The TDA 1910 is a monolithicintegratedcircuit in
MULTIWATT package, intended for use in Hi-Fi
audiopowerapplications,as high quality TV sets.
The TDA 1910 meets the DIN 45500 (d = 0.5%)
guaranteed output power of 10W when used at
24V/4W.At 24V/8Wthe output power is 7W min.
Features:
– muting facility
– protection against chip overtemperature
– very low noise
– high supplyvoltage rejection
– low ”switch-on”noise.
The TDA 1910 is assembled in MULTIWATT
Figure 23. Frequenc y response of the circuit of fig.22
Figure 25. Frequenc y response of the circuit of fig.24
Figure26. Squelchfunction in TV applicationsFigure 27. Delayed muting circuit
9/14
TDA1910
MUTINGFUNCTION
The output signal can be inhibitedapplying a DCvoltage V
Figure28
to pin 11,as shownin fig.28
T
The input resistanceat pin 1 dependson thethresholdvoltage V
= 200 K
R
1
R1 =10 Ω
@1.9V≤V
Ω
@
0V ≤ V
6V ≤ VT≤ V
4.7Vmuting-off
≤
T
≤ 1.3V
T
s
muting-on
at pin 11and is typically.
T
Referringtothefollowinginputstage, thepossibleattenuationof theinputsignalandthereforeoftheoutput
signalcan be found using the following expression.
R
⁄⁄
R
⁄⁄
5
1
R
1
Considering Rg = 10 KΩ the attenuation in the
muting-on condition is typicallyA
= 60 dB. In the
T
muting-off condition, the attenuation is very low,
typically 1.2dB.
Avery low current is necessaryto drivethe threshold voltageV
becausethe input resistance at pin
T
11is greaterthan150 KΩ. Themutingfunction can
beusedinmanycases,whenatemporaryinhibition
V
R
=
≅
100
+
g
R
5
K
Ω
=
A
T
V
where R5
i
5
- during commutationsat the input stages.
- during the receivertuning.
The variable impedance capabilityat pin 1 can be
useful in many applications and we haveshown 2
examplesin fig.22 and 24,where it hasbeen used
tochangethe feedbacknetwork,obtaining2 different frequencyresponses.
of the output signal is requested,for example:
- in switch-on condition, to avoid preamplifier
power-on transients(see fig. 27)
10/14
TDA1910
APPLICATIONSUGGESTION
The recommended values of the components are those shown on applicationcircuit of fig. 21. Different
valuescan be used.
The followingtablecan helpthe designer.
Component
R
g+R1
R
2
R
3
R
4
P
1
C
1
C
2
C
3
C
4
C
5
Raccom.
value
10K
Ω
Purpose
Input signal imped.
for muting operation
3.3KΩClose loop gain
setting.
100
Close loop gain
Ω
setting.
1
20K
Frequency stabilityDanger of oscillation
Ω
Volume
Ω
potentiometer.
1 µF
Input DC decoupling.Higher low frequency
1µF
0.22µF
2.2µFInverting input DC
decoupling.
0.1µFSupply voltage
bypass.
Larger than
recommended value
Increase of the attenuation in muting-on
condition. Decrease
Smaller than
recommended value
Decrease of the
attenuation in muting
on condition.
Allowed range
Min.Max.
of the inputsensitivity.
Increase of gain.Decrease of gain.
Increase quiescent
9R
3
current.
Decrease of gain.Increase of gain.R2/9
at high frequencies
with inductive loads.
Increase of the
switch-on noise.
Decrease of the input
impedance and of the
10K
100K
Ω
input level.
cutoff.
Increase of the
switch-on noise.
Higher low frequency
cutoff.
0.1µF
Danger of oscillations.
Ω
C
6
10µFRipple rejection.Increase of SVR.
Increase of the
Degradation of
SVR
2.2µF100µF
switch-on time
C
7
47µFBootstrap.Increase of the distor-
10µF100µF
tion at low frequency.
C
8
C
9
0.22µFFrequency stability.Danger of oscillation.
2200µF
(R
=4Ω)
L
Output DC
decoupling.
Higher low frequency
cutoff.
1000µF
=8Ω)
(R
L
11/14
TDA1910
THERMALSHUT-DOWN
The presence ofa thermallimiting circuit offersthe
followingadvantages:
1) An overload on the output (even if it is permanent), or an above limit ambient temperature
can be easily supportedsince the T
cannotbe
j
higher than 150°C.
2) The heatskink can have a smaller factor of
safety compared with that of a conventional
Figure 29. Output power and
drai n curre nt vs. case
temperature
Figure 30. Output power and
drai n curre nt vs. case
temperature
circuit.Thereis no possibilityof devicedamage
due to high junction temperature.
If for any reason, the junction temperature increases up to 150°C, the thermal shut-down
simply reduces the power dissipation and the
currentconsumption.
The maximum allowable power dissipation dependsupon thesizeof theexternalheatsink(i.e.its
thermal resistance); fig. 31 shows this dissipable
power as a function of ambient temperature for
differentthermalresistance.
Figure31.Maximumallowable
powerdissipation vs. ambient
temperature
MOUNTINGINSTRUCTIONS
The power dissipated in the circuit must be removedby addingan externalheatsink.
Thanks to the Multiwatt package attaching the
heatsinkis verysimple, ascrewor a compression
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor forany infringementof patents orother rights of third partieswhich may result from its use. No
license is granted by implicationor otherwiseunder any patentor patentrights of SGS-THOMSON Microelectronics. Specificationmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSONMicroelectronics products arenot authorizedfor use as criticalcomponents in lifesupport devicesor systems withoutexpress
written approval of SGS-THOMSONMicroelectronics.
1997 SGS-THOMSON Microelectronics – Printedin Italy– All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil- Canada- China - France - Germany- Hong Kong - Italy- Japan - Korea - Malaysia- Malta - Morocco - TheNetherlands -
Singapore - Spain - Sweden - Switzerland- Taiwan- Thailand - United Kingdom - U.S.A.
14/14
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