OUTVcc), either present before the power-on or made
afterwards, will cause pin 25 to remain steadily
low as long as the faulty condition persists.
Short-circuits across the speakers will give intermittent (pulsed) signalling,proportional to the
output voltageamplitude.
ExternalLayout Grounding
The 4 bridge stuctures have independent power
ground accesses (pins 2,8,18,24), while the signal ground is common to all of them (pin 13). The
Figure 15: TDA7454’sHalf Structure
TAB (pin 1) is connected to the chip substrate
and has to be grounded to the best-filtered
ground spot (usually nearby the minus terminal of
the Vcc-filtering electrolytic capacitor). This same
point should be used as the centre of a multi-track
star-like configuration, or, alternatively,as the origin of only two separate tracks, one for P-GND,
one for S-GND, each of them routed to their specificground pin(s).
This will provide the right degree of separation
between P-GND and S-GND yet assuring the
(necessary) electrical connection between them.
The correct ground assignment for the each elementof the circuit will then be:
(1): dam-bar protusion not included
(2): molding protusion included
OUTLINE AND
MECHANICAL DATA
Flexiwatt25
L2
H
V3
OL3L4
V
C
H3
G
H1
G1
R3
H2
F
A
R4
N
V2
R2
R
L
L1
V1
R2
B
V
FLEX25ME
L5
R1
R1R1
V1
D
E
M1
M
12/13
TDA7454
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
13/13
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