SGS Thomson Microelectronics TDA2822 Datasheet

.SUPPLYVOLTAGEDOWNTO 3 V

.LOWCROSSOVERDISTORSION

.LOWQUIESCENTCURRENT

.BRIDGEORSTEREOCONFIGURATION

TDA2822

DUALPOWER AMPLIFIER

POWER DIP

(Plastic12+2+2)

DESCRIPTION

The TDA2822 is a monolithic integrated circuit in
12+2+2 powerdip, intended for use as dual audio
poweramplifier inportableradiosandTSsets.

TYPI CAL APP LICATION CIRCUIT (STE RE O)

ORDERING NUMBER : TDA2822

March 1995

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TDA2822

PIN CONNE CTIO N (top view)

SCHEMATI C DIA G RAM

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

Supply Voltage 15 V

V

s

Output Peak Current 1.5 A

I

o

T

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P

tot

stg,Tj

Total Power Dissipation at T
at T

case

=70°C

Storage and Junction Temperature – 40 to 150 °C

amb

=50°C

1.25
4

W
W

TDA 2822

THERMAL DATA

Symbol Parameter Value Unit

R

th j-amb

R

th j-case

Thermal Resistance Junction-ambient
Thermal Resistance Junction-pins

Max
Max

80
20

°C/W
°C/W

ELECTRICAL CHARACTERISTICS (Vs = 6 V, T

=25°C, unless otherwise specified)

amb

STEREO (test circuit of fig. 1)

Symbol Parameter Test Condition Min. Typ. Max. Unit

Supply Voltage 3 15 V

V

s

Quiescent Output Voltage Vs=9V

V

c

Quiescent Drain Current 6 12 mA

I

d

Input Bias Current 100 nA

I

b

Output Power

P

o

(each channel)

Closed Loop Voltage Gain f = 1 kHz 36 39 41 dB

G

v

Input Resistance f = 1 kHz 100 kΩ

R

i

e

N Total Input Noise Rs=10kΩ

=6V

V

s

d = 10 % f = 1 kHz

=9V RL=4Ω

V

s

=6V RL=4Ω

V

s

= 4.5 V RL=4Ω

V

s

1.3

0.45

B = 22 Hz to 22 kHz
Curve A

4

2.7

1.7

0.65

0.32

2.5
2

SVR Supply Voltage Rejection f = 100 Hz 24 30 dB

CS Channel Separation R

=10kΩ f = 1 kHz 50 dB

g

BRIDGE (test circuit of fig. 2)

V

Supply Voltage 3 15 V

s

Quiescent Drain Current RL= ∞ 612mA

I

d

Output Offset Voltage RL=8Ω 10 60 mV

V

os

Input Bias Current 100 nA

I

b

Output Power d = 10 % f = 1 kHz

P

o

d Distortion (f = 1 kHz) R

Closed Loop Voltage Gain f = 1 kHz 39 dB

G

v

Input Resistance f = 1 kHz 100 kΩ

R

i

e

N Total Input Noise Rs=10kΩ

=9V RL=8Ω

V

s

V

=6V RL=8Ω

s

= 4.5 V RL=4Ω

V

s

=8Ω Po= 0.5 W 0.2 %

L

B = 22 Hz to 22 kHz
Curve A

SVR Supply Voltage Rejection f = 100 Hz 40 dB

2.7

0.9

3.2

1.35
1

3

2.5

V
V

W
W
W

µV
µV

W
W
W

µV
µV

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TDA2822

Figure 1 : Test Circuit (stereo).

Figure 2 : P.C. BoardandComponentsLayoutof theCircuitofFigure1 (1:1 scale).

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Figure 3 : Test Circuit (bridge).

Figure 4 : P.C. BoardandComponentsLayoutof theCircuitofFigure3 (1:1 scale).

TDA 2822

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TDA2822

Figure 5 : OutputPowervs. SupplyVoltage

(Stereo).

Figure6: OutputPowervs. Supply Voltage

(Bridge).

Figure 7 : Distorsionvs. OutputPower (Bridge). Figure8: Distorsionvs. OutputPower (Bridge).

Figure 9 : SupplyVoltageRejectionvs.

Frequency.

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Figure10 : QuiescentCurrentvs.SupplyVoltage.

TDA 2822

Figure 11 : TotalPowerDissipation vs. Output

Power(Stereo).

Figure 13 : TotalPowerDissipation vs. Output

Power(Bridge).

Figure 12: TotalPowerDissipationvs.Output

Power(Bridge).

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TDA2822

Figure 14 : ApplicationCircuitfor PortableRadios.

MOUNTING I NSTRUCTION

TheR
deringtheGNDpins toa suitablecopperareaof the
printed circuit board (Figure 15) or to an external
heatsink(Figure16).

Thediagram of Figure17showsthemaximum dis­sipablepowerP
theside”∂” oftwoequalsquarecopperareashaving
a thicknessof 35µ (1.4mils).

oftheTDA2822canbe reducedbysol-

thj-amb

andtheR

tot

as a functionof

th j-amb

Duringsolderingthe pinstemperaturemust notex­ceed 260 °C and the soldering time must not be
longer than12 seconds.

The externalheatsinkor printedcircuit copperarea
mustbeconnectedto electrical ground.

Figure 15 : Exampleof P.C. BoardCopper Area

which is used asHeatsink.

8/11

Figure16 : ExternalHeatsinkMountingExample.

TDA 2822

Figure 6 : MaximumDissipablePower and

Junctionto AmbientThermal
Resistancevs. Side”∂”.

Figure 7 : MaximumAllowablePower Dissipation

vs. AmbientTemperature.

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TDA2822

POWERDIP16 PACKAGE MECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.85 1.40 0.033 0.055

b 0.50 0.020

b1 0.38 0.50 0.015 0.020

D 20.0 0.787
E 8.80 0.346

e 2.54 0.100

e3 17.78 0.700

F 7.10 0.280

I 5.10 0.201

L 3.30 0.130

Z 1.27 0.050

mm inch

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TDA 2822

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifica­tions mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information pre­viously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or
systems without express writtenapproval of SGS-THOMSON Microelectronics.

 1995 SGS-THOMSON Microelectronics - All Rights Reserved

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