SGS Thomson Microelectronics TDA1904 Datasheet

TDA1904

4WAUDIOAMPLIFIER

HIGHOUTPUTCURRENTCAPABILITY
PROTECTION AGAINST CHIP OVERTEM-

PERATURE
LOWNOISE
HIGHSUPPLY VOLTAGEREJECTION
SUPPLY VOLTAGERANGE: 4V TO 20V

DESCRIPTION

The TDA 1904 is a monolithicintegrated circuit in
POWERDIP package intended for use as low-fre­quency power amplifier in wide range of applica-

ORDERING NUMBER

tions in portableradio and TV sets.

ABSOLUTEMAXIMUM RATINGS

Symbol Parameter Value Unit

V

S

I

O

I

O

P

tot

T

stg,Tj

Supply voltage 20 V
Peak output current (non repetitive) 2.5 A
Peak output current (repetitive) 2 A
Totalpower dissipation at T

Storage and junction temperature -40 to 150

at T

amb

pins

=80°C
=60°C

Powerdip

(8 + 8)

: TDA1904

1W
6W

°C

TEST AND APPLICATIONCIRCUIT

(*) R4 is necessaryonly for V

March 1993

<6V.

s

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TDA1904

PIN CONNECTION (top view)

SCHEMATICDIAGRAM

THERMALDATA

Symbol Parameter Value Unit

2/10

R

th-j-case

R

th-j-amb

Thermal resistance junction-pins max 15
Thermal resistance junction-ambient max 70

C/W

°
°C/W

TDA1904

ELECTRICALCHARACTERISTICS (Refer to the test circuit, T

=25°C, Rth(heatsink)=

amb

20 °C/W, unless otherwiswspecified)

Symbol Parameter Testconditions Min. Typ. Max. Unit

V

V

I

P

d Harmonic distortion

V

R

η

BW Small signal bandwidth(-3 dB) V

G

Supply voltage 4 20 V

s

Quiescent output voltage

o

Quiescent drain current Vs=9V

d

Output power d = 10%

o

V
V

V

V
V
V
V

=4V

s

= 14V

s

= 14V

s

=9V

s

= 14V

s

= 12V

s

=6V

s

f = 1 KHz
R

=4

Ω

L

1.8
4

3.1

0.7

2.1

7.2
8

10

2

4.5 W

f = 1 KHz
V

=9V RL=4

s

= 50 mW to 1.2W

P

o

Input saturation voltage

i

(rms)
Input resistance (pin 8) f = 1 KHz 55 150

i

Efficiency

Voltagegain (open loop)

v

Vs=9V
V

= 14V

s

f = 1 KHz
V

=9V RL=4

s

V

= 14V RL=4Ω Po= 4.5W

s

= 14V

s

= 14V

V

s

Ω

R

L

f = 1 KHz

Po=2W

=4

Ω

Ω

0.8

1.3

0.1 0.3 %

70
65

40 to 40,000 Hz

75 dB

15
18

V

mA

V

KΩ

%

G

e

Voltagegain (closed loop) Vs= 14V

v

Total input noise Rg=50

N

SVR Supply voltage rejection V

T

Thermal shut-down case

sd

temperature

Note: (°) Weightingfilter = curve A.

(°°) Filterwith noise bendwidth: 22Hz to 22 KHz.

=4Ω

R

f = 1 KHz

Ω

R

=10KΩ

g

R

=50

Ω

g

R

=10KΩ

g

= 12V

s

f

= 100 Hz

ripple

V

= 0.5 Vrms

ripple

P

= 2W 120 ÉC

tot

P

R

L

=1W

o

g

(°)

(°°)

=10KΩ

39.5 40 40.5 dB

1.2
24

2
3

40 50 dB

µV

µV

3/10

TDA1904

Figure 1. Testand application circuit

(*) R4 is necessary only for VS<6V

Figure 2. P.C. boardand components layoutof fig. 1 (1 : 1 scale)

4/10

APPLICATION SUGGESTION

The recommended values of the external compo­nents are those shown on the application circuitof
fig. 1.

Whenthe supplyvoltageV

isless than 6V,a 68Ω

S

resistor must be connected betweenpin 2 andpin

TDA1904

3 in order to obtain the maximum outputpower.
Different values can be used. The following table

can help thedesigner.

Components

R1 10 KΩ

R2
R3

R4

C1

C2

C3

Recomm.

value

100 Ω

4.7 Ω Frequency stability Danger of oscillation at

68 Ω Increase of the

2.2 µF

0.1 µF

22 µF

Purpose

Feedback resistors

output swing with
low supply voltage.

Input DC
decoupling.

Supply voltage
bypass.

Ripple rejection Increaseof SVR

Larger than

recommended value

Increase of gain. Decrease of gain.

Decrease of gain. Increase of gain.

high frequencies with
inductive loads.

Higher cost lower
noise.

increase of the
switch-on time.

Smaller than

recommended value

Increase quiescent
current.

Higher low
frequency cutoff.
Higher noise.

Danger of
oscillations.

Degradation of SVR.

Allowed range

Min. Max.

9R3

1KΩ

39 Ω 220 Ω

2.2 µF 100ΩF

C4

C5

C6

C7 1000µF OutputDC

2.2 µF

47µF

0.22 µF

Inverting input DC
decoupling.

Bootstrap. Increase of the

Frequency stability. Danger of oscillation.

decoupling

Increase of the
switch-on noise

Higher low
frequency cutoff.

distortion at low
frequency.

Higher low
frequency cutoff.

0.1 ΩF

10µF 100µF

5/10

TDA1904

Figure 3. Quiescent output
voltage vs. supply voltage

Figure 6. Distortion vs.
output power

Figure 4. Quiescent drain
currentvs. supply voltage

Figur e 7 . Dis tort ion vs .
output power

Figure 5. Output power vs.
supply voltage

Figure 8. Distortion vs.
output power

Figure 9. Distortion vs.
output power

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Figu r e 10. D ist ort ion vs.
output power

Figure 11. Distortion vs.
output power

TDA1904

Figu r e 12. D ist ort ion vs.
frequency

Figure 15 . Distortion vs.
frequency

Figure 13. Distortion vs.
frequency

Figure 16. Supply voltage
rejection vs. frequency

Figure 14. Distortion vs.
frequency

Figure 1 7. Total power
dissipation and efficiency
vs. outputpower

Fi gure 1 8. Total power
dissipation and efficiency
vs. output power

Figure 1 9. Total power
dissipation and efficiency
vs. outputpower

Figure 2 0. Total power
dissipation and efficiency
vs. outputpower

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TDA1904

THERMALSHUT-DOWN

Thepresenceof a thermal limiting circuit offersthe
followingadvantages:

1) An overload on the output (even if it is perma­nent), or an above limit ambient temperature
can be easily tolerated since the T

cannotbe

j

higher than 150°C.

2) Theheatsinkcanhaveasmallerfactorofsafety
compared with that of a conventional circuit.
Thereis no possibilityofdevicedamagedue to
high junction temperature.
If for any reason, the junction temperature in­crease up to 150°C, the thermal shut-down
simply reduces the power dissipation and the
currentconsumption.

MOUNTINGINSTRUCTION

The TDA 1904 is assembled in the Powerdip, in
which8pins(from9to16)areattachedto theframe
and remove the heat produced by the chip.

Figure21 showsa PC board copper area used as
a heatsink(I = 65 mm).

The thermal resistancejunction-ambientis 35°C.

Figure21.Exampleofheatsinkusing PC board
copper(l = 65 mm)

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POWERDIPPACKAGE MECHANICAL DATA

TDA1904

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.85 1.40 0.033 0.055

b 0.50 0.020

b1 0.38 0.50 0.015 0.020

D 20.0 0.787
E 8.80 0.346

e 2.54 0.100

e3 17.78 0.700

F 7.10 0.280

I 5.10 0.201

L 3.30 0.130

Z 1.27 0.050

mm inch

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TDA1904

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from itsuse. No
license isgrantedby implication or otherwiseunder anypatent or patent rightsofSGS-THOMSON Microelectronics.Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSONMicroelectronics products arenot authorizedforuseascriticalcomponentsin life supportdevices orsystems without express
written approval of SGS-THOMSONMicroelectronics.

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