Stand-by ON Threshold3.5V
Stand-by OFF Threshold1.5V
Mute ON threshold3.5V
Mute OFF threshold 1.5V
Mute Attenuation5065dB
Quiescent Current @ Stand-by0.61mA
Stand-by bias currentStand by ON: V
V
= 5V
mute
ST-BY
= 5V;
80µA
Play or Mute-20-5µA
I
muteBIAS
Mute Bias CurrentMute15µA
Play0.22µA
V/µs
3/13
Page 4
TDA7496SA
APPLICATION SUGGESTIONS
The recommended values of the external components are those shown on the application circuit of figure 1.
Different values can be used, the following table can help the designer.
COMPONENT
SUGGESTION
VALUE
PURPOSE
R1300KVolume Control CircuitLarger volume regulation
R210KMute time constantLarger mute on/off timeSmaller mute on/off time
P150KVolume Control Circuit
C11000µFSupply voltage bypassDanger of oscillation
C2470nFInput DC decouplingLower low frequency cutoff Higher low frequency cutoff
C3470nFInput DC decouplingLower low frequency cutoff Higher low frequency cutoff
C4470µFRipple rejectionBetter SVRWorse SVR
C5100nFVolume control time
constant
C61000µFOutput DC decouplingLower low frequency cutoff Higher low frequency cutoff
C71µFMute time constantLarger mute on/off timeSmaller mute on/off time
C81000µFOutput DC decouplingLower low frequency cutoff Higher low frequency cutoff
C9100nFSupply voltage bypassDanger of oscillation
LARGER THAN
SUGGESTION
time
Larger volume regulation
time
SMALLER THAN
SUGGESTION
Smaller volume regulation
time
Smaller volume regulation
time
Figure 1. Application Circui
+V
S
INR
INL
C4 470µF
C1
1000µF
PW_GND
C2 470nF
S_GND
C3 470nF
SVR 7
11
1
8
5
30K
VOLUME
C5
100nF
VAROUT_R
VOLUME
VOLUME
34
VAROUT_L
R1 300K
TP1
2
13
+
OP AMP
MUTE/STBY
PROTECTIONS
+
-30K
OP AMP
V
VOL
P1
50K
LOG
C9
0.1µF
S
PW_GND
15
+5V
C8 1000µF
14
9
10
C7
1µF
12
C6 1000µF
R2 10K
PW_GND
OUTR
OUTL
PW_GND
D96AU493D
S1 STBY
S2 MUTE
+5V
S_GND
+5V
4/13
Page 5
MUTE STAND-BY TRUTH TABLE
MUTESt-BYOPERATING CONDITION
HHSTAND-BY
LHSTAND-BY
HLMUTE
LLPLAY
Turn ON/OFF Sequences (for optimizing the POP performances)
Figure 1. USING ONLY THE MUTE FUNCTION
VS (V)
ST-BY
pin#9 (V)
5
V
SVR
pin#7(V)
TDA7496SA
2.5V
MUTE
pin#10 (V)
5
INPUT
(mV)
V
OUT
(V)
I
(mA)
Q
D97AU684
OFFSTBY MUTEPLAYSTBYOFFMUTE
USING ONLY THE MUTE FUNCTION
To semplify the application, the stand-by pin can be connected directly to Ground. During the ON/OFF transitions is recommended to respect the following conditions:
– At the turn-on the transition mute to mute - play must be made when the SVR pin is higher than 2.5V
– At the turn-of f the TDA 7496A must be brough t to mut e from t he pl ay condi tion when the SVR pin is
higher than 2.5V.
5/13
Page 6
TDA7496SA
Figure 2. P.C.B. and Component layoutPCB and Component Layout
In order to avoid the thermal protection intervention, that is placed approximati vely at Tj = 150°C, it is important
the dimensioning of the Heat Sinker R
The parameters that influence the dimensioning are:
– Maximum dissipa ted power for the device (P
– Max thermal resistance Junction to case (R
– Max. ambient temperature T
amb max
– Quiescent current Iq (mA)
Example:
= 22V, R
V
CC
= (N° channels) ·
P
dmax
= 2 · ( 3.0 ) + 0.5 = 6.5 W
P
dmax
(Heat Sinker)
= 8ohm, R
load
R
Th c-a
= 5 °C/W , T
Th j-c
2
V
cc
------------------------------I
2Π2R
⋅
load
150 T
–
-----------------------------------------R
P
d max
Th
qVcc
amb max
(°C/W).
amb max
⋅+
–
Th j-c
)
dmax
)
Th j-c
= 50°C
150 50–
----------------------5.0–10°C/W===
6.5
In figure 23 is shown the Power derating curve for the device.
Figure 23. Power derating curve
20
20
15
15
(a)
(a)
10
10
Pd (W)
Pd (W)
(c)
5
5
0
0
04080120160
04080120160
(c)
(b)
(b)
Tamb (°C)
Tamb (°C)
a)Infinite Heatsink
a)Infinite Heatsink
b)7 °C/ W
b)7 °C/ W
c)10 °C/ W
c)10 °C/ W
10/13
Page 11
TDA7496SA
Clipwatt Assembling Suggestions
The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 24.
A thermal grease can be used in order to reduce the additio nal thermal resistance of the contact betw een package and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip mus t be designed in order to avoid a maxi mum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
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