SGS Thomson Microelectronics TDA2170 Datasheet

TV VERTICALDEFLECTION OUTPUT CIRCUIT

The functionsincorporatedare :

.

POWERAMPLIFIER

.

FLYBACKGENERATOR

.

REFERENCE VOLTAGE

.

THERMALPROTECTION

DESCRIPTION

The TDA2170 is a monolithicintegrated circuit in
11-leadMultiwatt package.It is a high efficiency
power boosterfor directdriving ofverticalwindings

of TV yokes. It is intended for use in Colour are B
& Wtelevision receivers aswell asin monitors and
displays.

TDA2170

MULTIWATT 11

(Plastic Package)

ORDER CODE : TDA2170

PINCONNECTIONS

December 1992

Tab connected to Pin 6

11
10

NC

GND
9
8
7
6
5
4
3
2
1

REFERENCEVOLTAGE

OUTPUTSTAGESUPPLY

OUTPUT

GND

FLYBACKGENERATOR

SUPPLYVOLTAGE

NON INVERTINGINPUT

INVERTING INPUT

NC

2170-01.EPS

1/7

TDA2170

BLOCK DIAGRAM

584

Flyback

Generator

+V

S

SCHEMATIC DIAGRAM

3

2

Q1 Q2

D1

Q3

2

3

Reference

Voltage

Power

Amplifier

7

Thermal

Protection

6

109

YOKE

2170-02.EPS

7

4

D4

Q11

Q17

R12

Q20 D9

Q21

R11

Q18

Q22

Q19

R8 R9

Q12

D5

R5R4

D8

Q13

Q4

C1

Q7

D3

Q6

Q8

Q9

Q10

D6 D7

R6

Q14

Q5

Q15

Q16

R2D2R1

R3

R7

8

5

2/7

C2

R12

Q23

Q26

Q24

R14

Z1

R15

R13

Q25

R16

Q27

Q28Z2

R17 R18

Q29

6

10

9

2170-03.EPS

TDA2170

ABSOLUTEMAXIMUM RATINGS

Symbol Parameter Value Unit

V

s

V

7,V8

V

5

V2,V

I

o

I

o

I

o

I

5

I

5 Pin 5 Peak to Peak Flyback Current at f = 50 Hz, t

P

tot

T

stg,Tj

THERMALDATA

Symbol Parameter Value Unit

R

th (j-c)

R

th (j-a)

Supply Voltage (pin 4) 35 V
Flyback Peak Voltage 60 V
Voltage at Pin 5 + V
Amplifier Input Voltage + Vs– 0.5 V

3

s

Output Peak Current (non repetitive, t = 2 msec) 2.5 A
Output Peak Current at f = 50 Hz, t ≤ 10 µsec
Output Peak Current at f = 50 Hz, t > 10 µsec
Pin 5 DC Current at V7<V

Total Power Dissipation at T

4

case

=60°C

≤ 1.5 msec

fly

3A
2A

100 mA

3A

30 W

Storage and Junction Temperature – 40 to 150 °

Thermal Resistance Junction-case Max 3 °
Thermal Resistance Junction–ambient Max 40

C

C/W

°C/W

2170-01.TBL

2170-02.TBL

ELECTRICAL CHARACTERISTICS

(refer to the test circuits, V

Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.

Pin 4 Quiescent Current I5=0;I7=0;V3= 3 V 8 16 mA 1a
Pin 8 Quiescent Current I5=0;I7=0;V3=3V 16 36 mA 1a
Amplifier Input Bias Current V3= 1 V – 0.1 – 1
Amplifier Input Bias Current V2= 1 V – 0.1 – 1 µ
Reference Voltage I9= 0 2.2 V 1a

9

Reference Voltage Drift vs. Supply Voltage VS= 15 to 30 V 1 2 mV/V 1a

9

S

Pin 5 Saturation Voltage to GND I5=20mA 1 V 1c
Quiescent Output Voltage

7

Output Saturation Voltage to GND I7= 1.2 A 1 1.4 V 1c

Output Saturation Voltage to Supply – I7= 1.2 A 1.6 2.2 V 1b

Reference Voltage Output Resistance 2.1

9

Junction Temperature for Thermal Shut

j

Down

V

∆V
∆V

V

V

V

V

R

I

4

I

8

I

3

I

2

5L

7L

7H

T

=35V, T

S

=25°C unless otherwisespecified)

amb

=35V;Ra=13kΩ 18 V 1d

V

S

=15V;Ra=13kΩ 7.5 V 1d

V

S

= 0.7 A 0.7 1 V 1c

I

7

= 0.7 A 1.3 1.8 V 1b

–I

7

140

µA

A

kΩ

°C

1a
1a

2170-03.TBL

3/7

TDA2170

Figure 1 : DC Test Circuits
Figure 1a : Measurementof I2;I3;I4;I8;I9;

/∆VS;R9

∆V

9

S1: (a) I2; (b) I3,I4and I8.

: (a) I4and I8;(b) I3;(c) I2.

S

2

S

: (a) I2,I3,I4,I8,I9and V9;(b) R9.

3

Figure 1c : Measurementof V5L,V

7.L

.

Figure1b: Measurementof V7

2170-04.EPS

Figure1d: Measurementof V7.

H

2170-05.EPS

S1 : (a)V5L;(b) V7L.

Figure 2 : ApplicationCircuit

4/7

2170-06.EPS

2170-07.EPS

2170-08.EPS

Figure 3 : PC Board and ComponentLayout(1:1 scale)

TDA2170

COMPONENTS LIST FORTYPICALAPPLICATIONS

Component

5.9 Ω /10mH

1.95 App

RT1 10 4.7 10

R1 12 10 12
R2 10 5.6 5.6
R3 27 12 18
R4 12 8.2 5.6
R5 0.82 1 1 Ω
R6 270 330 330 Ω
R7 1.5 1.5 1.5 Ω
D1 1N 4001 1N 4001 1N 4001 –

C1 0.1 0.1 0.1 µ
C2 el. 1000/25 V 470/25 V 470/25 V
C3 el. 220/25 V 220/25 V 220/25 V µ

C4 0.22 0.22 0.22 µ
C5 el. 2200/25 V 2200/25 V 1000/16 V
C6 el. 4.7/16 V 4.7/16 V 10/16 V µ

110° TVC

110° TVC

9.6 Ω / 24.6 mH

1.2 App

90° TVC

15 Ω /30mH

0.82 App

Unit

kΩ
kΩ
kΩ
kΩ
kΩ

F

µF

F
F

µF

F

2170-09.TIF

2170-04.TBL

5/7

TDA2170

TYPICALPERFORMANCES

Parameter

–Supply Voltage 24 22.5 25 V

V

s

I

– Current 280 175 125 mA

s

t

– Flyback Time 0.6 1 0.7 ms

fly

*P

– Power Dissipation 4.2 2.5 2.05 W

tot

*R
T
T
t
V
V

* Worst case condition.

– Heatsink 7 13 16 °

th c–a
amb
j max

o

i
7

110° TVC

5.9 Ω /10mH

60 60 60 °

110 110 110 °

20 20 20 ms

2.5 2.5 2.5 V
50 47 52 V

MOUNTINGINSTRUCTIONS

The power dissipated in the circuit must be re­movedby adding an externalheatsink.

Thanks to the MULTIWATT package attaching
the heatsink is verysimple,a screwora compres-

Figure 2 : ApplicationCircuit

110° TVC

9.6 Ω /27mH

90° TVC

15 Ω /30 mH

sion spring (clip) being sufficient. Between the
heatsinkandthepackageitisbettertoinsertalayer
of silicon grease, to optimize the thermal contact ;
no electrical isolation is needed between the two
surfaces.

Unit

C/W

C
C

PP

P

2170-05.TBL

Figure5 : Maximum AllowablePowerDissipationversusAmbientTemperature

6/7

2170-10.EPS / 2170-11.EPS

2170-12.EPS

TDA2170

PACKAGE MECHANICAL DATA

11PINS - PLASTICMULTIWATT

H1

A

Dimensions

C

D

E

M1

B

M

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

L7

Dia. 1

L2

L

L1

F

G1

A 5 0.197
B 2.65 0.104
C 1.6 0.063
E 0.49 0.55 0.019 0.022
F 0.88 0.95 0.035 0.037

G 1.57 1.7 1.83 0.062 0.067 0.072
G1 16.87 17 17.13 0.664 0.669 0.674
H1 19.6 0.772
H2 20.2 0.795

L 21.5 22.3 0.846 0.878
L1 21.4 22.2 0.843 0.874
L2 17.4 18.1 0.685 0.713
L3 17.25 17.5 17.75 0.679 0.689 0.699
L4 10.3 10.7 10.9 0.406 0.421 0.429
L7 2.65 2.9 0.104 0.114

M 4.1 4.3 4.5 0.161 0.169 0.177

M1 4.88 5.08 5.3 0.192 0.200 0.209

S 1.9 2.6 0.075 0.102

S1 1.9 2.6 0.075 0.102

Dia. 1 3.65 3.85 0.144 0.152

Information furnishedis believed to beaccurate andreliable. However, SGS-THOMSON Microelectronics assumes noresponsibility
for the consequences of use ofsuch information norfor anyinfringement ofpatents orother rights of third parties which may result
from itsuse. Nolicence is grantedby implication or otherwise under any patent or patentrights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics productsare notauthorized for use ascritical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.

S

S1

L3

L4

H2

G

PMMUL11V.EPS

MUL11V.TBL

 1994SGS-THOMSON Microelectronics - All Rights Reserved

Purchase of I2C Components of SGS-THOMSON Microelectronics,conveys a license under the Philips

2

I

C Patent.Rights touse these components in aI2C system, isgranted provided that thesystem conforms to

2

the I

C Standard Specificationsas definedby Philips.

SGS-THOMSON Microelectronics GROUP OFCOMPANIES

Australia - Brazil - China -France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco

The Netherlands - Singapore - Spain -Sweden - Switzerland -Taiwan - Thailand - United Kingdom -U.S.A.

7/7